Heat exchange plate, heat exchange module, and electronic device

Abstract

The present application provides a heat exchange plate, a heat exchange module, and an electronic device. The heat exchange plate comprises a plate body; the plate body comprises a first area and a second area; the first area is configured to correspond to a heating area of an electronic product; the plate body is provided with a plurality of heat exchange flow channels; each heat exchange flow channel extends to the first area; the heat exchange flow channels are not communicated with each other; and at least a part of each heat exchange flow channel extends to the second area.

Description

Heat exchange plate, heat exchange module and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202411390052.4, filed on September 30, 2024, and entitled "Heat exchange plate, heat exchange module and electronic device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of electronic product heat dissipation technology, and more particularly, to a heat exchange plate, a heat exchange module and an electronic device. BACKGROUND

[0003] The existing electronic product heat exchange plate creates a circulating path between the high-temperature area and the low-temperature area of the electronic product, and exchanges heat through the circulation of heat exchange liquid. However, the existing heat exchange plate has the problem that the heat exchange liquid only flows through the high-temperature area and the low-temperature area once in one circulation time, which limits the effective transfer of heat, resulting in low heat exchange efficiency, thereby easily causing local overheating of the electronic product. SUMMARY

[0004] The present application provides a new technical solution for a heat exchange plate, which can at least solve the problem of low heat exchange efficiency of the existing heat exchange plate.

[0005] The present application also provides a new technical solution for a heat exchange module.

[0006] The present application also provides a new technical solution for an electronic device.

[0007] According to a first aspect of the present application, a heat exchange plate is provided, comprising: a plate body, the plate body comprising a first area and a second area, the first area being configured to correspond to a heat generating area of an electronic product; the plate body is provided with a plurality of heat exchange flow channels, each heat exchange flow channel extending to the first area, and each heat exchange flow channel is not communicated with each other; each heat exchange flow channel has at least a part extending to the second area.

[0008] Optionally, the plate body comprises a plurality of first areas, and each first area extends with different heat exchange flow channels.

[0009] Optionally, the plate body comprises a plurality of second areas, and each heat exchange flow channel extends to a different second area.

[0010] Optionally, the heat exchange flow channel itself has at least two groups of series sub-flow channels; each group of sub-flow channels has a first flow channel section and a second flow channel section; the first flow channel section is located in the first area, and the second flow channel section is located in the second area; the second flow channel sections of adjacent two groups of sub-flow channels are connected to each other to constitute the series connection between the sub-flow channels.

[0011] Optionally, the plate body comprises a plurality of first regions, each of the first regions extending with a plurality of groups of the sub-flow channels.

[0012] Optionally, the plate body comprises a plurality of second regions, the sub-flow channels extending to different second regions.

[0013] Optionally, the first flow channel segments of each group of the sub-flow channels extend in a bent manner in the respective corresponding first regions.

[0014] Optionally, the first regions comprise a plurality of hot zones, the first flow channel segments of each group of the sub-flow channels being located in different hot zones; and / or, the second regions comprise a plurality of cold zones, the second flow channel segments of each group of the sub-flow channels being located in different cold zones.

[0015] Optionally, the first flow channel segments have a smaller flow area than the second flow channel segments.

[0016] Optionally, the distribution density of the heat exchange flow channels in the first regions is greater than the distribution density of the heat exchange flow channels in the second regions.

[0017] Optionally, the plate body is provided with liquid passage openings, the liquid passage openings comprising a plurality of first liquid passage openings and a plurality of second liquid passage openings, the first liquid passage openings and the second liquid passage openings being used to communicate with a micro-pump, each of the heat exchange flow channels corresponding to a group of liquid passage openings.

[0018] Optionally, the plate body is provided with liquid passage openings, the liquid passage openings comprising first liquid passage openings and second liquid passage openings, each of the heat exchange flow channels corresponding to a group of liquid passage openings; the plate body is provided with at least one transition flow channel, the first end of the transition flow channel and the second liquid passage openings being used to communicate with a micro-pump.

[0019] Optionally, the first regions are divided into a same number of first sub-regions as the number of the heat exchange flow channels, each of the heat exchange flow channels extending to a different first sub-region; and / or, the second regions are divided into a same number of second sub-regions as the number of the heat exchange flow channels, each of the heat exchange flow channels extending to a different second sub-region.

[0020] According to a second aspect of the present application, a heat exchange module is provided, comprising: the heat exchange plate according to any one of the preceding heat exchange plates; and a micro-pump, each of the heat exchange flow channels corresponding to at least one micro-pump, the micro-pump and the heat exchange flow channel forming a circulation passage.

[0021] According to a third aspect of the present application, an electronic device is provided, comprising the heat exchange module.

[0022] According to the heat exchange plate provided in the application, the heat exchange liquid in the heat exchange plate can flow through the first area for multiple times in a single circulation time by arranging multiple heat exchange flow channels in the first area and the second area of the plate body, so that the heat exchange liquid can absorb heat in the first area for multiple times in a single circulation time and transfer the heat to the second area, avoiding heat exchange saturation of the heat exchange liquid, ensuring efficient heat exchange, improving the heat exchange efficiency of the heat exchange plate, and effectively preventing local overheating of the electronic product, ensuring the uniformity of the electronic product.

[0023] Other features and advantages of the present application will become apparent from the following detailed description of illustrative embodiments thereof, which proceeds with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0024] The accompanying drawings incorporated in and forming a part of the specification illustrate embodiments of the present application and, together with the description, serve to explain the principles of the application.

[0025] Fig. 1 is a structural schematic diagram of a heat exchange plate according to one embodiment provided in the application;

[0026] Fig. 2 is a structural schematic diagram of a sub-flow channel of a heat exchange plate according to one embodiment provided in the application;

[0027] Fig. 3 is a partial structural schematic diagram of a heat exchange plate according to one embodiment provided in the application.

[0028] Reference signs 100, heat exchange plate; 10, first area; 11, hot area; 20, second area; 21, cold area; 30, heat exchange flow channel; 31, sub-flow channel; 31a, first flow channel segment; 31b, second flow channel segment; 40, first liquid inlet; 50, second liquid inlet; 60, transition flow channel. DETAILED DESCRIPTION

[0029] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. Note that the relative arrangement, numerical expressions, and numerical values of components and steps set forth in these embodiments are not limiting to the scope of the present application unless otherwise specifically stated.

[0030] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way limiting to the scope of the application or its applications or uses.

[0031] Techniques, methods, and devices known to those of ordinary skill in the relevant art can not be discussed in detail herein, but should be considered as part of the specification, where appropriate.

[0032] In all of the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments can have different values.

[0033] It should be noted that like numerals and letters refer to like items throughout the several views, as such, once an item is defined in one view, it need not be discussed further in subsequent views.

[0034] The heat exchange plate 100 according to the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings.

[0035] As shown in FIG. 1 and FIG. 3, the heat exchange plate 100 according to the embodiments of the present application comprises a plate body.

[0036] Specifically, the plate body comprises a first region 10 and a second region 20, the first region 10 is configured to correspond to a heat generating area of an electronic product; the plate body is provided with a plurality of heat exchange channels 30, each heat exchange channel 30 extends to the first region 10, and the heat exchange channels 30 are not connected to each other; at least a part of each heat exchange channel 30 extends to the second region 20.

[0037] In other words, as shown in FIG. 1 and FIG. 3, the heat exchange plate 100 according to the embodiments of the present application is mainly used for heat exchange of an electronic product, which mainly comprises a plate body, the plate body can comprise a first region 10 and a second region 20, the area of the second region 20 can be greater than the area of the first region 10, the plate body is provided with heat exchange channels 30, one part of the heat exchange channels 30 can extend in the first region 10 of the plate body, and another part of the heat exchange channels 30 can extend in the second region 20 of the plate body, so as to form a passage for circulating heat exchange liquid. The first region 10 of the plate body is matched with the heat generating area of the electronic product (for example, the area where the processor of the electronic product is located), so that the first region 10 of the plate body can be matched with the heat generating area of the electronic product, and thus the heat exchange liquid circulating in the heat exchange channels 30 can transfer the heat of the heat generating area to the second region 20.

[0038] As shown in FIG. 1 and FIG. 2, in this embodiment, the plate body is provided with a plurality of heat exchange channels 30 which are not connected to each other, and in a single cycle time, the heat exchange liquid in the plurality of heat exchange channels 30 can flow through the first region 10 and the second region 20 at least once, that is, the heat exchange liquid in the heat exchange plate 100 can flow through the first region 10 multiple times (at least the same number of times as the number of heat exchange channels 30) in a single cycle time, so as to absorb heat in the first region 10 multiple times and transfer the heat to the second region 20, which can effectively avoid the heat exchange liquid reaching a heat exchange saturation state, so as to ensure that the heat exchange liquid can continuously and efficiently exchange heat in a relatively optimal temperature range.

[0039] Thus, according to the heat exchange plate 100 provided by the embodiment, by arranging a plurality of heat exchange flow channels 30 in the first area 10 and the second area 20 of the plate body, the heat exchange liquid in the heat exchange plate 100 can flow through the first area 10 multiple times in a single circulation time, so that the heat exchange liquid can absorb heat in the first area 10 multiple times in a single circulation time and transfer the heat to the second area 20, avoiding saturation of the heat exchange liquid, ensuring efficient heat exchange, improving the heat exchange efficiency of the heat exchange plate 100, and effectively preventing local overheating of the electronic product, ensuring the uniformity of the electronic product.

[0040] According to one embodiment of the present application, the plate body includes a plurality of first areas 10, and each first area 10 extends different heat exchange flow channels 30.

[0041] That is, as shown in FIG. 1, the plate body can be provided with a plurality of first areas 10, and the plurality of first areas 10 are matched with a plurality of heat generating areas of the electronic product, and each first area 10 extends different heat exchange flow channels 30, that is, each first area 10 extends at least two heat exchange flow channels 30, so that the heat exchange liquid in the plate body can absorb heat multiple times from different first areas 10 in a single circulation time and transfer the heat to the second area 20.

[0042] In the embodiment, the heat exchange liquid in the plurality of heat exchange flow channels 30 can absorb heat in the plurality of heat generating areas of the electronic product, so that the electronic product does not need to be provided with a plurality of heat exchange plates 100, and the heat exchange liquid in the heat exchange plate 100 can flow through each first area 10 multiple times in a single circulation time, which can ensure efficient heat exchange.

[0043] In some specific embodiments of the present application, the plate body includes a plurality of second areas 20, and each heat exchange flow channel 30 extends to different second areas 20.

[0044] Specifically, as shown in FIG. 1, the plate body can be provided with a plurality of second areas 20, and each heat exchange flow channel 30 can extend to one or more second areas 20 corresponding thereto, so that the heat exchange liquid in the plate body can transfer the heat absorbed multiple times in the first area 10 to different second areas 20 in a single circulation time, ensuring efficient heat exchange, effectively improving the heat exchange efficiency of the heat exchange plate 100, effectively preventing local overheating of the electronic product, and ensuring the uniformity of the electronic product.

[0045] According to one embodiment of the present application, the heat exchange flow channel 30 itself has at least two groups of series-connected sub-flow channels 31; each group of sub-flow channels 31 has a first flow channel section 31a and a second flow channel section 31b; the first flow channel section 31a is located in the first area 10, the second flow channel section 31b is located in the second area 20, and the second flow channel sections 31b of adjacent two groups of sub-flow channels 31 are connected to each other to form series connection between the sub-flow channels 31.

[0046] That is, as shown in FIG. 1, the heat exchange flow channel 30 includes multiple groups of sub-flow channels 31, the sub-flow channels 31 extend between the first area 10 and the second area 20, the part of the sub-flow channels 31 located in the first area 10 constitutes a first flow channel section 31a of the sub-flow channels 31, the part of the sub-flow channels 31 located in the second area 20 constitutes a second flow channel section 31b of the sub-flow channels 31, and the first end of the second flow channel section 31b of the first group of sub-flow channels 31 and the first end of the second flow channel section 31b of the second group of sub-flow channels 31 can be communicated with each other, which will be described in detail below by taking two groups of sub-flow channels 31 as an example. The first end of the second flow channel section 31b of the first group of sub-flow channels 31 and the first end of the second flow channel section 31b of the second group of sub-flow channels 31 are communicated with each other, so that the heat exchange liquid in a single heat exchange flow channel 30 can flow through the first area 10 and the second area 20 multiple times in a single circulation time, so that the heat exchange liquid in a single heat exchange flow channel 30 can absorb the heat of the heat generation area of the electronic product multiple times in the first area 10 and transfer the heat to the second area 20, which avoids the saturation of the heat exchange of the heat exchange liquid and guarantees the efficient heat exchange and improves the heat exchange efficiency of the heat exchange plate 100, and effectively prevents the problem of local overheating of the electronic product and guarantees the uniformity of the electronic product.

[0047] In the embodiment, as shown in FIG. 1, the two adjacent groups of sub-flow channels 31 are connected in series through the corresponding second flow channel sections 31b, so that the heat exchange liquid in a single heat exchange flow channel 30 can flow through the first area 10 and the second area 20 multiple times in a single circulation time, so that the heat exchange liquid in a single heat exchange flow channel 30 can absorb the heat of the heat generation area of the electronic product multiple times in the first area 10 and transfer the heat to the second area 20, which avoids the saturation of the heat exchange of the heat exchange liquid and guarantees the efficient heat exchange and improves the heat exchange efficiency of the heat exchange plate 100, and effectively prevents the problem of local overheating of the electronic product and guarantees the uniformity of the electronic product.

[0048] Moreover, when the heat exchange liquid flows through the multiple groups of sub-flow channels 31, it only needs to go back and forth between the first area 10 and the second area 20 multiple times without passing through the non-target area, which can ensure that the heat exchange liquid can focus on efficient heat exchange between the first area 10 (for the heat generation area of the electronic product) and the second area 20 (for the low heat area of the electronic product), thereby effectively avoiding the invalid heat exchange that may occur when the heat exchange liquid flows through the non-target area.

[0049] In some specific embodiments of the present application, the plate body includes multiple first areas 10, and each first area 10 extends multiple groups of sub-flow channels 31.

[0050] Specifically, the plate body can be provided with multiple first areas 10, the multiple first areas 10 are matched with multiple heat generation areas of the electronic product, and each first area 10 extends multiple groups of sub-flow channels 31, which can be sub-flow channels 31 of the same heat exchange flow channel 30 or sub-flow channels 31 of different heat exchange flow channels 30, so that the heat exchange liquid in the plate body can absorb heat multiple times from different first areas 10 in a single circulation time and transfer the heat to the second area 20.

[0051] In the embodiment, the heat exchange liquid in the single or multiple heat exchange channels 30 can absorb heat in multiple heat generation areas of the electronic product, so that the electronic product does not need to be provided with multiple heat exchange plates 100, and the heat exchange liquid in the heat exchange plate 100 can flow through each first area 10 multiple times in a single circulation time, so as to ensure efficient heat exchange.

[0052] According to an embodiment of the present application, the plate body includes multiple second areas 20, and the sub-channels 31 extend to different second areas 20.

[0053] That is, the plate body can be provided with multiple first areas 10, and each group of sub-channels 31 can extend to different second areas 20, so that the heat exchange liquid in a heat exchange channel 30 can flow through different second areas 20, so that the heat exchange liquid in the plate body can transfer the heat absorbed multiple times in the first area 10 to different second areas 20 in a single circulation time, ensuring efficient heat exchange, effectively improving the heat exchange efficiency of the heat exchange plate 100, and effectively preventing local overheating of the electronic product, ensuring the uniformity of the electronic product.

[0054] In some specific embodiments of the present application, the first channel segments 31a of each group of sub-channels 31 extend in the respective corresponding first areas 10.

[0055] Specifically, as shown in FIGS. 1 and 2, the first channel segments 31a of multiple groups of sub-channels 31 each have one or more bending portions, so that the first channel segments 31a can be fully distributed in the respective corresponding first areas 10, so as to ensure that the heat exchange liquid fully plays its heat exchange efficiency, and the heat exchange area can be optimized, the uniformity of the heat generation area of the electronic product can be significantly improved, and local overheating can be effectively prevented, thereby ensuring the stable operation of the electronic product.

[0056] According to an embodiment of the present application, the first area 10 includes multiple heat zones 11, and the first channel segments 31a of each group of sub-channels 31 are located in different heat zones 11; and / or, the second area 20 includes multiple cold zones 21, and the second channel segments 31b of each group of sub-channels 31 are located in different cold zones 21.

[0057] That is, as shown in FIG. 1, in order to further improve the heat exchange efficiency of the heat exchange plate 100, the first area 10 of the plate body can be divided into multiple heat zones 11 (i.e., areas for absorbing heat of heat generation areas), and the first channel segments 31a of each group of sub-channels 31 can extend to different heat zones 11, that is, each heat zone 11 is provided with only one first channel segment 31a, so that the heat exchange liquid flowing through each first channel segment 31a can dissipate heat in different positions of the heat generation area of the electronic product, which is beneficial to maintaining the uniformity of the heat generation area of the electronic product, can effectively prevent local overheating, and thereby ensures the stable operation of the electronic product.

[0058] As shown in FIG. 1, in order to further improve the heat exchange efficiency of the heat exchange plate 100, the second region 20 of the plate body can be divided into a plurality of cold regions 21 (i.e., regions for dissipating heat to the low-heat region and / or the outside world), and the second flow passage section 31b of each group of sub-flow passages 31 is extended to different cold regions 21, that is, each cold region 21 is only configured with the second flow passage section 31b of one group of sub-flow passages 31, so that when the heat exchange liquid flows in the second flow passage section 31b, the heat can be efficiently dispersed and transferred to different positions of the low-heat region of the electronic product, promoting the rapid transfer and distribution of heat. At the same time, it effectively prevents the local heat saturation phenomenon of the second region 20, thereby improving the heat exchange efficiency of the heat exchange plate 100.

[0059] In some embodiments of the present application, the flow area of the first flow passage section 31a is smaller than the flow area of the second flow passage section 31b.

[0060] Specifically, in each group of sub-flow passages 31, the flow areas (i.e., cross-sectional areas) of the first flow passage section 31a and the second flow passage section 31b can be different. In this embodiment, the flow area of the first flow passage section 31a is smaller than the flow area of the second flow passage section 31b. The first flow passage section 31a with a smaller flow area can ensure that the heat exchange liquid can quickly pass through when flowing through the first region 10, effectively reducing the residence time of the heat exchange liquid in this region, effectively avoiding the heat saturation phenomenon caused by the heat exchange liquid contacting high temperature for a long time, thereby ensuring that the heat exchange process can continue and be efficient. At the same time, the second flow passage section 31b with a larger flow area can ensure that the heat exchange liquid flows through the second region 20 relatively slowly, which is conducive to transferring heat to the low-heat region of the electronic product, and can ensure that the temperature of the heat exchange liquid entering the first region 10 is not too high, thereby ensuring that the heat exchange liquid can continuously and efficiently absorb heat in the first region 10.

[0061] According to an embodiment of the present application, the distribution density of the heat exchange flow passage 30 in the first region 10 is greater than the distribution density of the heat exchange flow passage 30 in the second region 20.

[0062] That is, the distribution density of the heat exchange flow passage 30 in the first region 10 and the second region 20 can be different. In this embodiment, the distribution density of the heat exchange flow passage 30 in the first region 10 (i.e., the first flow passage section 31a) is greater than the distribution density of the heat exchange flow passage 30 in the second region 20 (i.e., the second flow passage section 31b), that is, the heat exchange flow passage 30 is arranged relatively densely in the first region 10, and the heat exchange flow passage 30 is arranged relatively sparsely in the second region 20, that is, the area ratio of the heat exchange flow passage 30 in the first region 10 is greater than the area ratio of the heat exchange flow passage 30 in the second region 20.

[0063] In the embodiment, the dense heat exchange channels 30 in the first region 10 greatly increase the heat exchange area between the heat exchange liquid and the heat generating area of the electronic product, thereby accelerating the heat transfer process, facilitating the heat exchange liquid to rapidly absorb and remove the heat generated by the heat generating area, avoiding the occurrence of local overheating, significantly improving the uniform temperature performance of the electronic product, and ensuring the stable operation of the electronic product.

[0064] In some embodiments of the present application, the plate body is provided with liquid passages, the liquid passages include a plurality of first liquid passages 40 and a plurality of second liquid passages 50, the first liquid passages 40 and the second liquid passages 50 are used to communicate with the micropump, and each heat exchange channel 30 corresponds to a group of liquid passages.

[0065] In other words, as shown in FIG. 1, the plate body is provided with liquid passages, each heat exchange channel 30 corresponds to a group of liquid passages, specifically, the liquid passages include first liquid passages 40 and second liquid passages 50 which communicate with the heat exchange channels 30, in use, the first liquid passages 40 can communicate with the liquid outlet of the micropump, and the second liquid passages 50 can communicate with the liquid inlet of the micropump, so as to form a circulating passage of the heat exchange liquid, and when the electronic product is working, the heat exchange liquid can be driven to circulate in the circulating passage by the micropump.

[0066] In the embodiment, a group of liquid passages includes a plurality of first liquid passages 40 and a plurality of second liquid passages 50, each first liquid passage 40 and second liquid passage 50 can communicate with the micropump, so that a plurality of micropumps can be arranged in parallel in the circulating passage. When one of the micropumps fails, the other micropumps can still work, thereby effectively improving the reliability of the heat exchange module; at the same time, the plurality of micropumps arranged can significantly reduce the pressure drop of the heat exchange liquid in the circulation process, ensuring that the pressure distribution at each position in the circulating passage is more uniform, thereby ensuring the consistency of the heat exchange effect and the uniform temperature of the electronic product.

[0067] According to one embodiment of the present application, the plate body is provided with liquid passages, the liquid passages include first liquid passages 40 and second liquid passages 50, and each heat exchange channel 30 corresponds to a group of liquid passages; the plate body is provided with at least one transition channel 60, and the first end of the transition channel 60 and the first liquid passage 40, and the second end of the transition channel 60 and the second liquid passage 50 are used to communicate with the micropump.

[0068] That is, as shown in FIG. 2, the plate body is provided with liquid passages and transition channels 60, each heat exchange channel 30 corresponds to a group of liquid passages and at least one transition channel 60, and specifically, the liquid passages include first liquid passages 40 and second liquid passages 50 which communicate with the heat exchange channels 30.

[0069] When each heat exchange channel 30 corresponds to one transition channel 60, the outlet of the first micro-pump can be in communication with the first end of the transition channel 60, the inlet of the first micro-pump can be in communication with the first through liquid port 40, the inlet of the second micro-pump can be in communication with the second end of the transition channel 60, and the outlet of the second micro-pump can be in communication with the second through liquid port 50, so as to form a circulating path of the heat exchange liquid. When each heat exchange channel 30 corresponds to multiple transition channels 60, the ends of two transition channels 60 can also be in communication with the micro-pump, so that the circulating path can realize the series connection of three or more micro-pumps.

[0070] In the embodiment, the series connection of multiple micro-pumps can be realized by the cooperation of the transition channel 60, the first through liquid port 40 and the second through liquid port 50, and the flow rate of the heat exchange liquid in the circulating path is effectively increased, so that the heat exchange efficiency of the heat exchange plate 100 can be significantly improved.

[0071] In some specific embodiments of the present application, the first region 10 is divided into a same number of first sub-regions as the number of heat exchange channels 30, and each heat exchange channel 30 extends to a different first sub-region; and / or, the second region 20 is divided into a same number of second sub-regions as the number of heat exchange channels 30, and each heat exchange channel 30 extends to a different second sub-region.

[0072] In order to further improve the heat exchange efficiency of the heat exchange plate 100, the first region 10 of the plate body can be divided into multiple first sub-regions, and each heat exchange channel 30 extends to a different first sub-region, that is, only one heat exchange channel 30 is arranged in each first sub-region, so that the heat exchange liquid flowing through each heat exchange channel 30 can dissipate heat at different positions of the heat generation area of the electronic product, which is beneficial to maintaining the uniformity of the heat generation area of the electronic product and can effectively prevent local overheating, thereby ensuring the stable operation of the electronic product.

[0073] In order to further improve the heat exchange efficiency of the heat exchange plate 100, the second region 20 of the plate body can be divided into multiple second sub-regions, and each heat exchange channel 30 extends to a different cold area 21, that is, only one heat exchange channel 30 is arranged in each second sub-region, so that when the heat exchange liquid flows in the heat exchange channel 30, the heat can be efficiently dispersed and transferred to different positions of the low heat area of the electronic product, which promotes the rapid transmission and distribution of heat. At the same time, the local heat saturation phenomenon of the second region 20 is effectively prevented, thereby improving the heat exchange efficiency of the heat exchange plate 100.

[0074] In summary, the heat exchange plate 100 provided in the embodiment can realize that the heat exchange liquid in the heat exchange plate 100 can flow through the first area 10 for multiple times in a single circulation time, so that the heat exchange liquid can absorb heat in the first area 10 for multiple times in a single circulation time and transfer the heat to the second area 20, avoiding heat exchange saturation of the heat exchange liquid, ensuring efficient heat exchange, improving the heat exchange efficiency of the heat exchange plate 100, and effectively preventing local overheating of the electronic product and ensuring the uniformity of the electronic product.

[0075] The embodiment of the present application also provides a heat exchange module, which comprises the heat exchange plate 100 described in any of the above embodiments, and at least one micro-pump corresponding to each heat exchange flow channel 30, wherein the micro-pump and the heat exchange flow channel 30 are in communication to form a circulation passage. Since the heat exchange plate 100 provided in the embodiment of the present application has the above technical effects, the heat exchange module provided in the embodiment of the present application also has corresponding technical effects, and the embodiment will not be described in detail.

[0076] In some embodiments of the present application, the micro-pump can be a piezoelectric micro-pump, the length and width of the micro-pump can be about 7 mm, and the thickness of the micro-pump can be about 1 mm, so as to facilitate installation on a smaller electronic product.

[0077] The embodiment of the present application also provides an electronic device, for example, but not limited to, a wearable device, which comprises the heat exchange module described in the above embodiments. Since the heat exchange plate 100 provided in the embodiment of the present application has the above technical effects, the electronic device provided in the embodiment of the present application also has corresponding technical effects, and the embodiment will not be described in detail.

[0078] In some embodiments of the present application, the electronic device is a VR device, the first area 10 of the heat exchange plate 100 can be arranged in a heat generation area (for example, an area where a processor in the VR device is located) of the VR device, and the second area 20 of the heat exchange plate 100 can be arranged on a strap of the VR device. When the heat exchange module is running, the heat generated by the processor in the VR device can be transferred to the strap through the circulating heat exchange liquid, and then transferred to the external environment through the strap.

[0079] Although some specific embodiments of the present application have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration, but not for limiting the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A heat exchange plate, characterized in that include: The plate body includes a first region and a second region, wherein the first region is configured to correspond to the heat-generating area of ​​an electronic product; The plate is provided with multiple heat exchange channels, each of which extends to the first region and is not connected to the other heat exchange channels. Each of the aforementioned heat exchange channels extends at least a portion into the second region.

2. The heat exchange plate according to claim 1, characterized in that The plate body includes multiple first regions, each of which extends with different heat exchange channels.

3. The heat exchange plate according to claim 1, characterized in that The plate includes multiple second regions, and each heat exchange channel extends to a different second region.

4. The heat exchange plate according to claim 1, characterized in that The heat exchange channel itself has at least two sets of sub-channels connected in series; Each group of sub-channels has a first channel section and a second channel section; The first flow channel segment is located in the first region, the second flow channel segment is located in the second region, and the second flow channel segments of two adjacent sets of the sub-flow channels are connected to each other to form a series connection between the sub-flow channels.

5. The heat exchange plate according to claim 4, characterized in that The plate body includes a plurality of first regions, and each first region extends a plurality of the sub-channels.

6. The heat exchange plate according to claim 4, characterized in that The plate body includes multiple second regions, and the sub-channels extend to different second regions.

7. The heat exchange plate according to claim 4, characterized in that The first flow channel segment of each group of sub-flow channels bends and extends in its respective first region.

8. The heat exchange plate according to claim 4, characterized in that The first region includes multiple hot zones, and the first flow channel segment of each group of sub-flow channels is located in a different hot zone; and / or, The second region includes multiple cold zones, and the second flow channel segment of each group of sub-flow channels is located in a different cold zone.

9. The heat exchange plate according to claim 4, characterized in that The flow area of ​​the first flow channel section is smaller than that of the second flow channel section.

10. The heat exchange plate according to claim 1, characterized in that The distribution density of the heat exchange channels in the first region is greater than the distribution density of the heat exchange channels in the second region.

11. The heat exchange plate according to claim 1, characterized in that The plate is provided with a liquid inlet, which includes a plurality of first liquid inlets and a plurality of second liquid inlets. The first liquid inlets and the second liquid inlets are used to connect a micro pump, and each heat exchange channel corresponds to a set of liquid inlets.

12. The heat exchange plate according to claim 1, characterized in that The plate is provided with liquid inlets, which include a first liquid inlet and a second liquid inlet, and each heat exchange channel corresponds to a set of liquid inlets. The plate is provided with at least one transition channel, and the first end of the transition channel and the first liquid inlet, and the second end of the transition channel and the second liquid inlet are both used to connect the micro pump.

13. The heat exchange plate according to claim 1, characterized in that The first region is divided into a number of first sub-regions equal to the number of heat exchange channels, with each heat exchange channel extending into a different first sub-region; and / or, The second region is divided into a number of second sub-regions equal to the number of heat exchange channels, with each heat exchange channel extending into a different second sub-region.

14. A heat exchange module, characterized by include: The heat exchange plate according to any one of claims 1 to 13; Each heat exchange channel corresponds to at least one micropump, and the micropump is connected to the heat exchange channel to form a circulation path.

15. An electronic device, comprising: Includes the heat exchange module as described in claim 14.

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