Heat exchange plate, heat exchange module, and electronic device

Abstract

The present application provides a heat exchange plate, a heat exchange module, and an electronic device. The heat exchange plate comprises: a plate body, the plate body comprising a first region and a second region, the first region being configured to correspond to a heating region of an electronic product. The plate body is provided with a heat exchange flow channel, and the heat exchange flow channel at least extends into the second region and the first region to form a complete passage. The heat exchange flow channel comprises at least two groups of sub-flow channels; each group of sub-flow channels is provided with a first flow channel; and the first flow channels of each group of sub-flow channels are all located in the first region. The first flow channels of the two groups of sub-flow channels are in indirect communication with one another by means of the heat exchange flow channel extending to the second region.

Description

Heat exchange plate, heat exchange module and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202411390525.0, filed on September 30, 2024, and entitled "Heat exchange plate, heat exchange module and electronic device", the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the field of electronic product heat dissipation technology, and more particularly, to a heat exchange plate, a heat exchange module and an electronic device. BACKGROUND

[0003] The existing electronic product heat exchange plate creates a circulating path between the high temperature area and the low temperature area of the electronic product, and exchanges heat through the circulation of heat exchange liquid. However, the existing heat exchange plate has the problem that the heat exchange liquid only flows through the high temperature area and the low temperature area once in one cycle, which limits the effective transfer of heat, resulting in low heat exchange efficiency, which easily causes local overheating of the electronic product. SUMMARY

[0004] The present application provides a new technical solution of a heat exchange plate, which can at least solve the problem of low heat exchange efficiency of the existing heat exchange plate.

[0005] The present application also provides a new technical solution of a heat exchange module.

[0006] The present application also provides a new technical solution of an electronic device.

[0007] According to a first aspect of the present application, a heat exchange plate is provided, comprising: a plate body, the plate body comprising a first area and a second area, the first area being configured to correspond to a heat generating area of an electronic product; the plate body is provided with a heat exchange flow channel, the heat exchange flow channel extends at least in the second area and the first area to form a complete path; the heat exchange flow channel comprises at least two groups of sub-flow channels; each group of sub-flow channels has a first flow channel; the first flow channel of each group of sub-flow channels is located in the first area; the first flow channels of the two groups of sub-flow channels are indirectly connected through the heat exchange flow channel extending to the second area.

[0008] Optionally, each group of sub-flow channels has a second flow channel, the second flow channel is located in the second area, the second area is configured to correspond to a low heat area of the electronic product, the heat generation of the low heat area is lower than that of the heat generating area; in each group of sub-flow channels, the first flow channel is connected with the second flow channel of the group of sub-flow channels at both ends.

[0009] Optionally, the second flow channels of two adjacent groups of sub-flow channels are connected.

[0010] Optionally, each group of the sub-flow channels is connected in series through the second flow channel.

[0011] Optionally, the first region comprises a plurality of hot zones, and the first flow channel of each group of the sub-flow channels respectively corresponds to extend to one of the hot zones.

[0012] Optionally, the first flow channel of each group of the sub-flow channels extends in the respective corresponding hot zone with a bend.

[0013] Optionally, the second region comprises a plurality of cold zones, and the second flow channel of each group of the sub-flow channels respectively corresponds to extend to one of the cold zones.

[0014] Optionally, the plate body comprises a plurality of second regions.

[0015] Optionally, in each group of the sub-flow channels, the first flow channel has a smaller extension length than the second flow channel.

[0016] Optionally, the first flow channel has a smaller flow area than the second flow channel.

[0017] Optionally, the distribution density of the heat exchange flow channel in the first region is greater than the distribution density of the heat exchange flow channel in the second region.

[0018] Optionally, the plate body is formed with a plurality of first liquid passages and a plurality of second liquid passages, the first liquid passages and the second liquid passages are in communication with the heat exchange flow channel, and a micro-pump is used to communicate between the first liquid passages and the second liquid passages.

[0019] Optionally, the plate body is formed with a first liquid passage and a second liquid passage, the first liquid passage and the second liquid passage are in communication with the heat exchange flow channel; the plate body is provided with at least one transition flow channel, and a micro-pump is used to communicate between the first end of the transition flow channel and the first liquid passage, and between the second end of the transition flow channel and the second liquid passage.

[0020] According to a second aspect of the present application, a heat exchange module is provided, comprising: the heat exchange plate of any one of the above; a micro-pump, the heat exchange flow channel corresponding to at least one of the micro-pumps, and the micro-pump being in communication with the heat exchange flow channel to form a circulation passage.

[0021] According to a third aspect of the present application, an electronic device is provided, comprising the heat exchange module.

[0022] According to the heat exchange plate provided in the application, the first flow channel extending to the second area communicates the two groups of sub-flow channels in the first area, so that the heat exchange liquid can flow through the first area and the second area multiple times in a single cycle, the heat exchange liquid can absorb the heat of the heat generation area of the electronic product multiple times in the first area, and the heat is transferred to the second area, so that the heat exchange liquid is prevented from being saturated, the efficient heat exchange is ensured, the heat exchange efficiency of the heat exchange plate is improved, and the problem of local overheating of the electronic product is effectively prevented, so that the temperature uniformity of the electronic product is ensured.

[0023] Other features and advantages of the present application will become apparent from the following detailed description of illustrative embodiments thereof, which description should be taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0024] The accompanying drawings incorporated in and forming a part of the specification illustrate embodiments of the present application and, together with the description, serve to explain the principles of the application.

[0025] FIG. 1 is a structural schematic diagram of a heat exchange plate according to an embodiment provided in the application;

[0026] FIG. 2 is a structural schematic diagram of a sub-flow channel of a heat exchange plate according to an embodiment provided in the application;

[0027] FIG. 3 is a partial structural schematic diagram of a heat exchange plate according to an embodiment provided in the application.

[0028] 100, heat exchange plate; 10, first area; 11, heat generation area; 20, second area; 21, cold area; 30, heat exchange flow channel; 31, sub-flow channel; 31a, first flow channel; 31b, second flow channel; 40, first liquid inlet; 50, second liquid inlet; 60, transition flow channel. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0030] Various exemplary embodiments of the present application will now be described in detail below with reference to the accompanying drawings. Note that the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments are not limiting to the scope of the present application unless otherwise specifically stated.

[0031] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way limiting to the scope of the application or its applications or uses.

[0032] Techniques, methods, and apparatus known to those of ordinary skill in the relevant art can not be discussed in detail herein. However, where appropriate, such techniques, methods, and apparatus should be considered as being part of the specification.

[0033] In all of the compositions shown and discussed herein, any specific values should be interpreted as merely exemplary, and not a limitation. Thus, other examples of the exemplary embodiments can have different values.

[0034] It should be noted that like reference numerals and letters refer to like items throughout the attached drawings, and thus once an item is defined in one drawing, it is not necessary that it be further discussed in subsequent drawings.

[0035] The heat exchange plate 100 according to the embodiments of the present application will be described in detail below in conjunction with the drawings.

[0036] As shown in FIGS. 1 and 3, the heat exchange plate 100 according to the embodiments of the present application includes a plate body.

[0037] Specifically, the plate body includes a first region 10 and a second region 20, the first region 10 is configured to correspond to a heat generating area of an electronic product; the plate body is provided with a heat exchange flow channel 30, the heat exchange flow channel 30 extends at least in the second region 20 and the first region 10 to form a complete passage; the heat exchange flow channel 30 includes at least two groups of sub-flow channels 31; each group of sub-flow channels 31 has a first flow channel 31a; the first flow channel 31a of each group of sub-flow channels 31 is located in the first region 10; the first flow channels 31a of the two groups of sub-flow channels 31 are indirectly communicated through the heat exchange flow channel 30 extending to the second region 20.

[0038] In other words, as shown in FIGS. 1 to 3, the heat exchange plate 100 according to the embodiments of the present application is mainly used for heat exchange of an electronic product, which mainly includes a plate body, the plate body can include a first region 10 and a second region 20, the plate body is provided with a heat exchange flow channel 30, a part of the heat exchange flow channel 30 can extend in the first region 10 of the plate body, and another part of the heat exchange flow channel 30 can extend in the second region 20 of the plate body to form a passage for circulating heat exchange liquid. The first region 10 of the plate body is adapted to the heat generating area of the electronic product (for example, the area where the processor of the electronic product is located), so that the first region 10 of the plate body can cooperate with the heat generating area of the electronic product, so that the heat exchange liquid circulating in the heat exchange flow channel 30 can transfer the heat of the heat generating area to the second region 20.

[0039] As shown in FIG. 1 and FIG. 2, the heat exchange flow channel 30 includes multiple groups of sub-flow channels 31, each of which has a first flow channel 31a, and the first flow channels 31a of the multiple groups of sub-flow channels 31 are arranged in the first area 10 of the plate body and are not communicated in the first area 10, but are communicated by the heat exchange flow channel 30 passing through the second area 20, so that the heat exchange liquid can flow through the first area 10 and the second area 20 multiple times in a single cycle, thereby absorbing heat from the heat generating area of the electronic product multiple times in the first area 10 and transferring the heat to the second area 20, which can effectively prevent the heat exchange liquid from reaching a heat exchange saturation state too early and ensure that the heat exchange liquid can continuously and efficiently exchange heat in a relatively optimal temperature range.

[0040] Therefore, according to the heat exchange plate 100 provided by the embodiment, the heat exchange flow channel 30 extending to the second area 20 communicates the first flow channels 31a of the two groups of sub-flow channels 31 located in the first area 10, so that the heat exchange liquid can flow through the first area 10 and the second area 20 multiple times in a single cycle, thereby absorbing heat from the heat generating area of the electronic product multiple times in the first area 10 and transferring the heat to the second area 20, which can prevent the heat exchange liquid from reaching a heat exchange saturation state, ensure efficient heat exchange, improve the heat exchange efficiency of the heat exchange plate 100, and effectively prevent the problem of local overheating of the electronic product, thereby ensuring the uniformity of the electronic product.

[0041] According to an embodiment of the present application, each group of sub-flow channels 31 has a second flow channel 31b located in the second area 20, and the second area 20 is configured to correspond to a low heat area of the electronic product, and the heat generating amount of the low heat area is lower than that of the heat generating area.

[0042] Specifically, as shown in FIG. 1 and FIG. 2, the second area 20 of the plate body is adapted to the low heat area of the electronic product, so that the second area 20 of the plate body can cooperate with the low heat area of the electronic product, thereby the heat exchange liquid flowing in the heat exchange flow channel 30 can transfer the heat from the heat generating area of the electronic product to the low heat area of the electronic product.

[0043] It should be noted that the low heat area of the electronic product refers to an area whose temperature is lower than that of the heat generating area when the electronic product is in use, i.e., an area (for example, an area where the battery with relatively low heat generating amount is located, or an area where the electronic product does not generate heat) with relatively low heat generating amount can be regarded as the low heat area of the electronic product, so that the heat from the heat generating area with relatively high temperature can be transferred to the low heat area with relatively low temperature, which can improve the uniformity of the electronic product and prevent the electronic product from overheating.

[0044] In the embodiment, each group of sub-flow channels 31 has a second flow channel 31b, specifically, the first flow channel 31a of each group of sub-flow channels 31 has a second flow channel 31b at both ends thereof, and the second flow channel 31b can be located in the second area 20, so that the heat exchange liquid can exchange heat in the second area 20 of the plate body before flowing into the first flow channel 31a and after flowing out of the first flow channel 31a, which is beneficial to the heat transfer between the heat generation area and the low heat area of the electronic product, and can effectively prevent the electronic product from overheating.

[0045] In some embodiments of the present application, the second flow channels 31b of two adjacent groups of sub-flow channels 31 are connected.

[0046] That is, as shown in FIGS. 1 and 2, two adjacent groups of sub-flow channels 31 are connected through corresponding second flow channels 31b, and the following will be specifically described by taking two groups of sub-flow channels 31 as an example. The second flow channel 31b at the tail end of the first flow channel 31a of the first group of sub-flow channels 31 is connected with the second flow channel 31b at the head end of the first flow channel 31a of the second group of sub-flow channels 31, that is, the two second flow channels 31b are connected with each other at one or more positions.

[0047] When there are multiple connection positions, the heat exchange liquid can be divided and merged when flowing through the two second flow channels 31b, and by dividing the heat exchange liquid, the heat exchange liquid can more fully exchange heat in the second area 20, so as to more effectively transfer heat to the low heat area of the electronic product.

[0048] In the embodiment, two adjacent groups of sub-flow channels 31 are connected through corresponding second flow channels 31b, so that the heat exchange liquid can quickly enter the first flow channel 31a after flowing out of the second flow channel 31b, and the heat exchange liquid can focus on efficiently cooling the heat generation area of the electronic product in the first area 10, which effectively avoids the heat exchange liquid absorbing unnecessary heat when flowing through a non-target area, thereby being more beneficial to concentrated cooling of the heat generation area of the electronic product.

[0049] According to an embodiment of the present application, each group of sub-flow channels 31 is connected through a second flow channel 31b.

[0050] Specifically, as shown in FIG. 1, two adjacent groups of sub-flow channels 31 are connected through corresponding second flow channels 31b, and the following will be specifically described by taking two groups of sub-flow channels 31 as an example. The end of the second flow channel 31b at the tail end of the first flow channel 31a of the first group of sub-flow channels 31 is connected with the end of the second flow channel 31b at the head end of the first flow channel 31a of the second group of sub-flow channels 31, so as to realize the series connection of the two adjacent groups of sub-flow channels 31.

[0051] In the embodiment, the two adjacent groups of sub-flow channels 31 are connected in series through the respective corresponding second flow channels 31b, so that the heat exchange liquid only needs to pass through the first region 10 and the second region 20 multiple times without passing through the non-target region when flowing through the multiple groups of sub-flow channels 31, which can ensure that the heat exchange liquid can focus on efficient heat exchange between the first region 10 (for the heat generation area of the electronic product) and the second region 20 (for the low heat area of the electronic product), thereby effectively avoiding the invalid heat exchange that may occur when the heat exchange liquid flows through the non-target region.

[0052] In some embodiments of the present application, the first region 10 includes a plurality of heat areas 11, and the first flow channel 31a of each group of sub-flow channels 31 respectively corresponds to extend to one heat area 11.

[0053] That is, as shown in FIG. 1, in order to further improve the heat exchange efficiency of the heat exchange plate 100, the first region 10 of the plate body can be divided into a plurality of heat areas 11 (i.e., regions for absorbing heat from the heat generation area), and the first flow channel 31a of each group of sub-flow channels 31 extends to different heat areas 11, that is, each heat area 11 is only provided with one first flow channel 31a. In this way, the heat exchange liquid flowing through each first flow channel 31a can dissipate heat from the heat generation area of the electronic product at different positions, which is beneficial to maintaining the uniformity of the heat generation area of the electronic product and can effectively prevent local overheating, thereby ensuring the stable operation of the electronic product.

[0054] According to an embodiment of the present application, the first flow channel 31a of each group of sub-flow channels 31 is bent and extends in the respective corresponding heat area 11.

[0055] Specifically, as shown in FIG. 1, the first flow channel 31a of each group of sub-flow channels 31 has one or more bending portions, so that the first flow channel 31a can fully spread in the respective corresponding heat area 11. In this way, the heat exchange efficiency of the heat exchange liquid can be fully utilized, the heat exchange area can be optimized, the uniformity of the heat generation area of the electronic product can be significantly improved, local overheating can be effectively prevented, and the stable operation of the electronic product can be ensured.

[0056] In some embodiments of the present application, the second region 20 includes a plurality of cold areas 21, and the second flow channel 31b of each group of sub-flow channels 31 respectively corresponds to extend to one cold area 21.

[0057] That is, as shown in FIG. 1, in order to further improve the heat exchange efficiency of the heat exchange plate 100, the second region 20 of the plate body can be divided into multiple cold regions 21 (i.e., regions for dissipating heat to low-heat regions and / or the outside world), and the second flow channels 31b of each group of sub-flow channels 31 are extended to different cold regions 21, that is, each cold region 21 is only provided with the second flow channels 31b of one group of sub-flow channels 31. In this way, when the heat exchange liquid flows in the second flow channels 31b, it can efficiently disperse and transfer heat to different positions of the low-heat region of the electronic product, promoting rapid heat transfer and distribution. At the same time, it effectively prevents the occurrence of heat saturation in the local second region 20, thereby improving the heat exchange efficiency of the heat exchange plate 100.

[0058] According to one embodiment of the present application, the plate body includes multiple second regions 20.

[0059] Specifically, the plate body has at least two second regions 20. For a clearer description, two second regions 20 are taken as an example for detailed description below. The plate body has two second regions 20, and a part of the first flow channels 31a of adjacent sub-flow channels 31 are connected through the heat exchange flow channels 30 in one of the second regions 20, and another part of the first flow channels 31a of adjacent sub-flow channels 31 are connected through the heat exchange flow channels 30 in the other second region 20.

[0060] In the present embodiment, one first region 10 can correspond to multiple second regions 20. After the heat exchange liquid absorbs heat when flowing through the first region 10, it can be distributed to different second regions 20, thereby realizing efficient dispersion and transfer of heat, and effectively improving the heat exchange efficiency of the heat exchange plate 100.

[0061] In some optional examples of the present application, multiple second regions 20 are distributed with intervals, and the first region 10 can be located between two second regions 20; or multiple second regions 20 are distributed on the outer periphery of the first region 10.

[0062] In some specific embodiments of the present application, in each group of sub-flow channels 31, the extension length of the first flow channels 31a is less than the extension length of the second flow channels 31b.

[0063] In other words, in each group of sub-flow channels 31, the first flow channel 31a and the second flow channel 31b can have different lengths, and in the embodiment, the first flow channel 31a has a smaller length than the second flow channel 31b. The shorter first flow channel 31a can ensure that the heat exchange liquid can quickly pass through the first region 10, effectively reducing the residence time of the heat exchange liquid in the region, effectively avoiding the heat saturation phenomenon caused by the heat exchange liquid contacting high temperature for a long time, thereby ensuring that the heat exchange process can be continuously and efficiently carried out. At the same time, the longer second flow channel 31b can ensure that the heat exchange liquid can fully flow through the second region 20, which is conducive to transferring heat to the low-heat area of the electronic product, and can ensure that the temperature of the heat exchange liquid entering the first region 10 is not too high, thereby ensuring that the heat exchange liquid can continuously and efficiently absorb heat in the first region 10.

[0064] According to an embodiment of the present application, the first flow channel 31a has a smaller flow area than the second flow channel 31b.

[0065] Specifically, as shown in FIGS. 1 and 2, in each group of sub-flow channels 31, the first flow channel 31a and the second flow channel 31b can have different flow areas (i.e., cross-sectional areas), and in the embodiment, the first flow channel 31a has a smaller flow area than the second flow channel 31b. The first flow channel 31a with a smaller flow area can ensure that the heat exchange liquid can quickly pass through the first region 10, effectively reducing the residence time of the heat exchange liquid in the region, effectively avoiding the heat saturation phenomenon caused by the heat exchange liquid contacting high temperature for a long time, thereby ensuring that the heat exchange process can be continuously and efficiently carried out. At the same time, the second flow channel 31b with a larger flow area can ensure that the heat exchange liquid can flow through the second region 20 more slowly, which is conducive to transferring heat to the low-heat area of the electronic product, and can ensure that the temperature of the heat exchange liquid entering the first region 10 is not too high, thereby ensuring that the heat exchange liquid can continuously and efficiently absorb heat in the first region 10.

[0066] In some specific embodiments of the present application, the distribution density of the heat exchange flow channels 30 in the first region 10 is greater than the distribution density of the heat exchange flow channels 30 in the second region 20.

[0067] That is, as shown in FIG. 1, the distribution density of the heat exchange flow channels 30 in the first region 10 and the second region 20 can be different, and in the embodiment, the distribution density of the heat exchange flow channels 30 in the first region 10 (i.e., the first flow channel 31a) is greater than the distribution density of the heat exchange flow channels 30 in the second region 20 (i.e., the second flow channel 31b), that is, the heat exchange flow channels 30 are arranged relatively densely in the first region 10, and the heat exchange flow channels 30 are arranged relatively sparsely in the second region 20, that is, the area ratio of the heat exchange flow channels 30 in the first region 10 is greater than the area ratio of the heat exchange flow channels 30 in the second region 20.

[0068] In the embodiment, the dense heat exchange flow channels 30 in the first region 10 greatly increase the heat exchange area between the heat exchange liquid and the heat generating area of the electronic product, thereby accelerating the heat transfer process, facilitating the heat exchange liquid to rapidly absorb and carry away the heat generated by the heat generating area, avoiding the occurrence of local overheating, significantly improving the uniform temperature performance of the electronic product, and ensuring the stable operation of the electronic product.

[0069] According to one embodiment of the present application, the plate body is formed with a plurality of first liquid passages 40 and a plurality of second liquid passages 50, the first liquid passages 40 and the second liquid passages 50 are in communication with the heat exchange flow channels 30, and the first liquid passages 40 and the second liquid passages 50 are used to communicate the micro-pump.

[0070] As shown in FIG. 1, specifically, the plate body is provided with the first liquid passages 40 and the second liquid passages 50 in communication with the heat exchange flow channels 30, in use, the first liquid passages 40 can be in communication with the liquid outlet of the micro-pump, and the second liquid passages 50 can be in communication with the liquid inlet of the micro-pump, so as to form a circulating passage of the heat exchange liquid, and when the electronic product is working, the heat exchange liquid can be driven to circulate in the circulating passage by the micro-pump.

[0071] In the embodiment, the plate body is provided with a plurality of first liquid passages 40 and a plurality of second liquid passages 50, each of the first liquid passages 40 and the second liquid passages 50 can communicate the micro-pump, so that the parallel arrangement of a plurality of micro-pumps can be realized in the circulating passage. When one of the micro-pumps fails, the other micro-pumps can still work, thereby effectively improving the reliability of the heat exchange module; at the same time, the pressure drop of the heat exchange liquid in the circulation process can be significantly reduced by the plurality of micro-pumps arranged, ensuring that the pressure distribution at each position in the circulating passage is more uniform, thereby ensuring the consistency of the heat exchange effect and the uniform temperature of the electronic product.

[0072] According to some embodiments of the present application, the plate body is formed with the first liquid passages 40 and the second liquid passages 50, the first liquid passages 40 and the second liquid passages 50 are in communication with the heat exchange flow channels 30; the plate body is provided with at least one transition flow channel 60, and the first end of the transition flow channel 60 and the second end of the transition flow channel 60 are used to communicate the micro-pump.

[0073] That is, as shown in FIG. 3, the plate body is provided with at least one first liquid passage 40 and at least one second liquid passage 50, the first liquid passage 40 is in communication with the first end of the heat exchange flow channel 30, the second liquid passage 50 is in communication with the second end of the heat exchange flow channel 30, and the plate body is provided with one or more transition flow channels 60.

[0074] As shown in FIG. 3, when the plate body is provided with a transition flow channel 60, the outlet of the first micro-pump can be in communication with the first end of the transition flow channel 60, the inlet of the first micro-pump can be in communication with the first through-flow port 40, the inlet of the second micro-pump can be in communication with the second end of the transition flow channel 60, and the outlet of the second micro-pump can be in communication with the second through-flow port 50, so as to form a circulating path of the heat exchange liquid. When the plate body is provided with a plurality of transition flow channels 60, the ends of two transition flow channels 60 can also be in communication with micro-pumps, so that the circulating path can realize the series connection of three or more micro-pumps.

[0075] In the embodiment, the series connection of a plurality of micro-pumps can be realized by the cooperation of the transition flow channel 60, the first through-flow port 40 and the second through-flow port 50, and the flow rate of the heat exchange liquid in the circulating path is effectively increased, so that the heat exchange efficiency of the heat exchange plate 100 can be significantly improved.

[0076] In summary, according to the heat exchange plate 100 provided in the embodiment, the heat exchange liquid can flow through the first region 10 and the second region 20 multiple times in a single cycle by the first flow channel 31a connecting the two groups of sub-flow channels 31 in the first region 10, so that the heat exchange liquid can absorb the heat of the heat generation area of the electronic product multiple times in the first region 10 and transfer the heat to the second region 20, the saturation of the heat exchange liquid is avoided, the efficient heat exchange is ensured, the heat exchange efficiency of the heat exchange plate 100 is improved, and the problem of local overheating of the electronic product is effectively prevented, and the uniformity of the electronic product is ensured.

[0077] The embodiment of the present application also provides a heat exchange module, which comprises the heat exchange plate 100 described in any of the above embodiments, and at least one micro-pump, wherein the micro-pump is in communication with the heat exchange flow channel 30 to form a circulating path. Since the heat exchange plate 100 according to the embodiment of the present application has the above technical effects, the heat exchange module according to the embodiment of the present application also has corresponding technical effects, and the embodiment will not be described again.

[0078] In some embodiments of the present application, the micro-pump can be a piezoelectric micro-pump, the length and width of the micro-pump can be about 7 mm, and the thickness of the micro-pump can be about 1 mm, so as to be beneficial to installation on a smaller electronic product.

[0079] The embodiment of the present application also provides an electronic device, for example, but not limited to, a wearable device, which comprises the heat exchange module described in the above embodiments. Since the heat exchange plate 100 according to the embodiment of the present application has the above technical effects, the electronic device according to the embodiment of the present application also has corresponding technical effects, and the embodiment will not be described again.

[0080] In some embodiments of the application, the electronic device is a VR device, the first area 10 of the heat exchange plate 100 can be arranged in the heat generating area of the VR device (for example, the area where the processor in the VR device is located), and the second area 20 of the heat exchange plate 100 can be arranged on the strap of the VR device. When the heat exchange module is running, the heat of the processor located in the VR device can be transferred to the strap through the circulating heat exchange liquid, and the heat can be transferred to the external environment through the strap.

[0081] Although some specific embodiments of the application have been described in detail by examples, those skilled in the art should understand that the above examples are only for illustration, not for limiting the scope of the application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the application. The scope of the application is defined by the appended claims.

Claims

1. A heat exchange plate, characterized in that The plate body comprises a first region and a second region, the first region is configured to correspond to a heat generating area of an electronic product; The plate body is provided with a heat exchange flow channel, the heat exchange flow channel extends at least in the first region and the second region to form a complete passage; The heat exchange flow channel comprises at least two groups of sub-flow channels; Each group of sub-flow channels has a first flow channel; The first flow channel of each group of sub-flow channels is located in the first region; The first flow channels of two groups of sub-flow channels are indirectly connected through the heat exchange flow channel extending to the second region. Each group of sub-flow channels has a second flow channel, the second flow channel is located in the second region, the second region is configured to correspond to a low heat area of an electronic product, and the heat generation of the low heat area is lower than that of the heat generating area; 2. The heat exchange plate according to claim 1, characterized in that In each group of sub-flow channels, the first flow channel is connected with the second flow channel of the group of sub-flow channels at both ends. The second flow channels of two adjacent groups of sub-flow channels are connected.

3. The heat exchange plate according to claim 2, characterized in that Each group of sub-flow channels is connected in series through the second flow channel.

4. The heat exchange plate according to claim 2, characterized in that The first region comprises a plurality of heat areas, and the first flow channel of each group of sub-flow channels respectively corresponds to one of the heat areas.

5. The heat exchange plate according to claim 1, characterized in that The first flow channel of each group of sub-flow channels is bent and extends in the corresponding heat area.

6. The heat exchange plate according to claim 5, characterized in that The second region comprises a plurality of cold areas, and the second flow channel of each group of sub-flow channels respectively corresponds to one of the cold areas.

7. The heat exchange plate according to claim 2, characterized in that The plate body comprises a plurality of second regions.

8. The heat exchange plate according to any one of claims 1-7, characterized in that In each group of sub-flow channels, the extension length of the first flow channel is less than the extension length of the second flow channel.

9. The heat exchange plate according to claim 2, characterized in that The flow area of the first flow channel is smaller than the flow area of the second flow channel.

10. The heat exchange plate according to claim 2, characterized in that The distribution density of the heat exchange flow channel in the first region is greater than the distribution density of the heat exchange flow channel in the second region.

11. The heat exchange plate according to claim 1, characterized in that The plate body is formed with a plurality of first liquid passages and a plurality of second liquid passages, the first liquid passages and the second liquid passages are in communication with the heat exchange flow channel, and the first liquid passages and the second liquid passages are used to communicate with the micropump.

12. The heat exchange plate according to claim 1, characterized in that The plate body is formed with a first liquid passage and a second liquid passage, the first liquid passage and the second liquid passage are in communication with the heat exchange flow channel; 13. The heat exchange plate according to claim 1, characterized in that The plate body is provided with at least one transition flow channel, the first end of the transition flow channel and the second end of the transition flow channel are used to communicate with the micropump. The heat exchange plate according to any one of claims 1-13; 14. A heat exchange module, characterized by The micropump, the heat exchange flow channel corresponds to at least one micropump, and the micropump is in communication with the heat exchange flow channel to form a circulation passage. The heat exchange module of claim 14. ​ 15. An electronic device, comprising: ​

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