Liquid injection method for heat exchange plate, and heat exchange module and electronic device

Abstract

Provided in the present application are a liquid injection method for a heat exchange plate, and a heat exchange module and an electronic device. A heat exchange plate is provided with a heat exchange flow channel, and the heat exchange flow channel is provided with an injection port and a discharge port. The liquid injection method comprises: injecting a liquid into the heat exchange flow channel from the injection port for the first time, such that the liquid fills the heat exchange flow channel; performing primary degassing treatment on the heat exchange plate; injecting the liquid into the heat exchange flow channel from the injection port for the second time; at least performing one instance of secondary degassing treatment on the heat exchange plate; and after each instance of secondary degassing treatment, injecting a heat exchange liquid into the heat exchange flow channel from the injection port, such that the liquid fills the heat exchange flow channel. In the liquid injection method of the present application, by means of performing multiple instances of liquid injection and multi-stage degassing on a heat exchange plate, the uniform distribution of a liquid in a heat exchange flow channel is realized, gas in the heat exchange flow channel is effectively removed, the presence of bubbles in the heat exchange flow channel is effectively avoided, and the adverse effect of the bubbles on a heat exchange effect is eliminated, thereby significantly improving the reliability and heat exchange efficiency of the heat exchange plate.

Description

Liquid injection method of heat exchange plate, heat exchange module and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202411391812.3, filed on September 30, 2024, and entitled "Liquid injection method of heat exchange plate, heat exchange module and electronic device", the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of heat exchange plate liquid injection, and more particularly, to a liquid injection method of a heat exchange plate, a heat exchange module and an electronic device. BACKGROUND

[0003] The main function of the heat exchange plate is to absorb and transfer the heat generated by the device through liquid circulation. Although the existing heat exchange plate is designed with fine internal flow channels to improve heat exchange efficiency, the conventional liquid injection technology is difficult to discharge the gas in the flow channel, which seriously affects the heat exchange efficiency of the heat exchange plate. SUMMARY

[0004] The present application provides a new technical solution of a liquid injection method of a heat exchange plate, which can at least solve the problem of low heat exchange efficiency of the existing heat exchange plate caused by insufficient liquid injection process.

[0005] The present application also provides a new technical solution of a heat exchange module.

[0006] The present application also provides a new technical solution of an electronic device.

[0007] According to a first aspect of the present application, a liquid injection method for a heat exchange plate of an electronic product is provided, the heat exchange plate is provided with a heat exchange flow channel, the heat exchange flow channel is provided with an injection inlet and a discharge outlet, and the liquid injection method comprises the following steps:

[0008] Performing first liquid injection into the heat exchange flow channel from the injection inlet to fill the heat exchange flow channel with liquid;

[0009] Performing primary degassing treatment on the heat exchange plate;

[0010] Performing second liquid injection into the heat exchange flow channel from the injection inlet;

[0011] Performing secondary degassing treatment on the heat exchange plate at least once;

[0012] After each secondary degassing treatment, performing heat exchange liquid injection into the heat exchange flow channel from the injection inlet to fill the heat exchange flow channel with liquid.

[0013] Optionally, the primary degassing treatment is heating the heat exchange plate.

[0014] Optionally, the primary degassing treatment is heating the heat exchange plate in a heat preservation baking manner.

[0015] Optionally, the temperature of the primary degassing treatment is 60-80℃, and the treatment time is 3-4h.

[0016] Optionally, the secondary degassing treatment is water bath heating of the heat exchange plate, and the temperature of the water bath heating is 50-70℃, and the heating time is 1-2h.

[0017] Optionally, the secondary degassing treatment is ultrasonic vibration treatment of the heat exchange plate, and the frequency of the ultrasonic vibration treatment is 30-50kHz, the time of the ultrasonic vibration treatment is 30-60min, and the power of the ultrasonic vibration treatment is 100-300w.

[0018] Optionally, in the first liquid filling, the second liquid filling, and the heat exchange liquid filling, the volume of the filled liquid is greater than the volume of the heat exchange flow channel.

[0019] Optionally, the liquid filling method further comprises:

[0020] Before the heat exchange liquid is injected into the heat exchange flow channel, the heat exchange liquid is subjected to liquid degassing treatment.

[0021] Optionally, the liquid degassing treatment is heating and / or reducing the pressure of the heat exchange liquid to boiling.

[0022] Optionally, the liquid filling method further comprises:

[0023] Before the primary degassing treatment and the secondary degassing treatment are performed, a sealing plug is fixedly sealed to the injection port and the discharge port, so that the liquid is enclosed in the heat exchange flow channel.

[0024] When the second liquid filling or the heat exchange liquid filling is performed, the sealing plug is removed.

[0025] Optionally, when the heat exchange liquid filling process is performed, the filling flow rate of the heat exchange liquid is 2-3ml / s.

[0026] Optionally, in the first liquid filling and / or the second liquid filling process, the filled liquid is heat exchange liquid.

[0027] According to a second aspect of the present application, a heat exchange module is provided, characterized in that it comprises a heat exchange plate obtained by the liquid filling method according to any one of the above.

[0028] According to a third aspect of the present application, an electronic device is provided, comprising the heat exchange module described above.

[0029] According to the liquid injection method of the heat exchange plate, the uniform distribution of the liquid in the heat exchange channel is realized through multiple liquid injection and multiple-stage degassing of the heat exchange plate, and the gas in the heat exchange channel is effectively removed, the existence of the bubbles in the heat exchange channel is effectively avoided, the adverse effects of the bubbles on the heat exchange effect are eliminated, and therefore the reliability and the heat exchange efficiency of the heat exchange plate can be significantly improved.

[0030] Other features of the present application, and their advantages, will become apparent in the non-limiting detailed description of exemplary embodiments of the present application, described below with reference to the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0031] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present application and, together with the description, serve to explain the principles of the present application.

[0032] Fig. 1 is a flow chart of a liquid injection method according to one embodiment provided by the present application. DETAILED DESCRIPTION

[0033] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of the components and steps set forth in the embodiments, as well as the numerical expressions and values, are not limitations on the scope of the present application, unless otherwise specifically stated.

[0034] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way limiting on the scope of the application or its applications or uses.

[0035] Techniques, methods, and apparatus known to those of ordinary skill in the relevant art can not be discussed in detail herein, but should be considered as part of the specification, where appropriate.

[0036] In all of the examples shown and discussed herein, any specific values should be interpreted as merely illustrative and not as a limitation on the scope of the exemplary embodiments. Thus, other examples of the exemplary embodiments can have different values.

[0037] It should be noted that like reference numerals and letters in the various figures indicate similar items, and thus, once any term is defined in one figure, it is not necessary to discuss it further in connection with other figures.

[0038] Embodiments of the present application provide a heat exchange plate, which is mainly applied to electronic devices. The heat exchange plate is provided with a heat exchange channel, the heat exchange channel is provided with a first liquid inlet and a second liquid inlet, the first liquid inlet is adapted to communicate with a liquid inlet of a micro-pump, and the second liquid inlet is adapted to connect with a liquid outlet of the micro-pump to form a circulation loop. The heat exchange channel is further provided with an injection inlet and a discharge outlet, wherein the injection inlet is used to inject liquid into the heat exchange channel, and the discharge outlet is used to discharge gas and excess liquid in the heat exchange channel.

[0039] Specifically, the heat exchange plate is made of polymer material film layers, and the connection between the polymer material film layers is by bonding or hot pressing, etc. The connection part forms unnecessary protrusions on the inner side of the heat exchange flow channel. The protrusions can cause some small bubbles in the heat exchange flow channel when the heat exchange plate is injected.

[0040] Based on this, the embodiment of the present application also provides an injection method. The injection method can be used to inject the heat exchange plate in the above-mentioned embodiment. As shown in FIG. 1, the injection method comprises S100 to S500.

[0041] S100, first liquid injection is performed from the injection port to the heat exchange flow channel to fill the heat exchange flow channel with liquid.

[0042] Specifically, the first liquid injection is performed from the injection port to the heat exchange flow channel by using a pressurized injection method or a vacuum injection method. When the pressurized injection method is used, the flow speed of the liquid can be accelerated by increasing the pressure, thereby shortening the injection time and improving the injection efficiency. At the same time, by adjusting the size of the pressure, the speed and flow of the injection can be accurately controlled, which is beneficial to the uniform distribution of the liquid in the heat exchange flow channel and can reduce the formation of air columns or bubbles. When the vacuum injection method is used, the air in the heat exchange flow channel can be effectively extracted to form a negative pressure environment by vacuum extraction, so that the liquid can flow smoothly into the heat exchange flow channel, and the formation of air columns or bubbles can be reduced, which can ensure the uniform distribution of the liquid in the heat exchange flow channel.

[0043] S200, primary degassing treatment is performed on the heat exchange plate.

[0044] In detail, after the first liquid injection is completed, the primary degassing treatment can be performed on the heat exchange plate. Through the primary degassing treatment, the gas in the heat exchange plate can be collected together. For example, the bubbles dispersed in the liquid in the heat exchange flow channel can be collected at one or more places of the heat exchange flow channel to form air columns or larger bubbles, thereby facilitating the subsequent removal of the air columns and bubbles.

[0045] S300, second liquid injection is performed from the injection port to the heat exchange flow channel.

[0046] Specifically, after the primary degassing treatment is completed, the second liquid injection is performed from the injection port to the heat exchange flow channel by using the pressurized injection method. During the second liquid injection, the air columns and larger bubbles in the heat exchange flow channel can be pushed out of the discharge port by using the second injected liquid, so that the liquid can fill the space previously occupied by the air columns and bubbles.

[0047] S400, at least one secondary degassing treatment is performed on the heat exchange plate.

[0048] S500, after each secondary degassing treatment, liquid is injected into the heat exchange channel from the injection port to make the liquid fill the heat exchange channel.

[0049] That is, after the second liquid injection is completed, some small bubbles are still contained in the heat exchange plate, so the heat exchange plate can be subjected to one or two degassing treatments. Through the secondary degassing treatment, the small bubbles in the heat exchange channel can be gathered together to form larger bubbles. After each secondary degassing treatment is completed, liquid is injected into the heat exchange channel from the injection port by pressurized injection, so that the bubbles gathered during the secondary degassing treatment can be discharged through the discharge port, so that the liquid fills the entire heat exchange channel, thereby ensuring the heat exchange efficiency of the heat exchange plate.

[0050] Therefore, according to the liquid injection method of the present application, through multiple liquid injection and multiple-stage degassing of the heat exchange plate, uniform distribution of the liquid in the heat exchange channel is achieved, and the gas in the heat exchange channel is effectively removed, effectively avoiding the existence of bubbles in the heat exchange channel, eliminating the adverse effects of bubbles on the heat exchange effect, thereby significantly improving the reliability and heat exchange efficiency of the heat exchange plate.

[0051] In some embodiments of the present application, the primary degassing treatment is heating the heat exchange plate.

[0052] That is, one method of realizing the primary degassing treatment is to heat the heat exchange plate using a heating device. During heating, the heat exchange plate is placed vertically, and during the heating process, the bubbles in the heat exchange channel expand due to heating, and the buoyancy experienced by the bubbles also increases, thereby promoting the upward movement and gathering of the bubbles. At the same time, the heating of the liquid causes the solubility of the gas in the liquid to decrease, further promoting the release and upward movement of the bubbles, so that the bubbles can be effectively gathered at the top of the heat exchange channel, thereby realizing the entire primary degassing treatment process.

[0053] In this embodiment, the heat exchange plate is subjected to primary degassing treatment by heating, which can be suitable for batch degassing operation and can effectively improve the degassing efficiency.

[0054] According to one embodiment of the present application, the primary degassing treatment is heating the heat exchange plate using a heat preservation baking method.

[0055] This embodiment uses a heat preservation baking method to perform primary degassing treatment on the heat exchange plate, which can ensure uniform temperature of the heat exchange plate during heating. Through uniform heat transfer, the problem of local overheating or uneven heating can be reduced, the degassing process is optimized, and the degassing rate is improved, thereby effectively reducing the number of subsequent degassing times.

[0056] In some embodiments of the present application, the temperature of the first degassing treatment is 60-80°C, and the treatment time is 3-4 hours. Within this range, air in the heat exchange plate can be effectively removed. When the heat exchange plate is made of a polymer material film, within this range, air in the polymer material film and the glue at the connection of the heat exchange plate can be effectively removed, while ensuring that the heat exchange plate does not deform.

[0057] Optionally, when the first degassing treatment is performed, the heating temperature can be controlled between 60-80°C, such as 60°C, 65°C, 70°C, 75°C, and 80°C, and the heating time can be set to 3-4 hours, such as 3 hours, 3.5 hours, 4 hours, etc.

[0058] According to an embodiment of the present application, the second degassing treatment is water bath heating of the heat exchange plate, the temperature of the water bath heating is 50-70°C, and the heating time is 1-2 hours.

[0059] In other words, in order to avoid external gas entering the heat exchange flow channel through the polymer material film during heating, the second degassing treatment of the heat exchange plate is performed by water bath heating. Since the heat exchange plate is completely immersed in water, not only is the penetration of external gas prevented, but the uniformity of the heat exchange plate is also ensured. This uniform heating environment helps to collect the tiny bubbles in the heat exchange plate and the gas dissolved in the liquid, thereby optimizing the degassing process and improving the degassing efficiency, which can effectively reduce the number of subsequent degassing treatments, while improving the liquid injection efficiency and quality of the heat exchange plate.

[0060] When the second degassing treatment is performed, the temperature of the water bath heating can be controlled between 50-80°C, such as 50°C, 55°C, 60°C, 65°C, 70°C, 75°C, and 80°C, and the heating time can be set to 1-2 hours, such as 1 hour, 1.5 hours, 2 hours, etc. Within this condition, it is beneficial to collect the tiny bubbles in the heat exchange plate and the gas dissolved in the liquid, while ensuring that the heat exchange plate does not deform.

[0061] In some embodiments of the present application, the second degassing treatment is ultrasonic vibration treatment of the heat exchange plate, the frequency of the ultrasonic vibration treatment is 30-50 kHz, the time of the ultrasonic vibration treatment is 30-60 minutes, and the power of the ultrasonic vibration treatment is 100-300 watts.

[0062] That is, the method of achieving the first degassing treatment can also be ultrasonic vibration treatment of the heat exchange plate, which can prevent external gas from entering the heat exchange flow channel, while also helping to remove bubbles in the heat exchange plate during subsequent liquid injection.

[0063] When the secondary degassing treatment is performed, the frequency of the ultrasonic vibration treatment can be controlled between 30 kHz and 50 kHz, for example, 30 kHz, 35 kHz, 40 kHz, 45 kHz and 50 kHz, etc., and the time of the ultrasonic vibration treatment can be controlled between 30 min and 60 min, for example, 30 min, 40 min, 50 min and 60 min, etc. Under this condition, it is beneficial to collect the micro-bubbles in the heat exchange plate and the gas dissolved in the liquid, while ensuring the degassing effect.

[0064] Further, the power of the ultrasonic vibration treatment can be controlled between 100 w and 300 w, for example, 100 w, 200 w and 300 w, etc.

[0065] According to an embodiment of the present application, the volume of the liquid filled in the first liquid filling, the second liquid filling and the heat exchange liquid filling is greater than the volume of the heat exchange flow channel.

[0066] Specifically, when the first liquid filling, the second liquid filling and the heat exchange liquid filling are performed, it is ensured that the volume of the filled liquid is greater than the volume of the heat exchange flow channel, which can ensure that the heat exchange flow channel is occupied by the liquid, and it is beneficial to discharge the gas in the heat exchange plate during the liquid filling process, which can effectively reduce the number of liquid filling and degassing.

[0067] In some optional examples of the present application, the heat exchange plate is connected with a micro-pump before the liquid is filled, and the micro-pump is in communication with the heat exchange flow channel to form a circulation passage. When the first liquid filling, the second liquid filling and the heat exchange liquid filling are performed, it is ensured that the volume of the filled liquid is greater than the volume of the circulation passage, which can ensure that the circulation passage is occupied by the liquid, and it is beneficial to discharge the gas, which can effectively reduce the number of liquid filling and degassing.

[0068] In some embodiments of the present application, the liquid filling method further comprises: performing liquid degassing treatment on the heat exchange liquid before the heat exchange liquid is injected into the heat exchange flow channel.

[0069] In other words, before the heat exchange liquid is injected into the heat exchange flow channel, the heat exchange liquid is subjected to a preliminary liquid degassing treatment, which can ensure that the injected heat exchange liquid is as pure as possible and does not contain any bubbles or dissolved gas, thereby avoiding the negative impact of the gas on the heat transfer efficiency during the heat exchange process.

[0070] According to an embodiment of the present application, the liquid degassing treatment is heating and / or reducing the pressure of the heat exchange liquid to boiling.

[0071] That is, the method of the liquid degassing treatment includes but is not limited to the following cases:

[0072] Case one, heating the heat exchange liquid to boiling, which can discharge the gas dissolved in the heat exchange liquid;

[0073] Case two, the environment of the heat exchange liquid is vacuumized at the same time when the heat exchange liquid is heated, so that the heat exchange liquid is in a negative pressure environment, which can lower the boiling point of the heat exchange liquid, and can effectively avoid the gas being dissolved in the heat exchange liquid, and can effectively improve the degassing effect.

[0074] Case three, the environment of the heat exchange liquid is directly vacuumized, for example, vacuumized to below 0.1 bar, so that the heat exchange liquid can be boiled at room temperature, thereby effectively avoiding the gas being dissolved in the heat exchange liquid, and significantly improving the degassing effect.

[0075] In some embodiments of the present application, the liquid injection method further comprises: before the first degassing treatment and the second degassing treatment are performed, sealing and fixing the sealing plug to the injection port and the discharge port to seal the liquid in the heat exchange flow channel; and removing the sealing plug when the second liquid injection or the heat exchange liquid injection is performed.

[0076] That is, before the first degassing treatment is performed, the injection port and the discharge port are sealed by using the sealing plug, so as to ensure that the liquid is completely sealed in the heat exchange flow channel, prevent the liquid from leaking during the degassing process, and avoid external gas entering the heat exchange flow channel. When the second liquid injection is performed, the sealing plug only needs to be removed. Similarly, before the second degassing treatment is performed, the same method of sealing the liquid by using the sealing plug can be used to avoid the liquid from being lost during the degassing process, and to avoid external gas entering the heat exchange flow channel. After the heat exchange liquid is injected for the last time, the sealing plug can be selected to be retained to maintain the sealed state of the liquid in the heat exchange flow channel.

[0077] In some optional examples of the present application, the sealing plug is made of a high polymer material, and when the injection port and the discharge port are blocked, the sealing plug can be sealed and fixed by using heat bonding, ultrasonic welding or the like.

[0078] According to an embodiment of the present application, when the heat exchange liquid injection process is performed, the injection flow rate of the heat exchange liquid is 2 ml / s to 3 ml / s.

[0079] In this embodiment, the injection flow rate of the heat exchange liquid is maintained between 2 ml / s and 3 ml / s, for example, 2 ml / s, 2.5 ml / s and 3 ml / s, etc. Within this range, the efficiency of the liquid injection process can be ensured, the product production efficiency can be avoided due to the small flow rate, and the generation of bubbles can be prevented due to the large flow rate, thereby reducing the number of subsequent liquid injection and degassing.

[0080] In some embodiments of the present application, the liquid injected in the first liquid injection and / or the second liquid injection process is the heat exchange liquid.

[0081] That is, no matter the first liquid filling or the second liquid filling, the liquid used can be the heat exchange liquid. In this way, it can be ensured that the heat exchange liquid is not mixed with other types of liquid during the entire filling process, thereby avoiding the adverse effects that can occur on the heat exchange effect, and reducing the number of liquid additions.

[0082] In summary, according to the liquid filling method of the present application, through multiple liquid filling and multiple-stage degassing of the heat exchange plate, uniform distribution of the liquid in the heat exchange flow channel is achieved, and the gas in the heat exchange flow channel is effectively removed, effectively avoiding the existence of bubbles in the heat exchange flow channel, eliminating the adverse effects of bubbles on the heat exchange effect, thereby significantly improving the reliability and heat exchange efficiency of the heat exchange plate.

[0083] The embodiments of the present application also provide a heat exchange module, comprising a heat exchange plate and a micropump, wherein the heat exchange plate is the heat exchange plate obtained by the liquid filling method described in any of the above embodiments. Since the liquid filling method according to the embodiments of the present application has the above technical effects, the heat exchange module according to the embodiments of the present application also has corresponding technical effects, and this embodiment will not be repeated.

[0084] The embodiments of the present application also provide an electronic device comprising the heat exchange module described in the above embodiments. Since the liquid filling method according to the embodiments of the present application has the above technical effects, the electronic device according to the embodiments of the present application also has corresponding technical effects, and this embodiment will not be repeated.

[0085] Although some specific embodiments of the present application have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration, and are not intended to limit the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A liquid injection method for a heat exchange plate of an electronic product, characterized by, The heat exchange plate is provided with a heat exchange channel, the heat exchange channel is provided with an injection port and a discharge port, and the liquid injection method comprises the following steps: First liquid injection is performed from the injection port into the heat exchange channel to fill the heat exchange channel with liquid; Primary degassing treatment is performed on the heat exchange plate; Second liquid injection is performed from the injection port into the heat exchange channel; Secondary degassing treatment is performed at least once on the heat exchange plate; After each secondary degassing treatment, heat exchange liquid is injected from the injection port into the heat exchange channel to fill the heat exchange channel with liquid.

2. The liquid injection method according to claim 1, wherein The primary degassing treatment is heating the heat exchange plate.

3. The liquid injection method according to claim 2, wherein The primary degassing treatment is heating the heat exchange plate by heat preservation baking.

4. The liquid injection method according to claim 2, wherein The temperature of the primary degassing treatment is 60-80℃, and the treatment time is 3-4h.

5. The liquid injection method according to claim 1, wherein The secondary degassing treatment is water bath heating of the heat exchange plate, the temperature of the water bath heating is 50-70℃, and the heating time is 1-2h.

6. The liquid casting method according to claim 1, wherein The secondary degassing treatment is ultrasonic vibration treatment of the heat exchange plate, the frequency of the ultrasonic vibration treatment is 30-50kHz, the time of the ultrasonic vibration treatment is 30-60min, and the power of the ultrasonic vibration treatment is 100-300w.

7. The liquid casting method according to claim 1, wherein In the first liquid injection, the second liquid injection, and the heat exchange liquid injection, the volume of the injected liquid is greater than the volume of the heat exchange channel.

8. The liquid casting method according to claim 1, wherein The liquid injection method further comprises: Before the heat exchange liquid is injected into the heat exchange channel, liquid degassing treatment is performed on the heat exchange liquid.

9. The liquid injection method according to claim 8, wherein The liquid degassing treatment is heating and / or reducing the pressure of the heat exchange liquid to boiling.

10. The liquid casting method according to claim 1, wherein The liquid injection method further comprises: Before the primary degassing treatment and the secondary degassing treatment are performed, a sealing plug is used to seal and fix the injection port and the discharge port, so that the liquid is sealed in the heat exchange channel; When the second liquid injection or the heat exchange liquid injection is performed, the sealing plug is removed.

11. The liquid casting method according to claim 1, wherein When the heat exchange liquid injection process is performed, the injection flow rate of the heat exchange liquid is 2-3ml / s.

12. The liquid casting method according to claim 1, wherein In the first liquid injection and / or the second liquid injection process, the injected liquid is heat exchange liquid.

13. A heat exchange module, characterized by The heat exchange module comprises the heat exchange plate obtained by the liquid injection method according to any one of claims 1-12.

14. An electronic device, comprising: The heat exchange module comprises the heat exchange plate obtained by the liquid injection method according to any one of claims 1-12.

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