Electrothermal simulation processing method and apparatus for printed circuit board, device, and storage medium

Abstract

The present invention relates to the technical field of simulation processing. Provided are an electrothermal simulation processing method and apparatus for a printed circuit board, a device, and a storage medium. The method comprises: performing current simulation on a printed circuit board to generate a printed circuit board mesh model comprising a plurality of printed circuit board mesh units, and acquiring current distribution data of the printed circuit board; calculating a heating power for each printed circuit board mesh unit; establishing a printed circuit board grid model; mapping the printed circuit board mesh units into the printed circuit board grid model, and calculating an equivalent heating power for each grid unit; establishing a printed circuit board thermal simulation model comprising a plurality of thermal mesh units, and configuring the equivalent heating power to be a target heating power of each thermal mesh unit; and performing thermal simulation analysis on the printed circuit board, and drawing a temperature distribution map of the printed circuit board. The present invention can improve the accuracy and efficiency of electrothermal simulation processing and obtain accurate temperature distribution of printed circuit boards.

Description

A printed circuit board electric heating simulation processing method, device, equipment and storage medium TECHNICAL FIELD

[0001] The present application relates to the technical field of simulation processing, in particular to a printed circuit board electric heating simulation processing method, device, equipment and storage medium. BACKGROUND

[0002] With the improvement of the integration of electronic devices and the increasing complexity of functions, the thermal design problem of PCB (Printed Circuit Board) as the core component of electronic devices is increasingly valued. In high power density application scenarios, components and circuits inside the printed circuit board will generate a large amount of heat, which will lead to performance degradation, shortened life, and even overheating failure of electronic components if not effectively dissipated. Therefore, the thermal simulation technology for printed circuit boards has become a key link in electronic thermal design.

[0003] In the prior art, a simplified model is usually used to simulate the heat of the printed circuit board, and the heat generation area is set as a single heat source. However, the simplified model will cause the difference in heat generation power of different areas to be ignored, resulting in distorted simulation results and unable to accurately reflect the actual temperature distribution. SUMMARY

[0004] The problem solved by the present application is how to improve the thermal simulation accuracy of the printed circuit board region and obtain the accurate temperature distribution of the printed circuit board.

[0005] To solve the above problems, the present application provides a printed circuit board electric heating simulation processing method, device, equipment and storage medium.

[0006] In a first aspect, the present application provides a printed circuit board electric heating simulation processing method for electric heating simulation processing of a printed circuit board in an electronic device, comprising:

[0007] According to the circuit design data of the printed circuit board, current simulation of the printed circuit board is performed to generate a printed circuit board grid model, and printed circuit board current distribution data is collected, wherein the printed circuit board grid model comprises a plurality of printed circuit board grid units;

[0008] According to the current distribution data, the heat generation power of each printed circuit board grid unit is calculated;

[0009] A printed circuit board grid model is established, and the printed circuit board grid model comprises a plurality of grid units;

[0010] mapping the printed circuit board grid cells to corresponding positions in the printed circuit board grid model, and calculating equivalent heat generation power of each of the grid cells based on the heat generation power of the printed circuit board grid cells;

[0011] building a printed circuit board thermal simulation model based on the printed circuit board grid model, the printed circuit board thermal simulation model including a plurality of thermal grid cells corresponding to the grid cells, configuring the equivalent heat generation power as target heat generation power of the thermal grid cells, and setting each of the thermal grid cells as a heat source to obtain a printed circuit board target thermal simulation model;

[0012] performing printed circuit board thermal simulation analysis based on the printed circuit board target thermal simulation model to obtain printed circuit board thermal simulation results, and drawing a temperature distribution map of the printed circuit board according to the printed circuit board thermal simulation results.

[0013] Optionally, the current distribution data includes current data and resistance data of the printed circuit board grid cells.

[0014] Optionally, the calculation of the heat generation power of each of the printed circuit board grid cells based on the current distribution data includes:

[0015] calculating the current distribution data by using a Joule heat formula to obtain the heat generation power of each of the printed circuit board grid cells;

[0016] The Joule heat calculation formula is:

[0017] P = I 2 R;

[0018] wherein P represents the heat generation power of the printed circuit board grid cell, I represents the current flowing through the printed circuit board grid cell, and R represents the resistance of the printed circuit board grid cell.

[0019] Optionally, the mapping of the printed circuit board grid cells to corresponding positions in the printed circuit board grid model, and the calculation of the equivalent heat generation power of each of the grid cells based on the heat generation power of the printed circuit board grid cells includes:

[0020] discretizing each of the printed circuit board grid cells to obtain a plurality of printed circuit board grid sub-cells with equal volume;

[0021] calculating the heat generation power of each of the printed circuit board grid sub-cells based on the heat generation power of the printed circuit board grid cells;

[0022] mapping the printed circuit board grid sub-cell to a corresponding position in the printed circuit board grid model to determine an equivalent mapping pair, the equivalent mapping pair being used to represent a correspondence between the printed circuit board grid sub-cell and the grid sub-cell;

[0023] calculating, according to the equivalent mapping pair, an equivalent heat generation power of each of the grid cells based on a heat generation power of the printed circuit board grid sub-cell.

[0024] Optionally, the printed circuit board grid sub-cell is divided into N equal-volume printed circuit board grid sub-cells through discretization processing, and a calculation formula for calculating the heat generation power of each of the printed circuit board grid sub-cells based on the heat generation power of the printed circuit board grid sub-cell is:

[0025] wherein P a represents the heat generation power of the printed circuit board grid sub-cell, p represents the heat generation power of the printed circuit board grid sub-cell, and N represents a number of the printed circuit board grid sub-cells into which each of the printed circuit board grid sub-cells is divided.

[0026] Optionally, the calculating, according to the equivalent mapping pair, an equivalent heat generation power of each of the grid cells based on a heat generation power of the printed circuit board grid sub-cell comprises:

[0027] determining, based on the equivalent mapping pair, a printed circuit board grid sub-cell corresponding to each of the grid cells, wherein the printed circuit board grid sub-cell corresponding to each of the grid cells comprises a first printed circuit board grid sub-cell and a second printed circuit board grid sub-cell, the first printed circuit board grid sub-cell representing a printed circuit board grid sub-cell completely located within the grid cell, and the second printed circuit board grid sub-cell representing a printed circuit board grid sub-cell partially located within the grid cell;

[0028] determining a heat generation power of the first printed circuit board grid sub-cell;

[0029] determining, based on a heat generation power of the second printed circuit board grid sub-cell, an actual heat generation power of the second printed circuit board grid sub-cell in the grid cell according to a volume proportion of the second printed circuit board grid sub-cell in the grid cell;

[0030] calculating, based on the heat generation power of the first printed circuit board grid sub-cell and the actual heat generation power of the second printed circuit board grid sub-cell in the grid cell, an equivalent heat generation power of each of the grid cells.

[0031] Optionally, a calculation formula for the equivalent heat generation power of the grid cell is:

[0032] wherein, P W represents the equivalent heat generation power of the Wth grid unit, the Wth grid unit corresponding to i first printed circuit board grid sub-units and l second printed circuit board grid sub-units, P k represents the heat generation power of the kth first printed circuit board grid sub-unit, P m represents the actual heat generation power of the mth second printed circuit board grid sub-unit in the grid unit.

[0033] In a second aspect, the present application provides a printed circuit board heat simulation processing device for executing the printed circuit board heat simulation processing method, comprising:

[0034] an electrical simulation module for performing current simulation on the printed circuit board according to the circuit design data of the printed circuit board, generating a printed circuit board grid model, and collecting printed circuit board current distribution data, wherein the printed circuit board grid model comprises a plurality of printed circuit board grid units;

[0035] a heat generation power module for calculating the heat generation power of each printed circuit board grid unit according to the current distribution data;

[0036] a printed circuit board grid model module for establishing a printed circuit board grid model, wherein the printed circuit board grid model comprises a plurality of grid units;

[0037] a mapping module for mapping the printed circuit board grid units to corresponding positions in the printed circuit board grid model, and calculating the equivalent heat generation power of each grid unit based on the heat generation power of the printed circuit board grid units;

[0038] a thermal simulation model building module for building a printed circuit board thermal simulation model based on the printed circuit board grid model, wherein the printed circuit board thermal simulation model comprises a plurality of thermal grid units corresponding to the grid units, the equivalent heat generation power is configured as the target heat generation power of the thermal grid units, and each thermal grid unit is set as a heat source to obtain a printed circuit board target thermal simulation model;

[0039] a thermal simulation module for performing printed circuit board thermal simulation analysis based on the printed circuit board target thermal simulation model, obtaining printed circuit board thermal simulation results, and drawing a temperature distribution map of the printed circuit board according to the printed circuit board thermal simulation results.

[0040] In a third aspect, the present application provides an electronic device comprising a memory and a processor;

[0041] the memory is configured to store a computer program;

[0042] The processor is configured to implement the printed circuit board electro-thermal simulation processing method according to the first aspect when executing the computer program.

[0043] In a fourth aspect, the present application provides a computer readable storage medium, wherein the storage medium stores a computer program, and when the computer program is executed by a processor, the printed circuit board electro-thermal simulation processing method according to the first aspect is implemented.

[0044] Compared with the prior art, the present application has the following beneficial effects: firstly, the current of the printed circuit board is simulated according to the circuit design data of the printed circuit board to generate a printed circuit board grid model including a plurality of printed circuit board grid units, the printed circuit board grid model can refine the current distribution of each region of the printed circuit board, and provide a data basis for subsequent calculation of heat generation power; the heat generation power calculation based on the current distribution data can accurately describe the heat generation characteristics of each region, and improve the accuracy of heat source processing; then, by introducing the grid model, the complex structure of the printed circuit board can be simplified, so that the heat source of each region can be processed independently, thereby avoiding errors caused by a single heat source; subsequently, by accurately mapping the printed circuit board grid units into the grid model and calculating the equivalent heat generation power of each grid unit based on the heat generation power, the heat source distribution of the grid model can be ensured to be consistent with the current distribution and heat generation of the actual printed circuit board; then, by establishing a thermal simulation model based on the grid model, the complex heat generation power distribution can be converted into a plurality of independent heat sources, and each heat grid unit is assigned with a corresponding equivalent heat generation power, so that the thermal simulation can accurately reflect the temperature field change of the printed circuit board; finally, the accurate printed circuit board temperature distribution map is obtained through thermal simulation analysis. The present application can improve the accuracy and efficiency of electro-thermal simulation processing, and obtain the accurate temperature distribution of the printed circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0045] Fig. 1 is a flowchart of a printed circuit board electro-thermal simulation processing method according to an embodiment of the present application;

[0046] Fig. 2 is a flowchart of step S14 of a printed circuit board electro-thermal simulation processing method according to an embodiment of the present application;

[0047] Fig. 3 is a structural diagram of a printed circuit board electro-thermal simulation processing device according to an embodiment of the present application;

[0048] Fig. 4 is a structural diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0049] In order to make the above objectives, characteristics and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application are described in detail below with reference to the drawings. Although some embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms, and should not be interpreted as being limited to the embodiments described herein, on the contrary, these embodiments are provided to make the present application more thorough and complete. It should be understood that the drawings and embodiments of the present application are only for illustrative purposes, and are not intended to limit the scope of protection of the present application.

[0050] It should be understood that each step described in the method embodiments of the present application can be performed in different order and / or in parallel. In addition, the method embodiments can include additional steps and / or omit the steps shown. The scope of the present application is not limited in this respect.

[0051] The term "comprising" and variations thereof as used herein are open-ended, that is "including, but not limited to"; the term "based on" is "based, at least in part, on"; the term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments"; the term "optional" means "optional in at least some embodiments". Related definitions will be given in the description below. It should be noted that the concepts of "first", "second", etc. mentioned in the present application are only used to distinguish different devices, modules or units, and are not intended to limit the order or interdependence of the functions performed by these devices, modules or units.

[0052] It should be noted that the modification of "one" or "multiple" mentioned in the present application is illustrative and not limiting, and those skilled in the art should understand that unless otherwise explicitly indicated in the context, it should be understood as "one or more".

[0053] The names of the messages or information exchanged between the devices in the embodiments of the present application are only for illustrative purposes, and are not intended to limit the scope of the messages or information.

[0054] In order to solve the problem that the simulation results in the prior art are distorted and cannot accurately reflect the actual temperature distribution, the improvement of thermal simulation accuracy has become the focus of research. In the traditional method, the simulation accuracy is often reduced due to insufficient number of grid divisions or excessive model simplification, especially when dealing with multi-layer printed circuit boards or complex circuit structures, the heat source processing is particularly difficult. The existing thermal simulation method cannot accurately reflect the heat generation characteristics of different elements and regions, resulting in that the temperature distribution of the printed circuit board region does not match the actual situation, which affects the subsequent thermal design and optimization.

[0055] Referring to FIG. 1, the present application provides a printed circuit board electric heating simulation processing method for performing electric heating simulation processing on a printed circuit board in an electronic device, comprising:

[0056] S11, current simulation is performed on the printed circuit board according to circuit design data of the printed circuit board to generate a printed circuit board grid model, and printed circuit board current distribution data is collected, wherein the printed circuit board grid model comprises a plurality of printed circuit board grid units.

[0057] Firstly, circuit design data of the printed circuit board is obtained, such as conductor layout, component arrangement, layer number, material properties, etc. of the PCB, and the circuit design data of the printed circuit board is imported into electromagnetic simulation software. Voltage and current boundary conditions are set according to the actual circuit conditions. Then, the electromagnetic simulation software is used to simulate the current distribution of the PCB to obtain current distribution data of different regions of the PCB. In the simulation process, the PCB regions are divided into grids to generate a plurality of printed circuit board grid units. Each printed circuit board grid unit contains corresponding geometric data and current distribution data, which provides a data basis for subsequent calculation of heat generation power. The shape of the printed circuit board grid unit can be a triangular prism, a cuboid, etc., which can be flexibly set according to actual needs, and is not limited here.

[0058] S12, the heat generation power of each printed circuit board grid unit is calculated according to the current distribution data.

[0059] Specifically, after the current simulation is completed, the heat generation power of each grid unit is calculated according to the Joule heat formula. The resistance value of the printed circuit board grid unit can be calculated according to the material, resistivity and geometric size of each grid unit. The heat generation function of each printed circuit board grid unit can reflect the heat generated by the grid unit.

[0060] S13, a printed circuit board grid model is established, wherein the printed circuit board grid model comprises a plurality of grid units.

[0061] In order to simplify the thermal simulation model and improve the simulation efficiency, the printed circuit board is simplified into a grid model. The grid model divides the PCB into a plurality of grid units, and the number of grid units depends on the number of layers, area and simulation accuracy requirement of the PCB. Each grid unit represents a small area in the PCB and will be treated as a heat source in the subsequent steps.

[0062] S14, the printed circuit board grid units are mapped to corresponding positions in the printed circuit board grid model, and the equivalent heat generation power of each grid unit is calculated based on the heat generation power of the printed circuit board grid units.

[0063] Specifically, the equivalent heat generation power of each grid cell can be obtained by accumulating the heat generation powers of all printed circuit board grid cells mapped inside it. If the printed circuit board grid cell spans multiple grid cells, the heat generation power can be proportionally distributed according to the proportion of the printed circuit board grid cell in each grid cell, thereby ensuring that the heat source distribution in the printed circuit board thermal simulation process is highly consistent with the actual heat source distribution.

[0064] S15, a printed circuit board thermal simulation model is built based on the printed circuit board grid model, the printed circuit board thermal simulation model includes a plurality of thermal grid cells corresponding to the grid cells, the equivalent heat generation power is configured as the target heat generation power of the thermal grid cell, and each thermal grid cell is set as a heat source, thereby obtaining a printed circuit board target thermal simulation model.

[0065] wherein each grid cell corresponds to a corresponding printed circuit board thermal grid cell one by one, and the equivalent heat generation power is set as a heat source of each thermal grid cell, the target heat generation power of the thermal grid cell is an input parameter during thermal simulation, so as to ensure that the thermal simulation result can reflect the heat generation characteristics of different regions in the PCB.

[0066] S16, a printed circuit board thermal simulation analysis is performed based on the printed circuit board target thermal simulation model, a printed circuit board thermal simulation result is obtained, and a temperature distribution map of the printed circuit board is drawn according to the printed circuit board thermal simulation result.

[0067] Compared with the prior art, the beneficial effects of the present application are: first, the current of the printed circuit board is simulated according to the circuit design data of the printed circuit board, a printed circuit board grid model including a plurality of printed circuit board grid cells is generated, the printed circuit board grid model can refine the current distribution of each region of the printed circuit board, and provide a data basis for subsequent heat generation power calculation; the heat generation power calculation based on the current distribution data can accurately describe the heat generation characteristics of each region, and improve the accuracy of heat source processing; then, by introducing the grid model, the complex structure of the printed circuit board can be simplified, so that the heat source of each region can be processed independently, thereby avoiding the error caused by a single heat source; subsequently, by accurately mapping the printed circuit board grid cell into the grid model and calculating the equivalent heat generation power of each grid cell based on the heat generation power, the heat source distribution of the grid model can be ensured to be consistent with the current distribution and heat generation of the actual printed circuit board; then, by establishing a thermal simulation model based on the grid model, the complex heat generation power distribution can be converted into a plurality of independent heat sources, and each thermal grid cell is assigned with a corresponding equivalent heat generation power, so that the thermal simulation can accurately reflect the temperature field change of the printed circuit board; finally, a precise printed circuit board temperature distribution map is obtained through thermal simulation analysis. The present application can improve the accuracy and efficiency of electro-thermal simulation processing, and obtain the precise temperature distribution of the printed circuit board.

[0068] In an embodiment, the current distribution data comprises current data and resistance data of the printed circuit board grid cells.

[0069] Specifically, the resistance data of the printed circuit board grid cells can be obtained by the resistivity and the geometric shape of the printed circuit board grid cells.

[0070] In an embodiment, the calculating the heat generation power of each printed circuit board grid cell according to the current distribution data comprises:

[0071] calculating the heat generation power of each printed circuit board grid cell according to the current distribution data by using the Joule heat formula;

[0072] The Joule heat formula is:

[0073] P = I 2 R;

[0074] wherein, P represents the heat generation power of the printed circuit board grid cell, I represents the current flowing through the printed circuit board grid cell, and R represents the resistance of the printed circuit board grid cell.

[0075] The embodiment can accurately calculate the heat generation power of each printed circuit board grid cell by using the Joule heat formula, ensure the accuracy of the thermal simulation results, and provide high-precision input data for subsequent thermal simulation.

[0076] Referring to FIG. 2, the mapping the printed circuit board grid cells to the corresponding positions in the printed circuit board grid model and calculating the equivalent heat generation power of each grid cell based on the heat generation power of the printed circuit board grid cells comprises:

[0077] S141, discretizing each printed circuit board grid cell to obtain a plurality of printed circuit board grid sub-cells with equal volumes.

[0078] In order to improve the accuracy of the equivalent heat generation power of the grid cells, the printed circuit board grid cell can be first divided into a plurality of printed circuit board grid sub-cells. The discretization process can subdivide each printed circuit board grid cell into a plurality of printed circuit board grid sub-cells with equal volumes according to the geometric shape of each printed circuit board grid cell, so that the position and heat generation power distribution of each printed circuit board grid sub-cell are more accurate.

[0079] S142, calculating the heat generation power of each printed circuit board grid sub-cell based on the heat generation power of the printed circuit board grid cell.

[0080] Specifically, the printed circuit board grid unit is divided into N equal-volume printed circuit board grid sub-units through discretization processing, and a calculation formula for calculating the heat generation power of each printed circuit board grid sub-unit based on the heat generation power of the printed circuit board grid unit is:

[0081] wherein P a represents the heat generation power of the printed circuit board grid sub-unit, p represents the heat generation power of the printed circuit board grid unit, and N represents the number of the printed circuit board grid sub-units into which each printed circuit board grid sub-unit is divided.

[0082] S143, mapping the printed circuit board grid sub-unit to a corresponding position in the printed circuit board grid model to determine an equivalent mapping pair, which is used to represent the corresponding relationship between the printed circuit board grid sub-unit and the grid sub-unit.

[0083] According to the spatial coordinates of each printed circuit board grid sub-unit, it is mapped into the grid sub-unit covering the area, and the mapping pair relationship, i.e. the equivalent mapping pair, is determined. If a printed circuit board grid sub-unit spans multiple grid sub-units, the heat generation power of the printed circuit board grid sub-unit is distributed to the corresponding grid sub-units according to the volume proportion of the overlapping part. The embodiment can improve the accuracy of heat generation power mapping between the printed circuit board grid sub-unit and the grid sub-unit.

[0084] S144, calculating the equivalent heat generation power of each grid sub-unit based on the heat generation power of the printed circuit board grid sub-unit according to the equivalent mapping pair.

[0085] Specifically, calculating the equivalent heat generation power of each grid sub-unit based on the heat generation power of the printed circuit board grid sub-unit according to the equivalent mapping pair includes:

[0086] determining the printed circuit board grid sub-unit corresponding to each grid sub-unit based on the equivalent mapping pair, wherein the printed circuit board grid sub-unit corresponding to each grid sub-unit includes a first printed circuit board grid sub-unit and a second printed circuit board grid sub-unit, the first printed circuit board grid sub-unit represents a printed circuit board grid sub-unit completely located within the grid sub-unit, and the second printed circuit board grid sub-unit represents a printed circuit board grid sub-unit partially located within the grid sub-unit;

[0087] determining the heat generation power of the first printed circuit board grid sub-unit;

[0088] determine actual heat generation power of the second printed circuit board grid sub-unit in the grid unit according to volume proportion of the second printed circuit board grid sub-unit in the grid unit based on heat generation power of the second printed circuit board grid sub-unit;

[0089] calculate equivalent heat generation power of each of the grid units based on heat generation power of the first printed circuit board grid sub-unit and actual heat generation power of the second printed circuit board grid sub-unit in the grid unit.

[0090] The embodiment can accurately distribute heat generation power of the printed circuit board grid sub-unit to the grid unit through the accurate mapping and heat generation power distribution mechanism, especially finely distribute the heat generation power of the partially overlapped printed circuit board grid sub-unit according to the volume proportion, so as to ensure that the equivalent heat generation power of the grid unit is highly consistent with the actual current distribution and heat generation, thereby improving the accuracy and effectiveness of the electro-thermal simulation.

[0091] In an embodiment, the calculation formula of the equivalent heat generation power of the grid unit is:

[0092] wherein, P W represents the equivalent heat generation power of the Wth grid unit, the Wth grid unit corresponds to i first printed circuit board grid sub-units and l second printed circuit board grid sub-units, P k represents heat generation power of the kth first printed circuit board grid sub-unit, P m represents actual heat generation power of the mth second printed circuit board grid sub-unit in the grid unit.

[0093] The embodiment can effectively improve the calculation efficiency of the simulation while ensuring the accuracy of the heat generation power distribution.

[0094] Referring to FIG. 3, the present application provides a printed circuit board electro-thermal simulation processing device 30 for executing the above-mentioned printed circuit board electro-thermal simulation processing method, which comprises:

[0095] an electrical simulation module 31 for performing current simulation on the printed circuit board according to circuit design data of the printed circuit board, generating a printed circuit board grid model, and collecting printed circuit board current distribution data, wherein the printed circuit board grid model comprises a plurality of printed circuit board grid units;

[0096] a heat generation power module 32 for calculating heat generation power of each of the printed circuit board grid units according to the current distribution data;

[0097] a printed circuit board grid model module 33 for establishing a printed circuit board grid model, wherein the printed circuit board grid model comprises a plurality of grid units;

[0098] a mapping module 34, configured to map the printed circuit board grid cells to corresponding positions in the printed circuit board grid model, and calculate an equivalent heat generation power of each of the grid cells based on the heat generation power of the printed circuit board grid cells;

[0099] a thermal simulation model building module 35, configured to build a printed circuit board thermal simulation model based on the printed circuit board grid model, the printed circuit board thermal simulation model comprising a plurality of thermal grid cells corresponding to the grid cells, the equivalent heat generation power being configured as a target heat generation power of the thermal grid cells, and each of the thermal grid cells being set as a heat source, to obtain a printed circuit board target thermal simulation model;

[0100] a thermal simulation module 36, configured to perform printed circuit board thermal simulation analysis based on the printed circuit board target thermal simulation model, to obtain a printed circuit board thermal simulation result, and to draw a temperature distribution map of the printed circuit board according to the printed circuit board thermal simulation result.

[0101] Compared with the prior art, the present application has the following beneficial effects: firstly, the electric simulation module 31 performs current simulation on the printed circuit board according to the circuit design data of the printed circuit board, to generate a printed circuit board grid model comprising a plurality of printed circuit board grid cells, the printed circuit board grid model can refine the current distribution of each region of the printed circuit board, and provide a data basis for subsequent heat generation power calculation; the heat generation power calculation based on the current distribution data by the heat generation power module 32 can accurately describe the heat generation characteristics of each region, and improve the accuracy of heat source processing; then, the printed circuit board grid model module 33 can simplify the complex structure of the printed circuit board by introducing a grid model, so that the heat source of each region can be processed independently, thereby avoiding errors caused by a single heat source; subsequently, the mapping module 34 can ensure that the heat source distribution of the grid model is consistent with the current distribution and heat generation of the actual printed circuit board, by accurately mapping the printed circuit board grid cells to the grid model and calculating the equivalent heat generation power of each grid cell based on the heat generation power; then, the thermal simulation model building module 35 can convert the complex heat generation power distribution into a plurality of independent heat sources that can be simulated, and assign the corresponding equivalent heat generation power to each thermal grid cell, so that the thermal simulation can accurately reflect the temperature field change of the printed circuit board; finally, the thermal simulation module 36 can obtain an accurate printed circuit board temperature distribution map through thermal simulation analysis. The present application can improve the accuracy and efficiency of electric-thermal simulation processing, and obtain an accurate temperature distribution of the printed circuit board.

[0102] Referring to FIG. 4, the present application provides an electronic device 40 comprising a memory 41 and a processor 42;

[0103] The memory 41 is configured to store a computer program.

[0104] The processor 42 is configured to implement the printed circuit board electro-thermal simulation processing method when executing the computer program.

[0105] Alternatively, an electronic device 40 includes a memory 41 and a processor 42 coupled to the memory 41; the memory 41 is configured to store a computer program; the processor 42 is configured to execute the following operations when executing the computer program:

[0106] Current simulation is performed on the printed circuit board according to circuit design data of the printed circuit board, a printed circuit board grid model is generated, and printed circuit board current distribution data is collected, the printed circuit board grid model includes a plurality of printed circuit board grid units;

[0107] The heat generation power of each printed circuit board grid unit is calculated according to the current distribution data;

[0108] A printed circuit board grid model is established, the printed circuit board grid model includes a plurality of grid units;

[0109] The printed circuit board grid units are mapped to corresponding positions in the printed circuit board grid model, and the equivalent heat generation power of each grid unit is calculated based on the heat generation power of the printed circuit board grid unit;

[0110] A printed circuit board thermal simulation model is built based on the printed circuit board grid model, the printed circuit board thermal simulation model includes a plurality of thermal grid units corresponding to the grid units, the equivalent heat generation power is configured as the target heat generation power of the thermal grid units, and each thermal grid unit is set as a heat source, to obtain a printed circuit board target thermal simulation model;

[0111] Printed circuit board thermal simulation analysis is performed based on the printed circuit board target thermal simulation model, to obtain printed circuit board thermal simulation results, and a temperature distribution map of the printed circuit board is drawn according to the printed circuit board thermal simulation results.

[0112] The application provides a computer readable storage medium, the storage medium stores a computer program, when the computer program is executed by a processor, the printed circuit board electro-thermal simulation processing method is realized.

[0113] Alternatively, a non-volatile computer readable storage medium, the storage medium stores a computer program, when the computer program is executed by a processor, the processor executes the following operations:

[0114] Or, an electronic device 40, comprising a memory 41 and a processor 42 coupled to the memory 41; the memory 41 is configured to store a computer program; the processor 42 is configured to execute the following operations when executing the computer program:

[0115] Current simulation is performed on the printed circuit board according to the circuit design data of the printed circuit board, a printed circuit board grid model is generated, and printed circuit board current distribution data is collected, and the printed circuit board grid model comprises a plurality of printed circuit board grid units;

[0116] The heat generation power of each printed circuit board grid unit is calculated according to the current distribution data;

[0117] A printed circuit board grid model is established, and the printed circuit board grid model comprises a plurality of grid units;

[0118] The printed circuit board grid unit is mapped to the corresponding position in the printed circuit board grid model, and the equivalent heat generation power of each grid unit is calculated based on the heat generation power of the printed circuit board grid unit;

[0119] A printed circuit board thermal simulation model is built based on the printed circuit board grid model, the printed circuit board thermal simulation model comprises a plurality of thermal grid units corresponding to the grid units, the equivalent heat generation power is configured as the target heat generation power of the thermal grid unit, and each thermal grid unit is set as a heat source, to obtain a printed circuit board target thermal simulation model;

[0120] Based on the printed circuit board target thermal simulation model, a printed circuit board thermal simulation analysis is performed, a printed circuit board thermal simulation result is obtained, and a temperature distribution map of the printed circuit board is drawn according to the printed circuit board thermal simulation result.

[0121] Now, the electronic device 40 which can be a server or a client of the present application will be described, which is an example of a hardware device that can be applied to various aspects of the present application. The electronic device 40 is intended to represent a variety of form factors of digital electronic computing devices such as laptops, desktops, tablets, personal digital assistants, servers, blade servers, mainframes, and other appropriate computing devices. The electronic device 40 can also represent a variety of form factors of mobile devices such as personal digital assistants, cellular telephones, smart phones, wearable devices, and other similar computing devices. The components shown here, their connections and relationships, and their functions, are meant to be examples only, and are not meant to limit implementations of the present application described and / or claimed in this document.

[0122] The electronic device 40 includes a computing unit that can perform various appropriate actions and processes in accordance with a computer program stored in a read-only memory (ROM) or a computer program loaded from a storage unit into a random access memory (RAM). Various programs and data required for device operation can also be stored in the RAM. The computing unit, the ROM, and the RAM are connected to each other through a bus. An input / output (I / O) interface is also connected to the bus.

[0123] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiments can be completed by instructing the relevant hardware through a computer program, and the program can be stored in a computer readable storage medium. When the program is executed, it can include the processes of the above-mentioned embodiments. The storage medium can be a magnetic disc, an optical disc, a read-only memory (ROM), a random access memory (RAM), or the like. In this application, the units described as separate components can or can not be physically separated, and the components shown as units can or can not be physical units, that is, they can be located in one place or distributed on multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiments of the present application. In addition, the functional units in each embodiment of the present application can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0124] Although the present application is disclosed as above, the protection scope of the present application is not limited to this. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, and these changes and modifications will fall within the protection scope of the present application.

Claims

1. A method for electrothermal simulation processing of printed circuit boards, used to perform electrothermal simulation processing on printed circuit boards in electronic devices, characterized in that, The method comprises the following steps: current simulation is performed on the printed circuit board according to circuit design data of the printed circuit board, a printed circuit board grid model is generated, and printed circuit board current distribution data is collected, the printed circuit board grid model comprising a plurality of printed circuit board grid units; heat generation power of each printed circuit board grid unit is calculated according to the current distribution data; a printed circuit board grid model is established, the printed circuit board grid model comprising a plurality of grid units; the printed circuit board grid units are mapped to corresponding positions in the printed circuit board grid model, and equivalent heat generation power of each grid unit is calculated based on the heat generation power of the printed circuit board grid units; a printed circuit board thermal simulation model is built based on the printed circuit board grid model, the printed circuit board thermal simulation model comprising a plurality of thermal grid units corresponding to the grid units, the equivalent heat generation power is configured as target heat generation power of the thermal grid units, and each thermal grid unit is set as a heat source, so as to obtain a printed circuit board target thermal simulation model; thermal simulation analysis is performed on the printed circuit board based on the printed circuit board target thermal simulation model, so as to obtain printed circuit board thermal simulation results, and a temperature distribution diagram of the printed circuit board is drawn according to the printed circuit board thermal simulation results.

2. The printed circuit board electrical thermal simulation processing method according to claim 1, characterized by, The current distribution data comprises current data and resistance data of the printed circuit board grid units.

3. The printed circuit board electrical thermal simulation processing method according to claim 2, characterized by, The heat generation power of each printed circuit board grid unit is calculated according to the current distribution data, which comprises the following steps: the current distribution data is calculated by using a Joule heat formula, so as to obtain the heat generation power of each printed circuit board grid unit; the Joule heat calculation formula is as follows: P = I 2 R; wherein, P represents the heat generation power of the printed circuit board grid unit, I represents the current flowing through the printed circuit board grid unit, and R represents the resistance of the printed circuit board grid unit.

4. The printed circuit board electrical thermal simulation processing method of claim 1, wherein, The printed circuit board grid units are mapped to corresponding positions in the printed circuit board grid model, and equivalent heat generation power of each grid unit is calculated based on the heat generation power of the printed circuit board grid units, which comprises the following steps: discretization processing is performed on each printed circuit board grid unit, so as to obtain a plurality of printed circuit board grid sub-units with equal volume; heat generation power of each printed circuit board grid sub-unit is calculated based on the heat generation power of the printed circuit board grid units; the printed circuit board grid sub-units are mapped to corresponding positions in the printed circuit board grid model, so as to determine equivalent mapping pairs, the equivalent mapping pairs being used to represent the corresponding relationship between the printed circuit board grid sub-units and the grid sub-units; equivalent heat generation power of each grid unit is calculated according to the equivalent mapping pairs based on the heat generation power of the printed circuit board grid sub-units.

5. The printed circuit board electrical thermal simulation processing method according to claim 4, characterized by, The printed circuit board grid unit is divided into N equal-volume printed circuit board grid sub-units through discretization processing, and a calculation formula for calculating the heat generation power of each printed circuit board grid sub-unit based on the heat generation power of the printed circuit board grid unit is: wherein P a represents the heat generation power of the printed circuit board grid subunit, p represents the heat generation power of the printed circuit board grid unit, and N represents the number of the printed circuit board grid subunits divided from each printed circuit board grid unit.

6. The printed circuit board electrical thermal simulation processing method according to claim 4, characterized by, The equivalent heat generation power of each grid unit is calculated according to the equivalent mapping pairs based on the heat generation power of the printed circuit board grid sub-units, which comprises the following steps: determine, based on the equivalent mapping, printed circuit board grid sub-units corresponding to each of the grid units, wherein each of the printed circuit board grid sub-units corresponding to the grid units comprises a first printed circuit board grid sub-unit and a second printed circuit board grid sub-unit, the first printed circuit board grid sub-unit representing a printed circuit board grid sub-unit completely located within the grid unit, and the second printed circuit board grid sub-unit representing a printed circuit board grid sub-unit partially located within the grid unit; determine the heat generation power of the first printed circuit board grid sub-unit; determine, based on the heat generation power of the second printed circuit board grid sub-unit, actual heat generation power of the second printed circuit board grid sub-unit in the grid unit according to the volume ratio of the second printed circuit board grid sub-unit in the grid unit; calculate the equivalent heat generation power of each of the grid units based on the heat generation power of the first printed circuit board grid sub-unit and the actual heat generation power of the second printed circuit board grid sub-unit in the grid unit.

7. The printed circuit board electrical thermal simulation processing method according to claim 6, characterized by, The calculation formula of the equivalent heating power of the grid cell is: wherein P W represents the equivalent heat generation power of the Wth grid unit, the Wth grid unit corresponding to i first printed circuit board grid sub-units and l second printed circuit board grid sub-units, P k represents the heat generation power of the kth first printed circuit board grid sub-unit, P m represents the actual heat generation power of the mth second printed circuit board grid sub-unit in the grid unit.

8. A printed circuit board electrothermal simulation processing apparatus for executing the printed circuit board electrothermal simulation processing method according to any one of claims 1 to 7, characterized by comprise: an electrical simulation module configured to perform electrical current simulation on a printed circuit board according to circuit design data of the printed circuit board, generate a printed circuit board grid model, and collect printed circuit board current distribution data, wherein the printed circuit board grid model comprises a plurality of printed circuit board grid units; a heat generation power module configured to calculate heat generation power of each of the printed circuit board grid units according to the current distribution data; a printed circuit board grid model module configured to establish a printed circuit board grid model, wherein the printed circuit board grid model comprises a plurality of grid units; a mapping module configured to map the printed circuit board grid units to corresponding positions in the printed circuit board grid model, and calculate equivalent heat generation power of each of the grid units based on the heat generation power of the printed circuit board grid units; a thermal simulation model building module configured to build a printed circuit board thermal simulation model based on the printed circuit board grid model, wherein the printed circuit board thermal simulation model comprises a plurality of thermal grid units corresponding to the grid units, the equivalent heat generation power is configured as target heat generation power of the thermal grid units, and each of the thermal grid units is set as a heat source to obtain a printed circuit board target thermal simulation model; a thermal simulation module configured to perform printed circuit board thermal simulation analysis based on the printed circuit board target thermal simulation model, obtain printed circuit board thermal simulation results, and draw a temperature distribution map of the printed circuit board according to the printed circuit board thermal simulation results.

9. An electronic device, comprising: comprise a memory and a processor; the memory is configured to store a computer program; the processor is configured to implement the printed circuit board electrical and thermal simulation processing method according to any one of claims 1 to 7 when executing the computer program.

10. A computer readable storage medium characterized by, The storage medium has a computer program stored thereon, and when the computer program is executed by a processor, the printed circuit board electrical and thermal simulation processing method according to any one of claims 1 to 7 is implemented.

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