Thermal simulation processing method and apparatus for printed circuit board, and device and storage medium

Abstract

The present invention relates to the technical field of simulation processing. Provided are a thermal simulation processing method and apparatus for a printed circuit board, and a device and a storage medium. The method comprises: constructing a geometric model of an electronic device, partitioning the geometric model into a plurality of tetrahedral cells, setting material parameters and generating a mesh model of the electronic device; performing gridding processing on a pre-established geometric model of a printed circuit board, so as to obtain a plurality of grid sub-cells, and on the basis of actual circuit data of the printed circuit board, calculating equivalent material parameters of each grid sub-cell; selecting a plurality of first tetrahedral cells from the mesh model of the electronic device; mapping the first tetrahedral cells to corresponding positions in a gridded model, so as to obtain equivalent material parameters of each first tetrahedral cell; updating the material parameters of a printed circuit board region in the mesh model of the electronic device; and performing thermal simulation processing and drawing a temperature distribution map of the printed circuit board. By means of the present invention, a high-precision temperature distribution of a printed circuit board can be obtained.

Description

A printed circuit board thermal simulation processing method, device, equipment and storage medium TECHNICAL FIELD

[0001] The present application relates to the technical field of simulation processing, in particular to a printed circuit board thermal simulation processing method, device, equipment and storage medium. BACKGROUND

[0002] In the thermal simulation processing of electronic devices, especially in the thermal design process of portable devices such as mobile phones, it is usually necessary to simplify complex components to improve the success rate of mesh partitioning and reduce the number of mesh units. Simplification includes simplifying complex component models into common geometric models such as cylinders or cuboids to speed up simulation. For example, when performing thermal simulation on a mobile phone model, the printed circuit board is usually simplified as a cuboid, and the average specific heat capacity and thermal conductivity of the printed circuit board are used as equivalent parameters. Although simplification can effectively improve the speed of simulation, it will lose some simulation accuracy.

[0003] Especially in the area of printed circuit board circuit, the content of metal material is higher, and the heat conduction performance is significantly enhanced. Circuit designers usually reserve metal heat dissipation channels in the area of printed circuit board circuit to optimize the heat dissipation performance. However, in the thermal simulation processing, the simplified printed circuit board model usually uses the average thermal conductivity parameter, ignoring the difference in local thermal conductivity performance, resulting in that the simulation result cannot accurately reflect the temperature distribution of each area of the printed circuit board. The neglect of local thermal conductivity performance difference not only affects the accuracy of thermal simulation result, but also leads to incorrect judgment of designers when adjusting the heat dissipation structure, thereby affecting the optimization of the heat dissipation performance of the whole device. SUMMARY

[0004] The problem solved by the present application is how to improve the thermal simulation accuracy of the printed circuit board area and obtain high-precision printed circuit board temperature distribution.

[0005] To solve the above problems, the present application provides a printed circuit board thermal simulation processing method, device, equipment and storage medium.

[0006] In a first aspect, the present application provides a printed circuit board thermal simulation processing method for thermal simulation processing of a printed circuit board in an electronic device, comprising:

[0007] Building an electronic device geometric model, and performing mesh division on the electronic device geometric model to obtain a plurality of tetrahedral units, setting material parameters of the electronic device mesh model to obtain an electronic device mesh model;

[0008] rasterize the pre-established geometric model of the printed circuit board to generate a rasterized model of the printed circuit board, to obtain a plurality of raster subunits, and calculate equivalent material parameters of each raster subunit according to actual circuit data of the printed circuit board;

[0009] screen a plurality of first tetrahedron units in the electronic device grid model, wherein the plurality of first tetrahedron units are tetrahedron units used to compose a printed circuit board in the electronic device grid model;

[0010] map the first tetrahedron units to corresponding positions in the rasterized model, and obtain equivalent material parameters of each first tetrahedron unit based on the equivalent material parameters of each raster subunit;

[0011] update material parameters of a printed circuit board region in the electronic device grid model based on the equivalent material parameters of the first tetrahedron units;

[0012] perform thermal simulation processing on the updated electronic device grid model to obtain an electronic device thermal simulation result, and draw a temperature distribution diagram of the printed circuit board according to the electronic device thermal simulation result.

[0013] Optionally, the material parameters include thermal conductivity, specific heat capacity, and density, and the equivalent material parameters include equivalent thermal conductivity, equivalent specific heat capacity, and equivalent density.

[0014] Optionally, the calculation of the equivalent material parameters of each raster subunit according to the actual circuit data of the printed circuit board includes:

[0015] obtain actual circuit data of the printed circuit board, wherein the actual circuit data of the printed circuit board includes distribution data of metal materials and non-metal materials in the printed circuit board, and determine metal content of each raster subunit according to the actual circuit data of the printed circuit board;

[0016] determine equivalent density of each raster subunit according to density of the metal materials, density of the non-metal materials, and the metal content of each raster subunit;

[0017] determine equivalent specific heat capacity of each raster subunit according to specific heat capacity of the metal materials, specific heat capacity of the non-metal materials, and the metal content of each raster subunit;

[0018] determine equivalent thermal conductivity of each raster subunit according to thermal conductivity of the metal materials, thermal conductivity of the non-metal materials, and the metal content of each raster subunit.

[0019] Optionally, the method further comprises: screening a plurality of first tetrahedron units in the electronic device grid model, wherein the plurality of first tetrahedron units are tetrahedron units used for composing a printed circuit board in the electronic device grid model.

[0020] determining a geometric boundary of a printed circuit board region in the electronic device grid model according to the design information of the electronic device;

[0021] traversing the tetrahedron units in the electronic device grid model, and determining whether a geometric center of the tetrahedron unit is located within the geometric boundary of the printed circuit board region;

[0022] marking the tetrahedron unit whose geometric center is located within the geometric boundary of the printed circuit board region as the first tetrahedron unit.

[0023] Optionally, the method further comprises: mapping the first tetrahedron unit to a corresponding position in the gridded model, and obtaining equivalent material parameters of each first tetrahedron unit based on equivalent material parameters of each grid sub-unit.

[0024] discretizing the first tetrahedron unit to obtain a plurality of first tetrahedron sub-units;

[0025] mapping the first tetrahedron sub-unit to a corresponding position in the gridded model, and determining an equivalent mapping pair, the equivalent mapping pair being used to represent a corresponding relationship between the first tetrahedron sub-unit and the grid sub-unit;

[0026] obtaining equivalent material parameters of each first tetrahedron sub-unit based on equivalent material parameters of each grid sub-unit according to the equivalent mapping pair;

[0027] obtaining equivalent material parameters of the first tetrahedron unit based on equivalent material parameters of the plurality of first tetrahedron sub-units.

[0028] Optionally, the method further comprises: determining equivalent material parameters of each first tetrahedron sub-unit according to the equivalent mapping pair.

[0029] finding the corresponding grid sub-unit according to a position of a first tetrahedron sub-unit center point, and taking equivalent material parameters of the corresponding grid sub-unit as the equivalent material parameters of the first tetrahedron sub-unit.

[0030] Optionally, a calculation formula for obtaining the equivalent material parameters of the first tetrahedron unit based on the equivalent material parameters of the plurality of first tetrahedron sub-units is:

[0031] wherein, p represents the density of the first tetrahedron unit, k represents the thermal conductivity of the first tetrahedron unit, c represents the specific heat capacity of the first tetrahedron sub-unit, V sum represents the volume of the first tetrahedron unit, p i represents the density of the i-th tetrahedron sub-unit, k i represents the thermal conductivity of the i-th tetrahedron sub-unit, c i represents the specific heat capacity of the thermal conductivity of the i-th tetrahedron sub-unit, V i represents the volume of the i-th first tetrahedron sub-unit, and n represents the number of the tetrahedron sub-units contained in the tetrahedron unit.

[0032] In a second aspect, the present application provides a printed circuit board thermal simulation processing device for the printed circuit board thermal simulation processing method, comprising:

[0033] A grid model building module is configured to build an electronic device geometric model, perform grid division on the electronic device geometric model, obtain a plurality of tetrahedron units, set material parameters of the electronic device grid model, and obtain an electronic device grid model.

[0034] A gridding model building module is configured to perform gridding processing on a pre-established geometric model of the printed circuit board, generate a gridding model of the printed circuit board, obtain a plurality of grid sub-units, and calculate equivalent material parameters of each grid sub-unit according to actual circuit data of the printed circuit board.

[0035] A screening module is configured to screen a plurality of first tetrahedron units in the electronic device grid model, wherein the plurality of first tetrahedron units are tetrahedron units used to compose a printed circuit board in the electronic device grid model.

[0036] A mapping module is configured to map the first tetrahedron units to corresponding positions in the gridding model, and obtain equivalent material parameters of each first tetrahedron unit based on the equivalent material parameters of each grid sub-unit.

[0037] An updating module is configured to update material parameters of a printed circuit board region in the electronic device grid model based on the equivalent material parameters of the first tetrahedron units.

[0038] A thermal simulation module is configured to perform thermal simulation processing on the updated electronic device grid model, obtain an electronic device thermal simulation result, and draw a temperature distribution diagram of the printed circuit board according to the electronic device thermal simulation result.

[0039] In a third aspect, the present application provides an electronic device comprising a memory and a processor.

[0040] The memory is configured to store the computer program.

[0041] The processor is configured to implement the printed circuit board thermal simulation processing method according to the first aspect when executing the computer program.

[0042] In a fourth aspect, the present application provides a computer readable storage medium, wherein the storage medium stores a computer program, and when the computer program is executed by a processor, the printed circuit board thermal simulation processing method according to the first aspect is implemented.

[0043] Compared with the prior art, the present application has the following beneficial effects: first, by building an electronic device geometric model and performing grid division, setting material parameters, a foundation is laid for subsequent thermal simulation processing; then, the pre-established geometric model of the printed circuit board is rasterized, and the equivalent material parameters of each grid subunit are calculated according to the actual circuit data, so that more accurate printed circuit board material properties are obtained; then, by screening the tetrahedral units in the electronic device grid model, the first tetrahedral units in the printed circuit board region can be accurately separated out, providing a basis for subsequent printed circuit board material property updating. Subsequently, by mapping the first tetrahedral units to the rasterized model and applying the material properties of different regions of the printed circuit board to these tetrahedral units, the material properties of the printed circuit board in the electronic device grid model are updated using equivalent material parameters, ensuring that the material in the printed circuit board region can reflect the true thermal characteristics, thereby improving the accuracy of thermal simulation. Finally, by performing thermal simulation processing on the updated electronic device grid model, an accurate printed circuit board temperature distribution map is obtained. The present application updates the material parameters of the printed circuit board in the electronic device grid model using the equivalent material parameters obtained from the actual circuit data of the printed circuit board, to avoid local thermal performance errors caused by circuit simplification of the printed circuit board in the electronic device grid model, and can improve the accuracy of thermal simulation of the printed circuit board, and thus obtain a high-precision printed circuit board temperature distribution. BRIEF DESCRIPTION OF DRAWINGS

[0044] Fig. 1 is a flowchart of a printed circuit board thermal simulation processing method according to an embodiment of the present application;

[0045] Fig. 2 is a flowchart of step S13 of a printed circuit board thermal simulation processing method according to an embodiment of the present application;

[0046] Fig. 3 is a structural diagram of a printed circuit board thermal simulation processing device according to an embodiment of the present application;

[0047] Fig. 4 is a structural diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0048] In order to make the above objectives, characteristics and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. Although some embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms, and should not be interpreted as being limited to the embodiments set forth herein, but rather, these embodiments are provided so as to more completely and thoroughly understand the present application. It should be understood that the drawings and embodiments of the present application are merely for illustrative purposes, and are not intended to limit the scope of protection of the present application.

[0049] It should be understood that each of the steps described in the method embodiments of the present application can be performed in different orders, and / or in parallel. In addition, the method embodiments can include additional steps and / or omit the steps shown. The scope of the present application is not limited in this respect.

[0050] The term "comprising" and variations thereof as used herein are open-ended, that is "including but not limited to"; the term "based on" is "based, at least in part, on"; the term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments"; the term "optional" means "optional in at least some embodiments". Related definitions are given throughout the description. It should be noted that the concepts mentioned in the present application are merely for distinguishing different devices, modules or units, and are not intended to limit the functions of these devices, modules or units.

[0051] It should be noted that the modification of "one" or "more" mentioned in the present application is illustrative rather than limiting, and those skilled in the art should understand that, unless otherwise explicitly stated in the context, it should be understood as "one or more".

[0052] The names of the messages or information exchanged between the devices in the embodiments of the present application are merely for illustrative purposes, and are not intended to limit the scope of the messages or information.

[0053] Referring to FIG. 1, the present application provides a printed circuit board thermal simulation processing method for performing thermal simulation processing on a printed circuit board in an electronic device, comprising:

[0054] S11, a geometric model of an electronic device is built, and the electronic device geometric model is meshed to obtain a plurality of tetrahedral units, material parameters of the electronic device mesh model are set, and an electronic device mesh model is obtained.

[0055] First, build a geometric model of the electronic device using modeling software or simulation tools. The electronic device mesh model covers the entire geometric structure of the electronic device, including printed circuit boards, housings, batteries, chips, and other parts. The electronic device can be a mobile terminal, such as a mobile phone. After building the geometric model of the electronic device, meshing is performed to discretize the electronic device mesh model into multiple tetrahedral elements, each representing a part of the electronic device. The purpose of meshing is to facilitate subsequent simulation calculations. After completing meshing, further set material parameters (such as density, thermal conductivity, and specific heat capacity) and boundary conditions (such as external environment temperature, heat source location, etc.) for each element. Material parameters reflect the physical properties of each part of the electronic device.

[0056] S12, grid processing is performed on the pre-established geometric model of the printed circuit board to generate a grid model of the printed circuit board, obtaining a plurality of grid subunits, and calculating equivalent material parameters of each grid subunit according to actual circuit data of the printed circuit board.

[0057] To improve simulation accuracy, the printed circuit board area needs to be grid processed based on the original data of the printed circuit board area. The purpose of grid processing is to divide the printed circuit board area into multiple grid subunits, each representing a small area on the printed circuit board. After grid processing, according to the actual circuit design data of the printed circuit board (such as circuit layout, metal distribution and non-metal distribution), the equivalent material parameters of each grid subunit are calculated. These material parameters include density, thermal conductivity and specific heat capacity, which are calculated by analyzing the proportion of metal and non-metal materials in each grid subunit, and can accurately reflect the thermal performance of different areas of the printed circuit board.

[0058] S13, a plurality of first tetrahedral elements in the electronic device mesh model are screened out, wherein the plurality of first tetrahedral elements are tetrahedral elements used to compose the printed circuit board in the electronic device mesh model.

[0059] Specifically, all tetrahedral elements in the mesh model are traversed, and elements belonging to the printed circuit board area are screened out. The screened tetrahedral elements are the plurality of "first tetrahedral elements" used for subsequent material parameter updating and simulation processing.

[0060] S14, mapping the first tetrahedral elements to the corresponding positions in the grid model, and obtaining the equivalent material parameters of each first tetrahedral element based on the equivalent material parameters of each grid subunit.

[0061] After the first tetrahedral elements are screened out, the first tetrahedral elements are mapped to the corresponding positions in the gridded model. Specifically, the geometric center of each first tetrahedral element is calculated and matched with the grid sub-elements in the gridded model to determine the grid sub-element in which it is located. Based on the mapping relationship, the equivalent material parameters of each first tetrahedral element are calculated using the equivalent material parameters of the grid sub-elements.

[0062] S15, updating the material parameters of the printed circuit board region in the electronic device grid model based on the equivalent material parameters of the first tetrahedral elements.

[0063] It needs to be explained that all the material parameters of the first tetrahedral elements are replaced or updated one by one, and the material parameters (such as the uniform average value) of the printed circuit board region in the sub-device grid model are replaced by the equivalent material parameters obtained according to the actual printed circuit board region gridding processing. The material parameters reflect the heat conduction performance of different regions of the printed circuit board, so that the material properties of each tetrahedral element are closer to the actual thermal conductivity, density and specific heat capacity. Through the updating operation, the accuracy of the material parameters of the printed circuit board region can be improved, thereby providing more accurate input data for subsequent thermal simulation.

[0064] S16, performing thermal simulation processing on the updated electronic device grid model to obtain electronic device thermal simulation results, and drawing a temperature distribution map of the printed circuit board according to the electronic device thermal simulation results.

[0065] The embodiment simulates the heat conduction and heat dissipation of the printed circuit board region of the electronic device during the working process by using the thermal simulation software, and obtains the thermal simulation results of the electronic device. The simulation results include the temperature distribution map of the printed circuit board region, which can reflect the temperature difference of the printed circuit board in different regions, and further optimize the overall thermal design efficiency of the electronic device.

[0066] Compared with the prior art, the beneficial effects of the present application are: first, by building an electronic device geometric model and performing mesh division, setting material parameters, laying a foundation for subsequent thermal simulation processing; then, the pre-established geometric model of the printed circuit board is rasterized, and the equivalent material parameters of each raster subunit are calculated according to the actual circuit data, so that more accurate printed circuit board material properties are obtained; then, by screening the tetrahedral units in the electronic device grid model, the first tetrahedral units in the printed circuit board region can be accurately separated out, providing a basis for subsequent printed circuit board material property updating. Subsequently, by mapping the first tetrahedral units to the rasterized model and applying the material properties of different regions of the printed circuit board to these tetrahedral units, the printed circuit board material properties in the electronic device grid model are updated using equivalent material parameters, ensuring that the material in the printed circuit board region can reflect the true thermal characteristics, thereby improving the accuracy of thermal simulation. Finally, by performing thermal simulation processing on the updated electronic device grid model, an accurate printed circuit board temperature distribution map is obtained. The present application updates the material parameters of the printed circuit board in the electronic device grid model using the equivalent material parameters obtained from the actual circuit data of the printed circuit board, to avoid local thermal performance errors caused by circuit simplification of the printed circuit board in the electronic device grid model, and can improve the accuracy of thermal simulation of the printed circuit board, and thus obtain a high-precision printed circuit board temperature distribution.

[0067] In one embodiment, the material parameters include thermal conductivity, specific heat capacity, and density, and the equivalent material parameters include equivalent thermal conductivity, equivalent specific heat capacity, and equivalent density.

[0068] Specifically, thermal conductivity is the ability of a material to transfer heat, and is used to describe the thermal conductivity of a material. Different regions of a printed circuit board, such as metal layers and dielectric layers, have different thermal conductivities, and the thermal conductivity values of these regions need to be accurately set during simulation in order to more realistically simulate the process of heat conduction. Specific heat capacity represents the amount of heat required to raise the temperature of a unit mass of material by one degree, and is an important parameter that affects the temperature rise and heat dissipation performance of a material. For different materials in a printed circuit board, such as copper foil, dielectric layer, and solder joints, the corresponding specific heat capacities differ, so setting accurate specific heat capacity values for each part during simulation helps to accurately predict temperature changes and heat distribution. Density represents the ratio of the mass of a material to its volume; density is another important parameter that affects the ability of heat transfer and storage, and the density of different materials directly affects the performance of their specific heat capacities. Therefore, in printed circuit board thermal simulation, the corresponding density values need to be set for different regions to ensure accurate simulation results. This embodiment further limits the material parameters and equivalent material parameters, which can ensure accurate simulation of the thermal behavior of electronic devices and improve the efficiency of thermal management during the design process.

[0069] In an embodiment, the calculating the equivalent material parameters of each of the grid sub-units according to the actual circuit data of the printed circuit board comprises:

[0070] The actual circuit data of the printed circuit board is obtained, the actual circuit data of the printed circuit board comprising distribution data of metal materials and non-metal materials in the printed circuit board, and the metal content of each of the grid sub-units is determined according to the actual circuit data of the printed circuit board.

[0071] Specifically, the actual circuit data of the printed circuit board can be obtained from a printed circuit board design file or a printed circuit board layout diagram. The actual circuit data of the printed circuit board can include layout information of metal traces, pads, vias, etc. of a conductive layer, and distribution of non-metal materials such as insulating layers and dielectric materials. Through the actual circuit data of the printed circuit board, the proportion of metal and non-metal in each grid sub-unit on the printed circuit board can be accurately located, providing a basis for subsequent equivalent material parameter calculation.

[0072] The equivalent density of each of the grid sub-units is determined according to the density of the metal material, the density of the non-metal material, and the metal content of each of the grid sub-units.

[0073] The equivalent specific heat capacity of each of the grid sub-units is determined according to the specific heat capacity of the metal material, the specific heat capacity of the non-metal material, and the metal content of each of the grid sub-units.

[0074] The equivalent thermal conductivity of each of the grid sub-units is determined according to the thermal conductivity of the metal material, the thermal conductivity of the non-metal material, and the metal content of each of the grid sub-units.

[0075] Wherein, the equivalent density, the equivalent specific heat capacity and the equivalent thermal conductivity can be obtained by weighted summation of material parameters (density, specific heat capacity and thermal conductivity) based on the metal content data of each of the grid sub-units.

[0076] This embodiment describes in detail how to accurately calculate the equivalent material parameters of each grid sub-unit based on the actual circuit data of the printed circuit board, so as to ensure that the thermal performance in the simulation process can truly reflect the actual situation.

[0077] In an embodiment, the first plurality of tetrahedral units in the electronic device grid model are screened out, wherein the plurality of first tetrahedral units are tetrahedral units used to compose a printed circuit board in the electronic device grid model:

[0078] The geometric boundary of the printed circuit board region in the electronic device grid model is determined according to the design information of the electronic device.

[0079] The physical location and geometric boundary of the printed circuit board in the entire electronic device are determined by the design information (such as CAD drawings or three-dimensional model data) of the electronic device. The design information usually includes key parameters such as the size, shape, position and number of layers of the printed circuit board. The geometric boundary defines the spatial range of the printed circuit board in the entire electronic device model as a standard for screening tetrahedral units.

[0080] The geometric center of the tetrahedral unit is determined whether it is located within the geometric boundary of the printed circuit board region by traversing the tetrahedral unit in the electronic device grid model.

[0081] The electronic device grid model is composed of a plurality of tetrahedral units, each corresponding to a small part of the device. In order to screen the tetrahedral units belonging to the printed circuit board region, it is necessary to traverse all the tetrahedral units in the entire electronic device grid model and determine whether their geometric centers are located within the geometric boundary of the printed circuit board region.

[0082] The tetrahedral units whose geometric centers are located within the geometric boundary of the printed circuit board region are marked as the first tetrahedral units.

[0083] For the tetrahedral units whose geometric centers are located within the geometric boundary of the printed circuit board region, they are marked as "first tetrahedral units". These marked tetrahedral units constitute the printed circuit board region in the electronic device grid model and are used for subsequent material parameter updating and thermal simulation processing.

[0084] The embodiment ensures that the screening process is simple and efficient by analyzing the geometric center of the tetrahedral unit and the geometric boundary of the printed circuit board region, which helps to improve the accuracy of the thermal simulation results of the printed circuit board.

[0085] Referring to FIG. 2, in an embodiment, the mapping of the first tetrahedral units to the corresponding positions in the rasterized model and obtaining the equivalent material parameters of each first tetrahedral unit based on the equivalent material parameters of each raster subunit includes:

[0086] S131, discretize the first tetrahedral units to obtain a plurality of first tetrahedral subunits.

[0087] The goal of discretization in this embodiment is to subdivide each tetrahedral unit into a plurality of smaller tetrahedral subunits in order to more finely reflect the thermal performance distribution of different regions of the printed circuit board. Discretization processing can be achieved by a mesh refinement algorithm, for example, inserting new vertices in the tetrahedral unit, thereby dividing the original tetrahedron into a plurality of equal-volume or near-equal-volume subunits.

[0088] S132, mapping the first tetrahedron sub-unit to a corresponding position in the gridding model to determine an equivalent mapping pair, the equivalent mapping pair being used to represent the correspondence between the first tetrahedron sub-unit and the grid sub-unit.

[0089] After the discretization of the first tetrahedron unit is completed, each first tetrahedron sub-unit is mapped to a corresponding position in the gridding model. Specifically, the geometric center of each tetrahedron sub-unit is calculated, and the corresponding grid sub-unit is determined by comparing the geometric center coordinates of each tetrahedron sub-unit, thereby obtaining an equivalent mapping pair.

[0090] S133, determining the equivalent material parameters of each first tetrahedron sub-unit based on the equivalent material parameters of each grid sub-unit according to the equivalent mapping pair;

[0091] S134, obtaining the equivalent material parameters of the first tetrahedron unit based on the equivalent material parameters of a plurality of first tetrahedron sub-units.

[0092] The embodiment describes in detail the process of discretizing the tetrahedron unit and mapping it to the gridding model, thereby providing accurate data support for subsequent thermal simulation processing.

[0093] In one embodiment, the determination of the equivalent material parameters of each first tetrahedron sub-unit based on the equivalent mapping pair comprises:

[0094] According to the position of the center point of the first tetrahedron sub-unit, the corresponding grid sub-unit is found, and the equivalent material parameters of the corresponding grid sub-unit are taken as the equivalent material parameters of the first tetrahedron sub-unit.

[0095] The embodiment can ensure that the thermal performance of each sub-unit can reflect its actual physical characteristics, thereby providing an accurate data basis for subsequent thermal simulation.

[0096] In one embodiment, the calculation formula for obtaining the equivalent material parameters of the first tetrahedron unit based on the equivalent material parameters of a plurality of first tetrahedron sub-units is:

[0097] wherein p represents the density of the first tetrahedron unit, k represents the thermal conductivity of the first tetrahedron unit, c represents the specific heat capacity of the first tetrahedron sub-unit, V sum represents the volume of the first tetrahedron unit, p i represents the density of the i-th tetrahedron sub-unit, k i represents the thermal conductivity of the i-th tetrahedron sub-unit, c i represents the specific heat capacity of the i-th tetrahedron sub-unit, V iVi represents the volume of the ith first tetrahedron sub-unit, and n represents the number of the tetrahedron sub-units contained in the tetrahedron unit.

[0098] The embodiment can ensure the accuracy of the equivalent material parameter calculation of the first tetrahedron unit, truly reflect the thermal performance of the complex region in the electronic device, and thus improve the accuracy of the thermal simulation of the electronic device.

[0099] Referring to FIG. 3, the present application provides a printed circuit board thermal simulation processing device 30 for the printed circuit board thermal simulation processing method, comprising:

[0100] A grid model building module 31 is configured to build an electronic device geometric model, perform grid division on the electronic device geometric model, obtain a plurality of tetrahedron units, set material parameters of the electronic device grid model, and obtain an electronic device grid model.

[0101] A gridding model building module 32 is configured to perform gridding processing on a previously established geometric model of the printed circuit board, generate a gridding model of the printed circuit board, obtain a plurality of grid sub-units, and calculate equivalent material parameters of each grid sub-unit according to actual circuit data of the printed circuit board.

[0102] A screening module 33 is configured to screen a plurality of first tetrahedron units in the electronic device grid model, wherein the plurality of first tetrahedron units are tetrahedron units used to compose a printed circuit board in the electronic device grid model.

[0103] A mapping module 34 is configured to map the first tetrahedron units to corresponding positions in the gridding model, and obtain equivalent material parameters of each first tetrahedron unit based on the equivalent material parameters of each grid sub-unit.

[0104] An updating module 35 is configured to update material parameters of a printed circuit board region in the electronic device grid model based on the equivalent material parameters of the first tetrahedron units.

[0105] A thermal simulation module 36 is configured to perform thermal simulation processing on the updated electronic device grid model, obtain an electronic device thermal simulation result, and draw a temperature distribution diagram of the printed circuit board according to the electronic device thermal simulation result.

[0106] Compared with the prior art, the beneficial effects of the present application are: first, the grid model building module 31 builds an electronic device geometric model and performs grid division, sets material parameters, and lays a foundation for subsequent thermal simulation processing; then, the gridding model building module 32 performs gridding processing on the pre-established geometric model of the printed circuit board, and calculates the equivalent material parameters of each grid cell according to the actual circuit data, thereby obtaining more accurate printed circuit board material properties; then, the screening module 33 can accurately separate the first tetrahedral unit in the printed circuit board region by screening the tetrahedral unit in the electronic device grid model, providing a basis for subsequent printed circuit board material property updating. Subsequently, the mapping module 34 maps the first tetrahedral unit to the gridding model, and applies the material properties of different regions of the printed circuit board to these tetrahedral units, and the updating module 35 updates the material properties of the printed circuit board in the electronic device grid model using the equivalent material parameters, ensuring that the material of the printed circuit board region can reflect the true thermal characteristics, thereby improving the accuracy of thermal simulation. Finally, the thermal simulation module 36 performs thermal simulation processing on the updated electronic device grid model to obtain an accurate printed circuit board temperature distribution map. The present application updates the material parameters of the printed circuit board in the electronic device grid model using the equivalent material parameters obtained from the actual circuit data of the printed circuit board, to avoid local thermal performance errors caused by circuit simplification of the printed circuit board in the electronic device grid model, and can improve the thermal simulation accuracy of the printed circuit board, and further obtain a high-precision printed circuit board temperature distribution.

[0107] Referring to FIG. 4, the present application provides an electronic device 40 comprising a memory 41 and a processor 42;

[0108] The memory 41 is used to store a computer program;

[0109] The processor 42 is used to implement the above-mentioned printed circuit board thermal simulation processing method when executing the computer program.

[0110] Alternatively, an electronic device 40 comprises a memory 41 and a processor 42 coupled to the memory 41; the memory 41 is configured to store a computer program; the processor 42 is configured to perform the following operations when executing the computer program:

[0111] Building an electronic device geometric model, and performing grid division on the electronic device geometric model to obtain a plurality of tetrahedral units, setting material parameters of the electronic device grid model to obtain an electronic device grid model;

[0112] The geometric model of the printed circuit board is rasterized to generate a rasterized model of the printed circuit board, a plurality of raster subunits are obtained, and equivalent material parameters of each raster subunit are calculated according to actual circuit data of the printed circuit board;

[0113] A plurality of first tetrahedron units in the electronic device grid model are screened out, wherein the plurality of first tetrahedron units are tetrahedron units used to compose a printed circuit board in the electronic device grid model;

[0114] The first tetrahedron units are mapped to corresponding positions in the rasterized model, and equivalent material parameters of each first tetrahedron unit are obtained based on the equivalent material parameters of each raster subunit;

[0115] Material parameters of a printed circuit board region in the electronic device grid model are updated based on the equivalent material parameters of the first tetrahedron units;

[0116] The updated electronic device grid model is subjected to thermal simulation processing to obtain an electronic device thermal simulation result, and a temperature distribution diagram of the printed circuit board is drawn according to the electronic device thermal simulation result.

[0117] The application provides a computer readable storage medium, and the storage medium stores a computer program.

[0118] Alternatively, a non-volatile computer readable storage medium stores a computer program.

[0119] Alternatively, an electronic device 40 includes a memory 41 and a processor 42 coupled to the memory 41.

[0120] The geometric model of the electronic device is built, the electronic device geometric model is subjected to grid division to obtain a plurality of tetrahedron units, material parameters of the electronic device grid model are set, and an electronic device grid model is obtained.

[0121] The geometric model of the printed circuit board is rasterized to generate a rasterized model of the printed circuit board, a plurality of raster subunits are obtained, and equivalent material parameters of each raster subunit are calculated according to actual circuit data of the printed circuit board;

[0122] Screening a plurality of first tetrahedron units in the electronic device grid model, wherein the plurality of first tetrahedron units are tetrahedron units for composing a printed circuit board in the electronic device grid model;

[0123] Mapping the first tetrahedron units to corresponding positions in the rasterized model, and obtaining equivalent material parameters of each of the first tetrahedron units based on equivalent material parameters of each of the raster sub-units;

[0124] Updating material parameters of a printed circuit board region in the electronic device grid model based on the equivalent material parameters of the first tetrahedron units;

[0125] Performing thermal simulation processing on the updated electronic device grid model to obtain an electronic device thermal simulation result, and drawing a temperature distribution map of the printed circuit board according to the electronic device thermal simulation result. An electronic device 40, which can be a server or a client of the present application, will now be described, which is an example of a hardware device that can be applied to various aspects of the present application. The electronic device 40 is intended to represent various forms of digital electronic computing devices such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframes, and other suitable computers. The electronic device 40 can also represent various forms of mobile devices such as personal digital assistants, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions, are meant to be examples only, and are not intended to limit implementations of the present application described and / or claimed in this document.

[0126] The electronic device 40 includes a computing unit that can perform various appropriate actions and processes in accordance with a computer program stored in a read-only memory (ROM) or a computer program loaded from a storage unit into a random access memory (RAM). In the RAM, various programs and data required for device operation can also be stored. The computing unit, the ROM, and the RAM are connected to each other through a bus. An input / output (I / O) interface is also connected to the bus.

[0127] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by a computer program instructing relevant hardware, and the program can be stored in a computer readable storage medium. When the program is executed, the program can include the processes of the above-mentioned embodiment methods. The storage medium can be a magnetic disc, an optical disc, a read-only memory (ROM), a random access memory (RAM), or the like. In this application, the units described as separate components can or can not be physically separated, and the components shown as units can or can not be physical units, that is, they can be located in one place, or they can be distributed on multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment of the present application. In addition, the functional units in each embodiment of the present application can be integrated in one processing unit, or each unit can exist physically independently, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0128] Although the present application is disclosed as above, the protection scope of the present application is not limited to this. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, and these changes and modifications will fall within the protection scope of the present application.

Claims

1. A printed circuit board thermal simulation processing method for performing thermal simulation processing on a printed circuit board in an electronic device, characterized by, The method comprises the following steps: build an electronic device geometric model, and divide the electronic device geometric model into a plurality of tetrahedral units to obtain an electronic device grid model, and set material parameters of the electronic device grid model; perform rasterization processing on a pre-established geometric model of the printed circuit board to generate a rasterization model of the printed circuit board, obtain a plurality of grid sub-units, and calculate equivalent material parameters of each grid sub-unit according to actual circuit data of the printed circuit board; screen a plurality of first tetrahedral units in the electronic device grid model, wherein the plurality of first tetrahedral units are tetrahedral units used to compose a printed circuit board in the electronic device grid model; map the first tetrahedral units to corresponding positions in the rasterization model, and obtain equivalent material parameters of each first tetrahedral unit based on the equivalent material parameters of each grid sub-unit; update material parameters of the printed circuit board in the electronic device grid model based on the equivalent material parameters of the first tetrahedral units; perform thermal simulation processing on the updated electronic device grid model to obtain an electronic device thermal simulation result, and draw a temperature distribution diagram of the printed circuit board according to the electronic device thermal simulation result.

2. The printed circuit board thermal simulation processing method according to claim 1, characterized by, The material parameters include thermal conductivity, specific heat capacity and density, and the equivalent material parameters include equivalent thermal conductivity, equivalent specific heat capacity and equivalent density.

3. The printed circuit board thermal simulation processing method according to claim 2, characterized by, The calculation of the equivalent material parameters of each grid sub-unit according to the actual circuit data of the printed circuit board comprises: obtain the actual circuit data of the printed circuit board, which includes distribution data of metal materials and non-metal materials in the printed circuit board, and determine the metal content of each grid sub-unit according to the actual circuit data of the printed circuit board; determine the equivalent density of each grid sub-unit according to the metal material density, the non-metal material density and the metal content of each grid sub-unit; determine the equivalent specific heat capacity of each grid sub-unit according to the metal material specific heat capacity, the non-metal material specific heat capacity and the metal content of each grid sub-unit; determine the equivalent thermal conductivity of each grid sub-unit according to the metal material thermal conductivity, the non-metal material thermal conductivity and the metal content of each grid sub-unit.

4. The printed circuit board thermal simulation processing method according to claim 1, characterized by, The screening of the plurality of first tetrahedral units in the electronic device grid model comprises: determine the geometric boundary of the printed circuit board in the electronic device grid model according to the design information of the electronic device; traverse the tetrahedral units in the electronic device grid model, and judge whether the geometric center of the tetrahedral unit is located within the geometric boundary of the printed circuit board; mark the tetrahedral unit whose geometric center is located within the geometric boundary of the printed circuit board as the first tetrahedral unit.

5. The printed circuit board thermal simulation processing method of claim 1, wherein, The mapping of the first tetrahedral units to the corresponding positions in the rasterization model and the obtaining of the equivalent material parameters of each first tetrahedral unit based on the equivalent material parameters of each grid sub-unit comprise: perform discretization processing on the first tetrahedral units to obtain a plurality of first tetrahedral sub-units; mapping the first tetrahedron sub-unit to a corresponding position in the gridding model to determine an equivalent mapping pair, the equivalent mapping pair being used to represent a correspondence between the first tetrahedron sub-unit and the grid sub-unit; determining, based on the equivalent material parameters of each of the grid sub-units, an equivalent material parameter of each of the first tetrahedron sub-units according to the equivalent mapping pair; obtaining, based on the equivalent material parameters of a plurality of the first tetrahedron sub-units, an equivalent material parameter of the first tetrahedron unit.

6. The printed circuit board thermal simulation processing method according to claim 5, characterized by, The method further includes: finding a corresponding grid sub-unit according to a position of a center point of the first tetrahedron sub-unit, and taking the equivalent material parameter of the corresponding grid sub-unit as the equivalent material parameter of the first tetrahedron sub-unit.

7. The printed circuit board thermal simulation processing method according to claim 5, characterized by, The calculation formula of the equivalent material parameters of the first tetrahedral unit based on the equivalent material parameters of the plurality of first tetrahedral sub-units is: wherein p represents a density of the first tetrahedral unit, k represents a thermal conductivity of the first tetrahedral unit, c represents a specific heat capacity of the first tetrahedral subunit, V sum represents a volume of the first tetrahedral unit, p i represents a density of the i-th tetrahedral subunit, k i represents a thermal conductivity of the i-th tetrahedral subunit, c i represents a specific heat capacity of the i-th tetrahedral subunit, k i represents a volume of the i-th first tetrahedral subunit, n represents a number of the tetrahedral subunits contained in the tetrahedral unit.

8. A printed circuit board thermal simulation processing apparatus for executing the printed circuit board thermal simulation processing method according to any one of claims 1 to 7, characterized by The method further includes: a grid model building module, configured to build an electronic device geometric model, divide the electronic device geometric model into a plurality of tetrahedron units, and obtain an electronic device grid model, and set material parameters of the electronic device grid model; a gridding model building module, configured to perform gridding processing on a pre-established geometric model of the printed circuit board to obtain a plurality of grid sub-units, and calculate an equivalent material parameter of each of the grid sub-units according to actual circuit data of the printed circuit board; a screening module, configured to screen a plurality of first tetrahedron units in the electronic device grid model, wherein the plurality of first tetrahedron units are tetrahedron units used to compose a printed circuit board in the electronic device grid model; a mapping module, configured to map the first tetrahedron units to corresponding positions in the gridding model, and obtain an equivalent material parameter of each of the first tetrahedron units based on the equivalent material parameter of each of the grid sub-units; an updating module, configured to update material parameters of a printed circuit board region in the electronic device grid model based on the equivalent material parameters of the first tetrahedron units; a thermal simulation module, configured to perform thermal simulation processing on the updated electronic device grid model to obtain an electronic device thermal simulation result, and draw a temperature distribution diagram of the printed circuit board according to the electronic device thermal simulation result.

9. An electronic device, comprising: The device includes a memory and a processor. The memory is configured to store a computer program. The processor is configured to implement the printed circuit board thermal simulation processing method according to any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that, The storage medium has the computer program stored thereon, and the computer program, when executed by a processor, implements the printed circuit board thermal simulation processing method according to any one of claims 1 to 7.

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