Mounting apparatus and method for controlling mounting apparatus

Abstract

A mounting apparatus according to the present disclosure comprises: a stage that supports a substrate; a mounting head that has a nozzle capable of holding a component; a first movement device that moves the mounting head relative to the stage in the lifting / lowering direction; a second movement device that moves the mounting head relative to the stage in a direction intersecting the lifting / lowering direction; an imaging device that captures a component image of the component and a substrate image of the substrate; and a control unit that controls the second movement device. The mounting head has a first feature part and a second feature part that is provided below the first feature part. The first movement device moves the mounting head relative to the stage between a first height at which the imaging device captures a first image of the first feature part and a second height at which the imaging device captures a second image of the second feature part. The control unit controls the second movement device on the basis of the first image, the second image, the component image, and the substrate image.

Description

Mounting Device and Control Method of Mounting Device

[0001] The present disclosure relates to a mounting device and a control method of a mounting device.

[0002] For example, Patent Document 1 discloses a mounting device including a stage that holds a substrate, a mounting head that holds a component, and a recognition unit that recognizes the component and the substrate.

[0003] In the mounting device of Patent Document 1, with the mounting head disposed above the stage, the recognition unit enters between the mounting head and the stage and captures images of the component and the substrate. Alignment between the component and the substrate is performed according to the captured images.

[0004] Japanese Patent No. 6256486 [[ID=I3]]

[0005] However, when the mounting head is deformed, there is a possibility of deviation between the component at the imaging height and the component at the mounting height. Therefore, there is still room for improvement in terms of improving the mounting accuracy of the mounting device.

[0006] An object of the present disclosure is to provide a mounting device with improved mounting accuracy to solve the above problems.

[0007] The mounting device according to the present disclosure includes a stage that supports a substrate, a mounting head having a nozzle capable of holding a component, a first moving device that relatively moves the mounting head in the vertical direction with respect to the stage, a second moving device that relatively moves the mounting head in a direction intersecting the vertical direction with respect to the stage, an imaging device that captures a component image of the component and a substrate image of the substrate, and a control unit that controls the second moving device. The mounting head has a first feature portion and a second feature portion provided below the first feature portion. The first moving device relatively moves the mounting head with respect to the stage between a first height at which the imaging device captures a first image of the first feature portion and a second height at which the imaging device captures a second image of the second feature portion. The control unit controls the second moving device based on the first image, the second image, the component image, and the substrate image.

[0008] A control method for a mounting apparatus according to this disclosure includes: moving a mounting head having a nozzle capable of holding a component to a first height relative to a stage supporting a substrate; causing an imaging device to image a first feature portion of the mounting head; moving the mounting head relative to the stage in the vertical direction between a first height at which the imaging device images a first image of the first feature portion and a second height at which the imaging device images a second image of a second feature portion; causing the imaging device to image a second feature portion located below the first feature portion; causing the imaging device to image a component image and a substrate image; and moving the mounting head relative to the stage in a direction intersecting the vertical direction based on the first image, the second image, the component image, and the substrate image.

[0009] According to this disclosure, it is possible to provide a mounting device with improved mounting accuracy.

[0010] Schematic diagram of the mounting device according to Embodiment 1 of the present disclosure Schematic diagram of a part of the mounting device Schematic diagram of a part of the mounting device Schematic diagram of a feature member Schematic diagram of the optical system of the imaging device Flowchart showing an example of mounting operation by the mounting device Schematic diagram of a part of the mounting device in the mounting operation by superimposing the first and second images Schematic diagram of a component image Schematic diagram of a component image and a substrate image superimposed Flowchart showing a modified example of mounting operation by the mounting device

[0011] The embodiments of this disclosure will be described below with reference to the drawings.

[0012] [Embodiment 1] (Overall Configuration) Figure 1 is a schematic diagram of a mounting device 1 according to Embodiment 1 of the present disclosure. Figure 2 is a schematic diagram of a part of the mounting device 1 (mounting head 5, imaging device 6, and stage 8). In the figures, the Z direction is the vertical direction, and the X and Y directions intersect each other and the Z direction. In Embodiment 1, the Z direction is the vertical direction, the XY plane is a horizontal plane perpendicular to the Z direction, and the X and Y directions are perpendicular to each other, but are not limited to this.

[0013] As shown in Figure 1, the mounting apparatus 1 is an apparatus for mounting components 11 onto a substrate 12. The components 11 are thin, plate-shaped members, such as dies or IC chips. The substrate 12 is a plate-shaped member, which may be circular or rectangular in shape. The components 11 are formed from, for example, silicon, silicon carbide (SiC), etc. The substrate 12 is formed from, for example, silicon, glass, or resin, etc.

[0014] As shown in Figure 2, the surface of component 11 is provided with a wiring pattern (not shown) and recognition marks 71A and 71B for alignment. The surface of substrate 12 is provided with a wiring pattern (not shown) and recognition marks 72A and 72B for alignment. The recognition marks 71A, 71B, 72A, and 72B may be planar or uneven, and may be on the edges or corners of component 11 or substrate 12.

[0015] The two recognition marks 71A and 71B on component 11 are located diagonally opposite each other, and the two recognition marks 72A and 72B on the circuit board 12 are located at positions corresponding to the recognition marks 71A and 71B on the mounting position of component 11 on the circuit board 12.

[0016] As shown in Figures 1 and 2, the mounting device 1 comprises a component supply unit 2, a pickup head 3, a reversing unit 4, a mounting head 5, a Y-direction moving member 55, a Y-direction drive device 56, and a Y-axis beam 57 (Figure 2). The mounting device 1 further comprises moving devices 58 and 59, an imaging device 6, a third moving device 69 (Figure 2), a stage 8, and a control unit C.

[0017] The component supply unit 2 is configured to supply components 11 to the mounting head 5 via the pickup head 3. The component supply unit 2, for example, supports a wafer and supplies components 11 from the wafer.

[0018] The pickup head 3 is configured to hold the component 11 supplied from the component supply unit 2 and hand it over to the mounting head 5. Specifically, the pickup head 3 holds one side of the component 11 and hands it over to the mounting head 5 so that the mounting head 5 holds the other side.

[0019] The reversal unit 4 is configured to reverse the front and back sides of the component 11. The reversal unit 4 changes the pickup head 3, which is holding one side of the component 11, from a downward position to an upward position (indicated by the dotted line). As a result, the component 11 is also changed from a downward position to an upward position and is held by the mounting head 5 in the upward position.

[0020] The mounting head 5 is configured to hold the component 11 received from the pickup head 3 and mount it onto the circuit board 12. The mounting head 5 attracts and holds the component 11.

[0021] As shown in Figure 2, the mounting head 5 is movable relative to the pickup head 3 and the stage 8 by a Y-direction moving member 55, a Y-direction drive device 56, a Y-axis beam 57, and moving devices 58 and 59. The Y-direction moving member 55 is the member on which the mounting head 5 is mounted. The Y-direction drive device 56 is a device that moves the mounting head 5 in the Y direction together with the Y-direction moving member 55, and is, for example, a linear motor. In Embodiment 1, the Y-direction drive device 56 moves the mounting head 5 between the inversion unit 4 and the above the stage 8. The Y-axis beam 57 is a beam fixed to the base of the mounting device 1 and extending in the Y direction, and supports the Y-direction drive device 56 so that it can move. In Embodiment 1, the first moving device 58 moves the mounting head 5 up and down in the vertical direction F1 (Z direction) relative to the stage 8 and rotates it around the Z axis. The second moving device 59 moves the stage 8 in the X direction and Y direction relative to the mounting head 5. This operation allows for alignment between the component 11 and the circuit board 12. The moving devices 58 and 59 are, for example, motors.

[0022] A feature member 9 is attached to the mounting head 5. The feature member 9 has feature portions 91 and 92 provided at different heights (positions in the Z direction). The feature portions 91 and 92 may be planar shapes or irregularities on the surface of the feature member 9, or they may be edges or corners of the feature member 9. If they are planar shapes, the feature portions 91 and 92 may be realized by machining or by bonding, for example, a metal film such as Cr patterned onto glass.

[0023] The feature portions 91 and 92 are captured from below by the imaging device 6. Specifically, the imaging device 6 captures a first image E1 including the first feature portion 91 and a second image E2 including the second feature portion 92.

[0024] The imaging device 6 is configured to capture images for the purpose of aligning the component 11 and the substrate 12. In addition to images E1 and E2, the imaging device 6 captures component images including the recognition marks 71A and 71B of the component 11, and substrate images including the recognition marks 72A and 72B of the substrate 12.

[0025] The imaging device 6 is movable relative to the stage 8 at least in the front-to-back direction F2 (X direction) by a third moving device 69. In Embodiment 1, the imaging device 6 is movable in the X and Y directions. The third moving device 69 is, for example, a motor.

[0026] Stage 8 is configured to support the substrate 12. Stage 8 may have a heater for heating the substrate 12 and the components 11 that are close to the substrate 12. Providing a heater may facilitate the bonding of the components 11 and the substrate 12.

[0027] Returning to Figure 1, the control unit C is configured to control the mounting device 1. Specifically, the control unit C controls the Y-direction drive device 56, the moving devices 58, 59, 69, and the imaging device 6. The control unit C includes, for example, a general-purpose processor such as a CPU, MPU, FPGA, DSP, or ASIC that realizes predetermined functions by executing a program. The control unit C realizes its functions by executing a program stored in memory (not shown). The control unit C is not limited to realizing predetermined functions through the cooperation of hardware and software, but may also be a hardware circuit specifically designed to realize predetermined functions.

[0028] The control unit C includes an arithmetic unit C1 and a storage unit C2. The arithmetic unit C1 determines the relative position of the component 11 with respect to the substrate 12 based on the image captured by the imaging device 6. The storage unit C2 stores information such as the image captured by the imaging device 6. The storage unit C2 may be, for example, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, DVD or other optical disc storage, magnetic cassette, magnetic tape, magnetic disk storage or other magnetic storage device.

[0029] The structures of the mounting head 5, imaging device 6, and moving devices 58 and 69 will be described in more detail with reference to Figures 2 to 4. Figures 3 and 4 are schematic diagrams of a part of the mounting device 1, showing a different orientation from Figure 2.

[0030] As shown in Figure 2, the mounting head 5 has a suction nozzle 51 and a holding part 52. The suction nozzle 51 attracts and holds the part 11, and the holding part 52 attracts and holds the suction nozzle 51. A flow path connected to a vacuum pump (not shown) is formed inside the holding part 52, and the suction nozzle 51 is attracted to the lower surface of the holding part 52 through the flow path. The suction nozzle 51 has a through hole that communicates with the flow path inside the holding part 52, and the part 11 is attracted to the lower surface of the suction nozzle 51 through the through hole. The suction nozzle 51 is made of, for example, glass (synthetic quartz). The holding part 52 is made of, for example, metal. The holding part 52 may mechanically hold the suction nozzle 51.

[0031] The characteristic member 9 is fixed to the holding portion 52. The characteristic member 9 has a first member 93 provided with a first characteristic portion 91 and a second member 94 provided with a second characteristic portion 92.

[0032] The first member 93 is a member that extends in the X direction from the holding portion 52 and is fixed to the holding portion 52. The second member 94 is a member that extends in the Z direction from the end of the first member 93 fixed to the holding portion 52. In other words, the feature member 9 has an L-shape formed by members 93 and 94 extending in orthogonal directions.

[0033] The first member 93 has a first characteristic portion 91 on its downward-facing surface at its +X side end, i.e., tip 93B, away from the holding portion 52. The second member 94 has a second characteristic portion 92 on its downward-facing surface at its -Z side end, i.e., tip 94B, away from the first member 93.

[0034] Since the first member 93 extends in the X direction and the second member 94 extends in the Z direction, the feature portions 91 and 92 are spaced apart in the X and Z directions. Specifically, the second feature portion 92 is located on the -Z and -X side of the first feature portion 91. In other words, the second feature portion 92 is located below the first feature portion 91 and closer to the part 11.

[0035] The second member 94 has dimensions such that the second feature portion 92 at its tip is positioned above the lower surface of the component 11. This configuration prevents interference between the tip of the second member 94 and the substrate 12 when the mounting head 5 descends to bring the component 11 into contact with the substrate 12. On the other hand, the second feature portion 92 has a height difference G1 of 2 mm or less from the lower surface (tip 51A) of the suction nozzle 51 (see Figure 5). This configuration allows the tip of the second member 94 to be positioned close to the lower surface of the component 11. The second feature portion 92 may be lower or higher than the lower surface of the suction nozzle 51. The second feature portion 92 may have a height difference of 2 mm or less from the lower surface of the component 11.

[0036] The imaging device 6 includes cameras 61 and 62, a cylindrical member 63, and a reflective optical system 64. In Figure 2, the arrangement of cameras 61 and 62 is schematically shown and is not limited to the illustrated arrangement.

[0037] Cameras 61 and 62 are, for example, visible light cameras. The cylindrical member 63 is a cylindrical member that extends in the X direction and houses one or more lenses that focus the cameras 61 and 62 to the recognition marks or feature areas. A reflective optical system 64 is provided at the tip of the cylindrical member 63. The reflective optical system 64 has reflective surfaces 64A and 64B (see Figure 6) that are inclined at 45°, and reflects light rays from the first camera 61 upward and light rays from the second camera 62 downward. Therefore, the first camera 61 has an upward field of view so as to image the area above the imaging device 6 by the reflective optical system 64. The second camera 62 has a downward field of view so as to image the area below the imaging device 6 by the reflective optical system 64. In other words, the imaging device 6 has two fields of view, one above and one below.

[0038] The upward-facing first camera 61 images the feature parts 91 and 92 of the feature member 9 in addition to the component 11. The downward-facing second camera 62 images the substrate 12.

[0039] The first moving device 58 moves the mounting head 5 up and down in the vertical direction F1 between heights H1 to H4 aligned in the Z direction, above the stage 8. In the following description, heights H1 to H4 are the heights of the lower surface of the component 11 held by the mounting head 5.

[0040] The first height H1 is the height of the mounting head 5 when the imaging device 6 images the first feature area 91 from below. The second height H2 is the height of the mounting head 5 when the imaging device 6 images the second feature area 92 from below. The height difference between the feature areas 91 and 92 corresponds to the height difference between heights H1 and H2. The third height H3 is the height of the mounting head 5 when the imaging device 6 enters between the mounting head 5 and the stage 8 to image the component 11 and the substrate 12. The fourth height H4 is the height of the mounting head 5 when mounting the held component 11. The fourth height H4 is the height at which the component 11 held by the mounting head 5 contacts the substrate 12.

[0041] Heights H1 and H2 are lower than the third height H3 and higher than the fourth height H4. The height difference between heights H1 and H2, i.e., the height difference between feature parts 91 and 92, is smaller than the height difference between heights H3 and H4. The first height H1 is closer to the fourth height H4 than the third height H3, and more preferably closer to the fourth height H4 than the imaging height H5 described later. The second height H2 is closer to the third height H3 than the fourth height H4, and more preferably closer to the third height H3 than the imaging height H5 described later. Therefore, the height difference between heights H1 and H2, i.e., the height difference between feature parts 91 and 92, approaches the height difference between heights H3 and H4.

[0042] If the mounting head 5 is not deformed, the position of the first feature portion 91 captured at a first height H1 and the position of the second feature portion 92 captured at a second height H2 will coincide in the field of view of the first camera 61. The control unit C performs calibration in advance so that the positions of feature portions 91 and 92 coincide with each other. Specifically, the control unit C captures images of feature portions 91 and 92 in advance, calculates a correction amount to make the positions coincide, and stores it in the storage unit C2. Through calibration, feature portions 91 and 92 correspond to the positions of the same point (for example, point S) on the mounting head 5.

[0043] However, since the mounting head 5 is subjected to moments and thermal strain, there is a risk that the mounting head 5 may deform. If the mounting head 5 deforms, when the mounting head 5 moves up and down, the lower end of the mounting head 5 (for example, the suction nozzle 51) will shift in the XY direction. Similarly, when the mounting head 5 descends from the second height H2 to the first height H1, point S will also shift in the XY direction. As a result, the position of the second feature portion 92 imaged at the second height H2 will no longer coincide with the position of the first feature portion 91 imaged at the first height H1. In other words, a displacement amount V1 occurs between the second feature portion 92 and the first feature portion 91. The displacement amount V1 is a quantity that indicates how much point S shifts while the mounting head 5 is descending from the second height H2 to the first height H1.

[0044] In the present disclosure, the displacement amount V1 between the first feature portion 91 and the second feature portion 92 approximates the displacement amount of the component 11 when moving from the third height H3 to the fourth height H4. Therefore, even if the recognition marks 71A and 72A of the component 11 are not imaged at the fourth height H4, the positions of the recognition marks 71A and 71B at the fourth height H4 can be estimated based on the displacement amount V1 and the positions of the recognition marks 71A and 71B imaged at the third height H3.

[0045] The deformation of the mounting head 5 is a non-linear deformation. Therefore, by bringing the heights H2 and H1 closer to the heights H3 and H4 respectively, the displacement amount of the component 11 when moving from the third height H3 to the fourth height H4 can be approximated more accurately with the displacement amount V1.

[0046] The third moving device 69 moves the imaging device 6 forward and backward in the front-rear direction F2 (X direction) so as to approach and separate from the space between the component 11 and the substrate 12. The third moving device 69 further moves the imaging device 6 in the Y direction. Specifically, as shown in FIGS. 2 to 4, the third moving device 69 moves the imaging device 6 between the imaging positions P10, P11, P12 and the retracted position P13. On the other hand, the third moving device 69 maintains the height (imaging height H5) of the imaging device 6 constant. The imaging height H5 is between the third height H3 and the fourth height H4.

[0047] The imaging position P10 is a position where the imaging device 6 images the recognition marks 71A and 72A. The imaging position P11 is a position where the imaging device 6 images the recognition marks 71B and 72B. The imaging position P12 is a position where the imaging device 6 images the second feature portion 92. The retracted position P13 is a position separated in the -X direction from the space between the component 11 and the substrate 12. In the first embodiment, the retracted position P13 is also a position where the imaging device 6 images the first feature portion 91.

[0048] When viewed from the Y direction, the imaging positions P10, P11, P12 and the retreat position P13 are arranged in order toward the +X side. Since the recognition marks 71A and 71B are arranged on the diagonal line of the component 11, the imaging position P10 and the imaging position P11 are displaced in the Y direction. Also, since the recognition marks 71A and 71B and the feature portions 91 and 92 are displaced in the Y direction, the imaging positions P10, P11, and P12 are displaced in the Y direction. On the other hand, since the feature portions 91 and 92 are arranged in the X direction, the imaging position P12 and the retreat position P13 are arranged in the X direction.

[0049] In order to align the focal points of the first cameras 61 located at the imaging positions P10 and P11 with the component 11, the first moving device 58 moves the mounting head 5 to the third height H3. In order to align the focal point of the first camera 61 located at the imaging position P12 with the second feature portion 92, the first moving device 58 moves the mounting head 5 to the second height H2. In order to align the focal point of the first camera 61 located at the retreat position P13 with the first feature portion 91, the first moving device 58 moves the mounting head 5 to the first height H1.

[0050] In the feature member 9, the dimension of the first member 93 in the X direction is determined according to the interval between the imaging position P12 and the retreat position P13. Also, the dimension of the second member 94 in the Z direction is determined according to the focal length of the first camera 61 and the interval between the heights H1 and H2.

[0051] Subsequently, referring to FIG. 5, the feature member 9 of the mounting head 5 will be described in more detail. FIG. 5 is a schematic diagram of the feature member 9.

[0052] As shown in FIG. 5, the base end 93A of the first member 93 is screwed and fixed to the holding portion 52. Specifically, the base end 93A of the first member 93 extends in the Y direction and is screwed on both sides of the portion 93C extending in the X direction. The base end 94A of the second member 94 is screwed and fixed to the base end 93A of the first member 93. Specifically, the base end 94A of the second member 94 extends in the Y direction and is screwed on both sides of the portion 94C extending in the Z direction.

[0053] The YZ cross-sectional area of ​​the first member 93 decreases in the +X direction, that is, from the base end 93A towards the first feature portion 91. This configuration suppresses deflection of the first member 93 due to its own weight.

[0054] Next, the optical system of the imaging device 6 will be described with reference to Figure 6. Figure 6 is a schematic diagram of the optical system of the imaging device 6.

[0055] As shown in Figure 6, the two cameras 61 and 62 each have image sensors 61a and 62a, such as CMOS cameras.

[0056] The first camera 61 and the second camera 62 are located to the side (+X side) of the reflective optical system 64. In Embodiment 1, the reflective optical system 64 has a configuration in which two triangular prisms, each having reflective surfaces 64A and 64B on their inclined surfaces, are bonded together so that their inclined surfaces are in contact with each other. Therefore, the first reflective surface 64A, which reflects the light ray L1 to the first camera 61, and the second reflective surface 64B, which reflects the light ray L2 to the second camera 62, are on opposite sides of the same plane.

[0057] The imaging device 6 has a reflective optical system 64, as well as a reflective optical system 65 and a reflective optical system 66. The reflective optical systems 65 and 66 are housed in a cylindrical member 63. In Embodiment 1, the reflective optical systems 65 and 66 are reflective prisms having reflective surfaces, but they may also be reflective mirrors. The reflective surfaces of the reflective optical systems 65 and 66 are tilted 45° around the Z axis so as to face the reflective optical system 64.

[0058] By providing reflective optical systems 65 and 66, cameras 61 and 62 can be positioned so that their optical axes are parallel to each other. In Embodiment 1, cameras 61 and 62 are positioned so that their optical axes both extend in the X direction.

[0059] Here, we will describe the light ray L1 that enters the first camera 61. The light ray L1 extends from above the imaging device 6 in the -Z direction, is bent by 90° by the first reflective surface 64A of the reflective optical system 64 and deflected in the +Y direction. After that, the light ray L1 is bent by 90° by the reflective optical system 65 and deflected in the +X direction before entering the first camera 61.

[0060] Next, the light ray L2 incident on the second camera 62 will be described. The light ray L2 extends from below the imaging device 6 in the +Z direction, is bent by 90° by the second reflective surface 64B of the reflective optical system 64 and deflected in the -Y direction. After that, the light ray L2 is bent by 90° by the reflective optical system 66 and deflected in the +X direction before incident on the second camera 62.

[0061] (Operation) With the above configuration, an example of the mounting operation of the mounting device 1 will be described with reference to Figures 7 to 12. Figure 7 is a flowchart of the mounting operation of the mounting device 1. Figures 8 to 12 are schematic diagrams of the mounting device 1 showing the mounting operation.

[0062] First, the control unit C causes the pickup head 3 to hold the parts 11 in the parts supply unit 2, and then the inversion unit 4 inverts the pickup head 3 from downward to upward. The control unit C may also select the parts 11 to be held based on information such as a production program.

[0063] Next, the control unit C drives the Y-direction drive unit 56 and the first moving unit 58 to move the mounting head 5 closer to the pickup head 3 and lower it so that the mounting head 5 can receive the component 11 held by the pickup head 3 (S10).

[0064] Next, the control unit C drives the Y-direction drive unit 56 and the first moving unit 58 to move the mounting head 5, which holds the component 11, to a height above the substrate 12, for example, a third height H3 (S11). The imaging device 6 is located in the retracted position P13.

[0065] Next, the control unit C drives the first moving device 58 to lower the mounting head 5, which holds the component 11, from the third height H3 to the first height H1 (S12).

[0066] Therefore, as shown in Figure 8, the control unit C causes the first camera 61 to capture a first image E1 including the upper first feature portion 91 via the reflective optical system 64 (S13). The control unit C stores the first image E1 in the storage unit C2.

[0067] Next, the control unit C drives the first moving device 58 to raise the mounting head 5, which holds the component 11, from a first height H1 to a second height H2 (S14).

[0068] Next, the control unit C drives the third moving device 69 to move the imaging device 6 from the retracted position P13 to the imaging position P12 in the -X direction (S15). As a result, the reflective optical system 64 of the imaging device 6 is located below the second feature portion 92 of the feature member 9.

[0069] Therefore, as shown in Figure 9, the control unit C causes the first camera 61 to capture a second image E2 including the upper second feature portion 92 via the reflective optical system 64 (S16). The control unit C stores the second image E2 in the storage unit C2.

[0070] Next, the control unit C drives the first moving device 58 to raise the mounting head 5, which holds the component 11, from the second height H2 to the third height H3 (S17).

[0071] Next, as shown in Figure 10, the control unit C drives the third moving device 69 to move the imaging device 6 from imaging position P12 to imaging position P10 in the -X and Y directions (S18). As a result, the tip of the cylindrical member 63 of the imaging device 6 is positioned between the component 11 and the substrate 12. That is, the component 11 is located above the reflective optical system 64, and the substrate 12 is located below the reflective optical system 64.

[0072] Therefore, the control unit C causes the first camera 61 to capture a part image D1 of the upper part 11 in the +Z direction via the reflective optical system 64 (S19). The control unit C also causes the second camera 62 to capture a substrate image D2 of the lower substrate 12 in the -Z direction via the reflective optical system 64 (S19). Specifically, the first camera 61 captures a part image D1 including the recognition mark 71A of the part 11, and the second camera 62 captures a substrate image D2 including the recognition mark 72A of the substrate 12. The control unit C stores images D1 and D2 in the storage unit C2.

[0073] Next, as shown in Figure 11, the control unit C drives the third moving device 69 to move the imaging device 6 from imaging position P10 to imaging position P11 in the +X and Y directions (S20). Subsequently, the control unit C causes the first camera 61 to capture a component image D11 including the recognition mark 71B, and the second camera 62 to capture a substrate image D12 including the recognition mark 72B (S21). The control unit C stores images D11 and D12 in the storage unit C2.

[0074] Next, the control unit C drives the third moving device 69 to move the imaging device 6 from the imaging position P11 to the retracted position P13 in the +X and Y directions (S22).

[0075] Considering the movement by the third moving device 69, the imaging device 6 moves in the following order: retracted position P13, imaging position P12, imaging position P10, imaging position P11, and retracted position P13. Therefore, all images E1, E2, D1, D2, D11, and D12 can be captured in one round trip between the retracted position P13 and the imaging position P10.

[0076] Next, the control unit C calculates the amount of misalignment of the component 11 relative to the substrate 12 based on images E1, E2, D1, D2, D11, and D12, and aligns the component 11 and the substrate 12 according to the calculated amount of misalignment (S23). Specifically, the control unit C drives the second moving device 59 to move the stage 8 in the XY direction according to the calculated amount of misalignment.

[0077] The calculation of the displacement amount will be explained with reference to Figures 13 to 15. Figure 13 is a schematic diagram of images E1 and E2 superimposed. Figure 14 is a schematic diagram showing part image D1. Figure 15 is a schematic diagram of images D1 and D2 superimposed.

[0078] As shown in Figure 13, the control unit C calculates the amount of displacement V1 of the second feature portion 92 in the second image E2 based on the position of the first feature portion 91 in the first image E1. The amount of displacement V1 is the amount of displacement that indicates how much an object captured when the mounting head 5 is at the second height H2 is shifted when it is captured when the mounting head 5 is at the first height H1.

[0079] As shown in Figure 14, when the displacement amount V1 is applied to the part image D1, it is possible to determine where the recognition mark 71A is located (indicated by the recognition mark 71C) when the part image D1 is captured while the mounting head 5 is at a first height H1.

[0080] As shown in Figure 15, by adding the amount of misalignment V1 to the amount of misalignment V0 (i.e., apparent misalignment) between the recognition mark 71A and the recognition mark 72A on the substrate 12, the amount of misalignment V2 between the component 11 (recognition mark 71C) and the substrate 12 can be calculated. The control unit C then moves the stage 8 in the XY direction to correct the calculated amount of misalignment V2 and align the component 11 and the substrate 12.

[0081] Next, as shown in Figure 12, the control unit C drives the first moving device 58 to lower the aligned mounting head 5 to the fourth height H4 and mount the component 11 onto the substrate 12 (S24).

[0082] The mounting device 1 repeats steps S10 to S24 to mount multiple components 11 onto the substrate 12 one by one in sequence.

[0083] On the other hand, the implementation operation is not limited to the operation shown in Figure 7. Figure 16 is a flowchart showing a modified example of the implementation operation of the implementation device 1. In Figure 16, steps common to both Figure 7 and Figure 7 are denoted by the same reference numerals and their explanations are omitted.

[0084] As shown in Figure 16, the control unit C may, while mounting multiple components 11 in succession, capture a first image E1 of the first feature section 91 after mounting the previous component 11 but before receiving the next component 11. Specifically, the control unit C may, while raising the mounting head 5 from the fourth height H4 on which the previous component 11 is mounted (S30), have the first camera 61 capture a first image E1 at the first height H1 (S31), and then have the mounting head 5 receive the next component 11 (S10).

[0085] Since the first image E1 of the first feature section 91 is captured before step S10, instead of steps S12 to S14 in Figure 7, the control unit C executes step S32, which moves the mounting head 5 directly from the third height H3 to the second height H2 without passing through the first height H1.

[0086] This operation allows imaging of the first feature portion 91 at the first height H1, which the mounting head 5 passes through as it rises from the fourth height H4, thus eliminating the need for a separate step (for example, step S12) to move the mounting head 5 to the first height H1. Therefore, the cycle time of the mounting operation can be shortened, and the efficiency of the mounting operation can be improved.

[0087] (Effects) The mounting device 1 according to Embodiment 1 can achieve the following effects.

[0088] As described above, the mounting apparatus 1 of Embodiment 1 includes a stage 8 that supports a substrate 12 and a mounting head 5 having a suction nozzle 51 (nozzle) capable of holding a component 11. The mounting apparatus 1 includes a first moving device 58 that moves the mounting head 5 relative to the stage 8 in the vertical direction F1 (Z direction), a second moving device 59 that moves the mounting head 5 relative to the stage 8 in a direction intersecting the vertical direction F1, and a control unit C that controls the second moving device 59. The mounting apparatus 1 includes an imaging device 6 that captures a component image D1 of the component 11 and a substrate image D2 of the substrate 12. The mounting head 5 has a first feature section 91 and a second feature section 92 provided below the first feature section 91. The first moving device 58 is capable of moving the mounting head 5 relative to the stage 8 to a first height H1 where the imaging device 6 captures the first image E1 of the first feature section 91, and to a second height H2 where the imaging device 6 captures the second image E2 of the second feature section 92. The control unit C controls the second moving device 59 based on the first image E1, the second image E2, the component image D1, and the substrate image D2.

[0089] With this configuration, the mounting head 5 may deform due to moments or thermal strain, and when the mounting head 5 moves up and down, there is a risk of positional misalignment between the mounting head 5 and the stage 8. Therefore, by imaging the first feature section 91 and the second feature section 92, which have a height difference, the amount of positional misalignment can be determined. By correcting the positional misalignment, the mounting accuracy of the mounting device 1 can be improved.

[0090] In the mounting apparatus 1 of Embodiment 1, the first moving device 58 is capable of moving the mounting head 5 relative to the stage 8 to a third height H3 where the imaging device 6 captures the component image D1 and the substrate image D2, and to a fourth height H4 where the component 11 is mounted on the substrate 12. The first height H1 is closer to the fourth height H4 than to the third height H3, and the second height H2 is closer to the third height H3 than to the fourth height H4.

[0091] With this configuration, the first height H1 can be brought closer to the fourth height H4 on which the component 11 is mounted, and the second height H2 can be brought closer to the third height H3 on which the component image D1 is captured. Therefore, by capturing the first feature portion 91 and the second feature portion 92, the positional misalignment between the component 11 at the captured third height H3 and the component 11 at the mounted fourth height H4 can be determined more accurately.

[0092] In the mounting apparatus 1 of Embodiment 1, the imaging apparatus 6 has a first camera 61 (first imaging unit) that captures a first image E1, a second image E2, and a component image D1. The imaging apparatus 6 also has a second camera 62 (second imaging unit) that captures a substrate image D2. The imaging apparatus 6 has a reflective optical system 64 having a first reflective surface 64A that reflects light from above the imaging apparatus 6 and causes it to enter the first camera 61, and a second reflective surface 64B that reflects light from below the imaging apparatus 6 and causes it to enter the second camera 62.

[0093] This configuration makes it easier to focus on and image the horizontally shifted feature areas 91 and 92 compared to an imaging device that images through a horizontal field of view.

[0094] The mounting apparatus 1 of the first embodiment further includes a third moving device 69 that moves the imaging device 6 in a front-to-back direction F2 (X direction) intersecting the vertical direction F1. The third moving device 69 is capable of moving the imaging device 6 between a first imaging position P10 for capturing a component image D1 and a substrate image D2, a second imaging position P12 for capturing a second image E2, and a retracted position P13 away from the space between the component 11 and the substrate 12. The imaging device 6 captures the first image E1 at the retracted position P13.

[0095] With this configuration, the position for capturing the first image E1 is combined with the retraction position P13, which simplifies the movement of the imaging device 6. Therefore, the efficiency of the alignment operation of the mounting device 1 can be improved.

[0096] In the mounting device 1 of Embodiment 1, the retracted position P13, the second imaging position P12, and the first imaging position P10 are arranged in the front-to-back direction F2 in order. The imaging device 6 sequentially captures the first image E1, the second image E2, the component image D1, and the substrate image D2.

[0097] This configuration simplifies the movement of the imaging device 6 and further improves the efficiency of the alignment operation of the mounting device 1.

[0098] In the mounting apparatus 1 of Embodiment 1, the height difference G1 between the second feature portion 92 and the tip 51A of the suction nozzle 51 is 2 mm or less.

[0099] This configuration allows the second feature portion 92 to be positioned near the tip of the suction nozzle 51 (i.e., near the part 11). Therefore, the second image E2 can be captured by focusing on the second feature portion 92 near the third height H3 where the part image D1 is captured.

[0100] In the mounting apparatus 1 of Embodiment 1, the mounting head 5 has a holding portion 52 for holding the suction nozzle 51, and a feature member 9 fixed to the holding portion 52 and provided with a first feature portion 91 and a second feature portion 92. The feature member 9 has a first member 93 extending in the front-rear direction F2 with the first feature portion 91 at its end, and a second member 94 extending in the up-down direction F1 with the second feature portion 92 at its end.

[0101] This configuration makes it easy to create a height difference between the first feature portion 91 and the second feature portion 92. Furthermore, by shifting the first feature portion 91 and the second feature portion 92 in the front-rear direction F2, the imaging device 6 can be moved in the front-rear direction F2, allowing for easy imaging of each feature portion 91 and 92. By fixing the feature member 9 to the holding portion 52, it is not necessary to provide the feature portions 91 and 92 on separate suction nozzles 51 corresponding to different types of parts 11.

[0102] In the mounting device 1 of Embodiment 1, the base end 93A of the first member 93 is fixed to the holding part 52, and the base end 94A of the second member 94 is fixed to the base end 93A of the first member 93.

[0103] With this configuration, by fixing the second member 94 to the first member 93 (or vice versa), it is possible to understand how a specific point on the holding part 52 shifts as the mounting head 5 moves up and down.

[0104] In the mounting device 1 of Embodiment 1, the cross-sectional area of ​​the first member 93 perpendicular to the front-rear direction F2 decreases from the base end 93A to the tip end 93B.

[0105] This configuration makes it possible to suppress the first member 93 from bending under its own weight.

[0106] In the mounting apparatus 1 of Embodiment 1, the second feature portion 92 is provided below the first feature portion 91 and above the lower surface of the component 11 held by the suction nozzle 51.

[0107] With this configuration, compared to the case where the second feature portion 92 is located below the lower surface of the component 11, when the feature member 9 is lowered, such as when imaging the first feature portion 91, it is possible to suppress the lower surface of the component 11 from hitting the substrate 12.

[0108] The control method for the mounting apparatus 1 of Embodiment 1 includes moving a mounting head 5 having a suction nozzle 51 capable of holding a component 11 relative to a first height H1 with respect to a stage 8 supporting a substrate 12. The control method includes causing an imaging device 6 to image a first feature portion 91 on the mounting head 5. The control method includes moving the mounting head 5 relative to the stage 8 in the vertical direction F1 between a first height H1 where the imaging device 6 images a first image E1 of the first feature portion 91 and a second height H2 where the imaging device 6 images a second image E2 of the second feature portion 92. The control method includes causing the imaging device 6 to image a second feature portion 92 located below the first feature portion 91. The control method includes causing the imaging device 6 to image a component image D1 and a substrate image D2. The control method includes moving the mounting head 5 relative to the stage 8 in a direction intersecting the vertical direction F1, based on the first image E1, the second image E2, the component image D1, and the substrate image D2.

[0109] This configuration allows for improved mounting accuracy of the mounting device 1 by correcting positional misalignment caused by the raising and lowering of the mounting head 5.

[0110] The control method for the mounting device 1 of Embodiment 1 further includes holding the component 11 with the suction nozzle 51. The first feature portion 91 is imaged after the component 11 is held by the suction nozzle 51.

[0111] This configuration reduces the vertical movement F1 of the mounting head 5 between imaging and mounting, thereby minimizing the possibility of positional misalignment occurring again.

[0112] This disclosure is not limited to Embodiment 1, and can be implemented in various other forms.

[0113] In Embodiment 1, an example was described in which the vertical movement direction F1 (Z direction) of the first moving device 58 and the movement direction (XY direction) of the second moving device 59 are orthogonal, but the invention is not limited to this. The movement direction of the second moving device 59 may be inclined with respect to the movement direction of the first moving device 58. Also, the movement direction of the imaging device 6 by the third moving device 69 may be inclined with respect to the horizontal.

[0114] In Embodiment 1, an example was described in which the component 11 is aligned with respect to the substrate 12, but the invention is not limited to this. For example, the component 11 may be aligned with other components already mounted on the substrate 12 or with other surfaces.

[0115] In Embodiment 1, an example was described in which the mounting head 5 is movable in the vertical direction F1 (Z direction) by the first moving device 58 during steps S12 to S23 of the mounting operation, but the invention is not limited to this. The mounting head 5 may also be movable in the XY direction by a moving device such as a motor. In this case, the second moving device 59 that moves the stage 8 may be omitted. Alternatively, the mounting head 5 may be fixed, and the stage 8 may also be movable in the XYZ direction by the second moving device 59. It is sufficient that relative movement in the XYZ direction is achievable between the mounting head 5 and the stage 8.

[0116] In Embodiment 1, an example was described in which the feature member 9 has an L-shape composed of two members 93 and 94, but the embodiment is not limited to this. The feature member 9 may have any other shape as long as the feature portions 91 and 92 are offset in the Z direction, and may be formed from a single member.

[0117] In Embodiment 1, an example was described in which the component 11 and the substrate 12 each have two recognition marks 71A, 71B, 72A, and 72B, but the embodiment is not limited to this. The component 11 and the substrate 12 may each have one or three or more recognition marks.

[0118] In Embodiment 1, an example was described in which the second height H2 and the third height H3 are different, but the invention is not limited to this. Heights H2 and H3 may be the same. With this configuration, the step of changing the height of the mounting head 5 can be omitted, and the time required for the mounting operation can be shortened. An example was described in which the first height H1 and the fourth height H4 are different, but the invention is not limited to this. Heights H1 and H4 may be the same. In this case, the feature portion 91 is imaged before the suction nozzle 51 receives the part 11.

[0119] In Embodiment 1, an example was described in which the control unit C calculates the relative displacement amount V1 of two feature parts 91 and 92, but the invention is not limited to this. For example, the control unit C may calculate the displacement amount by comparing the first feature part 91 with a first reference position to determine how much the mounting head 5 located at a first height H1 is shifted. Alternatively, the control unit C may calculate the displacement amount by comparing the second feature part 92 with a second reference position to determine how much the mounting head 5 located at a second height H2 is shifted. The control unit C may calculate the displacement amount V1 from the two displacement amounts.

[0120] In Embodiment 1, an example was described in which the second height H2 and the third height H3 are close together, and the first height H1 and the fourth height H4 are close together, but the invention is not limited to this. For example, the control unit C may model the deformation of the mounting head 5 and calculate the first displacement by multiplying the displacement of the first feature portion 91 in the first image E1 with respect to a predetermined reference position by a first coefficient corresponding to the fourth height H4. Furthermore, the control unit C may calculate the second displacement by multiplying the displacement of the second feature portion 92 in the second image E2 with respect to a predetermined reference position by a second coefficient corresponding to the third height H3. The control unit C may also calculate the displacement amount V1 by adding the first displacement amount and the second displacement amount. With such a configuration, even when the second height H2 and the third height H3 are far apart, and the first height H1 and the fourth height H4 are far apart, the mounting accuracy of the mounting device 1 can be improved by correcting the positional displacement due to the deformation of the mounting head 5.

[0121] In Embodiment 1, an example was described in which the imaging device 6 images the component 11 and the substrate 12 in the same step in steps S19 and S21, but the invention is not limited to this. For example, if the recognition marks 71A and 71B on the component 11 and the corresponding recognition marks 72A and 72B on the substrate 12 are not on the same straight line extending in the Z direction, the control unit C moves the imaging device 6 to image the component 11 and the substrate 12 separately.

[0122] In Embodiment 1, an example was described in which the control unit C drives the second moving device 59 to move the stage 8 in the XY direction to align the component 11 with the substrate 12, but the invention is not limited to this. If the mounting head 5 has a structure symmetrical with respect to the XZ plane, the deformation in the Y direction will be small, so the control unit C may move the stage 8 only in the X direction to align the component 11 with the substrate 12. In addition, the control unit C may drive the first moving device 58 to rotate the mounting head 5 around the Z axis according to the orientation of the feature parts 91, 92 and recognition marks 71A, 71B, 72A, 72B in the images E1, E2, D1, D2, D11, D12.

[0123] In Embodiment 1, an example was described in which the base end 93A of the first member 93 is fixed to the holding portion 52 and the base end 94A of the second member 94 is fixed to the base end 93A of the first member 93, but the invention is not limited to this. The base end 94A of the second member 94 may be fixed to the holding portion 52, and the base end 93A of the first member 93 may be fixed to the base end 94A of the second member 94.

[0124] The mounting apparatus in the first embodiment comprises a stage that supports a substrate, a mounting head having a nozzle capable of holding a component, a first moving device that moves the mounting head relative to the stage in the vertical direction, a second moving device that moves the mounting head relative to the stage in a direction intersecting the vertical direction, an imaging device that captures component images and substrate images from the vertical direction, and a control unit that controls the second moving device. The mounting head has a first feature portion and a second feature portion located below the first feature portion. The first moving device is capable of moving the mounting head relative to the stage to a first height at which the imaging device captures a first image of the first feature portion and a second height at which the imaging device captures a second image of the second feature portion. The control unit controls the second moving device based on the first image, the second image, the component image, and the substrate image.

[0125] In the second embodiment, as a mounting apparatus, in the mounting apparatus of the first embodiment, the first moving device is capable of moving the mounting head relative to the stage to a third height at which the imaging device captures component images and substrate images, and a fourth height at which components are mounted on the substrate, wherein the first height is closer to the fourth height than the third height, and the second height is closer to the third height than the fourth height.

[0126] As a mounting apparatus in a third embodiment, in the mounting apparatus in the second embodiment, the imaging apparatus includes a first imaging unit for capturing a first image, a second image, and a component image; a second imaging unit for capturing a substrate image; and a reflective optical system having a first reflective surface for reflecting light from above the imaging apparatus and directing it onto the first imaging unit, and a second reflective surface for reflecting light from below the imaging apparatus and directing it onto the second imaging unit.

[0127] In the fourth embodiment, the mounting apparatus further comprises a third moving device that moves the imaging device in a forward and backward direction intersecting the vertical direction, wherein the imaging device is movable between a first imaging position for capturing component images and substrate images, a second imaging position for capturing a second image, and a retracted position away from the space between the component and the substrate, and the imaging device captures the first image in the retracted position.

[0128] In the fifth embodiment, the mounting apparatus is arranged in the fourth embodiment with the retracted position, the second imaging position, and the first imaging position in the front-to-back direction in order, and the imaging apparatus captures the first image, the second image, the component image, and the substrate image in order.

[0129] In the sixth embodiment, as a mounting apparatus, in any of the second to fifth embodiments, the height difference between the second feature portion and the tip of the nozzle is 2 mm or less.

[0130] In the seventh embodiment, the mounting device is such that the second height and the third height are the same as in any of the second to sixth embodiments.

[0131] As a mounting apparatus in the eighth embodiment, in a mounting apparatus in any of the first to seventh embodiments, the mounting head has a holding portion for holding a nozzle and a feature member fixed to the holding portion and provided with a first feature portion and a second feature portion, the feature member having a first member extending in the front-rear direction with the first feature portion at its end and a second member extending in the up-down direction with the second feature portion at its end.

[0132] In the ninth embodiment, as in the eighth embodiment, the base end of the first member is fixed to the holding portion, and the base end of the second member is fixed to the base end of the first member.

[0133] In the tenth embodiment, as in the eighth embodiment, the base end of the second member is fixed to the holding portion, and the base end of the first member is fixed to the base end of the second member.

[0134] In the 11th embodiment, as a mounting device, in any of the 8th to 10th embodiments, the cross-sectional area of ​​the first member perpendicular to the front-rear direction decreases from the base end to the tip end.

[0135] In the twelfth embodiment, as a mounting apparatus, in any of the first to seventh embodiments, the second feature portion is provided below the first feature portion and above the lower surface of the component held by the nozzle.

[0136] A control method for a mounting apparatus in a thirteenth embodiment includes: moving a mounting head having a nozzle capable of holding a component to a first height relative to a stage supporting a substrate; causing an imaging device to image a first feature portion of the mounting head; moving the mounting head relative to the stage in the vertical direction between a first height at which the imaging device images a first image of the first feature portion and a second height at which the imaging device images a second image of a second feature portion; causing the imaging device to image a second feature portion located below the first feature portion; causing the imaging device to image a component image and a substrate image; and moving the mounting head relative to the stage in a direction intersecting the vertical direction based on the first image, the second image, the component image, and the substrate image.

[0137] A control method for a mounting apparatus in a 14th embodiment further includes holding a component with a nozzle, in the control method for a mounting apparatus in a 13th embodiment, wherein the first feature portion is imaged before the component is held by the nozzle.

[0138] As a control method for the mounting apparatus in the 15th embodiment, the control method for the mounting apparatus in the 13th embodiment further includes holding a component with a nozzle, wherein the first feature portion is imaged after the component is held with the nozzle.

[0139] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various modifications and alterations will be obvious to those skilled in the art. Such modifications and alterations should be understood to be included within the scope of the invention as defined by the appended claims.

[0140] The mounting apparatus of this disclosure has the effect of aligning components with respect to a substrate and is particularly useful in mounting apparatuses for components such as IC chips, high-speed large-capacity memory, application processors, and CPUs.

[0141] 1 Mounting device 2 Component supply unit 5 Mounting head 6 Imaging device 8 Stage 9 Feature member 11 Component 12 Substrate 51 Suction nozzle 58 First moving device 59 Second moving device 61 First camera 62 Second camera 63 Cylindrical member 64 Reflective optical system 69 Third moving device 71A, 71B Recognition mark 72A, 72B Recognition mark 91 First feature part 92 Second feature part

Claims

1. A mounting apparatus comprising: a stage for supporting a substrate; a mounting head having a nozzle capable of holding components; a first moving device for moving the mounting head relative to the stage in a vertical direction; a second moving device for moving the mounting head relative to the stage in a direction intersecting the vertical direction; an imaging device for capturing component images of the components and substrate images of the substrate from the vertical direction; and a control unit for controlling the second moving device, wherein the mounting head has a first feature portion and a second feature portion provided below the first feature portion; the first moving device moves the mounting head relative to the stage between a first height at which the imaging device captures a first image of the first feature portion and a second height at which the imaging device captures a second image of the second feature portion; and the control unit controls the second moving device based on the first image, the second image, the component image, and the substrate image.

2. The mounting apparatus according to claim 1, wherein the first moving device moves the mounting head relative to the stage between a third height at which the imaging device captures the component image and the substrate image, and a fourth height at which the component is mounted on the substrate, the first height being closer to the fourth height than the third height, and the second height being closer to the third height than the fourth height.

3. The mounting apparatus according to claim 2, wherein the imaging apparatus comprises: a first imaging unit for capturing the first image, the second image, and the component image; a second imaging unit for capturing the substrate image; and a reflective optical system having a first reflective surface for reflecting light from above the imaging apparatus and directing it onto the first imaging unit, and a second reflective surface for reflecting light from below the imaging apparatus and directing it onto the second imaging unit.

4. The mounting device according to claim 2, wherein the imaging device is movable in a front-rear direction intersecting the vertical direction at an imaging height between the third height and the fourth height, the first height is closer to the fourth height than the imaging height, and the second height is closer to the third height than the imaging height.

5. The mounting apparatus according to claim 2, wherein the control unit controls the second moving device based on a displacement amount calculated by adding the displacement amount between the first feature portion in the first image and the second feature portion in the second image to the displacement amount between the component image and the substrate image.

6. The mounting apparatus according to claim 3, further comprising a third moving device for moving the imaging device in a front-rear direction intersecting the vertical direction, wherein the third moving device is capable of moving the imaging device between a first imaging position for capturing the component image and the substrate image, a second imaging position for capturing the second image, and a retracted position away from the space between the component and the substrate, and the imaging device captures the first image in the retracted position.

7. The mounting apparatus according to claim 6, wherein the retracted position, the second imaging position, and the first imaging position are arranged in the front-to-back direction in order, and the imaging device sequentially captures the first image, the second image, the component image, and the substrate image.

8. The mounting apparatus according to claim 2, wherein the height difference between the second feature portion and the tip of the nozzle is 2 mm or less.

9. The mounting apparatus according to claim 2, wherein the second height and the third height are the same.

10. The mounting device according to any one of claims 1 to 9, wherein the mounting head has a holding portion for holding the nozzle and a feature member fixed to the holding portion and having a first feature portion and a second feature portion, and the feature member has a first member extending in the front-rear direction with the first feature portion at its end and a second member extending in the up-down direction with the second feature portion at its end.

11. The mounting apparatus according to claim 10, wherein the base end of the first member is fixed to the holding portion, and the base end of the second member is fixed to the base end of the first member.

12. The mounting apparatus according to claim 10, wherein the base end of the second member is fixed to the holding portion, and the base end of the first member is fixed to the base end of the second member.

13. The mounting device according to claim 10, wherein the cross-sectional area of ​​the first member perpendicular to the front-rear direction decreases from the base end to the tip end.

14. The mounting apparatus according to any one of claims 1 to 9, wherein the second feature portion is provided below the first feature portion and above the lower surface of the component held by the nozzle.

15. A method for controlling a mounting apparatus, comprising: moving a mounting head having a nozzle capable of holding a component to a first height relative to a stage supporting a substrate; causing an imaging device to image a first feature portion of the mounting head; moving the mounting head relative to the stage in the vertical direction between a first height at which the imaging device images a first image of the first feature portion and a second height at which the imaging device images a second image of a second feature portion; causing the imaging device to image a second feature portion located below the first feature portion; causing the imaging device to image a component image and a substrate image; and moving the mounting head relative to the stage in a direction intersecting the vertical direction based on the first image, the second image, the component image, and the substrate image.

16. A control method for a mounting apparatus according to claim 15, further comprising holding the component with the nozzle, wherein the first feature portion is imaged before the component is held by the nozzle.

17. A control method for a mounting apparatus according to claim 15, further comprising holding the component with the nozzle, wherein the first feature portion is imaged after the component is held with the nozzle.

Images