Thermal simulation method for electronic device, and related device

Abstract

Provided in the present invention are a thermal simulation method for an electronic device, and a related device. The method comprises the following steps: constructing a geometric model of an electronic device; performing mesh generation on the geometric model; setting material parameters and convection boundary conditions of the geometric model; setting temperature observation points and heat sources; on the basis of a generated mesh, the material parameters and the convection boundary conditions of the geometric model, constructing a stiffness matrix [K] and a mass matrix [M] of the geometric model, and on the basis of the heat sources, calculating a load vector {B}; on the basis of [K], [M] and {B}, calculating and acquiring a system response function matrix [H(s)] of the geometric model; performing inverse Laplace transform on the system response function matrix [H(s)], so as to obtain a time-domain system response function matrix [H(t)]; on the basis of an application scenario, setting a transient power vector {P(t)} of each heat source; and performing convolution on [H(t)] and {P(t)}, so as to obtain and output a transient temperature {T(t)} of each observation point. The present invention can simultaneously obtain transient temperatures of observation points of an electronic device under the powers of different heat sources in a certain application scenario, thereby improving the simulation efficiency.

Description

A thermal simulation method and related equipment for electronic devices Technical Field

[0001] This invention relates to the field of computer-aided simulation technology, and in particular to a thermal simulation method and related equipment for electronic devices. Background Technology

[0002] With the rapid development of electronic devices, users have increasingly higher performance requirements, such as faster processing speeds, lower power consumption, and longer battery life. The increasing integration and complexity of electronic devices have led to a sharp increase in the heat generated during operation, placing higher demands on thermal management.

[0003] Transient thermal simulation is a technique that uses mathematical models and computer technology to simulate the thermal behavior of electronic devices over extremely short periods (e.g., seconds to minutes). This technique is primarily based on the fundamental principles of fluid mechanics and heat transfer, using numerical calculations and graphical displays to evaluate and optimize the thermal design of mobile phones. Compared to traditional thermal design methods that rely on multiple physical prototypes for verification, transient thermal simulation can predict the temperature distribution and heat flow of electronic devices under extreme or transient operating conditions during the design phase. This allows for timely detection and optimization of the thermal design, preventing performance degradation or damage due to overheating, thus improving product reliability and extending the overall lifespan of the electronic device. However, electronic devices require a corresponding number of transient simulations for different application scenarios. Existing EDA software's transient thermal simulation methods require resetting and numerical calculations for each simulation, resulting in excessive time consumption and a low thermal transient simulation rate. Summary of the Invention

[0004] The purpose of this invention is to provide a thermal simulation method and related equipment for electronic devices to solve the above-mentioned problems. It can simultaneously obtain the instantaneous temperature of each observation point of the electronic device under different transient heat source powers in a certain application scenario, thereby improving simulation efficiency while meeting the requirements for the number of transient simulations.

[0005] This invention proposes a thermal simulation method for electronic devices, comprising the following steps:

[0006] Construct the geometric model of the electronic device;

[0007] Mesh the geometric model;

[0008] Set the material parameters and convection boundary conditions for the geometric model;

[0009] Set temperature observation points and heat sources, with each observation point corresponding to a node in the mesh;

[0010] Constructing the finite element matrix: Construct the stiffness matrix [K] and mass matrix [M] of the geometric model based on the mesh, material properties and convection boundary conditions of the geometric model, and calculate the load vector {B} based on the heat source;

[0011] Based on the stiffness matrix [K], mass matrix [M], and load vector {B}, the system response function matrix [H(s)] of the geometric model is obtained through finite element analysis.

[0012] The system response function matrix [H(s)] is subjected to an inverse Laplace transform to obtain the time-domain system response function matrix [H(t)].

[0013] Set the transient power vector {P(t)} for each heat source according to the application scenario;

[0014] Convolve [H(t)] and {P(t)} to obtain and output the instantaneous temperature {T(t)} at each observation point.

[0015] In one embodiment, the material parameters include thermal conductivity, density, and specific heat capacity, and the convective boundary conditions include the convective heat transfer coefficient of the outer surface of the geometric model and the fluid environment temperature.

[0016] In one embodiment, the data for both the stiffness matrix [K] and the mass matrix [M] are stored as sparse matrices.

[0017] In one embodiment, the transient power vector {P(t)} of each heat source is:

[0018] Where m is the number of heat source groups, {P(t)} is an m-dimensional vector, and p i (t) is the power function of the i-th heat source.

[0019] In one embodiment, the instantaneous temperature {T(t)} at each observation point is calculated using the formula: {T(t)} = [H(t)] * {P(t)}.

[0020] In one embodiment, the instantaneous temperature {T(t)} at each observation point is an n-dimensional vector, where n is the number of observation points, and is expressed as:

[0021] In one embodiment, the instantaneous temperature {T(t)} at each observation point is represented as an instantaneous temperature curve at each observation point.

[0022] The present invention also proposes a computer device, including a memory, a processor, and a computer program stored in the memory, wherein the processor executes the computer program to implement the thermal simulation method for the electronic device as described above.

[0023] The present invention also proposes a computer storage medium storing a computer program, which, when executed by a processor, implements the thermal simulation method for the electronic device as described above.

[0024] The present invention also proposes a computer program product, including a computer program that, when executed by a processor, implements the thermal simulation method for the electronic device as described above.

[0025] Compared with the prior art, the advantages of the thermal simulation method for electronic devices and related equipment of the present invention are as follows:

[0026] 1) Based on the thermal circuit simulation method, this invention uses the system response function matrix [H(s)] of the electronic device extracted by simulation software and the heat source power {P(t)} set under different application scenarios of the electronic device to simultaneously simulate and calculate the transient temperature {T(t)} of each observation point of the electronic device under a certain application scenario, thereby improving the simulation efficiency.

[0027] 2) This invention uses electronic device model system functions to construct circuit models and applies them to thermal transient simulation, achieving the effect of one extraction and multiple simulations, which greatly shortens the time used for thermal transient simulation in the thermal design of electronic devices, shortens the R&D cycle, and improves product superiority. Attached Figure Description

[0028] Figure 1 is a flowchart illustrating a thermal simulation method for an electronic device according to an embodiment of the present invention;

[0029] Figure 2 is a schematic diagram of the mesh subdivision of a mobile phone model according to an embodiment of the present invention;

[0030] Figure 3 is a power function curve of a mobile phone heat source according to an embodiment of the present invention;

[0031] Figure 4 is an instantaneous temperature curve of a mobile phone at various observation points according to an embodiment of the present invention;

[0032] Figure 5 is a comparison of the simulation results of the mobile phone model using the existing technology and the thermal simulation method of the present invention;

[0033] Figure 6 is a schematic diagram showing the relative error of the simulation results of the mobile phone model using the existing technology and the thermal simulation method of the present invention. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this invention more readily understood, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that while many specific details are set forth in the following description to provide a thorough understanding of the invention, the invention can also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the invention; therefore, the invention is not limited to the specific embodiments disclosed below.

[0035] Secondly, the phrase "an embodiment" or "a particular embodiment" in this application refers to a specific feature, structure, or characteristic that can be included in at least one implementation of the present invention. The phrases "in one embodiment" and "a particular embodiment" appearing in different places in this specification do not all refer to the same embodiment, nor are they embodiments that are mutually exclusive, either alone or selectively, with other embodiments. The terms "comprising" or "including" indicate the presence of the claimed feature but do not exclude the presence of one or more other features. The term "and / or" as used in this application includes any and all combinations of one or more of the related listed items.

[0036] This invention proposes a thermal simulation method for electronic devices, as shown in Figure 1, which includes the following steps:

[0037] Step S1: Construct the geometric model of the electronic device.

[0038] Step S2: Mesh the geometric model.

[0039] Step S3: Set the material parameters and convection boundary conditions of the geometric model. The material parameters include thermal conductivity, density, specific heat capacity, etc., and the convection boundary conditions include the convection heat transfer coefficient of the outer surface of the geometric model and the fluid environment temperature, etc.

[0040] Step S4: Set the temperature observation points and heat sources. A heat source can act on one or more nodes, and each observation point corresponds to a node in the mesh. It should be noted that a node refers to the vertex of the mesh. In simulation calculations, the temperature of each mesh vertex is usually calculated on a node-by-node basis.

[0041] Step S5: Construct the finite element matrix: Construct the stiffness matrix [K] and mass matrix [M] of the geometric model based on the mesh, material properties and convection boundary conditions of the geometric model, and calculate the load vector {B} based on the heat source.

[0042] Specifically, the stiffness matrix [K], mass matrix [M], and load vector {B} are calculated based on the following finite element formula for heat conduction simulation: [K]{T}+[M]{dT / dt}={B}; M ij =∫ V ρc N i N j dV;

[0043] Where t is time, [K] is the stiffness matrix, and [M] is the mass matrix. Both [K] and [M] are sparse matrices, a matrix storage format used in computers for very large matrices, commonly used in large matrix calculations. That is, the data of the stiffness matrix [K] and the mass matrix [M] are stored in computer memory in sparse matrix form to prevent excessive memory usage; {B} is the load vector, representing the size of the heat source applied to the node; {T} is the node temperature, Ni is the interpolation function of node i in the element, h is the convective heat transfer coefficient, k is the thermal conductivity, ρ is the density, c is the specific heat capacity, Q is the size of the input volume heat source, q is the size of the input surface heat source, and T... amb The ambient temperature.

[0044] Step S6: Based on the stiffness matrix [K], mass matrix [M], and load vector {B}, obtain the system response function H(s) of the geometric model using existing thermal simulation software finite element analysis, and convert it into matrix representation to obtain the system response function matrix [H(s)]. The elements of the [H(s)] matrix are... ij Let H(s) represent the temperature contribution function of the j-th heat source to observation point i. The extraction of the system response function H(s) is a prior art technique and will not be elaborated upon here.

[0045] Step S7: Perform an inverse Laplace transform on the system response function matrix [H(s)] to obtain the time-domain system response function matrix [H(t)], i.e., [H(t)] = L -1 [[H(s)]],L -1 This is the symbol for the inverse Laplace transform.

[0046] The basic formula for the inverse Laplace transform is:

[0047] Step S8: Set the transient power vector of each heat source according to the application scenario required for transient simulation. Where m is the number of heat source groups, {P(t)} is an m-dimensional vector, and p i (t) is the power function of the i-th heat source.

[0048] Step S9: Convolve [H(t)] and {P(t)} to obtain and output the instantaneous temperature {T(t)} of each observation point. The formula for calculating the instantaneous temperature {T(t)} of each observation point is: {T(t)}=[H(t)]*{P(t)};

[0049] {T(t)} is an n-dimensional vector, where n is the number of observation points, and its expression is:

[0050] The output of {T(t)} is represented as an instantaneous temperature curve for each observation point.

[0051] The basic formula for convolution is:

[0052] The following section uses instantaneous thermal simulation of a mobile phone as an example to elaborate on the above thermal simulation method in detail. The specific operation is as follows:

[0053] 1) Construct the geometric model of the mobile phone;

[0054] 2) Mesh the phone's geometric model, as shown in Figure 2;

[0055] 3) Set the material parameters and convection boundary conditions for the geometric model;

[0056] 4) Set up 3 temperature observation points (probe1, probe2, probe3) and 2 heat sources (GPU, SOC), with each observation point corresponding to a node of the mesh;

[0057] 5) Constructing the finite element matrix: Construct the stiffness matrix [K] and mass matrix [M] of the geometric model based on the mesh, material properties and convection boundary conditions of the geometric model, and calculate the load vector {B} based on the heat source;

[0058] 6) Import the stiffness matrix [K], mass matrix [M], and load vector {B} containing the mobile phone model and boundary condition data into the thermal simulation software, and calculate and obtain the system response function matrix [H(s)] of the geometric model;

[0059] 7) Perform an inverse Laplace transform on the system response function matrix [H(s)] to obtain the time-domain system response function matrix [H(t)].

[0060] 8) Set the transient power vector {P(t)} for each heat source according to the application scenario. The power function is shown in Figure 3.

[0061] 9) Convolve [H(t)] and {P(t)} to obtain and output the instantaneous temperature {T(t)} at each observation point. The output of {T(t)} is represented as the instantaneous temperature curve of each observation point, as shown in Figure 4.

[0062] By extracting the system response function matrix [H(s)] and setting the power {P(t)} under different mobile application scenarios, the observation point temperature {T(t)} under different mobile application scenarios can be calculated, achieving the effect of one extraction (i.e., extracting H(s) through thermal simulation software) and multiple simulations.

[0063] The following example uses a mobile phone model under natural convection cooling for thermal simulation analysis. The heat sources are set as 14 0.4W surface heat sources on the chip and a 1W volume heat source on the DDR. The observation point is set as the center point of the mobile phone screen. After meshing, the above case is solved using both the existing finite element thermal transient simulation method and the thermal transient simulation method based on the system response function of this invention. The comparison of simulation time is shown in Table 1, the temperature curves obtained by the two methods are shown in Figure 5, and the relative temperature error is shown in Figure 6. As can be seen from Figures 5 and 6, the simulation results of the two methods are basically consistent, and the error is negligible. However, the simulation time of this invention is significantly improved compared to the existing technology, greatly enhancing simulation efficiency and saving simulation time.

[0064] Table 1 compares the simulation time of the mobile phone model using existing technology and the thermal simulation method of the present invention.

[0065] The present invention also proposes a computer device, including a memory, a processor, and a computer program stored in the memory, wherein the processor executes the computer program to implement the thermal simulation method of the electronic device as described above.

[0066] The present invention also proposes a computer storage medium storing a computer program, which, when executed by a processor, implements the thermal simulation method for the electronic device as described above.

[0067] The present invention also proposes a computer program product, including a computer program that, when executed by a processor, implements the thermal simulation method of the electronic device as described above.

[0068] It should be noted that Figures 2, 3, and 4 show screenshots of the actual software interface for thermal transient simulation on a mobile phone. These figures are intended to demonstrate the operation process and model construction effect of the present invention in actual software, rather than directly relating to the technical solution of the present invention. These screenshots include color graphics, which represent the original presentation of the software interface. These graphics have not been processed to represent the true state of the actual software. The content presented helps those skilled in the art to more intuitively understand the implementation method of the software using the technical solution of the present invention. The color graphics in the figures do not affect the understanding of the technical solution of the present invention itself.

[0069] The present invention has the following beneficial effects:

[0070] 1) Based on the thermal circuit simulation method, this invention uses the system response function matrix [H(s)] of the electronic device extracted by simulation software and the heat source power {P(t)} set under different application scenarios of the electronic device to simultaneously simulate and calculate the transient temperature {T(t)} of each observation point of the electronic device under a certain application scenario, thereby improving the simulation efficiency.

[0071] 2) This invention uses electronic device model system functions to construct circuit models and applies them to thermal transient simulation, achieving the effect of one extraction and multiple simulations, which greatly shortens the time used for thermal transient simulation in the thermal design of electronic devices, shortens the R&D cycle, and improves product superiority.

[0072] The constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., variations in parameter values, installation arrangements, colors, orientations, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application. For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of the element may be inverted or otherwise changed, and the nature or number or position of discrete elements may be altered or changed. Therefore, all such modifications are intended to be included within the scope of this invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Various corresponding modifications and variations can be made by those skilled in the art according to this invention without departing from the spirit and essence of the invention, but such corresponding modifications and variations should fall within the protection scope of this invention.

Claims

1. A thermal simulation method of an electronic device, characterized by, Includes the following steps: Construct the geometric model of the electronic device; Mesh the geometric model; Set the material parameters and convection boundary conditions for the geometric model; Set temperature observation points and heat sources, with each observation point corresponding to a node in the mesh; Constructing the finite element matrix: Construct the stiffness matrix [K] and mass matrix [M] of the geometric model based on the mesh, material properties and convection boundary conditions of the geometric model, and calculate the load vector {B} based on the heat source; Based on the stiffness matrix [K], mass matrix [M], and load vector {B}, the system response function matrix [H(s)] of the geometric model is obtained through finite element analysis. The system response function matrix [H(s)] is subjected to an inverse Laplace transform to obtain the time-domain system response function matrix [H(t)]. Set the transient power vector {P(t)} for each heat source according to the application scenario; Convolve [H(t)] and {P(t)} to obtain and output the instantaneous temperature {T(t)} at each observation point. 2.The thermal simulation method of an electronic device according to claim 1, wherein, The material parameters include thermal conductivity, density, and specific heat capacity, and the convective boundary conditions include the convective heat transfer coefficient of the outer surface of the geometric model and the fluid environment temperature. 3.The thermal simulation method of an electronic device according to claim 1, wherein, The data for both the stiffness matrix [K] and the mass matrix [M] are stored in the form of sparse matrices. 4.The thermal simulation method of an electronic device according to claim 1, wherein, The transient power vector {P(t)} for each heat source is: where m is the number of groups of heat sources, {P(t)} is an m-dimensional vector, p i (t) is the power function of the i-th group of heat sources. 5.The thermal simulation method of an electronic device according to claim 1, wherein, The formula for calculating the instantaneous temperature {T(t)} at each observation point is: {T(t)}=[H(t)]*{P(t)}. 6.The thermal simulation method of an electronic device according to claim 1, wherein, The instantaneous temperature {T(t)} of each observation point is an n-dimensional vector, n is the number of observation points, and the expression is: 7.The thermal simulation method of an electronic device according to claim 1, wherein, The instantaneous temperature {T(t)} at each observation point is represented by the instantaneous temperature curve of each observation point.

8. A computer device comprising a memory, a processor, and a computer program stored on the memory, wherein the computer program comprises instructions that, when executed by the processor, cause the processor to perform the method of any one of claims 1-7. The processor executes the computer program to implement the thermal simulation method for the electronic device as described in any one of claims 1-7.

9. A computer storage medium having stored thereon a computer program, characterized in that When the computer program is executed by the processor, it implements the thermal simulation method for the electronic device as described in any one of claims 1-7.

10. A computer program product comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the thermal simulation method for the electronic device as described in any one of claims 1-7.

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