Adjustable heat sink structure

Abstract

A heat sink structure is described. The heat sink structure comprises: a base plate, which has a first surface and a second surface, the first surface being thermally coupled to a heat-generating component; a sliding assembly, which is attached to the second surface of the base plate; and at least one heat dissipation element, which is adjustably retained by the sliding assembly. The at least one heat dissipation element has a first end and a second end, wherein the first end is retained such that the at least one heat dissipation element is thermally coupled to the second surface of the base plate, and the second end can dissipate thermal energy. A device further comprising a housing may comprise the heat sink structure, and the housing also accommodates the heat-generating component.

Description

Adjustable heat sink structure Technical Field

[0001] This disclosure relates to devices such as electronic devices having one or more components requiring thermal management. More specifically, this disclosure relates to an adjustable heat sink structure that provides heat transfer / dissipation away from components to which the heat sink structure is connected. Background Technology

[0002] Any background information described herein is intended to introduce the reader to various aspects of the technology that may relate to the embodiments of this disclosure described below. This discussion is intended to help provide the reader with background information to facilitate a better understanding of the various aspects of this disclosure. Therefore, it should be understood that these descriptions should be interpreted in this context.

[0003] Thermal management remains a significant challenge in many devices, particularly electronic devices such as set-top boxes, computers, game consoles, DVD players, and CD players. With the introduction of advanced components that have higher processing power and more functions and tend to generate more heat, efforts to improve thermal management will continue to be an important aspect of product design.

[0004] To address the thermal management challenges of these advanced components within electronic devices, thermally conductive metal structures, known as heat sinks or heat radiators, can be attached to the heat-generating parts. This allows heat to be removed and dissipated into the air space within the housing surrounding the electronic device, and ultimately into the air space outside the housing. These heat sinks or heat radiators are typically pre-formed from metal and / or thermally conductive materials. However, these pre-formed heat sinks and heat radiators often require longer manufacturing times and frequently waste valuable resources, especially when changes are needed after the molding process has begun. Furthermore, these pre-formed designs are not easily adaptable or reusable for other designs and products with different thermal management requirements. Therefore, an improved heat sink structure is needed that can adapt to the diverse and changing thermal management requirements of devices such as electronic equipment.

[0005] Summary of the Invention

[0006] The principles of this disclosure address these and other disadvantages and deficiencies present in electrical or electronic equipment that requires thermal management. However, those skilled in the art will understand that the principles of this disclosure can also provide advantages in other types of devices and systems.

[0007] According to one embodiment, a heat sink structure is described, the heat sink structure comprising: a substrate having a first surface and a second surface, the first surface being thermally coupled to a heat-generating component; a sliding assembly attached to the second surface of the substrate; and at least one heat dissipation element adjustablely held by the sliding assembly, the at least one heat dissipation element having a first end and a second end, the first end being held such that the at least one heat dissipation element is thermally coupled to the second surface of the substrate, and the second end being capable of dissipating heat energy.

[0008] According to one embodiment, an apparatus is described, the apparatus comprising: a housing; a heating element coupled to internal components of the housing; and a heat sink coupled to the heating element. The heat sink further comprises: a substrate having a first surface and a second surface, the first surface being thermally coupled to the heating element; a sliding assembly attached to the second surface of the substrate; and at least one heat dissipation element adjustablely held by the sliding assembly, the at least one heat dissipation element having a first end and a second end, the first end being held such that the at least one heat dissipation element is thermally coupled to the second surface of the substrate, and the second end being capable of dissipating heat energy. Attached Figure Description

[0009] The above and other aspects, features, and advantages of this disclosure will become more apparent when the following detailed description is taken in conjunction with the accompanying drawings, wherein:

[0010] Figure 1 is a block diagram of an exemplary electronic device to which the principles of this disclosure are applicable;

[0011] Figure 2 is a mechanical diagram of a cross-section of an electronic device to which the principles of this disclosure are applicable;

[0012] Figure 3A is a perspective view of an exemplary heat sink structure to which the principles of this disclosure are applicable;

[0013] Figure 3B is a side view of the heat sink structure in Figure 3A to which the principles of this disclosure are applicable;

[0014] Figure 4A is a perspective view of an exemplary heat sink fin used as a part of a heat sink structure to which the principles of this disclosure are applicable.

[0015] Figure 4B is an end view of the heat sink fins in Figure 4A to which the principles of this disclosure are applicable.

[0016] Figure 5A is a perspective view of another exemplary heat sink structure to which the principles of this disclosure are applicable;

[0017] Figure 5B is another perspective view of the heat sink structure in Figure 5A to which the principles of this disclosure are applicable;

[0018] Figure 5C is a bottom view of the heat sink structure in Figure 5A to which the principles of this disclosure are applicable;

[0019] Figure 5D is a side view of the heat sink structure in Figure 5A to which the principles of this disclosure are applicable;

[0020] Figure 5E is a top view of the heat sink structure in Figure 5A to which the principles of this disclosure apply;

[0021] Figure 6A is a top view of an exemplary heat-conducting plate used as part of a heat sink structure to which the principles of this disclosure are applicable.

[0022] Figure 6B is a side view of the heat-conducting plate in Figure 6A to which the principles of this disclosure are applicable;

[0023] Figure 7 is a side view of another exemplary heat sink fin to which the principles of this disclosure are applicable;

[0024] Figure 8 is a side view of another exemplary heat sink structure to which the principles of this disclosure apply;

[0025] Figure 9A is a perspective view of another exemplary heat sink structure to which the principles of this disclosure are applicable;

[0026] Figure 9B is another perspective view of the heat sink structure in Figure 9A to which the principles of this disclosure are applicable;

[0027] Figure 10A is a side perspective view of another exemplary radiator fin used as part of a radiator structure to which the principles of this disclosure are applicable.

[0028] Figure 10B is a perspective view of the heat sink fins in Figure 10A to which the principles of this disclosure are applicable.

[0029] Figure 11 is a perspective view of another exemplary heat sink structure to which the principles of this disclosure are applicable;

[0030] Figure 12A is a side view of another exemplary heat sink fin used as part of a heat sink structure to which the principles of this disclosure are applicable.

[0031] Figure 12B is a perspective view of the heat sink fins in Figure 12A to which the principles of this disclosure are applicable;

[0032] Figure 13 is a perspective view of another exemplary heat sink structure to which the principles of this disclosure apply;

[0033] Figure 14A is a perspective view of another exemplary heat sink structure to which the principles of this disclosure are applicable; and

[0034] Figure 14B is an enlarged view of a portion of the heat sink structure in Figure 14A to which the principles of this disclosure are applicable. Detailed Implementation

[0035] This disclosure is applicable to electronic devices or equipment described as assembly apparatus or devices having multiple walls and a thermal or heat management system or mechanism including one or more heat dissipation elements. This disclosure also relates to solutions for incorporating a thermal management system or mechanism including one or more heat sinks into electronic devices and equipment, particularly in the assembly process of devices and equipment that may have different or varying thermal management requirements.

[0036] This specification illustrates the principles of this disclosure. Therefore, it should be understood that those skilled in the art will be able to design various arrangements that, while not expressly described or shown herein, embody the principles of this disclosure and are included within the scope of the claims.

[0037] All examples and conditional language used herein are intended for educational purposes to help the reader understand the principles of this disclosure and the concepts contributed by the inventors to further the development of the art, and should be interpreted as not limiting the specific examples and conditions cited.

[0038] Furthermore, all statements herein regarding the principles, aspects, and embodiments thereof, as well as specific examples thereof, are intended to cover their structural and functional equivalents. Moreover, such equivalents include both those currently known and those developed in the future, i.e., any element developed that performs the same function, regardless of its structure.

[0039] In embodiments of the invention, any element that directly or indirectly represents or describes a means of performing a particular function is intended to cover any manner in which that function is performed, including, for example: a) a combination of elements performing that function, or b) any mechanism having a combination of electrical or mechanical elements performing that function. The disclosure defined by such claims is that the functions provided by the various said means are combined together and provided in the manner claimed in the claims. Therefore, any means capable of providing these functions can be considered equivalent to those means shown herein.

[0040] This embodiment addresses the problem of using or reusing heat sink or heat radiator structures in multiple devices, such as electronic devices, with different thermal management requirements. Typical heat sinks or heat radiators are usually designed specifically for a set of thermal management requirements. Heat sinks or heat radiators are typically manufactured using low-cost techniques, such as molding or die casting, which not only utilize tooling to manufacture many parts but also incur high costs for creating or modifying the tooling. When thermal management requirements change, or when new or different devices require heat sinks or heat radiators, the heat sinks or heat radiators are redesigned. Different manufacturing tools may be required to manufacture the new heat sinks or heat radiators. This process may be repeated for each new design of a heat sink or heat radiator for different products or for any design change, and each new design incurs tooling costs. The inability to reuse previously created heat sinks or heat radiators reduces efficiency, increases costs, and increases resource consumption.

[0041] To address these issues, the following embodiments describe a heat dissipation structure, such as a radiator or heat diffuser, including adjustable structural portions. The heat dissipation structure includes a first radiator element, referred to as a substrate or heat-conducting plate, formed of a thermally conductive material comprising metals (such as aluminum, copper, steel, etc.) and thermally conductive plastics. The adjustable heat dissipation structure also includes one or more second radiator elements, referred to as radiator fins or convection fins, formed of the same or different thermally conductive material as the first radiator element. Each of the one or more second radiator elements has a portion that contacts and is held on the first radiator element, such that each or more of the second radiator elements can be adjusted relative to the point of contact with the first radiator element. This adjustable holding mechanism may be referred to as a sliding assembly.

[0042] In some embodiments, portions of some or all of the second heat sink elements may be oriented perpendicular to the first heat sink element. Furthermore, in some embodiments, portions of some or all of the second heat sink elements may have portions oriented parallel to or in the same direction as the first heat sink element, some or all of which contact the surface of the first heat sink element. Further, in some embodiments, portions of the second heat sink elements may be used to hold one or more second heat sink elements to the first heat sink element. For example, a portion of each of the one or more second heat sink elements may extend beyond the edge of the remainder of the second heat sink element to engage with a sliding assembly. In this case, the sliding assembly may be a set of side rails along opposite edges. In some embodiments, thermal adhesive, hot putty, or hot grease may also be used to hold one or more second heat sink elements. The use of thermal adhesive, hot putty, or hot grease can also provide a consistent thermal interface between the first and second heat sink elements.

[0043] In some embodiments, a group of second heat sink elements may be included in an adjustable heat dissipation structure. The number of second heat sink elements in this group may be adjustable to meet different thermal management requirements. Furthermore, in some embodiments, the distance between any of the second heat sink elements in this group may be adjustable to meet different thermal management requirements. For example, the spacing between the second heat sink elements may be smaller for heat sink elements located close to heat-generating components or circuitry on the first heat sink element.

[0044] In some embodiments, one or more portions of the second heat sink element oriented perpendicular to the first heat sink element may also have portions oriented in a direction not perpendicular to the first heat sink element, such as shaped or bent portions. Furthermore, one or more of the second heat sink elements may include one or more slots formed in the element, the slots extending at least partially through the height of the element.

[0045] The adjustable heatsink structure described in this disclosure can be reused with a variety of designs and products with different thermal management requirements. The adjustable heatsink structure allows multiple second heatsink elements of different structures to be used with one or more different first heatsink elements, further enhancing modular flexibility. For example, multiple heatsink structures with different numbers and / or positions of second heatsink elements can be created by using nominally low-cost manufacturing techniques, such as mechanical forming and die casting, to create as few as two elements. Furthermore, the configurability and adjustability of the structure can be used to evaluate different thermal management designs for more effective testing during product development, improving development efficiency and reducing costs.

[0046] Turning to Figure 1, which illustrates a block diagram of an exemplary electronic device 100 according to various aspects of this disclosure. In electronic device 100, a wide area network (WAN) is coupled to a WAN transceiver 170 via an antenna 172 or via a direct network interface connection. The WAN transceiver 170 is coupled to a processor 110. The processor 110 is coupled to a memory 190. The processor 110 is also coupled to an audio / video interface 120, a local area network (LAN) transceiver 140, a LAN transceiver 150, and an Ethernet interface 160. The LAN transceiver 140 is coupled to an antenna 142. The LAN transceiver 150 is coupled to antennas 152 and 154. It should be understood that, for simplicity, several components and interconnections required for the complete operation of electronic device 100 are not shown, as the components not shown are well known to those skilled in the art. As shown in the figure, electronic device 100 can operate as a gateway device that connects to a WAN such as a cellular, satellite, microwave, or terrestrial communication network, and also provides an interface to one or more devices used in the home and connected via a wired and / or wireless home network or LAN. In other embodiments, electronic device 100 may be configured to operate as a desktop computer, laptop computer, mobile phone, set-top box, video display device, etc.

[0047] WAN transceiver 170 includes circuitry for performing network RF signal modulation and transmission functions on signals provided to the WAN from electronic device 100 via antenna 172 or a direct network connection, and for performing RF signal tuning and demodulation functions on signals received from the WAN at electronic device 100 via antenna 171 or a direct network connection. The RF modulation and demodulation functions are the same as those commonly used in communication systems such as cable, satellite, digital subscriber line, or air-to-ground systems. It is important to note that in some embodiments, WAN transceiver 170 may be referred to as a tuner, even though a tuner may also include modulation and transmission circuitry and functions. Processor 110 receives demodulated network communication signals from WAN transceiver 170 and provides WAN transceiver 170 with any data or content formatted for network transmission for modulation and transmission over an external network. WAN transceiver 170 may also include circuitry for signal conditioning, filtering, and / or signal conversion (e.g., optical-to-electrical signal conversion). Antenna 172 may be any type of antenna suitable for transmitting and / or receiving signals within one or more frequency ranges used by the WAN. In some embodiments, as shown, the antenna 172 may be located outside the structure of the electronic device 100, rather than inside it.

[0048] Memory 190 supports content and data processing and IP functions in processor 110, and also serves as a storage for applications, programs, control code, and media content and data information. Memory 190 may include one or more of the following storage elements, including but not limited to RAM, ROM, electrically erasable programmable ROM (EEPROM), and flash memory. Memory 190 may also include one or more integrated memory elements, including but not limited to magnetic media hard disk drives and optical media hard disk drives. Digital content and / or data stored in memory 190 can be retrieved, processed, and provided by processor 110 to one or more of audio / video interfaces 120, LAN transceivers 140 and 150, Ethernet interface 160, and WAN transceiver 170. Furthermore, digital content can be provided to processor 110 from one or more of audio / video interfaces 120, LAN transceivers 140 and 150, Ethernet interface 160, and WAN transceiver 170, and stored by processor 110 in memory 190.

[0049] The audio / video interface 120 allows connection to audio / video playback devices, such as the aforementioned television display devices or other media devices, such as set-top boxes. The audio / video interface 120 may include additional signal processing circuitry, including but not limited to digital-to-analog converters, signal filters, digital and / or analog signal format converters, modulators, demodulators, etc. The audio / video interface 120 also includes one or more physical connectors for connection to the audio / video playback device using one or more different types of audio / video connection cables. These physical connectors may include, but are not limited to, RCA or telephone type connectors, HDMI connectors, Digital Video Interface (DVI) connectors, Sony / Philips Digital Interface (S / PDIF) connectors, Toshiba Toslink connectors, and F-type coaxial connectors.

[0050] Ethernet interface 160 allows connection to external devices compliant with IEEE 802.3 or similar communication protocols, such as computers, tablets, etc. Ethernet interface 160 includes an RJ-45 physical interface connector or other standard interface connectors to allow connection to external local computers or other Ethernet-connected devices.

[0051] LAN transceiver 140, together with antenna 142, and LAN transceiver 150, together with antennas 152 and 154, provide wireless communication interfaces for other devices in a home network or LAN. LAN transceiver 140 and LAN transceiver 150 may include various electronic circuits for receiving signals and transmitting signals to other devices via antennas 142 and 152, 154, respectively. These various electronic circuits may include, but are not limited to, antenna switches, signal amplifiers, signal counters, frequency converters, modulators, demodulators, and transmission processors. LAN transceiver 140 and LAN transceiver 150 may operate using the same or different wireless communication protocols. In some embodiments, LAN transceiver 150 may communicate with other wireless devices via antennas 152 and 154 using the IEEE 802.11 protocol, which utilizes the 2.4-2.5 GHz (2.4 GHz ISM band) and / or 5.150-5.85 GHz (5 GHz band) frequency range. LAN transceiver 140 can also communicate with other wireless devices via antenna 142 using the Zigbee protocol. It is important to note that in other embodiments, LAN transceiver 140 and LAN transceiver 150 can be configured to operate using other wireless communication protocols, such as Thread, Bluetooth, Z-Wave, and Wi-Fi.

[0052] Processor 110 also provides a communication interface between data provided to and received from the WAN via WAN transceiver 170 and data provided to and received from the LAN via LAN transceiver 140, LAN transceiver 150, and / or Ethernet interface 160. Further, processor 110 can be configured to perform any transcoding of data between the WAN and LAN, and necessary audio / video signal decoding of signals provided via audio / video interface 120. Additionally, processor 110 receives input from a user via user interface 180 and transmits this input to other components in electronic device 100. The processor also receives information from other components in electronic device 100 and provides output information to the user via user interface 180. Processor 110 may be a programmable microprocessor that can be reconfigured using downloadable instructions or software code stored in memory 190. Alternatively, processor 110 may be a specially programmed controller and data processor with internal control code for controlling, managing, and processing all functions and data in electronic device 100.

[0053] It is worth noting that one or more of the elements described in electronic device 100 can be implemented as integrated circuits (ICs). These ICs, along with other electronic components used in electronic device 100, can generate significant amounts of heat due to their power consumption during operation. In some embodiments, one or more of the elements can be combined into a single IC. For example, processor 110, WAN transceiver 170, Ethernet interface 160, LAN transceiver 140, and LAN transceiver 150 can be combined into a single IC, referred to as a system-on-a-chip (SoC). Similar to those described herein, an SoC may consume more than 5W of power, converting most of its electrical energy into heat. If this heat is not removed from the area surrounding the SoC, its presence can raise the SoC's ambient operating temperature, potentially leading to a degradation in performance.

[0054] To maintain the operational performance of the electronic device 100 in the event of heat generation by components (including the aforementioned SoC) used to implement the described electronic device 100, a thermal management structure is attached to one or more of the components. This structure is used to remove and / or dissipate the heat generated by these components during operation of the electronic device 100. The structure includes a first element mechanically and thermally coupled to the components. A first thermally conductive element transfers the heat generated in the components. The heat sink also includes a second element mechanically and thermally coupled to the first element. The second element is configured to dissipate the heat conducted through the first element. For example, the second element may transfer heat to the air inside and / or outside the electronic device 100. The second element may also include a portion that is adjustable in position and / or orientation relative to the second element and the position or orientation of the first element. In some embodiments, one or both of the first and second elements may be constructed using a metallic material with heat transfer capabilities. Examples of metallic materials include, but are not limited to, copper, brass, aluminum, steel, etc. In some embodiments, one or both of the first and second elements may be constructed using a non-metallic material with heat transfer capabilities. Examples of non-metallic materials include, but are not limited to, acrylonitrile-butadiene-styrene (ABS), polybutylene terephthalate (PBT), liquid crystal polymer (LCP), polyphenylene sulfide (PPS), polycarbonate, nylon, etc. The first and second elements can also be formed using mechanical forming processes applied to the sheet, such as cutting, bending, and shaping, or by casting processes, such as die casting.

[0055] It is worth noting that the thermal conductivity of non-metallic materials is generally lower than that of metallic materials. For example, the thermal conductivity of aluminum is approximately 200 watts per meter-degree Kelvin (W / m-°K), while that of LCP is 1 W / m-°K. In some embodiments, the material used for the first element may differ from the material used for the second element. For example, the first element may be aluminum, and the second element may be copper. In another example, the first element may be aluminum, and the second element may be a combination of copper and PBT. Embodiments of a heat dissipation thermal management structure configurable for removing heat energy, used in devices such as electronic device 100, will be described in more detail below.

[0056] Turning now to Figure 2, which shows a mechanical view of a cross-section of an electronic device 200 according to various aspects of this disclosure. The electronic device 200 can operate in a manner similar to the electronic device 100 described in Figure 1. The electronic device 200 includes a housing 210. The surface of the housing 210 includes vents 215a-215f that allow air to pass between the interior and exterior of the electronic device 200. As shown, vents 215a and 215d are shown on opposing vertical surfaces. Vents 215b and 215c are shown on the top surface, and vents 215e and 215f are shown on the bottom surface. Vents 215a-215f may be formed as slots or holes on the surface of the housing 210. In other embodiments, more or fewer vents may be included, and the arrangement of the vents and / or ventilation openings may vary.

[0057] Electronic device 200 also includes printed circuit board 220. Multiple electronic components are electrically coupled using conductive traces formed on the surface of printed circuit board 220. Two ICs, 225a and 225b, are mounted to the top surface of printed circuit board 220. IC 225a may be a SoC as described above, containing circuitry for several of the components in the boxes depicted in FIG. 1. In one embodiment, IC 225a includes a WAN transceiver similar to WAN transceiver 170, a processor similar to processor 110, and at least one LAN transceiver similar to LAN transceiver 140 and / or LAN transceiver 150. IC 225b may be used as part of a memory component similar to memory 190. As shown, other components, such as resistors, capacitors, inductors, etc., may also be mounted on printed circuit board 220. These other components, along with ICs 225a and 225b, are electrically coupled using conductive traces formed on the top and / or bottom surfaces of printed circuit board 220. Furthermore, in some embodiments, additional components may be mounted to the bottom surface of printed circuit board 220. Overall, the printed circuit board 220, ICs 225a and 225b, and other components mounted on the printed circuit board 220 form a printed circuit assembly.

[0058] Electronic device 200 also includes a heat sink structure 230. The heat sink structure 230 is thermally coupled to the top surface of IC 225a. The heat sink 230 can use a thermally conductive liquid compound, such as thermal grease or hot paste, or a non-conductive thermal pad, such as SIL. or GAP Thermal coupling is performed. In some embodiments, the heat sink 230 may be thermally coupled using a phase change thermal pad. The phase change thermal pad is configured to absorb latent heat. When the phase change thermal pad absorbs heat, it begins to change phase to liquid, thus cooling it. This cooling effect is intended to reduce the rate of temperature rise of the heat-generating component. In some embodiments, an adhesive, such as thermal adhesive, may also be used to secure the heat sink structure to the IC 225a. In some embodiments, the heat sink assembly 230 may include mechanisms for attaching or securing to a printed circuit board 220 (not shown) to hold the heat sink assembly 230 in place and maintain contact between the heat sink assembly 230 and the IC 225a. Examples of attachment mechanisms include, but are not limited to, spring clip type fasteners, compression spring type fasteners, and screw and nut type fasteners.

[0059] The heat sink structure 230 includes a first portion oriented parallel to the surface of IC 225a and a second portion coupled to the first portion and including a set of elements oriented perpendicular to the surface of IC 225a. As described above, the first and second portions are made or formed using metallic or non-metallic materials, respectively. Each of the elements in the second portion is detachably and adjustably coupled and mechanically held to the first portion. Each of the second elements can be adjusted in terms of its position relative to each other and its position or location on the first portion of the heat sink structure 230. For example, each of the second elements can be adjusted in terms of its position relative to each other and its position or location on the first portion of the heat sink structure 230 using a sliding assembly. Further details regarding a heat sink structure with adjustable second elements using a sliding assembly will be described below.

[0060] The thermal coupling between the heat sink structure 230 and the integrated circuit 225a allows heat generated in the IC 225a to dissipate as part of a conduction and convection process. The heat generated by the IC 225a is conducted to a first portion of the heat sink structure 230, parallel to the IC 225a, initially warming the area around the contact region between the heat sink structure 230 and the IC 225a. Therefore, the first portion of the heat sink structure 230 can be referred to as a heat-conducting section or heat-conducting plate. Heat is conducted away from the contact region towards a cooler portion of the heat sink structure 230, which includes a set of vertically oriented elements (i.e., elements perpendicular to the IC 225a) comprising a second portion. These vertical elements comprising the second portion of the heat sink structure 230 can be referred to as convection fins, heat sink fins, or fins. Due to heat transfer from the heat-conducting plate, the temperature of the convection fins rises, and the heat is transferred to the cooler ambient air through natural convection between the surface area of ​​the convection fins and the air. The shape and position of these fins significantly influence how the radiator structure transfers heat, while the size and number of fins determine its efficiency. As shown in Figure 2, the radiator structure 230 includes 10 convection fins with a rectangular shape that extend almost the entire height of the housing 210. In other embodiments, different arrangements may be used, including different sizes and shapes of the heat-conducting plates and convection fins.

[0061] It is worth noting that portions of heat sink structure 230 and other heat sink structures described below have horizontally oriented heat-conducting plates. Therefore, these heat sink structures are primarily used in horizontally oriented electronic devices, such as electronic device 200, where height is the minimum dimension. The principles of this embodiment can also be applied to heat sink structures with heat-conducting plates of different orientations, such as vertical orientation, which can be used in vertically oriented electronic devices where width is the minimum dimension. In some embodiments, a heat sink with a vertically oriented heat-conducting plate and applying the principles of this embodiment can also be used in horizontally oriented electronic devices, and vice versa. Furthermore, electronic device 200 is shown as having a heat sink structure thermally coupled to a heat-generating component (integrated circuit). In other embodiments, a heat sink structure may be thermally coupled to additional heat-generating components, such as IC 225b, and / or may include additional heat sink structures thermally coupled to one or more additional heat-generating components.

[0062] Turning now to Figures 3A-3B, which illustrate a set of schematic diagrams of an exemplary heat sink structure 300 according to various aspects of this disclosure. The heat sink structure 300 may be included as part of an electronic device, such as electronic device 200 described in Figure 2 or electronic device 100 described in Figure 1, and is used to extract and / or dissipate heat energy or heat from one or more heat-generating components that are part of the electronic device. More specifically, in some embodiments, the heat sink structure 300 may be used in conjunction with one or more integrated circuits, such as integrated circuits 225a and / or 225b described in Figure 2, configured to perform various functions in the electronic device. In some cases, the heat sink structure 300 may be referred to as a heat dissipator or simply a heat sink. For reference purposes, Figure 3A shows a perspective view taken from the apex corner of the heat sink structure 300. Figure 3B shows a side view taken along the length of the heat sink structure.

[0063] It should be understood that, for the sake of simplicity, some components and elements required for the full functionality of the heat sink structure 300 in an electrical or electronic device, including those described above, are not shown because some of these unshown components and elements are well known to those skilled in the art. Furthermore, not all components of the heat sink structure 300 can be shown in every figure in Figures 3A-3B. However, when the same component of the heat sink structure 300 is shown in more than one figure in Figures 3A-3B, the same reference numerals are used.

[0064] The heat sink assembly 300 includes a first element 310, referred to as a heat-conducting plate, which serves as a heat-conducting element in a manner similar to that described above. The heat-conducting plate 310 includes a top surface 315, on which a set of second elements 350a-350i, referred to as convection fins, are located. The convection fins 350a-350i serve as heat dissipation elements in a manner similar to that described above. Each of the convection fins 350a-350i has a first portion in contact with the top surface 315 and a second portion extending outward in a direction away from the top surface 315. The first portion of each of the convection fins 350a-350i may partially or completely contact the top surface 315, providing heat transfer through conduction between the heat-conducting plate 310 and the convection fins 350a-250i. The heat-conducting plate 310 also includes a first side rail 320 and a second side rail 325 for holding and securing the convection fins 350a-350i to the heat-conducting plate 310. The first side rail 320 and the second side rail 325 have a first portion that extends substantially perpendicularly from the top surface 315 along the opposite side edges of the heat-conducting plate 310 in the direction of the convection fins 350a-350i. The first side rail 320 and the second side rail 325 also have a second portion that extends inwardly toward a second portion of the convection fins 350a-350i from the edge of the first portion and is substantially perpendicular to the first portion. The first side rail 320 and the second side rail 325, together with the opposite side edges of the heat-conducting plate 310, form a U-shaped channel for retaining the edge of each of the convection fins 350a-350i.

[0065] As shown in Figures 3A-3B, the heat-conducting plate 310 is rectangular or cuboid in shape, with a length of 160.0 mm, a width of 160.0 mm, and a total height of 9.0 mm. The material thickness for the heat-conducting plate 310 is 3.0 mm. In other embodiments, the shape and / or size of the heat-conducting plate 310 may be different. Furthermore, the first portion of each of the convection fins 350a-350i is a rectangle extending across the width of the heat-conducting plate, with a length of 12.5 mm, a width of 152.0 mm, and a material thickness of 2.9 mm. The second portion of each of the convection fins is also a rectangle extending beyond or near the second portion of the first side rail 320 and the second side rail 325. The second portion has a width of 138.0 mm, a height of 25.0 mm, and a material thickness of 2.5 mm. Each of the convection fins 350a-350i is uniformly spaced along the length of the heat-conducting plate 310. In other embodiments, different numbers of convection fins may be used depending on design requirements, and each or all of the convection fins may have different dimensions. Furthermore, in some embodiments, one or more of the convection fins may use different shapes, and the spacing between the convection fins may vary. Additional aspects concerning heat-conducting plates and convection fins similar to heat-conducting plate 310 and convection fins 350a-350i will be described in more detail below.

[0066] Turning now to Figures 4A-4B, which show a set of diagrams illustrating exemplary heat sink fins 400 according to various aspects of this disclosure. Heat sink fins 400 may be included as part of a heat sink structure, such as the heat sink structure 300 described in Figure 3. More specifically, in some embodiments, heat sink fins 400 may be configured and used as one or more of the aforementioned convection fins, such as convection fins 350, etc. For reference purposes, Figure 4A shows a perspective view taken from the apex of heat sink fin 400, and Figure 4B shows an end view taken along the width of heat sink fin 400. It should be understood that not all elements of heat sink fin 400 can be shown in each of Figures 4A-4B. However, when the same element of heat sink fin 400 is shown in more than one of the figures in Figures 4A-4B, the same reference numerals are used.

[0067] The heat sink fins 400 include a first element 460 called a thermal interface. The thermal interface 460 provides mechanical contact between the top surface of the heat-conducting plate, such as the top surface 315 in FIG. 3, and the bottom surface 461 of the heat sink fins 400. This mechanical contact ensures thermal transfer between the heat-conducting plate and the heat sink fins 400. In some embodiments, the bottom surface 461 may be formed and / or profiled to mechanically contact the heat-conducting plate over its entire area. Notably, in some embodiments, only a portion of the bottom surface 461 may mechanically contact the heat-conducting plate.

[0068] The radiator fins 400 also include a second element 470 called a convection interface. The convection interface 470 is configured to transfer heat, or thermal energy, conducted through the thermally conductive interface 460 to the air surrounding the radiator fins. As shown, the convection interface 470 is mechanically coupled to the thermally conductive interface 460 along a centerline between the two longer edges of the thermally conductive interface 460 (i.e., along its width). The convection interface 470 also extends outward at a right angle to the planar orientation of the thermally conductive interface 460. In other embodiments, the convection interface 470 may be mechanically coupled to the thermally conductive interface in different ways or configurations, and may also extend outward at a non-right-angle angle.

[0069] The thermal interface 460 also includes retaining flanges 465 and 466. Retaining flanges 465 and 466 extend outward from the end of the thermal interface 460, across the edge of the convection interface 470, and oriented along the plane of the thermal interface 460. In this way, retaining flanges 465 and 466 are configured to fit into a U-shaped channel structure formed by side rails, such as side rails 320 and 325, included on the thermal interface plate. Retaining flanges 465 and 466 provide a retaining mechanism for the heat sink fins 400, holding the fins in the appropriate orientation for normal operation with the thermal interface plate (e.g., thermal interface plate 310 in FIG. 3), while still allowing the heat sink fins 400 to be positioned at different locations within the span of the thermal interface plate, as described above. The retaining flanges may include additional features, such as small notches or raised edges (not shown), to provide mechanical force against the side rails after the heat sink fins 400 are correctly positioned and to prevent or minimize undesirable movement of the heat sink fins 400.

[0070] Turning now to Figures 5A-5E, which illustrate a set of diagrams of another exemplary heat sink structure 500 according to various aspects of this disclosure. The heat sink structure 500 may be included as part of an electrical or electronic device (such as electronic device 200 described in Figure 2 or electronic device 100 described in Figure 1, etc.) and used to extract and / or dissipate heat energy or heat from one or more heat-generating components that are part of the electrical or electronic device. More specifically, in some embodiments, the heat sink structure 500 may be used in conjunction with one or more integrated circuits or SoCs, such as integrated circuits 225a and / or 225b, etc., described in Figure 2, configured to implement various functions in an electronic device. For reference purposes, Figure 5A shows a perspective view of the heat sink structure 500 taken from its apex, and Figure 5B shows a side view taken along the length of the heat sink structure 500. Figure 5C shows a perspective view of the heat sink structure 500 taken from its bottom corner. Therefore, the heat sink 500 shown in Figure 5C is inverted relative to the nominal horizontal direction shown in Figures 5A and 5B to better illustrate one or more features described in this embodiment. Figure 5D shows a side view taken along the width of the heat sink structure 500, and Figure 5E shows a top view of the heat sink structure 500. It is worth noting that not all components of the heat sink structure 500 can be shown in every one of Figures 5A-5E. However, when the same component of the heat sink structure 500 is shown in more than one figure in Figures 5A-5E, the same reference numerals are used.

[0071] The radiator structure 500 includes a heat-conducting plate 510 having a top surface 515 and side rails 520 and 525, configured similarly to the heat-conducting plate 310 described for the radiator assembly 300 in FIG. 3. The heat-conducting plate 510 also includes a bottom surface 530 (shown only in FIG. 5C), a portion of which provides a mechanical contact interface to the outer surface of the heat-generating component. In some embodiments, the bottom surface 530 may directly contact the surface of the component. Alternatively, the bottom surface 530 may indirectly contact the surface of the component via a thermal interface element in a manner similar to that described in FIG. 2 above. The radiator structure 500 also includes a set of seven convection fins 550a-550g, configured and arranged similarly to the radiator fins 400 described in FIG. 4 above.

[0072] Furthermore, the heat-conducting plate 510 includes an interface channel 517. The interface channel 517 is formed by cutting off a portion along the top surface 615 or forming a void region. The interface channel 517 can be used in conjunction with the application of thermal interface elements to ensure thermal coupling between the heat-conducting plate 510 and the convection fins 550a-550g. Examples of usable thermal interface elements include, but are not limited to, thermal paste, thermal putty, and thermal adhesive. As part of the assembly of the radiator structure 500, a certain volume of thermal interface elements is placed in the interface channel 517 before the convection fins 550a-550g are attached to the heat-conducting plate 510. When each of the convection fins 550a-550g is attached to the heat-conducting plate 510, the thermal interface elements ensure contact between the convection fins 550a-550g and the heat-conducting plate 510, thereby transferring heat energy through thermal conduction. It is also worth noting that, instead of or in conjunction with the thermal interface elements applied to the interface channel, a certain amount of thermal interface elements can also be applied directly to the top surface 515.

[0073] Turning now to Figures 6A-6B, which illustrate a set of diagrams of an exemplary heat-conducting plate 600 according to various aspects of this disclosure. The heat-conducting plate 600 may serve as a heat sink structure, including portions of heat sink structure 300 as described in Figure 3 or heat sink structure 500 as described in Figures 5A-5E. More specifically, in some embodiments, the heat-conducting plate 600 may be configured as and used as one or more of heat-conducting plates as described above, such as heat sink 310 or heat sink 510. For reference purposes, Figure 6A shows a top view of the heat-conducting plate 600, and Figure 6B shows a side view along the width of the heat-conducting plate 600. It is noteworthy that both Figures 6A and 6B show the heat-conducting plate 600 oriented vertically rather than horizontally. However, Figures 6A and 6B will describe the relative orientation and dimensions of each of the elements as if they were oriented horizontally, in order to maintain consistency with all other embodiments described in this disclosure. It should also be understood that not all elements of the heat-conducting plate 600 may be shown in each of Figures 6A-6B. However, when the same element of the heat-conducting plate 600 is shown in more than one of the figures in Figures 6A-6B, the same reference numerals are used.

[0074] The heat-conducting plate 600 includes a top surface 615, a bottom surface 630, and side rails 620 and 625, configured similarly to the heat-conducting plate 310 described for the heat sink assembly 300 in FIG. 3. Side rails 620 and 625 each include first portions 621 and 626, configured to extend away from the bottom surface in a direction perpendicular to the top surface of the heat-conducting plate 600. The side rails also include second portions 622 and 627, configured to extend inwardly toward convection fins (e.g., convection fins 350a-350i) from the upper edges of the first portions 621 and 626 in a direction parallel to the top surface 615. The first portions 621 and 626, and the second portions 622 and 627, together with the edges of the heat-conducting plate 600, form channels for retaining any convection fins attached to the heat-conducting plate 600. As shown in the figure, the lengths of the first portions 621 and 626 are equal to the length of the heat-conducting plate (e.g., 160.0 mm), and the height is 3.0 mm. The lengths of the second portions 622 and 627 are also equal to the length of the heat-conducting plate, and the width is 10.0 mm. In other embodiments, the first portions 621 and 626 and / or the second portions 622 and 627 may have different dimensions, including not extending the entire length of the heat-conducting plate, and may also be oriented at angles other than perpendicular to and / or parallel to the top surface 615.

[0075] The heat-conducting plate 600 also includes an interface channel 617, which can be configured to receive additional thermal interface elements for use in conjunction with one or more convection fins (e.g., convection fins 550a-550g described in FIG. 5). Alternatively, the interface channel 617 can be configured to mechanically interface with the bottom surface of one or more convection fins to provide positional stability, rotational adjustability, and / or additional holding force for the convection fins. The interface rib 617 is shown in FIG. 6A as a rectangular cutout in the top surface 615 extending across the entire length of the heat-conducting plate 600, with a width equal to 16.0 mm and a depth equal to 0.4 mm. In other embodiments, other shapes and / or other dimensions may be used, including those that do not extend across the entire length of the heat-conducting plate 600.

[0076] Turning now to Figure 7, which shows a schematic diagram of another exemplary heat sink fin 700 according to various aspects of this disclosure. The heat sink fin 700 may be included as part of a heat sink structure, such as one or more of the heat sink structures described in this disclosure. For reference, Figure 7 shows a side view along the width of the heat sink fin 700.

[0077] The heat sink fin 700 includes a thermally conductive interface 760, a convection interface 770, and retaining edges 765 and 766, configured similarly to those shown for the heat sink fin 400 in Figures 4A-4B. The heat sink fin 700 also includes interface ribs 768 extending from the bottom surface 761 of the thermally conductive interface 760. The interface ribs 768 are configured to fit within interface channels, such as interface channel 417. The use of interface ribs 768 and interface channels provides additional stability and retaining force to the heat sink fin 700 and provides some angular adjustability for the position of the convection fins. In some embodiments, the interface ribs 768 may be rectangular, extending the length of the convection fin 700 and having a width corresponding to the width dimension of the interface channel. In other embodiments, the interface ribs 768 may be circular or elliptical, with a radius corresponding to the width dimension of the interface channel. The circular or elliptical shape allows the heat sink fins 700 to have a pivot point for holding, while also allowing the heat sink fins 700 to rotate freely relative to the heat-conducting plate (e.g., the heat-conducting plate 510 described in Figures 5A-5E). In other embodiments, different shapes and / or different sizes may be used.

[0078] Turning now to Figure 8, which illustrates a schematic diagram of another exemplary heat sink structure 800 according to various aspects of this disclosure. The heat sink structure 800 may be included as part of an electrical or electronic device, such as electronic device 200 described in Figure 2 or electronic device 100 described in Figure 1, and is used to extract and / or dissipate heat energy or heat from one or more heat-generating components that are part of the electrical or electronic device. More specifically, in some embodiments, the heat sink structure 800 may be used in conjunction with one or more integrated circuits or SoCs, such as integrated circuits 225a and / or 225b described in Figure 2, configured to perform various functions in an electronic device. For reference, Figure 8 shows a side view taken along the width of the heat sink structure 800.

[0079] The radiator structure 800 includes a heat-conducting plate 810 with side rails 820 and 825, configured similarly to the heat-conducting plate 410 described for use in the radiator structure 800 in Figures 4A-4E. The radiator structure 800 also includes mounting elements 840a and 840b, configured similarly to those described above in Figure 6B. The radiator structure 800 also includes convection fins 850 with conductive elements 860 and convection elements 870, configured and arranged similarly to the radiator fins 700 in Figure 7 above. The conductive element 860 includes retaining flanges 865 and 866 positioned within a U-shaped channel formed by the side rails 820 and 825. The conductive element 860 also includes an interface rib 868 adapted to an interface channel 817 included on the heat-conducting plate 810. As described above, the interface ribs 768 on the convection fins 850 are adapted to the interface channels 817 on the heat-conducting plate 810, providing additional stability and holding force for the convection fins 850, and providing a certain degree of angular adjustability for the position of the convection fins.

[0080] It is worth noting that although only one convection fin 850 is shown in the radiator structure 800, more convection fins can be used and can be configured and / or arranged in any of the ways described in the various embodiments of this disclosure.

[0081] The heat sink structure 800 also includes mounting elements 840a and 840b, referred to as mounting bosses. Mounting bosses 840a and 840b extend downward from the bottom surface of the heat-conducting plate 810 to mount the heat sink structure to another surface, such as a printed circuit board (e.g., printed circuit board 220 in FIG. 2) or a wall of a housing or enclosure (e.g., housing 210) that is part of an electronic device. Mounting bosses 840a and 840b can be mounted to the printed circuit board or housing using attachment elements such as screws, rivets, or tacks. As shown, the heat sink structure 800 includes two mounting bosses, one on each side of the heat-conducting plate 810. In other embodiments, more or fewer mounting bosses may be used, and they may be located in different positions.

[0082] Turning now to Figures 9A-9B, which illustrate a set of diagrams of another exemplary heat sink structure 900 according to various aspects of this disclosure. The heat sink structure 900 may be included as part of an electrical or electronic device, such as electronic device 200 described in Figure 2 or electronic device 100 described in Figure 1, and is used to extract and / or dissipate heat energy or heat from one or more heat-generating components that are part of the electrical or electronic device. More specifically, in some embodiments, the heat sink structure 900 may be used in conjunction with one or more integrated circuits or SoCs, such as integrated circuits 225a and / or 225b described in Figure 2, configured to perform various functions in an electronic device. For reference purposes, Figure 9A shows a perspective view of the heat sink structure 900 from its top side, and Figure 9B shows a perspective view of the top corner of the heat sink structure 900. It is noteworthy that not all elements of the heat sink structure 900 may be shown in each of Figures 9A-9B. However, when the same element of the heat sink structure 900 is shown in more than one of the figures in Figures 9A-9B, the same reference numerals are used.

[0083] The radiator structure 900 includes a heat-conducting plate 910 with side rails 920 and 925, configured in a similar manner to the aforementioned heat-conducting plate. The radiator assembly 900 also includes a set of nine convection fins 950a-950i, configured and arranged such that the spacing between the fins is non-uniform. More specifically, the spacing between convection fins 950a and 950b differs from the spacing between convection fins 950b and 950c. Furthermore, the spacing between convection fins 950c and 950d differs from the spacing between convection fins 950b and 950c or the spacing between convection fins 950a and 950b. This ability to adjust the spacing between the convection fins allows the radiator structure to be configured to provide maximum heat dissipation performance where needed, based on the characteristics of the heat-generating components. For example, the radiator structure 900 can be coupled to a heat-generating component at a point near the center of the radiator structure 900. As shown in convection fins 950c and 950d, by adjusting the spacing between the convection fins to be closer together, additional heat dissipation capacity can be concentrated on this area of ​​the heat-conducting plate 910. As shown in convection fins 950a and 950b, points farther from the heat-generating components may require less heat dissipation capacity and can utilize a wider spacing between the convection fins. The configuration of the heat sink structure shown and described herein allows for flexibility in the placement and density of the convection elements to adjust the performance of the thermal structure as needed.

[0084] As shown in Figure 9B, the heat sink structure 900 also includes mounting bosses 940a and 940b similar to those described in Figure 8. Mounting bosses 940a and 940b are shown as being diagonally positioned at two corners of the heat-conducting plate 910. In other embodiments, the mounting bosses may be located in other positions, and there may be more or fewer mounting bosses.

[0085] Turning now to Figures 10A-10B, which show a set of diagrams illustrating another exemplary heat sink fin 1000 according to various aspects of this disclosure. The heat sink fin 1000 may be included as part of a heat sink structure, such as any of the heat sink structures described above. For reference purposes, Figure 10A shows a side view taken along the width of the heat sink fin 1000, and Figure 10B shows a perspective view taken from the apex corner of the heat sink fin 1000.

[0086] The heat sink fin 1000 includes a thermally conductive interface 1060 with retaining flanges 1065 and 1066 and a convection interface 1070, configured similarly to the heat sink fin 400 described in Figures 4A-4B. Unlike the previous embodiments, the convection interface 1070 is mechanically coupled to the thermally conductive interface 1060 along one of its two longer edges (i.e., along its width). In this way, the mechanical interface between the thermally conductive element 1060 and the convection interface 1070 can be formed using mechanical bending forces instead of die casting. Furthermore, the convection interface 1070 also includes upper retaining flanges 1075 and 1076 that extend outward from the edge of the convection interface 1070 beyond a portion of each side rail of the heat-conducting plate (e.g., side rails 520 and 525 on the heat-conducting plate 510 in Figures 5A-5E). Each upper retaining flange 1075 and 1076 also includes upper lips 1077 and 1078, respectively. Furthermore, retaining flanges 1065 and 1066 also include lower lips 1067 and 1068, respectively. Lower lips 1067 and 1068, together with upper lips 1077 and 1078, provide a mechanical interface with the upper portion of the side rails of the heatsink plate. When the heatsink fins are attached to the heatsink plate, for example, heatsink plate 510, the additional mechanical interface further stabilizes and retains the heatsink fins 1000.

[0087] As shown in the figure, the first portion extends upward from the surfaces of retaining flanges 1065 and 1066 in a direction perpendicular to those surfaces. Each of the lower lips 1067 and 1068 also includes a second portion extending from the upper edge of the first portion in a direction parallel to the surfaces of retaining flanges 1065 and 1066. Furthermore, upper lips 1077 and 1078 extend from the lower edges of the upper retaining flanges 1075 and 1076 in the same direction as the second portion of the lower lips 1067 and 1068, and parallel to the surfaces of the retaining flanges 1065 and 1066, respectively. In other embodiments, one or more of the lower lips 1067 and 1068 and the upper lips 1077 and 1078 may be omitted. Additionally, the upper lips 1077 and 1078 may extend in a direction opposite to the direction of the second portion of the lower lips 1067 and 1068.

[0088] Turning now to Figure 11, which illustrates a schematic diagram of another exemplary heat sink structure 1100 according to various aspects of this disclosure. The heat sink structure 1100 may be included as a part of an electrical or electronic device, such as electronic device 200 described in Figure 2 or electronic device 100 described in Figure 1, and is used to extract and / or dissipate heat energy or heat from one or more heat-generating components that are part of the electrical or electronic device. More specifically, in some embodiments, the heat sink structure 1100 may be used in conjunction with one or more integrated circuits or SoCs, such as integrated circuits 225a and / or 225b described in Figure 2, which are configured to implement various functions in an electronic device. For reference, Figure 11 shows a perspective view of the heat sink structure 1100 as seen from its apex.

[0089] The radiator structure 1100 includes a heat-conducting plate 1111 with side rails 1120 and 1125, configured in a manner similar to that of the heat-conducting plate 510 described in Figures 5A-5E or the heat-conducting plate 610 described in Figure 6. The radiator structure 1100 also includes a set of convection fins 1150a-1150i, each convection fin configured and arranged in a manner similar to that of the radiator fins 1000 described in Figures 10A-10B. Each convection fin 1150a-1150i includes an upper retaining flange as well as an upper lip and a lower lip to provide further stability and retaining force when coupled to the heat-conducting plate 1110.

[0090] Turning now to Figures 12A-12B, which show a set of diagrams of another exemplary heat sink fin 1200 according to various aspects of this disclosure. The heat sink fin 1200 may be a portion of a heat sink structure, such as any of the heat sink structures described above. For reference purposes, Figure 12A shows a side view taken along the width of the heat sink fin 1200, and Figure 12B shows a perspective view taken from the apex corner of the heat sink fin 1200. It is noteworthy that not all elements of the heat sink fin 1200 can be shown in each of Figures 12A-12B. However, when the same element of the heat sink fin 1200 is shown in more than one of the figures in Figures 12A-12B, the same reference numerals are used.

[0091] The radiator fins 1200 include a thermally conductive interface 1260 having retaining flanges 1265 and 1266 and lower lips 1267 and 1268, configured in a manner similar to that described in Figures 10A-10B. Notably, the lower lips 1267 and 1268 do not include a second portion extending outwardly parallel to the retaining flanges as shown in Figures 10A-10B. Furthermore, the radiator fins 1200 include a convection interface 1270 having upper retaining flanges 1275 and 1276 and upper lips 1277 and 1278, configured in a manner similar to that described in Figures 10A-10B. Further noteworthy is that the upper retaining flanges 1275 and 1276 extend upward to the upper edge of the convection interface 1270.

[0092] Upper lips 1277 and 1278 also include retaining elements 1281 and 1282 (shown only in FIG. 12B). Retaining elements 1281 and 1282 provide a mechanism for more securely attaching and / or retaining the heat sink fins 1200 to a heat-conducting plate, such as the heat-conducting plate 510 described in FIGS. 5A-5E. In some embodiments, retaining elements 1281 and 1282 may be grooves formed in the surfaces of upper lips 1277 and 1278, respectively, toward retaining flanges 1265 and 1266. The grooves create a mechanical interference force between upper lips 1278 and 1279 and the upper portion of side rails (e.g., side rails 420 and 425) of the heat-conducting plate. In some embodiments, retaining elements 1281 and 1282 may be holes formed in the surfaces of upper lips 1277 and 1278 to allow fasteners to be used to attach the heat sink fins 1200 to the side rails of the heat-conducting plate. Examples of fasteners include, but are not limited to, screws, tacks, rivets, etc.

[0093] Furthermore, the upper portion 1272 of the convection interface 1270 curves downward relative to the lower portion 1271. The curve is formed along a line that begins at the center point between the top and bottom of the convection interface 1270 and spans the width of the interface. Additionally, the convection interface 1270 includes two slots 1273a and 1273b, which are formed or cut into the interface, with openings at the top for slots 1273a and 1273b. When devices using radiator structures include forced airflow components (such as fans), it is advantageous to use a convection interface 1270 with a curved design (such as the upper portion 1272) and additional slots (such as slots 1273a and 1273b). Forced airflow passes more easily through curved surfaces and slots compared to movement around some of the aforementioned radiator structures.

[0094] As shown in the figure, each of slots 1273a and 1273b extends from its top edge to three-quarters of the total height of the convection interface 1270, and each of slots 1273a and 1273b is also positioned at one-quarter of the total width of the convection interface 1170 from each side edge. In other embodiments, the number and / or length of the slots, as well as the location of the slots and / or the spacing between the slots, may vary. Furthermore, the curvature of the first portion 1272 has the same direction as the thermal interface 1260, and the top edge of the first portion extends from the surface of the lower portion 1271 to the same distance as the edge of the thermal interface 1260. In other embodiments, the amount and / or size of the curvature of the first portion 1272 may vary. Furthermore, the curvature direction of the first portion 1272 may differ from the direction of the thermal interface 1260. Furthermore, the bending direction, amount, and / or size of the first portion 1272 may be different for each region of the first portion 1272 between the grooves (e.g., grooves 1273a and 1273b). For example, the bending direction of the portion of the first portion 1272 between grooves 1273a and 1273b may be different from the bending direction of the remaining portions.

[0095] Turning now to Figure 13, which illustrates a schematic diagram of another exemplary heat sink structure 1300 according to various aspects of this disclosure. The heat sink structure 1300 may be included as part of an electrical or electronic device, such as electronic device 200 described in Figure 2 or electronic device 100 described in Figure 1, and is used to extract and / or dissipate heat energy or heat from one or more heat-generating components that are part of the electrical or electronic device. More specifically, in some embodiments, the heat sink structure 1300 may be used in conjunction with one or more integrated circuits or SoCs, such as integrated circuits 225a and / or 225b described in Figure 2, which are configured to implement various functions in an electronic device. For reference, Figure 13 shows a perspective view of the heat sink structure 1300 as seen from its apex.

[0096] The radiator structure 1300 includes a heat-conducting plate 1310 with side rails 1320 and 1325, configured in a manner similar to that of the heat-conducting plate 510 described in Figures 5A-5E or the heat-conducting plate 610 described in Figures 6A-6B. The radiator structure 1300 also includes a set of convection fins 1350a-1350i, each configured and arranged in a manner similar to that of the radiator fins 1200 described in Figure 12. Each convection fin 1350a-1350i includes an upper retaining flange and a lower retaining flange, as well as an upper lip on the upper retaining flange, to provide stability and retaining force when coupled to the heat-conducting plate 1310. Each convection fin also includes a retaining element, such as a surface groove, located on the upper lip of the upper retaining flange to provide additional retaining force when coupled to the heat-conducting plate 1310.

[0097] The heat-conducting plate 1310 also includes attachment openings 1342a and 1342b for attaching the heat sink structure 1300 to a heat-generating component (e.g., IC 225 in FIG. 2) or to a support structure for the heat-generating component (e.g., printed circuit board 220). In some embodiments, openings 1342a and 1342b can be used to attach the heat sink structure 1300 using attachment mechanisms such as screws and nuts and / or locking tacks. Other attachment mechanisms may also be used.

[0098] It is noteworthy that each of the convection fins 1350a-1350i is oriented at a small angle relative to the side rails 1320 and 1325 on the heat-conducting plate 1310, rather than being vertically oriented as shown in the embodiments described above. More specifically, as shown, the lower edge of the convection fins 1350a-1350i is positioned closer to the left end of the side rail 1325, and the upper edge of the convection fins 1350a-1350i is positioned closer to the right end of the side rail 1320. Other embodiments may use different angular positions for the convection fins 1350a-1350i. The angular positions used may be determined based on several factors, including but not limited to the location of external vents in the housing of the device (e.g., vents 215a-215d in the housing 210 for the electronic device 200 described in FIG. 2), the location of forced air components (such as fans), the direction of airflow through the housing of the device, and the location of the interface between the heat-generating components and the heat sink structure.

[0099] Turning now to Figures 14A-14B, which illustrate schematic diagrams of another exemplary heat sink structure 1400 according to various aspects of this disclosure. The heat sink structure 1400 may be included as part of an electrical or electronic device, such as electronic device 200 described in Figure 2 or electronic device 100 described in Figure 1, and is used to extract and / or dissipate heat energy or heat from one or more heat-generating components that are part of the electrical or electronic device. More specifically, in some embodiments, the heat sink structure 1400 may be used in conjunction with one or more integrated circuits or SoCs, such as integrated circuits 225a and / or 225b described in Figure 2, configured to implement various functions in an electronic device. For reference, Figure 14A shows a perspective view of the heat sink structure 1400 as seen from its apex. Figure 14B shows an enlarged view of the area identified as 14B in Figure 14A. It is noteworthy that not all elements of the heat sink structure 1400 can be shown in each of Figures 14A-14B. However, when the same element of the heat sink structure 1400 is shown in more than one of the figures in Figures 14A-14B, the same reference numerals are used.

[0100] The radiator structure 1400 includes a heat-conducting plate 1410 with side rails 1420 and 1425, configured in a manner similar to that of heat-conducting plate 510 described in Figures 5A-5E or heat-conducting plate 610 described in Figures 6A-6B. The radiator structure 1400 also includes convection fins 1450 configured and arranged in a manner similar to that of radiator fins 1200 described in Figures 12A-12B. The convection fins 1450 include an upper retaining flange (only the upper retaining flange 1465 is shown in Figure 14B) and a lower retaining flange (not shown). The upper retaining flange also includes an upper lip (only the upper lip 1467 is shown in Figure 14B) to provide stability and retaining force when coupled to the heat-conducting plate 1410.

[0101] The conductive fins 1450 also include interface ribs 1468, which are mechanically coupled to interface channels 1417 included on the heat-conducting plate 1410 in a similar manner to those described above. The use of shaped interface ribs 1468 on the convection fins 1450 and corresponding interface channels 1417 on the heat-conducting plate 1410 provides angular adjustability to the position of the convection fins 1450 while still ensuring stability and holding force on the heat-conducting plate 1410.

[0102] The convection fin 1450 also includes a retaining element (not shown) in the form of a mounting hole on the upper lip of the upper retaining flange to provide a semi-permanent attachment when coupled to the heat-conducting plate 1410. As shown in FIG14B, a retaining screw 1491 is fastened to the side rail 1425 via the retaining element to semi-permanently attach or secure the convection fin 1450 to the side rail 1455.

[0103] It is worth noting that the above embodiments all describe a sliding component mechanism involving the use of side rails, such as side rails 820 and 825 in FIG. 8, which form a U-shaped channel as a sliding component and are mechanically coupled to retaining flanges, such as retaining flanges 865 and 866. In other embodiments, the sliding component mechanism may use different structures. For example, an interface channel (e.g., interface channel 817) on the surface of a substrate (e.g., base 810) may be modified to adjustably retain interface ribs (e.g., interface rib 868) of one or more heat dissipation elements (e.g., convection fins 850) to form a sliding component mechanism.

[0104] According to one embodiment, the heat sink structure includes: a substrate having a first surface and a second surface, the first surface being thermally coupled to a heat-generating component; a sliding assembly attached to the second surface of the substrate; and at least one heat-dissipating element adjustablely held by the sliding assembly, the at least one heat-dissipating element having a first end and a second end, the first end being held such that the at least one heat-dissipating element is thermally coupled to the second surface of the substrate, and the second end being capable of dissipating heat energy.

[0105] According to one embodiment, the device includes: a housing; a heat-generating component coupled to internal elements of the housing; and a heat sink structure coupled to the heat-generating component. The heat sink structure further includes: a substrate having a first surface and a second surface, the first surface being thermally coupled to the heat-generating component; a sliding assembly attached to the second surface of the substrate; and at least one heat-dissipating element adjustablely held by the sliding assembly, the at least one heat-dissipating element having a first end and a second end, the first end being held such that the at least one heat-dissipating element is thermally coupled to the second surface of the substrate, and the second end being capable of dissipating heat energy.

[0106] In some embodiments, at least one heat dissipation element includes: a first portion having a first surface and a second surface, the first surface of the first portion being thermally coupled to a second surface of a substrate; and a second portion extending from the second surface of the first portion of the at least one heat dissipation element, the second portion being capable of dissipating heat energy by transferring heat energy to air surrounding the heat sink structure. In some embodiments, the first portion of the at least one heat dissipation element is oriented parallel to the second surface of the substrate. In some embodiments, the second portion of the at least one heat dissipation element is oriented perpendicular to the second surface of the substrate.

[0107] In some embodiments, the sliding assembly further includes a first side rail and a second side rail, each of which is positioned along an edge of an opposite side of the substrate. In some embodiments, the first side rail and the second side rail each form a U-shaped channel with a second surface along each opposite side of the substrate.

[0108] In some embodiments, at least one heat dissipation element includes a first retaining flange and a second retaining flange extending from opposite sides of the at least one heat dissipation element, the first retaining flange and the second retaining flange being configured to slide adjustably in a U-shaped channel formed by the first side rail and the second side rail, respectively.

[0109] In some embodiments, the second surface of the substrate further includes an interface channel formed therein, the interface channel extending with a width smaller than the width of the substrate. In some embodiments, at least one heat dissipation element further includes an interface rib extending outward from a first surface of the at least one heat dissipation element, the interface rib being mechanically coupled to the interface channel.

[0110] In some embodiments, at least one heat dissipation element is a group of heat dissipation elements, each element in the group being adjustablely positioned at a different location on a second surface of the substrate. In some embodiments, the group of heat dissipation elements is adjustablely positioned to be uniformly spaced apart on the second surface of the substrate. In some embodiments, at least two elements in the group of heat dissipation elements are adjustablely positioned to be spaced closer together than the other elements in the group of heat dissipation elements.

[0111] In some embodiments, the heat-generating component is at least one of an electromechanical component, an electromagnetic component, an integrated circuit (IC), and a system-on-a-chip (SoC).

[0112] It should be understood that, unless expressly stated in the foregoing description, the various features shown and described are interchangeable, that is, features shown in one embodiment may be incorporated into another embodiment.

[0113] Although embodiments incorporating the teachings of this disclosure have been shown and described in detail herein, those skilled in the art can readily devise many other different embodiments still incorporating these teachings. Having described preferred embodiments of the adjustable heat sink structure, it should be noted that modifications and variations can be made by those skilled in the art based on the foregoing teachings. Therefore, it should be understood that changes can be made to specific embodiments of this disclosure within the scope of this disclosure as outlined in the appended claims.

Claims

1. A radiator structure, comprising: A substrate having a first surface and a second surface, wherein the first surface is thermally coupled to a heating element; A sliding component attached to the second surface of the substrate; as well as At least one heat dissipation element is adjustablely held by the sliding assembly, the at least one heat dissipation element having a first end and a second end, the first end being held such that the at least one heat dissipation element is thermally coupled to the second surface of the substrate, and the second end being capable of dissipating heat energy.

2. The radiator structure according to claim 1, wherein, The at least one heat dissipation element includes: a first portion having a first surface and a second surface, the first surface of the first portion being thermally coupled to the second surface of the substrate; and a second portion extending from the second surface of the first portion of the at least one heat dissipation element, the second portion being capable of dissipating heat energy by transferring heat energy to the air surrounding the heat sink structure.

3. The radiator structure according to claim 2, wherein, The first portion of the at least one heat dissipation element is oriented parallel to the second surface of the substrate.

4. The radiator structure according to claim 2, wherein, The second portion of the at least one heat dissipation element is oriented perpendicular to the second surface of the substrate.

5. The radiator structure according to claim 1, wherein, The sliding assembly further includes a first side rail and a second side rail, each of the first side rail and the second side rail being positioned along the edges of opposite sides of the substrate.

6. The radiator structure according to claim 5, wherein, The first side rail and the second side rail each form a U-shaped channel with the second surface along each opposite side of the substrate.

7. The radiator structure according to claim 6, wherein, The at least one heat dissipation element includes a first retaining flange and a second retaining flange extending from opposite sides of the at least one heat dissipation element, the first retaining flange and the second retaining flange being configured to slide adjustably in a U-shaped channel formed by the first side rail and the second side rail, respectively.

8. The radiator structure according to claim 1, wherein, The second surface of the substrate further includes an interface channel formed therein, the width of which is less than the width of the substrate.

9. The radiator structure according to claim 8, wherein, The at least one heat dissipation element includes an interface rib extending outward from a first surface of the at least one heat dissipation element, the interface rib being mechanically coupled to the interface channel.

10. The radiator structure according to claim 1, wherein, The at least one heat dissipation element is a group of heat dissipation elements, each element in the group of heat dissipation elements being adjustablely positioned at different locations on the second surface of the substrate.

11. The radiator structure according to claim 10, wherein, The heat dissipation elements are adjustablely positioned to be evenly spaced on the second surface of the substrate.

12. The radiator structure according to claim 10, wherein, At least two of the heat dissipation elements in the group are adjustablely positioned to be spaced closer together than the other elements in the group.

13. An apparatus comprising: case; A heating element, which is coupled to internal components of the housing; as well as A heat sink, coupled to the heat-generating component, further comprising: A substrate having a first surface and a second surface, wherein the first surface is thermally coupled to the heating element; A sliding component, which is attached to the second surface of the substrate; and At least one heat dissipation element is adjustablely held by the sliding assembly, the at least one heat dissipation element having a first end and a second end, the first end being held such that the at least one heat dissipation element is thermally coupled to the second surface of the substrate, and the second end being capable of dissipating heat energy.

14. The apparatus according to claim 13, wherein, The at least one heat dissipation element includes: a first portion having a first surface and a second surface, the first surface of the first portion being thermally coupled to the second surface of the substrate; and a second portion extending from the second surface of the first portion of the at least one heat dissipation element, the second portion being capable of dissipating heat energy by transferring heat energy to the air surrounding the heat sink structure.

15. The apparatus according to claim 14, wherein, The first portion of the at least one heat dissipation element is oriented parallel to the second surface of the substrate.

16. The apparatus according to claim 14, wherein, The second portion of the at least one heat dissipation element is oriented perpendicular to the second surface of the substrate.

17. The apparatus according to claim 13, wherein, The sliding assembly also includes a first side rail and a second side rail positioned along the edges of opposite sides of the substrate.

18. The apparatus according to claim 17, wherein, The first side rail and the second side rail each form a U-shaped channel with the second surface along each opposite side of the substrate.

19. The apparatus according to claim 18, wherein, The at least one heat dissipation element includes a first retaining flange and a second retaining flange extending from opposite sides of the at least one heat dissipation element, the first retaining flange and the second retaining flange being configured to slide adjustably in a U-shaped channel formed by the first side rail and the second side rail, respectively.

20. The apparatus according to claim 13, wherein, The second surface of the substrate further includes an interface channel formed therein, the width of which is less than the width of the substrate.

21. The apparatus according to claim 20, wherein, The at least one heat dissipation element includes an interface rib extending outward from a first surface of the at least one heat dissipation element, the interface rib being mechanically coupled to the interface channel.

22. The apparatus according to claim 13, wherein, The at least one heat dissipation element is a group of heat dissipation elements, each element in the group of heat dissipation elements being adjustablely positioned at different locations on the second surface of the substrate.

23. The apparatus according to claim 22, wherein, The heat dissipation elements are adjustablely positioned to be evenly spaced on the second surface of the substrate.

24. The apparatus according to claim 22, wherein, At least two of the heat dissipation elements in the group are adjustablely positioned to be spaced closer together than the other elements in the group.

25. The apparatus according to claim 13, wherein, The heat-generating component is at least one of electromechanical components, electromagnetic components, integrated circuits (ICs), and system-on-a-chip (SoCs).

Images