Electronic component cover sheet, laminated sheet, and electronic component mounting substrate

Abstract

Provided are an electronic component cover sheet that makes it possible to form a cover layer having exceptional reworkability and adhesion at normal temperature, a laminated sheet, and an electronic component mounting substrate that has the cover layer. An electronic component cover sheet according to the present disclosure is used for forming a cover layer (3) of an electronic component mounting substrate (10) that is provided with a substrate (1), an electronic component (2), and the cover layer (3), which covers the electronic component (2) and at least a portion of the substrate (1), wherein: (i) the adhesive force of a cured product that is obtained by bonding the electronic component cover sheet to a polyimide base material, as measured through 180° peeling at 25°C, is 2.0 N / cm or greater; and (ii) the relationship 0.15 < B / A < 0.85 is satisfied, where A [cm / N] is the adhesive force of a cured product that is obtained by bonding the electronic component cover sheet to a polyimide base material as measured through 180° peeling at 25°C, and B [N / cm] is the adhesive force of the cured product of said electronic component cover sheet as measured through 180° peeling at Tg + 40°C.

Claims

1. An electronic component coating sheet for forming the coating layer of an electronic component mounting substrate, comprising a substrate, electronic components mounted on the substrate, and a coating layer covering at least a portion of the electronic components and the substrate, wherein (i) the adhesive strength of the cured product of the electronic component coating sheet bonded to a polyimide substrate is 2.0 N / cm or more when measured by 180-degree peeling at 25°C, and (ii) when the adhesive strength of the cured product of the electronic component coating sheet bonded to a polyimide substrate is A [N / cm] and the adhesive strength of the cured product of the electronic component coating sheet is B [N / cm] when measured by 180-degree peeling at Tg + 40°C, the relationship 0.15 < B / A < 0.85 is satisfied.

2. The electronic component coating sheet according to claim 1, wherein the fracture stress of the cured product of the electronic component coating sheet at Tg + 40°C is 0.50 MPa or more.

3. The electronic component coating sheet according to claim 1 or 2, wherein the fracture temperature of the cured product of the electronic component coating sheet is 200°C or higher.

4. The electronic component coating sheet according to any one of claims 1 to 3, wherein the gel fraction when the cured product of the electronic component coating sheet is immersed in methyl ethyl ketone is 50 to 100%.

5. The electronic component coating sheet according to any one of claims 1 to 4, wherein the storage modulus of the electronic component coating sheet at 100°C is 0.1 MPa or more and less than 15 MPa.

6. An electronic component coating sheet according to any one of claims 1 to 5, comprising a thermosetting resin having a functional group concentration of 10 to 550 mmol / kg.

7. A laminated sheet comprising an electronic component covering sheet according to any one of claims 1 to 6.

8. An electronic component mounting substrate comprising a substrate, an electronic component mounted on the substrate, and a coating layer covering at least a portion of the electronic component and the substrate, wherein the coating layer is composed of a cured product of the electronic component coating sheet described in any one of claims 1 to 6.

9. The electronic component mounting substrate according to claim 8, wherein the coating layer is peelable from the electronic component mounting substrate at a temperature of Tg + 40°C or higher for the cured product of the electronic component coating sheet.

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