36results about How to "Good welding reliability" patented technology

The invention discloses a microwave dielectric resonator, comprising a cavity and a dielectric resonator, the dielectric resonator is a cylinder with a through hole; the dielectric resonator is composed of the following components in mass percentage: calcium carbonate, Aluminum oxide, neodymium oxide, titanium dioxide; one end of the dielectric resonator is coated with a silver layer, and the other end of the dielectric resonator is welded in the cavity; the cavity is composed of the following components in mass percentage: alumina 95~ 96%, calcium carbonate 2~3%, lanthanum oxide 0.8~1.5%, samarium oxide 0.2~0.5%; the relative dielectric constant of the cavity is 9.5; the surface roughness of the inner wall of the cavity is about 0.8; the cavity The internal wall is covered with a metal layer through sputtering or electroless plating. The microwave dielectric resonator of the invention has a high Q value, and the tuning range can reach 7%-10% at a specified frequency. The general tuning range of the TE mode resonator is 3%-4%.

The invention discloses high-reliability PERC back silver conductive paste for a crystalline silicon solar cell and a preparation process for the high-reliability PERC back silver conductive paste. The viscosity of the slurry is 20 to 80 Pa.S, and the paste contains the following components in percentage by mass: 0.1%-0.3% of an inorganic additive, 1%-5% of glass powder, 45%-65% of silver powder,2%-6% of ethyl cellulose, 1%-5% of terpilenol, 20%-35% of texanol ester alcohol and a proper amount of an organic additive, wherein the glass powder is formed by the mixing of glass powder I and glasspowder II. The preparation method comprises the following steps: uniformly mixing the organic additive, ethyl cellulose, terpilenol and texanol ester alcohol under the water bath condition to obtaina carrier; adding the mixed glass system and the inorganic additive into the carrier, and uniformly mixing the mixture; and adding the silver powder system into the system at the step 2, and performing uniform mixing, rolling and filtering to obtain the back conductive silver paste. According to the invention, the PERC back silver paste guarantees the characteristics of the traditional non-contactsilver paste, is fewer in damages to an aluminum oxide passivation layer, is high in welding reliability of a back silver paste sintered electrode due to the fact that a mixed glass system is adopted, and has excellent comprehensive performances under the condition that the actual temperature is 740 DEG C-780 DEG C.

A surface-mounted fuse comprises a fusing chip (1). The fusing chip mainly consists of terminal electrodes (2), a ceramic substrate (3), a fusing body layer (4), and an arc extinction glass layer (5). The fusing body layer is located on an upper surface of the ceramic substrate. The two terminal electrodes are located on two sides of the fusing body layer respectively, and are electrically connected to the fusing body layer. The arc extinction glass layer covers the fusing body layer and the regions, close to the arc extinction glass layer, of the terminal electrodes. The surface-mounted fuse further comprises a fuse body (7) having a round through hole (6) in the middle. The fusing chip is located in the round through hole of the fuse body. Two metal covers (8) are located at two ends of the fuse body respectively, and cover the round through hole to form an enclosed chamber. The terminal electrodes are electrically connected to the metal covers through solder lugs (9). The surface-mounted can endure high temperature, has high strength, and can wrap a fuse wire and the arc extinction glass therein. The overall strength, the breaking capability, and the resistance to cold and hot shocks of the fuse are improved, and mass production is convenient.

A surface-mount-type high-frequency module in accordance with the present invention comprises BGA package IC(s) 1 and printed circuit board(s) carrying such BGA package IC(s) 1; such printed circuit board(s) being multilayer board(s), laminated at which there are inner layer(s) comprising core material(s) 6, and outer layer(s) constituting exterior(s) relative to inner layer(s) and comprising build-up layer(s) 5. Top surface(s) of printed circuit board(s) (core material(s) 6), in region(s) where BGA package IC(s) 1 carried thereby is / are mounted, is / are formed so as to be lower than top surface(s) of outer layer(s) (build-up layer(s) 5). Gap(s) between core material(s) 6 and BGA package IC(s) 1 is / are filled with encapsulant resin(s) 3.

The invention provides a membrane gas meter sampling and counting mechanism, which relates to the technical field of gas meters. It includes the upper casing of the gas meter, the character wheel assembly and the control circuit board. The number wheel of the character wheel assembly is provided with several magnets, and the control circuit board is provided with sampling sensor Ⅰ and sampling sensor Ⅱ. The sampling sensor Ⅰ and sampling sensor Ⅱ are close to each other. , and is located in the diameter direction of the number wheel. The invention solves the technical problems of the gas meter sampling and counting device in the prior art, which have weak anti-magnetic interference capability and hidden dangers of miscounting. The beneficial effect of the present invention is that the counting signal is directly collected by the control circuit board, eliminating intermediate links, eliminating hidden dangers affecting the accuracy of sampling and counting, and saving raw materials. The magnetic sensing element and the control circuit board are directly welded, which is suitable for the SMT chip technology, and the welding reliability is good, the process is simple, the production cost is reduced, and the production efficiency is improved. The anti-shake and anti-external magnetic field attack effects are good, ensuring accurate sampling and counting.

A method for dissimilar rotary friction welding of titanium alloy and steel belongs to the field of solid-phase connection of dissimilar metals. In order to realize the heterogeneous welding of titanium alloy and steel and avoid the generation of brittle phase in the welding zone, the invention uses copper as the welding transition metal to obtain high-quality friction welding seam by rotating friction welding, and realizes the heterogeneous welding of titanium alloy and steel. Welded parts. The invention uses Cu as the intermediate phase to realize the heterogeneous welding of titanium alloy and steel, which not only effectively prevents the diffusion of elements in Ti and steel, but also eliminates brittle phases such as Ti / Fe intermetallic compounds, improves the strength of the welded joint, and at the same time makes the The welded joint is firm, which effectively improves the quality and performance of the welded joint. The invention has the advantages of simplicity and convenience, high welding efficiency, excellent quality and performance of the obtained welded joint, and greatly reducing labor and processing costs.

A method for realizing dissimilar welding of titanium alloy and aluminum alloy belongs to the field of solid-phase connection of dissimilar metals. In order to realize the heterogeneous welding of titanium alloy and aluminum alloy and avoid the generation of Ti / Al brittle phase in the welding zone, the invention uses tin as the welding transition metal, and obtains high-quality friction welding seam through friction stir welding, and realizes the realization of titanium alloy and aluminum alloy. Dissimilar welding of aluminum alloys. The invention uses Sn as the intermediate phase, and realizes the heterogeneous welding of the high melting point titanium alloy and the low melting point aluminum alloy through friction stir welding, which not only effectively prevents the formation of brittle phases such as Ti / Al during the welding process, but also prevents the welding temperature from being too high. The resulting large amount of burning loss of the aluminum alloy improves the strength of the welded joint, and at the same time makes the welded joint firm, effectively improving the quality and performance of the welded joint. It has the advantages of simplicity and convenience, high welding efficiency, excellent quality and performance of the obtained welded joint, and greatly reducing labor and processing costs.

A zinc-based high-temperature lead-free solder, which contains 50% to 80% by weight of zinc, and also contains any one or two of aluminum, bismuth, palladium, nickel, germanium or phosphorus as additional trace elements, And the weight percentages of the above-mentioned additional trace elements are respectively: aluminum 0-0.09%, bismuth 0-3%, palladium 0-0.08%, nickel 0-0.05%, germanium 0-0.006% or phosphorus 0-0.03%, the balance is tin. The soldering tin of the invention can achieve good welding effect, and when the subsequent protection circuit of the high rated current fuse tube fuses, the solder in the end cap of the fuse tube does not overflow the outside of the tube.

The invention relates to a method for brazing Ti2AlC ceramics by Al base brazing filler metal, and aims to solve the technical problem of short service life of an existing electric contact component. The method includes the steps: first, preparing the brazing filler metal; second, assembling a Ti2AlC ceramic / brazing filler metal / Ti2AlC ceramic structural part, placing the structural part into a vacuum brazing furnace, performing vacuum pumping to reach 6.0*10<3>Pa, increasing temperature to 300 DEG C at the heating rate of 10 DEG C / min, keeping the temperature for 30min, increasing the temperature to 660-900 DEG C at the heating rate of 10 DEG C / min, keeping the temperature for 5-30min under the pressure of 0.2-1.0MPa, reducing the temperature to 300 DEG C at the cooling rate of 10 DEG C / min, performing furnace cooling and finishing brazing the Ti2AlC ceramics by the Al base brazing filler metal. By the method, a joint with an excellent mechanical property can be obtained, the shear strength of the joint is 70-120MPa, and electrical conductivity is 3.73-4.18*10<6>S / m and reaches 94% or more of the electrical conductivity of the Ti2AlC ceramics.

Provided is a laminated plate for a circuit substrate, the laminated plate for a circuit substrate comprising: a metal substrate; an insulating layer, the insulating layer is disposed on at least one surface of the metal substrate; a metal foil, the metal foil is disposed on the insulating layer; It is characterized in that the insulating layer contains a cross-linked copolymer of bisphenol cyanate resin and phenolic cyanate resin and an inorganic filler.