7results about How to "Good welding reliability" patented technology

The invention provides a back contact battery and a photovoltaic module. The back contact battery comprises a battery body; the multiple first auxiliary grids and the multiple second auxiliary grids are located on the battery body, the first auxiliary grids and the second auxiliary grids extend in the first direction and are alternately arranged at intervals in the second direction, and the distance between every two adjacent auxiliary grid sections in the first direction is a first distance; the plurality of first insulating parts are positioned on one side, far away from the battery body, of the plurality of auxiliary grid sections and are arranged at intervals along the first direction, and the distance between the projections of the end parts of the auxiliary grid sections on the battery body along the first direction and two adjacent first insulating parts is a second distance; the plurality of welding parts are positioned on one side, far away from the battery body, of the auxiliary grid section; the difference between the first distance and the second distance is greater than or equal to 0.3 mm, and the difference between the second distance and the width of the welding part in the first direction is greater than or equal to 0.3 mm, so that the problems of deviation, splitting or non-plump form and the like of the welding flux after solidification are avoided, and the welding reliability is ensured.

The utility model relates to a battery, a battery pack and electric equipment. The battery has the length L, the thickness D and the height H, and L is larger than D, L is larger than H, and L is larger than or equal to 300 mm and smaller than or equal to 2000 mm. The battery comprises at least one anti-explosion valve, the anti-explosion valve is arranged on the side face adjacent to the large face of the battery, and the distance D1 between the edge of the anti-explosion valve and the large face meets the requirement that D1 is larger than or equal to 1 mm and smaller than D / 2. The total area of the anti-explosion valve is S; the battery capacity C is more than or equal to 50Ah and less than or equal to 300Ah, and S and C meet the relational expression C: S = 0.1-1.5 (Ah / mm < 2 >). The range of D1 can prevent stress concentration of the explosion-proof valve, improve reliability and ensure that the explosion-proof valve has enough exhaust area. The lower limit value of S can ensure that the explosion-proof valve can quickly discharge high-temperature and high-pressure gas-liquid substances during thermal failure; the upper limit of S is used for avoiding the problems that the area of the anti-explosion valve is too large, the valve element is not prone to reaching the opening threshold value, and the opening error is large.

The invention discloses soldering paste resistant to high-temperature post-soldering residues and a preparation method of the soldering paste. The soldering paste comprises soldering flux and paste flux according to the weight ratio of (8-9): (1-2). The solder comprises a tin-bismuth series alloy and a titanate coupling agent modified halloysite nanotube. On the basis of the flux paste, the flux paste comprises the following raw materials in parts by weight: 35-65 parts of composite rosin; 35 to 55 parts of a solvent; 5-15 parts of tartaric acid; 5-10 parts of a thickening agent; 1-3 parts of a corrosion inhibitor; 2-4 parts of an antioxidant; and 2-3 parts of oleyl alcohol polyoxyethylene ether. The high-temperature-resistant soldering paste left after welding has the advantages of being resistant to high temperature, low in splashing and good in wettability, the welding effect is hard and firm, and welding spots are full and bright. In addition, the preparation method provided by the invention has the advantages of being simple, easy to operate and beneficial to large-scale production and application.

The invention provides a waste source near-surface treatment waste source packaging pipe packaging method and device. The method comprises the steps that an upper end opening of a packaging pipe is connected with the pouring end of a cement pouring device; cement is poured into the packaging pipe through the cement pouring device until pouring is completed; the connection between the packaging pipe and the pouring end of the cement pouring device is removed; mounting a cover body to the upper end opening of the packaging tube; and the packaging pipe is placed at a welding position, and welding connection of the packaging pipe and the cover body is conducted through a welding robot. According to the scheme, automatic cement pouring can be achieved, and the situation that the exposure dose of an operator is increased due to the fact that the operator is too close to the packaging pipe is avoided; automatic welding of the packaging pipe and the cover body can be achieved, the irradiation dose of operators can be prevented from being increased, meanwhile, welding reliability is good, and the welding sealing effect is good.

The invention discloses a preparation method of a copper diamond contact material and a product. The preparation method of the copper-diamond contact material comprises the following steps: firstly, weighing the diamond micro powder, the graphite powder and the CuMe alloy powder according to the proportion; me in the CuMe alloy powder represents one or more than two of Si, Al, Ni, Mg, Zn, Te, Sb and La elements, and the proportion of the Me in the CuMe alloy powder is 0.1-3 wt%; mixing the weighed components with water or ethanol to obtain slurry, and grinding the slurry with a sand mill; drying the mixed powder slurry obtained by grinding under a vacuum condition to obtain mixed powder; and performing isostatic pressing on the obtained mixed powder, then spraying a copper layer, and performing sintering, hot extrusion and rolling procedures on a sprayed billet to obtain the copper-clad plate. The contact prepared through the method is uniform in metallographic structure, good in welding resistance, high in interface bonding strength and high in welding reliability.

This utility model discloses a circuit board and its pad structure. The pad structure is an elongated structure, and at least one of the long and short sides of the elongated structure has a notch structure. The notch structure is located at the midpoint or approximately the midpoint of its side. The notch structure is used for ball bonding and forming a moving channel for the solder ball. The solder ball moves to the back of the pad structure through the moving channel, and then forms a reliable solder connection with the motherboard on the back of the pad structure. The length of the long side is L, the width of the short side is W, and L / W ≥ 1.25.

The invention discloses a chip packaging structure and electronic equipment, and belongs to the technical field of semiconductors. The chip packaging structure comprises a packaging substrate, an adapter plate and a plurality of chips. The adapter plate is arranged on the packaging substrate and is electrically connected with the packaging substrate; the plurality of chips comprise at least one first chip and at least one second chip; wherein the first chip is arranged on one side, far away from the packaging substrate, of the adapter plate and is electrically connected with the adapter plate, and the second chip is arranged between the adapter plate and the packaging substrate and is electrically connected with the adapter plate. According to the invention, the plurality of chips are respectively arranged at the two opposite sides of the adapter plate, the space of the front surface and the space of the back surface of the adapter plate are fully utilized, the area of the adapter plate is reduced, the size of the chip packaging structure is reduced, the integration degree of the unit area of a system is improved, the warping problem and the welding reliability problem are improved, and the yield is improved.