This utility model discloses a circuit board and its pad structure. The pad structure is an elongated structure, and at least one of the long and short sides of the elongated structure has a notch structure. The notch structure is located at the midpoint or approximately the midpoint of its side. The notch structure is used for
ball bonding and forming a moving channel for the
solder ball. The
solder ball moves to the back of the pad structure through the moving channel, and then forms a reliable solder connection with the
motherboard on the back of the pad structure. The length of the long side is L, the width of the short side is W, and L / W ≥ 1.25.