1results about How to "Less reactive" patented technology

The utility model provides a wafer transfer device, which comprises an equipment front-end module and at least one airflow equipment, and is characterized in that the side surface of the equipment front-end module is provided with at least one loading port, and the loading port is used for loading a front-opening transmission box; a fan filtering unit is arranged at the top of the equipment front-end module and is used for sucking air in the dust-free room environment and generating downward laminar airflow in the equipment front-end module; the airflow equipment is arranged on the inner side wall of the equipment front-end module, and is positioned above the loading port and below the fan filtering unit; the airflow equipment comprises at least one airflow channel, a heater and a supercharger are arranged between the air inlet end of the airflow channel and the fan filtering unit, and the supercharger and the heater are sequentially communicated to the air inlet end of the airflow channel through an airflow pipeline; part of laminar airflow exhausted by the fan filtering unit is guided into the heater through the supercharger, heated by the heater and then exhausted downwards through the airflow channel, so that a downward laminar airflow wall is formed at the loading opening.