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Method for checking printed circuit board appearance

A technology for printed circuit board and visual inspection, applied in electrical components, electrical components, measuring devices, etc., can solve problems such as low brightness level, inability to extract feature differences in measurement parts, and difficult components to determine whether the installation is qualified or not. achieve the effect of improving the recognition rate

Active Publication Date: 2009-04-15
TAIYO INK SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] In the case of a solder resist with a luminance level of 150, even if figure 1 When the component shown in (a-1) is mounted normally, the difference between the luminance level of (a) on the solder resist layer and the luminance level of the component electrode part (b) is small, so the measurement part cannot be extracted. Due to differences in characteristics, it is difficult to judge the pass or fail of component mounting
[0009] Additionally, if figure 1 In the case of component mounting abnormality shown in (a-2), the difference between the luminance level of (a) on the solder resist layer and the luminance level of the component electrode part (b) at the inspection and measurement site is small, so it cannot be extracted and measured. Due to the difference in the characteristics of the part, it is difficult to judge the pass or fail of component mo

Method used

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  • Method for checking printed circuit board appearance
  • Method for checking printed circuit board appearance
  • Method for checking printed circuit board appearance

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Embodiment

[0099] Hereinafter, although an Example and a comparative example are shown and this invention is concretely demonstrated, this invention is not limited to a following example. In addition, the following "parts" mean "parts by mass" unless otherwise specified.

[0100]

[0101] The carboxylic acid-containing photocurable resin of the present invention was prepared according to the following synthesis examples.

[0102] 220 parts of cresol novolak type epoxy resin (manufactured by Dainippon Ink Chemical Industry Co., Ltd., "EPICLON" (registered trademark) N-695, epoxy equivalent: 220) was added to a four-neck flask equipped with a stirrer and a reflux condenser , Add 214 parts of carbitol acetate, heat to dissolve. Next, 0.46 parts of hydroquinone as a polymerization inhibitor and 1.38 parts of triphenylphosphine as a reaction catalyst were added. The mixture was heated to 95-105°C, 72 parts of acrylic acid was slowly added dropwise, and reacted for 16 hours. The reaction ...

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Abstract

The invention provides an appearance inspection method used for a printing circuit board, which is characterized in that the method comprises the procedures as follows: a step in which a rein combination curing film with the luminance level ranging from 30 to 120 is arranged on a substrate where a circuit is formed or a welding resistance layer of the substrate, a step in which image signals are gained by photographing the substrate, a step in which the image signals are read and converted into luminance level signals and a step in which the luminance horizontal signals are judged.

Description

technical field [0001] The invention relates to an appearance inspection method of a printed circuit board which improves the identification rate of electronic components in the appearance inspection of the printed circuit board. Background technique [0002] In the mounting process of high-density and diversified printed circuit boards, the mounting state of electronic components and the quality of solder joints will affect the reliability of products. Therefore, it is used to improve work efficiency and ensure work quality. The automation and mechanization of visual inspections have been popularized. [0003] As a method of visual inspection of electronic components mounted on printed circuit boards, as proposed in Patent Document 1, for example, a CCD camera is used to photograph the components to be inspected, the solder pads in contact with them, and the solder resist, and obtain the respective luminance levels. , by judging whether the difference of the luminance leve...

Claims

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Application Information

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IPC IPC(8): H05K13/08G01N21/956
Inventor 栗原弘司木村纪雄
Owner TAIYO INK SUZHOU