Method for manufacturing planarized sacrificial layer and MEMS (micro-electromechanical system) microbridge structure

A manufacturing method and technology of a micro-bridge structure, which are applied in the manufacture of flat sacrificial layers and the manufacture of micro-bridge structures, can solve problems such as uneven sacrificial layers, and achieve a simple and feasible solution, ensure film thickness, and reduce the cost of MEMS products. Effect

CN102092671AActive Publication Date: 2011-06-15SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2011-06-15

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Abstract

The invention provides a method for manufacturing a planarized sacrificial layer and an MEMS (micro-electromechanical system) microbridge structure. The method comprises the following steps: providing a substrate, setting a dielectric layer on the substrate, and arranging a plug in the dielectric layer; depositing a transition layer and a top metal layer to cover the dielectric layer and the plug; patterning the top metal layer and the transition layer to form a top metal pattern and a patterned transition layer; and forming a sacrificial layer by a precipitation method, and forming holes in the sacrificial layer. The local planarization effect of the sacrificial layer can be realized by adjusting the distance of the top metal pattern, the scheme is simple and practical, no extra process step is required, the microbridge structure-based MEMS product cost or the cost for forming the sacrificial layer in accordance with the requirement can be greatly reduced, and the performance, the yield and the reliability of the product can be improved.
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Description

Method for manufacturing flat sacrificial layer and MEMS microbridge structure technical field The invention relates to the technical field of MEMS micro-bridge structures, in particular to a manufacturing method for manufacturing a micro-bridge structure and a flat sacrificial layer manufacturing method in the manufacturing process. Background technique Micro-electro-mechanical system (MEMS) technology has many advantages such as small, intelligent, executable, integrated, good process compatibility, and low cost, so it has begun to be widely used in many fields including the field of infrared detection technology. MEMS technology is generally poorly compatible with CMOS technology, so it is difficult to achieve large-scale production in the early stage. In recent years, due to the gradual expansion of market demand for MEMS products, the concept of CMOS-MEMS has been gradually proposed. CMOS-MEMS uses CMOS technology to make peripheral reading and signal processing circu...

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