Fixing device for third shaft of inclination angle measurement module and electronic sensor

Abstract

The invention provides a fixing device for a third shaft of an inclination angle measurement module. The fixing device comprises a Z-shaft vertical plate, a double-row patch pin header and a bottom plate, wherein golden fingers matched and communicated with the double-row patch pin header are arranged on both side edges of one bottom of the Z-shaft vertical plate; the golden fingers are inserted in the double-row patch pin header; the bottom plate PCB (Printed Circuit Board) is provided with a bonding pad matched and communicated with the double-row patch pin header; the bonding pad is welded with the bottom of the double-row patch pin header. The invention also provides an electronic sensor integrating the fixing device for the third shaft of the inclination angle measurement module. Adoption of the technical scheme provided by the invention can effectively solve the problem of highly accurately fixing the Z shaft of the inclination angle measurement module in a micro area and under the requirement at the ultralow height.

Description

technical field [0001] The invention relates to the field of electronic sensing, in particular to a fixing device for the third axis of an inclination measuring module and an electronic sensor. Background technique [0002] At present, with the increasing application of electronic sensor devices such as electronic compass and inclination measurement equipment with inclination measurement function, the accuracy of inclination measurement is getting higher and higher, and the area of ​​electronic sensor devices is also getting smaller and smaller, and the module height It must be as low as possible, which puts forward new requirements for the fixing method including the third axis of the inclination measurement module. [0003] There are generally the following ways to fix the third axis of the existing inclination measurement module: [0004] The first type: the bottom plate is used for the female row, and the Z-axis vertical plate is used for the needle row. The disadvanta...

AI Technical Summary

Problems solved by technology

The disadvantages of this method are: the PCB area of ​​the bottom board takes up a lot of space, the height required for the Z-axis vertical board is high, the connection method is unreliable, and the area and height of the high-precision inclination measurement module cannot be made small.

The disadvantage of this method is that the bottom plate needs to be slotted, and the occupied PCB area is very large. At the same time, since the upper and lower sides of the bottom plate need to be welded with the Z-axis vertical plate after slotting, the production process is directly complicated, and manual welding is required. Production Low efficiency; in addition, the high-precision inclination measurement module implemented

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