A cooling and heat dissipation device for a visible light imaging chip

Abstract

The present invention relates to a cooling and heat dissipation device for aviation optical imaging equipment, and in particular to a cooling and heat dissipation device for a visible light imaging chip. The device solves the technical problem that the existing visible light imaging chip device has poor cooling effect, resulting in large imaging noise and a sharp drop in image quality in a weak light environment, making the camera less adaptable in special working environments such as weak light. The device includes a vacuum cavity for placing a visible light imaging chip, a semiconductor group arranged inside the vacuum cavity, a square-shaped imaging circuit board sleeved on the side of the vacuum cavity, and a heat dissipation system in contact with the outer bottom surface of the vacuum cavity; the vacuum cavity includes a transparent window glass, a front panel, a cavity body, an exhaust valve arranged on the side wall of the cavity body, and a plurality of transfer pins arranged on the side of the cavity body and connected to the cavity body; a cavity window is arranged on the front panel; the transparent window glass is sealed on the cavity window; the vacuum degree of the vacuum cavity is greater than or equal to 1.0×10 ‑1 Pa.

Description

Technical Field

[0001] The invention relates to a refrigeration and heat dissipation device for aviation optical imaging equipment, and in particular to a refrigeration and heat dissipation device for a visible light imaging chip. Background Art

[0002] With the widespread application of drones in various fields, people's demand for aviation optical imaging equipment is also increasing, especially the demand for equipment that can perform clear imaging in special environments such as weak light is more urgent. There are two types of existing visible light imaging chip cooling devices, one of which uses semiconductors (TEC) for cooling, and the other uses nitrogen filling in a sealed cavity for cooling. However, the cooling effect of these two devices is poor, resulting in large imaging noise and a sharp drop in image quality in weak light environments for visible light imaging chips, making the camera less adaptable in special working environments such as weak light. Summary of the invention

[0003] In order to solve the technical problem that the existing visible light imaging chip device has poor cooling effect, resulting in large imaging noise and a sharp drop in image quality in a weak light environment, making the camera less adaptable in special working environments such as weak light, the present invention provides a visible light imaging chip cooling and heat dissipation device.

[0004] The technical solution of the present invention is:

[0005] A visible light imaging chip cooling and heat dissipation device, which is special in that:

[0006] It includes a vacuum cavity for placing a visible light imaging chip, a semiconductor group arranged inside the vacuum cavity, a square-shaped imaging circuit board sleeved on the side of the vacuum cavity, and a heat dissipation system in contact with the outer bottom surface of the vacuum cavity;

[0007] The vacuum chamber comprises a transparent window glass, a front panel, a chamber body, an exhaust valve arranged on the side wall of the chamber body, and a plurality of transfer pins arranged on the side of the chamber body and connected to the chamber body; a chamber window is arranged on the front panel; and the transparent window glass is sealed on the chamber window;

[0008] The vacuum degree of the vacuum chamber is greater than or equal to 1.0×10 -1 Pa;

[0009] The imaging circuit board is connected to the pins of the visible light imaging chip through the adapter pins;

[0010] The cold end of the semiconductor group contacts the back side of the visible light imaging chip, and the hot end is fixed on the inner bottom surface of the vacuum cavity, and the outer bottom surface of the vacuum cavity contacts the heat dissipation system.

[0011] Furthermore, in order to improve the heat dissipation effect of the heat dissipation system, the heat dissipation system includes a heat pipe, a heat sink and a heat dissipation fan arranged at the end of the heat sink; the cold end of the heat pipe contacts the outer bottom surface of the vacuum cavity, and the hot end of the heat pipe contacts the heat sink; the air outlet of the heat dissipation fan faces the heat sink.

[0012] Further, the semiconductor group includes a first-level semiconductor, a second-level semiconductor and a third-level semiconductor;

[0013] The cold end of the first-level semiconductor contacts the back side of the visible light imaging chip, the hot end of the first-level semiconductor contacts the cold end of the second-level semiconductor; the hot end of the second-level semiconductor contacts the cold end of the third-level semiconductor; the hot end of the third-level semiconductor is fixed on the inner bottom surface of the vacuum cavity.

[0014] Furthermore, in order to achieve a better sealing effect, the contact parts between the transparent window glass and the cavity window are gold-plated, and the transparent window glass is sealed on the cavity window.

[0015] Furthermore, in order to improve thermal conductivity, a thermally conductive silicone grease layer is provided on the contact surface between the bottom plate of the vacuum cavity and the heat conducting pipe.

[0016] Furthermore, the areas of the first-level semiconductor, the second-level semiconductor and the third-level semiconductor increase sequentially.

[0017] Furthermore, the center of the semiconductor group coincides with the center of the visible light imaging chip.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The present invention encapsulates the visible light imaging chip and the semiconductor group of the visible light camera in a vacuum cavity, performs chip cooling and heat leakage protection, and isolates the external heat from being conducted and radiated to the visible light imaging chip. The visible light imaging chip can be effectively cooled to ensure that it has extremely low noise and excellent image quality in a weak light environment.

[0020] 2. The present invention enables the camera to have very good imaging effects not only under sufficient lighting conditions but also under weak light conditions, thereby expanding the use boundary conditions of visible light cameras in the fields of aerial photography, geographic surveying and mapping, and environmental monitoring.

[0021] 3. The semiconductor group in the present invention includes a first-level semiconductor, a second-level semiconductor and a third-level semiconductor. Each level of semiconductor can be cooled by more than 25°. The three-level refrigeration can meet the temperature difference requirement of better than 70°C.

[0022] 4. A cavity window is arranged on the front panel of the present invention, and a transparent window glass is arranged in the cavity window. The contact parts between the transparent window glass and the cavity window are gold-plated, and the transparent window glass is precisely welded on the cavity window, which has a good sealing effect and improves the cooling efficiency of the device.

[0023] 5. The pins of the visible light imaging chip in the vacuum cavity are connected to the outside through adapter pins around the vacuum cavity. The imaging circuit board is welded to the adapter pins around the vacuum cavity to realize signal transmission with the internal chip, which is more convenient to install.

[0024] 6. The imaging circuit board in the present invention is in the shape of a square, and can be directly mounted on the vacuum chamber, thus saving installation space. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of an embodiment of the present invention;

[0026] The accompanying drawings are marked as follows:

[0027] 1-vacuum chamber, 101-front panel, 102-chamber body, 103-exhaust valve, 104-adapter pin, 105-transparent window glass, 106-chamber window, 2-semiconductor group, 201-first-level semiconductor, 202-second-level semiconductor, 203-third-level semiconductor, 3-imaging circuit board, 4-heat dissipation system, 401-heat sink, 402-heat dissipation fan, 403-heat pipe, 5-visible light imaging chip. DETAILED DESCRIPTION

[0028] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0029] Reference Figure 1 The visible light imaging chip cooling and heat dissipation device includes a vacuum chamber 1 for placing a visible light imaging chip 5, a semiconductor group 2 arranged inside the vacuum chamber 1, an imaging circuit board 3 sleeved on the side of the vacuum chamber 1, and a heat dissipation system 4 in contact with the outer bottom surface of the vacuum chamber 1.

[0030] The vacuum chamber 1 includes a transparent window glass 105, a front panel 101, a chamber body 102, an exhaust valve 103 arranged on the side wall of the chamber body 102, and a plurality of transfer pins 104 arranged on the side of the chamber body 102 and connected to the chamber body 102. A chamber window 106 is arranged on the front panel 101. For better sealing, the contact parts of the transparent window glass 105 and the chamber window 106 are gold-plated, and the transparent window glass 105 is sealed and welded on the chamber window 106. The vacuum degree of the vacuum chamber 1 is greater than or equal to 1.0×10 -1 Pa.

[0031] The pins of the visible light imaging chip 5 are connected to the outside of the vacuum chamber 1 through the adapter pins 104 and are inserted and soldered on the imaging circuit board 3 .

[0032] The semiconductor group 2 includes a first-level semiconductor 201, a second-level semiconductor 202, and a third-level semiconductor 203 which are sequentially arranged along the axial direction of the vacuum chamber 1, wherein the first-level semiconductor 201 is located at the mouth of the vacuum chamber 1; and the third-level semiconductor 203 is located at the bottom of the vacuum chamber 1. The cold end of the first-level semiconductor 201 is bonded to the back of the visible light imaging chip 5, and the hot end of the first-level semiconductor 201 is bonded to the cold end of the second-level semiconductor 202; the hot end of the second-level semiconductor 202 is bonded to the cold end of the third-level semiconductor 203; the hot end of the third-level semiconductor 203 is fixed to the inner bottom surface of the bottom plate of the vacuum chamber 1, and the outer bottom surface of the vacuum chamber 1 is in contact with the heat dissipation system 4).

[0033] The heat dissipation system 4 includes a heat pipe 403, a heat sink 401, and a heat dissipation fan 402 disposed at the end of the heat sink 401. The cold end of the heat pipe 403 contacts the outer bottom surface of the vacuum chamber 1, and the hot end of the heat pipe 403 contacts the heat sink 401; the air outlet of the heat dissipation fan 402 faces the heat sink 401. In order to improve thermal conductivity, a thermal grease layer is further provided on the contact surface between the bottom plate of the vacuum chamber 1 and the heat pipe 403 in this embodiment.

[0034] The working principle of the device is as follows:

[0035] During operation, the cold end of the first-level semiconductor 201 is in direct contact with the back side of the visible light imaging chip 5, and the heat of the visible light imaging chip 5 is transferred to the cold end of the second-level semiconductor 202. The hot end of the second-level semiconductor 202 then transfers the heat to the cold end of the third-level semiconductor 203. The hot end of the third-level semiconductor 203 then transfers the heat to the heat pipe 403. The heat pipe 403 then transfers the heat to the heat sink 401, and the heat is rapidly convected by the heat dissipation fan 402 for heat dissipation. The visible light imaging chip 5 is vacuum-sealed by the vacuum cavity 1 to isolate it from external heat conduction and heat radiation, thereby achieving cooling of the visible light imaging chip 5.

[0036] The method for making the device comprises the following steps:

[0037] Step 1) bonding the visible light imaging chip 5 to the cold end of the first-stage semiconductor 201 in the semiconductor group 2, ensuring that the center of the visible light imaging chip 5 coincides with the center of the semiconductor group 2;

[0038] Step 2) fixing the visible light imaging chip 5 and the semiconductor group 2 bonded together on the bottom plate of the vacuum chamber 1, ensuring that the hot end of the semiconductor group 2 is in full contact with the bottom plate of the vacuum chamber 1;

[0039] Step 3) soldering the pins of the visible light imaging chip 5 to the corresponding transfer pins 104 through wires;

[0040] Step 4) The contact parts of the transparent window glass 105 and the cavity window 106 are all plated with gold.

[0041] The front panel 101 and the transparent window glass 105 are welded to ensure that the weld is well sealed;

[0042] Step 5) installing the welded front panel 101 on the vacuum chamber 1;

[0043] Step 6) Install the imaging circuit board 3 and solder the adapter pins 104 to the imaging circuit board 3;

[0044] Step 7) evacuating the vacuum chamber 1 through the exhaust valve 103, and after the vacuum degree meets the requirements, welding and sealing the mouth of the exhaust valve 103;

[0045] Step 8) Install the heat pipe 403, apply a thermal grease layer on the contact surface between the bottom plate of the vacuum chamber 1 and the heat pipe 403, one end of the heat pipe 403 is connected to the outside of the bottom plate of the vacuum chamber 1, and the other end is connected to the heat dissipation system 4.

[0046] The above descriptions are merely embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings, or directly or indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A visible light imaging chip cooling and heat dissipation device, characterized in that: It comprises a vacuum chamber (1) for accommodating a visible light imaging chip (5), a semiconductor group (2) arranged inside the vacuum chamber (1), a square-shaped imaging circuit board (3) sleeved on the side of the vacuum chamber (1), and a heat dissipation system (4) in contact with the outer bottom surface of the vacuum chamber (1); The vacuum chamber (1) comprises a transparent window glass (105), a front panel (101), a chamber body (102), an exhaust valve (103) arranged on the side wall of the chamber body (102), and a plurality of transfer pins (104) arranged on the side of the chamber body (102) and connected to the chamber body (102); a chamber window (106) is arranged on the front panel (101); the transparent window glass (105) is sealed on the chamber window (106), and the contact parts between the transparent window glass (105) and the chamber window (106) are gold-plated; The vacuum degree of the vacuum chamber (1) is greater than or equal to 1.0×10 -1 Pa; The imaging circuit board (3) is connected to the pins of the visible light imaging chip (5) via the adapter pins (104); The semiconductor group (2) comprises a first-level semiconductor (201), a second-level semiconductor (202) and a third-level semiconductor (203); the cold end of the first-level semiconductor (201) contacts the back side of the visible light imaging chip (5), and the hot end contacts the cold end of the second-level semiconductor (202); the hot end of the second-level semiconductor (202) contacts the cold end of the third-level semiconductor (203), the hot end is fixed to the inner bottom surface of the vacuum chamber (1), and the outer bottom surface of the vacuum chamber (1) contacts the heat dissipation system (4).

2. The visible light imaging chip cooling and heat dissipation device according to claim 1, characterized in that: The heat dissipation system (4) comprises a heat pipe (403), a heat sink (401), and a heat dissipation fan (402) arranged at the end of the heat sink (401); the cold end of the heat pipe (403) contacts the outer bottom surface of the vacuum chamber (1), and the hot end of the heat pipe (403) contacts the heat sink (401); and the air outlet of the heat dissipation fan (402) faces the heat sink (401).

3. The visible light imaging chip cooling and heat dissipation device according to claim 2, characterized in that: A thermally conductive silicone grease layer is provided on the contact surface between the bottom plate of the vacuum chamber (1) and the heat conducting pipe (403).

4. The visible light imaging chip cooling and heat dissipation device according to claim 3, characterized in that: The areas of the first-level semiconductor (201), the second-level semiconductor (202) and the third-level semiconductor (203) increase in sequence.

5. The visible light imaging chip cooling and heat dissipation device according to claim 4, characterized in that: The center of the semiconductor group (2) coincides with the center of the visible light imaging chip (5).

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