Electronic device and method of manufacturing the same

Abstract

The present invention discloses an electronic device and a manufacturing method thereof. The manufacturing method comprises: providing a substrate; forming a thin film circuit on the substrate, the thin film circuit comprising at least one thin film transistor and at least one conductive circuit; forming at least one first connection pad on the substrate, the first connection pad being electrically connected to the thin film transistor through the conductive circuit; arranging the substrate on a driving circuit board, the driving circuit board comprising at least one second connection pad, wherein the second connection pad is adjacent to the first connection pad and is arranged corresponding to the first connection pad; and forming a conductive member covering at least part of the second connection pad and the first connection pad, wherein the second connection pad is electrically connected to the first connection pad through the conductive member.

Description

Technical Field

[0001] The invention relates to an electronic device and a manufacturing method thereof. Background Art

[0002] In the manufacturing of traditional optoelectronic devices, multiple thin film transistors are made on a substrate to form a thin film transistor substrate, and then the thin film transistors are used to drive the corresponding optoelectronic elements. Taking organic light emitting diode display devices as an example, if there are multiple different product sizes or functions, the method of using thin film transistors to drive the organic light emitting diodes to emit light must design corresponding thin film processes for each product size or function of the organic light emitting diode device, and expensive thin film transistor processes / masks / substrates / materials are required, which is very unfavorable to the changing product needs and is also quite inflexible in application. Summary of the invention

[0003] The purpose of the present invention is to provide an electronic device and a manufacturing method thereof. The present invention does not need to design its process for each product size and function. In addition to having a simple process and lower cost, it has more flexibility in application and can be applied to various product requirements.

[0004] To achieve the above-mentioned purpose, a manufacturing method of an electronic device according to the present invention includes: providing a substrate, wherein the substrate has a first surface and a second surface relative to each other; forming a thin film circuit on the first surface of the substrate, wherein the thin film circuit includes at least one thin film transistor and at least one conductive circuit; forming at least one first connection pad on the first surface of the substrate, wherein the first connection pad is electrically connected to the thin film transistor through the conductive circuit; setting the substrate on a driving circuit board through the second surface, wherein the driving circuit board includes at least one second connection pad, the second connection pad is adjacent to the first connection pad and is correspondingly set to the first connection pad; and forming a conductive member covering at least a portion of the second connection pad and the first connection pad, wherein the second connection pad is electrically connected to the first connection pad through the conductive member.

[0005] In some embodiments, the substrate is a hard board or a soft board.

[0006] In some embodiments, before the step of placing the substrate on the driving circuit board, the method further includes: removing the rigid carrier board.

[0007] In some embodiments, the conductive element covers at least a portion of the second connection pad and the first connection pad by printing or coating.

[0008] In some embodiments, the material of the conductive element includes solder paste, silver paste, or anisotropic conductive paste, or a combination thereof.

[0009] In some embodiments, after the step of forming a thin film circuit on the substrate, the method further includes: forming a protective layer covering the thin film circuit.

[0010] In some embodiments, the manufacturing method further includes: setting a surface mount component on the driving circuit board, wherein the driving circuit board further includes at least one third connection pad, the surface mount component is electrically connected to the thin film transistor through the second connection pad, and is electrically connected to the circuit of the driving circuit board through the third connection pad.

[0011] In some embodiments, the manufacturing method further includes: forming at least one fourth connection pad on the first surface of the substrate, wherein the fourth connection pad is electrically connected to the thin film transistor through a conductive line; and setting a surface mount component on the first surface of the substrate, wherein the surface mount component is electrically connected to the thin film transistor through the fourth connection pad.

[0012] In some embodiments, the manufacturing method further includes: forming at least one fourth connection pad on the first surface of the substrate, wherein the fourth connection pad is electrically connected to the thin film transistor through a conductive line; and setting at least one functional chip on the first surface of the substrate, wherein the functional chip is electrically connected to the thin film transistor through the fourth connection pad.

[0013] In some embodiments, the manufacturing method further includes: forming a protection layer covering the thin film circuit and the functional wafer.

[0014] In some embodiments, the surface mount component includes at least one light emitting diode or micro light emitting diode.

[0015] In some embodiments, the functional chip includes at least one light emitting diode chip or a micro light emitting diode chip.

[0016] In some embodiments, the manufacturing method further includes: arranging a plurality of substrate arrays on a driving circuit board; wherein each substrate has a plurality of thin film circuits and a plurality of first connection pads, and each thin film circuit is electrically connected to the corresponding plurality of first connection pads; the driving circuit board has a plurality of second connection pads; there are a plurality of conductive members, and one of the first connection pads corresponding to each thin film circuit and one of the second connection pads of the driving circuit board are electrically connected to each other through one of the conductive members; and two thin film circuits respectively arranged on two adjacent substrates are electrically connected to each other through two first connection pads and their corresponding second connection pads, and two conductive members.

[0017] In some embodiments, the manufacturing method further includes: arranging a plurality of substrate arrays on a driving circuit board; wherein each substrate has a plurality of thin film circuits and a plurality of first connection pads, and each thin film circuit is electrically connected to the corresponding plurality of first connection pads; the driving circuit board has a plurality of second connection pads; there are a plurality of conductive members, and one of the first connection pads corresponding to each thin film circuit and one of the second connection pads of the driving circuit board are electrically connected to each other through one of the conductive members; and two thin film circuits respectively arranged on two adjacent substrates are electrically connected to each other through two first connection pads and their corresponding second connection pads, and a conductive member.

[0018] To achieve the above-mentioned purpose, an electronic device according to the present invention includes a substrate, a thin film circuit, at least one first connection pad, a driving circuit board and a conductive member. The substrate has a first surface and a second surface opposite to each other. The thin film circuit is arranged on the first surface of the substrate, and the thin film circuit includes at least one thin film transistor and at least one conductive circuit. The first connection pad is arranged on the first surface of the substrate, and the first connection pad is electrically connected to the thin film transistor through the conductive circuit. The driving circuit board includes at least one second connection pad, wherein the substrate is arranged on the driving circuit board through the second surface, and the second connection pad is arranged corresponding to the first connection pad. The conductive member covers at least part of the second connection pad and the first connection pad, and the second connection pad is electrically connected to the first connection pad through the conductive member.

[0019] In some embodiments, the electronic device further includes a protective layer covering the thin film circuit.

[0020] In some embodiments, the electronic device further includes a surface mount component, which is disposed on a driving circuit board, and the driving circuit board further includes at least one third connection pad. The surface mount component is electrically connected to the thin film transistor through the second connection pad, and is electrically connected to the circuit of the driving circuit board through the third connection pad.

[0021] In some embodiments, the electronic device further includes at least one fourth connection pad and a surface mount component. The fourth connection pad is disposed on the first surface of the substrate, and the fourth connection pad is electrically connected to the thin film transistor through a conductive line. The surface mount component is disposed on the first surface of the substrate, and the surface mount component is electrically connected to the thin film transistor through the fourth connection pad.

[0022] In some embodiments, the electronic device further includes at least one fourth connection pad and at least one functional chip. The fourth connection pad is disposed on the first surface of the substrate, and the fourth connection pad is electrically connected to the thin film transistor through a conductive line. The functional chip is disposed on the first surface of the substrate, and the functional chip is electrically connected to the thin film transistor through the fourth connection pad.

[0023] In some embodiments, the electronic device further includes a protection layer covering the thin film circuit and the functional chip.

[0024] In some embodiments, a plurality of substrate arrays are arranged on a driving circuit board; each substrate has a plurality of thin film circuits and a plurality of first connection pads, and each thin film circuit is electrically connected to the corresponding plurality of first connection pads; the driving circuit board has a plurality of second connection pads; there are a plurality of conductive members, and one of the first connection pads corresponding to each thin film circuit and one of the second connection pads of the driving circuit board are electrically connected to each other through one of the conductive members; wherein two thin film circuits respectively arranged on two adjacent substrates are electrically connected to each other through two first connection pads and their corresponding second connection pads, and two conductive members.

[0025] In some embodiments, multiple substrate arrays are arranged on a driving circuit board; each substrate has multiple thin film circuits and multiple first connection pads, and each thin film circuit is electrically connected to the corresponding multiple first connection pads; the driving circuit board has multiple second connection pads; there are multiple conductive members, and one of the first connection pads corresponding to each thin film circuit and one of the second connection pads of the driving circuit board are electrically connected to each other through one of the conductive members; wherein two thin film circuits respectively arranged on two adjacent substrates are electrically connected to each other through two first connection pads and their corresponding second connection pads, and a conductive member.

[0026] As mentioned above, in the electronic device and the manufacturing method thereof of the present invention, a thin film circuit including at least one thin film transistor and at least one conductive circuit and at least one first connection pad are formed on a substrate, and a conductive member covering at least a portion of a second connection pad of a driving circuit board and the first connection pad of the substrate is used so that the second connection pad can be electrically connected to the first connection pad through the conductive member. This makes it unnecessary for the present invention to design its process for each product size and function. Therefore, in addition to having a simple process and lower cost, it is more flexible in application and can be adapted to a variety of product requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 The figure is a schematic diagram of the process steps of a method for manufacturing an electronic device according to an embodiment of the present invention.

[0028] Figure 2A , Figure 2C , Figure 2D Schematic diagrams of layouts of manufacturing processes of electronic devices according to embodiments of the present invention are shown respectively.

[0029] Figure 2B Schematic cross-sectional view of a substrate according to an embodiment of the present invention.

[0030] Figure 2E to Figure 2G Display separately Figure 2DSchematic diagram of the cross-section along the 2E-2E cutting line, the 2F-2F cutting line and the 2G-2G cutting line.

[0031] Figure 2H FIG. 4 is a schematic diagram of the layout of a driving circuit board according to an embodiment.

[0032] Fig.2I FIG. 4 is a schematic diagram of the layout of the surface mount components of the embodiment.

[0033] Figure 2J FIG. 4 is a schematic diagram of the layout of an electronic device according to an embodiment of the present invention.

[0034] Figure 2K show Figure 2J A circuit diagram of an embodiment of the present invention.

[0035] Figure 3A and Figure 3B They are schematic layout diagrams of thin film circuit substrates according to different embodiments of the present invention.

[0036] FIG. 4A to FIG. 4C They are schematic diagrams of layouts of electronic devices according to different embodiments of the present invention.

[0037] Figure 5 and Figure 6 They are schematic layout diagrams of an electronic device according to yet another embodiment of the present invention. DETAILED DESCRIPTION

[0038] An electronic device and a method for manufacturing the same according to preferred embodiments of the present invention will be described below with reference to the accompanying drawings, wherein the same elements will be denoted by the same reference numerals.

[0039] Figure 1 FIG. 1 is a schematic diagram of the process steps of a method for manufacturing an electronic device according to an embodiment of the present invention. Figure 1 As shown, the manufacturing method of the electronic device of the present invention may include: providing a substrate, wherein the substrate has a first surface and a second surface relative to each other (step S01); forming a thin film circuit on the first surface of the substrate, wherein the thin film circuit includes at least one thin film transistor and at least one conductive circuit (step S02); forming at least one first connection pad on the first surface of the substrate, wherein the first connection pad is electrically connected to the thin film transistor through the conductive circuit (step S03); disposing the substrate on a driving circuit board through the second surface, wherein the driving circuit board includes at least one second connection pad, the second connection pad is adjacent to the first connection pad, and is disposed corresponding to the first connection pad (step S04); and, forming a conductive member covering at least a portion of the second connection pad and the first connection pad, wherein the second connection pad is electrically connected to the first connection pad through the conductive member (step S05).

[0040] In some embodiments, the substrate may be an insulating substrate, or a conductive substrate plus an insulating layer. In some embodiments, the substrate may be a hard board or a soft board. If the substrate is a soft board, in order to allow subsequent components to be smoothly formed on the soft board through subsequent processes and to facilitate operation of the soft board, the soft board must first be formed on a rigid carrier, and then the rigid carrier is removed in a subsequent step. If the substrate is a hard board, this process is not required.

[0041] Please refer to Figure 1 And cooperate Figures 2A to 2K , to illustrate the detailed technical content of each of the above steps. Figure 2A , Figure 2C , Figure 2D , Figure 2H , Fig.2I and Figure 2J Schematic diagrams showing the layout of the manufacturing process of the electronic device according to the embodiment of the present invention, Figure 2B Shown is a schematic cross-sectional view of a substrate of an embodiment, Figure 2E to Figure 2G Then display Figure 2D Schematic diagram of the cross section along the 2E-2E cutting line, the 2F-2F cutting line and the 2G-2G cutting line, Figure 2H is a schematic diagram of the layout of the driving circuit board of the embodiment, Fig.2I is a schematic diagram of the layout of the surface mount components of the embodiment, and Figure 2K show Figure 2J A circuit diagram of an embodiment of the present invention.

[0042] First, if Figure 2AAs shown, step S01 is: providing a substrate 21, wherein the substrate 21 has a first surface S1 and a second surface S2 relative to each other. Here, the first surface S1 can be referred to as the upper surface of the substrate 21, and the second surface S2 can be referred to as the lower surface. The material of the substrate 21 can be glass, resin, metal or ceramic, or a composite material. Among them, the resin material is flexible and can include organic polymer materials, and the glass transition temperature (Glass Transition Temperature, Tg) of the organic polymer material can be, for example, between 250 degrees Celsius and 600 degrees Celsius, and the preferred temperature range can be, for example, between 300 degrees Celsius and 500 degrees Celsius. With such a high glass transition temperature, a thin film process can be directly performed on the substrate 21 in the subsequent process to form a thin film transistor and other components or circuits. The aforementioned organic polymer material may be a thermoplastic material, such as polyimide (PI), polyethylene (PE), polyvinyl chloride (PVC), polystyrene (PS), acrylic, fluorinated polymer, polyester or nylon.

[0043] In some embodiments, please refer to Figure 2B As shown, for example, a soft material (such as PI) can be formed on a rigid carrier 4 by coating (or gluing), and then cured (thermal curing or photocuring) to form a substrate 21 (soft board). Moreover, before setting the substrate 21 (soft board) on the driving circuit board in step S04, the rigid carrier 4 can be removed. The rigid carrier 4 is, for example, but not limited to, a glass plate, a ceramic plate, a metal plate, or a quartz plate.

[0044] Next, please refer to Figure 2AAs shown, step S02 is performed: a thin film circuit 22 is formed on the first surface S1 of the substrate 21, wherein the thin film circuit 22 includes at least one thin film transistor and at least one conductive circuit 222. This embodiment takes the formation of two thin film transistors 221a, 221b and a plurality of conductive circuits 222 on the substrate 21 as an example, and the thin film transistors 221a, 221b are electrically connected to each other through the conductive circuits 222. Here, the thin film circuit 22 and the conductive circuit 222 can be formed on the substrate 21, for example, by using a thin film process. The thin film transistors 221a, 221b and the conductive circuit 222 can be directly formed and arranged on the substrate 21; or, the thin film transistors 221a, 221b and the conductive circuit 222 can also be indirectly formed on the substrate 21, for example, a buffer layer or an insulating layer is included between the two, and there is no limitation. The aforementioned thin film process can include a low temperature polysilicon (LTPS) process, an amorphous silicon (a-Si) process, or a metal oxide (such as IGZO) semiconductor process, and the present invention is not limited thereto. The material of the conductive circuit 222 can be a single-layer or multi-layer structure composed of metal (such as aluminum, copper, silver, molybdenum, titanium) or its alloy, and a part of the thin film transistor 221a, 221b, such as the source or drain, can be made of the same material and process as the conductive circuit 222 to save costs. In some embodiments, the conductive circuit 222 can be directly or indirectly electrically connected to the thin film transistor 221a, 221b through other conductive layers; or the conductive circuit 222 can also be a wire electrically connected between the two thin film transistors 221a, 221b; or the conductive circuit 222 can also be a wire electrically connected between the thin film transistors 221a, 221b and other components; or the two conductive circuits 222 can be separated by an insulating layer to avoid short circuits, and the present invention is not limited. The aforementioned conductive circuit 222 is a general term, and as long as there is a film layer or circuit that can conduct electricity in the thin film circuit 22 formed on the substrate 21, it can be called a conductive circuit 222. In some embodiments, the conductive circuit 222 may also include a circuit for transmitting a scan signal (scan line) or a circuit for transmitting a data signal (data line), depending on the function and purpose of the electronic device.

[0045] Then, if Figure 2CAs shown, step S03 is performed: at least one first connection pad 23 is formed on the first surface S1 of the substrate 21, wherein the first connection pad 23 is electrically connected to the thin film transistors 221a and 221b through the conductive line 222. In this embodiment, four first connection pads 23 are formed on the first surface S1 of the substrate 21, and the four first connection pads 23 are located at the edge of the substrate 21 and respectively cover part of the conductive line 222, so that the first connection pads 23 can be electrically connected to the thin film transistors 221a and 221b through the conductive line 222. The material of the first connection pad 23 is, for example but not limited to, copper, silver or gold, or a combination thereof, or other suitable conductive materials. In some embodiments, in order to make a thicker first connection pad 23, the first connection pad 23 can be made on the conductive line 222 by, for example, electroplating, printing, or evaporation plus lift-off patterning. In other embodiments, the first connection pad 23 can also be made by a thin film process without limitation. In addition, the process of the first connection pad 23 (step S03) and the process of the thin film circuit 22 (step S02) can be swapped. In other words, the thin film transistors 221a, 221b and the conductive circuit 222 can be processed first, and then the first connection pad 23 can be processed, or vice versa, and the present invention is not limited thereto.

[0046] Please refer to Figure 2D As shown, after step S02 of forming the thin film circuit 22 on the substrate 21, the manufacturing method of this embodiment may further include: forming a protective layer 24 covering the thin film circuit 22 to form a thin film circuit substrate 2. Here, the protective layer 24 can be covered on the thin film circuit 22 by resin transfer molding (Resin Transfer Molding) or sealant dispensing or other appropriate methods to protect moisture or foreign matter from entering the thin film circuit 22 and destroying its characteristics. In some embodiments, the protective layer 24 can be formed at the same time as the thin film circuit 22 is manufactured by the LTPS process, for example, to save costs. In some embodiments, the protective layer 24 can also be formed after step S03 of forming the first connection pad 23, which is not limited by the present invention.

[0047] The protective layer 24 of this embodiment covers part of the first connection pad 23, and the part of the first connection pad 23 not covered by the protective layer 24 can be used to be electrically connected to the corresponding second connection pad via the conductive member in the future. In addition, in some embodiments, if there is a protective layer 24 around the first connection pad 23, it can also avoid the short circuit between the subsequent conductive member and the adjacent first connection pad 23 of different signals due to the diffusion effect of the conductive member. In addition, in this embodiment, if Figure 2E to Figure 2GAs shown, in addition to forming thin film transistors 221a, 221b, conductive circuits 222, first connection pads 23 and protective layers 24 on the substrate 21, the thin film circuit 22 may further include other film layers, such as insulating layers 27, 28, and / or other buffer film layers.

[0048] Then, proceed to step S04, such as Figure 2D and Figure 2H As shown, the substrate 21 is disposed on the driving circuit board 3 through the second surface S2, wherein the driving circuit board 3 includes at least one second connection pad 31, the second connection pad 31 is adjacent to the first connection pad 23, and is disposed corresponding to the first connection pad 23. The driving circuit board 3 can be a flexible circuit board or a rigid circuit board, and is not limited. Here, the second surface S2 of the substrate 21, that is, Figure 2D The lower surface of the thin film circuit substrate 2 is provided on the Figure 2H On the driving circuit board 3. Figure 2H As shown, the driving circuit board 3 of this embodiment includes four second connection pads 31. The material and process of the second connection pads 31 can be the same as or different from those of the first connection pads 23. In addition, when making the layout position of the second connection pads 31, it is necessary to refer to the layout position of the thin film circuit 22 of the thin film circuit substrate 2 and the first connection pads 23, so that when the thin film circuit substrate 2 is set on the driving circuit board 3, the second connection pads 31 can be respectively adjacent to the corresponding first connection pads 23 ( Figure 2J ).

[0049] Please refer to Figure 2H As shown, the driving circuit board 3 of this embodiment may further include two conductive circuits 32, and three second connection pads 31 are arranged and partially cover the two conductive circuits 32, but only two second connection pads 31 are electrically connected to the corresponding conductive circuits 32 through conductive holes H (the conductive holes H may be filled with conductive materials, such as but not limited to copper glue). Figure 2H In the embodiment, although a second connection pad 31 is disposed (partially covered) on the conductive circuit 32, since there is no conductive hole, it means that the second connection pad 31 is not electrically connected to the two conductive circuits 32 below it (the two can be separated by an insulating layer). In addition, the driving circuit board 3 of this embodiment can further include at least one third connection pad 33, which is disposed and partially covered on the conductive circuit 32, but is not electrically connected to the conductive circuit 32.

[0050] Next, step S05 is performed: forming a conductive member 11 covering at least a portion of the second connection pad 31 and the first connection pad 23, wherein the second connection pad 31 is electrically connected to the first connection pad 23 through the conductive member 11. Figure 2JAs shown, the conductive member 11 covering at least part of the second connection pad 31 and the first connection pad 23 can be formed by printing or coating, so that the two can be electrically connected. The material of the conductive member 11 can be, for example, but not limited to, solder paste, silver glue, or anisotropic conductive glue, or a combination thereof, or other suitable materials, and is not limited. The number of conductive members 11 in this embodiment is 4, and they are respectively arranged and partially covered on the second connection pad 31 and the first connection pad 23, so that the second connection pad 31 can be electrically connected to the corresponding first connection pad 23 through the conductive member 11.

[0051] In addition, if Fig.2I and Figure 2J As shown, the manufacturing method of the electronic device 1 of this embodiment may further include: arranging a surface mount component 12 on the driving circuit board 3. Here, the surface mount component 12 is arranged on the driving circuit board 3 using surface mount technology (SMT). The surface mount component 12 may be, for example, a dual-electrode component, such as but not limited to, including at least one light emitting diode (LED) or micro light emitting diode (μLED). In some embodiments, for example, the solder may be melted by heating so that the electrodes of the surface mount component 12 may be electrically connected to the electrodes on the driving circuit board 3 respectively.

[0052] Please refer to Figure 2K As shown, Figure 2K for Figure 2J A circuit diagram of an electronic device 1 is shown in FIG. Figure 2K A 2T1C circuit architecture is taken as an example. However, in different embodiments, it may also be other circuit architectures, such as 4T2C or 5T1C, and is not limited thereto.

[0053] exist Figure 2K In addition to the two thin film transistors 221a and 221b and the plurality of conductive lines 222, the thin film circuit 22 may further include a capacitor C. The connection relationship of the components of the thin film circuit 22 may refer to Figure 2K , no further explanation is given here. The plurality of conductive lines 222 of the present embodiment may include a scan line SL, a data line DL, a wire connecting the thin film transistors 221a and 221b, and a wire connecting the thin film transistors 221a and 221b and the first connection pad 23, respectively. Therefore, when the scan signal transmitted by the scan line SL turns on the thin film transistor 221a, the data signal may be transmitted through the data line DL through the thin film transistor 221a to the gate of the thin film transistor 221b, turning on the thin film transistor 221b, so that the voltage Vdd may be transmitted through the thin film transistor 221b to the light emitting diode 123, so that the light emitting diode 123 may emit light.

[0054] In this embodiment, if Figure 2J and Figure 2KAs shown, the electronic device 1 includes a substrate 21, a thin film circuit 22, a plurality of first connection pads 23, a driving circuit board 3 and a plurality of conductive members 11. The substrate 21 has a first surface S1 and a second surface S2 opposite to each other. The thin film circuit 22 is disposed on the first surface S1 of the substrate 21 and includes thin film transistors 221a, 221b and conductive circuits 222 (for simplicity of the drawing, Figure 2J 221a, 221b and 222 are not marked). The first connection pad 23 is arranged on the first surface S1 of the substrate 21, and the first connection pad 23 is electrically connected to the thin film transistors 221a and 221b through the conductive line 222. The driving circuit board 3 includes a plurality of second connection pads 31, and the substrate 21 is arranged on the driving circuit board 3 through the second surface S2, and each second connection pad 31 is adjacent to the corresponding first connection pad 23 and is arranged corresponding to the first connection pad 23. In addition, the conductive member 11 covers at least a portion of the second connection pad 31 and the first connection pad 23, so that the second connection pad 31 can be electrically connected to the corresponding first connection pad 23 through the conductive member 11.

[0055] In addition, the electronic device 1 may further include a surface mount component 12, which may include a light emitting diode 123 and two connection pads 121 and 122. The surface mount component 12 is electrically connected to the thin film transistor 221b through the connection pad 121 and the second connection pad 31, and is electrically connected to the driving circuit board 3 through the connection pad 122 and the third connection pad 33. Here, the third connection pad 33 may be electrically connected to the voltage Vss, such as ground (0V), so that the driving circuit of the driving circuit board 3 may transmit corresponding scanning signals and data signals through its conductive circuit 32, the second connection pad 31, the conductive member 11, the first connection pad 23, the thin film transistors 221a and 221b of the thin film circuit 22 and the conductive circuit 222, and is electrically connected to the voltage Vdd or the voltage Vss through the conductive circuit 32, the second connection pad 31, the conductive member 11, the first connection pad 23, and the third connection pad 33, thereby driving the light emitting diode 123 of the surface mount component 12 to emit light. In some embodiments, the LED 123 may emit, for example, red light, blue light, green light, ultraviolet light, infrared light, or light of other wavelengths.

[0056] Please refer to Figure 3A and Figure 3B As shown in FIG. 2 , they are schematic layout diagrams of thin film circuit substrates 2a and 2b according to different embodiments of the present invention.

[0057] like Figure 3AAs shown, the manufacturing process of the thin film circuit substrate 2a of this embodiment and the component composition and connection relationship of each component are roughly the same as those of the thin film circuit substrate 2 of the previous embodiment. The difference is that the manufacturing method of the thin film circuit substrate 2a of this embodiment can further include: forming at least one fourth connection pad 25 on the first surface S1 of the substrate 21, wherein the fourth connection pad 25 is electrically connected to the thin film transistor 221b through the conductive line 222; and arranging a surface mount component 12a on the first surface S1 of the substrate 21, wherein the surface mount component 12a is electrically connected to the thin film transistor 221b through the fourth connection pad 25 and the conductive line 222, thereby enabling the thin film circuit 22 to drive the light emitting diode 123 of the surface mount component 12a to emit light. Among them, a sixth connection pad 35 connected to the cathode of the light emitting diode 123 can be electrically connected to the ground terminal through the conductive line 222, for example. It is worth mentioning that because the surface mount component 12 needs to be electrically connected to the fourth connection pad 25 and the sixth connection pad 35 on the first surface S1 of the substrate 21, the surface mount component 12a is not covered with the protective layer 24 on the first surface S1 of the substrate 21; or, in different embodiments, after the surface mount component 12a is set, a protective layer 24 covering the thin film circuit 22 and the surface mount component 12a is set to protect the thin film circuit 22 and the surface mount component 12a, and the present invention is not limited thereto.

[0058] In addition, if Figure 3BAs shown, the manufacturing process of the thin film circuit substrate 2b of this embodiment and the thin film circuit substrate 2a of the aforementioned embodiment and its component composition and the connection relationship of each component are roughly the same. The difference is that the aforementioned thin film circuit substrate 2a has only one thin film circuit 22, but the thin film circuit substrate 2b of this embodiment is taken as an example including three thin film circuits 22 arranged side by side and electrically connected. In response to the layout of the three thin film circuits 22, the number of the first connection pads 23 of this embodiment is 10. Of course, the conductive circuits, second connection pads and conductive parts (not shown) of the driving circuit board should also be arranged corresponding to the layout of the thin film circuit substrate 2b. In addition, the surface mount component 12b of this embodiment includes three light-emitting diodes 123 and four connection pads 121, 122, 124, 125. Among them, the connection pad 121 is arranged on the fourth connection pad 25 and is electrically connected to the thin film transistor 221b of the first thin film circuit 22 through the fourth connection pad 25, the connection pad 122 is arranged on the sixth connection pad 35 and is electrically connected to the sixth connection pad 35 (the sixth connection pad 35 can be electrically connected to the first connection pad 23 through the conductive line 222, for example, to the ground terminal), the connection pad 124 is arranged on another fourth connection pad 25 and is electrically connected to the thin film transistor 221b of the second thin film circuit 22 through the fourth connection pad 25, and the connection pad 125 is arranged on the fifth connection pad 34 and is electrically connected to the thin film transistor 221b of the third thin film circuit 22 through the fifth connection pad 34 and the conductive line 222.

[0059] In some embodiments, the surface mount component 12b may include three sub-pixels, each sub-pixel includes a light emitting diode 123, and the three light emitting diodes 123 in the three sub-pixels may be red, blue and green LEDs, respectively, to form a full-color pixel unit, thereby forming a full-color LED display. Of course, in different embodiments, less than or more than three thin film circuits 22 may form a thin film circuit substrate, and match the corresponding surface mount components and driving circuit boards, and the present invention is not limited.

[0060] Please refer to FIG. 4A to FIG. 4C As shown, they are schematic layout diagrams of electronic devices 1c, 1d, and 1e according to different embodiments of the present invention.

[0061] like Figure 4AAs shown, the manufacturing process of the electronic device 1c of this embodiment and the component composition and connection relationship of each component are roughly the same as those of the electronic device 1 of the previous embodiment. The difference is that the thin film circuit substrate 2 of the electronic device 1 has only one thin film circuit 22, but the thin film circuit substrate 2c of the electronic device 1c of this embodiment is taken as an example including three thin film circuits 22 arranged side by side and electrically connected. In addition, the conductive circuit 32 of the driving circuit board 3c is also arranged corresponding to the layout of the three thin film circuits 22. In response to the layout of the three thin film circuits 22, the number of the first connection pad 23, the second connection pad 31 and the conductive member 11 of this embodiment are all 11, and are arranged corresponding to each other. In addition, the surface mount component 12c of this embodiment includes three light-emitting diodes 123 and four connection pads 121, 122, 124, 125. The connection pad 121 is electrically connected to the thin film transistor 221b of the first thin film circuit 22 through the second connection pad 31, the connection pad 122 is electrically connected to the third connection pad 33 (the third connection pad 33 can be connected to the ground terminal, for example), the connection pad 124 is electrically connected to the thin film transistor 221b of the second thin film circuit 22 through another second connection pad 31, and the connection pad 125 is electrically connected to the thin film transistor 221b of the third thin film circuit 22 through the fifth connection pad 34, the conductive circuit 32, and another second connection pad 31. Therefore, the driving circuit of the driving circuit board 3c can drive the three light-emitting diodes 123 corresponding to the surface mount component 12c to emit light through the conductive circuit 32, the second connection pad 31, the conductive member 11, the first connection pad 23, the thin film transistors 221a and 221b of the three thin film circuits 22, and the conductive circuit 222.

[0062] In some embodiments, the surface mount component 12c of the electronic device 1c may include three sub-pixels, and the three light emitting diodes 123 in the three sub-pixels may be red, blue and green LEDs, respectively, to form a full-color pixel unit, thereby forming a full-color LED display, and the electronic device 1c may be driven by the driving circuit board 3c to display images. Of course, in different embodiments, less than or more than three thin film circuits 22 may form a thin film circuit substrate, and the present invention is not limited thereto.

[0063] In addition, if Figure 4BAs shown, the manufacturing process of the electronic device 1d of this embodiment and its component composition and connection relationship of each component are roughly the same as those of the electronic device 1 of the previous embodiment. The difference is that in addition to the thin film circuit substrate 2d of the electronic device 1d of this embodiment including the thin film circuit 22, the manufacturing method of this embodiment may further include: setting at least one functional chip 26 on the first surface S1 of the substrate 21, wherein the functional chip 26 is electrically connected to the thin film transistor 221b through the fourth connection pad 25, thereby driving the functional chip 26 through the thin film circuit 22. Here, the functional chip 26, for example but not limited to, includes at least one light emitting diode chip or micro light emitting diode chip, or other functional chips, and is set on the first surface S1 of the substrate 21 by flip chip bonding, for example, to be electrically connected to the thin film circuit 22. In different embodiments, the functional chip 26 can also be disposed on the first surface S1 of the substrate 21 by wire bonding, eutectic bonding (e.g., Au-Sn), anisotropic conductive film (ACF) bonding, anisotropic conductive paste (ACP) bonding, solder ball bonding, or ultrasonic bonding, etc., without limitation. In response to the layout of the thin film circuit substrate 2d, the conductive circuit of the driving circuit board (not shown) is also disposed corresponding to the layout of the thin film circuit substrate 2d. In addition, after the functional chip 26 is disposed, a protective layer 24 is formed to cover the thin film circuit 22 and the functional chip 26 to protect the thin film circuit 22 and the functional chip 26 of the thin film circuit substrate 2d from being contaminated by foreign matter or moisture and thus destroying their characteristics.

[0064] In addition, if Figure 4CAs shown, the manufacturing process of the electronic device 1e of this embodiment and the electronic device 1d of the aforementioned embodiment and the connection relationship of each component are roughly the same. The difference is that the thin film circuit substrate 2e of the electronic device 1e of this embodiment is taken as an example including three thin film circuits 22 arranged side by side and electrically connected. In addition, the conductive circuit 32 of the driving circuit board 3e is also arranged corresponding to the layout of the three thin film circuits 22. In response to the layout of the three thin film circuits 22, the number of the first connection pads 23, the second connection pads 31 and the conductive member 11 of this embodiment are all 10, and are arranged corresponding to each other. In addition, corresponding to the number of thin film circuits 22, the number of functional chips 26 of this embodiment is also three, and each functional chip 26 is electrically connected to the thin film transistor 221b of the corresponding thin film circuit 22 through the fourth connection pad 25, so as to drive the corresponding functional chip 26 through the thin film transistor 221b of the thin film circuit 22. Therefore, the driving circuit of the driving circuit board 3e can drive the light-emitting diode of the corresponding functional chip 26 to emit light through the conductive circuit 32, the second connection pad 31, the conductive member 11, the first connection pad 23, the thin film transistors 221a and 221b of the three thin film circuits 22 and the conductive circuit 222.

[0065] In some embodiments, the three functional chips 26 of the electronic device 1e may include three sub-pixels, and the three light-emitting diode chips in the three sub-pixels may be red, blue, and green LED chips, respectively, to form a full-color pixel unit, thereby forming a full-color LED display. Of course, in different embodiments, less than or more than three thin film circuits 22 may form a thin film circuit substrate 2e to drive the corresponding functional chips 26, and the present invention is not limited thereto.

[0066] Please refer to Figure 5 and Figure 6 As shown, they are schematic layout diagrams of electronic devices 1f and 1g according to yet another embodiment of the present invention.

[0067] like Figure 5 As shown, the manufacturing process, component composition and connection relationship of each component of the electronic device 1f of this embodiment are roughly the same as those of the electronic device of the previous embodiment. The difference is that in the electronic device 1f of this embodiment, a plurality of thin film circuit substrates 2e having substrates 21 with thin film circuits 22 and first connection pads 23 are arrayed on the driving circuit board 3f. Figure 5 In the horizontal direction (the extending direction of the scanning line), two thin film circuits 22 provided on two adjacent substrates 21 are electrically connected to each other through two first connection pads 23 and their corresponding second connection pads 31, and two conductive members 11; Figure 5In the vertical direction (the extension direction of the data line), the two thin film circuits 22 provided on the two adjacent substrates 21 are electrically connected to each other through the two first connection pads 23 and the corresponding second connection pads 31, and the two conductive members 11. Specifically, the two adjacent substrates 21 each have a plurality of thin film circuits 22 and a plurality of first connection pads 23, and each thin film circuit 22 is electrically connected to the corresponding one or more first connection pads 23; the driving circuit board 3f has a plurality of second connection pads 31; the electronic device 1f of this embodiment has a conductive member 11 accordingly; the two thin film circuits 22 provided on the two adjacent substrates 21 are electrically connected to each other through the two first connection pads 23 and the corresponding second connection pads 31. Figure 5 It can be seen from the horizontal direction (the extension direction of the scanning line) that the thin film circuit 22 on one substrate 21 corresponds to a first connection pad 23 of the thin film circuit 22 on the other substrate 21 through one of the first connection pads 23. The two first connection pads 23 respectively correspond to two second connection pads 31 arranged adjacent to each other, and each first connection pad 23 can be electrically connected to its corresponding second connection pad 31 through a conductive member 11; therefore, two adjacent thin film circuits 22 of two adjacent substrates 21 can be electrically connected through two first connection pads 23, two second connection pads 31, and two conductive members 11. It must be noted here that this embodiment is only an example. The second connection pad exposed on the driving circuit board 3f is a dog-bone-shaped connection pad. In the embodiment, the two ends of the dog-bone-shaped connection pad are defined as two second connection pads 31, but the form of the second connection pad is not limited to this; for example, the second connection pad exposed on the driving circuit board 3f may be selected to be single and uniform in shape. In this case, the two adjacent thin film circuits 22 of the two adjacent substrates 21 will be electrically connected through two first connection pads 23, one second connection pad, and two conductive members 11; it can be seen that the number and configuration of the second connection pads 31 in this embodiment and other embodiments in this case should not be limited. Here, these thin film circuits 22 electrically connected to these functional chips 26 can form a matrix circuit and be electrically connected to the driving circuit board 3f to drive these functional chips 26 in the matrix circuit through the driving circuit board 3f. The multiple thin film circuit substrates 2e of the present embodiment are arranged in a matrix of rows and columns to form an active matrix (AM) electronic device, such as but not limited to an active matrix LED display, an active matrix Micro LED display, or an active matrix electronic device with other functions.

[0068] In some embodiments, multiple thin film circuit substrates 2e can be arranged at intervals on the driving circuit board 3f (they can be arranged in straight rows, horizontal columns, or a matrix of rows and columns, or arranged in a polygonal or irregular shape according to the needs of the client), and the first connection pads 23 of two adjacent thin film circuits 22 are electrically connected to each other through the conductive member 11 and the second connection pad 31 (and the conductive line 32). In other words, the manufacturer can design the required size of the driving circuit board 3f by himself, and then electrically connect the corresponding thin film circuit substrate 2e to complete the electronic device 1f. Therefore, the desired size can be spliced ​​according to the application requirements of the product, and the application flexibility is quite large.

[0069] In addition, if Figure 6 As shown, the manufacturing process, component composition and connection relationship of the electronic device 1g of this embodiment are substantially the same as those of the electronic device 1e of the previous embodiment. The difference is that in the electronic device 1g of this embodiment, Figure 6 In the horizontal direction (the extending direction of the scanning line), two thin film circuits 22 provided on two adjacent substrates 21 are electrically connected to each other through two first connection pads 23 and their corresponding second connection pads 31, and a conductive member 11', so as to drive the functional chips 26 in the matrix circuit through the driving circuit board 3g. Specifically, the thin film circuit 22 on one substrate 21 corresponds to one first connection pad 23 of the thin film circuit 22 on the other substrate 21 through one of the first connection pads 23, and the two first connection pads 23 correspond to two second connection pads 31 disposed adjacent to each other, and the two first connection pads 23 are electrically connected to the two corresponding second connection pads 31 through a single conductive member 11'. Since the electronic device 1g only uses one conductive member 11' to cover two adjacent first connection pads 23 and one second connection pad 31, two adjacent thin film circuits 22 can be electrically connected. Therefore, the process of forming the conductive member 11' can be reduced once, and the spacing between the two thin film transistor substrates 2e can also be reduced, so that the size and cost of the electronic device 1g can be reduced under the same resolution.

[0070] It is worth mentioning that Figure 5 The electronic device 1f and Figure 6 The design concept of the electronic device 1g can also be applied to the above-mentioned embodiment, that is, to Figure 2J , Figure 3A , Figure 3B , Figure 4A and Figure 4B In the thin film circuit substrates 2, 2a, 2b, 2c, 2d, the specific technical contents can be referred to above and will not be further explained here.

[0071] As mentioned above, in the conventional method of driving photoelectric elements with thin film transistors, for example, when driving light-emitting diodes with thin film transistors on thin film transistor substrates, it is necessary to design for the size or function of each product and use expensive thin film transistor processes, masks, substrates and materials, which is very unfavorable for the changing product requirements. However, the present invention does not need to design for the size or function of each product and use expensive thin film transistor processes, masks, substrates and materials. Therefore, it has the advantages of simple process and low cost, and is more flexible in application and can be applied to the changing product requirements.

[0072] In summary, in the electronic device and the manufacturing method thereof of the present invention, a thin film circuit including at least one thin film transistor and at least one conductive circuit and at least one first connection pad are formed on a substrate, and a conductive member covering at least a portion of a second connection pad of a driving circuit board and the first connection pad of the substrate is used so that the second connection pad can be electrically connected to the first connection pad through the conductive member. This makes it unnecessary for the present invention to design its process for each product size and function. Therefore, in addition to having a simple process and lower cost, it is more flexible in application and can be adapted to a variety of product requirements.

[0073] The above description is for illustrative purposes only and is not intended to be limiting. Any equivalent modifications or changes made to the present invention without departing from the spirit and scope of the present invention should be included in the appended claims.

Claims

1. A method for manufacturing an electronic device, include: Providing a substrate, wherein the substrate has a first surface and a second surface opposite to each other; forming a thin film circuit on the first surface of the substrate, wherein the thin film circuit comprises at least one thin film transistor and at least one conductive line; forming at least one first connection pad on the first surface of the substrate, wherein the first connection pad is electrically connected to the thin film transistor through the conductive line; The substrate is disposed on a driving circuit board through the second surface, wherein the driving circuit board comprises at least one second connection pad, the second connection pad is adjacent to the first connection pad and is disposed corresponding to the first connection pad; as well as forming a conductive member covering at least a portion of the second connection pad and at least a portion of the first connection pad, wherein the second connection pad is electrically connected to the first connection pad through the conductive member, and the conductive member is formed on the driving circuit board after the first connection pad and the second connection pad are formed, so as to cover at least a portion of the second connection pad and at least a portion of the first connection pad; Wherein, the manufacturing method further comprises: A plurality of substrate arrays are arranged on the driving circuit board; wherein each of the substrates has a plurality of thin film circuits and a plurality of the first connection pads, and each of the thin film circuits is electrically connected to the corresponding plurality of the first connection pads; the driving circuit board has a plurality of the second connection pads; there are a plurality of conductive members, and one of the first connection pads corresponding to each of the thin film circuits and one of the second connection pads of the driving circuit board are electrically connected to each other through one of the conductive members. 2 . The manufacturing method according to claim 1 , wherein the substrate is a hard board or a soft board formed on a rigid carrier.

3. The manufacturing method according to claim 2, wherein before the step of placing the substrate on the driving circuit board, further include: The rigid carrier plate is removed. 4 . The manufacturing method according to claim 1 , wherein the conductive member is covered on at least a portion of the second connection pad and at least a portion of the first connection pad by spraying or coating. 5 . The manufacturing method according to claim 1 , wherein the material of the conductive member comprises solder paste, silver paste, or anisotropic conductive paste, or a combination thereof.

6. The manufacturing method according to claim 1, wherein after the step of forming a thin film circuit on the substrate, further include: A protection layer is formed to cover the thin film circuit.

7. The manufacturing method according to claim 1, further comprising: include: A surface mount component is arranged on the driving circuit board, wherein the driving circuit board further comprises at least one third connection pad, the surface mount component is electrically connected to the thin film transistor via the second connection pad, and is electrically connected to the circuit of the driving circuit board via the third connection pad.

8. The manufacturing method according to claim 1, further comprising: include: forming at least one fourth connection pad on the first surface of the substrate, wherein the fourth connection pad is electrically connected to the thin film transistor through the conductive line; and A surface mount component is disposed on the first surface of the substrate, wherein the surface mount component is electrically connected to the thin film transistor through the fourth connection pad.

9. The manufacturing method according to claim 1, further comprising: include: forming at least one fourth connection pad on the first surface of the substrate, wherein the fourth connection pad is electrically connected to the thin film transistor through the conductive line; and At least one functional chip is disposed on the first surface of the substrate, wherein the functional chip is electrically connected to the thin film transistor through the fourth connection pad.

10. The manufacturing method according to claim 9, further comprising: include: A protection layer is formed to cover the thin film circuit and the functional chip.

11. The manufacturing method according to claim 7 or 8, wherein the surface mount component comprises at least one light emitting diode or at least one micro light emitting diode. 12 . The manufacturing method according to claim 9 , wherein the functional wafer comprises at least one light emitting diode wafer or at least one micro light emitting diode wafer.

13. The manufacturing method according to claim 1, further comprising: include: The two thin film circuits respectively disposed on two adjacent substrates are electrically connected to each other through two first connection pads and their corresponding second connection pads, and two conductive members.

14. The manufacturing method according to claim 1, further comprising: include: The two thin film circuits respectively arranged on two adjacent substrates are electrically connected to each other through two first connection pads and their corresponding second connection pads, and one conductive member.

15. An electronic device, include: A substrate having a first surface and a second surface opposite to each other; A thin film circuit is disposed on the first surface of the substrate, wherein the thin film circuit comprises at least one thin film transistor and at least one conductive circuit; at least one first connection pad, disposed on the first surface of the substrate, the first connection pad being electrically connected to the thin film transistor through the conductive line; A driving circuit board, comprising at least one second connection pad, wherein the substrate is disposed on the driving circuit board through the second surface, and the second connection pad is adjacent to the first connection pad and is disposed corresponding to the first connection pad, and the projections of the first connection pad and the second connection pad in a direction perpendicular to the substrate do not overlap; as well as a conductive member covering at least a portion of the second connection pad and at least a portion of the first connection pad, and the second connection pad is electrically connected to the first connection pad through the conductive member; Wherein, a plurality of substrate arrays are arranged on the driving circuit board; Each of the substrates has a plurality of the thin film circuits and a plurality of the first connection pads, and each of the thin film circuits is electrically connected to the corresponding plurality of the first connection pads; the driving circuit board has a plurality of the second connection pads; there are a plurality of the conductive members, and one of the first connection pads corresponding to each of the thin film circuits and one of the second connection pads of the driving circuit board are electrically connected to each other through one of the conductive members. The electronic device according to claim 15 , wherein the substrate is a hard board or a soft board. 17 . The electronic device according to claim 15 , wherein a material of the conductive member comprises solder paste, silver paste, or anisotropic conductive paste, or a combination thereof.

18. The electronic device according to claim 15, further comprising: include: A protective layer covers the thin film circuit.

19. The electronic device according to claim 15, further comprising: include: A surface mount component is disposed on the driving circuit board, and the driving circuit board further includes at least one third connection pad. The surface mount component is electrically connected to the thin film transistor through the second connection pad, and is electrically connected to the circuit of the driving circuit board through the third connection pad.

20. The electronic device according to claim 15, further comprising: include: at least one fourth connection pad, disposed on the first surface of the substrate, the fourth connection pad being electrically connected to the thin film transistor through the conductive line; and A surface mount component is disposed on the first surface of the substrate, and the surface mount component is electrically connected to the thin film transistor through the fourth connection pad.

21. The electronic device according to claim 15, further comprising: include: at least one fourth connection pad, disposed on the first surface of the substrate, the fourth connection pad being electrically connected to the thin film transistor through the conductive line; and At least one functional chip is disposed on the first surface of the substrate, and the functional chip is electrically connected to the thin film transistor through the fourth connection pad.

22. The electronic device according to claim 21, further comprising: include: A protective layer covers the thin film circuit and the functional chip.

23. The electronic device according to claim 19 or 20, wherein the surface mount component comprises at least one light emitting diode or at least one micro light emitting diode. 24 . The electronic device according to claim 21 , wherein the functional chip comprises at least one light emitting diode chip or at least one micro light emitting diode chip.

25. The electronic device according to claim 15, in, The two thin film circuits respectively disposed on two adjacent substrates are electrically connected to each other through two first connection pads and their corresponding second connection pads, and two conductive members.

26. The electronic device according to claim 15, in, The two thin film circuits respectively disposed on two adjacent substrates are electrically connected to each other through two first connection pads and their corresponding second connection pads, and one conductive member.

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