A solid crystal pick-up packaging device

Abstract

A solid crystal pickup and packaging device belongs to the technical field of chip packaging devices. It is characterized by comprising a mold adjustment device (57), a chip separation device (4) and a chip conveying device (5), wherein the chip separation device (4) is arranged on the lower side of the mold adjustment device (57), the chip conveying device (5) is arranged on the upper side of the mold adjustment device (57), a mold frame for clamping the mold (13) is arranged on the mold adjustment device (57), and a detection device is also arranged on the upper side of the mold adjustment device (57). The mold adjustment device of the solid crystal pickup and packaging device can drive the mold to rotate, thereby adjusting the posture of the chip, ensuring that the corresponding positions of the chip and the lead frame are aligned, so that the chip conveying device can accurately convey the chip to the corresponding position of the lead frame, ensuring the accuracy of chip placement, improving the stability of chip solid crystal packaging, and having a high product qualification rate.

Description

Technical Field

[0001] The invention discloses a die-bonding, picking-up and packaging device, belonging to the technical field of chip packaging devices. Background Art

[0002] The LED packaging process is a precision assembly manufacturing technology that bonds and fixes the chip and seals it for protection. The LED packaging equipment includes a set of production processes such as cleaning, crystal bonding, crystal bonding baking, wire bonding, phosphor application, lens installation, lens encapsulation, and test packaging. The core is the crystal bonding and welding process. Before LED packaging, the chip must first be separated from the blue film and transferred to the lead frame to achieve chip packaging. When packaging the chip, the chip's posture needs to be determined to ensure accurate chip packaging. Since the mold that clamps the blue film is annular, it is difficult to adjust the chip's posture, which makes it difficult to adjust the chip's posture, affecting the accuracy of chip packaging. Summary of the invention

[0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a die-bonding picking and packaging device capable of adjusting the posture of a chip, ensuring that the corresponding positions of the chip and the lead frame are aligned, and automatically completing the die-bonding process.

[0004] The technical solution adopted by the present invention to solve its technical problem is: the solid crystal picking and packaging device is characterized by: including a mold adjustment device, a chip separation device and a chip conveying device, the chip separation device is arranged on the lower side of the mold adjustment device, the chip conveying device is arranged on the upper side of the mold adjustment device, the mold adjustment device is provided with a mold frame for clamping the mold, and the upper side of the mold adjustment device is also provided with a detection device.

[0005] Preferably, the mold frame includes a clamping ring and a mold clamping device, a plurality of clamping pins are arranged at intervals on one side of the clamping ring, and the mold clamping device is arranged on the other side of the clamping ring and encloses the clamping pins to form a clamping portion.

[0006] Preferably, the mold adjusting device comprises a mold adjusting motor, and the output shaft of the mold adjusting motor is connected to the mold frame through a mold adjusting synchronous belt and drives the mold frame to rotate synchronously.

[0007] Preferably, the chip separation device comprises a puncture needle and a separation power device, the puncture needle is arranged on the lower side of the mold frame, and the separation power device is connected to the puncture needle and drives it to rise and fall synchronously.

[0008] Preferably, the separation power device includes a chip separation motor, a connecting rod, a chip separation shaft and a chip separation guide sleeve. The chip separation guide sleeve sliding sleeve is arranged outside the chip separation shaft, the chip separation motor is arranged on the lower side of the chip separation shaft, one end of the connecting rod is rotatably connected to the lower end of the chip separation shaft, and the other end is fixedly connected to the output shaft of the chip separation motor and rotates synchronously therewith, and the puncture needle is installed at the upper end of the chip separation shaft.

[0009] Preferably, the chip conveying device comprises a mobile device and a chip suction head, the chip suction head is mounted on the mobile device and moves with the mobile device, and a buffer mechanism is provided between the chip suction head and the mobile device.

[0010] Preferably, the buffer mechanism includes a buffer spring and a chip buffer sleeve, the chip buffer sleeve is slidably mounted on the mobile device, the chip suction head is mounted on the chip buffer sleeve and rises and falls synchronously with the chip buffer sleeve, and the buffer spring is connected to the chip buffer sleeve to push it to reset.

[0011] Preferably, the chip conveying device further comprises a chip adjusting mechanism, the chip suction head is mounted on the chip adjusting mechanism via a buffer mechanism, and the chip adjusting mechanism is mounted on the mobile device.

[0012] Preferably, the chip adjustment mechanism comprises a chip adjustment motor, the chip adjustment motor is mounted on the mobile device, and the buffer mechanism is connected to the output shaft of the chip adjustment motor and drives it to rotate synchronously.

[0013] Preferably, it also includes a mold storage device and a mold conveying device, the mold storage device is arranged on one side of the mold adjusting device, and the mold conveying device is arranged between the mold storage device and the mold adjusting device.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. The mold adjustment device of the die-bonding pickup and packaging device can drive the mold to rotate, thereby adjusting the posture of the chip to ensure that the corresponding positions of the chip and the lead frame are aligned, so that the chip conveying device can accurately convey the chip to the corresponding position of the lead frame, ensuring the accuracy of chip placement, improving the stability of chip die-bonding packaging, and achieving a high product qualification rate.

[0016] 2. The clamping pin cooperates with the clamping device to clamp the mold so that the mold can rotate synchronously with the clamping ring, which is convenient for taking and placing the mold and adjusting the posture of the chip.

[0017] 3. The mold adjustment motor is connected to the mold frame through the mold adjustment synchronous belt, so that the rotation angle of the mold frame can be accurately adjusted, and then the posture of the chip can be accurately adjusted, which is convenient for adjustment.

[0018] 4. The separation power device pushes the puncture needle up and down, and the puncture needle passes through the blue film and pushes the chip on the blue film to separate from the blue film, making it convenient for the chip conveying device to transfer the chip to the lead frame.

[0019] 5. The chip separation motor drives the puncture needle to move up and down in the vertical direction through the connecting rod, ensuring the stability of the reciprocating motion of the puncture needle, and also facilitating the control of the reciprocating rate of the puncture needle, which is easy to adjust.

[0020] 6. A buffer mechanism is provided between the chip suction head and the mobile device, so as to ensure the pressing force between the chip suction head and the chip when the chip suction head and the chip are sucked, which can ensure the reliable fit between the chip suction head and the chip, thereby ensuring that the chip suction head sucks the chip firmly, and can also avoid excessive pressing force of the chip suction head on the chip to cause damage to the chip.

[0021] 7. The buffer spring pushes the chip buffer sleeve to press the chip, and plays a buffering role after the chip suction head contacts the chip, avoiding excessive pressing force between the chip suction head and the chip, and avoiding damage to the chip.

[0022] 8. The chip adjustment mechanism can adjust the chip's posture to ensure that the corresponding positions of the chip and the lead frame are aligned, ensuring accurate chip packaging.

[0023] 9. The chip adjustment motor drives the chip suction head to rotate through the buffer mechanism, which is easy to adjust and convenient to adjust the rotation angle of the chip suction head to ensure that the corresponding positions of the chip and the lead frame are aligned.

[0024] 10. The mold storage device can store new molds and receive empty molds. The chip storage device can not only transport new lead frames to the mold rack, but also transfer empty molds on the mold rack back to the mold storage device, thus realizing automatic loading and unloading with a high degree of automation. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a top view schematic diagram of the die-bonding pick-up and packaging device.

[0026] Figure 2 It is a three-dimensional schematic diagram of the mold storage device.

[0027] Figure 3 for Figure 2 A partial enlarged view of point A in the middle.

[0028] Figure 4 It is a front view schematic diagram of the mold storage device.

[0029] Figure 5 for Figure 4 A partial enlarged view of point B in the middle.

[0030] Figure 6It is a three-dimensional schematic diagram of the silo supporting mechanism.

[0031] Figure 7 It is a three-dimensional schematic diagram of the mold conveying device.

[0032] Figure 8 for Figure 7 A partial enlarged view of point C in the middle.

[0033] Fig. 9 It is a schematic front view of the mold conveying device.

[0034] Fig.10 It is a three-dimensional schematic diagram of the mold positioning device.

[0035] Fig.11 for Fig.10 A partial enlarged view of point D in the middle.

[0036] Fig.12 It is a front view schematic diagram of the chip separation device.

[0037] Fig.13 It is a three-dimensional schematic diagram of a chip conveying device.

[0038] Fig.14 It is a front view schematic diagram of the chip conveying device.

[0039] Fig.15 for Fig.14 A partial enlarged view of point E in the middle.

[0040] Fig.16 It is a three-dimensional schematic diagram of a lead frame conveying device.

[0041] In the figure: 1, mold storage device 2, mold conveying device 3, mold positioning device 4, chip separation device 5, chip conveying device 6, lead frame input device 7, lead frame conveying device 8, lead frame output device 9, feed bottom plate 10, feed column 11, silo support mechanism 12, silo clamping device 13, mold 14, silo clamping cylinder 15, silo clamping block 1501, clamping platform 16, silo support plate 1601, silo support part 17, support guide rail 18, support slide block 1801, discharge operating part 19, support mounting plate 20, support spring 21, material removal Frame 22, material taking column 23, material taking guide rod 24, material taking base 25, mold push frame 26, material discharging guide plate 27, material discharging adjustment cylinder 28, mold discharging bottom plate 29, material discharging column 30, material discharging positioning rod 31, material discharging cylinder 32, toggle roller 33, material discharging baffle 34, material taking lever 35, mold conveying frame 36, mold conveying motor 37, mold lifting cylinder 38, push frame 39, mold positioning plate 40, clamping claw installation plate 41, telescopic cylinder 42, mold clamping plate 43, installation shaft 44, lever 45, clamping claw lifting guide rail 46, lifting installation block 47, clamping claw rotation Frame 48, clamping claw lifting frame 49, clamping claw guide rod 50, clamping claw lifting ring 51, clamping claw toggle frame 5101, clamping claw toggle groove 52, mold support frame 5201, mold support ring 53, clamping ring 54, clamping pin 55, positioning wheel 56, mold clamping device 57, mold adjustment device 58, mold positioning translation frame 59, mold positioning frame 60, mold adjustment synchronous belt 61, clamping rod 6101, clamping rod clamping part 6102, clamping rod operating part 62, support block 63, clamping spring 64, positioning clamping cylinder 65, clamping wheel 66, mold adjustment motor 67, chip separation Lifting cylinder 68, chip separation lifting frame 69, chip separation motor 70, connecting rod 71, chip separation lifting plate 72, chip separation shaft 73, puncture needle 74, chip separation guide sleeve 75, suction head translation frame 76, suction head translation guide rail 77, suction head lifting frame 78, suction head lifting guide rail 79, chip adjustment motor 80, main shaft 81, chip buffer sleeve 82, chip suction head 83, buffer spring 84, chip conveying synchronous belt 85, lead frame conveying frame 86, guide shaft 87, lead frame translation frame 88, lead frame lifting frame 89, suction cup mounting frame 90, lead frame suction cup. DETAILED DESCRIPTION

[0042] Figures 1 to 16 The best embodiment of the present invention is shown below in conjunction with the attached Figures 1 to 16 The present invention is further described.

[0043] A die-bonding pick-up packaging device includes a mold adjustment device 57, a chip separation device 4, and a chip conveying device 5. The chip separation device 4 is arranged at the lower side of the mold adjustment device 57, and the chip conveying device 5 is arranged at the upper side of the mold adjustment device 57. A mold frame for clamping a mold 13 is arranged on the mold adjustment device 57, and a detection device is also arranged at the upper side of the mold adjustment device 57. The mold adjustment device 57 of the die-bonding pick-up packaging device can drive the mold 13 to rotate, thereby adjusting the posture of the chip, ensuring that the corresponding positions of the chip and the lead frame are aligned, so that the chip conveying device 5 can accurately convey the chip to the corresponding position of the lead frame, ensuring good accuracy of chip placement, improving the stability of chip die-bonding packaging, and having a high qualified rate of products.

[0044] The present invention is further described below in conjunction with specific embodiments. However, people familiar with the art should understand that the detailed description given here in conjunction with the drawings is for better explanation, and the structure of the present invention necessarily exceeds these limited embodiments. For some equivalent replacement schemes or common means, they are no longer described in detail herein, but still belong to the scope of protection of the present application.

[0045] Specific: such as Figure 1 As shown: the solid crystal picking and packaging device also includes a frame and a mold storage device 1, a mold conveying device 2, a mold positioning device 3, a chip conveying device 5, a lead frame input device 6, a lead frame conveying device 7 and a lead frame output device 8 installed on the frame, the mold positioning device 3 is arranged on one side of the mold storage device 1, the mold conveying device 2 is arranged between the mold storage device 1 and the mold positioning device 3, the chip separation device 4 is arranged on the lower side of the mold positioning device 3, the chip conveying device 5 is arranged on the upper side of the chip separation device 4, the lead frame conveying device 7 and the mold positioning device 3 are arranged side by side, and the chip conveying device 5 is used to transfer the chip on the mold 13 on the mold positioning device 3 to the middle of the lead frame conveying device 7. The lead frame input device 6 is arranged at the input end of the lead frame conveying device 7, and the lead frame output device 8 is arranged at the output end of the lead frame conveying device 7. The lead frame input device 6 conveys the lead frame to the lead frame conveying device 7, and the chip conveying device 5 conveys the chip to the lead frame of the lead frame input device 6, and then the lead frame on the lead frame conveying device 7 is sent out through the lead frame output device 8.

[0046] like Figures 2~5As shown: the mold storage device 1 includes a feed bin and a material taking device arranged at the lower side of the feed bin, the material outlet of the feed bin is arranged at the bottom, a bin supporting mechanism 11 is arranged at the lower side of the feed bin, and a pushing part for pushing the bin supporting mechanism 11 to open is arranged on the material taking device. The feed bin of the mold storage device 1 is used to stack molds 13, and the material taking device pushes the bin supporting mechanism 11 to open through the pushing part, so that the material taking device releases the support for the mold 13 in the feed bin, and the mold 13 falls onto the material taking device, and the material taking device drives the mold 13 to fall. During the falling process, the pushing part is separated from the bin supporting mechanism 11, so that the bin supporting mechanism 11 completes the support for the mold 13 again, thereby ensuring that only one mold 13 is taken at a time, realizing automatic and continuous material taking of the mold 13, and the material taking speed is fast and the material taking efficiency is high.

[0047] The mold storage device 1 also includes a discharge bin and a discharge mechanism, the discharge mechanism is arranged at the lower side of the material taking mechanism, the discharge bin is arranged at one side of the discharge end of the discharge mechanism, and a mold guide mechanism is arranged at the top of the discharge mechanism. The feed bin, the material taking device, the discharge mechanism and the discharge bin are all installed on the material taking base 24.

[0048] At least two silo support mechanisms 11 are provided, and a feed silo for accommodating the mold 13 is provided on the middle upper side of the silo support mechanism 11, and a discharge operating part 1801 for pushing it to open is provided on the silo support mechanism 11. The feed silo is used to stack multiple molds 13 with blue films, and at least two silo support mechanisms 11 cooperate to support multiple molds 13. The discharge operating part 1801 is pushed to open the silo support mechanism 11, so that the mold 13 can be taken from the bottom of the feed silo, and the mold 13 can be taken continuously, so that the continuous automatic feeding of the blue film is realized, and the solid crystal efficiency is improved. The feed silo also includes a feed bottom plate 9, a silo clamping device 12 and a feed column 10.

[0049] The feed bottom plate 9 is arranged horizontally, and a through hole for the mold 13 to pass through is arranged in the middle of the feed bottom plate 9 to form a discharge port. The feed column 10 is arranged vertically on the upper side of the feed bottom plate 9, and the lower end of the feed column 10 is fixedly connected to the feed bottom plate 9. At least three feed columns 10 are evenly spaced around the discharge port of the feed bottom plate 9, so as to form a feed bin on the upper side of the feed bottom plate 9. In this embodiment, four feed columns 10 are evenly spaced. The feed column 10 can guide the mold 13, so as to ensure that the mold 13 is neatly stacked in the feed bin.

[0050] The upper end of the feed column 10 is in a tapered shape with a diameter gradually increasing from top to bottom, so as to facilitate stacking of the mold 13 in the feed bin.

[0051] There are at least two silo supporting mechanisms 11 evenly spaced around the discharge port of the feed bottom plate 9. In the present embodiment, there are two silo supporting mechanisms 11 symmetrically arranged on both sides of the discharge port, and the silo supporting parts 1601 of the two silo supporting mechanisms 11 extend into the discharge port. The two silo supporting mechanisms 11 cooperate to support the mold 13.

[0052] The silo clamping device 12 is arranged on the upper side of the feed bottom plate 9 , and the silo clamping device 12 is arranged on the upper side of the silo supporting mechanism 11 , so as to be able to clamp the upper mold 13 , thereby facilitating the removal of the lowermost mold 13 .

[0053] The silo clamping device 12 includes a silo clamping cylinder 14 and a silo clamping block 15. The silo clamping cylinder 14 is horizontally mounted on the feed bottom plate 9. The piston rod of the silo clamping cylinder 14 is arranged radially along the discharge port of the feed bottom plate 9. The piston rod of the silo clamping cylinder 14 is arranged toward the feed silo. The silo clamping block 15 is a rectangular parallelepiped. The silo clamping block 15 is arranged between the silo clamping cylinder 14 and the feed silo. The piston rod of the silo clamping cylinder 14 is connected to the silo clamping block 15 and pushes it to reciprocate in the direction of approaching or moving away from the feed silo. The clamping device can also be implemented by an electric push rod.

[0054] The lower part of the silo clamping block 15 on one side of the accommodating space is convex, forming a clamping platform 1501. The clamping platform 1501 is an arc-shaped arc with a concave middle part, thereby increasing the contact area with the mold 13, which can not only ensure the clamping of the mold 13, but also avoid deformation of the mold 13, which may cause damage to the mold 13.

[0055] The material taking device includes a material taking frame 21 and a material taking cylinder. The material taking frame 21 is horizontally arranged on the upper side of the material taking base 24 and is located directly below the feeding bottom plate 9. The material taking cylinder is arranged on one side of the material taking base 24. The piston rod of the material taking cylinder is connected to the material taking frame 21 and drives it to rise and fall vertically. A vertical material taking guide rail is arranged on the material taking base 24, and the material taking frame 21 is slidably installed on the material taking guide rail.

[0056] At least three material picking guide rods 23 are arranged on the upper side of the material picking rack 21, and the material picking guide rods 23 are arranged vertically. In the present embodiment, three material picking guide rods 23 are arranged, and the three material picking guide rods 23 together form a material picking portion coaxial with the material discharge port, so as to guide the removed mold 13, ensure the accurate position of the removed mold 13, and facilitate the subsequent picking and placing of the mold 13. Preferably, the upper end of the material picking guide rod 23 is a cone with a diameter gradually increasing from top to bottom, so as to facilitate the mold 13 to enter the material picking portion.

[0057] The upper side of the material taking frame 21 is also provided with a material taking column 22, which is arranged vertically. There are at least two material taking columns 22. In this embodiment, there are three material taking columns 22, which are enclosed in a ring coaxial with the discharge port, and the distance from the material taking column 22 to the center of the discharge port is less than the distance from the material taking guide rod 23 to the center of the discharge port. The top of the material taking column 22 is arranged lower than the top of the material taking guide rod 23, so that the removed mold 13 can be supported, so that the mold 13 is spaced apart from the material taking frame 21, which is convenient for the subsequent transfer of the mold 13. The feeding bottom plate 9 is provided with a material taking guide hole that matches the material taking guide rod 23.

[0058] A pushing part is provided on the side of the material picking rack 21 to cooperate with the silo supporting mechanism 11. In this embodiment, the silo supporting mechanism 11 has two symmetrically arranged on both sides of the feed silo. The pushing part corresponds to the silo supporting mechanism 11 one by one and is arranged on the lower side of the corresponding silo supporting mechanism 11.

[0059] A material picking lever 34 is provided at the lower part of both sides of the material picking rack 21, the upper end of the material picking lever 34 is detachably connected to the material picking rack 21, and the lower end of the material picking lever 34 extends to the outside of the material picking rack 21, and a driving roller 32 is rotatably installed at the lower end of the material picking lever 34, thereby forming a pushing part for pushing the discharging operating part 1801.

[0060] The discharge bin is arranged on one side of the material taking base 24, and the discharge bin includes a mold discharge bottom plate 28, a discharge column 29 and a discharge baffle 33. The mold discharge bottom plate 28 is arranged horizontally below the material taking base 24, and the mold discharge bottom plate 28 is arranged on one side of the material taking base 24. The discharge column 29 is arranged vertically on the upper side of the mold discharge bottom plate 28, and the discharge column 29 has two symmetrically arranged on both sides of the mold discharge bottom plate 28. The discharge baffle 33 is arranged on the upper side of the mold discharge bottom plate 28 and on the side of the mold discharge bottom plate 28 away from the material taking base 24. The discharge baffle 33 and the discharge columns 29 on both sides are combined to form a discharge bin with open right and upper sides. The discharge mechanism pushes the mold 13 with the chip removed into the discharge bin for stacking. The bottom of the mold discharge bottom plate 28 can be hinged with the mold discharge bottom plate 28, so as to facilitate the removal of the mold 13 in the discharge bin.

[0061] The discharge mechanism includes a mold pusher 25 and a discharge cylinder 31. A long hole is provided in the middle of the material taking base 24. A discharge guide rail is installed on the lower side of the material taking base 24. The discharge guide rail is arranged horizontally. The lower part of the mold pusher 25 is slidably installed on the discharge guide rail. The upper part passes through the long hole and extends upward to push the mold 13 into the discharge bin. The discharge cylinder 31 is horizontally installed on the material taking base 24. The piston rod of the discharge cylinder 31 is connected to the mold pusher 25 and pushes it to move horizontally, thereby realizing the pushing of the mold 13.

[0062] A discharge positioning rod 30 is provided on the upper middle side of the material taking base 24. The discharge positioning rod 30 is symmetrically arranged on both sides of the mold push frame 25. Two discharge positioning rods 30 are arranged at intervals on each side of the mold push frame 25, thereby forming a discharge positioning part for positioning the mold 13. The mold 13 to be sent out is directly sent to the discharge positioning part. A material taking frame guide hole matching with the discharge positioning rod 30 is provided on the upper side of the material taking frame 21. The discharge positioning rod 30 can also guide the material taking frame 21, ensuring that the material taking frame 21 is lifted and lowered in a straight line.

[0063] A discharge guide plate 26 is also provided on the upper side of the material taking base 24. There are two discharge guide plates 26 symmetrically arranged on both sides of the mold push frame 25. The discharge guide plate 26 is arranged between the discharge positioning rod 30 and the discharge bin. The discharge guide plate 26 is vertically arranged, and a discharge channel is formed between the two discharge guide plates 26. The end of the discharge guide plate 26 close to the discharge positioning rod 30 is inclined, so that the width of the feed end of the discharge channel gradually widens in the direction close to the discharge positioning rod 30, which facilitates the mold 13 to enter the discharge channel.

[0064] A discharge adjustment mechanism is also provided on the lower side of the material taking base 24. The discharge adjustment structure is used to adjust the height of the delivered mold 13. The discharge adjustment mechanism includes a discharge adjustment cylinder 27 and a discharge adjustment rod. The discharge adjustment cylinder 27 is vertically arranged on the lower side of the material taking base 24. A discharge adjustment frame is arranged between the discharge adjustment cylinder 27 and the material taking base 24. The discharge adjustment cylinder 27 is connected to the discharge adjustment frame and drives it to rise and fall linearly. There are three discharge adjustment rods, and the three discharge adjustment rods are combined to form a ring coaxial with the discharge port. The lower end of the discharge adjustment rod is connected to the discharge adjustment frame and rises and falls synchronously with it, and the upper end passes through the material taking base 24. A discharge adjustment plate is installed on the upper end of the discharge adjustment rod, and the height of the delivered mold 13 is adjusted by the discharge adjustment plate.

[0065] like Figure 6 As shown: the silo supporting mechanism 11 includes a supporting slider 18, a silo supporting plate 16 and a supporting spring 20. Long holes along the radial direction of the discharge port are symmetrically arranged on both sides of the feed bottom plate 9. The silo supporting plate 16 is arranged on the upper side of the feed bottom plate 9, and the supporting slider 18 is arranged on the lower side of the feed bottom plate 9. The supporting slider 18 is a groove type with the opening facing upward. Both sides of the supporting slider 18 pass through the long holes on the corresponding side of the feed bottom plate 9 and are connected to the silo supporting plate 16 on the corresponding side, and drive the silo supporting plate 16 to move synchronously. A supporting guide rail 17 along the radial direction of the discharge port is installed at the bottom of the feed bottom plate 9. The supporting guide rail 17 is arranged in the middle of the supporting slider 18, and the supporting slider 18 is slidably connected to the supporting guide rail 17, so as to guide the supporting slider 18 and ensure that the supporting slider 18 moves linearly. The supporting spring 20 is arranged on a side of the supporting slider 18 away from the discharge port. The supporting spring 20 is connected to the supporting slider 18 and pushes it to move in a direction close to the discharge port.

[0066] There are two supporting springs 20 symmetrically arranged on both sides of the supporting slider 18. The silo supporting mechanism 11 also includes a supporting mounting plate 19, which is detachably connected to the side of the feed bottom plate 9. One end of the supporting spring 20 is connected to the corresponding side of the supporting slider 18, and the other end is connected to the supporting mounting plate 19. The supporting spring 20 is in a compressed state, thereby ensuring that the driving force on both sides of the supporting slider 18 is balanced, ensuring that the movement of the supporting slider 18 is smoother, and the upper part of the feed bottom plate 9 can limit the supporting slider 18.

[0067] The bottom of the supporting slider 18 is gradually inclined downward in the direction away from the accommodating space, forming a discharge operating part 1801. The discharge operating part 1801 is used to move the supporting slider 18 away from the accommodating space, and then the silo supporting plate 16 is moved in the direction away from the accommodating space, thereby releasing the support for the mold 13.

[0068] The side of the silo supporting plate 16 close to the accommodating space is an arc-shaped silo supporting portion 1601 with a concave center, thereby ensuring reliable support for the mold 13 and avoiding obstruction to the mold when the mold 13 is moved downward.

[0069] The silo supporting mechanism 11 can also be realized by a horizontally arranged supporting cylinder or electric push rod.

[0070] The working process of the feeding device of the chip packaging device is as follows: when feeding is required, the material picking rack 21 moves upward, and the silo supporting mechanism 11 is pushed to open by turning the roller 32. At this time, the silo clamping device 12 presses the upper mold 13, so that the lowermost mold 13 falls onto the material picking rack 21, and then the material picking rack 21 descends, releasing the restriction on the silo supporting mechanism 11, so that the silo supporting mechanism 11 supports the upper mold 13 again to complete the material picking.

[0071] When the material taking rack 21 rises to take the material, the empty mold 13 enters between the four material taking-out positioning rods 30 , the material taking-out adjusting cylinder 27 adjusts the height of the empty mold 13 , and the material taking-out mechanism pushes the empty mold 13 to move into the material taking-out bin, thereby completing the material taking-out of the empty mold 13 .

[0072] like Figures 7-9 As shown: it includes a rotary power device and at least one mold clamp, the mold clamp is set on the side of the rotary power device and rotates synchronously with the rotary power device. The mold conveying device 2 drives the mold clamp to rotate, thereby realizing the movement of the mold 13 in and out. Compared with the linear motion of the mold clamp, the moving speed of the mold 13 is greatly improved, the working efficiency is high, the speed of chip separation is guaranteed, and then the efficiency of crystal bonding is guaranteed.

[0073] The mold conveying device 2 also includes a mold conveying lifting mechanism, which is connected to the rotary power device. The mold conveying lifting mechanism is vertically arranged and drives the rotary power device to lift vertically. The rotating shaft of the rotary power device is vertically arranged. The mold clamps are installed on the top of the rotary power device. There are at least two mold clamps arranged side by side. In this embodiment, there are two mold clamps arranged side by side, and the two mold clamps rotate synchronously with the rotary power device.

[0074] The mold conveying device 2 also includes a mold conveying frame 35 , which is vertically arranged. The rotary power device is installed on the mold conveying frame 35 , and the mold conveying lifting mechanism is installed on the upper end of the mold conveying frame 35 .

[0075] The rotary power device includes a mold conveying motor 36 and a clamping claw mounting plate 40. The mold conveying motor 36 is vertically arranged at the lower end of the mold conveying frame 35, the output shaft of the mold conveying motor 36 is arranged upward, and the mold conveying lifting mechanism is detachably connected to the mold conveying frame 35. The clamping claw mounting plate 40 is arranged at intervals on the upper side of the mold conveying frame 35, and the clamping claw mounting plate 40 is arranged horizontally.

[0076] A clamp rotating frame 47 and a mounting shaft 43 are sequentially arranged from bottom to top between the mold conveying motor 36 and the clamp mounting plate 40. The clamp rotating frame 47 is a slot-shaped frame with an opening facing upward. The output shaft of the mold conveying motor 36 is connected to the bottom of the clamp rotating frame 47 and drives the clamp rotating frame 47 to rotate synchronously. The mounting shaft 43 is arranged vertically, and the lower end of the mounting shaft 43 extends into the clamp rotating frame 47, and the upper end is coaxially connected to the clamp mounting plate 40, so that the mold conveying motor 36 drives the clamp mounting plate 40 to rotate.

[0077] Both sides of the inner wall of the clamping jaw rotating frame 47 are provided with lifting and lowering mounting blocks 46, and the middle part of the lifting and lowering mounting blocks 46 is provided with guide grooves. The lower end of the mounting shaft 43 extends between the two lifting and lowering mounting blocks 46, and both sides of the lower end of the mounting shaft 43 are provided with clamping jaw lifting and lowering guide rails 45 that are slidably connected to the guide grooves on the corresponding sides. The lifting and lowering mounting blocks 46 cooperate with the clamping jaw lifting and lowering guide rails 45 on the mounting shaft 43, which can not only guide the lifting and lowering of the mounting shaft 43, but also enable the mounting shaft 43 to rotate synchronously with the clamping jaw rotating frame 47, thereby realizing the lifting and lowering and rotating actions of the clamping jaw mounting plate 40, and avoiding interference between the two.

[0078] The mold conveying and lifting mechanism includes a mold lifting cylinder 37, a lever 44 and a clamping claw lifting frame 48. The mold lifting cylinder 37 is horizontally arranged on one side of the mounting shaft 43, and the piston rod of the mold lifting cylinder 37 is horizontally arranged toward the mounting shaft 43. The lever 44 is arranged between the mold lifting cylinder 37 and the mounting shaft 43. The lever 44 is gradually inclined downward in the direction close to the mold lifting cylinder 37. One end of the lever 44 is rotatably connected to the mounting shaft 43, and the other end is rotatably connected to the piston rod of the mold lifting cylinder 37, thereby realizing the lifting and lowering of the mounting shaft 43 and making the lifting and lowering of the mounting shaft 43 more stable.

[0079] A push frame 38 is arranged between the piston rod of the mold lifting cylinder 37 and the lever 44. The push frame 38 is arranged between the lever 44 and the mold lifting cylinder 37. The piston rod of the mold lifting cylinder 37 is connected to the push frame 38 and pushes it to move in a direction close to or away from the mounting shaft 43. The lever 44 has two levers 44 symmetrically arranged on both sides of the push frame 38. The two levers 44 are respectively arranged on both sides of the mounting shaft 43. One end of the lever 44 is rotatably connected to the corresponding side of the push frame 38, and the other end is rotatably connected to the corresponding side of the mounting shaft 43.

[0080] The middle part of the installation shaft 43 is coaxially sleeved with a clamping claw lifting ring 50, and the clamping claw lifting ring 50 is synchronously lifted and lowered with the installation shaft 43. A clamping claw toggling frame 51 is provided between each lever 44 and the clamping claw lifting ring 50. The clamping claw toggling frame 51 is a rectangular parallelepiped, and the clamping claw toggling frame 51 is provided between the corresponding lever 44 and the clamping claw lifting ring 50. The clamping claw toggling frame 51 is rotatably connected with the lever 44 on the corresponding side. A clamping claw toggling groove 5101 is provided on one side of the clamping claw toggling frame 51 close to the clamping claw lifting ring 50, and both sides of the clamping claw lifting ring 50 are slidably provided in the clamping claw toggling groove 5101 on the corresponding side, so that the installation shaft 43 can be lifted and lowered by the clamping claw lifting ring 50, and the rotation of the installation shaft 43 can be avoided from being hindered.

[0081] A clamp lifting frame 48 is provided between the mold conveying frame 35 and the clamp mounting plate 40 . The mounting shaft 43 is rotatably connected to the clamp lifting frame 48 . The clamp lifting frame 48 rises and falls synchronously with the mounting shaft 43 .

[0082] A vertical clamping guide rod 49 is provided on the clamping lifting frame 48, and a clamping guide hole matching the clamping guide rod 49 is provided on the mold conveying frame 35. The upper end of the clamping guide rod 49 is connected to the clamping lifting frame 48 and rises and falls synchronously with it, and the lower end slides and extends into the corresponding clamping guide hole. In this embodiment, four clamping guide rods 49 are evenly spaced around the installation shaft 43, and the clamping guide holes correspond to the clamping guide rods 49 one by one, so as to guide the installation shaft 43, ensure that the installation shaft 43 rises and falls in a straight line, and further ensure that the mold 13 is taken and placed more accurately.

[0083] The mold clamp includes a clamping cylinder and a mold clamping plate 42. The clamping cylinder is installed on the upper side of the clamping plate 40. The clamping cylinder is arranged along the radial direction of the clamping plate 40. The mold clamping plate 42 is arranged on the side of the clamping cylinder away from the axis of the clamping plate 40. The mold clamping plates 42 appear in pairs. The clamping cylinder is connected to the two mold clamping plates 42 at the same time and drives them to open and close, thereby realizing the clamping and loosening of the mold 13. The mold clamping plate 42 on the lower side can be fixedly arranged, and the mold clamping plate 42 on the upper side is connected to the clamping cylinder, thereby realizing the opening and closing of the two mold clamping plates 42, and then realizing the clamping and loosening of the mold 13.

[0084] The clamping cylinder is connected to a telescopic cylinder 41, which is mounted on a clamp mounting plate 40. The telescopic cylinder 41 is radially arranged along the clamp mounting plate 40. The piston rod of the telescopic cylinder 41 is connected to the clamp cylinder and pushes the clamping cylinder to move radially along the clamp mounting plate 40, thereby facilitating the removal and placement of the mold 13.

[0085] In the mold transfer device, the mold lifting cylinder 37 pushes the installation shaft 43 up and down, thereby realizing the height adjustment of the mold clamp, and the mold conveying motor 36 drives the clamp installation plate 40 to rotate, thereby realizing the displacement of the mold clamp, thereby realizing the transfer of the mold 13. Two mold clamps are provided. When replacing an empty mold 13, one mold clamp first clamps the new mold 13, and the other mold clamp clamps the empty mold 13, and then the rotating mechanism drives the mold clamp to rotate, so that the new mold 13 is placed on the designated station, thereby improving the replacement efficiency of the mold 13.

[0086] like Figures 10-11 As shown: the mold positioning device 3 includes a mold adjusting device 57, a mold frame is provided on the mold adjusting device 57, a clamping part is provided on the mold frame, the mold adjusting device 57 is connected to the mold frame and drives it to rotate, and the detection device is arranged on one side of the clamping part. The clamping part of the mold positioning device 3 clamps the mold 13, the detection device can detect the chip on the blue film and collect the image of the chip, and drives the mold frame to rotate through the mold adjusting device 57, so as to adjust the posture of the chip, ensure the chip posture is accurate, and then ensure the accurate chip packaging after taking, so that the equipment works stably and the product qualification rate is high.

[0087] The mold positioning device 3 also includes a mold supporting frame 52, a mold transverse moving device and a mold longitudinal moving device. The mold supporting frame 52 is installed on the mold transverse moving device, and the mold transverse moving device is installed on the mold longitudinal moving device. The moving directions of the mold transverse moving device and the mold longitudinal moving device are both horizontal, and the moving directions of the mold transverse moving device and the mold longitudinal moving device are perpendicular to each other.

[0088] The mold support frame 52 is arranged horizontally, one end of the mold support frame 52 is mounted on the mold transverse movement device, and the other end is provided with an annular mold support ring 5201, and the mold frame is rotatably mounted on the upper side of the mold support ring 5201. The mold adjustment device 57 is mounted on the mold support frame 52, and the mold adjustment device 57 is connected to the mold frame and drives it to rotate synchronously, thereby realizing the adjustment of the chip posture. A clamping part is arranged on the upper side of the mold frame, and a detection device is arranged at intervals on the upper side of the mold frame, and the detection device is aligned with the middle of the clamping part. The detection device is a CCD camera, and the CCD can also be a photoelectric sensor.

[0089] The mold longitudinal movement device is installed on the mold positioning frame 59, and the mold longitudinal movement device includes a mold longitudinal translation linear module and a mold positioning translation frame 58. The mold positioning translation frame 58 is arranged on the upper side of the mold positioning frame 59. Horizontal mold longitudinal translation guide rails are symmetrically arranged on both sides of the mold positioning translation frame 59. The two sides of the mold positioning translation frame 58 are respectively slidably connected to the mold longitudinal translation guide rails on the corresponding sides. The mold longitudinal translation linear module is installed on the mold positioning translation frame 58. The mold longitudinal translation linear module is connected to the mold positioning translation frame 58 and drives it to move horizontally.

[0090] The mold lateral movement device includes a mold lateral translation linear module. The mold support frame 52 is arranged on the upper side of the mold positioning translation frame 58. A horizontal mold lateral translation guide rail is arranged on the upper side of the mold positioning translation frame 58. The mold lateral translation guide rail is arranged vertically with the mold longitudinal translation guide rail. The mold support frame 52 is slidably installed on the mold lateral translation guide rail. The mold lateral translation linear module is installed on the mold positioning translation frame 58. The mold lateral translation linear module is connected to the mold support frame 52 and drives it to translate.

[0091] The mold frame includes a clamping ring 53 and a mold clamping device 56. The clamping ring 53 is annular and is arranged on the upper side of the mold support frame 52. The clamping ring 53 is coaxial with the mold support ring 5201. At least three positioning wheels 55 are arranged around the side of the clamping ring 53. In this embodiment, three positioning wheels 55 are evenly spaced around the clamping ring 53. The positioning wheels 55 are rotatably mounted on the mold support frame 52 and position the clamping ring 53 to ensure that the clamping ring 53 is always coaxial with the mold support ring 5201 during rotation. A vertical clamping pin 54 is arranged on one side of the clamping ring 53, and the mold clamping device 56 is arranged on the other side of the clamping ring 53. The mold clamping device 56 cooperates with the clamping pin 54 to achieve clamping and releasing of the mold 13, which is easy to operate. The height of the side of the clamping ring 53 where the clamping pin 54 is provided is higher than the height of the side where the mold clamping device 56 is provided, thereby avoiding interference with the operation of the mold clamping device 56 .

[0092] The mold clamping device 56 includes a clamping rod 61 and a clamping power device. The clamping rod 61 is arranged between the clamping ring 53 and the clamping power device. The middle part of the clamping rod 61 is rotatably mounted on the mold support bracket 52 to form a lever mechanism. The clamping rod operating part 6102 is arranged at one end of the clamping rod 61 close to the clamping power device, and the clamping rod clamping part 6101 is arranged at the other end. The clamping rod clamping part 6101 is an arc-shaped part with a convex middle part, so as to avoid damage to the mold 13. The clamping power device is connected to the clamping rod operating part 6102 and drives it to swing, thereby achieving the clamping of the mold 13 through the clamping rod clamping part 6101. The clamping rod 61 has two symmetrically arranged on both sides of the clamping power device. The clamping rod operating part 6102 of the clamping rod 61 is arranged close to the clamping power device, which can not only ensure that the clamping of the mold 13 is more reliable, but also avoid crushing the mold 13.

[0093] The clamping power device includes a clamping spring 63 and a positioning clamping cylinder 64. A support block 62 is provided on the mold support bracket 52 between the clamping rod operating part 6102 and the clamping ring 53. The clamping spring 63 corresponds to the clamping rod 61 one by one. The clamping spring 63 is provided between the support block 62 and the corresponding clamping rod operating part 6102. One end of the clamping spring 63 is connected to the support block 62, and the other end is connected to the corresponding clamping rod operating part 6102. The clamping spring 63 is in a compressed state. The positioning clamping cylinder 64 is provided on the side of the clamping rod 61 away from the clamping ring 53, and the positioning clamping cylinder 64 is provided along the radial direction of the clamping ring 53. A clamping wheel 65 is rotatably installed on the piston rod of the positioning clamping cylinder 64. The positioning clamping cylinder 64 pushes the two clamping rod operating parts 6102 to swing through the clamping wheel 65, thereby realizing that the clamping rod 61 releases the clamping of the mold 13.

[0094] The mold adjustment device 57 includes a mold adjustment motor 66, which is mounted on the mold support bracket 52. The output shaft of the mold adjustment motor 66 is arranged vertically. The output shaft of the mold adjustment motor 66 is connected to the clamping ring 53 through the mold adjustment synchronous belt 60, thereby driving the clamping ring 53 to rotate synchronously, and the rotation angle of the clamping ring 53 can be accurately adjusted. A synchronous pulley is installed on the output shaft of the mold adjustment motor 66, and the side of the clamping ring 53 is provided with side teeth meshing with the mold adjustment synchronous belt 60. One end of the mold adjustment synchronous belt 60 meshes with the synchronous pulley, and the other end meshes with the side teeth of the clamping ring 53.

[0095] When the mold positioning device is in use, the positioning and pressing cylinder 64 first pushes the pressing rod 61 to open, and when the mold 13 enters the upper side of the clamping ring 53, the positioning and pressing cylinder 64 is reset, and the pressing spring 63 pushes the pressing rod 61 to swing and press the mold 13. At this time, the detection device detects the chip on the mold 13, and the mold adjustment motor 66 drives the clamping ring 53 to rotate, adjusts the posture of the chip, and ensures accurate chip packaging.

[0096] like Fig.12 As shown: the chip separation device 4 includes a puncture needle 73 and a separation power device. A plurality of puncture needles 73 are arranged side by side. The plurality of puncture needles 73 are arranged vertically. The puncture needles 73 are arranged on the upper side of the separation power device and rise and fall with the separation power device. The puncture needles 73 pass through the blue film and separate the chip from the blue film, thereby realizing the separation of the chip from the blue film.

[0097] The separation power device includes a chip separation motor 69, a connecting rod 70, a chip separation shaft 72 and a chip separation guide sleeve 74. The chip separation motor 69 is installed on the chip separation lifting frame 68. The chip separation guide sleeve 74 is vertically fixed on the upper side of the chip separation lifting frame 68. The chip separation guide sleeve 74 is a cylinder with a closed upper end. The upper end of the chip separation shaft 72 slides into the chip separation guide sleeve 74. The upper end of the chip separation guide sleeve 74 is provided with a through hole for the puncture needle 73 to pass through. The lower end of the chip separation shaft 72 is fixed with a chip separation lifting plate 71, and the chip separation lifting plate 71 drives the chip separation shaft 72 to rise and fall synchronously. The chip separation motor 69 is arranged on the lower side of the chip separation lifting plate 71. The output shaft of the chip separation motor 69 is connected to the chip separation lifting plate 71 through the connecting rod 70. One end of the connecting rod 70 is connected to the output shaft of the chip separation motor 69 and rotates synchronously with it. The other end of the connecting rod 70 is rotationally connected to the lower end of the chip separation shaft 72, thereby realizing the lifting and lowering of the puncture needle 73.

[0098] A chip separation lifting cylinder 67 is provided at the lower side of the chip separation lifting frame 68. The chip separation lifting cylinder 67 is provided vertically. The output shaft of the chip separation lifting cylinder 67 is connected to the chip separation lifting frame 68 and drives it to rise and fall to adapt to the separation of chips on blue films of different heights. A chip separation guide shaft for guiding the chip separation lifting frame 68 is provided on the side of the chip separation lifting frame 68, thereby ensuring that the chip separation lifting frame 68 rises and falls in a straight line and ensures accurate chip separation.

[0099] like Figures 13-15As shown: the chip conveying device 5 includes a mobile device and a chip suction head 82. The chip suction head 82 is installed on the mobile device and moves with the mobile device. A buffer mechanism is provided between the chip suction head 82 and the mobile device. A buffer mechanism is provided between the chip suction head 82 of the chip conveying device 5 and the mobile device, so that when the chip suction head 82 and the chip are sucked, the pressing force between the chip suction head 82 and the chip can be ensured, which can ensure that the chip suction head 82 and the chip are reliably attached, thereby ensuring that the chip suction head 82 sucks the chip firmly, and can also avoid excessive pressing force of the chip suction head 82 on the chip to damage the chip.

[0100] The moving device includes a suction head translation device and a suction head lifting device, the suction head lifting device is installed on the suction head translation device, and the chip suction head 82 is installed on the suction head lifting device through a buffer mechanism. The chip conveying device 5 also includes a chip adjustment mechanism, the chip adjustment mechanism is installed on the chip lifting device, and the chip suction head 82 is installed on the chip lifting device through a buffer mechanism.

[0101] The tip translation device includes a tip translation frame 75, a tip translation guide rail 76, and a tip translation linear module. The tip translation guide rail 76 is horizontally arranged. The tip translation guide rail 76 has two parallel and spaced apart guide rails. The upper and lower sides of the tip translation frame 75 are respectively slidably mounted on the tip translation guide rails 76 on the corresponding sides to ensure the linear movement of the tip translation frame 75. The tip translation linear module is connected to the tip translation frame 75 and pushes the tip translation frame 75 to move horizontally.

[0102] The tip lifting device includes a tip lifting frame 77 and a tip lifting linear module. Vertical tip lifting guide rails 78 are symmetrically arranged on both sides of the tip translation frame 75. The two sides of the tip lifting frame 77 are respectively slidably installed on the tip lifting guide rails 78 on the corresponding sides. The tip lifting linear module is installed on the tip translation frame 75. The tip lifting linear module is connected to the tip lifting frame 77 and pushes the tip lifting frame 77 to lift and lower linearly.

[0103] The chip adjustment mechanism includes a chip adjustment motor 79 and a spindle 80. The chip adjustment motor 79 is mounted on the suction head lifting frame 77. The spindle 80 is rotatably mounted on the suction head lifting frame 77. The spindle 80 is vertically arranged. The chip adjustment motor 79 is arranged between the spindle 80 and the suction head translation frame 75. The output shaft of the chip adjustment motor 79 is connected to the spindle 80 and drives it to rotate synchronously. The chip adjustment mechanism is installed at the lower end of the spindle 80.

[0104] The output shaft of the chip adjustment motor 79 is connected to the main shaft 80 through the chip conveying synchronous belt 84. The output shaft of the chip adjustment motor 79 is equipped with an active synchronous pulley, and the main shaft 80 is equipped with a driven synchronous pulley. One end of the chip conveying synchronous belt 84 is meshed with the active synchronous pulley, and the other end is meshed with the driven synchronous pulley, which is convenient for controlling the rotation angle of the main shaft 80 and adjusting the attitude of the chip. A CCD camera or a photoelectric sensor can be installed at the bottom of the suction head lifting frame 77, so as to realize the detection of the chip attitude and the position of the lead frame.

[0105] The buffer mechanism includes a buffer spring 83 and a chip buffer sleeve 81. The inner diameter of the lower end of the chip buffer sleeve 81 is smaller than the inner diameter of the upper end. The lower end of the main shaft 80 slides into the upper end of the chip buffer sleeve 81. The main shaft 80 and the chip buffer sleeve 81 are connected by a key or spline, so that the main shaft 80 and the chip buffer sleeve 81 rotate synchronously, thereby realizing the adjustment of the chip angle. The buffer spring 83 is sleeved on the main shaft 80, the upper end of the buffer spring 83 is supported on the suction head lifting frame 77, and the lower end is supported on the chip buffer sleeve 81, and the buffer spring 83 is in a compressed state.

[0106] The chip suction head 82 is a chip suction pen head, the upper end of the chip suction head 82 extends into the lower end of the chip buffer sleeve 81, the chip suction head 82 rises and falls synchronously with the chip buffer sleeve 81, and the chip suction head 82 rotates synchronously with the chip buffer sleeve 81, so as to adjust the angle of the chip. The main shaft 80 is cylindrical, the lower end of the main shaft 80 is connected to the chip suction head 82 through the chip buffer sleeve 81, and the upper end is equipped with a rotary joint, so as to facilitate the connection of the negative pressure air pipe.

[0107] A detection disc is coaxially mounted on the main shaft 80, and a detection portion is formed by a protrusion on one side of the detection disc. A photoelectric sensor that cooperates with the detection disc is provided on the suction head lifting frame 77, thereby realizing the detection of the rotation angle of the main shaft 80 and facilitating the control of its rotation angle.

[0108] When the chip transfer device is in use, the tip translation device and the tip lifting device drive the chip tip 82 to move, thereby realizing the adjustment of the position of the chip tip 82, and the adjustment is convenient. The chip adjustment mechanism drives the chip tip 82 to rotate, thereby adjusting the angle of the chip to ensure that the corresponding positions of the chip and the lead frame are aligned. After the chip tip 82 is bonded to the chip, the tip lifting device continues to descend, and the elastic force of the buffer spring 83 makes the chip tip 82 bonded to the chip reliably, thereby ensuring that the chip tip 82 firmly absorbs the chip. When the tip lifting device descends, due to the existence of inertia, the chip tip 82 cannot stop immediately, and the buffer spring 83 can also eliminate the damage to the chip caused by the inertia of the tip lifting device.

[0109] like Fig.16As shown: the lead frame conveying device 7 includes a lead frame conveying frame and a lead frame conveying linear module. A horizontal lead frame guide rail is provided on the frame. The lead frame conveying frame is slidably installed on the lead frame guide rail. The lead frame linear module is installed on the frame. The lead frame linear module is connected to the lead frame conveying frame and drives it to move horizontally.

[0110] The lead frame input device 6 and the lead frame output device 8 have the same structure, and both include a lead frame conveying frame 85, a lead frame translation frame 87, a lead frame lifting frame 88 and a lead frame suction cup 90. The lead frame conveying frame 85 is equipped with a guide shaft 86, which is horizontally arranged. The lead frame translation frame 87 is slidably installed on the guide shaft 86. The lead frame conveying frame 85 is equipped with a lead frame conveying linear module, which is connected to the lead frame translation frame 87 and pushes it to translate. The lead frame translation frame 87 is provided with a lead frame lifting frame. The guide rail and the lead frame lifting guide rail are vertically arranged, the lead frame lifting frame 88 is slidably installed on the lead frame lifting guide rail, the lead frame translation frame 87 is installed with a lead frame lifting cylinder, the piston rod of the lead frame lifting cylinder is connected to the lead frame lifting frame 88, and drives the lead frame lifting frame 88 to lift vertically, the lead frame lifting frame 88 is installed with a suction cup mounting frame 89, the lead frame suction cup 90 is installed on the lead frame mounting frame 89, and a plurality of lead frame suction cups 90 are installed on the lead frame mounting frame 89, so as to ensure that the sucked lead frame is level and prevent the chip from falling off.

[0111] The mold conveying device 2 of the solid crystal picking and packaging device transfers the mold 13 on the mold storage device 1 to the mold positioning device 3, the mold positioning device 3 positions the mold 13, the chip separation device 4 separates the chip on the blue film from the blue film, the chip conveying device 5 transfers the separated chip to the lead frame on the lead frame conveying device 7, the lead frame input device 6 is used to convey the empty lead frame to the lead frame conveying device 7, and the lead frame output device 8 is used to send out the lead frame with chips arranged on it.

[0112] The above is only a preferred embodiment of the present invention, and does not limit the present invention in other forms. Any technician familiar with the profession may use the above disclosed technical content to change or modify it into an equivalent embodiment with equivalent changes. However, any simple modification, equivalent change and modification made to the above embodiment according to the technical essence of the present invention without departing from the technical solution of the present invention still belongs to the protection scope of the technical solution of the present invention.

Claims

1. A die-bonding pick-up and packaging device, characterized in that: The invention comprises a mold adjusting device (57), a chip separating device (4) and a chip conveying device (5), wherein the chip separating device (4) is arranged on the lower side of the mold adjusting device (57), the chip conveying device (5) is arranged on the upper side of the mold adjusting device (57), a mold frame for clamping the mold (13) is arranged on the mold adjusting device (57), and a detection device is also arranged on the upper side of the mold adjusting device (57); The chip separation device (4) comprises a puncture needle (73) and a separation power device. The puncture needle (73) is arranged on the lower side of the mold frame. The separation power device is connected to the puncture needle (73) and drives it to rise and fall synchronously. The separation power device comprises a chip separation motor (69), a connecting rod (70), a chip separation shaft (72) and a chip separation guide sleeve (74). The chip separation guide sleeve (74) is slidably sleeved outside the chip separation shaft (72). The chip separation motor (69) is arranged on the lower side of the chip separation shaft (72). One end of the connecting rod (70) is rotatably connected to the lower end of the chip separation shaft (72), and the other end is fixedly connected to the output shaft of the chip separation motor (69) and rotates synchronously therewith. The puncture needle (73) is installed on the upper end of the chip separation shaft (72). The chip conveying device (5) comprises a mobile device and a chip suction head (82); the chip suction head (82) is mounted on the mobile device and moves with the mobile device.

2. The die-bonding pick-up and packaging device according to claim 1, characterized in that: The mold frame comprises a clamping ring (53) and a mold clamping device (56). A plurality of clamping pins (54) are arranged at intervals on one side of the clamping ring (53). The mold clamping device (56) is arranged on the other side of the clamping ring (53) and is combined with the clamping pins (54) to form a clamping portion.

3. The die-bonding pick-up and packaging device according to claim 1, characterized in that: The mold adjustment device (57) comprises a mold adjustment motor (66), the output shaft of which is connected to the mold frame via a mold adjustment synchronous belt (60) and drives the mold frame to rotate synchronously.

4. The die-bonding pick-up and packaging device according to claim 1, characterized in that: A buffer mechanism is provided between the chip suction head (82) and the moving device.

5. The die-bonding pick-up and packaging device according to claim 4, characterized in that: The buffer mechanism comprises a buffer spring (83) and a chip buffer sleeve (81); the chip buffer sleeve (81) is slidably mounted on the mobile device; the chip suction head (82) is mounted on the chip buffer sleeve (81) and rises and falls synchronously with the chip buffer sleeve (81); the buffer spring (83) is connected to the chip buffer sleeve (81) to push it to reset.

6. The die-bonding pick-up and packaging device according to claim 1, characterized in that: The chip conveying device (5) further comprises a chip adjusting mechanism, the chip suction head (82) is mounted on the chip adjusting mechanism via a buffer mechanism, and the chip adjusting mechanism is mounted on the mobile device.

7. The die-bonding pick-up and packaging device according to claim 6, characterized in that: The chip adjustment mechanism comprises a chip adjustment motor (79), the chip adjustment motor (79) is mounted on the mobile device, and the buffer mechanism is connected to the output shaft of the chip adjustment motor (79) and drives it to rotate synchronously.

8. The die-bonding pick-up and packaging device according to claim 1, characterized in that: It also comprises a mold storage device (1) and a mold conveying device (2), wherein the mold storage device (1) is arranged on one side of the mold adjusting device (57), and the mold conveying device (2) is arranged between the mold storage device (1) and the mold adjusting device (57).

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