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Chip glue spreading and shaking device

A chip packaging and gluing technology, used in semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve problems such as uneven sedimentation, achieve a reasonable and compact overall structure, shake well, improve The effect of packaging quality

Active Publication Date: 2021-03-26
深圳平晨半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When the chip is packaged, it needs to be glued, and then wait for the glue to dry; most of the conventional glue laying methods use natural drying, and the sediment in the glue will sink and become extremely uneven during the drying process. Equipment for shaking it well during the drying process

Method used

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  • Chip glue spreading and shaking device
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Embodiment Construction

[0013] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, a clear and complete description will be made below in conjunction with the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, and Not all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0014] The chip spread glue shaking device of preferred embodiment of the present invention, as figure 1 shown, see also figure 2 , including a die 1 for chip packaging, a concave mounting arm 2, a lifting assembly 3 that drives the mounting arm up and down, and two pneumatic grippers 4 that respectively clamp the left and right ends of the mold after clamping; the concave mounting arm 2 Both ...

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PUM

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Abstract

The invention relates to a chip glue spreading and shaking device which comprises a die for packaging a chip, and further comprises a concave mounting arm, a lifting assembly for driving the mountingarm to lift, and two pneumatic clamping jaws for clamping the left end and the right end of the die after die assembly respectively. Rotating cylinders for driving the pneumatic clamping jaws to longitudinally rotate in a one-to-one correspondence manner are mounted on two concave arms of the mounting arm; die assembly is performed on the die after a chip is coated with a glue, then the two pneumatic clamping jaws clamp the two ends of the die after die assembly respectively to keep the die in a die assembly state, then the lifting assembly drives the mounting arm to drive the die to reciprocate up and down, and in the moving process, the pneumatic clamping jaws are driven by the rotating cylinder to rotate to turn over the die by a certain angle; and the whole structure is reasonable andcompact, the chip glue spreading, processing and shaking effects are good, and the packaging quality of the chip can be greatly improved.

Description

technical field [0001] The invention relates to the technical field of glue spreading on chips, and more specifically, to a glue spreading and shaking device for chips. Background technique [0002] When the chip is packaged, it needs to be glued, and then wait for the glue to dry; most of the conventional glue laying methods use natural drying, and the sediment in the glue will sink and become extremely uneven during the drying process. Shake the device well during the drying process. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a chip spreading and shaking device for the above-mentioned defects of the prior art. [0004] The technical solution adopted by the present invention to solve its technical problems is: [0005] Construct a chip laying and shaking device, including a mold for chip packaging, which also includes a concave mounting arm, a lifting assembly that drives the mounting arm up and down, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/28
CPCH01L23/28
Inventor 李婷
Owner 深圳平晨半导体科技有限公司
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