A fast cooling pressure head on a mobile phone display bonding device

Abstract

The present invention belongs to the technical field of mobile phone display manufacturing, and in particular, is a fast cooling pressure head on a mobile phone display bonding device, comprising a horizontal fixed bracket, a cylinder is fixedly connected to one side of the top of the horizontal fixed bracket by bolts, a Z-axis mounting bracket is movably connected to the other side of the top of the horizontal fixed bracket, the cylinder is located at the front side of the Z-axis mounting bracket, the bottom side of the Z-axis mounting bracket is fixedly connected to two vertical fixed brackets by bolts, the piston shaft of the cylinder extends to the bottom of the horizontal fixed bracket and is fixedly connected to a heating element, and the heating element is located between the two vertical fixed brackets. The fast cooling pressure head proposed by the present invention has the characteristics of pollution-free rapid heating, rapid cooling, fast and accurate temperature control, and no water seepage or pipe bursting during repeated heating of the pressure head, which solves the problem of poor electronic circuit contact and mechanical connection caused by the material rebounding due to the withdrawal of the pressure head under high temperature during the bonding process of FPC electronic circuits.

Description

Technical Field

[0001] The invention relates to the technical field of manufacturing mobile phone display screens, and in particular to a fast cooling pressure head on a mobile phone display screen bonding device. Background Art

[0002] Bonding heads are widely used in the bonding process of mobile phone screen liquid crystal display modules (LCMs), which are components that assemble liquid crystal displays, drive circuits, FPCs (Flexible Printed Circuits), backlights and other structural parts. The mechanical connection and electrical conduction between the liquid crystal glass, drive circuits and FPCs in liquid crystal displays are the core of LCM production. The production process of liquid crystal glass and FPCs is the FOG (Film On Glass) bonding process, which is to mount the FPC on the glass panel. The process equipment in the FOG bonding process will use this type of head. The following is the basic process flow:

[0003] 1. ACF pre-lamination: paste ACF of specified length on the ITO end of the LCD glass or the pins of the FPC that need to be bonded;

[0004] 2. Pre-bonding: Use the auxiliary image system on the FOG bonding machine to align the pins of the FPC and the ITO end of the liquid crystal glass, and pre-press to form a preliminary connection;

[0005] 3. Main bonding: Under higher temperature and pressure, the pre-bonded LCM products are subjected to main bonding. The electrical connection between FPC and liquid crystal glass is achieved through the deformation of ACF conductive particles and the rupture of the insulating layer. At the same time, the two different materials, FPC and liquid crystal glass, are connected together through the polymerization and hardening of ACF glue at high temperature to provide sufficient mechanical connection strength.

[0006] The fully automatic COG bonding machine is mainly composed of three units: ACF (anisotropic conductive adhesive or anisotropic conductive film), pre-pressing and main pressing. The main pressing unit is also called the main pressing bonding device, which is used to complete the back-end process of the display screen, namely the main pressing stage. Specifically, the main function of the pressure head of the main pressing bonding device is to provide a movement in the Z-axis direction, so as to apply a force of about 150-300N on the buffer silicone tape, and then transfer it to the glass substrate and IC.

[0007] In order to make the circuits between the IC and the glass substrate well connected, during this pressing stage, the pressing head temperature needs to be as high as 200-420 degrees. The temperature of the heat insulation board rises sharply, and this heat will be transferred to the parts above the pressing head. The expansion coefficient of the product material is unstable under the heating state and the influence of the ambient temperature, which directly affects the product yield.

[0008] In the existing LCM product process similar to FOG bonding, when bonding anisotropic conductive adhesive and OLED materials, the temperature of the pressure head is kept at a high temperature (such as 180 degrees - 360 degrees) during the bonding process. The pressure head is withdrawn in a hot state, and the material has not completely cooled down. Therefore, after the material is heated, it needs to be cooled naturally. The product material rebounds under high temperature, causing poor contact of the electronic pin circuit, which not only reduces the circuit connection strength and force between the FPC and the liquid crystal glass, but also causes the electrode pins of the FPC and the liquid crystal glass to produce induced open circuits due to the particle situation. Therefore, the existing LCM products bonded by the FOG process have serious quality risks. This technical problem needs to be solved, so we propose a fast cooling pressure head on the mobile phone display bonding equipment to solve the above problem. Summary of the invention

[0009] The purpose of the present invention is to solve the disadvantages of the prior art and to propose a fast cooling pressure head on a mobile phone display screen bonding device.

[0010] In order to achieve the above object, the present invention adopts the following technical solutions:

[0011] A fast cooling pressure head on a mobile phone display bonding device comprises a horizontal fixed bracket, one side of the top of the horizontal fixed bracket is fixedly connected to a cylinder by bolts, the other side of the top of the horizontal fixed bracket is movably connected to a Z-axis mounting bracket, the cylinder is located at the front side of the Z-axis mounting bracket, the bottom side of the Z-axis mounting bracket is fixedly connected to two vertical fixed brackets by bolts, the piston shaft of the cylinder extends to the bottom of the horizontal fixed bracket and is fixedly connected to a heating element, the heating element is located between the two vertical fixed brackets, and the bottom sides of the two vertical fixed brackets are fixedly connected to the same pressure head by bolts, the bottom side of the heating element is movably connected to the top side of the pressure head, the front side of the heating element is fixedly connected to multiple groups of heating tubes, and one side of the pressure head is provided with a cooling port.

[0012] Preferably, ceramic insulation rings are fixedly adhered to both sides of the bottom of the Z-axis mounting bracket, and the bottom side of the ceramic insulation ring is fixedly adhered to the top side of the horizontal fixed bracket. The ceramic insulation ring reduces the temperature transfer of the upper parts during the rapid heating of the pressure head.

[0013] Preferably, the top side of the heating element is fixedly connected to a heating separation bracket by bolts, and the top side of the heating separation bracket is fixedly connected to the output shaft of the cylinder by bolts, and the heating separation bracket is used to install the heating element connection part component.

[0014] Preferably, guide rods are fixedly connected to both sides of the top of the heating separation bracket, and the top end of the guide rods extends to the inner side of the horizontal fixed bracket and is movably connected to the inner side of the horizontal fixed bracket. The guide rods make the heating element rise and fall more smoothly.

[0015] Preferably, a pressure head temperature sensor probe is fixedly connected to the front central portion of the pressure head, and the pressure head temperature sensor probe is used to detect temperature changes of the pressure head when it is in use.

[0016] Preferably, a plurality of heating temperature sensor probes are fixedly connected to the front top of the heating element, the heating temperature sensor probes are located above the heating tube, and the heating temperature sensor probes are used to detect temperature changes when the pressure head is heated.

[0017] Preferably, the number of the heating tubes is eight, and the eight heating tubes are equally divided into four groups and arranged at equal intervals on the front side of the heating body, and the heating tubes provide heating for the heating body.

[0018] The fast cooling pressure head on the mobile phone display screen bonding device described in the present invention has the following advantages:

[0019] 1. Realize rapid heating of the pressure head without pollution;

[0020] 2. Realize rapid cooling of the pressure head;

[0021] 3. Realize fast and accurate temperature control of the pressure head;

[0022] 4. Achieve safe production, ensure that there will be no water seepage, pipe burst, etc. during repeated heating of the pressure head, and protect the safety of production personnel;

[0023] 5. Achieve high-efficiency heating and save energy while meeting process requirements;

[0024] 6. The shortcomings of the existing technical solutions are perfectly solved through precise temperature control;

[0025] The fast cooling pressure head proposed in the present invention has the characteristics of rapid heating without pollution, rapid cooling, fast and accurate temperature control, and no water seepage or pipe bursting during repeated heating of the pressure head. It solves the problem of poor electronic circuit contact and mechanical connection caused by material rebound due to the withdrawal of the pressure head under high temperature during the FPC electronic circuit bonding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of the structure of a fast cooling pressure head on a mobile phone display screen bonding device proposed by the present invention;

[0027] Figure 2 A side view of a fast cooling pressure head on a mobile phone display screen bonding device proposed by the present invention;

[0028] Figure 3 An exploded view of a fast cooling pressure head on a mobile phone display screen bonding device proposed by the present invention;

[0029] Figure 4 The present invention provides a schematic structural diagram of a pressure head and a cooling port of a fast cooling pressure head on a mobile phone display screen bonding device.

[0030] In the figure: 1. Cylinder; 2. Z-axis mounting bracket; 3. Ceramic insulation ring; 4. Horizontal fixing bracket; 5. Guide rod; 6. Vertical fixing bracket; 7. Heating element; 8. Pressure head; 9. Heating temperature sensor probe; 10. Heating tube; 11. Pressure head temperature sensor probe; 12. Heating separation bracket; 13. Cooling port. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0032] Reference Figure 1-4 A fast cooling pressure head on a mobile phone display bonding device comprises a horizontal fixed bracket 4, one side of the top of the horizontal fixed bracket 4 is fixedly connected to a cylinder 1 by bolts, the other side of the top of the horizontal fixed bracket 4 is movably connected to a Z-axis mounting bracket 2, the cylinder 1 is located at the front side of the Z-axis mounting bracket 2, the bottom side of the Z-axis mounting bracket 2 is fixedly connected to two vertical fixed brackets 6 by bolts, the piston shaft of the cylinder 1 extends to the bottom of the horizontal fixed bracket 4 and is fixedly connected to a heating element 7, the heating element 7 is located between the two vertical fixed brackets 6, and the bottom sides of the two vertical fixed brackets 6 are fixedly connected to the same pressure head 8 by bolts, the bottom side of the heating element 7 is movably connected to the top side of the pressure head 8, the front side of the heating element 7 is fixedly connected to multiple groups of heating tubes 10, and a cooling port 13 is provided on one side of the pressure head 8.

[0033] In this embodiment, ceramic insulation rings 3 are fixedly adhered to both sides of the bottom of the Z-axis mounting bracket 2, and the bottom side of the ceramic insulation ring 3 is fixedly adhered to the top side of the horizontal fixed bracket 4. The ceramic insulation ring 3 is used to reduce the temperature transfer of the upper parts during the rapid heating of the pressure head 8.

[0034] In this embodiment, the top side of the heating element 7 is fixedly connected to the heating separation bracket 12 by bolts, and the top side of the heating separation bracket 12 is fixedly connected to the output shaft of the cylinder 1 by bolts. The heating separation bracket 12 is used to install the connecting part component of the heating element 7.

[0035] In this embodiment, guide rods 5 are fixedly connected to both sides of the top of the heating separation bracket 12, and the top of the guide rods 5 extends to the inner side of the horizontal fixed bracket 4 and is movably connected to the inner side of the horizontal fixed bracket 4. The guide rods 5 make the heating element 7 rise and fall more smoothly.

[0036] In this embodiment, a pressure head temperature sensor probe 11 is fixedly connected to the front center of the pressure head 8 , and the pressure head temperature sensor probe 11 is used to detect the temperature change of the pressure head 8 when it is in use.

[0037] In this embodiment, a plurality of heating temperature sensor probes 9 are fixedly connected to the front top of the heating element 7. The heating temperature sensor probes 9 are located above the heating tube 10. The heating temperature sensor probes 9 are used to detect the temperature change when the pressure head 8 is heated.

[0038] In this embodiment, the number of the heating tubes 10 is eight, and the eight heating tubes 10 are equally divided into four groups and arranged at equal intervals on the front side of the heating element 7 , and the heating tubes 10 provide heating to the heating element 7 .

[0039] The cooling air refrigeration and temperature reduction pressure head in this embodiment is installed on the Z-axis pressure mechanism of the bonding equipment, and is used after being tightened and fixed by 4 M6 screws; wherein, the arrangement mode and function of each part and component are as follows: when the cylinder 1 descends, the heating element 7 and the pressure head 8 are closely fitted, and the temperature of the heating element 7 is transferred to the pressure head 8; when the cylinder 1 rises, the heating element 7 and the pressure head 8 are separated, and the pressure head 8 is quickly cooled down by the external cooling air refrigeration and temperature reduction device flowing in from the cooling port 13; the Z-axis mounting bracket 2 connects the pressure head mechanism with the Z-axis connection block, and the Z-axis mounting bracket 2 is made of Cr12 steel and is vacuum heat treated so that the workpiece will not be affected by deformation during use and will not affect the bonding process. This part is mainly connected and installed with other components for use; the ceramic insulation ring 3 is used to reduce the temperature transfer of the upper part during the rapid heating of the pressure head 8; the horizontal fixing bracket 4 and the vertical fixing bracket 6 are used to install the connection components of the pressure head 8, and the material The material is Cr12 heat-treated; the guide rod 5 makes the heating element 7 rise and fall more smoothly; eight heating tubes 10 are installed on the heating element 7, and the temperature is accurately controlled using the intelligent digital temperature controller PID function; the pressure head 8 is made of YG12X tungsten steel and is vacuum heat-treated, so that the heating deformation of the workpiece during use can be ignored. This part is mainly connected to the cooling pipe and the installation components. The most important part of the pressure head 8 is the pressure head blade position, with a surface finish of 0.4µm and a parallelism of 0.001mm; the heating temperature sensor probe 9 and the pressure head temperature sensor probe 11 are used to detect the temperature change when the pressure head 8 is heated and used, and the process temperature change process is realized through the temperature controller PID adjustment; the heating tube 10 supplies heating to the heating element 7; the heating separation bracket 12 is used to install the connecting component of the heating element 7, and the material is Cr12 heat-treated; the cooling port 13 is the inflow interface of the cooling air refrigeration and cooling device.

[0040] The working process and control principle of the pressure head proposed in this embodiment are as follows: the pressure head 8 is preheated when the machine is turned on to make the temperature reach the process required temperature (160-280℃). When the temperature reaches the set value, the Z-axis mechanism is started to drive the pressure head 8 to bond. The mechanism above the pressure head 8 moves vertically downward at a uniform speed. The pressure head 8 is indirectly pressed on the product through the buffer silica gel, and then the mechanism is kept stationary and the temperature of the pressure head 8 is kept stable within the process required range (such as 8-12 seconds). When the bonding time is up, the heating element 7 is separated from the pressure head 8, and the cooling air refrigeration and cooling device flows into the pressure head body to cool the internal During the cooling process, the pressure head is quickly cooled to the lower limit (70-110°C); for example, the pressure head 8 is used at a temperature of 250°C during bonding, and the new pressure head 8 in this embodiment can be cooled to between 70-100°C in 5-10S. When the pressure head 8 is cooled to the set lower line temperature, the bonding position of the product is also cooled to the temperature of the product material forming state (70-100°C), thereby controlling the thermal expansion and contraction of the material and the instability of the electronic circuit, thereby improving the product quality. Then the pressure head 8 rises and returns to the standby position, completing a binding process.

Claims

1. A fast cooling pressure head on a mobile phone display screen bonding device, comprising a horizontal fixing bracket (4), characterized in that: A cylinder (1) is fixedly connected to one side of the top of the horizontal fixed bracket (4) by bolts, and a Z-axis mounting bracket (2) is movably connected to the other side of the top of the horizontal fixed bracket (4). The cylinder (1) is located at the front side of the Z-axis mounting bracket (2). The bottom side of the Z-axis mounting bracket (2) is fixedly connected to two vertical fixed brackets (6) by bolts. The piston shaft of the cylinder (1) extends to the bottom of the horizontal fixed bracket (4) and is fixedly connected to a heating element (7). The heating element (7) is located between the two vertical fixed brackets (6), and the bottom sides of the two vertical fixed brackets (6) are fixedly connected to the same pressure head (8) by bolts. The bottom side of the heating element (7) is movably connected to the top side of the pressure head (8). The front side of the heating element (7) is fixedly connected to a plurality of groups of heating tubes (10); a cooling port (13) is provided on one side of the pressure head (8); ceramic heat insulating rings (3) are fixedly adhered to both sides of the bottom of the Z-axis mounting bracket (2); the bottom side of the ceramic heat insulating ring (3) is fixedly adhered to the top side of the horizontal fixed bracket (4); the top side of the heating element (7) is fixedly connected to a heating separation bracket (12) by bolts; the top side of the heating separation bracket (12) is fixedly connected to the output shaft of the cylinder (1) by bolts; the top sides of the heating separation bracket (12) are fixedly connected to guide rods (5); the top ends of the guide rods (5) extend to the inner side of the horizontal fixed bracket (4) and are movably connected to the inner side of the horizontal fixed bracket (4).

2. The fast cooling pressure head on the mobile phone display screen bonding device according to claim 1, characterized in that: A pressure head temperature sensor probe (11) is fixedly connected to the front center portion of the pressure head (8).

3. The fast cooling pressure head on the mobile phone display screen bonding device according to claim 1, characterized in that: A plurality of heating temperature sensor probes (9) are fixedly connected to the front top of the heating element (7), and the heating temperature sensor probes (9) are located above the heating tube (10).

4. The fast cooling pressure head on the mobile phone display screen bonding device according to claim 1, characterized in that: The number of the heating tubes (10) is eight, and the eight heating tubes (10) are equally divided into four groups and arranged at equal intervals on the front side of the heating body (7).

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