A kind of additive adding method for preventing 4.5μm copper foil from tearing edge

An additive, copper foil technology, applied in electroforming, electrolysis process, etc., can solve the problems of reducing the bonding force between copper foil and titanium cathode substrate, easy tearing and unable to continuously rewind, etc., to prevent tearing.

Active Publication Date: 2022-07-19
安徽华创新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method for adding additives to prevent 4.5 μm copper foil from tearing, which can solve the problems of the traditional 4.5 μm electrolytic copper foil, such as the easy to tear edge and cannot be continuously rolled, and use additives to reduce the copper foil and titanium cathode substrate The bonding force allows the copper foil to be better peeled off from the cathode roll, thereby achieving the effect of preventing edge tearing

Method used

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  • A kind of additive adding method for preventing 4.5μm copper foil from tearing edge
  • A kind of additive adding method for preventing 4.5μm copper foil from tearing edge
  • A kind of additive adding method for preventing 4.5μm copper foil from tearing edge

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Embodiment 1

[0028] A method for adding additives for preventing edge tearing of 4.5μm copper foil, comprising the following steps:

[0029] (1) Use a titanium cathode with a smooth surface Rz of 1.2-1.3μm, the size is 60*100mm, and the solution in the electroplating tank is Cu 2+ The concentration of 60-120g / L, H 2 SO 4 The concentration of 70-140g / L, Cl - The concentration of the additive is 5-50mg / L, and then each additive is added to the electroplating tank equipped with copper foil for electroplating. The flow rate of the additive in a single machine is 1-5L / h, and the current density is 2000-6500A / m 2 ;

[0030] (2) The concentration of the additive TBPS solution is 2.4g / L, the PEG-10000 solution is 1.4g / L, the collagen peptide solution is 16.8g / L, the sodium saccharin solution is 7.2g / L, and the additive flow rate of a single machine is 3.5L / h, Current density 5500A / m 2 .

[0031] Through this example, the continuous production meter of copper foil is 31004 meters.

Embodiment 2

[0033] A method for adding additives for preventing edge tearing of 4.5μm copper foil, comprising the following steps:

[0034] (1) Use a titanium cathode with a smooth surface Rz of 1.2-1.3μm, the size is 60*100mm, and the solution in the electroplating tank is Cu 2+ The concentration of 60-120g / L, H 2 SO 4 The concentration of 70-140g / L, Cl - The concentration of the additive is 5-50mg / L, and then each additive is added to the electroplating tank equipped with copper foil for electroplating. The flow rate of the additive in a single machine is 1-5L / h, and the current density is 2000-6500A / m 2 ;

[0035] (2) The concentration of the additive TBPS solution is 2.4g / L, the PEG-10000 solution is 1g / L, the collagen peptide solution is 16.8g / L, the sodium saccharin solution is 7.2g / L, the additive flow rate of a single machine is 4.5L / h, and the current Density 5500A / m 2 .

[0036] Through this example, the continuous production meter of copper foil is 40039 meters.

[0037]...

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Abstract

The invention discloses a method for adding additives for preventing edge tearing of 4.5 μm copper foil. ‑1.3μm titanium cathode, the solution in the bath is Cu 2+ , H 2 SO 4 , and Cl ‑ , and then add each additive to the electroplating tank with copper foil for electroplating; carry out the verification of different additives, the electroplated copper foil is peeled off one side, and the edge of the copper foil is clamped by an electronic tensioner, and the peeling test is carried out perpendicular to the copper foil. And record the size of the peeling force, find the smallest peeling strength as the best ratio. The invention can solve the problem that the traditional 4.5-micron electrolytic copper foil is easy to tear and cannot be continuously wound, and uses additives to reduce the bonding force between the copper foil and the titanium cathode base material, so that the copper foil can be better peeled off from the cathode roller, so as to prevent tearing edge effect.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil manufacturing methods, in particular to a method for adding additives for preventing edge tearing of 4.5 μm copper foil. Background technique [0002] Ultra-thin copper foil for lithium-ion batteries is one of the most important parts in the lithium-ion battery manufacturing industry. It is used as a negative electrode current collector for lithium-ion batteries. It is a thin and light 4.5 micron copper foil, which is 45% lighter than the original 8 micron copper foil, but the thinner copper foil is a huge challenge for continuous production, because the copper foil of 4.5mm copper foil will be Too thin results in tearing and breaking of the foil, making it impossible for continuous production. In view of the above reasons, it is necessary to design an additive addition method for preventing edge tearing of 4.5μm copper foil. SUMMARY OF THE INVENTION [0003] The purpose of th...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): C25D1/04C25D1/22
CPCC25D1/04C25D1/22
Inventor徐龙操声跃何桂青安聪徐辉
Owner安徽华创新材料股份有限公司