A new circulating water vortex cooling chamber for semiconductor waste gas treatment equipment

Abstract

The present invention discloses a novel circulating water vortex cooling cavity for semiconductor waste gas treatment equipment, wherein the device body comprises a first cooling cavity, a second cooling cavity, a vortex water inlet, a waste gas inlet and a nameplate, wherein the first cooling cavity is located at the bottom of the device body, and the rear end of the second cooling cavity is installed at the front end of the first cooling cavity by screws, wherein a group of vortex water inlets are provided, and a group of vortex water inlets are symmetrically installed on the surface of the second cooling cavity, and a group of waste gas inlets are provided, and a group of waste gas inlets are symmetrically installed on the surface of the first cooling cavity. The novel circulating water vortex cooling cavity for semiconductor waste gas treatment equipment can improve the efficiency of waste gas treatment in the cavity by increasing the length of the cooling cavity, and can also increase the amount of waste gas treatment in the cavity, thereby further improving the work efficiency of the staff.

Description

Technical Field

[0001] The present invention relates to the technical field of waste gas treatment in the semiconductor industry, and in particular to a novel circulating water vortex cooling cavity for semiconductor waste gas treatment equipment. Background Art

[0002] Semiconductor waste gas is mostly toxic and harmful gas, which is seriously harmful to human body and environment. With the increasing prosperity of the semiconductor industry and the surge in production capacity, semiconductor manufacturers have more demands on waste gas treatment equipment and higher requirements on treatment efficiency due to the limitations of internal facilities.

[0003] The existing semiconductor industry waste gas treatment circulating water vortex cooling chamber has the following defects:

[0004] 1. When the existing semiconductor industry waste gas treatment circulating water vortex cooling cavity is in use, the cooling cavity is relatively short. When the waste gas is treated, the circulating water in the cavity cools the waste gas, the cooling efficiency is slow, and the waste gas treatment is limited, thereby failing to improve the waste gas treatment efficiency.

[0005] 2. When the existing semiconductor industry waste gas treatment circulating water vortex cooling cavity is in use, the vortex water inlet is long, and the long vortex water inlet will affect the rotation force of the vortex water, causing the vortex water to be blocked in the cavity, thereby affecting the normal waste gas treatment work of the device body. Summary of the invention

[0006] The purpose of the present invention is to provide a novel circulating water vortex cooling chamber for semiconductor waste gas treatment equipment to solve the problems raised in the above-mentioned background technology.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A new type of circulating water vortex cooling cavity for semiconductor waste gas treatment equipment is characterized in that: the device body includes a first cooling cavity, a second cooling cavity, a vortex water inlet, an exhaust gas inlet and a nameplate, the first cooling cavity is located at the bottom of the device body, the rear end of the second cooling cavity is installed at the front end of the first cooling cavity by screws, the vortex water inlet is provided with a group, and the vortex water inlet of one group is symmetrically installed on the surface of the second cooling cavity, and the exhaust gas inlet is provided with a group, and the exhaust gas inlet of one group is symmetrically installed on the surface of the first cooling cavity.

[0009] As a preferred embodiment of the present invention, both the front and rear ends of the first cooling cavity and the second cooling cavity are provided with connecting outer rings, the connecting outer rings are in a hollowed-out circular shape, and the surfaces of the connecting outer rings are provided with a plurality of groups of connecting screw holes.

[0010] As a preferred embodiment of the present invention, a sealing gasket is provided at the connection between the first cooling cavity and the second cooling cavity. The sealing gasket is in a hollow circular shape and is made of rubber.

[0011] As a preferred embodiment of the present invention, an electronic valve is installed in the vortex water inlet, and a plurality of groups of threads are provided on the surface of the vortex water inlet.

[0012] As a preferred embodiment of the present invention, the interior of the first cooling cavity is a hollow structure, and an internal cavity is provided inside the first cooling cavity. The internal cavity is a hollow structure, and a plurality of threads are provided at both the front and rear ends of the surface of the internal cavity.

[0013] As a preferred embodiment of the present invention, the first cooling cavity, the second cooling cavity and the internal cavity are all made of SUS material.

[0014] As a preferred embodiment of the present invention, the nameplate is installed on the surface of the second cooling cavity by screws, and the surface of the nameplate is provided with product information.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The new circulating water vortex cooling cavity of this semiconductor waste gas treatment equipment can effectively solve the problem of vortex water cooling the waste gas in the cavity, and can effectively improve the device body's work on cooling the waste gas. This device is provided with a first cooling cavity and a second cooling cavity. After the first cooling cavity and the second cooling cavity are connected, the length of the overall cavity can be lengthened, so that more vortex water and waste gas can enter the cavity, further facilitating a large amount of vortex water to cool the waste gas in the cavity, further improving the device body's work on waste gas treatment, thereby improving the work efficiency of the staff. This device has a simple structure and better efficiency, which is convenient for the staff to handle the waste gas.

[0017] 2. The new circulating water vortex cooling cavity of the semiconductor waste gas treatment equipment is provided with a vortex water inlet. The device is provided with a group of vortex inlets. The vortex water inlet is shorter than the normal vortex water inlet, thereby reducing the vortex water inlet and increasing the rotation force of the vortex water entering the cavity, thereby making it easier to cool the waste gas in the cavity during the vortex. The vortex water inlet can make the vortex water enter the cavity more turbulent, thereby preventing the waste gas in the cavity from being blocked, thereby reducing the problems that occur during the operation of the device body, further improving the stability of the operation of the device body, and improving the working efficiency of the device body in treating the waste gas. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 It is a schematic diagram of the overall internal structure of the present invention;

[0020] Figure 3 It is a schematic diagram of the overall cross-sectional structure of the present invention;

[0021] Figure 4 A top view of the overall structure of the present invention;

[0022] Figure 5 It is a schematic structural diagram of the second cavity of the present invention.

[0023] In the figure: 1. Device body; 2. First cooling cavity; 3. Second cooling cavity; 4. Vortex water inlet; 5. Exhaust gas inlet; 6. Nameplate; 7. Product information; 8. Connecting outer ring; 9. Connecting screw hole; 10. Internal cavity; 11. Thread; 12. Sealing gasket; 13. Electronic valve. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] See also Figure 1-5 , the present invention provides a technical solution:

[0026] A new type of circulating water vortex cooling cavity for semiconductor waste gas treatment equipment, the device body 1 includes a first cooling cavity 2, a second cooling cavity 3, a vortex water inlet 4, an exhaust gas inlet 5 and a nameplate 6, the first cooling cavity 2 is located at the bottom of the device body 1, the rear end of the second cooling cavity 3 is installed on the front end of the first cooling cavity 2 by screws, the vortex water inlet 4 is provided in a group, and a group of the vortex water inlet 4 is symmetrically installed on the surface of the second cooling cavity 3, and the exhaust gas inlet 5 is provided in a group, and a group of the exhaust gas inlet 5 is symmetrically installed on the surface of the first cooling cavity 2.

[0027] As a preferred embodiment of the present invention, the first cooling cavity 2 and the second cooling cavity 3 are both provided with connecting outer rings 8 at the front and rear ends, and the connecting outer rings 8 are in a hollow circular shape. A plurality of connecting screw holes 9 are provided on the surface of the connecting outer rings 8. The connecting outer rings 8 at both ends of the first cooling cavity 2 and the second cooling cavity 3 can be easily connected, so that it is convenient for the staff to connect the first cooling cavity 2 and the second cooling cavity 3. The staff only needs to make the connecting outer ring 8 on the first cooling cavity 2 and the connecting outer ring 8 at one end of the second cooling cavity 3 correspond to each other, and insert the screws into the connecting screw holes 9, so that the first cooling cavity 2 and the second cooling cavity 3 can be connected.

[0028] As a preferred embodiment of the present invention, a sealing gasket 12 is provided at the connection between the first cooling cavity 2 and the second cooling cavity 3. The sealing gasket 12 is in a hollow circular shape and is made of rubber. The sealing gasket 12 at the connection between the first cooling cavity 2 and the second cooling cavity 3 can improve the tightness of the connection between the first cooling cavity 2 and the second cooling cavity 3, and prevent the first cooling cavity 2 and the second cooling cavity 3 from being loosely connected, resulting in leakage of vortex water and exhaust gas in the cavity, thereby affecting the device body 1's treatment of exhaust gas, and the infiltrated exhaust gas will also affect the health of the staff.

[0029] As a preferred embodiment of the present invention, an electronic valve 13 is installed in the vortex water inlet 4, and several groups of threads 11 are provided on the surface of the vortex water inlet 4. This vortex water inlet 4 is shorter than the normal vortex water inlet 4, thereby reducing the vortex water inlet, which can increase the rotation force of the vortex water entering the cavity, thereby making it easier to cool the exhaust gas in the cavity during the vortex. This vortex water inlet 4 can make the vortex water enter the cavity more turbulently, thereby preventing the blockage of the exhaust gas in the cavity, thereby reducing the problems that occur during the operation of the device body 1, further improving the stability of the operation of the device body 1, and improving the working efficiency of the device body 1 in treating the exhaust gas. The electronic valve 13 on the vortex water inlet 4 can control the vortex water to enter the cavity, thereby making it easier for the staff to control the vortex water to enter the cavity to treat the exhaust gas.

[0030] As a preferred embodiment of the present invention, the interior of the first cooling cavity 2 is a hollow structure, and an internal cavity 10 is provided inside the first cooling cavity 2. The internal cavity 10 is a hollow structure, and a plurality of threads 11 are provided on the front and rear ends of the surface of the internal cavity 10. The internal cavity 10 in the first cooling cavity 2 can protect the first cooling cavity 2, thereby preventing the first cooling cavity from being damaged. The internal cavity 10 is installed in the first cooling cavity 2 through the threads 11 at the front and rear ends. Therefore, when the staff needs to disassemble the internal cavity 10 in the first cooling cavity 2, the staff only needs to rotate the internal cavity 10, and the internal cavity 10 can be rotated out through the threads 11 on the surface, thereby facilitating the staff to perform disassembly work, and the staff can perform maintenance on the first cooling cavity 2 and the internal cavity 10, thereby preventing the exhaust gas from being attached to the inside of the cavity during treatment and affecting the exhaust gas treatment efficiency.

[0031] As a preferred embodiment of the present invention, the first cooling cavity 2, the second cooling cavity 3 and the internal cavity 10 are all made of SUS316 material. The first cooling cavity 2, the second cooling cavity 3 and the internal cavity 10 are all made of SUS316 material. The stainless steel plasticity, toughness, cold deformation and welding process performance of SUS316 material are good. 316 has good high temperature strength, 316L has slightly worse high temperature performance, but better corrosion resistance than 316. Due to the low carbon content and 2%-3% molybdenum, the corrosion resistance to reducing salts and various inorganic acids and organic acids, alkalis and salts is improved. At the same time, the high temperature strength, so that this SUS316 material can improve the overall stability of the device body 1, and can also prevent the exhaust gas from corroding the first cooling cavity 2, the second cooling cavity 3 and the internal cavity 10, thereby effectively improving the service life of the device body 1, and further facilitating the device body 1 to treat the exhaust gas.

[0032] As a preferred embodiment of the present invention, the nameplate 6 is installed on the surface of the second cooling cavity 3 by screws, and the surface of the nameplate 6 is provided with product information 7. The product information on the nameplate 6 can facilitate the staff to understand the device body 1, so that the staff can communicate with the manufacturer after use, so as to facilitate the staff to have a comprehensive understanding of the product information.

[0033] Working principle: During operation, the staff uses the connecting outer ring 8 at the rear end of the first cooling cavity 2 to dock with the connecting outer ring 8 at the front end of the second cooling cavity 3, and the staff uses screws to insert into the connecting screw holes 9, so that the first cooling cavity 2 and the second cooling cavity 3 can be connected. The sealing gasket 12 at the connection between the first cooling cavity 2 and the second cooling cavity 3 can improve the tightness of the connection between the first cooling cavity 2 and the second cooling cavity 3, and prevent the first cooling cavity 2 and the second cooling cavity 3 from being loosely connected, which may cause leakage of vortex water and exhaust gas in the cavity, thereby affecting the treatment of exhaust gas by the device body 1, and the infiltrated exhaust gas may also affect the health of the staff. After the first cooling cavity 2 and the second cooling cavity 3 are connected, the length of the overall cavity can be lengthened, so that more vortex water and exhaust gas can enter the cavity, further facilitating the cooling treatment of the exhaust gas in the cavity by a large amount of vortex water, and further improving the exhaust gas treatment work of the device body 1. Thereby, the working efficiency of the staff is improved. The staff uses a waste pipe to access the exhaust gas inlet 5 in the second cooling cavity 3, and the exhaust gas will enter the first cooling cavity 2 and the second cooling cavity 3. The staff uses a vortex water pipe to access the vortex water inlet 4 through a thread. The vortex water inlet 4 is shorter than the normal vortex water inlet 4, thereby reducing the vortex water inlet and increasing the rotation force of the vortex water entering the cavity, thereby making it easier to cool the exhaust gas in the cavity during the vortex. This type of vortex water inlet 4 can make the vortex water enter the cavity more turbulent, thereby preventing the blockage of the exhaust gas in the cavity, thereby reducing the problems that occur during the operation of the device body 1, further improving the operating stability of the device body 1, and improving the working efficiency of the device body 1 in treating the exhaust gas. The electronic valve 13 on the vortex water inlet 4 can control the vortex water to enter the cavity, thereby facilitating the staff to control the vortex water to enter the cavity to treat the exhaust gas.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A new circulating water vortex cooling chamber for semiconductor waste gas treatment equipment, characterized by: The device comprises a device body (1), wherein the device body (1) comprises a first cooling cavity (2), a second cooling cavity (3), a vortex water inlet (4), an exhaust gas inlet (5) and a nameplate (6), wherein the first cooling cavity (2) is located at the bottom of the device body (1), the rear end of the second cooling cavity (3) is mounted on the front end of the first cooling cavity (2) by means of screws, the vortex water inlet (4) is provided in a group, and the vortex water inlet (4) is symmetrically mounted on the surface of the second cooling cavity (3), and the exhaust gas inlet (5) is provided in a group, and the exhaust gas inlet (5) is symmetrically mounted on the surface of the first cooling cavity (2); The first cooling cavity (2) and the second cooling cavity (3) are both provided with connecting outer rings (8) at both ends, the connecting outer rings (8) are in the shape of a hollow circle, and a plurality of connecting screw holes (9) are provided on the surface of the connecting outer rings (8); The interior of the first cooling cavity (2) is a hollow structure, and an internal cavity (10) is provided inside the first cooling cavity (2). The internal cavity (10) is a hollow structure, and a plurality of threads (11) are provided at both the front and rear ends of the surface of the internal cavity (10).

2. According to claim 1, a novel circulating water vortex cooling chamber for semiconductor waste gas treatment equipment is characterized by: A sealing gasket (12) is provided at the connection between the first cooling cavity (2) and the second cooling cavity (3); the sealing gasket (12) is in a hollow circular shape and is made of rubber.

3. According to claim 1, a novel circulating water vortex cooling chamber for semiconductor waste gas treatment equipment is characterized by: An electronic valve (13) is installed in the vortex water inlet (4), and a plurality of groups of threads (11) are provided on the surface of the vortex water inlet (4).

4. According to claim 1, a novel circulating water vortex cooling chamber for semiconductor waste gas treatment equipment is characterized by: The first cooling cavity (2), the second cooling cavity (3) and the internal cavity (10) are all made of SUS316 material.

5. According to claim 1, a novel circulating water vortex cooling chamber for semiconductor waste gas treatment equipment is characterized by: The nameplate (6) is mounted on the surface of the second cooling cavity (3) by means of screws, and the surface of the nameplate (6) is provided with product information (7).

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