Radiation effect test method and system

Abstract

The application discloses a kind of radiation effect test method and system, for the radiation effect of to-be-tested voltage source module is tested, comprising: when to-be-tested voltage source module is in the state of not being radiated by radiation source module, the first output voltage output by to-be-tested voltage source module provides first reference voltage signal for analog-digital conversion module, and analog-digital conversion module collects fixed analog signal and converts fixed analog signal into first digital signal;When to-be-tested voltage source module is in the state of being radiated by radiation source module, the second output voltage output by to-be-tested voltage source module provides second reference voltage signal for analog-digital conversion module, and analog-digital conversion module collects fixed analog signal and converts fixed analog signal into second digital signal;According to first digital signal and second digital signal, the voltage difference of second output voltage and first output voltage is obtained, to obtain the radiation effect of to-be-tested voltage source module.This method can capture the small output change of voltage source under radiation effect.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of anti-radiation, in particular to a radiation effect testing method and system. BACKGROUND

[0002] The voltage source is used to provide voltage for other circuit modules, and the band gap reference (BGR) is widely used in space. Since the radiation environment in space is harsh, when the band gap reference module is subjected to radiation of a certain energy, the output voltage of the band gap reference will change, and the normal working state of other circuit modules provided with voltage by the band gap reference will be destroyed. Therefore, how to characterize the radiation effect of the voltage source is a problem worthy of study. Generally, an oscilloscope or a probe station test system is directly connected to the output node of the voltage source circuit to directly measure the output voltage change of the voltage source under radiation effect. However, the output change of the voltage source under radiation effect cannot be completely captured by using this test method. SUMMARY

[0003] The present application provides a radiation effect testing method and system, which can capture the small output change of the voltage source under radiation effect.

[0004] The present application provides a radiation effect testing method for testing the radiation effect of a to-be-tested voltage source module, comprising: when the to-be-tested voltage source module is in a state not irradiated by a radiation source module, a first output voltage output by the to-be-tested voltage source module provides a first reference voltage signal for an analog-to-digital conversion module, and the analog-to-digital conversion module collects a fixed analog signal and converts the fixed analog signal into a first digital signal; when the to-be-tested voltage source module is in a state irradiated by the radiation source module, a second output voltage output by the to-be-tested voltage source module provides a second reference voltage signal for the analog-to-digital conversion module, and the analog-to-digital conversion module collects the fixed analog signal and converts the fixed analog signal into a second digital signal; and a voltage difference between the second output voltage and the first output voltage is obtained according to the first digital signal and the second digital signal, so as to obtain the radiation effect of the to-be-tested voltage source module.

[0005] In one embodiment, the radiation source module comprises a single-particle source module, the single-particle source module comprises a laser, and the to-be-tested voltage source module comprises a band gap reference source.

[0006] In one of the embodiments, further comprising: when the MOS tube of the to-be-tested voltage source module is in the state of being radiated by the radiation source module, the second output voltage output by the to-be-tested voltage source module provides the second reference voltage signal for the analog-digital conversion module, the analog-digital conversion module collects the fixed analog signal and converts the fixed analog signal into the second digital signal; and the voltage difference between the second output voltage and the first output voltage is obtained according to the first digital signal and the second digital signal, so as to obtain the radiation effect of the to-be-tested voltage source module.

[0007] In one of the embodiments, further comprising: when different regions of the to-be-tested voltage source module are in the state of being radiated by the radiation source module, a plurality of second output voltages output by the to-be-tested voltage source module provide a plurality of second reference voltage signals for the analog-digital conversion module, the analog-digital conversion module collects the fixed analog signal and converts the fixed analog signal into a plurality of second digital signals; a plurality of voltage differences between the plurality of second output voltages and the first output voltage are obtained according to the first digital signal and the plurality of second digital signals, and the sensitive region and the sensitive degree distribution of the to-be-tested voltage source module are obtained according to the size and the occurrence frequency of the plurality of voltage differences.

[0008] In one of the embodiments, the first output voltage of the to-be-tested voltage source module provides the first reference voltage signal for the analog-digital conversion module through a linear voltage variation circuit, and the second output voltage of the to-be-tested voltage source module provides the second reference voltage signal for the analog-digital conversion module through the linear voltage variation circuit.

[0009] In one of the embodiments, the voltage difference between the second output voltage and the first output voltage obtained according to the first digital signal and the second digital signal comprises:

[0010] The fixed analog signal comprises a fixed voltage signal, the first digital signal comprises a first binary digital signal, and the second digital signal comprises a second binary digital signal; the first binary digital signal is converted into a first decimal digital signal, and the second binary digital signal is converted into a second decimal digital signal.

[0011]

[0012] The voltage difference z between the second output voltage and the first output voltage is obtained according to (1), (2) and (3), wherein a is the first output voltage, b is the voltage of the fixed voltage signal, c is the number of bits of the first binary digital signal and the second binary digital signal, d is the first decimal digital signal, e is the second decimal digital signal, x is the quantization range of the first reference voltage signal, and y is the quantization range of the second reference voltage signal.

[0013] The application also provides a radiation effect test system, comprising: a radiation source module for emitting radiation; a to-be-tested voltage source module, which outputs a first output voltage when the to-be-tested voltage source module is in a state of not being irradiated by the radiation source module, and which outputs a second output voltage when the to-be-tested voltage source module is in a state of being irradiated by the radiation source module; an analog-to-digital conversion module, which collects a fixed analog signal and converts the fixed analog signal into a first digital signal when the first output voltage output by the to-be-tested voltage source module provides a first reference voltage signal for the analog-to-digital conversion module, and which collects the fixed analog signal and converts the fixed analog signal into a second digital signal when the second output voltage output by the to-be-tested voltage source module provides a second reference voltage signal for the analog-to-digital conversion module; and a test module, which obtains a voltage difference between the second output voltage and the first output voltage according to the first digital signal and the second digital signal, so as to obtain the radiation effect of the to-be-tested voltage source module.

[0014] In one embodiment, the radiation source module comprises a single-particle source module, and the to-be-tested voltage source module comprises a bandgap reference source.

[0015] In one embodiment, the to-be-tested voltage source module outputs the first output voltage to the analog-to-digital conversion module through a linear voltage variation circuit, and outputs the second output voltage to the analog-to-digital conversion module through the linear voltage variation circuit.

[0016] In one embodiment, the system further comprises a translation module, which can move the to-be-tested voltage source module so that the radiation source module can irradiate different regions of the to-be-tested voltage source module.

[0017] The one or more technical solutions provided in the embodiments of the application have at least the following technical effects or advantages:

[0018] 1. The application provides a kind of radiation effect test method, the voltage source module to be measured provides first reference voltage signal and second reference voltage signal for analog-digital conversion module, this test method introduces very small additional capacitive load, can capture the small output change of voltage source under the radiation effect, test efficiency is high.

[0019] 2. The application provides a kind of radiation effect test system, analog-digital conversion module is electrically connected with the voltage source module to be measured, this test system introduces very small additional capacitive load, can capture the small output change of voltage source under the radiation effect, test efficiency is high.

[0020] 3, radiation source module includes laser, with the advantages of large equivalent linear energy transfer value adjustment range, laser frequency accurate adjustable, test efficiency is high.

[0021] 4, it further includes translation module, translation module can move the voltage source module to be measured, to make radiation source module can radiate the different regions of the voltage source module to be measured, can obtain the sensitive area and sensitive degree distribution of the whole module of the voltage source module to be measured. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0023] Figure 1 It is the flow chart of the radiation effect test method of the application.

[0024] Figures 2-3 It is the structure diagram of the radiation effect test system of the application.

[0025] In the figure: 10, radiation source module;101, radiation;20, voltage source module to be measured;201, first reference voltage signal;202, second reference voltage signal;30, analog-digital conversion module;301, first digital signal;302, second digital signal;40, linear voltage variation circuit;401, first output voltage;402, second output voltage;501, fixed analog signal;60, detection module;70, imaging module;801, optical platform;802, translation module;90, computer. DETAILED DESCRIPTION

[0026] In the following, the embodiments of the present disclosure will be described with reference to the drawings. However, it should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present disclosure. In addition, in the following description, the description of well-known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present disclosure.

[0027] Various structural diagrams according to embodiments of the present disclosure are shown in the accompanying drawings. These diagrams are not drawn to scale in that certain details are exaggerated for the purpose of clarity, and certain details may be omitted. The shapes of various regions, layers, and the relative sizes and positional relationships among them shown in the diagrams are merely exemplary, and in actuality may deviate due to manufacturing tolerances or technical limitations, and regions / layers with different shapes, sizes, and relative positions can be additionally designed according to actual needs by those skilled in the art.

[0028] In the context of the present disclosure, when a layer / element is said to be located “on” another layer / element, the layer / element can be directly on the other layer / element, or there can be an intervening layer / element between them. In addition, if a layer / element is located “on” another layer / element in one orientation, it can be located “under” the other layer / element when the orientation is reversed.

[0029] Embodiment one

[0030] As shown in the Figure 1 radiation 101 effect test method for testing the radiation 101 effect of the to-be-tested voltage source module 20 is provided, including: when the to-be-tested voltage source module 20 is in a state of not being radiated 101 by the radiation source module 10, the first output voltage 401 output by the to-be-tested voltage source module 20 provides a first reference voltage signal 201 for the analog-to-digital conversion module 30, and the analog-to-digital conversion module 30 collects a fixed analog signal 501 and converts the fixed analog signal 501 into a first digital signal 301; when the to-be-tested voltage source module 20 is in a state of being radiated 101 by the radiation source module 10, the second output voltage 402 output by the to-be-tested voltage source module 20 provides a second reference voltage signal 202 for the analog-to-digital conversion module 30, and the analog-to-digital conversion module 30 collects the fixed analog signal 501 and converts the fixed analog signal 501 into a second digital signal 302; the voltage difference between the second output voltage 402 and the first output voltage 401 is obtained according to the first digital signal 301 and the second digital signal 302, so as to obtain the radiation 101 effect of the to-be-tested voltage source module 20.

[0031] S10: when the to-be-tested voltage source module 20 is in a state of not being radiated 101 by the radiation source module 10, the first output voltage 401 output by the to-be-tested voltage source module 20 provides a first reference voltage signal 201 for the analog-to-digital conversion module 30, and the analog-to-digital conversion module 30 collects a fixed analog signal 501 and converts the fixed analog signal 501 into a first digital signal 301.

[0032] The analog-to-digital converter module refers to a module that converts a continuously changing analog signal into a discrete digital signal.

[0033] In one embodiment, the radiation source module 10 comprises a single particle source module.

[0034] The single particle effect is a kind of radiation 101 effect that a single high-energy particle passes through the sensitive area of a microelectronic device to cause abnormal change of the device state. The single particle effect refers to the change or damage phenomenon of the logic state, function, etc. of the module caused by the additional charge formed by ionization in the module after being irradiated by high-energy ions 101.

[0035] In one embodiment, the radiation source module 10 comprises a laser.

[0036] The pulse laser simulating single particle effect is an effective and feasible technical solution. The single particle effect is caused by ionization of the outer electron of the target atom by high-energy heavy ions, forming additional charge, resulting in changes or damage phenomena of the logic state, function, etc. of the device. High-energy ions mainly produce electron-hole pairs by inelastic collision with the outer electron of the target atom, while laser produces electron-hole pairs by photoionization. Although the mechanisms of producing electron-hole pairs are different, the processes and mechanisms of absorbing electron-hole pairs by PN junction are the same.

[0037] In one embodiment, the voltage source module to be tested 20 comprises a bandgap reference source.

[0038] The bandgap reference source (BGR) is a commonly used circuit module for providing voltage to other circuit modules. Its output voltage is the sum of the positive temperature coefficient voltage and the negative temperature coefficient voltage, generating an output voltage that does not change with temperature.

[0039] S20: When the voltage source module to be tested 20 is in the state of being irradiated 101 by the radiation source module 10, the second output voltage 402 output by the voltage source module to be tested 20 provides a second reference voltage signal 202 for the analog-to-digital conversion module 30, and the analog-to-digital conversion module 30 collects the fixed analog signal 501 and converts the fixed analog signal 501 into a second digital signal 302.

[0040] In one embodiment, the voltage source module to be tested 20 provides a first reference voltage signal 201 for the analog-to-digital conversion module 30 through the first output voltage 401 of the linear voltage variation circuit 40, and the voltage source module to be tested 20 provides a second reference voltage signal 202 for the analog-to-digital conversion module 30 through the second output voltage 402 of the linear voltage variation circuit 40.

[0041] The output voltage of the to-be-tested voltage source module 20 is processed by the linear voltage changing circuit 40 to generate a reference voltage signal, the reference voltage signal includes a plurality of reference voltage signal units, the voltage difference between the reference voltage signal units is equal, wherein the voltage of the smallest reference voltage signal unit to the voltage of the largest reference voltage signal unit is a quantization range, the fixed voltage signal is compared with the voltage of the plurality of reference voltage signal units in size in the analog-digital conversion module 30, and a digital signal is converted and output by the analog-digital conversion module 30.

[0042] S30: obtaining the voltage difference between the second output voltage 402 and the first output voltage 401 according to the first digital signal 301 and the second digital signal 302, so as to obtain the radiation 101 effect of the to-be-tested voltage source module 20.

[0043] In one embodiment, the step S30 includes:

[0044] The fixed analog signal 501 includes a fixed voltage signal, the first digital signal 301 includes a first binary digital signal, the second digital signal 302 includes a second binary digital signal, the first binary digital signal is converted into a first decimal digital signal, and the second binary digital signal is converted into a second decimal digital signal.

[0045]

[0046]

[0047] According to (1), (2), (3), the voltage difference z between the second output voltage 402 and the first output voltage 401 is obtained, wherein a is the first output voltage 401, b is the voltage of the fixed voltage signal, c is the number of bits of the first binary digital signal and the second binary digital signal, d is the first decimal digital signal, e is the second decimal digital signal, x is the quantization range of the first reference voltage signal 201, and y is the quantization range of the second reference voltage signal 202.

[0048] In one specific embodiment, the voltage of the fixed voltage signal is +0.796875V, the first binary digital signal is 1110011000, the number of bits of the first binary digital signal is 10, the first decimal digital signal is 920, and the quantization range of the first reference voltage signal 201 is 1; the voltage of the fixed voltage signal is +0.796875V, the first binary digital signal is 1110010000, the number of bits of the first binary digital signal is 10, the first decimal digital signal is 912, and the formula (2) is substituted:

[0049]

[0050] The solution |y| is 1.02,

[0051] The first output voltage 401 is 1.2V, and substituted into formula (3):

[0052]

[0053] The voltage difference z between the second output voltage 402 and the first output voltage 401 is 0.024V.

[0054] In one embodiment, steps S20-S30 further comprise:

[0055] When the MOS tube of the to-be-tested voltage source module 20 is in the state of being radiated 101 by the radiation source module 10, the second output voltage 402 output by the to-be-tested voltage source module 20 provides a second reference voltage signal 202 for the analog-digital conversion module 30, the analog-digital conversion module 30 collects the fixed analog signal 501 and converts the fixed analog signal 501 into a second digital signal 302; the voltage difference between the second output voltage 402 and the first output voltage 401 is obtained according to the first digital signal 301 and the second digital signal 302, so as to obtain the radiation 101 effect of the to-be-tested voltage source module 20.

[0056] In one embodiment, steps S20-S30 further comprise:

[0057] When different regions of the to-be-tested voltage source module 20 are in the state of being radiated 101 by the radiation source module 10, multiple second output voltages 402 output by the to-be-tested voltage source module 20 provide multiple second reference voltage signals 202 for the analog-digital conversion module 30, the analog-digital conversion module 30 collects the fixed analog signal 501 and converts the fixed analog signal 501 into multiple second digital signals 302; multiple voltage differences between the multiple second output voltages 402 and the first output voltage 401 are obtained according to the first digital signal 301 and the multiple second digital signals 302, and the sensitive region and the sensitive degree distribution of the to-be-tested voltage source module 20 are obtained according to the size and the occurrence frequency of the multiple voltage differences.

[0058] Embodiment two

[0059] As Figures 2-3As shown, a radiation 101 effect test system is provided, comprising: a radiation source module 10 for emitting radiation 101; a to-be-tested voltage source module 20, when the to-be-tested voltage source module 20 is in a state of not being radiated 101 by the radiation source module 10, the to-be-tested voltage source module 20 outputs a first output voltage 401; when the to-be-tested voltage source module 20 is in a state of being radiated 101 by the radiation source module 10, the to-be-tested voltage source module 20 outputs a second output voltage 402; an analog-to-digital conversion module 30, when the first output voltage 401 output by the to-be-tested voltage source module 20 provides a first reference voltage signal 201 for the analog-to-digital conversion module 30, the analog-to-digital conversion module 30 collects a fixed analog signal 501 and converts the fixed analog signal 501 into a first digital signal 301; when the second output voltage 402 output by the to-be-tested voltage source module 20 provides a second reference voltage signal 202 for the analog-to-digital conversion module 30, the analog-to-digital conversion module 30 collects the fixed analog signal 501 and converts the fixed analog signal 501 into a second digital signal 302; a test module, the test module obtains a voltage difference between the second output voltage 402 and the first output voltage 401 according to the first digital signal 301 and the second digital signal 302, so as to obtain the radiation 101 effect of the to-be-tested voltage source module 20.

[0060] In one embodiment, the radiation source module 10 comprises a single-particle source module.

[0061] In one embodiment, the radiation source module 10 comprises a laser.

[0062] In one embodiment, the to-be-tested voltage source module 20 comprises a bandgap reference source.

[0063] In one embodiment, further comprising a linear voltage variation circuit 40, the first output voltage 401 of the to-be-tested voltage source module 20 provides the first reference voltage signal 201 for the analog-to-digital conversion module 30 through the linear voltage variation circuit 40, and the second output voltage 402 of the to-be-tested voltage source module 20 provides the second reference voltage signal 202 for the analog-to-digital conversion module 30 through the linear voltage variation circuit 40.

[0064] In one embodiment, further comprising a translation module 802, the translation module 802 can move the to-be-tested voltage source module 20 so that the radiation source module 10 can radiate 101 different regions of the to-be-tested voltage source module 20.

[0065] In one embodiment, the translation module 802 comprises an XY translation module 802 for moving the to-be-tested voltage source module 20 at a constant amplitude step.

[0066] In one embodiment, the translation module 802 is placed on an optical platform 801.

[0067] In one embodiment, an imaging module 70 is further included for observing the voltage source module 20 under test. The imaging module 70 includes a CCD imaging module 70, which can observe the surface of the voltage source module 20 under test through focusing visible light rays and image on a computer. Through the imaging and translation module 802 on the computer, the MOS tube position in the voltage source module 20 under test can be easily found and the sensitive area can be recorded. CCD is the abbreviation of Charge Coupled Device, which is a special semiconductor device with a lot of same light-sensitive elements, each of which is called a pixel.

[0068] In one embodiment, the imaging module 70 transmits the image to the computer 90 to display the voltage source module 20 under test.

[0069] In one embodiment, a detection module 60 is further included, the digital signal includes a binary digital signal, and the detection module 60 collects the binary digital signal input by the analog-digital conversion module 30 and converts it into a decimal digital signal.

[0070] In one embodiment, the detection module 60 transmits the decimal digital signal to the computer 90.

[0071] The technical solutions in the embodiments of the present application have at least the following technical effects or advantages:

[0072] 1. The present application provides a radiation 101 effect test method, the voltage source module 20 under test provides a first reference voltage signal 201 and a second reference voltage signal 202 for the analog-digital conversion module 30, the test method introduces a very small additional capacitive load, which can capture the small output change of the voltage source under the radiation 101 effect, and the test efficiency is high.

[0073] 2. The present application provides a radiation 101 effect test system, the analog-digital conversion module 30 is electrically connected with the voltage source module 20 under test, the test system introduces a very small additional capacitive load, which can capture the small output change of the voltage source under the radiation 101 effect, and the test efficiency is high.

[0074] 3. The radiation source module 10 includes a laser, which has the advantages of large equivalent linear energy transfer value adjustment range, accurate laser frequency adjustment, and high test efficiency.

[0075] 4. A translation module 802 is further included, which can move the voltage source module 20 under test, so that the radiation source module 10 can radiate 101 different areas of the voltage source module 20 under test, and the sensitive area and sensitive degree distribution of the entire module of the voltage source module 20 under test can be obtained according to the size and frequency of the digital signal.

[0076] Those skilled in the art will appreciate that embodiments of the present application can be devised for a variety of applications. It is intended that the present application be limited only by the scope of the appended claims, and it is intended that various modifications and alterations made by those skilled in the art be considered as within the scope of the present application. The embodiments of the present application will be described with reference to the attached drawings, wherein:

[0077] The present application is described in reference to the drawings using a flowchart and / or a block diagram of the method, apparatus (system) and computer program product according to embodiments of the application. It will be understood that each block of the flowchart and / or block diagram, and combinations of blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general purpose computer, special purpose computer, embedded processing device or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart and / or block diagram block or blocks. Figure 1 one or more functions specified in the flowchart and / or block diagram block or blocks. Figure 1 one or more functions specified in the flowchart and / or block diagram block or blocks.

[0078] These computer program instructions can also be stored in a computer- readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instructions which implement the function specified in the flowchart and / or block diagram block or blocks. Figure 1 one or more functions specified in the flowchart and / or block diagram block or blocks. Figure 1 one or more functions specified in the flowchart and / or block diagram block or blocks.

[0079] These computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart and / or block diagram block or blocks. Figure 1 one or more functions specified in the flowchart and / or block diagram block or blocks. Figure 1 one or more functions specified in the flowchart and / or block diagram block or blocks.

[0080] While the preferred embodiments of the application have been described, additional variations and modifications can be made to the embodiments by those skilled in the art once they learn of the basic inventive concepts. Therefore, the appended claims are intended to cover all such modifications and variations as fall within the scope of the present application.

[0081] Obviously, many modifications and variations of the present application are possible in light of the above teachings. It is, therefore, to be understood that within the scope of the appended claims and their equivalents, the application can be practiced otherwise than as specifically described.

Claims

1. A radiation effect test method for testing a radiation effect of a voltage source module to be tested, characterized by, Comprise: When the to-be-tested voltage source module is in a state of not being radiated by the radiation source module, a first output voltage output by the to-be-tested voltage source module provides a first reference voltage signal for an analog-to-digital conversion module, and the analog-to-digital conversion module collects a fixed analog signal and converts the fixed analog signal into a first digital signal; When the to-be-tested voltage source module is in a state of being radiated by the radiation source module, a second output voltage output by the to-be-tested voltage source module provides a second reference voltage signal for the analog-to-digital conversion module, and the analog-to-digital conversion module collects the fixed analog signal and converts the fixed analog signal into a second digital signal; According to the first digital signal and the second digital signal, a voltage difference between the second output voltage and the first output voltage is obtained to obtain a radiation effect of the to-be-tested voltage source module; The first output voltage of the to-be-tested voltage source module provides the first reference voltage signal for the analog-to-digital conversion module through a linear voltage change circuit, and the second output voltage of the to-be-tested voltage source module provides the second reference voltage signal for the analog-to-digital conversion module through the linear voltage change circuit; According to the first digital signal and the second digital signal, a voltage difference between the second output voltage and the first output voltage is obtained, comprising: The fixed analog signal comprises a fixed voltage signal, the first digital signal comprises a first binary digital signal, and the second digital signal comprises a second binary digital signal; the first binary digital signal is converted into a first decimal digital signal, and the second binary digital signal is converted into a second decimal digital signal; According to (1), (2), and (3), the voltage difference z between the second output voltage and the first output voltage is obtained, wherein a is the first output voltage, b is the voltage of the fixed voltage signal, c is the number of bits of the first binary digital signal and the second binary digital signal, d is the first decimal digital signal, e is the second decimal digital signal, x is a quantization range of the first reference voltage signal, and y is a quantization range of the second reference voltage signal.

2. The radiation effect testing method of claim 1, wherein, The radiation source module comprises a single-particle source module, and the single-particle source module comprises a laser; and the to-be-tested voltage source module comprises a bandgap reference source.

3. The radiation effects testing method of claim 1, wherein, Further comprise: When the MOS tube of the to-be-tested voltage source module is in a state of being radiated by the radiation source module, the second output voltage output by the to-be-tested voltage source module provides the second reference voltage signal for the analog-to-digital conversion module, and the analog-to-digital conversion module collects the fixed analog signal and converts the fixed analog signal into the second digital signal; According to the first digital signal and the second digital signal, a voltage difference between the second output voltage and the first output voltage is obtained to obtain a radiation effect of the to-be-tested voltage source module.

4. The radiation effects testing method of claim 1, wherein, Further comprise: The second output voltage of the to-be-tested voltage source module provides a second reference voltage signal for the analog-digital conversion module when different regions of the to-be-tested voltage source module are in a state of being radiated by the radiation source module, the analog-digital conversion module collects the fixed analog signal and converts the fixed analog signal into a second digital signal; According to the first digital signal and the second digital signal, a voltage difference between the second output voltage and the first output voltage is obtained, and according to the size and frequency of the voltage difference, a sensitive region and a sensitive degree distribution of the to-be-tested voltage source module are obtained.

5. A radiation effects testing system, characterized by, Comprise: a radiation source module for emitting radiation; a to-be-tested voltage source module, the to-be-tested voltage source module outputs a first output voltage when the to-be-tested voltage source module is in a state of not being radiated by the radiation source module; the to-be-tested voltage source module outputs a second output voltage when the to-be-tested voltage source module is in a state of being radiated by the radiation source module; an analog-digital conversion module, the first output voltage of the to-be-tested voltage source module provides a first reference voltage signal for the analog-digital conversion module, the analog-digital conversion module collects a fixed analog signal and converts the fixed analog signal into a first digital signal, and the second output voltage of the to-be-tested voltage source module provides a second reference voltage signal for the analog-digital conversion module, the analog-digital conversion module collects the fixed analog signal and converts the fixed analog signal into a second digital signal; a test module, the test module obtains a radiation effect of the to-be-tested voltage source module according to the first digital signal and the second digital signal; further comprising a linear voltage variation circuit, the first output voltage of the to-be-tested voltage source module provides the first reference voltage signal for the analog-digital conversion module through the linear voltage variation circuit, and the second output voltage of the to-be-tested voltage source module provides the second reference voltage signal for the analog-digital conversion module through the linear voltage variation circuit; According to the first digital signal and the second digital signal, a voltage difference between the second output voltage and the first output voltage is obtained, comprising: The fixed analog signal comprises a fixed voltage signal, the first digital signal comprises a first binary digital signal, and the second digital signal comprises a second binary digital signal, the first binary digital signal is converted into a first decimal digital signal, and the second binary digital signal is converted into a second decimal digital signal; According to (1), (2) and (3), the voltage difference z between the second output voltage and the first output voltage is obtained, wherein a is the first output voltage, b is the voltage of the fixed voltage signal, c is the number of bits of the first binary digital signal and the second binary digital signal, d is the first decimal digital signal, e is the second decimal digital signal, x is a quantization range of the first reference voltage signal, and y is a quantization range of the second reference voltage signal.

6. The radiation effects testing system of claim 5, wherein, The radiation source module includes a single particle source module including a laser, and the voltage under test source module includes a bandgap reference source.

7. The radiation effects testing system of claim 5, wherein, A translation module is also included that can move the voltage under test source module to enable the radiation source module to radiate different areas of the voltage under test source module.

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