A semiconductor wafer optical fiber temperature measuring device and preparation method thereof

Abstract

The present invention belongs to the technical field of optical fiber temperature measurement, and relates to an optical fiber temperature measurement device for a semiconductor wafer and a preparation method thereof, comprising: a threaded sleeve, an optical fiber head sleeve, a limit spring, an optical fiber, and an optical fiber inner sleeve; the optical fiber head sleeve extends into the threaded sleeve and compresses the limit spring, the optical fiber inner sleeve presses against the rear end face of the optical fiber head sleeve, the optical fiber head extends out of the optical fiber head sleeve and is flush with the head end face of the optical fiber head sleeve, and the tail of the optical fiber extends out of the rear end face of the threaded sleeve; the present invention replaces thermocouple temperature measurement by adopting fluorescence temperature measurement, and does not need to perform thermocouple voltage conversion, and changes indirect measurement into direct measurement, thereby avoiding the introduction of errors caused by signal conditioning; at the same time, the fluorescence temperature measurement accuracy of the present invention can reach ±0.15°C, so the present invention has smaller errors and higher accuracy, and the present invention has good corrosion resistance and noise resistance.

Description

Technical Field

[0001] The invention belongs to the technical field of optical fiber temperature measurement, and relates to a semiconductor wafer optical fiber temperature measurement device and a preparation method thereof. Background Art

[0002] Wafer refers to the silicon chip used in the manufacture of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer; various circuit component structures can be processed on the silicon wafer to become an integrated circuit product with specific electrical functions. After silicon is extracted from the sand into a whole crystal rod, the crystal rod needs to undergo a series of processes to form a silicon substrate that meets the requirements of semiconductor manufacturing, that is, a wafer. After cutting, the wafer garden requires the cutting surface to be flat, and the surface must be free of slides, regional contamination, edge collapse, cracks, pits, etc. The processing flow is: shape finishing, slicing, chamfering, grinding and polishing, etc. In the process control, a slight temperature difference will damage the wafer and cause irreversible damage, so high-precision temperature control is particularly important in the entire manufacturing process.

[0003] The most common method for temperature control and monitoring of wafer heating plates is thermocouple temperature measurement. Under normal conditions, thermocouple temperature measurement has the following shortcomings: First, signal conditioning is complex: a lot of signal conditioning is required to convert the thermocouple voltage into a usable temperature reading. Signal conditioning has always taken a lot of design time, and improper handling will introduce errors and reduce accuracy. Second, the accuracy is low: in addition to the inherent inaccuracy of the thermocouple due to the characteristics of metal, the measurement accuracy of the thermocouple can only reach the measurement accuracy of the reference junction temperature, which is generally within 1°C to 2°C. Third, it is susceptible to corrosion: because the thermocouple probe is composed of metal, corrosion over time may reduce accuracy under some working conditions. Therefore, they may need protection; and maintenance is essential. Fourth, poor noise resistance: when measuring millivolt signal changes, the noise generated by stray electric and magnetic fields may cause problems. Therefore, a temperature measurement device with small error, high accuracy, corrosion resistance and good noise resistance is needed to solve this problem. Summary of the invention

[0004] The technical solution adopted by the present invention to solve the technical problem is: a semiconductor wafer optical fiber temperature measurement device, comprising: a threaded sleeve, an optical fiber head sleeve, a limit spring, an optical fiber, and an optical fiber inner sleeve;

[0005] The threaded sleeve is in the shape of a three-stage stepped shaft with a thick middle section and thin ends. A first step through hole coaxial with the threaded sleeve and having a larger front end and a smaller rear end is provided in the threaded sleeve.

[0006] The optical fiber inner sleeve is cylindrical and made of flexible material. The inner diameter of the optical fiber inner sleeve is equal to the outer diameter of the optical fiber. The outer diameter of the optical fiber inner sleeve is equal to the inner diameter of the small hole of the first step through hole.

[0007] The optical fiber head sleeve is cylindrical, and the inner cylinder of the optical fiber head sleeve is provided with a second step through hole with a small front end and a large rear end, the diameter of the large hole in the second step through hole is equal to the outer diameter of the optical fiber, the diameter of the small hole in the second step through hole is equal to the outer diameter of the optical fiber core of the optical fiber, and the outer diameter of the optical fiber head sleeve is equal to the diameter of the large hole in the first step through hole;

[0008] The outer diameter of the limit spring is equal to the large hole diameter of the first step through hole, and the inner diameter of the limit spring is equal to the outer diameter of the optical fiber inner sleeve;

[0009] One end of the large hole of the optical fiber head sleeve extends from the large hole of the threaded sleeve into the first step through hole and compresses one end face of the limit spring, and the other end face of the limit spring compresses the step end face of the large hole of the first step through hole. One end of the optical fiber inner sleeve passes through the inner cylinder of the limit spring and presses against the rear end face of the optical fiber head sleeve. The other end of the optical fiber inner sleeve extends out of the rear outside of the threaded sleeve. The optical fiber core of the optical fiber head extends out of the head of the optical fiber head sleeve from the small hole of the second step through hole and is flush with the head end face of the optical fiber head sleeve. The tail of the optical fiber passes through the inner cylinder of the optical fiber inner sleeve and extends out of the rear end face of the threaded sleeve.

[0010] Preferably, a circular packaging cap is fastened to the head end face of the optical fiber head sleeve, a disc-shaped fluorescent powder cake is embedded in the inner ring of the packaging cap, and the inner end face of the fluorescent powder cake is in contact with and overlaps with the head end face of the optical fiber core.

[0011] More preferably, the packaging cap is fastened in a manner that an annular groove is provided on the head end face of the optical fiber head sleeve, and the packaging cap is clamped on the head end face of the optical fiber head sleeve through the annular groove.

[0012] Preferably, a fiber optic connector is provided at the tail end of the optical fiber.

[0013] More preferably, the optical fiber connector is provided with a dust cap.

[0014] Preferably, an external thread is provided on the outer diameter of the tail step shaft of the threaded sleeve.

[0015] Preferably, a fiber optic limiting tube is provided at the tail end of the optical fiber inner sleeve where it protrudes from the threaded sleeve, and the fiber optic limiting tube is made of a heat shrink tube.

[0016] The present invention also discloses a semiconductor wafer optical fiber temperature measurement method, which is used for the above-mentioned temperature measurement device and comprises the following steps:

[0017] Step 1: Cut the optical fiber according to the designed length, insert the optical fiber into the optical fiber inner sleeve, and expose one end of the optical fiber outside the optical fiber inner sleeve by 0.8-1.5cm. Apply high temperature curing glue within the range of 0.8-1.5, insert the optical fiber ribbon sheath into the optical fiber head sleeve until the optical fiber is exposed more than 0.5cm from the small hole of the head of the optical fiber head sleeve, and put the optical fiber, the optical fiber inner sleeve, and the optical fiber head sleeve into the oven for high temperature curing;

[0018] Step 2: After the high-temperature curing is completed, the optical fiber exposed from the small hole of the head of the optical fiber head sleeve is cut off, and the optical fiber head sleeve is loaded into a grinder, and the head end face of the optical fiber head sleeve is polished with a grinding sheet;

[0019] Step 3: Mix the high-temperature glue and the fluorescent powder, extrude the fluorescent powder under high pressure to form a powder cake, remove the formed fluorescent powder cake from the powder cake loading platform, embed the fluorescent powder cake into the annular inner wall of the packaging cap, and completely push the fluorescent powder cake into the packaging cap until the outer end surface of the fluorescent powder cake is flush with the outer end surface of the annular bottom of the packaging cap; this step retains the fluorescent powder to the greatest extent and reduces the involvement of glue, maximizes the retention of the purity of the fluorescent powder, and reduces the transmission obstacles of the optical signal;

[0020] Step 4: Insert the packaging cap into the annular groove at the top of the optical fiber head sleeve, and then use purple glue to cure the packaging cap and the optical fiber head sleeve. After curing, remove the excess purple glue, and then add high-temperature isolation curing glue on the basis of the purple glue for reinforcement;

[0021] Step 5: Insert the limit spring, threaded sleeve, and optical fiber limit tube in sequence at the other end of the optical fiber, so that the optical fiber head sleeve and the threaded sleeve clamp the limit spring in the middle position of the first step through hole, and heat shrink and tighten the optical fiber limit tube at the end of the optical fiber inner sleeve where the threaded sleeve protrudes. At this time, the threaded sleeve cannot slide to the rear, and the middle limit spring begins to play a tensioning role. The part of the optical fiber head sleeve protruding from the head of the threaded sleeve is limited by the movable stroke of the limit spring;

[0022] Step 6: Clamp the optical fiber connector and complete the corresponding polishing process. Put a dust cap on the polished optical fiber connector to complete the production of the temperature measuring optical fiber.

[0023] Preferably, in step 2: the grinder grinds and polishes the head end face of the optical fiber head sleeve using 9 μm, 3 μm, 1 μm, and 0.5 μm grinding sheets in sequence.

[0024] Preferably, in the step four: the cured and polished optical fiber head sleeve and the packaging cap embedded with the fluorescent powder cake are placed in a vacuum operating box to perform a curing operation of embedding the packaging cap into the optical fiber head sleeve, and air is prevented from flowing in during the curing operation; the significance of this step is that the vacuum environment is not heat-conductive, but it does not affect the light transmission path. The powder cake is actually fluorescent powder. After the powder cake is stimulated by the temperature, the optical signal fed back is transmitted through the vacuum environment directly to the optical end face. This method minimizes the transmission obstacles of the optical signal.

[0025] The beneficial effects of the present invention are:

[0026] 1. The present invention replaces thermocouple temperature measurement with fluorescence temperature measurement, and does not need to perform thermocouple voltage conversion, changing indirect measurement to direct measurement, thereby avoiding the introduction of errors caused by signal conditioning; at the same time, the fluorescence temperature measurement accuracy of the present invention can reach ±0.15°C, while the thermocouple measurement accuracy can only reach within 1°C to 2°C, so the present invention has smaller errors and higher accuracy.

[0027] 2. The optical fiber, optical fiber head sleeve and optical fiber inner sleeve of the present invention are all made of flame-retardant and corrosion-resistant high-performance materials, which can be used reliably in various environments without maintenance. Compared with the thermocouple probe made of metal, the present invention has better corrosion resistance.

[0028] 3. The present invention uses optical fiber, which has excellent anti-interference performance. Since the optical fiber is only affected by the optical signal of temperature feedback, it is not interfered by external factors such as radiation and vibration. Therefore, the present invention has better noise resistance.

[0029] 4. The present invention adopts a limit spring to adjust the temperature measurement distance of the optical fiber head, so it can be manufactured according to customer needs. The temperature measurement point of the optical fiber head can automatically adjust the distance under pressure. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a front view of the head of a semiconductor wafer optical fiber temperature measurement device;

[0031] Figure 2 It is a frontal cross-sectional view of the head;

[0032] Figure 3 It is an overall cross-sectional view;

[0033] Figure 4 It is a cross-sectional view of the optical fiber head sleeve;

[0034] Figure 5 This is a schematic diagram of the production of fluorescent powder cake.

[0035] In the figure: 1. threaded sleeve; 2. fiber optic head sleeve; 3. limit spring; 4. optical fiber; 5. optical fiber inner sleeve; 6. optical fiber limit tube; 7. first step through hole; 8. second step through hole; 9. optical fiber core; 10. packaging cap; 11. phosphor powder cake; 12. annular groove; 13. optical fiber connector; 14. dust cap; 15. external thread. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the relevant technologies in the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] refer to Figure 1-5 , a semiconductor wafer optical fiber temperature measuring device and a preparation method thereof, comprising: a threaded sleeve 1, an optical fiber head sleeve 2, a limit spring 3, an optical fiber 4, and an optical fiber inner sleeve 5;

[0038] The threaded sleeve 1 is in the shape of a three-stage stepped shaft with a thick middle section and thin ends. A first step through hole 7 coaxial with the threaded sleeve 1 and having a larger front end and a smaller rear end is provided in the threaded sleeve 1.

[0039] The optical fiber inner sleeve 5 is cylindrical and made of flexible material. The inner diameter of the optical fiber inner sleeve 5 is equal to the outer diameter of the optical fiber 4. The outer diameter of the optical fiber inner sleeve 5 is equal to the inner diameter of the small hole of the first step through hole 7.

[0040] The optical fiber head sleeve 2 is cylindrical, and the inner cylinder of the optical fiber head sleeve 2 is provided with a second step through hole 8 with a small front end and a large rear end, the diameter of the large hole in the second step through hole 8 is equal to the outer diameter of the optical fiber 4, the diameter of the small hole in the second step through hole 8 is equal to the outer diameter of the optical fiber core 9 of the optical fiber 4, and the outer diameter of the optical fiber head sleeve 2 is equal to the large hole diameter of the first step through hole 7;

[0041] The outer diameter of the limit spring 3 is equal to the large hole diameter of the first step through hole 7, and the inner diameter of the limit spring 3 is equal to the outer diameter of the optical fiber inner sleeve 5;

[0042] One end of the large hole of the optical fiber head sleeve 2 extends from the large hole of the threaded sleeve 1 into the first step through hole 7 and compresses one end face of the limit spring 3. The other end face of the limit spring 3 compresses the step end face of the large hole of the first step through hole 7. One end of the optical fiber inner sleeve 5 passes through the inner tube of the limit spring 3 and presses against the rear end face of the optical fiber head sleeve 2. The other end of the optical fiber inner sleeve 5 extends out of the outer rear end of the threaded sleeve 1. The optical fiber core 9 at the head of the optical fiber 4 extends out of the head of the optical fiber head sleeve 2 from the small hole of the second step through hole 8 and is flush with the head end face of the optical fiber head sleeve 2. The tail of the optical fiber 4 passes through the inner tube of the optical fiber inner sleeve 5 and extends out of the tail end face of the threaded sleeve 1.

[0043] Furthermore, a circular packaging cap 10 is fastened to the head end face of the optical fiber head sleeve 2, and a disc-shaped fluorescent powder cake 11 is embedded in the inner ring of the packaging cap 10. The inner end face of the fluorescent powder cake 11 is in contact with and overlaps with the head end face of the optical fiber core 9.

[0044] Furthermore, the fastening connection method of the packaging cap 10 is that the head end surface of the optical fiber head sleeve 2 is provided with an annular groove 12, and the packaging cap 10 is clamped on the head end surface of the optical fiber head sleeve 2 through the annular groove 12.

[0045] Furthermore, a fiber optic connector 13 is provided at the tail end of the optical fiber 4 .

[0046] Furthermore, a dust cap 14 is provided on the optical fiber connector 13 .

[0047] Furthermore, an external thread 15 is provided on the outer diameter of the tail step shaft of the threaded sleeve 1 .

[0048] Furthermore, a fiber optic limiting tube 6 is provided at the tail end of the fiber optic inner sleeve 5 extending out of the threaded sleeve 1, and the fiber optic limiting tube 6 is made of a heat shrink tube.

[0049] The present invention also discloses a semiconductor wafer optical fiber temperature measurement method, which is used for the above-mentioned temperature measurement device and comprises the following steps:

[0050] Step 1: Cut the optical fiber 4 according to the designed length, insert the optical fiber 4 into the optical fiber inner sleeve 5, expose one end of the optical fiber 4 outside the optical fiber inner sleeve 5 by 0.8-1.5 cm, apply high temperature curing glue within the range of 0.8-1.5, insert the optical fiber 4 with the sheath into the optical fiber head sleeve 2, until the optical fiber 4 is exposed from the small hole of the head of the optical fiber head sleeve 2 by more than 0.5 cm, put the optical fiber 4 together with the optical fiber inner sleeve 5 and the optical fiber head sleeve 2 into the oven for high temperature curing;

[0051] Step 2: After the high-temperature curing is completed, the optical fiber 4 exposed from the small hole of the head of the optical fiber head sleeve 2 is cut off, and the optical fiber head sleeve 2 is loaded into a grinder, and the head end face of the optical fiber head sleeve 2 is polished by a grinding sheet;

[0052] Step 3: Mix the high-temperature glue and the fluorescent powder, extrude the fluorescent powder under high pressure into a powder cake state to form a fluorescent powder cake 11, remove the formed fluorescent powder cake 11 from the powder cake loading platform, embed the fluorescent powder cake 11 into the annular inner wall of the packaging cap 10, and completely push the fluorescent powder cake 11 into the packaging cap 10 until the outer end surface of the fluorescent powder cake 11 is flush with the outer end surface of the annular bottom of the packaging cap 10; this step retains the fluorescent powder to the greatest extent and reduces the intervention of glue, maximizes the retention of the purity of the fluorescent powder, and reduces the transmission obstacles of the optical signal;

[0053] Step 4: insert the packaging cap 10 into the annular groove 12 at the top of the optical fiber head sleeve 2, and then use purple glue to cure the packaging cap 10 and the optical fiber head sleeve 2. After curing, remove the excess purple glue, and then add high-temperature isolation curing glue on the basis of the purple glue for reinforcement;

[0054] Step 5: Insert the limit spring 3, the threaded sleeve 1, and the optical fiber limit tube 6 in sequence at the other end of the optical fiber 4, so that the optical fiber head sleeve 2 and the threaded sleeve 1 clamp the limit spring 3 in the middle position of the first step through hole 7, and heat shrink and tighten the optical fiber limit tube 6 at the point where the threaded sleeve 1 protrudes from the tail end of the optical fiber inner sleeve 5. At this time, the threaded sleeve 1 cannot slide to the tail, and the middle limit spring 3 begins to play a tensioning role. The part of the optical fiber head sleeve 2 protruding from the head of the threaded sleeve 1 is limited by the movable stroke of the limit spring 3;

[0055] Step 6: After the optical fiber connector 13 is clamped, the corresponding polishing process is completed, and a dust cap 14 is put on the polished optical fiber connector 13 to complete the production of the temperature measuring optical fiber.

[0056] Furthermore, in the step 2: the grinder sequentially grinds and polishes the head end face of the optical fiber head sleeve 2 using grinding discs of 9 μm, 3 μm, 1 μm, and 0.5 μm.

[0057] Furthermore, in the step four: the cured and polished optical fiber head sleeve 2 and the packaging cap 10 embedded with the fluorescent powder cake 11 are placed in a vacuum operating box to perform a curing operation of embedding the packaging cap 10 into the optical fiber head sleeve 2, and air is prevented from flowing in during the curing operation; the significance of this step is that the vacuum environment is not heat-conductive, but it does not affect the light transmission path. The powder cake is actually fluorescent powder. After the powder cake is stimulated by the temperature, the optical signal fed back is transmitted through the vacuum environment directly to the optical end face. This method minimizes the transmission obstacles of the optical signal.

[0058] Example

[0059] According to the particularity of the wafer processing process, this embodiment may have an ultra-low temperature or ultra-high temperature environment. Therefore, this embodiment chooses to use a quartz optical fiber with a resistance of -60℃ to 400℃ as a carrier, and uses fluorescence temperature measurement technology to detect the temperature of the wafer heating plate. The fluorescence fiber temperature measurement is based on the material properties of rare earth fluorescent substances. When certain special rare earth sensitive materials are stimulated by light, they emit a visible linear spectrum, that is, fluorescence. If a certain parameter of fluorescence is modulated by temperature, and their relationship is monotonic, this relationship can be used for temperature measurement.

[0060] In traditional fluorescence temperature measurement, the fluorescent powder at the end of the optical fiber is diluted with glue and directly bonded to the end face of the optical fiber, and then the fluorescent powder is coated with light-shielding glue to achieve the light-shielding effect; this method can meet most temperature measurement needs, but in order to achieve higher precision temperature measurement requirements, this embodiment transforms the powder coating structure of the optical fiber end temperature measurement probe. The multi-layer glue of the probe slows down the heat transfer, so for the probe, a probe structure with separated fluorescent powder and optical fiber is made to achieve high-precision use requirements.

[0061] In this embodiment, the optical fiber 4 is made of quartz optical fiber, the packaging cap 10 is made of metal silver, the optical fiber inner sleeve 5 is made of a polytetrafluoroethylene sleeve, the optical fiber limiting tube 6 is made of a fluororubber limiting tube, and the dust cap 14 is made of a silicone dust cap.

[0062] During production, first cut the optical fiber 4 according to the actual required length, insert the optical fiber 4 into the optical fiber inner sleeve 5, and expose one end of the optical fiber 4 outside the optical fiber inner sleeve 5 by about 1 cm. Apply high temperature curing glue within the range of 1 cm, and insert the optical fiber 4 with the sheath into the optical fiber head sleeve 2 until the optical fiber 4 is exposed to the optical fiber head sleeve 2 for more than 0.5 cm. Put the optical fiber 4 and the sleeve into a high temperature oven for high temperature curing. After the high temperature curing is completed, cut off the part of the optical fiber 4 exposed to the optical fiber head sleeve 2, and load the optical fiber head sleeve 2 with the optical fiber 4 into the grinder, and polish it with 9μm, 3μm, 1μm, and 0.5μm grinding discs.

[0063] Then, by mixing high-temperature glue and phosphor in proportion, the phosphor is extruded under high pressure to form a powder cake state, at which the phosphor is retained to the greatest extent and the involvement of glue is reduced, thereby maximizing the retention of the purity of the phosphor. The formed phosphor cake 11 is removed from the powder cake loading platform, and the phosphor cake 1 is embedded in the packaging cap 10. The phosphor cake 11 is completely pushed into the packaging cap 10 with a tool until the phosphor cake 11 contacts and overlaps with the bottom of the packaging cap 10.

[0064] Then, place the cured and polished fiber optic head sleeve 2 and the packaging cap 10 embedded with the fluorescent powder cake 11 in a vacuum operating box, embed the packaging cap 10 into the annular groove 12 at the top of the fiber optic head sleeve 2, and then use ultraviolet glue to cure the packaging cap 10 and the fiber optic head sleeve 2 to prevent air from flowing in. After curing, remove the excess ultraviolet glue, and then add high-temperature insulating curing glue on the basis of the ultraviolet glue for reinforcement. The significance of this operation process is that the vacuum environment is not heat-conductive, but it does not affect the transmission path of light. The fluorescent powder cake 11 is actually fluorescent powder. After being excited by the temperature, the optical signal fed back by the fluorescent powder cake 11 is transmitted directly through the vacuum environment to the optical end face. This method minimizes the transmission obstacles of the optical signal.

[0065] Then, the limit spring 3, the threaded sleeve 1, and the optical fiber limit tube 6 are inserted into the other end of the optical fiber in sequence; according to the previously designed structure, the optical fiber head sleeve 2 and the threaded sleeve 1 clamp the limit spring 3 in the middle position, and the optical fiber limit tube 6 is heat-shrunk and tightened on the tail end of the optical fiber inner sleeve 5. At this time, the threaded sleeve 1 cannot slide to the tail, and the middle limit spring 3 starts to work, and the part of the optical fiber head sleeve 2 that extends out of the threaded sleeve 1 is controlled by the active stroke of the limit spring 3.

[0066] Finally, the optical fiber connector 13 is clamped and polished, and a dust cap 14 is put on to complete the production of the high-precision temperature measurement optical fiber.

[0067] In summary, the present invention provides a semiconductor wafer optical fiber temperature measurement device and a preparation method thereof. By adopting fluorescence temperature measurement instead of thermocouple temperature measurement, there is no need to perform thermocouple voltage conversion, and the indirect measurement is changed to direct measurement, thereby avoiding the introduction of errors caused by signal conditioning; at the same time, the fluorescence temperature measurement accuracy of the present invention can reach ±0.15°C, while the thermocouple measurement accuracy can only reach within 1°C to 2°C, so the present invention has smaller error and higher accuracy, and the present invention has good corrosion resistance and noise resistance, so the present invention has broad application prospects.

[0068] It should be emphasized that the above are only preferred embodiments of the present invention and do not limit the present invention in any form. Any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A semiconductor wafer optical fiber temperature measurement device, characterized in that: include: Threaded sleeve (1), optical fiber head sleeve (2), limit spring (3), optical fiber (4), optical fiber inner sleeve (5); The threaded sleeve (1) is in the shape of a three-stage stepped shaft with a thick middle section and thin ends. A first step through hole (7) coaxial with the threaded sleeve (1) and having a larger front end and a smaller rear end is provided in the threaded sleeve (1). The optical fiber inner sleeve (5) is cylindrical and made of a flexible material. The inner diameter of the optical fiber inner sleeve (5) is equal to the outer diameter of the optical fiber (4). The outer diameter of the optical fiber inner sleeve (5) is equal to the inner diameter of the small hole of the first step through hole (7). The optical fiber head sleeve (2) is cylindrical, and the inner cylinder of the optical fiber head sleeve (2) is provided with a second step through hole (8) with a small front end and a large rear end, the diameter of the large hole in the second step through hole (8) is equal to the outer diameter of the optical fiber (4), the diameter of the small hole in the second step through hole (8) is equal to the outer diameter of the optical fiber core (9) of the optical fiber (4), and the outer diameter of the optical fiber head sleeve (2) is equal to the diameter of the large hole of the first step through hole (7); The outer diameter of the limit spring (3) is equal to the large hole diameter of the first step through hole (7), and the inner diameter of the limit spring (3) is equal to the outer diameter of the optical fiber inner sleeve (5); One end of the large hole of the optical fiber head sleeve (2) extends from the large hole of the threaded sleeve (1) into the first step through hole (7) and compresses one end face of the limit spring (3); the other end face of the limit spring (3) compresses the step end face of the large hole of the first step through hole (7); one end of the optical fiber inner sleeve (5) passes through the inner tube of the limit spring (3) and presses against the rear end face of the optical fiber head sleeve (2); the other end of the optical fiber inner sleeve (5) extends out of the rear outer side of the threaded sleeve (1); the optical fiber core (9) at the head of the optical fiber (4) extends out of the head of the optical fiber head sleeve (2) from the small hole of the second step through hole (8) and is flush with the head end face of the optical fiber head sleeve (2); the tail of the optical fiber (4) passes through the inner tube of the optical fiber inner sleeve (5) and extends out of the tail end face of the threaded sleeve (1).

2. A semiconductor wafer optical fiber temperature measurement device according to claim 1, characterized in that: A circular packaging cap (10) is fastened to the head end face of the optical fiber head sleeve (2), and a circular fluorescent powder cake (11) is embedded in the inner ring of the packaging cap (10). The inner end face of the fluorescent powder cake (11) contacts and overlaps with the head end face of the optical fiber core (9).

3. A semiconductor wafer optical fiber temperature measurement device according to claim 2, characterized in that: The fastening connection method of the packaging cap (10) is that the head end surface of the optical fiber head sleeve (2) is provided with an annular groove (12), and the packaging cap (10) is clamped on the head end surface of the optical fiber head sleeve (2) through the annular groove (12).

4. A semiconductor wafer optical fiber temperature measurement device according to claim 1, characterized in that: An optical fiber connector (13) is provided at the tail of the optical fiber (4).

5. A semiconductor wafer optical fiber temperature measurement device according to claim 4, characterized in that: The optical fiber connector (13) is provided with a dustproof cap (14).

6. The semiconductor wafer optical fiber temperature measurement device according to claim 1, characterized in that: An external thread (15) is provided on the outer diameter of the tail step shaft of the threaded sleeve (1).

7. The semiconductor wafer optical fiber temperature measurement device according to claim 1, characterized in that: An optical fiber limiting tube (6) is provided at the tail end of the optical fiber inner sleeve (5) where it protrudes from the threaded sleeve (1), and the optical fiber limiting tube (6) is made of a heat shrink tube.

8. A semiconductor wafer optical fiber temperature measurement method, characterized in that: The temperature measurement method is used for the temperature measurement device according to any one of claims 1 to 7, comprising the following steps: Step 1: Cut the optical fiber (4) according to the designed length, insert the optical fiber (4) into the optical fiber inner sleeve (5), expose one end of the optical fiber (4) outside the optical fiber inner sleeve (5) by 0.8-1.5 cm, apply high temperature curing glue within the range of 0.8-1.5, insert the optical fiber (4) with the sheath into the optical fiber head sleeve (2), until the optical fiber (4) is exposed from the head hole of the optical fiber head sleeve (2) by more than 0.5 cm, and put the optical fiber (4) together with the optical fiber inner sleeve (5) and the optical fiber head sleeve (2) into the oven for high temperature curing; Step 2: After the high-temperature curing is completed, the optical fiber (4) exposed from the small hole of the head of the optical fiber head sleeve (2) is cut off, and the optical fiber head sleeve (2) is loaded into a grinder, and the head end face of the optical fiber head sleeve (2) is polished with a grinding sheet; Step 3: Mix the high-temperature glue and the fluorescent powder, extrude the fluorescent powder under high pressure to form a powder cake state to form a fluorescent powder cake (11), remove the formed fluorescent powder cake (11) from the powder cake loading platform, embed the fluorescent powder cake (11) into the annular inner wall of the packaging cap (10), and completely push the fluorescent powder cake (11) into the packaging cap (10) until the outer end surface of the fluorescent powder cake (11) is flush with the outer end surface of the annular bottom of the packaging cap (10); Step 4: embed the packaging cap (10) into the annular groove (12) at the top of the optical fiber head sleeve (2), and then use ultraviolet glue to cure the packaging cap (10) and the optical fiber head sleeve (2). After curing, remove the excess ultraviolet glue, and then add high-temperature insulating curing glue on the basis of the ultraviolet glue for reinforcement; Step 5: Insert the limit spring (3), the threaded sleeve (1), and the optical fiber limit tube (6) in sequence at the other end of the optical fiber (4), so that the optical fiber head sleeve (2) and the threaded sleeve (1) clamp the limit spring (3) at the middle position in the first step through hole (7), and heat shrink and tighten the optical fiber limit tube (6) at the end of the optical fiber inner sleeve (5) extending out of the threaded sleeve (1). At this time, the threaded sleeve (1) cannot slide to the rear, and the middle limit spring (3) begins to play a tensioning role. The part of the optical fiber head sleeve (2) extending out of the head of the threaded sleeve (1) is limited by the movable stroke of the limit spring (3); Step 6: After the optical fiber connector (13) is clamped, the corresponding polishing process is completed, and a dust cap (14) is put on the polished optical fiber connector (13), thereby completing the production of the temperature measuring optical fiber.

9. The semiconductor wafer optical fiber temperature measurement method according to claim 8, characterized in that: In the step 2, the grinder sequentially grinds and polishes the head end face of the optical fiber head sleeve (2) using grinding discs of 9 μm, 3 μm, 1 μm, and 0.5 μm.

10. The semiconductor wafer optical fiber temperature measurement method according to claim 8, characterized in that: In the step 4, the cured and polished optical fiber head sleeve (2) and the packaging cap (10) embedded with the fluorescent powder cake (11) are placed in a vacuum operating box to perform a curing operation of embedding the packaging cap (10) into the optical fiber head sleeve (2), and air is prevented from flowing in during the curing operation.

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