Liquid cooling-phase change heat management device and method for replaceable heat storage module for logging instrument

Abstract

The present invention belongs to the field of well logging technology, and relates to a liquid-cooled phase-change heat management device with a replaceable heat storage module for a well logging instrument, which is used for the thermal management of the well logging instrument chip, and includes an insulation bottle I, an insulation bottle quick connector, a pipeline quick connector, a heat storage module shell, a phase change material, a liquid cooling module, and an insulation bottle II; the insulation bottle I and the insulation bottle II are connected by an insulation bottle quick connector; the heat storage module shell is filled with a phase change material; the liquid cooling module includes a water-cooled pipe heat absorption section, a circulation pump, and a water-cooled pipe heat release section; the water-cooled pipe heat absorption section is arranged in the insulation bottle I, and is used to take out the heat generated by the chip of the well logging instrument; the water-cooled pipe heat release section is arranged in the heat storage module shell to exchange heat with the phase change material; the water-cooled pipe heat absorption section and the water-cooled pipe heat release section are connected by a pipeline quick connector; the circulation pump is used to drive the liquid cooling medium to circulate in the water-cooled pipe heat absorption section and the water-cooled pipe heat release section. The present invention can simultaneously solve the problem of high-temperature thermal failure of the well logging instrument and the need to operate again in a short time after the operation is completed.

Description

Technical Field

[0001] The present invention belongs to the field of well logging technology, and more specifically, relates to a liquid cooling-phase change heat management device and method for a replaceable heat storage module for a well logging instrument. Background Art

[0002] As the demand for oil and gas resources increases, oil and gas extraction becomes increasingly important. Well logging instruments are used to explore the distribution of underground oil and gas resources. The electronic devices inside them face high-temperature environments underground. The long-term self-heating of the chip and the heat leakage from the environment cause heat accumulation, local hot spots, and thermal failure. At the same time, the well logging instrument may need a short-term secondary operation after the operation is completed, and the chip needs to be cooled quickly. However, the high-temperature chip after the operation is completed cannot be directly exposed to the environment. On the one hand, the huge temperature difference causes excessive thermal stress, which may cause chip damage. On the other hand, in situations where the air humidity is too high, water vapor liquefaction may cause the chip to short-circuit.

[0003] In order to solve the problem of high-temperature failure of logging instruments, the traditional thermal management solution of logging instruments uses an insulating bottle and phase change materials for insulation and heat storage, and transfers heat from the chip to the phase change material through heat conduction. For example, the Chinese invention patent with the announcement number CN110087438A discloses "a heat dissipation and heat storage device and method for high-power devices in logging instruments". The heat of high-power devices is directly introduced and stored in the heat absorbent through the heat-conducting base and heat-conducting pipe by heat conduction. This method reduces the heat transfer link and can meet the temperature control requirements of electronic devices with low heat flux density.

[0004] However, due to the limited heat conduction and heat dissipation capacity, there is a certain temperature difference between the chip and the phase change material, and the sensible heat of the phase change material is not fully utilized. At the same time, due to the good thermal insulation performance of the insulation bottle, the internal heat dissipation is slow after the operation is completed, and the cooling time is long, which affects the progress of the operation.

[0005] There is no corresponding technical solution to the problem of how to quickly dissipate heat. Summary of the invention

[0006] In view of the above defects or improvement needs of the prior art, the present invention provides a liquid cooling-phase change thermal management device and method of a replaceable heat storage module for a logging instrument, the purpose of which is to simultaneously solve the technical problems of high-temperature thermal failure of the logging instrument and the need to operate again within a short time after the operation is completed.

[0007] To achieve the above object, according to one aspect of the present invention, a liquid cooling-phase change heat management device with a replaceable heat storage module for a logging instrument is provided, which is used for thermal management of a logging instrument chip, and includes an insulation bottle I, an insulation bottle quick connector, a pipeline quick connector, a heat storage module housing, a phase change material, a liquid cooling module and an insulation bottle II, wherein:

[0008] The insulation bottle I and the insulation bottle II are connected by an insulation bottle quick connector; the phase change material is filled in the heat storage module shell; the heat storage module shell is located in the insulation bottle II;

[0009] The liquid cooling module includes a water-cooling tube heat absorption section, a circulation pump and a water-cooling tube heat release section; the water-cooling tube heat absorption section is arranged in the insulation bottle I, and is used to take out the heat generated by the chip of the logging instrument; the water-cooling tube heat release section is arranged in the heat storage module shell to exchange heat with the phase change material; the water-cooling tube heat absorption section and the water-cooling tube heat release section are connected by a pipeline quick connector; the circulation pump is used to drive the liquid cooling medium to circulate in the water-cooling tube heat absorption section and the water-cooling tube heat release section.

[0010] Furthermore, the liquid cooling module also includes a liquid compensator, which is connected in series to the inlet or outlet pipeline of the circulation pump.

[0011] Furthermore, the outlet pipeline of the liquid compensator extends inwardly to the bottom of the liquid compensator and is located on the side facing downward when the liquid compensator is working.

[0012] Furthermore, the liquid cooling medium in the liquid compensator is a high-temperature fluorinated liquid; and the circulating pump is a high-temperature resistant pump.

[0013] Furthermore, it also includes an adapter, which is arranged in the insulation bottle I and is used to install a fixed circulation pump and a liquid compensator.

[0014] Furthermore, it also includes a water cooling plate, which is arranged with an S-shaped flow channel that matches the shape of the water cooling tube heat absorption section, and the water cooling tube heat absorption section is installed and fixed or integrally formed in the S-shaped flow channel; the water cooling plate is tightly attached to the chip of the logging instrument through a thermal interface material.

[0015] Furthermore, the heat release section of the water-cooling pipe is arranged in a spiral in the heat storage module shell, the spiral diameter ranges from 40 to 60 mm, and the pitch ranges from 16 to 30 mm.

[0016] Furthermore, an insulating sleeve is provided between the pipeline quick connector and the insulating bottle quick connector, and the length of the insulating sleeve is not less than the length of the insulating bottle quick connector.

[0017] Furthermore, the insulated bottle quick connector is formed by splicing two arc-shaped parts, and the joint is matched and positioned by a boss and a groove; threads connected to the insulated bottle I and the insulated bottle II are arranged at both ends of the insulated bottle quick connector respectively; the inside of the tube wall of the insulated bottle I and the insulated bottle II is provided with a vacuum layer, and both are provided with a thread matching the insulated bottle quick connector at one end, and a limit part is provided at the other end.

[0018] In order to achieve the above object, according to another aspect of the present invention, a liquid cooling-phase change heat management method for a replaceable heat storage module for a logging tool is provided, which is implemented by using a liquid cooling-phase change heat management device as described in any of the preceding items, comprising:

[0019] During downhole operations, the heat generated by the chip of the logging tool is transferred from the heat absorbing section of the water cooling tube to the heat releasing section of the water cooling tube through the liquid cooling medium and then transferred to the phase change material for storage;

[0020] When the operation is completed or the heat storage module reaches its working limit and needs to be cooled, only the insulation bottle II with the heat storage module is removed, so that the shell of the heat storage module is directly exposed to the external environment, while the circuit of the logging instrument is still protected by the insulation bottle I, and the circuit part of the logging instrument is quickly cooled by liquid cooling circulation and external environment heat dissipation;

[0021] When the operation is completed or the heat storage module reaches its working limit and needs to be lowered back into the well immediately, open the insulation bottle quick connector, then quickly replace the new heat storage module through the pipeline quick connector, and then reassemble the liquid cooling-phase change thermal management device before going down into the well.

[0022] In general, compared with the prior art, the technical solution of the present invention has the following beneficial effects:

[0023] (1) The present invention solves the problem of high-temperature thermal failure of the logging instrument and the problem of secondary operation in a short time after the logging instrument is completed: first, a liquid cooling circulation system is combined with a phase change material heat storage module, and forced convection heat exchange is used to replace the traditional heat conduction process, which greatly reduces the heat transfer resistance, realizes rapid heat transfer from the chip to the phase change material, fully utilizes the heat storage capacity of the phase change material, prolongs the working time, and effectively solves its thermal failure problem; second, the chip circuit part and the phase change heat storage part of the logging instrument are physically separated by a quick connector, and thermal protection is provided by an insulating bottle respectively, and the two insulating bottles are connected by an insulating bottle quick connector. After the operation is completed, only the insulating bottle equipped with the heat storage module can be removed, and the heat storage module is dissipated by the liquid cooling circulation system and external cooling conditions, so that the heat can be protected and the heat can be dissipated in a short time; if it is necessary to go down to the well immediately after the operation is completed, the circulation pipeline can be removed by the pipeline quick connector to directly replace the heat storage module and the water-cooling pipe heat release section inside it, so as to realize immediate downhole operation without waiting for the heat storage module to dissipate heat.

[0024] (2) The use of a liquid compensator to compensate for the liquid cooling medium can reduce the frequency of replenishing the liquid cooling medium when replacing the heat storage module, thereby saving the waiting time for going down to the well again while ensuring the normal operation of the liquid cooling module.

[0025] (3) By designing the position of the liquid compensator outlet pipeline, the liquid circulation pipeline can be guaranteed to work normally even under low liquid level conditions, further reducing the frequency of replenishing liquid cooling medium when replacing the heat storage module.

[0026] (4) During underground operations, the temperature is evenly distributed by placing the cold plate in line with the chip layout, and the gap is filled with thermal interface materials, which can effectively and quickly remove the heat generated by the chip while avoiding local overheating. The S-shaped heat absorption section of the water-cooling pipe is arranged in the water-cooling plate, which can fully exchange heat between the liquid cooling medium and the water-cooling plate and improve temperature uniformity.

[0027] (5) The heat release section of the water-cooling pipe is spirally arranged in the phase change material shell, which can enhance the heat exchange between the liquid cooling medium and the phase change material and accelerate the heat storage rate of the phase change material. It can greatly reduce the heat transfer resistance between the chip and the phase change material, reduce the temperature difference between the chip and the phase change material, and thus extend the working time of the instrument in a high temperature environment.

[0028] (6) When cooling after the operation, the heat storage module is physically separated from the circuit part. Only the insulation bottle II equipped with the heat storage module can be removed, and the circuit part can be quickly cooled by using the external heat dissipation environment and liquid cooling cycle, so that the logging instrument can perform the next operation in a short time. At the same time, since the chip circuit is still protected by the insulation bottle I, it can avoid circuit damage caused by the large thermal stress caused by the sudden change of ambient temperature after leaving the well and circuit short circuit caused by the cooling and liquefaction of water vapor.

[0029] (7) When the operation is completed and it is necessary to go down the well immediately, on the basis of removing the insulation bottle II, the insulation sleeve and the pipe quick connector can be further or together removed, and a new heat storage module (low temperature storage) can be replaced. After a simple installation, the well operation can be carried out again. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 The overall schematic diagram of the liquid cooling-phase change heat management device with replaceable heat storage module for logging tools;

[0031] Figure 2 It is a schematic diagram of the circuit structure;

[0032] Figure 3 It is a schematic diagram of the structure of the heat storage part;

[0033] Figure 4 Schematic diagram of the liquid compensator structure

[0034] Figure 5 This is a schematic diagram of the plug structure of the heat storage module;

[0035] Figure 6 This is a schematic diagram of the structure of the quick connector for the thermal insulation bottle;

[0036] Figure 7 It is a cross-sectional view of the insulated bottle;

[0037] Figure 8 This is a schematic diagram of a pipeline quick connector;

[0038] Fig. 9Comparison of temperature rise curves of heat sources and phase change materials using conductive heat dissipation and liquid cooling.

[0039] Throughout the drawings, the same reference numerals are used to denote the same elements or structures, wherein:

[0040] 1. Insulation plug I, 2. Insulation bottle I, 3. Substrate, 4. Chip, 5. Thermal interface material, 6. Lower water-cooled plate, 7. Upper water-cooled plate, 8. Upper end cover, 9. Lower end cover, 10. Water-cooled pipe heat absorption section, 11. Adapter, 12. Circulation pump, 13. Liquid compensator, 14. Insulation sleeve, 15. Insulation bottle quick connector, 16. Pipeline quick connector, 17. Heat storage module plug, 18. Heat storage module shell, 19. Phase change material, 20. Water-cooled pipe heat release section, 21. Insulation bottle II, 22. Insulation plug II, 23. Liquid cooling medium;

[0041] 201. Insulation bottle internal thread, 202. Insulation bottle vacuum layer, 203. Insulation bottle slot; 1501. Connector external thread I, 1502 Connector external thread II, 1503. External hexagonal groove, 1504. External boss, 1505. Internal groove; 1701. Sealing ring, 1702. Sealing ring groove, 1703. Sealing thread, 1704. Sealing boss, 1705. Internal hexagonal groove;

[0042] 1801. Heat storage module end cover I, 1802. Through shell, 1803. Heat storage module end cover II, 1804. Potting port, 1805. Pipeline hole. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0044] Figure 1 The overall schematic diagram of the liquid cooling-phase change heat management device of the replaceable heat storage module for logging instruments. The device includes an insulation plug I1, an insulation bottle I2, a substrate 3, a chip 4, a thermal interface material 5, a lower water cooling plate 6, an upper water cooling plate 7, an upper end cover 8, a lower end cover 9, a water cooling pipe heat absorption section 10, an adapter 11, a circulating pump 12, a liquid compensator 13, an insulation sleeve 14, an insulation bottle quick connector 15, a pipeline quick connector 16, a heat storage module plug 17, a heat storage module shell 18, a phase change material 19, a water cooling pipe heat release section 20, an insulation bottle II 21, an insulation plug II 22, and a liquid cooling medium 23 in the pipeline.

[0045] Figure 2 and Figure 3They are schematic diagrams of the circuit structure and the heat storage structure. The chip 4 is mounted on both sides of the substrate 3 and is bonded to the lower water-cooled plate 6 and the upper water-cooled plate 7 through thermal grease. The gap between the substrate 3 and the lower water-cooled plate 6 and the upper water-cooled plate 7 is filled with thermal interface material 5, so that the chip dissipates heat evenly; the lower water-cooled plate 6 and the upper water-cooled plate 7 are fixed to the upper end cover 8 and the lower end cover 9 by screws, and the interior is used to install the heat-absorbing section of the water-cooled pipe; the upper end cover 8 and the lower end cover 9 are respectively connected to the insulation plug I1 and the adapter 11 by screws; the adapter 11 is used to install a circulating pump 12 and a liquid compensator 13; the circulating pump 12 is used to provide power circulation; the liquid compensator is used to supplement the liquid cooling medium 23; insulation plug I1, substrate 3, chip 4, thermal interface material 5, lower water-cooled plate 6, upper water-cooled plate 7, upper end cover 8, lower end cover 9, water-cooled pipe heat absorption section 10, adapter 11, circulating pump 12, and liquid compensator 13 are all installed in the insulation bottle I2; the insulation bottle I2 is connected to the insulation bottle II21 through the insulation bottle quick connector 15; the insulation bottle II21 is used to install the insulation plug II22 and the heat storage module, wherein the heat storage module is composed of a heat storage module shell 18, a plug 17, a phase change material 19 and a water-cooled pipe heat release section 20; the water-cooled pipe heat release section 20 is connected to the water-cooled pipe heat absorption section 10 through a pipe quick connector 16, and the pipe quick connector 16 is provided with an insulation sleeve 21, which, on the one hand, isolates the environmental heat leakage, and on the other hand, is used to connect the adapter 11 and the heat storage module shell 18.

[0046] Figure 4 It is a schematic diagram of the structure of the liquid compensator. Liquid-cooling medium 23 is stored in the liquid compensator 13, wherein the pipeline connected to the circulating pump 12 penetrates into the lower left side of the liquid compensator, and the pipeline connected to the pipeline quick connector 16 is located on the upper right side of the liquid compensator 13, ensuring that the circulating pump 12 can pump the liquid-cooling medium 23 from the bottom end when the instrument is operating in the vertical direction underground and in the horizontal direction when cooling uphole, and the liquid-cooling medium 23 can flow to the bottom of the liquid compensator after circulation.

[0047] An S-shaped flow channel is arranged between the lower water-cooling plate 6 and the upper water-cooling plate 7 and the upper end cover 8 and the lower end cover 9, which are connected by screws and are used to install the water-cooling pipe heat absorption section 10. The liquid cooling medium 23 enters the S-shaped flow channel through the inlet pipe of the upper water-cooling plate 7 for sufficient heat exchange, and then flows out from the outlet pipe of the lower water-cooling plate 6, which can make the heat exchange uniform and avoid local hot spots.

[0048] The heat storage module shell 18 is welded by a heat storage module end cover I1801, a through shell 1802 and a heat storage module end cover II1803 to ensure sealing; the water-cooling pipe heat release section 20 is spirally arranged in the heat storage module shell 18 to enhance heat exchange, and the water-cooling pipe heat release section 20 is welded to both sides of the pipe hole 1805 on the heat storage module end cover I1801 to ensure sealing; the phase change material 19 is potted through the potting port 1804 and sealed with the heat storage module plug 17.

[0049] Figure 5 It is a schematic diagram of the joint structure of the heat storage module, and its sealing method is thread 1703 + boss 1704 + sealing ring groove 1702 and sealing ring 1701, which are tightened with the potting port 1804 through the inner hexagonal groove 1705.

[0050] Figure 6 The schematic diagram of the structure of the quick connector for the insulated bottle is shown in FIG. The quick connector for the insulated bottle 15 is made of high-strength titanium alloy and is divided into an upper and lower part, which are positioned by an outer boss 1504 and an inner groove 1505 for easy installation. In addition, the left and right sides of the connector are provided with an outer thread I1501 for connecting the insulated bottle I2 and an outer thread II1502 for connecting the insulated bottle II21, and an outer hexagonal groove 1503 is provided in the middle to tighten the threads on the left and right sides.

[0051] Figure 7 The heat-insulating bottle is made of metal, with an internal thread 201 connected to the heat-insulating bottle joint at one end, a vacuum layer 202 in the middle to isolate the surrounding environment from heat leakage, and a limiter at the other end. In this embodiment, the limiter is configured as a slot 203 to prevent the heat-insulating bottle from rotating when installing and removing it.

[0052] Figure 8 The pipe quick connector 16 is a CPC quick plug-in connector, which can quickly replace the pipe while ensuring the sealing performance, and its left and right ends are respectively connected to the water cooling pipe heat release section 20 and the water cooling pipe heat absorption section 10.

[0053] The thermal insulation sleeve 14 is made of PEEK, which can reduce environmental heat leakage; the thermal insulation plugs 11 and 222 are composed of a PEEK outer shell and a nano-aerogel inner core, which can greatly prevent axial heat leakage in a high-temperature environment.

[0054] The liquid compensator 13 is used to supplement the liquid cooling medium. The liquid cooling medium 23 is a high-temperature fluorinated liquid with a temperature resistance exceeding 150°C. The circulating pump is a high-temperature resistant pump 12 with a temperature resistance exceeding 150°C.

[0055] The heat insulating plug I1, the upper end cover 8 and the lower end cover 9, the adapter 11, the heat insulating sleeve 14, the heat storage module housing 18, and the heat insulating plug II22 are all connected by evenly distributed axial screws.

[0056] The phase change material 20 is preferably paraffin, hydrated salt or low melting point alloy. The heat storage module housing 18, heat storage module plug 17, water cooling pipe heat release section 20, and water cooling pipe heat absorption section 10 are made of stainless steel 304. The lower water cooling plate 6 and the upper water cooling plate 7 and the upper end cover 8 and the lower end cover 9 are made of copper or aluminum.

[0057] The specific working process of the liquid cooling-phase change heat management device with replaceable heat storage module for a well logging instrument of the present invention will be explained below.

[0058] Working process underground. First, the device isolates radial heat leakage from high temperature environment through insulation bottle I2 and insulation bottle II21, and performs axial heat insulation through insulation plug I1, insulation plug II22 and insulation sleeve 14; second, the heat generated by the chip is evenly discharged by using lower water cooling plate 7 and upper water cooling plate 6 and thermal interface material 5; third, the lower water cooling plate 6 and upper water cooling plate 7 and the pipes in upper end cover 8 and lower end cover 9 are arranged in S shape to enhance heat exchange; fourth, the heat release section 20 of the water cooling pipe is spirally arranged in the phase change material 19 to accelerate the heat storage rate of the phase change material 19; fifth, the circulating pump 12 is used to drive the liquid cooling medium 23 to transport heat from the lower water cooling plate 7 and upper water cooling plate 6 to the phase change material 19, so as to realize rapid heat transfer and repeatedly circulate the medium after heat exchange. Through the above process, the temperature of the chip 2 in the instrument can be controlled within the temperature resistance range during working time, greatly reducing the temperature difference from the chip 2 to the phase change material 19, and improving the heat storage capacity of the phase change material 19.

[0059] Fig. 9 The temperature rise curves of heat sources and phase change materials using heat conduction and liquid cooling are compared. It can be seen that the liquid cooling cycle of the present invention can greatly reduce the heat transfer resistance between the chip and the phase change material, thereby reducing the temperature difference between the chip and the phase change material, and can extend the working time of the instrument, which can highlight the effectiveness and superiority of the present invention.

[0060] Rapid cooling process after the operation is completed. The insulation bottle I2 and the insulation bottle II21 can be physically separated by removing the insulation bottle quick connector 15, and then the insulation bottle II21 equipped with the heat storage module can be removed. The liquid cooling medium 23 is driven by the circulating pump 12 to transfer the heat of the chip 2 to the heat storage module. The heat storage module shell 18 is quickly cooled down by external cooling conditions, which can achieve chip 2 cooling in a short time, while avoiding direct contact between the high-temperature chip 2 and the normal temperature environment, preventing excessive thermal stress from causing damage to the chip 2 and water vapor liquefaction causing a short circuit in the circuit. After cooling, install the insulation bottle II21 through the insulation bottle quick connector 15 and the next operation can be carried out in a short time.

[0061] If you need to go down the well immediately after the operation is completed, you can further remove the insulation sleeve 14 on the basis of removing the insulation bottle II20, shut down the circulation pump 12, disconnect the water cooling pipe heat release section 20 through the pipeline quick connector 16, remove the high-temperature heat storage module and replace it with a new heat storage module through the pipeline quick connector 16, install the insulation sleeve 14 and the insulation bottle quick connector 15, and replenish the working medium in the circulation pipeline through the liquid compensator 13, and then you can immediately start the next operation. In order to make full use of the heat storage capacity of the heat storage module, the new heat storage modules used for replacement are stored in a low-temperature environment to ensure a low initial temperature.

[0062] It will be easily understood by those skilled in the art that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A liquid cooling-phase change thermal management device with replaceable heat storage module for logging instrument, used for thermal management of logging instrument chip, characterized in that: It comprises an insulated bottle I (2), an insulated bottle quick connector (15), a pipeline quick connector (16), a heat storage module housing (18), a phase change material (19), a liquid cooling module and an insulated bottle II (21), wherein: The insulation bottle I (2) and the insulation bottle II (21) are connected via an insulation bottle quick connector (15); the heat storage module housing (18) is filled with a phase change material (19); the heat storage module housing (18) is located inside the insulation bottle II (21); The liquid cooling module comprises a water-cooling pipe heat absorption section (10), a circulation pump (12) and a water-cooling pipe heat release section (20); the water-cooling pipe heat absorption section (10) is arranged in an insulating bottle 1 (2) and is used to remove the heat generated by the chip of the logging instrument; the water-cooling pipe heat release section (20) is arranged in a heat storage module shell (18) to exchange heat with a phase change material (19); the water-cooling pipe heat absorption section (10) and the water-cooling pipe heat release section (20) are connected through a pipeline quick connector (16); and the circulation pump (12) is used to drive the liquid cooling medium to circulate in the water-cooling pipe heat absorption section (10) and the water-cooling pipe heat release section (20).

2. A liquid cooling-phase change heat management device with replaceable heat storage module for a logging tool as claimed in claim 1, characterized in that: The liquid cooling module also includes a liquid compensator (13), which is connected in series to the inlet or outlet pipeline of the circulation pump (12).

3. A liquid cooling-phase change heat management device with replaceable heat storage module for a logging tool as claimed in claim 2, characterized in that: The outlet pipeline of the liquid compensator (13) extends inwardly to the bottom of the liquid compensator (13) and is located on the side of the liquid compensator (13) that faces downward when the liquid compensator (13) is in operation.

4. A liquid cooling-phase change heat management device with replaceable heat storage module for a logging tool as claimed in claim 2, characterized in that: The liquid cooling medium in the liquid compensator (13) is a high-temperature fluorinated liquid; and the circulating pump (12) is a high-temperature resistant pump.

5. A liquid cooling-phase change heat management device with replaceable heat storage module for a logging tool as claimed in claim 2, characterized in that: It also includes an adapter (11), which is arranged in the insulation bottle I (2) and is used to install a fixed circulation pump (12) and a liquid compensator (13).

6. A liquid cooling-phase change heat management device with replaceable heat storage module for a logging tool as claimed in any one of claims 1 to 5, characterized in that: It also includes a water cooling plate (6, 7), the water cooling plate (6, 7) is arranged with an S-shaped flow channel that matches the shape of the water cooling pipe heat absorption section (10), and the water cooling pipe heat absorption section (10) is installed and fixed or integrally formed in the S-shaped flow channel; the water cooling plate (6, 7) is tightly attached to the chip of the well logging instrument through a thermal interface material.

7. A liquid cooling-phase change heat management device with replaceable heat storage module for a logging tool according to any one of claims 1 to 5, characterized in that: The water-cooling pipe heat release section (20) is arranged in a spiral in the heat storage module shell (18), with a spiral diameter ranging from 40 to 60 mm and a spiral pitch ranging from 16 to 30 mm.

8. A liquid cooling-phase change heat management device with replaceable heat storage module for a logging tool as claimed in any one of claims 1 to 5, characterized in that: A heat insulating sleeve (14) is arranged between the pipeline quick connector (16) and the heat insulating bottle quick connector (15), and the length of the heat insulating sleeve (14) is not less than the length of the heat insulating bottle quick connector (15).

9. The liquid cooling-phase change heat management device with replaceable heat storage module for logging instrument according to claim 8, characterized in that: The insulated bottle quick connector (15) is formed by splicing two arc-shaped parts, and the joint is matched and positioned by a boss (1504) and a groove (1505); threads connected to the insulated bottle I (2) and the insulated bottle II (21) are arranged at both ends of the insulated bottle quick connector (15); the tube walls of the insulated bottle I (2) and the insulated bottle II (21) are both provided with a vacuum layer, and both are provided with a thread matching the insulated bottle quick connector (15) at one end, and a limit portion is provided at the other end.

10. A liquid cooling-phase change heat management method for a replaceable heat storage module for a logging tool, characterized in that: The method is implemented by using the liquid cooling-phase change heat management device as claimed in any one of claims 1 to 9, comprising: During underground operation, the heat generated by the chip of the logging instrument is forcibly transferred from the water cooling tube heat absorbing section (10) to the water cooling tube heat releasing section (20) through the liquid cooling medium and then transferred to the phase change material (19) for storage; When the operation is completed or the heat storage module reaches its working limit and needs to be cooled, only the insulation bottle II (21) containing the heat storage module is removed, so that the shell of the heat storage module is directly exposed to the external environment, while the circuit of the logging instrument is still protected by the insulation bottle I (2), and the circuit part of the logging instrument is quickly cooled by liquid cooling circulation and heat dissipation from the external environment; When the operation is completed or the heat storage module reaches its working limit and needs to be immediately lowered back into the well, the insulation bottle quick connector (15) is opened, and then a new heat storage module is quickly replaced through the pipeline quick connector (16), and then the liquid cooling-phase change heat management device is reassembled and lowered into the well.

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