33 results about "Thermal solution" patented technology

The invention provides a liquid cooling plate flow channel design optimization method and device based on topological optimization and a liquid cooling plate, and relates to the technical field of thermal management, and the method comprises the steps: S1, determining the geometric parameters of the liquid cooling plate according to the size of a battery module, constructing a double-layer two-dimensional design domain, and setting material, heat source and boundary conditions; s2, a topological optimization algorithm is adopted, material distribution is represented with a relative density variable, a multi-objective function giving consideration to the maximum heat exchange amount and the minimum pressure drop is constructed, a clear fluid-solid interface is obtained through density filtering and a projection function, and a target double-layer two-dimensional flow channel contour is obtained through iterative solution under volume fraction constraint; and S3, taking the target double-layer two-dimensional flow channel contour as a cross section to carry out spatial stretching bending deformation, and generating a double-layer special-shaped flow channel structure with a diffusion layer and a collection layer. According to the method, global optimization of two-dimensional topological optimization and three-dimensional geometric reconstruction are fused, the contradiction between the heat dissipation performance and the flow resistance is effectively solved, and a high-performance heat dissipation solution is provided for battery thermal management.

Methods, apparatus, systems, and articles of manufacture are disclosed to cool electronic devices. An example thermal solution to cool an electronic device Includes a first cooling plate at a first side of a printed circuit board and a second cooling plate at a second side of the printed circuit board, the second side opposite the first side. The second cooling plate is fluidically coupled with the first cooling plate.

Integrated circuit ("IC") structures and electronic packages that utilized an inorganic-convertible polymer to improve bond strength and thermal conductivity are described. In one embodiment, the inorganic-convertible polymer acts as a side fill material to seal a die periphery and improve direct bonding strength. In another embodiment, the inorganic-convertible polymer acts as a thermal bonding layer to increase the thermal conductivity between a die and a thermal solution.

The utility model relates to the technical field of CPU heat dissipation, in particular to a heat dissipation structure which comprises a main heat dissipation device, a first expansion heat dissipation device, a second expansion heat dissipation device, a heat conduction pipe, a heat dissipation block, a heat dissipation sheet and a fixing support, the heat conduction pipe is arranged at one end of the main heat dissipation device, and the heat dissipation block is fixedly arranged above the heat conduction pipe; the first expansion radiator and the second expansion radiator are respectively connected with the radiating block through radiating fins; the cooling fins are soft in texture and can be bent by a certain angle; the fixed support body is connected with the main radiator, the first expansion radiator and the second expansion radiator are lifted through the movable support, and when the movable support deforms, the first expansion radiator and the second expansion radiator are driven to rotate. The position of the claw radiator is adjusted through the fixing support, the limitation of an existing claw radiator is overcome, the radiating efficiency is improved, meanwhile, the occupied space of a main board is reduced, the mounting and dismounting processes of the radiator are simplified, and a more convenient and efficient radiating solution is provided for a user.

To promote heat radiation of a cable for supplying electric power to an electric heating type catalyst device.SOLUTION: The vehicle includes the engine 20 located in the engine room 110, the EHC50 that defines the flow passage of the exhaust gas together with the exhaust gas pipe 40 in the engine room 110 and supports the catalytic converter on the catalytic converter support that generates heat by being energized, and the third EHC50 cable 82 that connects the power supply device 70 for supplying power to the EHC50 and the 2EHC, and at least a part of the third 2EHC cable 82 is located on the upward direction side with respect to the 28A of the upper end surface of the head cover 28 of the engine 20.SELECTED DRAWING: Figure 1

A device package comprising an integrated cooling assembly. The device package may comprise multiple semiconductor devices and one or more cold plates attached to one or more of the semiconductor devices. For example, the device package may comprise a first semiconductor device, a second semiconductor device, and a third semiconductor device, wherein the second semiconductor device is disposed adjacent to the first semiconductor device in a first direction and the third semiconductor device is disposed adjacent to the second semiconductor device in the first direction. The device package may also comprise a cold plate attached to the second semiconductor device, wherein the cold plate comprises a plurality of coolant channels that extend along a second direction perpendicular to the first direction.

A semiconductor package and the method for forming the same are provided. The semiconductor package includes a substrate having an upper surface and a lower surface, first integrated circuit devices mounted on the upper surface, and second integrated circuit devices mounted on the lower surface. A first heat spreader in the form of a vapor-chamber (VC) is located over the first integrated circuit devices. A second heat spreader in the form of a vapor-chamber is located over the second integrated circuit devices. A heat-transfer member thermally couples the first heat spreader and the second heat spreader on both sides of the substrate.

The application relates to a flow-equalizing liquid inlet structure with an adaptive liquid inlet space and a liquid-cooled energy storage tank. The flow-equalizing liquid inlet structure is provided with an adjustable liquid inlet plug at the position of the liquid inlet end of each branch liquid inlet channel in the main liquid inlet pipeline. The first end face and the second end face of the adjustable liquid inlet plug form a first liquid inlet space and a second liquid inlet space with the inner wall of the main liquid inlet pipeline, respectively. The area difference between the first end face and the second end face causes the flow of the refrigerant to generate a pressure difference to drive the axial movement of the adjustable liquid inlet plug, to real-time adjust the size of the first liquid inlet space and the second liquid inlet space, to force the liquid inlet of the branch liquid inlet pipeline close to the main liquid inlet pipeline to decrease, and to make the excess refrigerant flow to other branch liquid inlet pipelines, to realize dynamic flow balance. Through the above dynamic flow distribution mode, an efficient and reliable heat dissipation solution is provided for the liquid-cooled energy storage tank, to help improve the safety of the energy storage system.

The invention relates to the technical field of device connection, in particular to a high-performance ultrasonic-assisted Kovar-W80Cu20 joint connection method and a precise device. Sn-Sb10 alloy brazing filler metal is adopted, and the Kovar alloy and the W80Cu20 alloy are connected through ultrasonic-assisted brazing. The obtained joint has the characteristics of low thermal expansion coefficient and high thermal conductivity, and the equivalent thermal conductivity at 25 DEG C and 125 DEG C reaches 50 + / -2W / m.K. The shear strength can still exceed 55MPa after being aged for 45 days at the temperature of 160 DEG C; after the Kovar-W80Cu20 composite material is subjected to thermal shock circulation at-40 DEG C to + 125 DEG C for 2000 cycles, the shear strength can still reach 57 MPa, excellent aging reliability and thermal shock reliability are shown, and excellent mechanical properties are attributed to interface bonding promotion by ultrasonic loading and the characteristic of low thermal expansion coefficient of the Kovar-W80Cu20 structure. According to the high-performance ultrasonic-assisted Kovar-W80Cu20 joint connection method and the precise device, the Kovar alloy and the low-expansion and high-heat-conduction W80Cu20 alloy are efficiently connected by constructing the'Kovar / SnSb10 / W80Cu20 'heterogeneous joint, an excellent heat dissipation solution is provided for the high-power precise device, and meanwhile the good CTE matching performance with a chip material is kept.

The invention discloses laptop cooling via a low pressure air booster. Technical solutions discussed herein include cooling systems for electronic devices including a low pressure ion blower and an electromagnetic air booster to improve thermal management of laptop computers. The cooling system may include a plurality of blower modules arranged in a parallel or series configuration. The thermal solution may be a steam chamber or a heat pipe, or may include a thin film air moving device integrated into the air gap. The cooling system may be selectively operated between the low pressure blower module and the centrifugal blower based on a cooling demand. The blower module may include an electrode arrangement having a single exposed electrode. The cooling system may also incorporate an active noise cancellation system that uses phase shift signals between the blower units.

According to the heatless solution dehumidification system, a low-concentration salt solution enters the bottom of a low-concentration solution tank, and the concentration of the low-concentration salt solution stored at the bottom of the low-concentration solution tank is detected through a first concentration meter in the low-concentration solution tank; according to the heatless solution dehumidification system provided by the utility model, the low-concentration pipeline pumps out the low-concentration salt solution and guides the low-concentration salt solution into the separator, the low-concentration salt solution is converted into the high-concentration salt solution and then is input into the high-concentration solution tank, and the concentration of the solution is monitored through the second concentration meter; heating and cooling of the salt solution are omitted through the separator, energy consumption is reduced, the bypass pipeline is connected between the output end of the low-concentration pipeline and the high-concentration solution tank in a communicating mode, the low-concentration electromagnetic valve is arranged on the bypass pipeline, and the specific concentration of the high-concentration salt solution in the high-concentration solution tank can be adjusted by adjusting the opening degree of the low-concentration electromagnetic valve.

The invention relates to a flow-equalizing liquid inlet structure with a self-adaptive liquid inlet space and a liquid cooling energy storage box, and the flow-equalizing liquid inlet structure is provided with adjustable liquid inlet plugs at the positions, corresponding to the liquid inlet ends of branch liquid inlet runners, in a main liquid inlet pipeline. A first liquid inlet space and a second liquid inlet space are formed by the first end face and the second end face of the adjustable liquid inlet plug and the inner wall of the main liquid inlet pipeline respectively, and the area difference between the first end face and the second end face is utilized, so that refrigerant flows to generate pressure difference to drive the adjustable liquid inlet plug to move axially. The size of the first liquid inlet space and the size of the second liquid inlet space are adjusted in real time, inlet liquid of the branch liquid inlet pipelines close to the main liquid inlet pipeline is forced to be reduced, redundant refrigerant flows to other branch liquid inlet pipelines, flow dynamic balance is achieved, an efficient and reliable heat dissipation solution is provided for the liquid cooling energy storage box through the dynamic flow distribution mode, and the service life of the liquid cooling energy storage box is prolonged. And the safety of the energy storage system is improved.

An apparatus including a substrate having a first surface, and a silicon interposer including a first surface and a second surface, wherein the first surface is connected to the first surface of the substrate. The apparatus also includes at least one stack including an artificial intelligence (AI) chiplet and a plurality of static random-access memories (SRAMs) stacked below the AI chiplet, wherein the at least one stack includes a top surface, a bottom surface, a first side surface and a second side surface, and the at least one stack is orthogonally attached by the first side surface to the second surface of the silicon interposer. The apparatus additionally includes a heat spreader surrounding the top surface, the bottom surface and the second side surface of the at least one stack.

A stacked assembly includes a first semiconductor die; a second semiconductor die secured to the first semiconductor die; and a dielectric encasing at least the second semiconductor die. The dielectric defines a cooling channel having at least one inlet and at least one outlet, and the cooling channel is configured to direct cooling fluid to at least the second semiconductor die.

A device package comprising an integrated cooling assembly. The device package may comprise multiple semiconductor devices and one or more cold plates attached to one or more of the semiconductor devices. For example, the device package may comprise a first semiconductor device, a second semiconductor device, and a third semiconductor device, wherein the second semiconductor device is disposed adjacent to the first semiconductor device in a first direction and the third semiconductor device is disposed adjacent to the second semiconductor device in the first direction. The device package may also comprise a cold plate attached to the second semiconductor device, wherein the cold plate comprises a plurality of coolant channels that extend along a second direction perpendicular to the first direction.

To provide an electronic device that reduces the thermal resistance caused by air, improves the heat transfer effect, and accelerates the heat dissipation of a chip.SOLUTION: An electronic device includes a heat dissipation housing including multiple housing walls 11 and 13, a circuit board 2, a chip 3, a thermal interface material layer 4, a thermally conductive member 5, and an elastic member 6. The circuit board, the chip, the thermally conductive member, and the elastic member are located within a chamber 101 formed of the heat dissipation housing. The chip is located on a surface of the circuit board. The thermally conductive member is located on a surface of the chip. The elastic member, which has a heat transfer property, is compressed between the thermally conductive member and the first housing wall 11 to reduce a gap between the chip and the thermally conductive member. The gap is filled with a thermal interface material layer. The thin thermal interface material layer filling the gap can accelerate heat transfer between the chip and the thermally conductive member, thereby, allowing the thermally conductive member to quickly transfer absorbed heat to the heat dissipation housing, to heat dissipation effect.SELECTED DRAWING: Figure 4

Integrated circuit dies, systems, devices, and techniques, are described herein related to embedding a thermal solution into an integrated circuit die to heat the integrated circuit die when deployed in sub-zero environments, techniques for operating the thermal solution in a system, and techniques for fabricating the embedded thermal solution. The thermal solution includes a resistive heating element having the same material and substantially coplanar with components of devices of the integrated circuit die.

Integrated circuit (“IC”) structures and electronic packages that utilized an inorganic-convertible polymer to improve bond strength and thermal conductivity are described. In one embodiment, the inorganic-convertible polymer acts as a side fill material to seal a die periphery and improve direct bonding strength. In another embodiment, the inorganic-convertible polymer acts as a thermal bonding layer to increase the thermal conductivity between a die and a thermal solution.

The utility model provides a kind of inner circulating water-cooled radiator of direct current distribution cabinet, it is related to heat dissipation technical field, and it includes: the cold source side of heat exchanger is connected seawater, the heat source side of heat exchanger is connected inner circulation pipeline, and multiple heat sources in the direct current distribution cabinet are flowed through by inner circulation pipeline;Three-way valve is set on the liquid outlet pipe in inner circulation pipeline, and three-way valve is communicated with liquid inlet pipe;Anti-freezing temperature control circuit is electrically connected with three-way valve set on inner circulation pipeline.There is beneficial effect in low temperature environment, anti-freezing temperature control circuit switches three-way valve to bypass mode, so that cooling liquid is separated from seawater cold source, cooling liquid is heated using cabinet heat source itself heat, avoid pipeline and cabinet surface dew, prevent condensed water from causing electrical short circuit, corrosion and other problems, also avoid the risk of pipeline burst, leakage caused by cooling liquid freezing expansion.Based on temperature real-time monitoring, it is intelligently switched between anti-freezing and heat dissipation mode, realize environment adaptability, safe and reliable heat dissipation solution.

The invention relates to the technical field of thermal control of space satellites, and provides a heat dissipation structure for a high-power-consumption device of a space satellite. The heat dissipation structure comprises a heat dissipation substrate, a connection layer, a semiconductor chip, a heat diffuser, a heat dissipation sheet and a thermal interface material. The diamond / copper composite material is applied to a heat dissipation structure, and the surface of the composite material is subjected to surface metallization treatment, so that a heat dissipation substrate, a heat sink, a heat dissipation shell and / or a thermal interface material can be prepared. By means of the ultrahigh heat conductivity of the diamond copper composite material and the linear expansion coefficient matched with the semiconductor chip, the heat can be quickly conducted out and thermally matched with the chip. The integrated design can support integration of heat dissipation and structure supporting, and the requirements for light weight and high stability of a satellite in an extreme environment are met. A diamond / copper material system and a specific surface treatment and connection process thereof are systematically applied to a heat dissipation solution of a high-power-consumption device of a space satellite, extremely high reliability and excellent efficiency of the diamond / copper material system in a space environment are verified, and the diamond / copper material system is suitable for heat dissipation of high-power-consumption devices such as a CPU (central processing unit), a GPU (graphics processing unit) and an ASIC (application specific integrated circuit) in the space satellite.

Systems, apparatus, articles of manufacture, and methods are disclosed for deploying feet and / or including hinge gaskets to improve thermal solutions and / or acoustic experience with electronic devices. An example electronic device includes a first panel; a second panel; a hinge coupling the first panel and the second panel; a foot coupled to the second panel, the foot movable between a deployed position and a retracted position; a sensor to detect a position of the first panel; and programmable circuitry to execute instructions to cause the foot to be moved between the deployed position and the retracted position based on the position of the first panel.

The present application relates to a kind of laser direct writing liquid absorption core structure ultra-thin ceramic heat plate and its preparation method, and the ultra-thin ceramic heat plate includes ceramic upper shell plate, ceramic lower shell plate and ceramic middle frame;Cavity is formed between ceramic upper shell plate and ceramic lower shell plate, and ceramic middle frame is arranged in the cavity;Micro-groove liquid absorption core structure is formed on ceramic middle frame by laser direct writing, and micro-groove liquid absorption core structure includes horizontal micro-groove and longitudinal micro-groove, ceramic middle frame is sequentially divided into condensation zone, heat insulation zone and evaporation zone along the heat transfer direction of heat plate, and horizontal micro-groove is arranged in condensation zone, heat insulation zone and evaporation zone along the heat transfer direction of heat plate, and longitudinal micro-groove is also arranged on the horizontal micro-groove of condensation zone and evaporation zone, and longitudinal micro-groove is perpendicular to horizontal micro-groove;The depth of horizontal micro-groove is greater than the depth of longitudinal micro-groove, with excellent ultra-thin ceramic heat plate performance, reliability and adaptability, provide integrated heat dissipation solution for miniaturization electronic device.

Technical solutions discussed herein include cooling systems for electronic devices, including low-pressure ionic blowers and electromagnetic air movers to improve thermal management in laptops. The cooling system may include multiple blower modules arranged in parallel or series configurations. The thermal solution may be a vapor chamber or a heat pipe, or may include a thin-film air-moving device integrated into an air gap. The cooling system may selectively operate between low pressure blower modules and centrifugal blowers based on cooling demands. The blower module may include an electrode configuration with a single exposed electrode. The cooling system may also incorporate an active noise cancellation system using phase-shifted signals between blower units.

The invention discloses a modularized phase change heat exchange system and method based on parallel connection of multiple condensation tanks. The system comprises a vapor-liquid separation type phase change cold plate, at least one variable modularized phase change liquid cooling tank, a bottom liquid storage tank, a 1 + 1 backup fluorinated liquid circulating pump and a liquid distributor. Steam in the phase change cold plate is led out through a special steam pipe, a low-power-consumption micropump driving closed loop is formed on the secondary side, a spiral coil is arranged in each tank, the steam enters a tank cavity and then directly surrounds the coil to be condensed, and cooling water on the primary side is connected in parallel in the coil to flow and exchange heat; according to the invention, flexible expansion and high redundancy of the system capability are realized through modular paralleling, increasing and decreasing of the multiple condensation tanks; by combining the vapor-liquid separation type cold plate and the ultra-low power consumption micropump circulation, the system power consumption and the space occupation are greatly reduced while the ultrahigh heat dissipation density and the temperature uniformity are ensured, and an efficient and reliable heat dissipation solution is provided for a high-density data center.

Thermal management components and electronic devices for sliding applications are provided. Exemplary embodiments of thermal management components or thermal solutions (e.g., those with improved durability) for sliding applications are disclosed. In the exemplary embodiments, the thermal management components or thermal solutions are robust and provide a durable, non-slip thermal interface material (TIM) with superior performance compared to conventional thermal solutions by improving heat transfer between the sliding heat source and the stationary heat sink via a durable layer (e.g., a metallic abrasion-resistant layer defined by a stainless steel, copper, beryllium copper, aluminum, brass, other metal substrate or cap, or other materials having high thermal conductivity and puncture resistance in addition to abrasion resistance) disposed on or along the thermal interface material (broadly, interface materials) or along the thermal interface material.

The application relates to an IGCT heat dissipation technology field for an extra-high voltage power grid, in particular to an IGCT heat dissipation assembly based on an extra-high voltage power grid and a heat dissipation method thereof, which comprises a heat transfer base body, a cooling regulation and control module, a driving regulation and control device and an electrostatic neutralization unit. The IGCT shell is designed in a three-layer composite material, efficient heat conduction and electrical insulation are realized through a heat-conducting metal layer, a corrugated metal framework and a ceramic insulation layer; the cooling regulation and control module utilizes a separation diaphragm and a liquid flow pump set to form turbulent heat exchange; the driving regulation and control device controls the flow of the cooling liquid through mechanical movement; and the electrostatic neutralization unit monitors and neutralizes the electric charge of the cooling liquid in real time. Through mechanical driving of the honeycomb liquid cooling array, turbulent flow strengthening heat dissipation and the electrostatic elimination mechanism of the charge neutralization module, the technical bottleneck of the existing IGCT heat dissipation assembly is comprehensively solved, and an efficient and reliable heat dissipation solution is provided for the IGCT in the extra-high voltage power grid.

This utility model relates to a forced heat dissipation device for sponge titanium production, aiming to solve the problems of low heat dissipation efficiency, poor product quality, and short equipment lifespan in existing heat dissipation methods. The device includes a reactor, a radiator, and a radiator extension / retraction device. The radiator is installed in the space between the reactor and the furnace shell, abutting against the reactor wall, and has internal air ducts to enhance heat dissipation. The radiator moves in and out through the extension / retraction device, exiting the space between the reactor and the furnace shell after reduction, facilitating reactor loading and unloading. The radiator has multiple heat dissipation channels and can be supplemented with atomized water; the heat dissipation area changes with the reaction center. This utility model provides a highly efficient and intelligent heat dissipation solution for sponge titanium production by enhancing heat dissipation, intelligent heat dissipation control, improving product quality, extending equipment lifespan, and optimizing production efficiency.

A thermal solution using a heat exchanger mounted inside an outdoor telecom unit. More specifically, a hardened optical platform includes a base chassis and a lid configured to seal an interior of the base chassis, wherein each of the base chassis and the lid include a plurality of fins. The hardened optical platform also including a vapor chamber in the interior including a heat exchanger. The heat exchanger including a second plurality of fins that are intertwined with a third plurality of fins on the base chassis in the interior.

Devices, methods, and structures for unleashing the full computing power of handheld and wearable computing devices. An example can provide a docking station that can help to overcome form factor limitations of handheld and wearable computing and other small form factor devices. These limitations can include a limited capability of a small form factor device to dissipate heat due and an inability to support large connectors due to a limited surface area.