47 results about "Thermal solution" patented technology

The invention discloses a control method and device for heat dissipation equipment, and relates to the technical field of computers, and the method comprises the steps: employing a load dynamic perception and prediction model cooperative control technology, building a dynamic correlation model of a load and heat dissipation, and achieving the mode upgrade of a heat dissipation system from lagging regulation to advanced response. A control instruction is generated by predicting a load change trend in real time, and a dual-mode protection mechanism is combined, so that energy efficiency loss caused by traditional temperature control delay is avoided, system stability and energy efficiency performance are optimized, an efficient and energy-saving active heat dissipation solution is provided for high-load equipment, and the service life of the system is prolonged. The problems of low control efficiency of the heat dissipation equipment and energy efficiency loss caused by delayed adjustment in related technologies are solved, and the technical effects of improving the control efficiency of the heat dissipation equipment and reducing energy consumption are achieved.

The invention provides a liquid cooling plate flow channel design optimization method and device based on topological optimization and a liquid cooling plate, and relates to the technical field of thermal management, and the method comprises the steps: S1, determining the geometric parameters of the liquid cooling plate according to the size of a battery module, constructing a double-layer two-dimensional design domain, and setting material, heat source and boundary conditions; s2, a topological optimization algorithm is adopted, material distribution is represented with a relative density variable, a multi-objective function giving consideration to the maximum heat exchange amount and the minimum pressure drop is constructed, a clear fluid-solid interface is obtained through density filtering and a projection function, and a target double-layer two-dimensional flow channel contour is obtained through iterative solution under volume fraction constraint; and S3, taking the target double-layer two-dimensional flow channel contour as a cross section to carry out spatial stretching bending deformation, and generating a double-layer special-shaped flow channel structure with a diffusion layer and a collection layer. According to the method, global optimization of two-dimensional topological optimization and three-dimensional geometric reconstruction are fused, the contradiction between the heat dissipation performance and the flow resistance is effectively solved, and a high-performance heat dissipation solution is provided for battery thermal management.

The invention relates to the technical field of hastelloy, in particular to a preparation method of a large-caliber seamless hastelloy thin-wall roller body, which comprises the following steps of: 1) performing vacuum centrifugal casting on an alloy blank sleeve; (2) carrying out thermal solution treatment on the alloy blank sleeve; (3) machining the pipe blank; (4) powerful spinning is conducted, specifically, a powerful spinning machine is used for conducting spinning on the pipe blank for more than three passes; and 5) annealing heat treatment. Fine grains are prepared through multi-pass spinning and low-temperature annealing, the strength and toughness of the material are improved through fine grain strengthening, the grains in all directions of the hastelloy conductive roller are uniform and consistent, and the average grain size is smaller than or equal to 10 microns; the tensile strength is greater than or equal to 800MPa; the yield strength is greater than or equal to 600MPa; the ductility is not less than 20%.

Methods, apparatus, systems, and articles of manufacture are disclosed to cool electronic devices. An example thermal solution to cool an electronic device Includes a first cooling plate at a first side of a printed circuit board and a second cooling plate at a second side of the printed circuit board, the second side opposite the first side. The second cooling plate is fluidically coupled with the first cooling plate.

Integrated circuit ("IC") structures and electronic packages that utilized an inorganic-convertible polymer to improve bond strength and thermal conductivity are described. In one embodiment, the inorganic-convertible polymer acts as a side fill material to seal a die periphery and improve direct bonding strength. In another embodiment, the inorganic-convertible polymer acts as a thermal bonding layer to increase the thermal conductivity between a die and a thermal solution.

The utility model relates to the technical field of CPU heat dissipation, in particular to a heat dissipation structure which comprises a main heat dissipation device, a first expansion heat dissipation device, a second expansion heat dissipation device, a heat conduction pipe, a heat dissipation block, a heat dissipation sheet and a fixing support, the heat conduction pipe is arranged at one end of the main heat dissipation device, and the heat dissipation block is fixedly arranged above the heat conduction pipe; the first expansion radiator and the second expansion radiator are respectively connected with the radiating block through radiating fins; the cooling fins are soft in texture and can be bent by a certain angle; the fixed support body is connected with the main radiator, the first expansion radiator and the second expansion radiator are lifted through the movable support, and when the movable support deforms, the first expansion radiator and the second expansion radiator are driven to rotate. The position of the claw radiator is adjusted through the fixing support, the limitation of an existing claw radiator is overcome, the radiating efficiency is improved, meanwhile, the occupied space of a main board is reduced, the mounting and dismounting processes of the radiator are simplified, and a more convenient and efficient radiating solution is provided for a user.

To promote heat radiation of a cable for supplying electric power to an electric heating type catalyst device.SOLUTION: The vehicle includes the engine 20 located in the engine room 110, the EHC50 that defines the flow passage of the exhaust gas together with the exhaust gas pipe 40 in the engine room 110 and supports the catalytic converter on the catalytic converter support that generates heat by being energized, and the third EHC50 cable 82 that connects the power supply device 70 for supplying power to the EHC50 and the 2EHC, and at least a part of the third 2EHC cable 82 is located on the upward direction side with respect to the 28A of the upper end surface of the head cover 28 of the engine 20.SELECTED DRAWING: Figure 1

The invention provides a passive heat exchanger air inducing cover synergistic structure and an optimization design method thereof, relates to the technical field of heat exchanger structure design, and solves the problems that an existing heat exchanger is low in ventilation rate and serious in airflow lateral loss. Wherein the optimal design object is the arrangement angle of the passive heat exchanger air inducing cover and the projection length of the passive heat exchanger air inducing cover on the end face; in the optimization design process, the ventilation rate of the passive heat exchanger under the air inducing covers of various specifications is calculated in a porous medium model simulation mode, the air inducing cover arrangement angle and the projection length meeting the preset engineering requirement are selected according to the ventilation rate, and the corresponding air inducing cover synergistic structure is determined; the induced air cover synergistic structure is a circle of plate-shaped induced air cover arranged around the periphery of the end face of the heat exchanger serving as an airflow inlet. The ventilation rate and the heat dissipation performance of the passive heat exchanger under the natural air cooling condition can be remarkably improved, and an efficient, reliable and low-maintenance heat dissipation solution is provided for a high-power-density wind turbine generator.

A device package comprising an integrated cooling assembly. The device package may comprise multiple semiconductor devices and one or more cold plates attached to one or more of the semiconductor devices. For example, the device package may comprise a first semiconductor device, a second semiconductor device, and a third semiconductor device, wherein the second semiconductor device is disposed adjacent to the first semiconductor device in a first direction and the third semiconductor device is disposed adjacent to the second semiconductor device in the first direction. The device package may also comprise a cold plate attached to the second semiconductor device, wherein the cold plate comprises a plurality of coolant channels that extend along a second direction perpendicular to the first direction.

The invention provides an array surface cold plate adopting air cooling and liquid cooling combined heat dissipation, the array surface cold plate is provided with a plurality of avoiding holes, and a plurality of arrays of a sub-array assembly are arranged in the corresponding avoiding holes; a cooling flow channel arranged around the avoiding hole is formed in the array surface cold plate, an inlet flow channel of the cooling flow channel is communicated with the liquid inlet connector, an outlet flow channel of the cooling flow channel is communicated with the liquid outlet connector, and a cold and hot separation cavity is formed between the inlet flow channel and the outlet flow channel; local enhanced heat exchange pieces are arranged in the cooling flow channels and used for increasing the flow resistance of cooling liquid in the cooling flow channels. A systematic, independent, light, small and reconfigurable heat dissipation solution can be provided for a high-power array surface product, the heat dissipation capacity and the temperature equalizing capacity of the array surface cold plate are obviously improved, the air cooling heat dissipation capacity is outstanding, the efficiency is high, the gas-liquid heat exchange cold source and the array surface cold plate are integrally designed, and the heat dissipation efficiency is improved. The light weight and miniaturization level of the array plane is obviously improved, and the whole array plane structure is easy to reconstruct and parameterize and serialize.

A semiconductor package and the method for forming the same are provided. The semiconductor package includes a substrate having an upper surface and a lower surface, first integrated circuit devices mounted on the upper surface, and second integrated circuit devices mounted on the lower surface. A first heat spreader in the form of a vapor-chamber (VC) is located over the first integrated circuit devices. A second heat spreader in the form of a vapor-chamber is located over the second integrated circuit devices. A heat-transfer member thermally couples the first heat spreader and the second heat spreader on both sides of the substrate.

A circuit board and vapor chamber are disclosed. Connectors couple the vapor chamber to a circuit board. The connectors extend from the bottom of the vapor chamber. The connectors fix the vapor chamber to the circuit board such that the bottom of the vapor chamber thermally couples to a heat source on the circuit board. The circuit board has a connector assembly that couples to the vapor chamber.

The application relates to a flow-equalizing liquid inlet structure with an adaptive liquid inlet space and a liquid-cooled energy storage tank. The flow-equalizing liquid inlet structure is provided with an adjustable liquid inlet plug at the position of the liquid inlet end of each branch liquid inlet channel in the main liquid inlet pipeline. The first end face and the second end face of the adjustable liquid inlet plug form a first liquid inlet space and a second liquid inlet space with the inner wall of the main liquid inlet pipeline, respectively. The area difference between the first end face and the second end face causes the flow of the refrigerant to generate a pressure difference to drive the axial movement of the adjustable liquid inlet plug, to real-time adjust the size of the first liquid inlet space and the second liquid inlet space, to force the liquid inlet of the branch liquid inlet pipeline close to the main liquid inlet pipeline to decrease, and to make the excess refrigerant flow to other branch liquid inlet pipelines, to realize dynamic flow balance. Through the above dynamic flow distribution mode, an efficient and reliable heat dissipation solution is provided for the liquid-cooled energy storage tank, to help improve the safety of the energy storage system.

The invention relates to the technical field of device connection, in particular to a high-performance ultrasonic-assisted Kovar-W80Cu20 joint connection method and a precise device. Sn-Sb10 alloy brazing filler metal is adopted, and the Kovar alloy and the W80Cu20 alloy are connected through ultrasonic-assisted brazing. The obtained joint has the characteristics of low thermal expansion coefficient and high thermal conductivity, and the equivalent thermal conductivity at 25 DEG C and 125 DEG C reaches 50 + / -2W / m.K. The shear strength can still exceed 55MPa after being aged for 45 days at the temperature of 160 DEG C; after the Kovar-W80Cu20 composite material is subjected to thermal shock circulation at-40 DEG C to + 125 DEG C for 2000 cycles, the shear strength can still reach 57 MPa, excellent aging reliability and thermal shock reliability are shown, and excellent mechanical properties are attributed to interface bonding promotion by ultrasonic loading and the characteristic of low thermal expansion coefficient of the Kovar-W80Cu20 structure. According to the high-performance ultrasonic-assisted Kovar-W80Cu20 joint connection method and the precise device, the Kovar alloy and the low-expansion and high-heat-conduction W80Cu20 alloy are efficiently connected by constructing the'Kovar / SnSb10 / W80Cu20 'heterogeneous joint, an excellent heat dissipation solution is provided for the high-power precise device, and meanwhile the good CTE matching performance with a chip material is kept.

The invention discloses laptop cooling via a low pressure air booster. Technical solutions discussed herein include cooling systems for electronic devices including a low pressure ion blower and an electromagnetic air booster to improve thermal management of laptop computers. The cooling system may include a plurality of blower modules arranged in a parallel or series configuration. The thermal solution may be a steam chamber or a heat pipe, or may include a thin film air moving device integrated into the air gap. The cooling system may be selectively operated between the low pressure blower module and the centrifugal blower based on a cooling demand. The blower module may include an electrode arrangement having a single exposed electrode. The cooling system may also incorporate an active noise cancellation system that uses phase shift signals between the blower units.

According to the heatless solution dehumidification system, a low-concentration salt solution enters the bottom of a low-concentration solution tank, and the concentration of the low-concentration salt solution stored at the bottom of the low-concentration solution tank is detected through a first concentration meter in the low-concentration solution tank; according to the heatless solution dehumidification system provided by the utility model, the low-concentration pipeline pumps out the low-concentration salt solution and guides the low-concentration salt solution into the separator, the low-concentration salt solution is converted into the high-concentration salt solution and then is input into the high-concentration solution tank, and the concentration of the solution is monitored through the second concentration meter; heating and cooling of the salt solution are omitted through the separator, energy consumption is reduced, the bypass pipeline is connected between the output end of the low-concentration pipeline and the high-concentration solution tank in a communicating mode, the low-concentration electromagnetic valve is arranged on the bypass pipeline, and the specific concentration of the high-concentration salt solution in the high-concentration solution tank can be adjusted by adjusting the opening degree of the low-concentration electromagnetic valve.

To provide a slot-in apparatus mounted with a number of child apparatuses and cooled by a fan, and to enable highly efficient heat radiation even when various child apparatuses are mounted.SOLUTION: An apparatus cooling device comprises: first and second channels that are adjacent to each other in parallel, and have apparatuses arranged at predetermined positions therein; a cooling fan that is provided in the first and second channels to cause air for cooling the apparatuses to flow in from an intake port provided at one end of the first and second channels, and exhaust the air from an exhaust port provided at the other end of the first and second channels; and an adjustment member that, when the flow rate of the air generated by the cooling fan becomes a predetermined value, adjusts the pressure loss in at least one of the first and second channels so that the pressure loss in the first channel and the pressure loss in the second channel become identical to each other.SELECTED DRAWING: Figure 1

The invention relates to a forced heat dissipation device for titanium sponge production, and aims to solve the problems of low heat dissipation efficiency, poor product quality, short equipment service life and the like in an existing heat dissipation mode. The device comprises a reactor, a radiator and a radiator telescopic device. The radiator is arranged in the space between the reactor and the furnace shell, abuts against the wall of the reactor and is internally provided with an air duct channel used for enhancing heat dissipation. The radiator enters and exits from the space between the reactor and the furnace shell after the reduction is finished, so that the reactor can be conveniently discharged and fed into the furnace. The radiator is provided with a plurality of heat dissipation channels, atomized water can be added, and a heat dissipation area changes along with the change of the reaction center. According to the invention, an efficient and intelligent heat dissipation solution is provided for titanium sponge production by strengthening the heat dissipation effect, intelligently controlling heat dissipation, improving the product quality, prolonging the service life of equipment and optimizing the production efficiency.

A baking system is provided. A receiving base is operable to receive a processing unit assembly including a processing unit, a thermal solution, and a thermal interface material operable to couple the processing unit and the thermal solution. An upper portion is operable to provide heat to the processing unit assembly to cure the thermal interface material. The upper portion directs heat to the processing unit assembly from above the processing unit assembly. A bottom portion is operable to provide heat to the processing unit assembly to cure the thermal interface material. The bottom portion directs heat to the processing unit assembly from below the processing unit assembly opposite the upper portion.

The invention relates to a flow-equalizing liquid inlet structure with a self-adaptive liquid inlet space and a liquid cooling energy storage box, and the flow-equalizing liquid inlet structure is provided with adjustable liquid inlet plugs at the positions, corresponding to the liquid inlet ends of branch liquid inlet runners, in a main liquid inlet pipeline. A first liquid inlet space and a second liquid inlet space are formed by the first end face and the second end face of the adjustable liquid inlet plug and the inner wall of the main liquid inlet pipeline respectively, and the area difference between the first end face and the second end face is utilized, so that refrigerant flows to generate pressure difference to drive the adjustable liquid inlet plug to move axially. The size of the first liquid inlet space and the size of the second liquid inlet space are adjusted in real time, inlet liquid of the branch liquid inlet pipelines close to the main liquid inlet pipeline is forced to be reduced, redundant refrigerant flows to other branch liquid inlet pipelines, flow dynamic balance is achieved, an efficient and reliable heat dissipation solution is provided for the liquid cooling energy storage box through the dynamic flow distribution mode, and the service life of the liquid cooling energy storage box is prolonged. And the safety of the energy storage system is improved.

An apparatus including a substrate having a first surface, and a silicon interposer including a first surface and a second surface, wherein the first surface is connected to the first surface of the substrate. The apparatus also includes at least one stack including an artificial intelligence (AI) chiplet and a plurality of static random-access memories (SRAMs) stacked below the AI chiplet, wherein the at least one stack includes a top surface, a bottom surface, a first side surface and a second side surface, and the at least one stack is orthogonally attached by the first side surface to the second surface of the silicon interposer. The apparatus additionally includes a heat spreader surrounding the top surface, the bottom surface and the second side surface of the at least one stack.

A stacked assembly includes a first semiconductor die; a second semiconductor die secured to the first semiconductor die; and a dielectric encasing at least the second semiconductor die. The dielectric defines a cooling channel having at least one inlet and at least one outlet, and the cooling channel is configured to direct cooling fluid to at least the second semiconductor die.

A device package comprising an integrated cooling assembly. The device package may comprise multiple semiconductor devices and one or more cold plates attached to one or more of the semiconductor devices. For example, the device package may comprise a first semiconductor device, a second semiconductor device, and a third semiconductor device, wherein the second semiconductor device is disposed adjacent to the first semiconductor device in a first direction and the third semiconductor device is disposed adjacent to the second semiconductor device in the first direction. The device package may also comprise a cold plate attached to the second semiconductor device, wherein the cold plate comprises a plurality of coolant channels that extend along a second direction perpendicular to the first direction.

To provide an electronic device that reduces the thermal resistance caused by air, improves the heat transfer effect, and accelerates the heat dissipation of a chip.SOLUTION: An electronic device includes a heat dissipation housing including multiple housing walls 11 and 13, a circuit board 2, a chip 3, a thermal interface material layer 4, a thermally conductive member 5, and an elastic member 6. The circuit board, the chip, the thermally conductive member, and the elastic member are located within a chamber 101 formed of the heat dissipation housing. The chip is located on a surface of the circuit board. The thermally conductive member is located on a surface of the chip. The elastic member, which has a heat transfer property, is compressed between the thermally conductive member and the first housing wall 11 to reduce a gap between the chip and the thermally conductive member. The gap is filled with a thermal interface material layer. The thin thermal interface material layer filling the gap can accelerate heat transfer between the chip and the thermally conductive member, thereby, allowing the thermally conductive member to quickly transfer absorbed heat to the heat dissipation housing, to heat dissipation effect.SELECTED DRAWING: Figure 4

Integrated circuit dies, systems, devices, and techniques, are described herein related to embedding a thermal solution into an integrated circuit die to heat the integrated circuit die when deployed in sub-zero environments, techniques for operating the thermal solution in a system, and techniques for fabricating the embedded thermal solution. The thermal solution includes a resistive heating element having the same material and substantially coplanar with components of devices of the integrated circuit die.

Embodiments disclosed herein include electronic packages with thermal solutions. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and an integrated heat spreader (IHS) that is thermally coupled to a surface of the first die. In an embodiment, the IHS comprises a main body having an outer perimeter, and one or more legs attached to the outer perimeter of the main body, wherein the one or more legs are supported by the package substrate. In an embodiment, the electronic package further comprises a thermal block between the package substrate and the main body of the IHS, wherein the thermal block is within the outer perimeter of the main body.

Integrated circuit (“IC”) structures and electronic packages that utilized an inorganic-convertible polymer to improve bond strength and thermal conductivity are described. In one embodiment, the inorganic-convertible polymer acts as a side fill material to seal a die periphery and improve direct bonding strength. In another embodiment, the inorganic-convertible polymer acts as a thermal bonding layer to increase the thermal conductivity between a die and a thermal solution.

To provide a small mobility that can efficiently exhaust heat by utilizing the rising air currents generated by a heat source.SOLUTION: A small mobility is covered by a cover 3 and includes at least one or more heat-generating lower heat sources 5 inside, and a duct 7 is provided from above the lower heat source 5 to communicate with the outside air on the upper surface of the cover 3, and the position of an inlet 8 of the duct 7 relative to the lower heat source 5 is set to include the center of the lower heat source 5 in the longitudinal and lateral directions, and the inlet 8 is formed in a shape that extends from the center of the lower heat source 5 along the longitudinal direction.SELECTED DRAWING: Figure 2