8 results about "Thermal solution" patented technology

A device package comprising an integrated cooling assembly. The device package may comprise multiple semiconductor devices and one or more cold plates attached to one or more of the semiconductor devices. For example, the device package may comprise a first semiconductor device, a second semiconductor device, and a third semiconductor device, wherein the second semiconductor device is disposed adjacent to the first semiconductor device in a first direction and the third semiconductor device is disposed adjacent to the second semiconductor device in the first direction. The device package may also comprise a cold plate attached to the second semiconductor device, wherein the cold plate comprises a plurality of coolant channels that extend along a second direction perpendicular to the first direction.

A device package comprising an integrated cooling assembly. The device package may comprise multiple semiconductor devices and one or more cold plates attached to one or more of the semiconductor devices. For example, the device package may comprise a first semiconductor device, a second semiconductor device, and a third semiconductor device, wherein the second semiconductor device is disposed adjacent to the first semiconductor device in a first direction and the third semiconductor device is disposed adjacent to the second semiconductor device in the first direction. The device package may also comprise a cold plate attached to the second semiconductor device, wherein the cold plate comprises a plurality of coolant channels that extend along a second direction perpendicular to the first direction.

The utility model provides a kind of inner circulating water-cooled radiator of direct current distribution cabinet, it is related to heat dissipation technical field, and it includes: the cold source side of heat exchanger is connected seawater, the heat source side of heat exchanger is connected inner circulation pipeline, and multiple heat sources in the direct current distribution cabinet are flowed through by inner circulation pipeline;Three-way valve is set on the liquid outlet pipe in inner circulation pipeline, and three-way valve is communicated with liquid inlet pipe;Anti-freezing temperature control circuit is electrically connected with three-way valve set on inner circulation pipeline.There is beneficial effect in low temperature environment, anti-freezing temperature control circuit switches three-way valve to bypass mode, so that cooling liquid is separated from seawater cold source, cooling liquid is heated using cabinet heat source itself heat, avoid pipeline and cabinet surface dew, prevent condensed water from causing electrical short circuit, corrosion and other problems, also avoid the risk of pipeline burst, leakage caused by cooling liquid freezing expansion.Based on temperature real-time monitoring, it is intelligently switched between anti-freezing and heat dissipation mode, realize environment adaptability, safe and reliable heat dissipation solution.

Thermal management components and electronic devices for sliding applications are provided. Exemplary embodiments of thermal management components or thermal solutions (e.g., those with improved durability) for sliding applications are disclosed. In the exemplary embodiments, the thermal management components or thermal solutions are robust and provide a durable, non-slip thermal interface material (TIM) with superior performance compared to conventional thermal solutions by improving heat transfer between the sliding heat source and the stationary heat sink via a durable layer (e.g., a metallic abrasion-resistant layer defined by a stainless steel, copper, beryllium copper, aluminum, brass, other metal substrate or cap, or other materials having high thermal conductivity and puncture resistance in addition to abrasion resistance) disposed on or along the thermal interface material (broadly, interface materials) or along the thermal interface material.

This utility model relates to a forced heat dissipation device for sponge titanium production, aiming to solve the problems of low heat dissipation efficiency, poor product quality, and short equipment lifespan in existing heat dissipation methods. The device includes a reactor, a radiator, and a radiator extension / retraction device. The radiator is installed in the space between the reactor and the furnace shell, abutting against the reactor wall, and has internal air ducts to enhance heat dissipation. The radiator moves in and out through the extension / retraction device, exiting the space between the reactor and the furnace shell after reduction, facilitating reactor loading and unloading. The radiator has multiple heat dissipation channels and can be supplemented with atomized water; the heat dissipation area changes with the reaction center. This utility model provides a highly efficient and intelligent heat dissipation solution for sponge titanium production by enhancing heat dissipation, intelligent heat dissipation control, improving product quality, extending equipment lifespan, and optimizing production efficiency.

A thermal solution using a heat exchanger mounted inside an outdoor telecom unit. More specifically, a hardened optical platform includes a base chassis and a lid configured to seal an interior of the base chassis, wherein each of the base chassis and the lid include a plurality of fins. The hardened optical platform also including a vapor chamber in the interior including a heat exchanger. The heat exchanger including a second plurality of fins that are intertwined with a third plurality of fins on the base chassis in the interior.

Exemplary embodiments are disclosed of thermal management assemblies or thermal solutions (e.g., with improved durability, etc.) for sliding applications. In exemplary embodiments, the thermal management assembly or thermal solution is robust and improves heat transfer between a slidable heat source and a stationary heat sink via a durable layer (e.g., metal wear-resistant layer defined by a stainless steel, copper, beryllium copper, aluminum, brass, other metal substrate or cover, other materials with high thermal conductivity and puncture resistant in addition to wear-resistant, etc.) disposed over or along a thermal interface material (broadly, interface material) (e.g., thermal phase change material (PCM), etc.), thereby providing a durable, slide-resistant thermal interface material (TIM) with improved performance over conventional thermal solutions.