196 results about "Thermal solution" patented technology

A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and / or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and / or second component from the heat generated by the heat source.

A thermal solution for a portable electronic device, which is positioned between a heat source and another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the second component from the heat generated by the heat source.

A heat transfer system is presented for managing thermal transients, thus providing engineers greater flexibility in designing thermal solutions for applications subject to transient heat-generation. A heat reservoir device for managing a heat input subject to transient conditions includes a heat transfer subsystem having a first end and a second end, where the first end is thermally coupled to the heat input; a heat storage subsystem coupled to the second end of the heat transfer subsystem, where the heat storage subsystem comprises a phase change material responsive to the transient conditions. The excess heat load during transient operation is temporarily absorbed by the latent heat of fusion when the phase change material changes its phase from solid to liquid. Subsequently, the absorbed heat can be released back to the ambient via a heat rejection subsystem. This allows engineers to design smaller heat sinks capable of accommodating given transient conditions. This results in heat sinks which are lower cost and smaller size, or which reduce the requirement to provide higher airflow, thereby also decreasing cost and noise, and increasing reliability.

A thermal solution for equipment containing a heat-generating component, which is positioned between the heat-generating component and an external surface of the equipment, where the thermal solution facilitates heat dissipation from the heat-generating component while shielding the external surface from the heat generated by the heat-generating component.

A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and / or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and / or second component from the heat generated by the heat source.

One embodiment of a modular, scalable cooling system includes a core cooling module configured to be thermally coupled to a heat-generating electronic device and a supplemental cooling module configured to be thermally coupled to the core cooling module. A first interface attached to the core cooling module is configured to thermally couple the core cooling module to the supplemental cooling module. The core cooling module and the supplemental cooling module may be used alone or in combination to dissipate heat from the heat-generating electronic device.

A chassis air guide thermal cooling solution including a fan to which protruding edges are wedged at wedge grooves of a locating assembly to locate the fan therein, locating notches of a flexible ring are positioned in the locating assembly, an accommodating ring is accommodated around the flexible ring, and the locating assembly is fastened with a locating plate by means of screws; a side panel is devised with ventilation openings for drawing external air or discharging hot air at the interior of the device. The locating assembly is provided with a plurality of flexible openings, and after having fixed the locating plate therein, an assembled position of the chassis air guide thermal cooling solution is adjusted; after having assembled the chassis air guide thermal cooling solution therein, a distance between the accommodating ring and the heat dissipating fan is adjusted using the flexible ring.

An apparatus for removably retaining an IC package in engagement with a socket such that the contacts of both the IC package and the socket are properly engaged is disclosed. Specifically, a universal retention mechanism (URM) which may be fabricated in a diecast material, may comprise a retention frame to engage a socket. A load plate hinged to the retention frame may be caused to press the socket and IC package together through force selectively applied through the use of a load lever. In addition, the frame may contain features to attach a thermal solution (e.g. a heat sink or other cooling device) directly to the frame thus eliminating the need to attach it directly to a motherboard or through a backplate.

A method, system, and apparatus are disclosed. In one embodiment method includes causing a cooling medium to flow through a hollow cable. The cable couples an external cooling station to a heat exchanging unit. The heat exchanging unit is located within a mobile computing device. The method then transfers heat from within the mobile computing device to the cooling medium at the heat exchanging unit. Then the cooling medium contained the transferred heat is expelled out of the mobile computing device.