196 results about "Thermal solution" patented technology

A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and / or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and / or second component from the heat generated by the heat source.

A thermal solution for a portable electronic device, which is positioned between a heat source and another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the second component from the heat generated by the heat source.

A heat transfer system is presented for managing thermal transients, thus providing engineers greater flexibility in designing thermal solutions for applications subject to transient heat-generation. A heat reservoir device for managing a heat input subject to transient conditions includes a heat transfer subsystem having a first end and a second end, where the first end is thermally coupled to the heat input; a heat storage subsystem coupled to the second end of the heat transfer subsystem, where the heat storage subsystem comprises a phase change material responsive to the transient conditions. The excess heat load during transient operation is temporarily absorbed by the latent heat of fusion when the phase change material changes its phase from solid to liquid. Subsequently, the absorbed heat can be released back to the ambient via a heat rejection subsystem. This allows engineers to design smaller heat sinks capable of accommodating given transient conditions. This results in heat sinks which are lower cost and smaller size, or which reduce the requirement to provide higher airflow, thereby also decreasing cost and noise, and increasing reliability.

A thermal solution for equipment containing a heat-generating component, which is positioned between the heat-generating component and an external surface of the equipment, where the thermal solution facilitates heat dissipation from the heat-generating component while shielding the external surface from the heat generated by the heat-generating component.

One embodiment of a modular, scalable cooling system includes a core cooling module configured to be thermally coupled to a heat-generating electronic device and a supplemental cooling module configured to be thermally coupled to the core cooling module. A first interface attached to the core cooling module is configured to thermally couple the core cooling module to the supplemental cooling module. The core cooling module and the supplemental cooling module may be used alone or in combination to dissipate heat from the heat-generating electronic device.