Plate-type heat-pipe radiator

Abstract

The invention relates to a plate heat pipe radiator, which comprises a sheet sealed case made from metallic sheet, whose inner chamber is vacuum and filled with liquid working substance which can be gasified when heated; the outer side of the bottom of case has a heat adsorption end face which is close to the surface of heating electric element to adsorb the heat; the chamber of case has a support element which is connected to the inner surface of said case to eliminate the case deformation caused by the pressure generated by the outer atmosphere pressure of the gasified liquid working substance. The invention via the heat pipe and strengthening the structure of sheet case, overcomes the defects of traditional aluminum alloy heat radiator on the miniaturization and high speed development.

Description

technical field [0001] The invention relates to a plate type heat pipe radiator, in particular to a flat heat pipe radiator for heat dissipation of electronic components by densely arranging support members inside the working cavity of the radiator and arranging heat dissipation fins on the heat dissipation surface of the radiator . Background technique [0002] With the significant increase in the integration of integrated circuits, small and ultra-thin electronic products have developed rapidly, including notebook computers, functional module devices in communication system workstations, and small electronic controls used in automated smart devices. unit etc. Taking notebook computers as an example, in recent years, with the continuous and rapid improvement of social needs, the performance of notebook computer products has been rapidly improved, and new products will appear every year on average to eliminate old products. [0003] The improvement of notebook computer per...

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Problems solved by technology

[0003] The improvement of notebook computer performance depends on the improvement of product hardware performance and the continuous upgrading of system software and application software. Among them, the improvement of hardware performance plays a major role, such as the improvement of CPU computing speed and storage device read and write speed. However, The increase in speed usually leads to an increase in power consumption, while the volume of electronic components (such as CPU) and the volume of notebook computers continue to decrease, resulting in a reduction in the volume of the aluminum alloy comb-shaped cooling plate and cooling fan used. Small, which makes it difficult for the heat generated by the laptop to dissipate

As we all know, the reliability and life of the CPU are closely related to its operating temperature. If the heat generated cannot be dissipated in time, the reliability of the CPU will be greatly reduced, and even cause the computer system to fail to operate normally.

[0004] Recently, some chip manufacturers have developed a new generation of CPU chips for notebook computers in order to eliminate the difficulty of heat dissipation caused by increasing the computing speed and reducing the size of the chip. Under the premise of not reducing the speed, it has smaller volume and power consumption, which reduces the heat generated. However, even this new generation of CPU chips is still restricted by heat dissipation problems. That is to say, in the current situation, The reduction of power consumption is very limited, but the desire to increase the computing speed and further reduce the thickness (or volume) of the notebook computer is growing rapidly. In this case, if the traditional aluminum alloy comb-shaped cooling plate continues to be used To dissipate heat with a cooling fan, even if the current cooling problem can be solved in a short time, it will still hinder the continued development of notebook computers in the future. It can be seen that research and design of a new radiator combined with low-power and high-speed CPU The research and development of the chip can provide a good heat dissipation technology guarantee for the further development of notebook computers and other electronic equipment towards miniaturization and high-speed operation in the future.

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