Plate-type heat-pipe radiator

A plate-type heat pipe and radiator technology, applied in indirect heat exchangers, instruments, heat exchange equipment, etc., can solve the problems of reduced reliability, reduced heat, volume reduction of aluminum alloy comb-shaped heat sink plates and cooling fans, etc., to achieve High working reliability, fast heat transfer speed, uniform heat conduction effect

Inactive Publication Date: 2006-07-19
杨洪武
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The improvement of notebook computer performance depends on the improvement of product hardware performance and the continuous upgrading of system software and application software. Among them, the improvement of hardware performance plays a major role, such as the improvement of CPU computing speed and storage device read and write speed. However, The increase in speed usually leads to an increase in power consumption, while the volume of electronic components (such as CPU) and the volume of notebook computers continue to decrease, resulting in a reduction in the volume of the aluminum alloy comb-shaped cooling plate and cooling fan used. Small, which makes it difficult for the heat generated by the laptop to dissipate
As we all know, the reliability and life of the CPU are closely related to its operating temperature. If the heat generated cannot be dissipated in time, the reliability of the CPU will be greatly reduced, and even cause the computer system to fail to operate normally.
[0004] Recently, some chip manufacturers have developed a new generation of CPU chips for notebook computers in order to eliminate the difficulty of heat dissi

Method used

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  • Plate-type heat-pipe radiator
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  • Plate-type heat-pipe radiator

Examples

Experimental program
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Effect test

no. 1 example

[0066] Such as Figure 18As shown, the support member 4 includes an upper connection layer 41 and a lower connection layer 42 for fixedly connecting the inner surface of the casing. The upper connection layer 41 and the lower connection layer 42 are connected by a support member 43 , so that a space through which fluid can pass is formed between the upper connection layer 41 and the lower connection layer 42 . The upper connection layer 41 is formed by continuous bending and extending of a metal rod. Similarly, the lower connection layer 42 is also formed of a metal rod by continuous bending and extending according to the shape of the upper connection layer 41 . The upper connection layer 41 and the lower connection layer 42 are arranged in parallel, and a plurality of supporting members 43 arranged side by side are respectively connected with the upper connection layer 41 and the lower connection layer 42 through their two ends, and they are separated, so that the whole suppo...

no. 2 example

[0069] Such as Figure 19 shown. The difference between this embodiment and the first embodiment mainly lies in the different configurations of the upper connection layer and the lower connection layer. Both the upper connection layer and the lower connection layer are composed of a group of metal rods arranged parallel to each other, distributed and extended in parallel, and the outer layer metal rods 44 and the inner layer metal rods 45 are arranged in a mutual misalignment manner. A plurality of supports 43 are connected in a figure-eight shape between the outer metal rod 44 and the inner metal rod 45 . The support member 43 is made of continuously bent metal rods in actual processing, which not only facilitates processing and production, but also makes the whole device have higher supporting strength.

[0070] When in use, the outer layer metal rod 44 and the inner layer metal rod 45 are welded on the inner surface of the housing so that the housing can be well supported...

no. 3 example

[0072] The difference between this embodiment and the above two embodiments is that the upper connection layer and the lower connection layer are made of metal sheets arranged parallel to each other, such as Figure 20 shown. The outer layer metal sheet 46 and the inner layer metal sheet 47 can be respectively brazed on the inner surface of the housing during installation and use. Since the shell of the heat pipe is made of metal foil, when the outer metal sheet 46 and the inner layer metal sheet 47 are brazed and fixed inside the shell, the thickness of the shell can be thickened in sections, which is beneficial to the reinforcement of the shell. Intensity has some help.

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Abstract

The invention relates to a plate heat pipe radiator, which comprises a sheet sealed case made from metallic sheet, whose inner chamber is vacuum and filled with liquid working substance which can be gasified when heated; the outer side of the bottom of case has a heat adsorption end face which is close to the surface of heating electric element to adsorb the heat; the chamber of case has a support element which is connected to the inner surface of said case to eliminate the case deformation caused by the pressure generated by the outer atmosphere pressure of the gasified liquid working substance. The invention via the heat pipe and strengthening the structure of sheet case, overcomes the defects of traditional aluminum alloy heat radiator on the miniaturization and high speed development.

Description

technical field [0001] The invention relates to a plate type heat pipe radiator, in particular to a flat heat pipe radiator for heat dissipation of electronic components by densely arranging support members inside the working cavity of the radiator and arranging heat dissipation fins on the heat dissipation surface of the radiator . Background technique [0002] With the significant increase in the integration of integrated circuits, small and ultra-thin electronic products have developed rapidly, including notebook computers, functional module devices in communication system workstations, and small electronic controls used in automated smart devices. unit etc. Taking notebook computers as an example, in recent years, with the continuous and rapid improvement of social needs, the performance of notebook computer products has been rapidly improved, and new products will appear every year on average to eliminate old products. [0003] The improvement of notebook computer per...

Claims

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Application Information

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IPC IPC(8): H01L23/427H01L23/36G06F1/20H05K7/20F28D15/02
CPCF28D15/0233H01L2924/0002F28F3/025F28D15/046H01L23/427G06F2200/201G06F1/20
Inventor 杨洪武
Owner 杨洪武
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