A mechanical chuck device

Abstract

The present invention discloses a mechanical chuck device comprising a carrier plate, a water-cooled base, a chuck claw supported on the water-cooled base, a water-cooled base, a crank-slider mechanism, a heating coil connector, and a temperature sensor. The water-cooled base has a cooling channel within it. When the carrier plate is at a high temperature, a cooling medium is passed through the cooling channel to cool components outside the carrier plate. The present invention has the advantages of a simple and compact structure, simple manufacture, ease of use, and a wide range of applications.

Description

Technical Field

[0001] The present invention mainly relates to the technical field of semiconductor component manufacturing equipment, and in particular to a mechanical chuck device, which is especially suitable for semiconductor component manufacturing equipment. Background Art

[0002] Semiconductor component manufacturing technology and processes are extremely complex. Plasma processing units for processes such as ion implantation, sputtering, CVD, and etching typically use electrostatic chucks to hold objects such as semiconductor wafers and glass substrates.

[0003] Electrostatic chucks apply voltage to internal electrodes to generate an adsorption force, which in turn attracts and holds objects. Currently, electrostatic chucks have a very long development cycle, are difficult to manufacture, and have poor adaptability to various environments. This is especially true for vacuum, high-temperature, and low-temperature electrostatic chucks, where existing technology is insufficient and manufacturing processes are imperfect. Summary of the Invention

[0004] The technical problem to be solved by the present invention is: in response to the technical problems existing in the prior art, the present invention provides a mechanical chuck device with a simple and compact structure, simple manufacture, easy use and wide application range.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A mechanical chuck device includes a carrier plate, a water-cooled base, and a clamping claw supported on the water-cooled base, a water-cooled base, a crank-slider mechanism, a heating coil connector, and a temperature sensor; a cooling pipe is provided inside the water-cooled base, and a cooling medium is introduced into the cooling pipe when the carrier plate is at a high temperature to cool components outside the carrier plate.

[0007] As a further improvement of the device of the present invention: the crank-slider mechanism includes more than three groups of cranks and sliders, and the more than three groups of cranks and sliders are evenly distributed in the circumferential direction, corresponding to the claws evenly distributed in the circumference; the water-cooled base has a slide groove inside for constraining the sliding of the slider; the slider is used to drive the roller, driving the claw to rotate around the rotation axis to achieve the loosening and clamping actions.

[0008] As a further improvement of the device of the present invention: the driving base in the crank-slider mechanism is hingedly connected to one end of the crank through the second core shaft, and the other end of the crank is hingedly connected to the slider through the first core shaft, which is used to drive the claws so that the claws rotate regularly around the rotating axis according to the cam curve of the slider, thereby realizing the clamping and releasing of the load; the driving base and the push rod are hard-connected, and when the push rod moves up and down to drive the load, the crank is driven to rotate around the second core shaft, and the crank drives the slider to slide in the slide groove of the water-cooled base through the first core shaft.

[0009] As a further improvement of the device of the present invention: a constraint cover is provided on the slider, and a guide groove formed by the slide groove and the constraint cover is used to enable the slider to slide effectively in the slide groove; the constraint cover is fastened to the water-cooled base.

[0010] As a further improvement of the device of the present invention: the roller cooperates with the claw through a fixing pin, and under the action of the compression spring, the roller fully contacts the curved surface of the slider in the crank-slider mechanism to enable the slider to drive the claw.

[0011] As a further improvement of the device of the present invention: a heat insulation plate is installed between the water-cooled base and the carrier plate, separated by a pad; the upper and lower surfaces of the heat insulation plate respectively create gaps between the carrier plate and the water-cooled base, which are used to isolate heat transfer between the carrier plate and the water-cooled base.

[0012] As a further improvement of the device of the present invention: the heating coil connector is installed on the water-cooling base and is sealed at the joint with the water-cooling base. The heating coil connector is docked with the heating coil lead-out terminal in a vacuum and is led to the atmospheric environment.

[0013] As a further improvement of the device of the present invention: the temperature sensor connector is installed on the water-cooled base and is sealed at the joint with the water-cooled base. The temperature sensor connector and the temperature sensor lead-out terminal are docked in a vacuum and are led to the atmospheric environment.

[0014] As a further improvement to the device of the present invention: the carrier plate is a high-temperature carrier plate or a conventional temperature carrier plate.

[0015] As a further improvement of the device of the present invention: there are holes for installing compression springs and rotating shafts on the circumference of the water-cooling base, and the water-cooling base is connected to the supporting plate by screws. The screws first pass through the spacer, and then pass through the pressure cap and the spring in sequence to be connected to the supporting plate.

[0016] Compared with the prior art, the advantages of the present invention are:

[0017] 1. The mechanical chuck device of the present invention has a simple and compact structure, is simple to manufacture, easy to use, and has a wide range of applications. It can be used in vacuum, high and low temperature, and room temperature environments. The present invention can be widely used in plasma processing units such as ion implantation, sputtering, CVD, and etching.

[0018] 2. In the mechanical chuck device of the present invention, when the carrier plate is at a high temperature, a cooling medium is passed through the water-cooling base to cool components other than the carrier plate to prevent them from being damaged or failing due to overheating. At room temperature or low temperature, no cooling medium is passed through the water-cooling base.

[0019] 3. The mechanical chuck device of the present invention is a mechanical chuck device that can be used in vacuum, high and low temperatures, and room temperature. The carrier plate has a heating function, and the temperature of the carrier plate can be adjusted in real time according to the process technology. It can also be equipped with a low-temperature carrier plate according to the process technology requirements. Regardless of the high and low temperatures in vacuum or room temperature, this device can still achieve effective clamping of objects such as semiconductor chips or glass substrates.

[0020] 4. The mechanical chuck device of the present invention adopts a mechanical structure to complete clamping, which shortens the manufacturing cycle of the carrier disc and greatly reduces the difficulty of the manufacturing process of the carrier disc. The mechanical chuck can also adapt to various vacuum environments, such as high temperature, low temperature, and normal temperature vacuum environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structural principle of the mechanical chuck device of the present invention.

[0022] Figure 2 It is a schematic diagram of the structural principle of the chuck crank-slider in a specific application example of the present invention.

[0023] Figure 3 It is a schematic diagram of the structural principle of the fixed installation of the carrier plate in a specific application example of the present invention.

[0024] Figure 4 yes Figure 3 Schematic diagram of the amplification structure principle at I in the middle.

[0025] Legend:

[0026] 1. Adapter plate; 2. Push rod; 3. Water-cooled base; 4. Crank-slider mechanism; 5. Constraint cover; 6. Roller; 7. Heat insulation plate; 8. Pad; 9. Heating coil connector; 10. Temperature sensor connector; 11. Claw; 12. Reset spring; 13. Carrying plate; 14. Slider; 15. Crank; 16. Load; 17. Rotating shaft; 18. Fixing pin; 19. First core shaft; 20. Screw; 21. Spacer; 22. Screw; 23. Pressure cap; 24. Spring; 25. Drive base. DETAILED DESCRIPTION

[0027] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] In the description of this application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0030] In this application, unless otherwise specified or limited, the terms "assemble," "connect," "connect," "fix," and the like should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0031] like Figures 1-4 As shown, the mechanical chuck device of the present invention can be used in vacuum, high and low temperature, and normal temperature environments. It includes a clamping claw 11, a water-cooled base 3, a crank-slider mechanism 4, a heating coil connector 9, a temperature sensor connector 10, and a carrier plate 13, wherein the water-cooled base 3 is used to support functional components such as the crank-slider mechanism 4, the clamping claw 11, the return spring 12, the heating coil connector 9, the temperature sensor connector 10, and the constraint cover 5. The water-cooled base 3 has a cooling pipe inside. When the carrier plate 13 is at a high temperature, a cooling medium is passed through the cooling pipe in the water-cooled base 3 to cool components outside the carrier plate 13 to prevent the water-cooled base 3, the crank-slider mechanism 4, the sealing ring, and other components from being damaged or failing due to excessive temperatures. At normal or low temperatures, no cooling medium is passed through.

[0032] In a specific application example, the crank-slider mechanism 4 of the present invention includes three sets of cranks 15 and sliders 14; the three sets of cranks 15 and sliders 14 are evenly distributed in the circumferential direction, with intervals of 120°, corresponding to the claws 11 evenly distributed around the circumference.

[0033] In a specific application example, the water-cooled base 3 has a slide groove inside, which is evenly distributed in the circumferential direction and spaced 120° apart, and is used to constrain the slider 14 to slide effectively; at the same time, there are holes on the circumference of the water-cooled base 3 for installing the compression spring 12 and the rotating shaft 17. The water-cooled base 3 is connected to the carrier plate 13 by a screw 22. The screw 22 first passes through the spacer 21, and then passes through the pressure cap 23 and the spring 24 in turn. The spring 24 can effectively release and offset the stress and deformation generated by various components at high temperatures to ensure the normal operation of the carrier plate 13.

[0034] In a specific application example, the drive base 25 in the crank-slider mechanism 4 is hinged to one end of the three cranks 15 via the second spindle 20. The other ends of the three cranks 15 are hinged to the three sliders 14 via the first spindle 19, thereby forming the crank-slider mechanism 14. The crank-slider mechanism 14 is the primary motion mechanism, driving the claws 11, causing them to rotate regularly around the rotation axis 17 according to the cam curve of the slider 14, thereby clamping and releasing the load 16. The drive base 25 in the crank-slider mechanism 4 is rigidly connected to the push rod 2, allowing the claws 11 to clamp or release when the load is lowered or raised, without interference. The drive base 25 and the push rod 2 share the same motion trajectory. When the push rod 2 moves up and down to drive the load 16, it simultaneously drives the three cranks 15 to rotate around the second spindle 20. The cranks 15, via the first spindle 19, drive the slider 14 to slide within the slide groove of the water-cooled base 3.

[0035] Furthermore, the slider 14 is positioned within the chute of the water-cooled base 3, with a restraining cover plate 5 positioned thereon. The guide groove formed by the chute and the restraining cover plate 5 effectively ensures the effective sliding of the slider 14 within the chute, thereby ensuring the accuracy of the movement of the claw 11. The slider 14 is used to drive the roller 6, thereby driving the claw 11 to rotate about the rotation axis 17 to achieve the release and clamping actions. The curved surface of the slider 14 in contact with the roller 6 satisfies the requirement that the claw 11 first releases the load 16 when the drive base 25 rises, and then clamps the load 16 when the drive base 25 descends. During the clamping and release processes, there is no interference between the claw 11 and the load 16.

[0036] In a specific application example, the claws 11 are evenly distributed in the circumferential direction, with an interval of 120°, corresponding to the sliders 14 in the crank-slider mechanism 4 .

[0037] In a specific application example, the constraint cover 5 is fastened to the water-cooled base 3. The constraint cover 5 is used to constrain the slider 14, and together with the slide groove on the water-cooled base 3, constrains the slider 14 to slide effectively, even if the slider 14 moves freely in the slide groove in the water-cooled base 3.

[0038] In a specific application example, the roller 6 cooperates with the claw 11 through the fixing pin 18. Under the action of the compression spring 12, the roller 6 fully contacts the curved surface of the slider 14 in the crank-slider mechanism 4, so that the slider 14 effectively drives the claw 11.

[0039] In a specific application example, the thermal insulation plate 7 is installed between the water-cooled base 3 and the carrier plate 13, separated by a gasket 8, to provide thermal insulation within the vacuum environment. The upper and lower surfaces of the thermal insulation plate 7 create gaps between the carrier plate 13 and the water-cooled base 3, respectively. When the carrier plate 13 is hot, these gaps effectively isolate heat transfer between the carrier plate 13 and the water-cooled base 3 within the vacuum environment.

[0040] In this specific application, the carrier plate 13 serves as the main heating unit. The main body consists of two layers, with a printed heating coil between them. The plate undergoes a static pressing process followed by high-temperature binder removal and sintering. The carrier plate 13 heats the wafers by energizing the internal heating coils, achieving a maximum temperature of 700°C with a uniform temperature rise and maintaining structural stability during the heating process.

[0041] Furthermore, the heating coil is printed on the inside of the carrier plate 13 using a screen printing process. The coil width of the heating coil is controlled within 0.05 mm, the coil thickness of the heating coil is uniform, and the heating coil layout is reasonable, so that the heated object is heated evenly and the temperature rise is small within a diameter of 300 mm.

[0042] In a specific application example, the heating coil connector 9 is mounted on the water-cooled base 3 and sealed at its junction with the water-cooled base 3. The heating coil connector 9 interfaces with the heating coil lead terminals in a vacuum environment and leads to the atmosphere. When the carrier plate 13 is in use at room temperature, the heating coil connector 9 has no external lead wires and only serves as a seal.

[0043] In a specific application example, the temperature sensor connector 10 is installed on the water-cooled base 3 and is sealed at the joint with the water-cooled base 3. The temperature sensor connector 10 is docked with the temperature sensor lead terminal in a vacuum and is led to the atmospheric environment.

[0044] Furthermore, the temperature sensor is bonded to the carrier plate 13 and measures a temperature above 700° C. with a temperature control accuracy of ±1° C.

[0045] In a specific application example, according to actual application requirements and different operating temperatures, the carrier plate 13 can be replaced with a high-temperature carrier plate and a normal-temperature carrier plate.

[0046] In a specific application example, the clamping claws 11 are hingedly connected to the water-cooling base 3 via the rotating shaft 17 , and driven by the compression spring 12 , the three clamping claws 11 are in a clamping state.

[0047] During operation: When the drive base 25 rises under the drive of the push rod 2, the slider 14 in the crank-slider mechanism 4 drives the roller 6 mounted on the claw 11 through the curved surface at the end, causing the claw 11 to rotate and gradually open, releasing the load 6. After the load 6 is released, the push rod 2 begins to contact the load 6, driving it upward.

[0048] When the push rod 2 descends, the load 6 is lowered along with the push rod 2 under the action of gravity; when the load 6 contacts the carrier plate 13, the roller 6 on the claw 11 moves to the end curved surface of the slider 14; at this time, the claw 11 is in a clamping state under the action of the compression spring 12, clamping the load 6; the rise and fall of the load 6 is accompanied by the opening and clamping of the claw 11, which is a synchronous process. During this process, there is no interference between the claw 11 and the load 6.

[0049] See also Figure 1 As shown, in a specific application example, an adapter plate 1 is provided at one end of the water-cooled base 3, and a pad 8, a heat insulation plate 7, a pad 8 and a carrier plate 13 are arranged in sequence at the other end. The pad 8 is used to form a gap and insulation between the water-cooled base 3 and the heat insulation plate 3 as well as the heat insulation plate 3 and the carrier plate 13.

[0050] In order to ensure the flatness of the functional surface of the carrier plate 13 after installation, the following Figure 3 and Figure 4 The mounting assembly shown in the figure includes a screw 22, a spacer 21, a pressure cap 23, and a spring 24, which are connected in sequence. The spacer 21 provides insulation and heat insulation, and the spring 24 reduces the difficulty of adjusting the flatness of the functional surface of the carrier plate 13. The spring 24 also effectively eliminates thermal deformation caused by high temperatures. Especially when using a high-temperature carrier plate, it can effectively absorb deformation caused by the carrier plate 13 and other components at high temperatures, thereby ensuring the flatness of the functional surface of the carrier plate 13.

[0051] The above are merely preferred embodiments of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions based on the principles of the present invention are within the scope of protection of the present invention. It should be noted that for those skilled in the art, various improvements and modifications that do not depart from the principles of the present invention should be considered within the scope of protection of the present invention.

Claims

1. A mechanical chuck device, characterized in that: The invention comprises a carrier plate, a water-cooled base and a clamping claw supported on the water-cooled base, a water-cooled base, a crank-slider mechanism, a heating coil connector and a temperature sensor connector; a cooling pipe is provided inside the water-cooled base, and a cooling medium is introduced into the cooling pipe when the carrier plate is at a high temperature to cool the components outside the carrier plate; the crank-slider mechanism comprises more than three groups of cranks and sliders, and the more than three groups of cranks and sliders are evenly distributed in the circumferential direction, corresponding to the clamping claws evenly distributed in the circumference; a slide groove is provided inside the water-cooled base to constrain the sliding of the slider; the slider is used to drive the roller to drive the clamping claw to rotate around the rotating axis to realize the loosening and clamping actions; the crank The driving base in the handle-slider mechanism is hinged to one end of the crank through the second core shaft, and the other end of the crank is hinged to the slider through the first core shaft, which is used to drive the claws, so that the claws rotate regularly around the rotating axis according to the cam curve of the slider, so as to realize the clamping and releasing of the load; the driving base and the push rod are hard connected, when the push rod moves up and down to drive the load, the crank is driven to rotate around the second core shaft, and the crank drives the slider to slide in the slide groove of the water-cooled base through the first core shaft; the roller is matched with the claw through the fixing pin, and under the action of the compression spring, the roller is in full contact with the curved surface of the slider in the crank-slider mechanism, so that the slider drives the claws.

2. The mechanical chuck device according to claim 1, wherein: The slider is provided with a constraint cover plate, and the guide groove formed by the slide groove and the constraint cover plate is used to enable the slider to slide effectively in the slide groove; the constraint cover plate is fastened to the water-cooling base.

3. The mechanical chuck device according to any one of claims 1 or 2, characterized in that: A heat insulation plate is installed between the water-cooled base and the carrier plate, separated by a pad; the upper and lower surfaces of the heat insulation plate respectively form gaps between the carrier plate and the water-cooled base to isolate heat transfer between the carrier plate and the water-cooled base.

4. The mechanical chuck device according to any one of claims 1 or 2, characterized in that: The heating coil connector is mounted on a water-cooled base and is sealed at the junction with the water-cooled base. The heating coil connector is docked with the heating coil lead-out terminal in a vacuum and is led to the atmospheric environment.

5. The mechanical chuck device according to any one of claims 1 or 2, characterized in that: The temperature sensor connector is mounted on a water-cooled base and is sealed at its junction with the water-cooled base. The temperature sensor connector is docked with the temperature sensor lead-out terminal in a vacuum and is led to the atmospheric environment.

6. The mechanical chuck device according to any one of claims 1 or 2, characterized in that: The carrier plate is a high-temperature carrier plate or a conventional-temperature carrier plate.

7. The mechanical chuck device according to any one of claims 1 or 2, characterized in that: There are holes for installing compression springs and rotating shafts on the circumference of the water-cooling base. The water-cooling base is connected to the carrier plate by screws. The screws first pass through the spacer, and then pass through the pressure cap and the spring in sequence to connect to the carrier plate.

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