A wafer flipping mechanism

Abstract

The present invention belongs to the field of wafer technology, and in particular to a wafer flipping mechanism, comprising a housing, and also comprising a control screen, a camera, an entry and exit device, a flipping device, and a self-locking device mounted on the housing. The wafer flipping mechanism, by providing an entry and exit device, can flip the wafer outside the housing when flipping it, without requiring space for flipping the wafer inside the housing, and without affecting the robot arm's ability to take the next wafer for cleaning. The wafer can be moved in two directions, front and back, by moving the rack. When the holding seat is located in front of the housing, it is convenient to take and place the wafer. When it is located at the rear of the housing, it is convenient to flip the wafer, thereby automatically flipping the wafer, solving the technical problem that the existing wafer needs to be flipped after cleaning, and the cleaning efficiency is reduced by flipping it by the robot arm.

Description

Technical Field

[0001] This invention relates to the field of wafer technology, and more particularly to a wafer flipping mechanism. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. Various circuit element structures can be fabricated on silicon wafers to become IC products with specific electrical functions.

[0003] In the existing wafer cleaning process, a robotic arm adsorbs the lower surface (non-cleaning side) of the wafer, removes it from the basket, and places it on the cleaning machine to clean the upper surface (cleaning side). After cleaning, the robotic arm adsorbs the lower surface of the wafer again and places it back into the basket. This results in the cleaned side of the wafer facing upwards. When the robotic arm removes a wafer, dust is shaken off, causing dust to adhere to the cleaned side and affecting the quality of wafer cleaning. The existing basket only serves to hold the wafer and cannot flip the cleaned wafer, or use a robotic arm with a flipping function. This operation increases the robotic arm's movement and affects cleaning efficiency. After the robotic arm flips the wafer downwards, it only uses negative pressure to fix the wafer. If the negative pressure suction of the robotic arm malfunctions, the adsorbed wafer will fall off, increasing production losses. Summary of the Invention

[0004] To address the technical problem that existing wafer cleaning processes require flipping the wafer to prevent dust from falling onto the cleaned surface and affecting wafer quality, and that flipping with a robotic arm reduces cleaning efficiency, this invention proposes a wafer flipping mechanism.

[0005] The present invention proposes a wafer flipping mechanism, which includes a housing, and further includes a control screen, a camera, an entry / exit device, a flipping device, and a self-locking device mounted on the housing;

[0006] The camera is fixedly mounted on the outer surface of the housing of the control screen, and the camera captures the actions of the robotic arm that holds the wafer.

[0007] An infeed / outfeed device is disposed inside the housing and pushes the wafers to be cleaned and the wafers after cleaning to the outside of the housing. The infeed / outfeed device includes a holding base for holding the wafers, a drive mechanism, and an infeed / outfeed mechanism. The drive mechanism includes a transmission gear, and the movement of the transmission gear drives the infeed / outfeed mechanism at different levels to move. The infeed / outfeed mechanism includes a moving block, and the moving block drives the holding base to move back and forth horizontally under the rotation of the transmission gear.

[0008] A flipping device, comprising a flipping gear for flipping, wherein the flipping mechanism is located on one side of the moving block, and the rotation of the flipping gear drives the holding seat to flip over.

[0009] A self-locking device is disposed inside the holder and performs a fixing action on the wafer within the holder. The self-locking device includes a fixing mechanism and a locking mechanism. The fixing mechanism includes a fixing block. When the wafer is flipped, the rising of the fixing block supports and fixes the wafer within the holder. When the wafer is removed, the falling of the fixing block releases the fixing action on the wafer within the holder. The locking mechanism includes a magnetic ball and a fixing groove. The outer surface of the magnetic ball magnetically attracts the inner wall of the fixing groove to fix the fixing block.

[0010] Preferably, the drive mechanism further includes a drive motor fixedly installed on the inner wall of the lower end of the housing. The output shaft of the drive motor is fixedly installed with a rotating shaft through a coupling. One end of the rotating shaft is slidably inserted into the inner wall of the transmission gear to drive the rotation of the transmission gear.

[0011] An adjusting motor is fixedly installed on the upper inner wall of the housing. The output shaft of the adjusting motor is fixedly installed with a lead screw through a coupling. A moving plate is threadedly connected to the outer surface of the lead screw. The lower surface of the moving plate is rotatably connected to the outer surface of the transmission gear through a bearing to drive the transmission gear to lift and limit the moving plate. A distance sensor is fixedly installed on the lower inner wall of the housing to detect the position of the moving plate inside the housing.

[0012] Through the above technical solution, the rotation of the lead screw enables the transmission gear to mesh with different moving gears, thereby controlling the entry and exit of the holding seats at different levels.

[0013] Preferably, the in-and-out mechanism further includes a limiting groove, the outer surface of which is fixedly installed to the outer surface of the outer shell and extends through the inner wall of the outer shell to its interior. The outer surface of the moving block is slidably inserted into the inner top wall of the limiting groove. A moving rack is fixedly installed on the outer surface of the moving block. A moving gear is rotatably connected to the inner wall of the limiting groove. The outer surface of the moving gear meshes with the outer surface of the moving rack and the outer surface of the moving gear meshes with the outer surface of the transmission gear.

[0014] Through the above technical solution, the rotation of the transmission gear drives the rotation of the moving gear, thereby driving the moving rack that meshes with the moving gear to move horizontally. By raising and lowering the transmission gear, it can mesh with moving gears at different levels, enabling multiple containers to move in and out through a single drive motor.

[0015] Preferably, the inner bottom wall of the limiting groove is fixedly installed with symmetrically distributed lower contact pieces, and the lower surface of the moving rack is fixedly installed with an upper contact piece. The upper surface of the lower contact piece is electrically connected to the lower surface of the lower contact piece to realize the limiting action of the moving rack.

[0016] Through the above technical solution, the moving rack has two different upper contact plates. After the two upper contact plates contact the lower contact plate in the limiting groove, different resistances are generated to determine the position of the moving rack. When both upper contact plates of the moving rack are in contact with the lower contact plate, the moving rack is in the reset state. After the moving rack moves, different upper contact plates contact the lower contact plate and generate different resistance values, which can determine the position of the moving rack. At the same time, it is convenient to stop the drive motor and know the position of the moving rack, so as to drive the holding seat to the required position.

[0017] Preferably, the flipping device further includes a flipping housing mounted on the outer surface of the moving block. The flipping housing has an inverted U-shaped cross-section. A dual-axis motor is fixedly mounted on the inner wall of the flipping housing. Half gears are mounted on the inner walls of both ends of the flipping housing through bearings. One end of the output shaft of the dual-axis motor drives the half gear to rotate through the cooperation of a belt and a pulley. The outer surface of the half gear meshes with the outer surface of the flipping gear to drive the container to flip.

[0018] The above technical solution enables the flipping of the holding seat and the movement of the fixed block by the rotation of a half gear, which reduces the investment in the drive source and the production cost. After the half gear meshes with the outer surface of the flipping gear, the half gear can drive the flipping gear to rotate one full turn by rotating half a turn.

[0019] Preferably, a connecting shaft is fixedly installed on both outer surfaces of the holding base. One end of the connecting shaft passes through the inner wall of the flipping housing and is rotatably connected to the inner side wall of the flipping housing through a bearing. The other end of the connecting shaft is fixedly installed on the inner wall of the flipping gear.

[0020] The above technical solution enables the wafer to be flipped by rotating the connecting shaft, thereby flipping the wafer.

[0021] Preferably, the inner wall of the flip-out housing is fixedly installed with a plug rod with a limit block, and one end of each of the two plug rods is slidably sleeved with an electromagnet for locking the connecting shaft. The two electromagnets are symmetrically distributed, and the electromagnets have a semi-circular notch adapted to the connecting shaft. A reset spring for resetting the electromagnet is sleeved on the outer surface of the plug rod.

[0022] The above technical solution involves energizing two symmetrical electromagnets. After the electromagnets move on the plug rod, they attract each other, clamping the connecting shaft in the middle of the electromagnets and preventing the connecting shaft from rotating on its own, which would affect the wafer flipping.

[0023] Preferably, the fixing mechanism further includes a transmission rod with gears, the two ends of which are rotatably connected to the inner wall of the flipping housing via bearings. The outer surface of the gears of the transmission rod meshes with the outer surface of the half gears to drive the rotation of the transmission rod. A fixed shaft is mounted on the inner wall of the housing via a bearing seat, and one end of the transmission rod drives the rotation of the fixed shaft via a gear set.

[0024] With the above technical solution, after the half gear rotates to one side of the transfer rod, it can drive the transfer rod to rotate. One rotation of the half gear can complete the self-locking of the wafer and the flipping of the container.

[0025] Preferably, a fixed missing gear is fixedly installed at one end of the fixed shaft, the outer surface of the holding seat is slidably inserted into the outer surface of the fixed block, a fixed rack is fixedly installed on the outer surface of the fixed block, and the outer surface of the fixed missing gear meshes with the outer surface of the fixed rack.

[0026] Through the above technical solution, the rotation of the fixed missing gear can drive the fixed rack to rise and fall, so that the fixed block can be located inside the container, supporting the two sides of the wafer inserted in the container and preventing the wafer from falling off when flipping. At the same time, when the fixed missing gear rotates to a place without tooth grooves, it does not mesh with the fixed rack, so that the fixed rack does not cause obstruction when the container flips.

[0027] Preferably, the locking mechanism further includes a locking groove formed inside the holding seat, a telescopic rod is fixedly installed on the inner wall of the locking groove, one end of the telescopic rod is fixedly installed on the outer surface of the magnetic ball through a connecting plate, a connecting spring for resetting the magnetic ball is fixedly installed on the inner wall of the locking groove, the fixing groove is formed on the outer surface of the fixing block, and the outer surface of the magnetic ball is slidably inserted into the inner wall of the fixing groove.

[0028] The above technical solution uses a telescopic rod to limit the magnetic ball, and a return spring to reset the magnetic ball. The magnetic ball is inserted into the fixing groove and can be attracted to the inner wall of the fixing groove to limit the fixing block. This makes it easy to fix the fixing block inside the holding base and achieve the support and fixation of the wafer.

[0029] The beneficial effects of this invention are as follows:

[0030] 1. By setting up an infeed / outfeed device, the wafer can be flipped from outside the housing, eliminating the need for space inside the housing for wafer flipping. This does not affect the robotic arm's ability to pick up the next wafer for cleaning. The movement of the rack and pinion drives the wafer to move in both forward and backward directions. When the holder is in front of the housing, it facilitates the picking and placing of the wafer; when it is behind the housing, it facilitates the flipping of the wafer. This allows for automatic wafer flipping, solving the technical problem of existing wafer cleaning methods that require flipping after cleaning to prevent dust from falling on the cleaned surface and affecting wafer quality, and the reduced cleaning efficiency caused by using a robotic arm for flipping.

[0031] 2. By setting up a flipping device, when flipping the wafer, the holder holding the wafer can be driven to flip. Driven by a dual-axis motor, the flipping gear is rotated to flip the wafer, keeping the cleaned side of the wafer facing down. The holder can be locked after flipping by the attraction of an electromagnet to prevent the holder from deflecting on its own, which would cause the wafer to be not in a horizontal state and affect subsequent handling.

[0032] 3. By setting a self-locking device, the wafer is fixed during the flipping process. Driven by a dual-axis motor, the fixing block can be raised and lowered to support the lower end of the wafer, preventing the wafer from falling off the holder. This prevents the wafer from moving and being damaged during the flipping process. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of a wafer flipping mechanism proposed in this invention;

[0034] Figure 2 This is a perspective view of the adjusting motor structure of a wafer flipping mechanism proposed in this invention;

[0035] Figure 3 This is a perspective view of the lead screw structure of a wafer flipping mechanism proposed in this invention;

[0036] Figure 4 This is a perspective view of the drive motor structure of a wafer flipping mechanism proposed in this invention;

[0037] Figure 5This is a perspective view of the moving rack structure of a wafer flipping mechanism proposed in this invention;

[0038] Figure 6 This is a perspective view of the lower contact plate structure of a wafer flipping mechanism proposed in this invention;

[0039] Figure 7 This is a perspective view of a dual-axis motor structure for a wafer flipping mechanism proposed in this invention;

[0040] Figure 8 This is a perspective view of a half-gear structure of a wafer flipping mechanism proposed in this invention;

[0041] Figure 9 This is a perspective view of the electromagnet structure of a wafer flipping mechanism proposed in this invention;

[0042] Figure 10 This is a perspective view of the holding structure of a wafer flipping mechanism proposed in this invention;

[0043] Figure 11 This is a perspective view of the fixed shaft structure of a wafer flipping mechanism proposed in this invention;

[0044] Figure 12 This is a perspective view of a fixed missing gear structure for a wafer flipping mechanism proposed in this invention;

[0045] Figure 13 This is a perspective view of the fixed rack structure of a wafer flipping mechanism proposed in this invention;

[0046] Figure 14 This is a perspective view of the fixing block structure of a wafer flipping mechanism proposed in this invention.

[0047] In the diagram: 1. Outer shell; 11. Control panel; 12. Camera; 20. Container; 2. Drive motor; 21. Rotating shaft; 22. Transmission gear; 23. Adjustment motor; 24. Lead screw; 25. Moving plate; 26. Distance sensor; 3. Limiting groove; 31. Moving block; 32. Moving rack; 33. Moving gear; 34. Lower contact piece; 35. Upper contact piece; 4. Flipping shell; 41. Dual-axis motor; 42. Half gear; 5. Connecting shaft; 51. Flipping gear; 52. Insertion rod; 53. Electromagnet; 54. Return spring; 6. Transmission rod; 61. Fixed shaft; 62. Fixed missing gear; 63. Fixed block; 64. Fixed rack; 7. Locking groove; 71. Telescopic rod; 72. Magnetic ball; 73. Connecting spring; 74. Fixed groove. Detailed Implementation

[0048] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0049] Referring to Figure 1-14 , a wafer flipping mechanism includes a housing 1. The cross-section of the housing 1 is in the shape of a Chinese character 'hui', and further includes a control screen 11, a camera 12, an inlet / outlet device, a flipping device, and a self-locking device installed on the housing 1;

[0050] The camera 12 is fixedly installed on the outer surface of the housing of the control screen 11. When the control screen 11 is foldable, it is convenient to adjust the screen angle of the control screen 11. The control screen 11 can display the quantity of wafers after cleaning, and at the same time can manually control the inlet / outlet device, the flipping device, and the self-locking device, which is convenient for manual operation. The camera 12 captures the actions of the manipulator holding the wafer. After the actions of the manipulator are captured by the camera 12, it can automatically control the inlet / outlet device to move in and out, which is convenient for the manipulator to place the wafer on the inlet / outlet device.

[0051] As Figure 2-6 shown, in order to ensure that when the wafer is flipped, it does not affect the manipulator's picking up of other wafers, an inlet / outlet device is provided. The inlet / outlet device is located inside the housing 1 and pushes the wafers to be cleaned and the wafers after cleaning to the outside of the housing 1. The existing wafer basket for holding wafers cannot flip the wafers. After the cleaned wafers are sent into the basket by the manipulator, the cleaning surface is facing up, which is likely to cause dust to shake off when the manipulator picks up the next wafer, resulting in contamination of the cleaned wafers. The inlet / outlet device includes a holding seat 20 for holding wafers, a driving mechanism, and an inlet / outlet mechanism. The groove for holding wafers inside the holding seat 20 is in the shape of an arch, which is convenient for the manipulator to pick up, and at the same time, the curved end can limit the wafer, which is convenient for supporting the wafer during flipping.

[0052] The driving mechanism includes a transmission gear 22. The movement of the transmission gear 22 drives the inlet / outlet mechanisms at different levels to move. The inlet / outlet mechanism includes a moving block 31. The moving block 31 drives the holding seat 20 to perform a horizontal forward and backward movement under the rotation of the transmission gear 22.

[0053] Specifically, in order to drive multiple holding seats 20 to move in and out of the housing 1, the driving mechanism further includes a driving motor 2 fixedly installed on the inner wall of the lower end of the housing 1. The output shaft of the driving motor 2 is fixedly installed with a rotating shaft 21 through a coupling. One end of the rotating shaft 21 is rotatably connected to the outer surface of the housing 1 through a bearing. One end of the rotating shaft 21 is slidably inserted into the inner wall of the transmission gear 22 to drive the transmission gear 22 to rotate while not affecting the lifting of the transmission gear 22;

[0054] To enable a drive motor 2 to move the multi-layer container 20 in and out of the outer casing 1, an adjustment motor 23 is fixedly installed on the upper inner wall of the outer casing 1. The output shaft of the adjustment motor 23 is fixedly installed with a lead screw 24 via a coupling. One end of the lead screw 24 is rotatably connected to the inner wall of the outer casing 1 via a bearing. To adjust the position of the transmission gear 22, a moving plate 25 is threadedly connected to the outer surface of the lead screw 24. The lower surface of the moving plate 25 is rotatably connected to the outer surface of the transmission gear 22 via a bearing to drive the transmission gear 22 to lift and limit the movement of the moving plate 25. A distance sensor 26 is fixedly installed on the lower inner wall of the outer casing 1 to detect the position of the moving plate 25 inside the outer casing 1.

[0055] Specifically, in order to convert the rotation of the transmission gear 22 into the movement of the container 20, the in-and-out mechanism also includes a limiting groove 3. After the outer surface of the limiting groove 3 is fixedly installed to the outer surface of the outer shell 1, one side extends through the inner wall of the outer shell 1 into its interior, so that the transmission gear 22 can drive the moving block 31 to move. The outer surface of the moving block 31 is slidably inserted into the inner top wall of the limiting groove 3. A moving rack 32 is fixedly installed on the outer surface of the moving block 31. In order to drive the moving rack 32 to move back and forth, a moving gear 33 is rotatably connected to the inner wall of the limiting groove 3. The outer surface of the moving gear 33 meshes with the outer surface of the moving rack 32, and the outer surface of the moving gear 33 meshes with the outer surface of the transmission gear 22.

[0056] To limit and control the movement of the rack 32, symmetrically distributed lower contact pieces 34 are fixedly installed on the inner bottom wall of the limiting groove 3. This facilitates the identification of the position of the rack 32 within the limiting groove 3. An upper contact piece 35 is fixedly installed on the lower surface of the rack 32. The upper and lower surfaces of the lower contact pieces 34 are electrically connected to each other to limit the movement of the rack 32. There are two lower contact pieces 34 and two upper contact pieces 35. The resistance values ​​of the two upper contact pieces 35 are different. The position of the rack 32 is determined by the different resistance values ​​generated when they come into contact with the lower contact pieces 34. Alternatively, the upper contact pieces 35 can be replaced with photoelectric switch transmitters, and the photoelectric switch receivers of the lower contact pieces 34 can be used to determine the position of the rack 32.

[0057] like Figure 7-9 As shown, in order to achieve automatic flipping of the wafer, a flipping device is provided. The flipping device includes a flipping gear 51 for flipping. The flipping mechanism is located on one side of the moving block 31. The rotation of the flipping gear 51 drives the holding seat 20 to perform the flipping action.

[0058] Specifically, the flipping device also includes a flipping housing 4 installed on the outer surface of the moving block 31. The cross-section of the flipping housing 4 is inverted U-shaped. In order to achieve stable flipping of the wafer, a dual-axis motor 41 is fixedly installed on the inner wall of the flipping housing 4. The dual-axis motor 41 drives the two ends of the holding seat 20 to flip synchronously. In order to drive the holding seat 20 to flip, half gears 42 are installed on the inner walls of both ends of the flipping housing 4 through bearings. One end of the output shaft of the dual-axis motor 41 drives the half gear 42 to rotate through the cooperation of belt and pulley. According to the actual production situation, the cooperation of belt and pulley can also be replaced by synchronous belt and synchronous pulley or chain and sprocket. The outer surface of the half gear 42 meshes with the outer surface of the flipping gear 51 to drive the holding seat 20 to flip. The number of teeth of the half gear 42 is the same as the number of teeth of the flipping gear 51. After the half gear 42 rotates half a turn, it can drive the flipping gear 51 to rotate one turn.

[0059] Furthermore, in order to drive the holding seat 20 to perform a flipping action, connecting shafts 5 are fixedly installed on both outer surfaces of the holding seat 20. One end of the connecting shaft 5 passes through the inner wall of the flipping housing 4 and is rotatably connected to the inner side wall of the flipping housing 4 through a bearing. The other end of the connecting shaft 5 is fixedly installed on the inner wall of the flipping gear 51.

[0060] Furthermore, in order to limit the connecting shaft 5 and prevent the holding seat 20 from rotating on its own, a plug rod 52 with a limit block is fixedly installed on the inner wall of the flip shell 4. One end of each plug rod 52 is slidably sleeved with an electromagnet 53 for locking the connecting shaft 5. The upper end of the electromagnet 53 is slidably inserted with the plug rod 52, which can limit the electromagnet 53 while allowing the electromagnet 53 to rise and fall. The two electromagnets 53 are symmetrically distributed. The appearance of the electromagnet 53 is a semi-circular notch adapted to the connecting shaft 5. After the two electromagnets 53 are attracted, the notch forms a complete circle shape to clamp the connecting shaft 5. A reset spring 54 for resetting the electromagnet 53 is sleeved on the outer surface of the plug rod 52. The two ends of the reset spring 54 are fixedly installed on the outer surfaces of the plug rod 52 and the electromagnet 53, respectively.

[0061] like Figure 10-14As shown, a self-locking device is provided to support and fix the wafer during the wafer flipping process. The self-locking device is located inside the holding base 20 and fixes the wafer inside the holding base 20. In order to reduce the contact surface with the wafer and prevent contamination of the wafer cleaning surface, the self-locking device includes a fixing mechanism and a locking mechanism. The fixing mechanism includes a fixing block 63, one end of which is arc-shaped to facilitate contact with the outer surface of the wafer. When flipping the wafer, the lifting of the fixing block 63 supports and fixes the wafer inside the holding base 20. When removing the wafer, the lowering of the fixing block 63 releases the wafer from the holding base 20. The locking mechanism includes a magnetic ball 72 and a fixing groove 74. The outer surface of the magnetic ball 72 magnetically attracts the inner wall of the fixing groove 74 to fix the fixing block 63.

[0062] Specifically, in order to control the movement of the fixed block 63 by rotating a half gear 42, the fixing mechanism also includes a transmission rod 6 with a gear. The gear of the transmission rod 6 has the same number of teeth as the flip gear 51. The two ends of the transmission rod 6 are rotatably connected to the inner wall of the flip housing 4 through bearings. In order to drive the rotation of the transmission rod 6, the outer surface of the gear of the transmission rod 6 meshes with the outer surface of the half gear 42 to drive the rotation of the transmission rod 6. In order to drive the fixed block 63 to automatically lift and lower, a fixed shaft 61 is installed on the inner wall of the housing 1 through a bearing seat. One end of the transmission rod 6 drives the rotation of the fixed shaft 61 through a gear set.

[0063] Furthermore, in order to drive the lifting and lowering of the fixed block 63, a fixed gear 62 is fixedly installed at one end of the fixed shaft 61. In order to limit the movement of the fixed block 63, the outer surface of the container 20 is slidably inserted into the outer surface of the fixed block 63. A fixed rack 64 is fixedly installed on the outer surface of the fixed block 63. The outer surface of the fixed gear 62 meshes with the outer surface of the fixed rack 64 to realize the automatic lifting and lowering of the fixed block 63, which can support the wafer after it is attached to the outer side of the wafer.

[0064] Furthermore, in order to fix the fixing block 63, the locking mechanism also includes a locking groove 7 inside the holding seat 20. In order to limit the magnetic ball 72, a telescopic rod 71 is fixedly installed on the inner wall of the locking groove 7. One end of the telescopic rod 71 is fixedly installed on the outer surface of the magnetic ball 72 through a connecting plate. In order to facilitate the magnetic ball 72 to reset after the fixing block 63 is compressed, a connecting spring 73 for resetting the magnetic ball 72 is fixedly installed on the inner wall of the locking groove 7. The two ends of the connecting spring 73 are fixedly installed on the inner wall of the locking groove 7 and the outer surface of the connecting plate, respectively. The fixing groove 74 is opened on the outer surface of the fixing block 63. The outer surface of the magnetic ball 72 is slidably inserted into the inner wall of the fixing groove 74. The magnetic ball 72 is magnetic and can be magnetically connected to the inner wall of the fixing groove 74. The fixing block 63 is fixed by inserting the magnetic ball 72 into the fixing groove 74. At the same time, the magnetic ball 72 and the fixing groove 74 attract each other to strengthen the fixing of the fixing block 63 and prevent the position of the fixing block 63 from changing.

[0065] Working principle: When the robotic arm needs to pick up the wafers in the holding tray 20 for cleaning, after the empty robotic arm approaches the outer shell 1, the camera 12 captures the robotic arm and controls the drive motor 2 inside the outer shell 1 to start. The drive motor 2 drives the rotating shaft 21 to rotate, and the rotating shaft 21 drives the transmission gear 22 that is sleeved with it to rotate. The rotation of the transmission gear 22 drives the rotation of the moving gear 33 in the limiting groove 3. After the moving gear 33 rotates, it drives the moving rack 32 that meshes with it to move forward in the limiting groove 3 towards the outer shell 1. When the moving rack 32 moves, the upper contact piece 35 at the rear end of the moving rack 32 contacts the lower contact piece 34 of the limiting groove 3 near the front end of the outer shell 1, generating a resistance value. The drive motor 2 stops driving the rotating shaft 21. At the same time, the moving rack 32 drives the flipping shell 4 to move out of the outer shell 1 through the moving block 31. The holding seat 20 on the flipping shell 4 drives the wafer to move out of the outer shell 1. After the wafer moves out of the outer shell 1, one end of the robot arm is attracted by the negative pressure of the lower surface of the wafer in the holding seat 20, and then drives the wafer into the cleaning machine to clean the upper surface of the wafer.

[0066] After the wafer cleaning is completed, the robotic arm applies negative pressure to the lower surface of the wafer again and removes the wafer, turning the wafer towards the outer casing 1. The camera 12 on the outer casing 1 captures the presence of the wafer and the robotic arm. After the robotic arm places the wafer into the holding tray 20 located outside the outer casing 1, the camera 12 captures the wafer in place and the robotic arm leaves. Then, the drive motor 2 starts, driving the moving rack 32 to move, causing the holding tray 20 to move towards the rear of the outer casing 1 to perform the wafer flipping action. After the contact piece 35 on the front end of the moving rack 32 contacts the lower contact piece 34 on the inner wall of the rear end of the limiting groove 3, the generated resistance value causes the drive motor 2 to stop, and the holding tray 20 is located outside the rear side of the outer casing 1.

[0067] The adjusting motor 23 in the housing 1 drives the rotation of the lead screw 24. The adjusting plate, which is threadedly connected to the lead screw 24, can drive the transmission gear 22, which is mounted with the lead screw 24, to rise and fall. After the transmission gear 22 disengages from the moving gear 33 it is meshing with, it meshes with the moving gear 33 above or below it. The position of the moving gear 33 is determined by the distance sensor 26, and the adjusting motor 23 is controlled to stop driving the lead screw 24 to rotate. The drive motor 2 starts again, driving the next holding seat 20 to move towards the front of the housing 1, so that the robot arm can pick up the next wafer for cleaning.

[0068] Simultaneously, the dual-axis motor 41 inside the flipping housing 4 starts, driving the rotation of the half gear 42 through the cooperation of the belt and pulley. After the half gear 42 meshes with the gear on the transmission rod 6, it drives the transmission rod 6 to rotate one revolution. After the transmission rod 6 rotates one revolution, it drives the fixed shaft 61 inside the flipping housing 4 to rotate through the transmission of the gear plate assembly. The fixed shaft 61 drives the fixed missing gear 62 to rotate one revolution. The fixed missing gear 62 rotates and the fixed rack 64 meshing with it rises. The fixed rack 64 drives the fixed block 63 on the holding base 20 to disengage the upper fixing groove 74 from the magnetic ball 72. After the fixed block 63 rises, the fixed block 63... During the process, the fixing block 63 presses the magnetic ball 72 on the holding base 20, and the magnetic ball 72 can retract into the locking groove 7. The telescopic rod 71 and the connecting spring 73 are compressed. When the magnetic ball 72 encounters the fixing groove 74 of the fixing block 63, the magnetic ball 72 is reset under the elastic force of the connecting spring 73. The magnetic ball 72 is inserted into the fixing groove 74 and simultaneously adsorbed to the inner wall of the fixing groove 74. The fixing block 63 contacts and adheres to the outer side of the wafer in the holding base 20. The rotation of the fixing gear 62 one turn makes the side without the tooth groove face down to fix the rack 64, which does not hinder the subsequent rotation of the fixing rack 64 with the holding base 20.

[0069] After the electromagnet 53 inside the flip housing 4 is de-energized, it releases the clamping of the connecting shaft 5. The electromagnet 53 is reset under the force of the reset spring 54 on the plug rod 52. The half gear 42 continues to rotate, and after disengaging from the gear on the transmission rod 6, it engages with the flip gear 51 on the connecting shaft 5, causing the connecting shaft 5 to rotate one revolution. This causes the holding seat 20 to flip the wafer. After the flipping is completed, the electromagnet 53 is energized again to clamp and fix the connecting shaft 5.

[0070] The adjusting motor 23 drives the transmission gear 22 to rise and fall again. After meshing with the previous transmission gear 22, it drives the rear holding seat 20 to return to the outer shell 1. When the two upper contact pieces 35 of the moving rack 32 come into contact with the two lower contact pieces 34 in the limiting groove 3 and generate two different resistance values, the drive motor 2 stops and the holding seat 20 returns to its original position.

[0071] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A wafer flipping mechanism, comprising a housing (1), characterized in that: It also includes a control panel (11), a camera (12), an entry / exit device, a flipping device, and a self-locking device installed on the housing (1); The camera (12) is fixedly installed on the outer surface of the housing of the control screen (11), and the camera (12) performs capture actions on the robotic arm that holds the wafer; An inlet / outlet device is located inside the housing (1) and pushes the wafers to be cleaned and the wafers after cleaning to the outside of the housing (1). The inlet / outlet device includes a holding base (20) for holding the wafers, a drive mechanism, and an inlet / outlet mechanism. The drive mechanism includes a transmission gear (22). The movement of the transmission gear (22) drives the inlet / outlet mechanism at different levels to move. The inlet / outlet mechanism includes a moving block (31). The moving block (31) drives the holding base (20) to move horizontally back and forth under the rotation of the transmission gear (22). A flipping device, comprising a flipping gear (51) for flipping, wherein the flipping mechanism is located on one side of the moving block (31), and the rotation of the flipping gear (51) drives the holding seat (20) to flip over. The self-locking device is located inside the holding tray (20) and performs a fixing action on the wafer inside the holding tray (20). The self-locking device includes a fixing mechanism and a locking mechanism. The fixing mechanism includes a fixing block (63). When the wafer is flipped, the rising of the fixing block (63) supports and fixes the wafer inside the holding tray (20). When the wafer is removed, the falling of the fixing block (63) releases the fixing action on the wafer inside the holding tray (20). The locking mechanism includes a magnetic ball (72) and a fixing groove (74). The outer surface of the magnetic ball (72) magnetically attracts the inner wall of the fixing groove (74) and performs a fixing action on the fixing block (63).

2. The wafer flipping mechanism according to claim 1, characterized in that: The drive mechanism also includes a drive motor (2) fixedly installed on the inner wall of the lower end of the housing (1). The output shaft of the drive motor (2) is fixedly installed with a rotating shaft (21) through a coupling. One end of the rotating shaft (21) is slidably inserted into the inner wall of the transmission gear (22) to drive the rotation of the transmission gear (22). An adjusting motor (23) is fixedly installed on the upper inner wall of the outer shell (1). The output shaft of the adjusting motor (23) is fixedly installed with a lead screw (24) through a coupling. A moving plate (25) is threadedly connected to the outer surface of the lead screw (24). The lower surface of the moving plate (25) is rotatably connected to the outer surface of the transmission gear (22) through a bearing to drive the transmission gear (22) to lift and limit the moving plate (25). A distance sensor (26) is fixedly installed on the lower inner wall of the outer shell (1). The distance sensor (26) detects the position of the moving plate (25) inside the outer shell (1).

3. The wafer flipping mechanism according to claim 1, characterized in that: The entry and exit mechanism also includes a limiting groove (3). The outer surface of the limiting groove (3) is fixedly installed with the outer surface of the outer shell (1) and extends through the inner wall of the outer shell (1) to its interior. The outer surface of the moving block (31) is slidably inserted into the inner top wall of the limiting groove (3). A moving rack (32) is fixedly installed on the outer surface of the moving block (31). A moving gear (33) is rotatably connected to the inner wall of the limiting groove (3). The outer surface of the moving gear (33) meshes with the outer surface of the moving rack (32). The outer surface of the moving gear (33) meshes with the outer surface of the transmission gear (22).

4. A wafer flipping mechanism according to claim 3, characterized in that: The inner bottom wall of the limiting groove (3) is fixedly installed with symmetrically distributed lower contact pieces (34), and the lower surface of the moving rack (32) is fixedly installed with an upper contact piece (35). The upper surface of the lower contact piece (34) is electrically connected to the lower surface of the lower contact piece (34) to limit the movement of the moving rack (32).

5. A wafer flipping mechanism according to claim 1, characterized in that: The flipping device also includes a flipping housing (4) installed on the outer surface of the moving block (31). The cross-section of the flipping housing (4) is inverted U-shaped. A dual-axis motor (41) is fixedly installed on the inner wall of the flipping housing (4). Half gears (42) are installed on the inner walls of both ends of the flipping housing (4) through bearings. One end of the output shaft of the dual-axis motor (41) drives the half gears (42) to rotate through the cooperation of belt and pulley. The outer surface of the half gears (42) meshes with the outer surface of the flipping gears (51) to drive the container (20) to flip.

6. A wafer flipping mechanism according to claim 5, characterized in that: The outer surfaces of both sides of the holding base (20) are fixedly installed with connecting shafts (5). One end of the connecting shaft (5) passes through the inner wall of the flipping housing (4) and is rotatably connected to the inner side wall of the flipping housing (4) through a bearing. One end of the connecting shaft (5) is fixedly installed to the inner wall of the flipping gear (51).

7. A wafer flipping mechanism according to claim 6, characterized in that: The inner wall of the flip-out housing (4) is fixedly installed with a plug rod (52) with a limit block. One end of each of the two plug rods (52) is slidably sleeved with an electromagnet (53) for locking the connecting shaft (5). The two electromagnets (53) are symmetrically distributed. The appearance of the electromagnet (53) is a semi-circular notch adapted to the connecting shaft (5). The outer surface of the plug rod (52) is sleeved with a reset spring (54) for resetting the electromagnet (53).

8. A wafer flipping mechanism according to claim 5, characterized in that: The fixing mechanism also includes a transmission rod (6) with gears. The two ends of the transmission rod (6) are rotatably connected to the inner wall of the flipping housing (4) through bearings. The outer surface of the gear of the transmission rod (6) meshes with the outer surface of the half gear (42) to drive the transmission rod (6) to rotate. The inner wall of the housing (1) is equipped with a fixed shaft (61) through a bearing seat. One end of the transmission rod (6) drives the fixed shaft (61) to rotate through a gear plate assembly.

9. A wafer flipping mechanism according to claim 8, characterized in that: A fixed missing gear (62) is fixedly installed at one end of the fixed shaft (61). The outer surface of the container (20) is slidably inserted into the outer surface of the fixed block (63). A fixed rack (64) is fixedly installed on the outer surface of the fixed block (63). The outer surface of the fixed missing gear (62) meshes with the outer surface of the fixed rack (64).

10. A wafer flipping mechanism according to claim 1, characterized in that: The locking mechanism also includes a locking groove (7) opened inside the holding seat (20). A telescopic rod (71) is fixedly installed on the inner wall of the locking groove (7). One end of the telescopic rod (71) is fixedly installed on the outer surface of the magnetic ball (72) through a connecting plate. A connecting spring (73) for resetting the magnetic ball (72) is fixedly installed on the inner wall of the locking groove (7). The fixing groove (74) is opened on the outer surface of the fixing block (63). The outer surface of the magnetic ball (72) is slidably inserted into the inner wall of the fixing groove (74).

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