LED lamp beads and electronic equipment

Abstract

The present application provides an LED lamp bead and an electronic device, wherein the LED lamp bead comprises an LED bracket, a light-emitting component, a first packaging glue and a second packaging glue. The LED bracket comprises an insulating seat and a plurality of conductive feet integrally inlaid with the insulating seat, the insulating seat is recessed from the top to form a first reflective cup and a plurality of second reflective cups arranged side by side, the conductive feet have a crystal fixing portion, and the crystal fixing portion is located in the first reflective cup and the second reflective cup; the first reflective cup is located on one side of the insulating seat, and the plurality of second reflective cups are located on the other side of the insulating seat. The light-emitting component comprises a driving chip arranged in the first reflective cup and a plurality of blue light chips respectively arranged in the second reflective cup. The first packaging glue is filled in the first reflective cup; the second packaging glue is respectively filled in the plurality of second reflective cups. The driving chip is electrically connected to the plurality of blue light chips respectively, and the second packaging glue in each second reflective cup contains different phosphors, so that the color of light emitted by each blue light chip through the second packaging glue is different.

Description

Technical Field

[0001] The present application relates to the field of LED technology, and in particular to an LED lamp bead and an electronic device. Background Art

[0002] As a new type of lighting source, LED lamp beads have significant advantages such as energy saving, environmental protection, short response time and long life. At present, the light emission method of LED lamp beads is mainly based on the combination of red, green and blue primary color LED chips or other color LED chips. This method has high efficiency, controllable color temperature and good color rendering, but the different light decay of the three primary color chips leads to unstable color temperature, and the control circuit is complicated, resulting in high R&D costs of LED lamp beads. Summary of the invention

[0003] The present application provides an LED lamp bead and an electronic device, which aims to solve the problem that the current light-emitting method of LED lamp bead is mainly based on the combination of red, green and blue three-primary color LED chips or other color LED chips for light emission. This method has high efficiency, controllable color temperature and good color rendering, but the different light decay of the three-primary color chips leads to unstable color temperature, and the control circuit is complicated, resulting in high R&D cost of LED lamp bead.

[0004] In a first aspect, the present application provides an LED lamp bead, the LED lamp bead comprising:

[0005] The LED bracket comprises an insulating base and a plurality of conductive feet integrally inlaid with the insulating base, the insulating base is concave from the top to form a first reflective cup and a plurality of second reflective cups arranged side by side, the conductive foot has a crystal fixing part, and the crystal fixing part is located in the first reflective cup and the second reflective cup; wherein the first reflective cup is located on one side of the insulating base, and the plurality of second reflective cups are located on the other side of the insulating base;

[0006] A light-emitting component, the light-emitting component includes a driving chip and a plurality of blue light chips, the driving chip is arranged on the crystal-fixing part in the first reflective cup, the plurality of blue light chips are respectively arranged on the crystal-fixing part in the second reflective cup, and each second reflective cup includes at least one blue light chip;

[0007] A first packaging glue is filled in the first reflective cup and covers the driver chip;

[0008] A second packaging glue is respectively filled in the plurality of second reflective cups and covers the blue light chip;

[0009] The driving chip is electrically connected to the plurality of blue light chips respectively, and the second packaging glue in each second reflective cup contains different phosphors, so that the driving chip controls the blue light chip in each second reflective cup to emit light of different colors through the second packaging glue.

[0010] In a second aspect, the present application provides an electronic device, including an LED lamp bead as provided in any embodiment of the present application.

[0011] The present application provides an LED lamp bead, which includes an LED bracket, a light-emitting component, a first packaging glue and a second packaging glue. The LED bracket includes an insulating seat and a plurality of conductive feet integrally inlaid with the insulating seat, the insulating seat is recessed from the top to form a first reflective cup and a plurality of second reflective cups arranged side by side, the conductive feet have a solid crystal part, and the solid crystal part is located in the first reflective cup and the second reflective cup; wherein the first reflective cup is located on one side of the insulating seat, and the plurality of second reflective cups are located on the other side of the insulating seat. The light-emitting component includes a driver chip and a plurality of blue light chips, the driver chip is arranged on the solid crystal part in the first reflective cup, and the plurality of blue light chips are respectively arranged on the solid crystal part in the second reflective cup, and each second reflective cup includes at least one blue light chip. The first packaging glue is filled in the first reflective cup and covers the driver chip; the second packaging glue is respectively filled in the plurality of second reflective cups and covers the blue light chip. The driving chip is electrically connected to the plurality of blue light chips respectively, and the second packaging glue in each second reflective cup contains different phosphors, so that the driving chip controls the blue light chip in each second reflective cup to emit light of different colors through the second packaging glue.

[0012] The LED lamp beads provided have at least the following beneficial effects:

[0013] 1. Multi-color light output: By using different phosphors in different reflective cups, the output of multiple colors of light is achieved, which enhances the color expression and application flexibility of LED lamp beads.

[0014] 2. Precise color control: The driver chip can independently control each blue light chip, achieving precise color mixing and adjustment capabilities. For example, the color temperature and lumen value of the emitted light combined with the ratio of phosphors can also be precisely controlled to meet diverse application requirements.

[0015] 3. Improve luminous efficiency: The reflective cup design enhances the light reflection effect and improves the overall luminous efficiency of the LED lamp beads.

[0016] 4. Customization potential: Different phosphor combinations can be selected according to needs to meet the needs of various specific lighting scenarios.

[0017] 5. Cost reduction and miniaturization product development: By placing the blue light chip 132 in multiple second reflective cups 1112, the manufacturing cost of the LED lamp bead 10 can be greatly reduced while ensuring the multi-color light output of the LED lamp bead 10, which is conducive to the development of small, high-performance lighting products.

[0018] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 This is a front view of the first type of LED lamp bead provided in the embodiment of the present application;

[0021] Figure 2 This is a three-dimensional view of the first type of LED lamp bead provided in the embodiment of the present application;

[0022] Figure 3 This is a rear view of the first type of LED lamp bead provided in the embodiment of the present application;

[0023] Figure 4 It is a schematic structural diagram of a conductive foot provided in an embodiment of the present application;

[0024] Figure 5 It is a structural schematic diagram of a light-emitting component and a conductive foot provided by the present application;

[0025] Figure 6 This is an exploded view of the first type of LED lamp bead provided in the embodiment of the present application;

[0026] Figure 7 This is a schematic diagram of the use status of the first type of LED lamp bead provided in the embodiment of the present application;

[0027] Figure 8 This is a schematic diagram of the light-emitting state of the first type of LED lamp bead provided in the embodiment of the present application;

[0028] Fig. 9 This is a front view of the second type of LED lamp bead provided in the embodiment of the present application;

[0029] Fig.10 This is a front view of the third type of LED lamp bead provided in the embodiment of the present application;

[0030] Fig.11 This is a front view of the fourth type of LED lamp bead provided in the embodiment of the present application;

[0031] Fig.12 This is a schematic structural diagram of an LED product provided in this application.

[0032] Description of main components and symbols:

[0033] 100. LED products.

[0034] 10. LED lamp beads.

[0035] 11. LED bracket; 111. Insulating seat; 1111. First reflective cup; 1112. Second reflective cup; 1113. First partition wall; 1114. Second partition wall; 112. Conductive pin; 1121. Crystal fixing part; 1121a. First power pin; 1121b. Ground pin; 1121c. Second power pin; 1121d. Signal input pin; 1121e. Signal output pin; 1122. Welding part; 113. Transition pin; 13. Light-emitting component; 131. Driver chip; 132. Blue light chip; 14. Support member; 15. Anti-foolproofing port; 16. First packaging glue; 17. Second packaging glue.

[0036] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0038] The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may also be decomposed, combined or partially merged, so the actual execution order may change according to actual conditions.

[0039] It should be understood that the terms used in this application specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in this application specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0040] It should be understood that in order to facilitate the clear description of the technical solutions of the embodiments of the present application, in the embodiments of the present application, the words "first", "second" and the like are used to distinguish between the same items or similar items with substantially the same functions and effects. For example, the first encapsulation glue and the second encapsulation glue are only used to distinguish between different encapsulation glues, and their order is not limited. Those skilled in the art can understand that the words "first", "second" and the like do not limit the quantity and execution order, and the words "first", "second" and the like do not necessarily limit them to be different.

[0041] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0042] As a new type of lighting source, LED lamp beads have significant advantages such as energy saving, environmental protection, short response time and long life. At present, the light emission method of LED lamp beads is mainly based on the combination of red, green and blue primary color LED chips or other color LED chips. This method has high efficiency, controllable color temperature and good color rendering, but the different light decay of the three primary color chips leads to unstable color temperature, and the control circuit is complicated, resulting in high R&D costs of LED lamp beads.

[0043] Please refer to Figures 1 to 8 As shown in the figure, the present application provides an LED lamp bead 10, which includes an LED bracket 11, a light-emitting component 13, a first packaging glue 16 and a second packaging glue 17. The LED bracket 11 includes an insulating seat 111 and a plurality of conductive feet 112 integrally inlaid with the insulating seat 111, the insulating seat 111 is recessed from the top to form a first reflective cup 1111 and a plurality of second reflective cups 1112 arranged side by side, the conductive feet 112 have a crystal fixing portion 1121, and the crystal fixing portion 1121 is located in the first reflective cup 1111 and the second reflective cup 1112; wherein, the first reflective cup 1111 is located on one side of the insulating seat 111, and the plurality of second reflective cups 1112 are located on the other side of the insulating seat 111. The light emitting component 13 includes a driver chip 131 and a plurality of blue light chips 132. The driver chip 131 is disposed on the crystal bonding portion 1121 in the first reflective cup 1111. The plurality of blue light chips 132 are respectively disposed on the crystal bonding portion 1121 in the second reflective cup 1112. Each second reflective cup 1112 includes at least one blue light chip 132. The first packaging glue 16 is filled in the first reflective cup 1111 and covers the driver chip 131; the second packaging glue 17 is respectively filled in the plurality of second reflective cups 1112 and covers the blue light chip 132.

[0044] The driving chip 131 is electrically connected to the plurality of blue light chips 132 , respectively. The second packaging glue 17 in each second reflective cup 1112 contains different phosphors, so that the driving chip 131 controls the blue light chip 132 in each second reflective cup 1112 to emit light of different colors through the second packaging glue 17 .

[0045] Specifically, Figure 1-2 As shown in 9-10, the provided LED lamp bead 10 is formed on the insulating seat 111 by forming a first reflective cup 1111 and a plurality of second reflective cups 1112 (as shown in the figure, the number of the second reflective cups 1112 can be 3, 4, or can be arbitrarily limited according to the number of luminous colors. The embodiment of the present application does not limit the number of the second reflective cups 1112.), and at least one blue light chip 132 is placed in each second reflective cup 1112, and the second packaging glue 17 in each second reflective cup 1112 contains different phosphors, so that the driving chip 131 can control each blue light chip 132 to emit light of different colors, such as Figure 8 As shown, four kinds of light, red, green, blue and white, can be emitted in the four second reflective cups 1112. The provided LED lamp bead 10 can achieve the following beneficial effects:

[0046] 1. Multi-color light output: By using different phosphors in different reflective cups, the output of multiple colors of light is achieved, which enhances the color expression and application flexibility of the LED lamp bead 10.

[0047] 2. Precise color control: The driver chip 131 can independently control each blue light chip 132, achieving precise color mixing and adjustment capabilities. For example, the color temperature and lumen value of the emitted light combined with the ratio of the phosphor can also be precisely controlled to meet diverse application requirements.

[0048] 3. Improve luminous efficiency: The reflective cup design enhances the light reflection effect and improves the overall luminous efficiency of the LED lamp bead 10.

[0049] 4. Customization potential: Different phosphor combinations can be selected according to needs to meet the needs of various specific lighting scenarios.

[0050] 5. Cost reduction and miniaturization product development: By placing blue light chips 132 in multiple second reflective cups 1112, the manufacturing cost of the LED lamp beads 10 can be greatly reduced while ensuring the multi-color light output of the LED lamp beads 10, which is conducive to the development of small, high-performance lighting products.

[0051] In some embodiments, the insulating seat 111 between each second reflective cup 1112 and the first reflective cup 1111 forms a first partition wall 1113; the multiple second reflective cups 1112 include at least one target reflective cup, the target reflective cup is located in the middle position of the multiple second reflective cups 1112 arranged side by side, and the height of the first partition wall 1113 of the target reflective cup is lower than the height of the first partition walls 1113 of the remaining second reflective cups 1112.

[0052] like Figure 1 , Figure 2 and Figure 5 As shown, the insulating seat 111 forms a first partition wall 1113 between each second reflector cup 1112 and the first reflector cup 1111. Among the multiple second reflector cups 1112 arranged side by side, at least one is defined as a target reflector cup and the target reflector cup is located in the middle of the multiple second reflector cups 1112. By making the height of the first partition wall 1113 of the target reflector cup lower than the height of the first partition wall 1113 of other second reflector cups 1112. The first partition wall 1113 can effectively separate different reflectors, reduce light crosstalk, and improve the purity of light in each reflector cup. And through physical isolation, it is ensured that the phosphors in different reflectors will not mix, and the uniqueness of the light color emitted by each reflector cup is guaranteed.

[0053] At the same time, the first partition wall 1113 can isolate the heat between the chips to a certain extent, which contributes to better heat distribution and management. The lower height of the first partition wall 1113 corresponding to the target reflector cup allows more light diffusion and mixing. This may help to produce a more uniform or more special light effect, such as creating a central bright spot or a soft transition zone. By adjusting the height of the partition wall of the target reflector cup, a better overall light output effect can be achieved while maintaining color separation. Differentiated partition wall heights provide more possibilities for the design of LED lamp beads 10, and light distribution can be adjusted according to specific application requirements. The lower partition wall corresponding to the target reflector cup may allow different colors of light to mix to a certain extent, creating a richer color effect. The LED lamp bead 10 proposed in this application helps to create a more balanced and more beautiful overall lighting effect, especially in multi-color lighting applications.

[0054] Therefore, the differentiated partition wall design provided increases the flexibility and efficiency of the LED lamp bead 10 in terms of light control and color management, while providing the possibility for innovative lighting effects. This design shows the fine tuning of LED performance at the microstructural level, which is expected to play an important role in various high-end lighting applications.

[0055] Exemplarily, the LED lamp bead 10 includes three second reflective cups 1112 arranged side by side, and the second reflective cup 1112 located in the middle is a target reflective cup.

[0056] like Fig.10 As shown, when the LED lamp bead 10 includes three second reflective cups 1112, the target reflective cup is the second reflective cup, and then the corresponding color of fluorescent powder can be selected according to needs and set in the target reflective cup and the remaining second reflective cups 1112, thereby realizing a diversified design of the luminous effect of the LED lamp bead 10.

[0057] Exemplarily, the LED lamp bead 10 includes four second reflective cups 1112 arranged side by side, and the two second reflective cups 1112 located in the middle are target reflective cups.

[0058] like Figure 1-2 As shown, when the LED lamp bead 10 includes four second reflective cups 1112, the target reflective cups are the two located in the middle position, and then the corresponding color of fluorescent powder can be selected according to needs and set in the target reflective cup and the remaining second reflective cups 1112, thereby realizing a diversified design of the luminous effect of the LED lamp bead 10.

[0059] Exemplarily, a second partition wall 1114 is formed on the insulating seat 111 between the target reflective cup and the adjacent second reflective cup 1112 , and the height of the second partition wall 1114 is lower than the height of the first partition wall 1113 of the remaining second reflective cups 1112 .

[0060] The second partition wall 1114 forms a lower physical separation between the target reflector and the adjacent second reflector 1112. This design allows a certain degree of light interaction while still maintaining a basic separation effect. The lower height of the second partition wall 1114 allows the light between the target reflector and the adjacent reflector to be partially mixed. This can create a richer and more natural color transition effect.

[0061] By allowing the light in the central area (the target reflector and its adjacent areas) to diffuse more freely, the obvious boundaries or color mutations in the output of the lamp beads can be reduced. Partially mixed light can produce more diverse colors and increase the color expression of the lamp beads. The lower second partition wall 1114 may help improve the heat distribution in the central area and prevent excessive heat concentration in certain areas. This differentiated partition wall design provides more parameter adjustment space for relevant technicians to fine-tune the light output characteristics according to specific application requirements. This design can be used to create unique optical effects, such as a soft central halo or gradient effect. By allowing the light in the central area to partially diffuse, it can help balance the light intensity distribution of the entire LED lamp bead 10. Better light mixing and distribution may lead to higher overall light efficiency and reduce light energy loss. The structure provided in this application makes it easier for the LED lamp bead 10 to adapt to different application scenarios, from focused lighting to soft ambient light. In some applications, this built-in light control may reduce the need for additional external optical components. The fine design of the LED lamp bead 10 provided can bring unique market advantages to the product, especially in high-end lighting applications.

[0062] Therefore, the setting of the second partition wall 1114 embodies a delicate balance, that is, maintaining basic light separation while allowing moderate light mixing. This design not only improves the performance and flexibility of the LED lamp bead 10, but also opens up new possibilities for innovative lighting solutions. It demonstrates the importance of fine-tuning LED performance at the microstructural level, which is expected to play a key role in various high-quality lighting applications.

[0063] For example, Figure 6 As shown, the height of the second packaging glue 17 in the target reflective cup is the same as the height of the first partition wall 1113 of the target reflective cup, and the first packaging glue 16 is also filled on the second packaging glue 17 of the target reflective cup.

[0064] Since the height of the first partition wall 1113 of the target reflective cup is lowered, there is a gap between the first reflective cup 1111 and the target reflective cup, so the first packaging glue 16 will be filled on the second packaging glue 17 of the target reflective cup. At the same time, if the first packaging glue 16 is transparent glue or diffusion glue, and the second packaging glue 17 is fluorescent glue composed of fluorescent powder of any color, it can be adjusted according to the luminous requirements to present a richer luminous effect.

[0065] For example, Figure 4 and Figure 5As shown, the driver chip 131 and the blue light chip 132 in the target reflective cup are electrically connected via bonding wires; the LED lamp bead 10 also includes: a transition pin 113, a solid crystal portion 1121 of the transition pin 113 is located in both the first reflective cup 1111 and the remaining second reflective cups 1112, and the driver chip 131 is electrically connected to the blue light chips 132 in the remaining second reflective cups 1112 via the transition pin 113.

[0066] Since the first partition wall 1113 creates a gap between the first reflective cup 1111 and the target reflective cup, the first reflective cup 1111 and the target reflective cup can be directly connected via bonding wires. Since the target reflective cup is located in the middle position, the wiring distance of the LED lamp bead 10 can also be shortened, thereby reducing the cost of the LED lamp bead 10 and achieving its miniaturized design.

[0067] At the same time, the provided embodiment simplifies the circuit connection method by using the transition pin 113 as a bridge between the driver chip 131 and the blue light chip 132 in the other second reflective cup 1112. The number of bonding wires required to be directly from the driver chip 131 to each blue light chip 132 is reduced. The use of bonding wires is reduced, and the risk of failure caused by broken bonding wires or poor connections is reduced. The setting of the transition pin 113 solid crystal part 1121 provides a more stable connection foundation. By using the transition pin 113, the limited space inside the LED lamp bead 10 can be more effectively utilized. The complex wiring requirements are reduced, leaving more space for other components. The transition pin 113 may help to disperse and conduct heat and improve the overall thermal management effect. The simplified connection method may make the production process more efficient and reduce complex bonding steps. This design provides more layout options for technicians in this field, and the position of the chip and pins can be adjusted as needed.

[0068] Furthermore, the transition pin 113 may provide a shorter and more direct electrical path, potentially improving the signal transmission quality. And combined with the connection method of the target reflector cup, reducing the use of bonding wires may reduce material costs and production costs. The provided LED lamp bead 10 may reduce electromagnetic interference through a simpler connection, improve the overall performance stability of the LED lamp bead 10, and make the LED lamp bead 10 easier to adapt to different packaging and application requirements. And the design of the transition pin 113 may provide the possibility for future functional expansion (such as adding more control components).

[0069] Therefore, the present application embodies an innovative connection method through the design of the transition pin 113, which not only simplifies the internal structure of the LED lamp bead 10, but also may improve the reliability, performance and production efficiency of the product. This design demonstrates the importance of optimizing the LED lamp bead 10 at the microstructure level and is expected to play an important role in various high-quality lighting applications, especially in scenarios requiring complex control and multi-color output.

[0070] In some embodiments, Fig. 9 As shown, the LED lamp beads 10 may not be provided with a target reflective cup, that is, the blue light chip 132 in each second reflective cup 1112 is electrically connected to the driver chip 131 through the transition pin 113, and thus a unified connection method may help ensure that the signals received by different blue light chips 132 are more consistent.

[0071] In some embodiments, the LED lamp bead 10 includes four second reflective cups 1112. Figure 1-2 As shown, the LED lamp bead 10 can be provided with four second reflective cups 1112 as required, and the four second reflective cups 1112 can emit different lights by selecting different phosphors.

[0072] Exemplarily, along the arrangement direction of the plurality of second reflective cups 1112, the colors of the light emitted from the second reflective cups 1112 are red, green, blue and white, respectively. By using red, green, blue and white light sources, a colorful light effect can be created. The combination of the three basic colors of red, green and blue can produce a variety of colors, which provides great color expression for the LED lamp bead 10. The white light source can provide bright illumination and enhance the clarity and contrast of the entire lighting effect. Combining red, green and blue light sources can create a more vivid and rich effect visually. By using four different colors of light sources, a more uniform light distribution can be achieved in the overall lighting, reducing light spots and shadows. At the same time, by setting the blue and green colors that are more similar to the blue light chip 132 in the middle position, the blue light chip 132 can be combined when the first partition wall 1113 is set to make the overall luminous effect more uniform.

[0073] It should be noted that, in some embodiments, the color of the light emitted by each second reflective cup 1112 can be arbitrarily set according to actual application requirements, and the embodiments of the present application do not limit this.

[0074] In some embodiments, the LED lamp bead 10 includes three second reflective cups 1112. Fig.10As shown, the LED lamp bead 10 can be provided with three second reflective cups 1112 as required, and different phosphors can be selected to make the three second reflective cups 1112 emit different lights. At the same time, by setting the blue color in the middle position, when the first partition wall 1113 is provided, the blue light chip 132 can be combined to make the overall luminous effect more uniform.

[0075] Exemplarily, the colors of the second reflective cups 1112 are red, green and blue respectively along the arrangement direction of the second reflective cups 1112. The combination of the three basic colors of red, green and blue can produce various colors, which provides great color expression for the LED lamp bead 10.

[0076] In some embodiments, if the color of the light emitted by the blue chip 132 through the second packaging glue 17 is red, the second packaging glue 17 contains red phosphor. By providing the red phosphor, red light with a color purity of >80% and a wavelength of 525 nm can be obtained.

[0077] In some embodiments, if the color of the light emitted by the blue light chip 132 through the second packaging glue 17 is green, the second packaging glue 17 contains green phosphor. By setting the green phosphor, green light with a color purity of >80% and a wavelength of 525nm can be obtained.

[0078] It should be noted that the present application does not impose any restrictions on the color purity and wavelength of any light, and the color purity >80% and the wavelength of 525 nm are merely a set of embodiments shown in the present application.

[0079] In some embodiments, if the color of the light emitted by the blue chip 132 through the second packaging glue 17 is white, the second packaging glue 17 contains one or more of green phosphor, yellow phosphor, orange phosphor and red phosphor. The blue chip 132 is used to excite one or more of the yellow or red, green, yellow and orange phosphors, and the ratio of the one or more phosphors is adjusted according to the required color temperature, lumen, CRI and other parameters to achieve the required white light.

[0080] In some embodiments, if the color of the light emitted by the blue light chip 132 through the second packaging glue 17 is blue, the second packaging glue 17 does not contain phosphor, or the second packaging glue 17 contains blue phosphor, or the second packaging glue 17 contains yellow phosphor. According to the requirements for the color purity and lumen value of the final emitted blue light, the lumen value of the blue light can be improved by adding yellow phosphor. At the same time, it is also possible to choose not to add phosphor and select transparent glue or diffusion glue as the second packaging glue 17 for the second reflective cup 1112. At the same time, blue phosphor can also be added to improve the color purity of the blue light.

[0081] In some embodiments, the conductive pin 112 includes at least a first power pin 1121a, a ground pin 1121b and a plurality of second power pins 1121c. The first power pin 1121a and the ground pin 1121b are respectively arranged in the first reflective cup 1111 and located on opposite sides of the insulating seat 111. The plurality of second power pins 1121c are respectively located in the first reflective cup 1111. The driving chip 131 is respectively electrically connected to the first power pin 1121a and the ground pin 1121b, and the blue light chip 132 is electrically connected to the second power pin 1121c.

[0082] like Figure 4-5 As shown, by setting a first power pin 1121a, a ground pin 1121b and a plurality of second power pins 1121c, it is possible to provide separate power to the driver chip 131 and the blue light chip 132, so that when the power consumption of the driver chip 131 is higher than that of the blue light chip 132, a smaller power supply can be connected to the second power pin 1121c, thereby reducing the energy consumption of the entire LED lamp bead 10.

[0083] Exemplarily, the conductive pin 112 further includes a signal input pin 1121d and a signal output pin 1121e, which are respectively arranged in the first reflective cup 1111 and located on opposite sides of the insulating seat 111, and the driving chip 131 is respectively electrically connected to the signal input pin 1121d and the signal output pin 1121e; wherein the signal input pin 1121d and the first power pin 1121a are arranged on the same side, and the signal output pin 1121e and the ground pin 1121b are arranged on the same side. Figure 4-5 As shown, by setting the signal input pin 1121d and the signal output pin 1121e, the driver chip 131 can receive external signals to realize refined and intelligent control of each blue light chip 132. At the same time, the arrangement of the pins also simplifies the product structure of the provided LED lamp bead 10.

[0084] Exemplarily, the insulating seat 111 includes a first end face and a second end face that are arranged opposite to each other, and the first reflective cup 1111, the second reflective cup 1112 and the light-emitting component 13 are located on the first end face of the insulating seat 111; the first power pin 1121a, the ground pin 1121b and the solid crystal portion 1121 of multiple second power pins 1121c are also arranged on the second end face of the insulating seat 111; the first power pin 1121a is located at the first end face and the solid crystal portion 1121 of the second end face is electrically connected, the ground pin 1121b is located at the first end face and the solid crystal portion 1121 of the second end face is electrically connected, and the second power pin 1121c is located at the first end face and the solid crystal portion 1121 of the second end face is electrically connected.

[0085] like Figure 4As shown, the crystal bonding part 1121 is arranged on the second end surface, so that the connection between the power pin, the ground pin 1121b and the plurality of second power pins 1121c becomes more direct, simplifying the internal circuit layout. This design reduces the complexity of the electrical connection and improves the overall efficiency of the electrical connection and assembly.

[0086] It should be noted that, in some embodiments, the conductive pin 112 further has a welding portion 1122, the welding portion 1122 of the first power pin 1121a is connected to the first end surface and the second end surface of the first power pin 1121a The welding portion 1122 of the ground pin 1121b is connected to the first end surface and the second end surface of the ground pin 1121b The welding portion 1122 of the second power pin 1121c is connected to the second end surface The second end surface of the second power pin 1121c is connected to the first end surface and the second end surface of the second power pin 1121c. Figure 4 As shown, the welding portion 1122 can extend the crystal-fixing portion 1121 to the second end surface, thereby improving the connection stability of the product.

[0087] In some embodiments, the projection shape of the first reflective cup 1111 on the insulating seat 111 is the same as the projection shape of the plurality of second reflective cups 1112 on the insulating seat 111. Figure 1 ,like Figure 1 It can be seen that the projection shapes corresponding to the overall outlines of the first reflective cup 1111 and the second reflective cup 1112 are both hexagonal. By making the projection shapes formed by the first reflective cup 1111 and the plurality of second reflective cups 1112 the same, a symmetrical design of the product can be achieved, thereby improving the overall luminous effect.

[0088] In some embodiments, the LED lamp bead 10 further includes a support member 14, which is disposed at the wall of the first reflective cup 1111 to enhance the structural strength of the first reflective cup 1111 and prevent the conductive foot 112 from tilting. The support member 14 may be made of prefabricated plastic, thereby enhancing the structural strength of the first reflective cup 1111 and suppressing the corresponding conductive corner to prevent it from tilting.

[0089] In some embodiments, the material of the insulating seat 111 is epoxy molding compound, and the conductive foot 112 is formed by chemical plating on the injection-molded epoxy plastic through laser direct structuring technology. By using epoxy molding compound (EMC) as the material of the insulating seat 111 and using laser direct structuring (LDS) technology to inject the conductive foot 112, not only the performance and reliability of the LED lamp bead 10 are improved, but also the manufacturing process is optimized, providing important support for the miniaturization, high efficiency and long life of the product. This innovative combination of materials and processes has brought significant technological progress to the design and production of LED lamp beads 10.

[0090] like Fig.11 As shown, Fig.11 Schematic diagram of an LED lamp bead 10 in which a conductive foot 112 is injection molded on an EMC substrate based on LDS technology ( Fig.11 The red line in the figure is the conductive foot 112, and the blue line is the part located on the conductive foot 112, and the specific position is consistent with the other embodiments of the present application). The present application uses a laser to locally heat and process the surface of the conductive foot 112. This heating can make the surface of the conductive foot micro-roughened and increase its bonding strength with the epoxy molding compound. At the same time, this process can also accurately locate the position of the conductive foot. On the conductive foot after laser treatment, the epoxy molding compound is injected into the mold. This process will make the epoxy molding compound tightly bonded to the conductive foot, and the bonding strength between the conductive foot and the epoxy molding compound is greatly enhanced by pre-injection molding through laser pretreatment. After the injection molding is completed, the component needs to be cooled and cured so that the epoxy molding compound tightly wraps the conductive foot after curing. Due to the application of laser direct forming technology, the conductive foot can maintain excellent bonding strength after cooling. Finally, the injection-molded parts are tested to ensure that the quality and conductivity of the bonding between the conductive foot and the epoxy molding compound meet the design standards. If necessary, some post-processing processes can also be performed, such as surface cleaning and polishing. The combination of laser direct forming and injection molding improves manufacturing accuracy and product reliability, effectively improving the adhesion strength and positioning accuracy between the conductive pins and the epoxy molding compound, making it suitable for the manufacturing of high-requirement LED lamp beads.

[0091] For example, the color of the epoxy molding compound is black. The filler of the black resin material is relatively small, the surface is relatively fine, and it is not easy to fall off after metallization. It is also generally more stable under light and temperature changes, reducing the performance degradation of the material caused by light aging or temperature changes. This makes the LED lamp bead 10 have better stability.

[0092] For example, the color of the epoxy molding compound is white. White materials have a high light reflectivity and can effectively reflect light in the desired direction, thereby improving the light efficiency of the LED lamp bead 10. This is particularly beneficial for improving luminous efficiency, especially in application scenarios that require high brightness. At the same time, white materials can diffuse light more evenly, reduce the appearance of bright spots and shadows, and thus improve the uniformity of lighting. Therefore, the corresponding epoxy molding compound color can be selected according to the adaptability of the needs, and the embodiment of the present application does not limit the color of the epoxy molding compound.

[0093] For example, the colors of the epoxy molding material are black and white, with the black part located above the white part. Since the filler of the black resin material is relatively small and the surface is relatively delicate compared to the white resin material, by molding a layer of black on the white plastic again, and then electroplating a smooth metal layer on the black after LDS, the advantages of both black and white materials can be combined at the same time, and the light efficiency of the LED lamp bead 10 can be effectively improved while the conductive foot 112 is injection molded using the LDS technology.

[0094] At the same time, when the white resin is molded, space can be reserved for secondary molding of black plastic and electroplating of the conductive foot 112 to ensure the flatness of the surface. The white resin can also be raised to allow the black glue to flow into the raised gaps. This embodiment of the present application does not limit this.

[0095] In some embodiments, Figure 1 As shown, a foolproof opening 15 is provided on one side of the insulating seat 111 of the LED lamp bead 10. The functions of the foolproof opening 15 are mainly reflected in preventing mis-insertion, improving installation efficiency, enhancing product reliability and protecting user safety. These functions together provide a strong guarantee for the wide application of the LED lamp bead 10.

[0096] The present application provides an LED lamp bead 10, which uses different phosphors in different reflective cups to achieve the output of multiple colors of light, thereby enhancing the color expression and application flexibility of the LED lamp bead 10. At the same time, the driver chip 131 can independently control each blue light chip 132, achieving precise color mixing and adjustment capabilities. The color temperature and lumen value of the emitted light combined with the combination ratio of the phosphors can also be precisely controlled to meet diverse application requirements. The reflective cup design enhances the light reflection effect and improves the overall luminous efficiency of the LED lamp bead 10. Different phosphor combinations can be selected according to requirements to meet the needs of various specific lighting scenes. The provided LED lamp bead 10 realizes multi-functions in a single LED lamp bead 10, which is conducive to the development of small and high-performance lighting products. And by placing blue light chips 132 in multiple second reflective cups 1112, the manufacturing cost of the LED lamp bead 10 can be greatly reduced while ensuring the multi-color light output of the LED lamp bead 10, which is conducive to the development of small and high-performance lighting products.

[0097] Please refer to Fig.12 , Fig.12 is a schematic diagram of the structure of the electronic device 100 provided in the embodiment of the present application, such as Fig.10 As shown, the electronic device 100 includes the LED lamp beads provided by any embodiment of the present application, thereby enabling the electronic device 100 to be miniaturized.

[0098] In some embodiments, the electronic device 100 is any device such as a fan, a screen, etc., and the embodiment of the present application does not limit the type of the electronic device 100.

[0099] In some embodiments, the electronic device 100 includes a plurality of LED lamp beads 10 , and the plurality of LED lamp beads can be connected in the electronic device 100 at intervals, or a corresponding connection method can be set according to requirements.

[0100] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0101] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0102] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0103] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. An LED lamp bead, characterized in that: The LED lamp beads include: An LED bracket, the LED bracket comprising an insulating base and a plurality of conductive feet integrally inlaid with the insulating base, the insulating base being concave from the top to form a first reflective cup and a plurality of second reflective cups arranged side by side, the conductive foot having a crystal fixing portion, the crystal fixing portion being located inside the first reflective cup and the second reflective cup; wherein the first reflective cup is located on one side of the insulating base, and the plurality of second reflective cups are located on the other side of the insulating base; A light emitting component, the light emitting component comprises a driving chip and a plurality of blue light chips, the driving chip is arranged on the crystal-fixing part in the first reflective cup, the plurality of blue light chips are respectively arranged on the crystal-fixing part in the second reflective cup, each of the second reflective cups comprises at least one blue light chip; the insulating seat between each of the second reflective cups and the first reflective cup forms a first partition wall; the plurality of second reflective cups comprises at least one target reflective cup, the target reflective cup is located in the middle of the plurality of second reflective cups arranged side by side, the height of the first partition wall of the target reflective cup is lower than the height of the first partition walls of the remaining second reflective cups, so that more light in the target reflective cup is diffused and mixed to form a central bright spot or a soft transition zone; the target reflective cups The insulating seat between the optical cup and the adjacent second reflective cup forms a second partition wall, the height of the second partition wall is lower than the height of the first partition wall of the remaining second reflective cups, so that the light between the target reflective cup and the adjacent second reflective cup can be partially mixed; the material of the insulating seat is epoxy molding compound, the conductive foot is formed by chemical plating on the injection-molded epoxy plastic through laser direct molding technology, the color of the epoxy molding compound is black and white, and the black part is located above the white part; the filler of the black part is smaller than the white part, the surface of the black part is finer than the surface of the white part, and when the white part is molded, the resin corresponding to the white part is raised, and the black glue corresponding to the black part flows into the raised gap; A first packaging glue, wherein the first packaging glue is filled in the first reflective cup and covers the driving chip; A second packaging glue, wherein the second packaging glue is respectively filled in the plurality of second reflective cups and covers the blue light chip; The driving chip is electrically connected to the plurality of blue light chips respectively, and the second packaging glue in each second reflective cup contains different phosphors, so that the driving chip controls the blue light chip in each second reflective cup to emit light of different colors through the second packaging glue.

2. The LED lamp bead according to claim 1, characterized in that: The LED lamp bead comprises three second reflective cups arranged side by side, and the second reflective cup located in the middle is the target reflective cup.

3. The LED lamp bead according to claim 1, characterized in that: The LED lamp bead comprises four second reflective cups arranged side by side, and two of the second reflective cups located in the middle are the target reflective cups.

4. The LED lamp bead according to claim 1, characterized in that: The height of the second packaging glue in the target reflective cup is the same as the height of the first partition wall of the target reflective cup, and the first packaging glue is also filled on the second packaging glue of the target reflective cup.

5. The LED lamp bead according to claim 1, characterized in that: The driver chip and the blue light chip in the target reflective cup are electrically connected via bonding wires; the LED lamp bead further includes: A transition pin, wherein the crystal-bonding portion of the transition pin is located in both the first reflective cup and the remaining second reflective cups, and the driving chip is electrically connected to the blue light chip in the remaining second reflective cups through the transition pin.

6. The LED lamp bead according to claim 1, characterized in that: The LED lamp bead includes four second reflective cups.

7. The LED lamp bead according to claim 6, characterized in that: Along the arrangement direction of the plurality of second reflective cups, colors of light emitted from the second reflective cups are red, green, blue and white respectively.

8. The LED lamp bead according to claim 1, characterized in that: The LED lamp bead includes three second reflective cups.

9. The LED lamp bead according to claim 8, characterized in that: The colors of the second reflective cups are red, green and blue respectively along the arrangement direction of the second reflective cups.

10. The LED lamp bead according to claim 1, characterized in that: If the color of the light emitted by the blue light chip through the second packaging glue is red, the second packaging glue contains red phosphor; and / or, If the color of the light emitted by the blue light chip through the second packaging glue is green, the second packaging glue contains green phosphor; and / or, If the color of the light emitted by the blue light chip through the second packaging glue is white, the second packaging glue contains one or more of green phosphor, yellow phosphor, orange phosphor and red phosphor.

11. The LED lamp bead according to claim 1, characterized in that: If the color of the light emitted by the blue light chip through the second packaging glue is blue, the second packaging glue does not contain phosphor, or the second packaging glue contains blue phosphor, or the second packaging glue contains yellow phosphor.

12. The LED lamp bead according to claim 1, characterized in that: The conductive pin at least includes a first power pin, a ground pin and a plurality of second power pins, the first power pin and the ground pin are respectively arranged in the first reflective cup and located on opposite sides of the insulating seat, and the plurality of second power pins are respectively located in the first reflective cup; the driving chip is respectively electrically connected to the first power pin and the ground pin, and the blue light chip is electrically connected to the second power pin.

13. The LED lamp bead according to claim 12, characterized in that: The conductive pin further includes a signal input pin and a signal output pin, the signal input pin and the signal output pin are respectively arranged in the first reflective cup and located at two opposite sides of the insulating seat, and the driving chip is electrically connected to the signal input pin and the signal output pin respectively; The signal input pin and the first power pin are arranged on the same side, and the signal output pin and the ground pin are arranged on the same side.

14. The LED lamp bead according to claim 12, characterized in that: The insulating seat includes a first end face and a second end face that are arranged opposite to each other, and the first reflective cup, the second reflective cup and the light-emitting component are located on the first end face of the insulating seat; the first power pin, the ground pin and the crystal bonding parts of multiple second power pins are also arranged on the second end face of the insulating seat; the first power pin is located at the first end face and the crystal bonding parts of the second end face are electrically connected, the ground pin is located at the first end face and the crystal bonding parts of the second end face are electrically connected, and the second power pin is located at the first end face and the crystal bonding parts of the second end face are electrically connected.

15. The LED lamp bead according to claim 14, characterized in that: The conductive pin also has a welding portion, the welding portion of the first power pin is connected to the bonding portion of the first power pin located at the first end surface and the second end surface, the welding portion of the ground pin is connected to the bonding portion of the ground pin located at the first end surface and the second end surface, and the welding portion of the second power pin is connected to the bonding portion of the second power pin located at the first end surface and the second end surface.

16. The LED lamp bead according to claim 1, characterized in that: The projection shape of the first reflective cup on the insulating seat is the same as the projection shape of the plurality of second reflective cups on the insulating seat.

17. The LED lamp bead according to claim 1, characterized in that: The LED lamp beads also include: A support member is arranged at the cup wall of the first reflective cup, and is used to enhance the structural strength of the first reflective cup and prevent the conductive foot from tilting.

18. An electronic device, characterized in that: The LED lamp bead comprises any one of claims 1-17.

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