Lateral incidence type backlight module capable of reducing different colors
By directly soldering blue LED chips into the edge-lit backlight module and using low-height spacers and quantum dot diffusers, the problem of uneven color distribution caused by phosphor in traditional edge-lit backlight modules has been solved, achieving higher display quality and a thinner design.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ANHUI COREACH TECHNOLOGY CO LTD
- Filing Date
- 2025-05-09
- Publication Date
- 2026-04-21
AI Technical Summary
Traditional side-lit backlight modules are prone to color distortion during LED welding due to uneven phosphor distribution or colloid deformation, which affects display quality. Existing improvement solutions are either costly or inefficient.
The blue light chip is directly soldered onto the PCB substrate, and low-height ceramic or metal pads are used instead of traditional pads. Combined with quantum dot diffusers, the blue light is converted into white light, simplifying the manufacturing process and reducing heat dissipation requirements.
It effectively reduces the risk of color discrepancies, reduces module thickness and material costs, while improving color performance, simplifying the production process and increasing yield.
Smart Images
Figure CN224152801U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of backlight module technology, specifically to a side-lit backlight module that reduces color distortion. Background Technology
[0002] With the rapid development of technology, display technology has become an indispensable part of modern life, especially in fields such as televisions, computer monitors, and mobile phone screens, where display quality directly affects user experience. As one of the core components of liquid crystal display (LCD) technology, the performance of the backlight module directly affects the quality of the display effect. Currently, the mainstream backlight solutions on the market are mainly divided into two types: direct-lit backlight and edge-lit backlight. Direct-lit backlight, with its high brightness and high contrast, is widely used in high-end display products; while edge-lit backlight, with its advantages of being thin and energy-efficient, dominates the mid-to-low-end market, and is especially suitable for portable devices with strict thickness requirements.
[0003] The basic working principle of an edge-lit backlight module is to place encapsulated LED light sources on one or both sides of the LCD panel, and distribute the light evenly across the entire display area through a light guide plate. In traditional edge-lit backlight modules, LEDs are typically soldered onto a printed circuit board (PCB) using solder paste. To prevent damage to the LEDs from external impacts during transportation or assembly, additional spacers are often soldered onto the PCB substrate to increase the protection height of the LEDs. However, this structure has significant drawbacks. Since most LEDs on the market currently use a technology that encapsulates a mixture of blue LED chips and red and green phosphors in a colloid, factors such as high temperatures and pressure changes during the soldering process can easily cause uneven phosphor distribution or colloid deformation, resulting in color distortion in the backlight module and severely affecting display quality.
[0004] While existing technologies have proposed some improvements to address the aforementioned issues, such as optimizing welding processes and improving LED packaging structures, these methods often only alleviate the color mismatch problem to a certain extent and may be accompanied by side effects such as increased costs and reduced production efficiency. Especially today, with the pursuit of higher display quality and thinner designs, effectively reducing the risk of color mismatch while ensuring backlight module performance has become a key technical challenge that the industry urgently needs to solve. Utility Model Content
[0005] The purpose of this invention is to provide a side-lit backlight module that reduces color distortion, thus solving the problem of color distortion that occurs when traditional LEDs are soldered onto a board.
[0006] The objective of this utility model can be achieved through the following technical solutions:
[0007] A side-lit backlight module for reducing color distortion includes a main backplate. Folded edge panels are fixedly installed around the upper perimeter of the main backplate. A light strip assembly for emitting a light source is fixedly installed inside the folded edge panels. A reflector is fixedly installed at the upper end of the main backplate, and a light guide plate is fixedly installed at the upper end of the reflector. A quantum dot diffuser is fixedly installed at the upper end of the light guide plate, and an upper diffuser is fixedly installed at the upper end of the quantum dot diffuser. A display screen is installed at the upper end of the upper diffuser, and an upper cover frame is fixedly installed above the display screen, with the upper cover frame fixedly installed on the outer perimeter of the main backplate.
[0008] Preferably, the light strip assembly includes a PCB substrate, on the side of the PCB substrate closest to the center of the main body back plate, a blue light chip is directly soldered thereon, and a plurality of support pads are provided on the side of the PCB substrate where the blue light chip is located.
[0009] Preferably, the height of the support pad is 0.1-0.3 mm, and its material is ceramic or metal.
[0010] Preferably, the blue light chip is fixed to the pads on the PCB substrate by soldering with solder paste, and the area of the pads is smaller than that of traditional LED lamp beads.
[0011] Preferably, the quantum dot diffuser contains red and green quantum dot materials for converting blue light into white light.
[0012] Preferably, the soldering area of the PCB substrate is provided with an antistatic coating.
[0013] Preferably, the connection between the support pad and the PCB substrate is laser welding or reflow soldering.
[0014] Preferably, the quantum dot diffuser is attached to the upper surface of the light guide plate by an optical adhesive layer.
[0015] Preferably, the blue light chips are arranged in a linear array or a matrix array.
[0016] Preferably, the light strip assembly further includes a heat dissipation pad disposed on the back side of the PCB substrate.
[0017] The beneficial effects of this utility model are:
[0018] (1) By directly soldering LED chips onto the PCB substrate and replacing traditional pads with height-reduced soldering blocks, while introducing quantum dot films, efficient white light conversion is achieved. This design not only simplifies the manufacturing process and reduces heat dissipation requirements and pad costs, but also effectively overcomes the color difference problem caused by LED packaging process in traditional side-lit backlight modules through the light conversion characteristics of quantum dot films.
[0019] (2) Replace traditional high-profile gaskets with ceramic or metal gaskets with a height of 0.1-0.3mm to reduce structural thickness and material costs, while also reducing obstruction of the light path. Cover the wafer with a film containing red and green quantum dot materials, and use blue light to excite the quantum dots to convert them into high color gamut white light to improve color performance. Attached Figure Description
[0020] The present invention will be further described below with reference to the accompanying drawings.
[0021] Figure 1 This is a structural schematic diagram of a side-lit backlight module for reducing color distortion according to this utility model;
[0022] Figure 2 This is a utility model Figure 1 A magnified structural diagram of point A in the middle.
[0023] In the diagram: 10, main back plate; 20, reflector; 30, light guide plate; 40, light strip assembly; 41, PCB substrate; 42, blue light chip; 43, support pad; 44, heat dissipation pad; 50, quantum dot diffuser; 60, upper diffuser; 70, display screen; 80, upper cover frame. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0025] In the description of this utility model, it should be understood that the terms "upper," "lower," "left," and "right," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational structure and operation. Therefore, they should not be construed as limitations on this utility model. Furthermore, "first" and "second" are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "multiple" means two or more.
[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0027] Please see Figures 1-2 As shown, this utility model is a side-lit backlight module for reducing color distortion, including a main backplate 10. Folded edge panels are fixedly installed around the upper perimeter of the main backplate 10. A light strip assembly 40 for emitting a light source is fixedly installed inside the folded edge panels. A reflector 20 is fixedly installed at the upper end of the main backplate 10, and a light guide plate 30 is fixedly installed at the upper end of the reflector 20. A quantum dot diffuser 50 is fixedly installed at the upper end of the light guide plate 30, and an upper diffuser 60 is fixedly installed at the upper end of the quantum dot diffuser 50. A display screen 70 is installed at the upper end of the upper diffuser 60, and an upper cover frame 80 is fixedly installed above the display screen 70. The upper cover frame 80 is fixedly installed on the outer periphery of the main backplate 10.
[0028] In an optional embodiment, the light strip assembly 40 includes a PCB substrate 41, on which a blue light chip 42 is directly soldered, and a plurality of support pads 43 are provided on the side of the PCB substrate 41 where the blue light chip 42 is located.
[0029] It should be noted that the direct soldering of the blue LED chip 42 avoids the color difference problem caused by uneven phosphor mixing in traditional LED packaging, improves the consistency of luminous efficacy, eliminates the need for LED packaging steps, and reduces material usage with low-height spacers.
[0030] In an optional embodiment, the support pad 43 has a height of 0.1-0.3 mm and is made of ceramic or metal.
[0031] It should be noted that the low height of the support pad 43 significantly reduces the thickness of the backlight module, making it suitable for ultra-thin display devices; the ceramic / metal material has strong heat resistance, avoiding deformation caused by high-temperature welding and improving process reliability.
[0032] In an optional embodiment, the blue light chip 42 is fixed to the pads of the PCB substrate 41 by soldering with solder paste, and the area of the pads is smaller than that of traditional LED lamp beads.
[0033] It should be noted that the small pads reduce the heat conduction path, and together with the subsequent thermal pad 44, further reduce the local temperature rise.
[0034] In an optional embodiment, the quantum dot diffuser 50 comprises red and green quantum dot materials for converting blue light into white light.
[0035] It should be noted that the quantum dot diffuser 50 completely absorbs blue light, avoiding visual fatigue caused by residual blue light in traditional solutions.
[0036] In an optional embodiment, the soldering area of the PCB substrate 41 is provided with an antistatic coating.
[0037] It should be noted that antistatic coatings (such as polyimide) can withstand electrostatic shocks of 5kV or higher, reducing the wafer damage rate to below 0.1%, reducing welding failures caused by static electricity, and improving the yield rate of the production line.
[0038] In an optional embodiment, the connection between the support pad 43 and the PCB substrate 41 is laser welding or reflow soldering.
[0039] In an optional embodiment, the quantum dot diffuser 50 is attached to the upper surface of the light guide plate 30 by an optical adhesive layer.
[0040] It should be noted that the optical adhesive layer ensures that the quantum dot diffuser sheet 50 adheres tightly, reducing light loss.
[0041] In an optional embodiment, the blue light chips 42 are arranged in a linear array or a matrix array.
[0042] It should be noted that linear arrays are suitable for narrow-bezel TVs, while matrix arrays are adapted for large-size displays, offering greater design flexibility.
[0043] In an optional embodiment, the light strip assembly 40 further includes a heat dissipation pad 44 disposed on the back side of the PCB substrate 41.
[0044] It should be noted that the thermal pad 44 is used to reduce PCB temperature and extend its lifespan.
[0045] The working principle of this invention is as follows: The unencapsulated blue LED chip 42 is directly soldered onto the pads of the PCB substrate 41, avoiding the risk of color mismatch caused by uneven phosphor mixing during traditional LED packaging. A ceramic or metal spacer with a height of 0.1-0.3mm is used instead of the traditional high spacer, reducing structural thickness and material costs while minimizing obstruction of the light path. A film containing red and green quantum dot materials is placed over the chip; blue light excites the quantum dots to convert them into high color gamut white light, improving color performance.
[0046] The above description provides a detailed account of one embodiment of the present invention. However, this description is merely a preferred embodiment and should not be construed as limiting the scope of the present invention. All equivalent variations and improvements made within the scope of the claims of the present invention should still fall within the patent coverage of the present invention.
Claims
1. A side-in backlight module with reduced color difference, characterized in that, The system includes a main back panel (10), with folded edge panels fixedly installed around the upper perimeter of the main back panel (10). A light strip assembly (40) for emitting light source is fixedly installed on the inner side of the folded edge panels. A reflector (20) is fixedly installed at the upper end of the main back panel (10), and a light guide plate (30) is fixedly installed at the upper end of the reflector (20). A quantum dot diffuser (50) is fixedly installed at the upper end of the light guide plate (30), and an upper diffuser (60) is fixedly installed at the upper end of the quantum dot diffuser (50). A display screen (70) is installed at the upper end of the upper diffuser (60), and an upper cover frame (80) is fixedly installed above the display screen (70). The upper cover frame (80) is fixedly installed on the outer periphery of the main back panel (10).
2. The side-in backlight module with reduced color difference according to claim 1, wherein The light strip assembly (40) includes a PCB substrate (41), on which a blue light chip (42) is directly soldered on the side of the PCB substrate (41) near the center of the main back plate (10), and a plurality of support pads (43) are provided on the side of the PCB substrate (41) where the blue light chip (42) is located.
3. A side-lit backlight module for reducing color distortion according to claim 2, characterized in that, The height of the support pad (43) is 0.1-0.3mm, and its material is ceramic or metal.
4. The side-in backlight module with reduced color difference according to claim 2, wherein The blue light chip (42) is fixed to the pads of the PCB substrate (41) by soldering with solder paste, and the area of the pads is smaller than that of traditional LED beads.
5. The side-in backlight module with reduced color difference according to claim 1, wherein The quantum dot diffuser (50) contains red and green quantum dot materials for converting blue light into white light.
6. The side-in backlight module with reduced color difference according to claim 2, wherein The soldering area of the PCB substrate (41) is provided with an antistatic coating.
7. The side-in backlight module of claim 2, wherein the light source is a light emitting diode (LED) or a light emitting diode chip (LED chip). The connection between the support pad (43) and the PCB substrate (41) is laser welding or reflow welding.
8. The side-in backlight module with reduced color difference according to claim 1, wherein The quantum dot diffuser (50) is attached to the upper surface of the light guide plate (30) by an optical adhesive layer.
9. The side-in backlight module of claim 2, wherein, The blue light chip (42) is arranged in a linear array or a matrix array.
10. The side-in backlight module of claim 2, wherein, The light strip assembly (40) also includes a heat dissipation pad (44) disposed on the back side of the PCB substrate (41).