Wafer terminal assembling mechanism and method

Abstract

The invention provides a wafer terminal assembling mechanism and method. The wafer terminal assembling mechanism comprises a wafer terminal body feeding mechanism, a shielding sheet feeding mechanism, a shielding sheet transferring mechanism and a wafer terminal body positioning mechanism, wherein the shielding sheet feeding mechanism, the shielding sheet transferring mechanism and the wafer terminal body positioning mechanism are arranged on the side face of the wafer terminal body feeding mechanism. Wherein the wafer terminal body feeding mechanism, the shielding sheet feeding mechanism, the shielding sheet transfer mechanism and the wafer terminal body positioning mechanism are all mounted on the rack; the wafer terminal body feeding mechanism is used for achieving intermittent feeding of wafer terminal bodies. The shielding sheet feeding mechanism is used for conveying a shielding sheet material belt and cutting the shielding sheet to form single shielding sheets; the wafer terminal body positioning mechanism is used for positioning and fixing the wafer terminal body in place; the shielding sheet transfer mechanism is used for transferring the shielding sheet to the wafer terminal body and then installing the shielding sheet on the wafer terminal body. The automatic assembling device is mainly used for achieving automatic assembling of the shielding piece, and the assembling efficiency of the shielding piece on the wafer terminal is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of connectors, and in particular to a wafer terminal assembly mechanism and method. Background Art

[0002] Connector, or CONNECTOR. It is also called connector, plug and socket in China. It generally refers to an electrical connector. It is a device that connects two active devices to transmit current or signals. Connectors are a component that our electronic engineering technicians often come into contact with.

[0003] The PSAS5.0 series of high-speed female connectors has a large number of wafers and a long volume due to product structure limitations. The connector has a variety of terminals, such as BL terminals, 7-pin wafer terminals, SAS6-pin terminals, SATA15-pin terminals, and 40-pin wafer terminals. The industry for inserting wafer terminals cannot realize automated production and needs to perform step-by-step operations. The existing technology is to assemble the bent wafer terminals with manual wires and install the wafer terminals in a plastic housing, which is extremely inefficient and has high labor costs.

[0004] Especially when assembling wafer terminals, it is necessary to install a shielding sheet on the wafer terminals, and after installing the shielding sheet, the wafer terminals are inserted into the plastic shell of the connector. Currently, the installation of the shielding sheet can only be done manually, and the assembly efficiency is very low. Summary of the invention

[0005] The object of the present invention is to provide a wafer terminal assembly mechanism and method, which are mainly used to realize the automatic assembly of the shielding sheet and improve the assembly efficiency of the shielding sheet on the wafer terminal.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0007] A wafer terminal assembly mechanism comprises a wafer terminal body feeding mechanism, a shielding sheet feeding mechanism arranged on the side of the wafer terminal body feeding mechanism, a shielding sheet transfer mechanism and a wafer terminal body positioning mechanism;

[0008] Among them, the wafer terminal body feeding mechanism, the shielding sheet feeding mechanism, the shielding sheet transfer mechanism and the wafer terminal body positioning mechanism are all installed on the frame;

[0009] The wafer terminal body feeding mechanism is used to realize intermittent feeding of the wafer terminal body;

[0010] The shielding sheet feeding mechanism is used to realize the conveyance of the shielding sheet material strip and to cut the shielding sheet into individual shielding sheets;

[0011] The wafer terminal body positioning mechanism is used to position and fix the wafer terminal body in place;

[0012] The shielding sheet transfer mechanism is used to transfer the shielding sheet to the wafer terminal body and then install the shielding sheet on the wafer terminal body.

[0013] Among them, the shielding sheet feeding mechanism includes a first bracket, a shielding sheet flow channel arranged on the first bracket, a cutting unit, a driving unit and a pressing unit arranged in sequence in the moving direction of the shielding sheet, and a transverse feeding unit is arranged below the cutting unit. The driving unit is used to drive the shielding sheet to move in the shielding sheet flow channel, the pressing unit is used to roll the shielding sheet entering the shielding sheet flow channel, and the transverse feeding unit is used to carry a single shielding sheet formed by cutting the shielding sheet strip through the cutting unit.

[0014] Furthermore, the shielding sheet flow channel includes a first flow channel and a second flow channel installed on a first bracket, the first flow channel and the second flow channel are arranged in parallel, guide grooves are arranged on the first flow channel and the second flow channel, a first yield groove is arranged at the bottom of the guide groove, and a shielding sheet moving area is formed between the guide grooves of the first and second flow channels.

[0015] Preferably, a pressure plate is provided on the first flow channel and the second flow channel, the pressure plate is located above the guide groove, and a second yielding groove is provided on the pressure plate.

[0016] Preferably, the first flow channel and the second flow channel are provided with a first guide inclined surface communicating with the guide groove.

[0017] The pressing unit further includes a pressing support, a cover plate, a first spring, a pressing block and a pressing wheel. A step groove is provided on the pressing support. The pressing block is slidably installed in the step groove. The first spring is located in the step groove and contacts the pressing block. The cover plate is fixedly connected to the pressing support. The first spring contacts the cover plate. The pressing wheel is rotatably installed on the pressing block. Under the action of the first spring, the pressing wheel presses the shielding sheet material strip onto the shielding sheet flow channel.

[0018] Furthermore, the driving unit includes a mounting plate, a horizontal slide, a first telescopic rod, a second telescopic rod and a first vertical slide, the mounting plate is fixedly mounted on the first bracket, the horizontal slide is slidably mounted on the first bracket, a first mounting seat is fixedly provided on the horizontal slide, the first vertical slide is slidably mounted on the first mounting seat, the first telescopic rod is fixedly mounted on the mounting plate and connected to the horizontal slide, the second telescopic rod is vertically arranged and connected to the first vertical slide after being installed on the mounting seat, and the lower end surface of the first vertical slide is provided with a first pin corresponding to the positioning holes on both sides of the shielding plate.

[0019] Preferably, the end of the first pin is in an inverted truncated cone structure.

[0020] Furthermore, the cutting unit is located above the horizontal feeding unit, and the cutting unit includes a second bracket, a third telescopic rod, and a second vertical slide. The second bracket is installed on the first bracket, and the second vertical slide is slidably installed on the second bracket. After the third telescopic rod is installed on the second bracket, it is connected to the second vertical slide. A punching head and a second pin are provided at the lower end of the second vertical slide. A limiting platform is provided on the first bracket. The shielding sheet is located on the limiting platform, and the shielding sheet strip is punched out by the punching head to form a single shielding sheet, which then falls on the horizontal feeding unit.

[0021] The invention also discloses a wafer terminal assembly method, which comprises using the wafer terminal assembly feeding mechanism to realize the installation of the shielding sheet.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] In actual use, the present invention is mainly used to realize the automatic installation of the shielding sheet of the wafer terminal. When in use, the wafer terminal body feeding mechanism realizes intermittent feeding of the wafer terminal body. The shielding sheet feeding mechanism conveys the shielding sheet material strip and forms a single shielding sheet after cutting the shielding sheet, so that the shielding sheet is cut to the position of the wafer terminal body at the preset position. The wafer terminal body is positioned by the wafer terminal body positioning mechanism. After the shielding sheet transfer mechanism transfers the shielding sheet to the wafer terminal body, the shielding sheet is installed on the wafer terminal body. In this way, the automatic assembly of the wafer terminal can be realized, and the assembly efficiency of the shielding sheet on the wafer terminal can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0026] Figure 2 It is a schematic diagram of the positional relationship among the cutting unit, the driving unit and the pressing unit of the present invention.

[0027] Figure 3 It is a schematic diagram of the overall structure of the lateral feeding unit of the present invention.

[0028] Figure 4 It is a schematic diagram of the overall structure of the shielding sheet transport mechanism of the present invention.

[0029] Figure 5 It is a schematic diagram of the installation relationship between the driving unit and the first bracket of the present invention.

[0030] Figure 6 It is a schematic diagram of the flow channel structure of the shielding plate of the present invention.

[0031] Figure 7 For the present invention Figure 6 A partial enlarged schematic diagram in the middle.

[0032] Figure 8 It is a schematic diagram of the overall structure of the wafer terminal body positioning mechanism of the present invention.

[0033] Fig. 9 For the present invention Figure 8 A partial enlarged schematic diagram of point B in the middle.

[0034] Fig.10 This is a schematic diagram of the shielding sheet of the present invention installed on the wafer terminal body.

[0035] Reference numerals:

[0036] 101 wafer terminal body feeding mechanism, 102 eighth telescopic rod, 103 shielding sheet, 104 wafer terminal body, 105 shielding sheet feeding mechanism, 106 first bracket, 107 shielding sheet flow channel, 108 cutting unit, 109 support frame, 110 first flow channel, 111 second flow channel, 112 guide groove, 113 first give way groove, 114 pressing plate, 115 push frame, 116 first guide slope, 117 pressing unit, 118 pressing support, 119 cover plate, 120 lower pressing plate, 121 pressing block, 122 pressing wheel, 123 driving unit, 124 mounting plate, 125 horizontal slide plate, 126 first telescopic rod, 127 second telescopic rod, 128 first vertical slide plate, 129 the A mounting seat, 130 a first pin, 131 a rolling wheel, 132 a second bracket, 133 a third telescopic rod, 134 a second vertical slide, 135 a punch head, 136 a second inclined plane, 137 a limiting platform, 138 a horizontal feeding unit, 139 a third bracket, 140 a fourth telescopic rod, 141 a third vertical slide block, 142 a bearing block, 143 a fifth telescopic rod, 144 a shielding sheet transport mechanism, 145 a fourth bracket, 146 a screw drive unit, 147 a fifth bracket, 148 a sixth telescopic rod, 149 a negative pressure suction head, 150 a wafer terminal body positioning mechanism, 151 a positioning seat, 152 a pushing block, 153 a connecting seat, 154 a seventh telescopic rod, 155 a first inclined plane, 156 a U-shaped notch. DETAILED DESCRIPTION

[0037] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the embodiments of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0038] In the description of the embodiments of the present invention, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0040] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0041] In the embodiments of the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0042] The disclosure below provides many different embodiments or examples to implement different structures of the embodiments of the present invention. In order to simplify the disclosure of the embodiments of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the embodiments of the present invention. In addition, the embodiments of the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0043] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0044] See also Figure 1-Figure 10 , this embodiment discloses a wafer terminal assembly mechanism, including a wafer terminal body feeding mechanism 101, a shielding sheet feeding mechanism 105 arranged on the side of the wafer terminal body feeding mechanism 101, a shielding sheet transfer mechanism 144 and a wafer terminal body positioning mechanism 150;

[0045] Among them, the wafer terminal body feeding mechanism 101, the shielding sheet feeding mechanism 105, the shielding sheet transfer mechanism 144 and the wafer terminal body positioning mechanism 150 are all installed on the frame;

[0046] The wafer terminal body feeding mechanism 101 is used to realize intermittent feeding of the wafer terminal body;

[0047] The shielding sheet feeding mechanism 105 is used to realize the conveyance of the shielding sheet 103 material strip and to cut the shielding sheet 103 into individual shielding sheets 103;

[0048] The wafer terminal body positioning mechanism 150 is used to position and fix the wafer terminal body 104 in place;

[0049] The shielding sheet transfer mechanism 144 is used to transfer the shielding sheet 103 to the wafer terminal body 104 and then install the shielding sheet 103 on the wafer terminal body 104 .

[0050] In actual use, the present invention is mainly used to realize the automatic installation of the shielding sheet 103 of the wafer terminal. When in use, the wafer terminal body feeding mechanism 101 realizes intermittent feeding of the wafer terminal body, the shielding sheet feeding mechanism 105 conveys the shielding sheet 103 material strip, and forms a single shielding sheet 103 after cutting the shielding sheet 103, so that the shielding sheet 103 is cut to the position of the wafer terminal body 104 at the preset position, and the wafer terminal body 104 is positioned by the wafer terminal body positioning mechanism 150, and the shielding sheet transfer mechanism 144 transfers the shielding sheet 103 to the wafer terminal body 104, and then installs the shielding sheet 103 on the wafer terminal body 104. In this way, the automatic assembly of the wafer terminal can be realized, and the assembly efficiency of the shielding sheet 103 on the wafer terminal can be improved.

[0051] Among them, the shielding sheet feeding mechanism 105 includes a first bracket 106, a shielding sheet flow channel 107 arranged on the first bracket 106, a cutting unit 108, a driving unit 123 and a pressing unit 117 which are arranged in sequence in the moving direction of the shielding sheet 103, and a transverse feeding unit 138 is arranged below the cutting unit 108. The driving unit 123 is used to drive the shielding sheet 103 to move in the shielding sheet flow channel 107, the pressing unit 117 is used to roll the shielding sheet 103 entering the shielding sheet flow channel 107, and the transverse feeding unit 138 is used to carry a single shielding sheet 103 formed by cutting the shielding sheet 103 strip by the cutting unit 108.

[0052] In order to facilitate the feeding of the shielding sheet 103, in actual use, the shielding sheet 103 is formed into a material strip (shielding sheet material strip) by stamping, and the material strip is sent to the shielding sheet flow channel 107 so that the material strip can move smoothly in the shielding sheet flow channel 107, and the cutting unit 108 is used to cut the material strip into a single shielding sheet 103. The set pressing unit 117 enables the material strip to move more stably in the shielding sheet flow channel 107. After the single shielding sheet 103 is formed, the horizontal feeding unit 138 realizes the transfer of the shielding sheet 103.

[0053] Among them, in this embodiment, the shielding sheet flow channel 107 includes a first flow channel 110 and a second flow channel 111 installed on the first bracket 106, the first flow channel 110 and the second flow channel 111 are arranged in parallel, and guide grooves 112 are arranged on the first flow channel 110 and the second flow channel 111, and a first yield groove 113 is arranged at the bottom of the guide groove 112, and a shielding sheet 103 movement area is formed between the guide grooves 112 of the first and second flow channels.

[0054] The first clearance groove 113 can serve the purpose of making way, so that the driving unit 123 can drive the material belt after passing through the first clearance groove 113 and contacting the material belt, so that the material belt can be closely attached to the bottom of the guide groove 112 .

[0055] Furthermore, in actual use, a pressing plate 114 is provided on the first flow channel 110 and the second flow channel 111, and the pressing plate 114 is located above the guide groove 112. A second clearance groove is provided on the pressing plate 114. The setting of the pressing plate 114 can realize the position limiting of the material belt during the movement, so that the material belt can move along a preset track, and the material belt is prevented from slipping out of the guide groove 112.

[0056] In some preferred implementation cases, the first flow channel 110 and the second flow channel 111 are provided with a first guide slope 116 connected to the guide groove 112 , and when the material strip enters the guide groove 112 , the first guide slope 116 can serve the purpose of guidance.

[0057] The pressing unit 117 includes a pressing support 118, a cover plate 119, a first spring, a pressing block 121 and a pressing wheel 122. The pressing support 118 is provided with a stepped groove, the pressing block 121 is slidably installed in the stepped groove, the first spring is located in the stepped groove and contacts the pressing block 121, the cover plate 119 is fixedly connected to the pressing support 118, the first spring contacts the cover plate 119, and the pressing wheel 122 is rotatably installed on the pressing block 121. Under the action of the first spring, the pressing wheel 122 presses the shielding sheet 103 material strip onto the shielding sheet flow channel 107. When the material strip moves in the guide groove 112, the material strip in the guide groove 112 is prone to warping. The set pressing unit 117 can make the material strip better fit with the bottom of the guide groove 112, which is convenient for subsequent cutting.

[0058] More importantly, since the material strip of the shielding sheet 103 is a rolled material, the provided pressing unit 117 can cooperate with the shielding sheet flow channel 107 to achieve the correction of the shielding sheet 103 .

[0059] Among them, the driving unit 123 includes a mounting plate 124, a horizontal slide 125, a first telescopic rod 126, a second telescopic rod 127 and a first vertical slide 128. The mounting plate 124 is fixedly mounted on the first bracket 106, the horizontal slide 125 is slidably mounted on the first bracket 106, a first mounting seat 129 is fixedly provided on the horizontal slide 125, the first vertical slide 128 is slidably mounted on the first mounting seat 129, the first telescopic rod 126 is fixedly mounted on the mounting plate 124 and connected to the horizontal slide 125, the second telescopic rod 127 is vertically arranged and connected to the first vertical slide 128 after being installed on the mounting seat, and the lower end surface of the first vertical slide 128 is provided with a first pin 130 corresponding to the positioning holes on both sides of the shielding plate 103.

[0060] Under the action of the horizontal slide 125 and the first vertical slide 128, the first pin 130 can be moved horizontally and vertically. After the first pin 130 moves vertically downward, it can pass through the second make way groove and contact the positioning holes on both sides of the shielding plate 103. At this time, the first pin 130 extends into the first make way groove 113. Under the action of the first telescopic rod 126, the first pin 130 can drive the material belt, and the material belt can be reset after it is in place. Such a reciprocating cycle can realize intermittent feeding of the material belt.

[0061] Furthermore, the end of the first pin 130 is in an inverted truncated cone structure, and the truncated cone structure can serve as a guide, making it easier for the first pin 130 to be inserted into the positioning hole.

[0062] Among them, the cutting unit 108 is located above the horizontal feeding unit 138, and the cutting unit 108 includes a second bracket 132, a third telescopic rod 133, and a second vertical slide 134. The second bracket 132 is installed on the first bracket 106, and the second vertical slide 134 is slidably installed on the second bracket 132. After the third telescopic rod 133 is installed on the second bracket 132, it is connected to the second vertical slide 134. A punch head 135 and a second pin are provided at the lower end of the second vertical slide 134. A limiting platform 137 is provided on the first bracket 106. The shielding sheet 103 is located on the limiting platform 137, and the shielding sheet 103 strip is punched out by the punch head 135 to form a single shielding sheet 103, and then falls on the horizontal feeding unit 138.

[0063] After the material strip reaches the bottom of the cutting unit 108, the third telescopic rod 133 can drive the second vertical slide plate 134 to move toward the material strip, and the material strip is supported under the action of the limit platform 137. After the punch head 135 contacts the material strip, the material strip is cut.

[0064] Furthermore, in actual use, the third bracket 139, the fourth telescopic rod 140, the third vertical slider 141, the bearing block 142 and the fifth telescopic rod 143 are included above the horizontal feeding unit 138. The third bracket 139 is slidably installed on the frame. The fourth telescopic rod 140 is installed on the first bracket 106 and is connected to the third bracket 139, and is used to drive the third bracket 139 to move. The third vertical slider 141 is slidably installed on the third bracket. The fifth telescopic rod 143 is installed on the third bracket 139 and is slidably connected to the third vertical slider 141. The bearing block 142 is provided with a bearing groove matching the structure of the shielding plate 103. The bearing block 142 is slidably connected to the third vertical slider 141 through a guide rod. A limiting bolt is provided at the end of the guide rod. A supporting spring is provided between the third vertical slider 141 and the bearing block 142. The bearing block 142 is in contact with the limiting portion and is in a flush state.

[0065] During use, since a supporting spring is provided between the supporting block 142 and the third vertical slider 141, when the shielding sheet 103 is punched, the punching head 135 presses the shielding sheet 103 onto the supporting block 142. During punching, the shielding sheet 103 is always in a pressed state. After the shielding sheet 103 is punched to form a single shielding sheet 103, the shielding sheet 103 is located on the supporting block 142. Under the action of the supporting spring, when the third vertical slider 141 is reset, the supporting block 142 will rise synchronously. When the third vertical slider 141 leaves the shielding sheet 103, the shielding sheet 103 will not jump.

[0066] The shielding sheet transfer mechanism 144 includes a fourth bracket 145, a screw drive unit 146, a fifth bracket 147, a sixth telescopic rod 148 and a negative pressure suction head 149. The fourth bracket 145 is fixedly installed on the frame, and the fifth bracket 147 is slidably installed on the fourth bracket 145. After the screw drive unit 146 is installed on the fourth bracket 145, it is used to drive the fifth bracket 147 to move on the fourth bracket 145. After the sixth telescopic rod 148 is installed on the fifth bracket 147, the movable end of the sixth telescopic rod 148 is connected to the negative pressure suction head 149. The negative pressure suction head 149 is connected to a negative pressure device, and a plurality of negative pressure adsorption holes are arranged on the negative pressure head.

[0067] In this way, in actual use, the shielding sheet 103 is fixed by negative pressure adsorption through the negative pressure head, and the screw drive unit 123 drives the fifth bracket 147 to move on the fourth bracket 145, so that the shielding sheet 103 can be close to or away from the wafer terminal body 104. When the shielding sheet 103 is located above the wafer terminal body 104, the sixth telescopic rod 148 drives the negative pressure suction head 149 to approach the wafer terminal body 104, and mounts the shielding sheet 103 on the wafer terminal body 104, thereby realizing the installation of the shielding sheet 103 on the wafer terminal body 104.

[0068] In actual use, the wafer terminal body positioning mechanism 150 includes a positioning seat 151, a pushing block 152, a connecting seat 153 and a seventh telescopic rod 154. The connecting seat 153 is fixedly mounted on the bracket of the wafer terminal body feeding mechanism 101. The connecting seat 153 is provided with a first slide groove. After the pushing block 152 is slidably installed in the first slide groove, the lower end is connected to the seventh telescopic rod 154. The pushing block 152 is provided with a first inclined surface 155. The positioning seat 151 has a U-shaped notch 156. The positioning seat 151 is slidably installed on the connecting seat 153. A tension spring is arranged between the positioning seat 151 and the connecting seat 153. A rolling wheel 131 is rotatably arranged on the side of the positioning seat 151 away from the U-shaped notch 156. Under the action of the tension spring, the rolling wheel 131 contacts the first inclined surface 155.

[0069] Since the wafer terminal body 104 realizes intermittent feeding under the action of the wafer terminal body feeding mechanism 101, when the wafer terminal body 104 moves to the position of the positioning seat 151, at this time, under the action of the seventh telescopic rod 154, the pushing block 152 moves upward, and under the action of the first inclined surface 155, the positioning seat 151 will move toward the wafer terminal body 104, and fix the wafer terminal body 104 in the U-shaped groove 156, so as to realize the positioning and limiting of the wafer terminal body 104, so as to facilitate the negative pressure suction head 149 to accurately move the shielding sheet 103 to the top of the wafer terminal body 104 to realize the clamping operation of the shielding sheet 103.

[0070] Furthermore, in actual use, the wafer terminal body positioning mechanism 150 also includes an eighth telescopic rod 102, a support frame 109, a push frame 115 and a lower pressure plate 120. The support frame 109 is fixedly mounted on the bracket of the wafer terminal body feeding mechanism 101. The eighth telescopic rod 102 is installed on the support frame 109 and then connected to the push frame 115. The push frame 115 is slidably mounted on the support frame 109. The lower pressure plate 120 is fixedly connected to the push frame 115, and a second inclined surface 136 is provided on the lower pressure plate 120.

[0071] After the negative pressure suction head 149 installs the shielding sheet 103 on the wafer terminal body 104, the eighth telescopic rod 102 drives the push frame 115 to move, so that the lower pressure plate 120 moves toward the wafer terminal body 104 to above the shielding sheet 103 on the wafer terminal body 104. At this time, the lower pressure plate 120 will be located above the shielding sheet 103 to prevent the installed shielding sheet 103 from being taken away from the wafer terminal body 104 when the negative pressure suction head 149 is reset. After the negative pressure suction head 149 is reset, the lower pressure plate 120 is reset horizontally, and the wafer terminal body 104 with the shielding sheet 103 installed is moved to the next process.

[0072] This embodiment also discloses a wafer terminal assembly method, including using the wafer terminal assembly feeding mechanism described above to achieve installation of the shielding sheet 103 .

[0073] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0074] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer terminal assembly mechanism, characterized in that: It includes a wafer terminal body feeding mechanism, a shielding sheet feeding mechanism arranged on the side of the wafer terminal body feeding mechanism, a shielding sheet transfer mechanism and a wafer terminal body positioning mechanism; Among them, the wafer terminal body feeding mechanism, the shielding sheet feeding mechanism, the shielding sheet transfer mechanism and the wafer terminal body positioning mechanism are all installed on the frame; The wafer terminal body feeding mechanism is used to realize intermittent feeding of the wafer terminal body; The shielding sheet feeding mechanism is used to realize the conveyance of the shielding sheet material strip and to cut the shielding sheet into individual shielding sheets; The wafer terminal body positioning mechanism is used to position and fix the wafer terminal body in place; The shielding sheet transfer mechanism is used to transfer the shielding sheet to the wafer terminal body and then install the shielding sheet on the wafer terminal body.

2. A wafer terminal assembly feeding mechanism according to claim 1, characterized in that: The shielding sheet feeding mechanism includes a first bracket, a shielding sheet flow channel arranged on the first bracket, a cutting unit, a driving unit and a pressing unit arranged in sequence in the moving direction of the shielding sheet, and a transverse feeding unit is arranged below the cutting unit. The driving unit is used to drive the shielding sheet to move in the shielding sheet flow channel, the pressing unit is used to roll the shielding sheet entering the shielding sheet flow channel, and the transverse feeding unit is used to carry a single shielding sheet formed by cutting the shielding sheet strip through the cutting unit.

3. A wafer terminal assembly feeding mechanism according to claim 2, characterized in that: The shielding sheet flow channel includes a first flow channel and a second flow channel installed on a first bracket. The first flow channel and the second flow channel are arranged in parallel. Guide grooves are arranged on the first flow channel and the second flow channel. A first yield groove is arranged at the bottom of the guide groove. A shielding sheet moving area is formed between the guide grooves of the first and second flow channels.

4. The wafer terminal assembly feeding mechanism according to claim 3, characterized in that: A pressing plate is arranged on the first flow channel and the second flow channel. The pressing plate is located above the guide groove and a second giving way groove is arranged on the pressing plate.

5. The wafer terminal assembly feeding mechanism according to claim 3, characterized in that: The first flow channel and the second flow channel are provided with a first guide inclined surface communicating with the guide groove.

6. The wafer terminal assembly feeding mechanism according to claim 2, characterized in that: The pressing unit includes a pressing support, a cover plate, a first spring, a pressing block and a pressing wheel. A step groove is provided on the pressing support. The pressing block is slidably installed in the step groove. The first spring is located in the step groove and contacts the pressing block. The cover plate is fixedly connected to the pressing support. The first spring contacts the cover plate. The pressing wheel is rotatably installed on the pressing block. Under the action of the first spring, the pressing wheel presses the shielding sheet material belt onto the shielding sheet flow channel.

7. The wafer terminal assembly feeding mechanism according to claim 2, characterized in that: The driving unit includes a mounting plate, a horizontal slide, a first telescopic rod, a second telescopic rod and a first vertical slide. The mounting plate is fixedly mounted on the first bracket, the horizontal slide is slidably mounted on the first bracket, a first mounting seat is fixedly provided on the horizontal slide, the first vertical slide is slidably mounted on the first mounting seat, the first telescopic rod is fixedly mounted on the mounting plate and connected to the horizontal slide, the second telescopic rod is vertically arranged and connected to the first vertical slide after being mounted on the mounting seat, and the lower end surface of the first vertical slide is provided with first pins corresponding to the positioning holes on both sides of the shielding plate.

8. The wafer terminal assembly feeding mechanism according to claim 7, characterized in that: The end of the first pin is in an inverted truncated cone structure.

9. The wafer terminal assembly feeding mechanism according to claim 2, characterized in that: The cutting unit is located above the horizontal feeding unit, and the cutting unit includes a second bracket, a third telescopic rod, and a second vertical slide. The second bracket is installed on the first bracket, and the second vertical slide is slidably installed on the second bracket. The third telescopic rod is installed on the second bracket and connected to the second vertical slide. A punching head and a second pin are provided at the lower end of the second vertical slide. A limiting platform is provided on the first bracket. The shielding sheet is located on the limiting platform, and the shielding sheet strip is punched by the punching head to form a single shielding sheet, which then falls on the horizontal feeding unit.

10. A wafer terminal assembly method, characterized in that: The invention comprises using the wafer terminal assembly feeding mechanism described in any one of claims 1 to 9 to realize the installation of the shielding sheet.

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