Display module, manufacturing method and display device

Abstract

The invention discloses a display module, a manufacturing method and a display device. The display module of one embodiment comprises a display area, a non-display area at least partially surrounding the display area, a bending area connected with one end of the non-display area and a binding area connected with the bending area. The display module comprises a substrate. The display light-emitting layer is located on the substrate of the display area; the wiring layer is located on the substrate in the non-display area, the bending area and the binding area, and the wiring layer is electrically connected with the display light-emitting layer; the polarization layer is positioned on one side, far away from the substrate, of the display light-emitting layer; the protection layer is positioned on one side, far away from the substrate, of the wiring layer in the bending area; the protective layer is provided with a binding area, the driving chip is bound with the binding area, the extension direction of the binding boundary of the binding area and the driving chip is a first direction, and the orthographic projection of the protective layer on the substrate comprises a plurality of projection blocks at intervals in the first direction.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and more specifically, to a display module, a manufacturing method and a display device. Background Art

[0002] With the rapid expansion of the OLED (organic light-emitting diode) display market, more and more types of display products are rapidly pouring into the market. The surge in product volume has also put great pressure on screen manufacturers. How to solve the pain points and difficult process problems in production and quickly and stably mass produce has become an urgent problem to be solved. In the MDL process, there are many stubborn defects. In the production process of display modules, the proportion of bright lines and abnormal display caused by the bending and breaking of the binding area of ​​the display module is quite high. Since the bending process is already the latter part of the display module process, the loss caused by the defect in the bending section is huge. Therefore, it is necessary to improve the process for the bending and breaking caused by the bending process. Summary of the invention

[0003] An object of the present invention is to provide a display module, a manufacturing method and a display device to solve at least one of the problems existing in the prior art.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions:

[0005] A first aspect of the present invention provides a display module, the display module comprising a display area, a non-display area at least partially surrounding the display area, a bending area connected to one end of the non-display area, and a binding area connected to the bending area, the display module comprising:

[0006] substrate;

[0007] A display light emitting layer located on the substrate in the display area;

[0008] A wiring layer located on the substrate in the non-display area, the bending area and the binding area, the wiring layer being electrically connected to the display light-emitting layer;

[0009] A polarizing layer located on a side of the display light-emitting layer away from the substrate;

[0010] A protection layer located at a side of the routing layer in the bending region away from the substrate; and

[0011] A driving chip is bound to the binding area, the extending direction of the binding boundary between the binding area and the driving chip is a first direction, and the orthographic projection of the protection layer on the substrate includes a plurality of projection blocks with intervals in the first direction.

[0012] In an optional embodiment, the orthographic projection of the routing layer on the substrate is located at the two side ends of the bending zone and the central area of ​​the bending zone, and the projection blocks of the orthographic projection of the protective layer on the substrate respectively cover the orthographic projection of the routing layer on the substrate located at the two side ends of the bending zone and the central area of ​​the bending zone.

[0013] In an optional embodiment, in the orthographic projection of the bending region on the substrate, both side ends of the bending region include a first end located at one edge and a second end located at another edge and arranged opposite to the first end along a first direction.

[0014] The routing layer at least includes a first routing portion located at the first end position, a second routing portion located at the second end position, and a third routing portion located between the first routing portion and the second routing portion;

[0015] The protective layer at least comprises:

[0016] The first protection portion covers the first routing portion;

[0017] The second protection portion covers the second routing portion; and

[0018] The third protection portion covers the third routing portion. In an optional embodiment, a direction perpendicular to the first direction is a second direction.

[0019] The length of the protective layer in the second direction is greater than the length of the bending area in the second direction,

[0020] The projection boundary of the protective layer on the side of the orthographic projection of the substrate close to the polarizing layer overlaps with the projection boundary of the polarizing layer on the side of the orthographic projection of the substrate close to the bending region;

[0021] There is a gap between a projection boundary of the protection layer on a side of the substrate where the orthographic projection is far from the polarizing layer and a projection boundary of the driving chip on a side of the substrate where the orthographic projection is close to the bending region.

[0022] In an optional embodiment, the display module further includes a blocking dam surrounding one or more of the first protective portion, the second protective portion and the third protective portion, the blocking dam surrounds the surrounded protective portion in its orthographic projection on the substrate, the height of the blocking dam is higher than the height of the protective portion surrounded by the blocking dam, and the viscosity of the blocking dam is greater than the viscosity of the protective layer.

[0023] In an optional embodiment, a projection boundary of the blocking dam on a side of the substrate close to the polarizing layer overlaps with a projection boundary of the polarizing layer on a side of the substrate close to the bending region.

[0024] There is a gap between a projection boundary of the blocking dam on a side of the substrate away from the polarized light and a projection boundary of the driving chip on a side of the substrate close to the bending region.

[0025] In an optional embodiment, the width L of each barrier edge of the barrier dam is MCL The calculation formula is:

[0026] L MCL =π(Bending R+0.012)+(0.3~0.95);

[0027] Wherein, Bending R is the bending radius of the bending zone.

[0028] In an optional embodiment, the polarizing layer includes a polarizing bottom surface attached to the display light-emitting layer, a polarizing top surface opposite to the polarizing bottom surface, and a polarizing side surface perpendicular to the polarizing bottom surface and the polarizing top surface, and the polarizing side surface is located on a side of the polarizing layer close to the protective layer.

[0029] A first absorption groove is provided on the polarizing side surface, and the first absorption groove extends along a second direction from the polarizing side surface toward a central area of ​​the display area.

[0030] The first absorption groove comprises a first inner groove surface close to the substrate and a second inner groove surface away from the substrate, and a surface of the protective layer away from the substrate is located between the first inner groove surface and the second inner groove surface of the first absorption groove.

[0031] In an optional embodiment, the length of the first absorption groove extending along the second direction from the polarizing side surface toward the display area is the groove depth distance of the first absorption groove.

[0032] The distance between the first inner groove surface and the second inner groove surface is the groove diameter of the first absorption groove;

[0033] The groove depth of the first absorption groove is less than the distance between the boundary of the non-display area where the polarizing side surface is located and the boundary of the display area.

[0034] In an optional embodiment, a second absorption groove is provided on the surface of the display light emitting layer close to the polarizing layer, and the second absorption groove extends from the surface of the display light emitting layer close to the polarizing layer toward the substrate.

[0035] The vertical surfaces of the protective layer and the polarizing layer that are bonded to each other extend along the first direction in the orthographic projection of the substrate, are discontinuous projections with intervals in the first direction, and fall in the orthographic projection of the second absorption groove on the substrate.

[0036] In an optional embodiment, the display module further includes at least one inorganic film layer between the encapsulation layer and the polarizing layer, and the second absorption groove is arranged on a surface of the inorganic film layer closest to the polarizing layer and close to the polarizer.

[0037] A second aspect of the present invention provides a display device, comprising the display module described in the first aspect of the present invention.

[0038] A third aspect of the present invention provides a method for manufacturing the display module according to the embodiment of the first aspect of the present invention, the method comprising:

[0039] forming a display light-emitting layer on the substrate corresponding to the display area;

[0040] Forming a wiring layer on the substrate corresponding to the non-display area, the bending area, and the binding area, wherein the wiring layer is electrically connected to the display light-emitting layer;

[0041] forming a polarizing layer on a side of the display light-emitting layer away from the substrate;

[0042] Coating a protective layer on the substrate corresponding to the bending area, wherein the protective layer extends along a first direction in an orthographic projection of the substrate and has a gap in the first direction; and

[0043] The driver chip is bound to the binding area, the extension direction of the binding boundary between the binding area and the driver chip is a first direction, and the orthographic projection of the protection layer on the substrate includes a plurality of projection blocks with intervals in the first direction.

[0044] In an optional embodiment, the forming of a wiring layer on the substrate corresponding to the non-display area, the bending area, and the binding area further includes:

[0045] forming a metal trace on the substrate corresponding to the non-display area;

[0046] Forming a first routing portion located at the first end, a second routing portion located at the second end, and a third routing portion located between the first routing portion and the second routing portion on the substrate corresponding to the bending region;

[0047] forming a metal trace on the substrate corresponding to the bonding area;

[0048] The step of coating a protective layer on the substrate corresponding to the bending region further comprises:

[0049] A protective layer is coated on the surface corresponding to the first routing portion, the second routing portion and the third routing portion which are away from the substrate.

[0050] In an optional embodiment, before coating the protective layer on the substrate corresponding to the bending area, the method further includes:

[0051] A blocking dam of an annular structure is formed at a position corresponding to one or more of the first protective portion, the second protective portion and the third protective portion, wherein the blocking dam surrounds the surrounding protective portion in the orthographic projection of the substrate, the height of the blocking dam is higher than the height of the protective portion surrounded by the blocking dam, and the viscosity of the blocking dam is greater than the viscosity of the protective layer.

[0052] In an optional embodiment, the polarizing layer located on a side of the display light-emitting layer away from the substrate further includes:

[0053] A first absorption groove is provided on the polarizing side surface of the polarizing layer close to the protective layer, and the first absorption groove extends along the second direction and from the polarizing side surface toward the display area.

[0054] In an optional embodiment, forming a display light-emitting layer on the substrate corresponding to the display area further comprises:

[0055] A second absorption groove is formed on a surface of the display light emitting layer close to the polarizing layer, and the second absorption groove extends from the surface of the display light emitting layer close to the polarizing layer toward the substrate.

[0056] The beneficial effects of the present invention are as follows:

[0057] The segmented protective layer of the embodiment of the present invention not only protects the wiring layer, but also can reduce the bending stress received by the layer structure of the display module during the bending process, especially can reduce the bending stress received by the wiring layer serving as the neutral layer during the bending process, and at the same time alleviate the problem of thickening of the film layer of the polarizing layer close to the protective layer due to the siphon effect, thereby avoiding the risk of breakage of the wiring layer of the display module during the bending process, and avoiding deformation, breakage, bright lines, or abnormal display and other defects of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] The specific implementation modes of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0059] Figure 1 A schematic diagram showing a structure of a display module of the related art showing a siphon effect;

[0060] Figure 2 A schematic structural diagram showing a bent state of a display module according to an embodiment of the present invention;

[0061] Figure 3 Show Figure 2 A schematic diagram of the top view of the display module shown;

[0062] Figure 4 Show Figure 2 A schematic structural diagram of the display module in a non-bent state shown;

[0063] Figure 5 A schematic diagram showing a top view of a display module with a barrier dam structure according to an embodiment of the present invention;

[0064] Figure 6 Show Figure 5 A schematic structural diagram of the display module in a non-bent state shown;

[0065] Figure 7 A schematic diagram showing a structure of a first absorption tank according to an embodiment of the present invention;

[0066] Figure 8 A schematic diagram showing a structure of a second absorption tank according to an embodiment of the present invention;

[0067] Fig. 9 A schematic diagram showing the position of the inorganic film layer according to an embodiment of the present invention. DETAILED DESCRIPTION

[0068] In order to explain the present invention more clearly, the present invention is further described below in conjunction with embodiments and drawings. Similar components in the drawings are represented by the same reference numerals. It should be understood by those skilled in the art that the content specifically described below is illustrative rather than restrictive, and the protection scope of the present invention should not be limited thereto.

[0069] In the manufacturing process of the display module, there is a technical difficulty that the display module is prone to bending and breaking due to bending, resulting in greater stress on the layer structure of the display module in the bent section, resulting in deformation, breakage, bright lines, or abnormal display defects in the display module.

[0070] In view of this, the present invention provides a display module, a manufacturing method and a display device to solve at least one of the above problems.

[0071] In related technologies, such as Figure 1 As shown, the display module includes a display area AA, a non-display area NA at least partially surrounding the display area AA, a bending area WZ connected to one end of the non-display area NA, and a binding area BD connected to the bending area WZ. During the manufacturing process of the display module, part of the bending area WZ and the binding area BD are folded to the non-light-emitting side of the display module to reduce the border of the display module.

[0072] Based on the above discussion, during the bending process, the bending zone WZ and the circuits of the display module near the bending zone WZ are subjected to greater stress, resulting in deformation, breakage, bright lines or abnormal display defects of the display module.

[0073] And, if Figure 1 As shown, in the manufacturing process, it is usually necessary to coat the protective layer 50 on the routing line of the bending zone WZ. When the protective layer 50 is coated, the material fluidity will converge toward the bottom of the polarizing layer 40 close to the binding zone BD. The bottom of the polarizing layer 40 can block and limit the material flow of the protective layer 50. However, since the colloid material of the protective layer 50 is in contact with the polarizing layer 40, the bottom of the polarizing layer 40 that is higher than the material part of the protective layer 50 will produce a siphon effect, such as Figure 1 As shown, the glue of the protective layer 50 is continuously sucked upward, so that the thickness of the protective layer 50 close to the polarizing layer 40 is greater than the thickness of the protective layer 50 close to the binding area BD.

[0074] Based on the above layer structure, the neutral layer of the display module is generally set on the wiring layer 30. The purpose of this setting is to make the force on the wiring layer 30 during the bending process as zero as possible, thereby avoiding the tearing of the line. Figure 1 As shown in FIG. 1 , due to the siphon effect of the polarizing layer 40 on the protective layer 50, the following may occur: Figure 1 The thickness of the protective layer 50 on the side of the polarizing layer 40 is greater than the thickness of the protective layer 50 on the side close to the binding area BD. This will cause the actual neutral layer to move upward during bending, which will cause the routing layer 30 serving as the neutral layer to be subjected to both compression and tensile stresses. At this time, the risk of line breakage of the routing layer 30 serving as the neutral layer is greatly increased.

[0075] Therefore, in view of this, in an optional embodiment, Figure 2 and Figure 3 As shown, the display module includes:

[0076] Substrate 10,

[0077] A display light emitting layer 20 located on the substrate 10 in the display area AA;

[0078] A wiring layer 30 located on the substrate 10 in the non-display area NA, the bending area WZ and the binding area BD, wherein the wiring layer 30 is electrically connected to the display light-emitting layer 20;

[0079] A polarizing layer 40 located on a side of the display light emitting layer 20 away from the substrate 10;

[0080] A protection layer 50 located at a side of the wiring layer 30 in the bending zone WZ away from the substrate 10; and

[0081] The driving chip 60 is located in the binding area BD and is bound to the wiring layer 30. The extending direction of the binding boundary between the binding area BD and the driving chip 60 is the first direction. For example, the driving chip 60 extends in the first direction. Figure 3 The first direction shown extends.

[0082] In this embodiment, the protective layer 50 has an interval in the first direction of the orthographic projection of the substrate 10, that is, the protective layer 50 of this embodiment is coated along the bending zone WZ in sections, such as Figure 3 As shown, the orthographic projection of the protection layer 50 on the substrate 10 includes a plurality of projection blocks with intervals in the first direction.

[0083] Based on the above configuration, the segmented protective layer 50 of the embodiment of the present invention can not only protect the wiring layer 30, but also reduce the bending stress received by the layer structure of the display module during the bending process, especially reduce the bending stress received by the wiring layer 30 as the neutral layer during the bending process, and at the same time alleviate the problem of thickening of the film layer of the polarizing layer 40 close to the protective layer 50 due to the siphon effect, thereby avoiding the risk of breakage of the wiring layer 30 of the display module during the bending process, and avoiding deformation, breakage, bright lines, or abnormal display and other defects of the display module.

[0084] In an optional embodiment, if Figure 3 As shown, the orthographic projection of the routing layer 30 on the substrate 10 is located at the two side ends of the bending zone WZ and the central area of ​​the bending zone WZ, and the projection blocks of the orthographic projection of the protective layer 50 on the substrate 10 respectively cover the orthographic projection of the routing layer 30 located at the two side ends of the bending zone and the central area of ​​the bending zone on the substrate 10.

[0085] In the present embodiment, the protective layer 50 is designed with a discontinuous distribution in three sections, namely, left, middle and right. Through this design, the protective layer 50 can protect the important wiring concentrated in the display module. Moreover, under the discontinuous distribution design of the protective layer 59, the protective layer 50 is not coated in the intermittent area of ​​the projection, and the intermittent area of ​​the projection will not form a contact surface between the protective layer 50 and the polarizing layer 40. By reducing the contact area between the protective layer 50 and the polarizing layer 40, the siphon effect of the polarizing layer 40 on the protective layer 50 is effectively reduced. Therefore, the risk of breakage in the bending process of the display module can be effectively reduced.

[0086] In an optional embodiment, in the orthographic projection of the bending region on the substrate, both side ends of the bending region include a first end located at one edge and a second end located at another edge and arranged opposite to the first end along a first direction.

[0087] The routing layer 30 at least includes a first routing portion 31 located at the first end position, a second routing portion 32 located at the second end position, and a third routing portion 33 located between the first routing portion 31 and the second routing portion 32 .

[0088] In this embodiment, the first routing portion 31, the third routing portion 33 and the second routing portion 32 are respectively located at the left, middle and right positions of the bending zone WZ, such as touch signal routing and data signal lines, to achieve line connection of the display area.

[0089] In an optional embodiment, if Figure 3 As shown, the protective layer 50 at least includes:

[0090] The first protection portion 51 covers the first wiring portion 31;

[0091] The second protection portion 52 covers the second wiring portion 32; and

[0092] The third protection portion 53 covers the third wiring portion 33 .

[0093] That is, the first protection portion 51 , the second protection portion 51 and the third protection portion 53 are respectively arranged corresponding to the first routing portion 31 , the second routing portion 32 and the third routing portion 33 to protect each routing portion respectively.

[0094] In one embodiment, the first routing portion 31 has an arc-shaped edge near the edge end of the orthographic projection of the substrate 10, the second routing portion 32 has a rectangular orthographic projection on the substrate 10, and the third routing portion 33 has an arc-shaped edge near the edge end of the orthographic projection of the substrate 10.

[0095] like Figure 3 As shown, the first routing portion 31 and the third routing portion 33 are located at the left end and the right end of the bending zone WZ, and are arranged on both sides of the bending zone WZ. The first routing portion 31 and the third routing portion 33 are structures that are wide at the top and narrow at the bottom, that is, the length of the first routing portion 31 and the third routing portion 33 in the first direction on the side close to the display area AA is greater than the length in the first direction on the side close to the binding area BD. The second routing portion 32 is a rectangular structure, and is located in the middle position of the bending zone WZ to ensure the electrical uniformity of the routing of the display module.

[0096] The first protection portion 51, the second protection portion 52 and the third protection portion 53 are respectively the same in shape as the orthographic projections of the first routing portion 31, the second routing portion 32 and the third routing portion 33 on the substrate 10, that is, the first protection portion 51, the second protection portion 52 and the third protection portion 53 of the present embodiment respectively cover the first routing portion 31, the second routing portion 32 and the third routing portion 33 to comprehensively protect the routing.

[0097] It is worth mentioning that the shapes of the above-mentioned protection parts 51~53 and routing parts 31~33 are only one embodiment. Those skilled in the art take the covering of the orthographic projections of the routing parts 31~33 by the protection parts 51~53 as the design criterion. The orthographic projection shapes of the protection parts 51~53 and the routing parts 31~33 may be the same, or may be basically the same within the error range, which are all within the protection scope of this embodiment and will not be elaborated here. In an example, the coating length of the first protective portion 51 in the first direction is 10 mm, the distance between the first protective portion 51 and the second protective portion 52 in the first direction is 10 mm, the coating length of the second protective portion 52 in the first direction is 16.6 mm, the distance between the second protective portion 52 and the third protective portion 53 in the first direction is 10 mm, and the coating length of the third protective portion 53 in the first direction is 10 mm. Through this design, the protective layer 50 can protect important wiring concentrated in the display module, and under the intermittent distribution design of the protective layer 59, the protective layer 50 is not coated in the intermittent area of ​​the projection, and the intermittent area of ​​the projection will not form a contact surface between the protective layer 50 and the polarizing layer 40. By reducing the contact area between the protective layer 50 and the polarizing layer 40, the siphon effect of the polarizing layer 40 on the protective layer 50 is effectively reduced. Therefore, the risk of breakage in the bending process of the display module can be effectively reduced.

[0098] In an optional embodiment, the direction perpendicular to the first direction is the second direction, and the length of the protective layer 50 in the second direction is greater than the length of the bending zone WZ in the second direction. Figure 4 As shown, the protection layer 50 of this embodiment completely covers the bending zone WZ and the two side ends of the protection layer 50 in the second direction are arranged at the position of the partial binding area BD to completely protect the routing of the bending zone WZ.

[0099] In this embodiment, Figure 4 As shown, the projection boundary of the protective layer 50 on the side of the orthographic projection of the substrate 10 close to the polarizing layer 40 overlaps with the projection boundary of the polarizing layer 40 on the side of the orthographic projection of the substrate close to the bending zone WZ.

[0100] There is a gap between the projection boundary of the protective layer 50 on the side of the orthographic projection of the substrate 10 away from the polarizing layer 40 and the projection boundary of the orthographic projection of the driving chip 60 on the side of the substrate 10 close to the bending zone WZ. That is, the protective layer 50 of the embodiment of the present invention is in contact with the polarizing layer 40, that is, the vertical side of the protective layer 50 perpendicular to the horizontal plane of the substrate 10 and the vertical side of the polarizing layer 40 perpendicular to the horizontal plane of the substrate 10 are in contact, while the vertical side of the protective layer 50 perpendicular to the horizontal plane of the substrate 10 and the vertical side of the driving chip 60 perpendicular to the horizontal plane of the substrate 10 are not in contact, that is, there is a gap between the protective layer 50 and the driving chip 60 to prevent the protective layer 50 from affecting the circuit of the driving chip 60.

[0101] based on Figure 3 and Figure 4 In the embodiment shown, during the coating process of the protective layer 50, how to control the material flowability of the protective layer 50 to prevent the protective layer 50 from exceeding the setting position of the embodiment, therefore, the embodiment of the present invention further proposes a solution for controlling the material flowability of the protective layer 50. In an optional embodiment, as Figure 5 and Figure 6 As shown, the display module also includes a blocking dam 70 surrounding one or more of the first protective portion 51, the second protective portion 52 and the third protective portion 53, and the blocking dam 70 surrounds the surrounded protective portion in its orthographic projection on the substrate 10, and the height of the blocking dam 70 is higher than the height of the protective portion surrounded by the blocking dam 70.

[0102] In various structural designs of the barrier dam 70, the barrier dam 70 surrounds the first protection portion 51 and is higher than the first protection portion 51, or the barrier dam 70 surrounds the second protection portion 52 and is higher than the second protection portion 52, or the barrier dam 70 surrounds the third protection portion 53 and is higher than the third protection portion 53, and the barrier dam 70 is used to surround and limit one or more protection portions of the protective layer 50. Exemplarily, the height of the barrier dam 70 is 0.1±0.01mm, the thickness of the protective layer 50 is 0.07±0.02mm, and the height of the barrier dam 70 is slightly higher than the height of the protective layer 50, so as to prevent overflow when the material of the protective layer 50 is injected into the barrier dam 70.

[0103] In an optional embodiment, the material viscosity of the blocking dam 70 is greater than the material viscosity of the protective layer 50. By taking advantage of the characteristics of different materials, before coating the first protective portion 51, the second protective portion 52 and the third protective portion 53, the blocking dam 70 is first formed, and then the glue of each protective portion is injected into the blocking dam 70, so as to achieve precise coating at the coating position while limiting the material flow of the protective layer 50, thereby ensuring that there is a gap between each protective portion to reduce the stress of the display module and avoid interference with the polarizing layer 40 and the driving chip 60 during the manufacturing process due to process errors.

[0104] In an optional embodiment, if Figure 5 and Figure 6 As shown, the projection boundary of the blocking dam 70 on the side of the substrate near the polarizing layer 40 overlaps with the projection boundary of the substrate near the bending zone WZ, and there is a gap between the boundary of the substrate far away from the polarizing side of the substrate and the projection boundary of the driving chip 60 on the side of the substrate near the bending zone WZ. In other words, the vertical sidewall surface of the blocking dam 70 perpendicular to the horizontal plane of the substrate 10 and the vertical sidewall surface of the polarizing layer 40 perpendicular to the horizontal plane of the substrate 10 are in contact with each other, and there is a gap between the vertical sidewall surface of the blocking dam 70 perpendicular to the horizontal plane of the substrate 10 and the vertical sidewall surface of the driving chip 60 perpendicular to the horizontal plane of the substrate 10, which effectively protects the wiring layer 30 in the bending zone WZ while avoiding interference with the electrical circuit of the driving chip 60.

[0105] like Figure 5 As shown, the blocking dam 70 is a "U"-shaped ring structure with a certain thickness, the inner wall of the blocking dam 70 close to the side of each protective portion is the inner boundary of the blocking dam 70, and the outer wall of the blocking dam 70 close to the side of the polarizing layer 40 is the outer boundary of the blocking dam 70, and the shape of the orthographic projection of the outer boundary of the blocking dam 70 on the substrate 10 and the orthographic projection of the inner boundary of the blocking dam 70 on the substrate 10 are the same as the shape of the orthographic projection of each protective portion on the substrate 10.

[0106] In a specific example, the positive projection of the first protective portion 51 on the substrate 10 includes a first arc-shaped projection boundary located at the left end of the bending zone WZ, a first upper projection boundary close to the side of the polarizing layer 40, a first lower projection boundary opposite to the first upper projection boundary, and a first side projection boundary opposite to the first arc-shaped projection boundary, thereby forming a protective portion design corresponding to the edge structure of the bending zone WZ.

[0107] In this example, the shape of the orthographic projection of the blocking dam 70 surrounding the first protective portion 51 on the substrate 10 is similar to the orthographic projection structure of the first protective portion 51 on the substrate 10, that is, the blocking dam 70 surrounding the first protective portion 51 includes a first arc-shaped blocking boundary located at the left end of the bending zone WZ, a first upper blocking boundary close to the side of the polarizing layer 40, a first lower blocking boundary opposite to the first upper blocking boundary, and a first side blocking boundary opposite to the first arc-shaped blocking boundary, thereby forming a structural design surrounding the first protective portion 51.

[0108] In a specific example, the positive projection of the second protective portion 52 on the substrate 10 includes a second arc-shaped projection boundary located at the right end of the bending zone WZ, a second upper projection boundary close to the side of the polarizing layer 40, a second lower projection boundary opposite to the second upper projection boundary, and a second side projection boundary opposite to the second arc-shaped projection boundary, thereby forming a protective portion design corresponding to the edge structure of the bending zone WZ.

[0109] In this example, the shape of the orthographic projection of the blocking dam 70 surrounding the first protective portion 51 on the substrate 10 is similar to the orthographic projection structure of the second protective portion 52 on the substrate 10, that is, the blocking dam 70 surrounding the second protective portion 52 includes a second arc-shaped blocking boundary located at the left end of the bending zone WZ, a second upper blocking boundary close to the side of the polarizing layer 40, a second lower blocking boundary opposite to the second upper blocking boundary, and a second side blocking boundary opposite to the first arc-shaped blocking boundary, thereby forming a structural design surrounding the second protective portion 52.

[0110] In a specific example, the third protection portion 53 is located between the first protection portion 51 and the second protection portion 52, and the orthographic projection of the third protection portion 53 on the substrate 10 is a rectangular structure.

[0111] The orthographic projection of the third protection portion 53 on the substrate 10 includes a third upper projection boundary close to the polarizing layer 40, a third lower projection boundary opposite to the third upper projection boundary, a third side projection boundary close to the first side projection boundary, and a fourth side projection boundary opposite to the third side projection boundary.

[0112] In this example, the shape of the orthographic projection of the blocking dam 70 surrounding the third protective portion 53 on the substrate 10 is similar to the orthographic projection structure of the third protective portion 53 on the substrate 10, that is, the blocking dam 70 surrounding the third protective portion 53 includes a third upper blocking boundary close to one side of the polarizing layer 40, a third lower blocking boundary opposite to the third upper blocking boundary, a third side blocking boundary close to the first side blocking boundary, and a fourth side blocking boundary opposite to the third side blocking boundary, thereby forming a structural design surrounding the third protective portion 53.

[0113] Based on the above structure, a barrier dam 70 structure surrounding one or more of the first protecting portion 51 , the second protecting portion 52 and the third protecting portion 53 is formed to prevent each protecting portion from overflowing from the barrier dam 70 .

[0114] In an optional embodiment, the width L of each barrier edge of the barrier dam 70 is MCL The calculation formula is:

[0115] L MCL =π(Bending R+0.012)+(0.3~0.95);

[0116] Bending R is the bending radius of the bending zone WZ, and the width of the barrier dam 70 is designed to provide the display module with the most suitable width under different bending structures. For example, the width of the barrier dam 70 is 0.1±0.01 mm.

[0117] Based on the structural design of the protective layer 50 in the above-mentioned embodiment, in the manufacturing process of the protective layer 50 by the interval segmented coating, although the contact area between the protective layer 50 and the polarizing layer 40 becomes smaller, there will still be a siphon phenomenon at the contact portion between the protective layer 50 and the polarizing layer 40, in order to further reduce the increase in thickness of the protective layer 50 on the side close to the polarizing layer 40 caused by the siphon.

[0118] In an optional embodiment, if Figure 7 As shown, the polarizing layer 40 includes a polarizing bottom surface 41 attached to the display light-emitting layer 20, a polarizing top surface 42 opposite to the polarizing bottom surface 41, and a polarizing side surface 43 perpendicular to the polarizing bottom surface 41 and the polarizing top surface 42, and the polarizing side surface 43 is located on a side of the polarizing layer 40 close to the protective layer 50.

[0119] A first absorption groove 81 is provided on the polarizing side surface 43, and the first absorption groove 81 extends along the second direction and from the polarizing side surface 43 toward the central area of ​​the display area AA, that is, the first absorption groove extends from the edge of the non-display area AA where the binding area BD is located to the central area of ​​the display area AA, and the first absorption groove 81 includes a first inner groove surface 811 close to the side of the substrate 10 and a second inner groove surface 812 away from the substrate 10, and the surface of the protective layer 50 away from the substrate 10 is located between the first inner groove surface 811 and the second inner groove surface 812 of the first absorption groove 81.

[0120] In the embodiment of the present invention, a reserved groove is opened on the side wall of the polarizing layer 40 near the bending zone WZ, such as Figure 7 As shown, in the manufacturing process of the protective layer 50, when the protective layer 50 contacts the polarizing layer 40, the protective layer 50 with fluidity is first siphoned into the groove by the first absorption groove 81, so that Figure 1 The siphon effect of the protective layer 50 near the bending zone WZ will be greatly improved, and the thickness of the polarizing layer 40 near the bending zone WZ will also be effectively controlled. In the actual bending process, the risk of breakage caused by the siphoning of the polarizing layer 40 during the bending process will also be greatly reduced.

[0121] In an optional embodiment, if Figure 7As shown, the length of the first absorption groove 81 extending along the second direction and from the polarizing side surface 43 toward the display area AA is the groove depth distance of the first absorption groove 81, that is, the first absorption groove 81 extends from the bending area WZ to the display area AA, and this embodiment limits the groove depth distance of the first absorption groove 81. In an optional embodiment, the groove depth distance of the first absorption groove 81 is less than the distance between the boundary of the non-display area NA where the polarizing side surface 43 is located and the boundary of the display area.

[0122] That is to say, the first absorption groove 81 of this embodiment does not enter the display area AA, avoiding the influence of the first absorption groove 81 on the display area AA, that is, the first absorption groove 81 will not affect the display effect. In a specific example, the attachment accuracy of the polarizing layer 40 and the display light-emitting layer 20 in the related art is ±0.05mm, and the minimum distance at which the first absorption groove 81 does not enter the display area AA is about 0.35mm. Taking the above two points into consideration, the groove depth distance of the first absorption groove 81 of this embodiment is set to 0.15±0.05mm, which realizes the use of the first absorption groove 81 to improve the siphon effect to reduce the risk of bending and fracture, while ensuring the display performance of the display module.

[0123] In this embodiment, the distance between the first inner groove surface 811 and the second inner groove surface 812 is the groove diameter of the first absorption groove 81, and the surface of the protective layer 50 away from the substrate 10 is located between the first inner groove surface 811 and the second inner groove surface 812 of the first absorption groove 81, that is, the upper surface of the protective layer 50 is at a certain distance from the first inner groove surface 811 and the second inner groove surface 812.

[0124] In a specific example, the distance between the upper surface of the protective layer 50 and the first inner groove surface 811, and the distance between the upper surface of the protective layer 50 and the second inner groove surface 812 can both be set to 0.01 mm. With this setting, the first absorption groove 81 can take into account both the fluidity of the protective layer 50 and the siphon effect of the polarizing layer 40 on the side close to the bending zone WZ.

[0125] In a specific example, the thickness of the protective layer 50 is 0.07 mm. When the actual thickness of the protective layer 50 is less than 0.07±0.01 mm, the first absorption groove 81 will siphon the flowing material of the protective layer 50 into the first absorption groove 81 from above, so that the thickness of the protective layer 50 is closer to the theoretical value, so that the stress on the routing layer 30 is smaller.

[0126] When the actual value of the thickness of the protective layer 50 is greater than 0.07±0.01mm, due to the material fluidity of the protective layer 50, the first absorption groove 81 can receive a portion of the material of the protective layer 50 to flow in, thereby reducing the actual thickness of the protective layer 50, and also reducing the phenomenon of thickness accumulation of the protective layer 50 caused by siphoning of the polarizing layer 40 near the bending zone WZ, thereby reducing the stress of the protective layer 50 caused by siphoning of the polarizing layer 40 near the bending zone WZ, thereby reducing the risk of bending and fracture.

[0127] In an optional embodiment, a second absorption groove 82 is provided on the surface of the display light emitting layer 20 close to the polarizing layer 40, and the second absorption groove 82 extends from the surface of the display light emitting layer 20 close to the polarizing layer 40 toward the substrate 10. In this embodiment, the second absorption groove 82 is used to further absorb the polarizing layer 40 close to the bending zone WZ.

[0128] In this embodiment, the vertical surface of the protective layer 50 and the polarizing layer 40 that are bonded to each other extends along the first direction in the orthographic projection on the substrate 10, and is an intermittent projection with intervals in the first direction, and falls in the orthographic projection of the second absorption groove 82 on the substrate 10. That is to say, the orthographic projection of the second absorption groove 82 on the substrate 10 of this embodiment covers both part of the orthographic projection of the protective layer 50 on the substrate 10 and part of the orthographic projection of the polarizing layer 40 on the substrate 10, that is, part of the second absorption groove 82 is located in the bending zone WZ, and the other part is located in the non-display area NA, so that the material of the protective layer 50 near the bending zone WZ is absorbed. Through this setting, the thickness accumulation of the protective layer 50 near the bending zone WZ due to the siphoning of the polarizing layer 40 is further reduced, thereby reducing the risk of bending and fracture.

[0129] In this embodiment, the extension distance of the second absorption groove 82 from the surface of one side of the polarizing layer 40 to the substrate 10 is the groove depth distance of the second absorption groove 82, that is, the second absorption groove 82 extends downward in the thickness direction, and the downward extension distance is the groove depth distance of the second absorption groove 82.

[0130] The distance between the boundary of the second absorption groove 82 located at the orthographic projection of the protective layer 50 on the substrate 10 and the boundary of the second absorption groove 82 located at the orthographic projection of the polarizing layer 40 on the substrate 10 is the groove diameter of the second absorption groove 82. That is, the length of the opening of the second absorption groove 82 from the bending area WZ to the display area AA is the groove diameter, that is, the groove width.

[0131] In a specific example, the groove depth of the second absorption groove 82 is 0.05±0.01mm, and the groove width of the second absorption groove 82 is 0.2±0.01mm. Based on the above settings, after the segmented protective layer 50 is coated, the flowing material of the protective layer 50 close to the side of the polarizing layer 40 will flow into the second absorption groove 82 due to fluidity, which makes the contact area between the protective layer 50 and the non-display area NA larger, and the bonding degree is also improved. Because the degree of siphoning of the protective layer 50 by the polarizing layer 40 side is also reduced, the accumulation of the protective layer 50 on the side of the polarizing layer 40 close to the bending zone WZ is reduced. During the bending process, the extrusion and tensile stresses on the routing layer 30 in the bending zone WZ are reduced, so the risk of fracture and defects in the bending zone WZ are also significantly reduced.

[0132] In an optional embodiment, if Fig. 9 As shown, the display module also includes an encapsulation layer 93 located on the side of the display light-emitting layer 20 away from the substrate 10, and the display module also includes at least one inorganic film layer 94 located between the encapsulation layer 93 and the polarizing layer 40, and the second absorption groove 82 is arranged on the surface of the inorganic film layer 94 closest to the polarizing layer 40 on the side close to the polarizer.

[0133] In this embodiment, the second absorption groove 82 is arranged on the inorganic film layer 94 on the side of the packaging layer away from the substrate 10. This setting position will not affect the water and oxygen resistance of the display module, but can also improve the risk of fracture in the bending process, and has wide applicability.

[0134] It is worth mentioning that Figure 7 The structure shown has a first absorption groove 81 and Figure 8 The structure with the second absorption groove 82 shown can be simultaneously applied to the structure of the same display module. Further, Figure 5 and Figure 6 The barrier dam 70 structure shown can also be used with Figure 7 or with Figure 8 The structure is combined to play a protective role in preventing the protective layer 50 from overflowing from the blocking dam 70. Therefore, the embodiments formed by combining various embodiments of the present invention are also within the protection scope of the present invention.

[0135] In one embodiment, Figure 4 and Figure 6 As shown, the display module further includes an adhesive layer 95 disposed on a side of the polarizing layer 40 away from the substrate 10 , and a cover plate 96 located on a side of the adhesive layer 95 away from the substrate 10 .

[0136] In an optional embodiment, if Figure 2 , Figure 7 and Figure 8As shown, after the display module is bent, the non-light-emitting side surface of the substrate 10 located in the display area AA away from the display light-emitting layer 20 and the non-light-emitting side surface of the substrate 10 located in the binding area BD away from the display light-emitting layer 20 are bonded and adhered by using at least one heat dissipation layer 91. Exemplarily, the heat dissipation layer 91 may include one or more of natural graphite, artificial graphite, graphene and carbon nanotube heat dissipation film.

[0137] In an optional embodiment, if Figure 2 , Figure 7 and Figure 8 As shown, a height compensation layer 92 is further provided between the heat dissipation layer 91 and the surface of the substrate 10 located in the binding area BD after being bent away from the display light-emitting layer 20, for compensating the height between the heat dissipation layer 91 and the surface of the substrate 10 located in the binding area BD after being bent away from the display light-emitting layer 20 to a preset height, so as to avoid the problem of breakage caused by a large bending curvature of the bending zone WZ after bending.

[0138] Another embodiment of the present invention provides a display device, which includes the display module of the above embodiment. The display device of the embodiment of the present invention can be any product or component with a display function, such as electronic paper, mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, navigator, etc., which is not limited in this embodiment.

[0139] Another embodiment of the present invention provides a method for manufacturing the above-mentioned display module, the method comprising:

[0140] S10, forming a display light emitting layer 20 on the substrate 10 corresponding to the display area AA;

[0141] S20, forming a wiring layer 30 on the substrate 10 corresponding to the non-display area NA, the bending area WZ, and the binding area BD, wherein the wiring layer 30 is electrically connected to the display light-emitting layer 20;

[0142] S30, forming a polarizing layer 40 on the side of the display light emitting layer 20 away from the substrate 10;

[0143] S40, coating a protective layer 50 on the substrate 10 corresponding to the bending zone WZ, wherein the protective layer 50 extends along a first direction in the orthographic projection of the substrate 10 and has a gap in the first direction; and S50, forming a driving chip 60 bound to the routing layer 30 in the binding area BD.

[0144] The manufacturing method of the embodiment of the present invention does not add complicated process steps. The protective layer 50 distributed at intervals formed based on the above process steps can not only protect the wiring layer 30, but also reduce the bending stress received by the layer structure of the display module during the bending process, especially the bending stress received by the wiring layer 30 as the neutral layer during the bending process, and at the same time alleviate the problem of thickening of the film layer of the polarizing layer 40 close to the protective layer 50 due to the siphon effect, thereby avoiding the risk of breakage of the wiring layer 30 of the display module during the bending process, and avoiding deformation, breakage, bright lines, or abnormal display of the display module.

[0145] In an optional embodiment, when the display module adopts Figure 2 and Figure 3 The structure of step S20 "forming a wiring layer 30 on the substrate 10 corresponding to the non-display area NA, the bending area WZ, and the binding area BD" further includes:

[0146] S21, forming a metal wiring on the substrate 10 corresponding to the non-display area NA;

[0147] S23, forming a first routing portion 31 located at the first end, a second routing portion 32 located at the second end, and a third routing portion 33 located between the first routing portion 31 and the second routing portion 32 on the substrate 10 corresponding to the bending zone WZ;

[0148] S25, forming metal wiring on the substrate 10 corresponding to the binding area BD. The metal wiring is arranged at the positions of the non-display area NA, the bending area WZ and the binding area BD to form circuit wiring.

[0149] Step S40 of "coating a protective layer 50 on the substrate 10 corresponding to the bending zone WZ" further includes:

[0150] A protective layer 50 is coated on the surface corresponding to the first routing portion 31, the second routing portion 32 and the third routing portion 33 away from the substrate 10, thereby forming a first protection portion 51, a second protection portion 52 and a third protection portion 53 for protecting the first routing portion 31, the second routing portion 32 and the third routing portion 33 respectively, so as to protect the routing in the bending zone WZ.

[0151] In an optional embodiment, if Figure 5 and Figure 6 As shown, when the display module has a barrier dam 70 to limit the protective layer 50, before step S40 of "coating the protective layer 50 on the substrate 10 corresponding to the bending zone WZ", the method further includes:

[0152] A blocking dam 70 of an annular structure is formed at a position corresponding to one or more of the first protective portion 51, the second protective portion 52 and the third protective portion 53, the blocking dam 70 surrounds the surrounding protective portion in the orthographic projection of the substrate 10, the height of the blocking dam 70 is higher than the height of the protective portion surrounded by the blocking dam 70, and the viscosity of the blocking dam 70 is greater than the viscosity of the protective layer 50.

[0153] Exemplarily, the barrier dam 70 is formed by pre-coating and curing a high-viscosity material, and then a low-viscosity material is injected into the interior of the barrier dam 70 and cured, thereby forming a first protective portion 51, a second protective portion 52 and a third protective portion 53, thereby limiting the material flow of the protective layer 50 and achieving precise coating of the position of the protective layer 50.

[0154] In an optional embodiment, if Figure 7 As shown, when the display module has a structure of the first absorption groove 81, step S30 "on the polarizing layer 40 located on the side of the display light-emitting layer 20 away from the substrate 10" further includes:

[0155] A first absorption groove 81 is formed on the polarizing side surface 43 of the polarizing layer 40 close to the protective layer 50 . The first absorption groove 81 extends along the second direction from the polarizing side surface 43 toward the display area AA.

[0156] In an optional embodiment, if Figure 8 As shown, when the display module has the structure of the second absorption groove 82, step S10 "forming a display light-emitting layer 20 on the substrate 10 corresponding to the display area AA" further includes:

[0157] A second absorption groove 82 is formed on the surface of the display light emitting layer 20 close to the polarizing layer 40 , and the second absorption groove 82 extends from the surface of the display light emitting layer 20 close to the polarizing layer 40 toward the substrate 10 .

[0158] It is worth noting that the specific embodiment of the method for manufacturing the display module of the embodiment of the present invention can refer to the display module of the aforementioned embodiment, and the relevant parts can refer to the design, which will not be repeated here.

[0159] In the description of the present invention, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0160] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the embodiments here. All obvious changes or modifications derived from the technical solution of the present invention are still within the protection scope of the present invention.

Claims

1. A display module, comprising a display area, a non-display area at least partially surrounding the display area, a bending area connected to one end of the non-display area, and a binding area connected to the bending area, characterized in that: The display module comprises: substrate; A display light emitting layer located on the substrate in the display area; A wiring layer located on the substrate in the non-display area, the bending area and the binding area, the wiring layer being electrically connected to the display light-emitting layer; A polarizing layer located on a side of the display light-emitting layer away from the substrate; A protection layer located at a side of the routing layer in the bending region away from the substrate; and A driving chip is bound to the binding area, the extending direction of the binding boundary between the binding area and the driving chip is a first direction, and the orthographic projection of the protection layer on the substrate includes a plurality of projection blocks with intervals in the first direction.

2. The display module according to claim 1, characterized in that: The orthographic projection of the routing layer on the substrate is located at the two side ends of the bending zone and the central area of ​​the bending zone, and the projection blocks of the orthographic projection of the protection layer on the substrate respectively cover the orthographic projection of the routing layer on the substrate located at the two side ends of the bending zone and the central area of ​​the bending zone.

3. The display module according to claim 2, characterized in that: In the orthographic projection of the bending region on the substrate, both side ends of the bending region include a first end located at one edge and a second end located at another edge and arranged opposite to the first end along a first direction, The routing layer at least includes a first routing portion located at the first end position, a second routing portion located at the second end position, and a third routing portion located between the first routing portion and the second routing portion; The protective layer at least comprises: The first protection portion covers the first routing portion; The second protection portion covers the second routing portion; and The third protection portion covers the third routing portion.

4. The display module according to claim 1, characterized in that: The direction perpendicular to the first direction is the second direction, The length of the protective layer in the second direction is greater than the length of the bending area in the second direction, The projection boundary of the protective layer on the side of the orthographic projection of the substrate close to the polarizing layer overlaps with the projection boundary of the polarizing layer on the side of the orthographic projection of the substrate close to the bending region; There is a gap between a projection boundary of the protection layer on a side of the substrate where the orthographic projection is far from the polarizing layer and a projection boundary of the driving chip on a side of the substrate where the orthographic projection is close to the bending region.

5. The display module according to claim 3, characterized in that: The display module also includes a blocking dam surrounding one or more of the first protective portion, the second protective portion and the third protective portion, the blocking dam surrounds the surrounding protective portion in its orthographic projection on the substrate, the height of the blocking dam is higher than the height of the protective portion surrounded by the blocking dam, and the viscosity of the blocking dam is greater than the viscosity of the protective layer.

6. The display module according to claim 5, characterized in that: The projection boundary of the blocking dam on the side of the orthographic projection of the substrate close to the polarizing layer overlaps with the projection boundary of the orthographic projection of the polarizing layer on the side of the substrate close to the bending region. There is a gap between a projection boundary of the blocking dam on a side of the substrate away from the polarized light and a projection boundary of the driving chip on a side of the substrate close to the bending region.

7. The display module according to claim 6, characterized in that: The width L of each barrier boundary of the barrier dam is MCL The calculation formula is: L MCL =π(Bending R+0.012)+(0.3~0.95); Wherein, Bending R is the bending radius of the bending zone.

8. The display module according to any one of claims 1 to 4, characterized in that: The polarizing layer comprises a polarizing bottom surface attached to the display light-emitting layer, a polarizing top surface opposite to the polarizing bottom surface, and a polarizing side surface perpendicular to the polarizing bottom surface and the polarizing top surface, wherein the polarizing side surface is located on a side of the polarizing layer close to the protective layer. A first absorption groove is provided on the polarizing side surface, and the first absorption groove extends along a second direction from the polarizing side surface toward a central area of ​​the display area. The first absorption groove comprises a first inner groove surface close to the substrate and a second inner groove surface away from the substrate. A surface of the protection layer away from the substrate is located between a first inner groove surface and a second inner groove surface of the first absorption groove.

9. The display module according to claim 8, characterized in that: The length of the first absorption groove extending along the second direction from the polarizing side surface toward the display area is the groove depth distance of the first absorption groove. The distance between the first inner groove surface and the second inner groove surface is the groove diameter of the first absorption groove; The groove depth of the first absorption groove is less than the distance between the boundary of the non-display area where the polarizing side surface is located and the boundary of the display area.

10. The display module according to any one of claims 1 to 4 or 8, characterized in that: A second absorption groove is provided on the surface of the display light emitting layer close to the polarizing layer, and the second absorption groove extends from the surface of the display light emitting layer close to the polarizing layer toward the substrate. The vertical surfaces of the protective layer and the polarizing layer that are bonded to each other extend along the first direction in the orthographic projection of the substrate, are discontinuous projections with intervals in the first direction, and fall in the orthographic projection of the second absorption groove on the substrate.

11. The display module according to claim 10, characterized in that: The display module further includes at least one inorganic film layer between the encapsulation layer and the polarizing layer, and the second absorption groove is arranged on a surface of the inorganic film layer closest to the polarizing layer and close to the polarizer.

12. A display device, characterized in that: The display device comprises the display module according to any one of claims 1 to 11.

13. A method for manufacturing the display module according to any one of claims 1 to 11, characterized in that: The method comprises: forming a display light-emitting layer on the substrate corresponding to the display area; Forming a wiring layer on the substrate corresponding to the non-display area, the bending area, and the binding area, wherein the wiring layer is electrically connected to the display light-emitting layer; forming a polarizing layer on a side of the display light-emitting layer away from the substrate; Coating a protective layer on the substrate corresponding to the bending area; The driver chip is bound to the binding area, the extension direction of the binding boundary between the binding area and the driver chip is a first direction, and the orthographic projection of the protection layer on the substrate includes a plurality of projection blocks with intervals in the first direction.

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