Device for rapidly judging cable fault item

Abstract

The invention belongs to the field of distribution cable line fault repair, and relates to a cable fault item rapid judgment device which comprises an intelligent logic main control module, a test high voltage generation module, a high voltage discharge module, an insulation performance test module, a multi-phase path switching module, a line inductive reactance test module, a test result storage module, an HMI module and a power supply module. Insulation test direct-current high voltage is applied between tested phase lines through the multi-phase path switching module, the insulation performance test module is matched with the test high-voltage generation module, sampling measurement is carried out on returned insulation signals, current leakage is detected, the insulation degree between each phase branch and the insulation degree between each phase branch and the ground are rapidly and fully automatically measured, and the test accuracy is improved. The workload of workers is reduced, the measurement time is shortened, and the working efficiency is improved; high voltage in the access is discharged to the negative electrode through the high-voltage discharge module, and the risk of high-voltage discharge can be eliminated, so that testers are prevented from being electrically shocked, and the purpose of protecting the testers is achieved.

Description

Technical Field

[0001] The invention belongs to the field of power distribution cable line fault emergency repair, in particular to a device for quickly judging cable fault items. Background Art

[0002] With the development of power grids, cable lines account for an increasing proportion, but the fault points of cable lines are hidden and difficult to find. When a fault occurs, it often takes more time to determine the fault point. There are currently two main ways to find cable faults. One is to test the transmission in sections, but unsuccessful test transmission will cause impact current in the station and affect the service life of the equipment in the substation. Therefore, the number of unsuccessful test transmissions needs to be reduced. Another way is to measure each section of cable in the ring network cabinet and the high-voltage cabinet in the civil distribution room to check the insulation to the ground and whether there is a short circuit between phases. However, when using an ohmmeter to measure, it is necessary to measure each item one by one, a total of 6 times, and after the measurement, the measured cable needs to be discharged before continuing to measure. The measurement time is long, and improper operation of personnel will also cause safety hazards such as not touching the undischarged cables.

[0003] Chinese patent CN201935983U discloses a ground fault detector, which includes a box, a megohmmeter is arranged inside the box, and the output end of the megohmmeter is connected to an E connecting line and an L connecting line through a knife switch, wherein the end of the E connecting line is a U-shaped copper joint, and the end of the L connecting line is a hook.

[0004] This patent uses the method of manually shaking the megohmmeter handle and observing the indication to realize the segmented shaking test of the faulty line. Firstly, this non-automatic method of troubleshooting the faulty line is time-consuming and labor-intensive, reduces work efficiency, and has safety hazards, which can easily threaten the personal safety of the operator. Summary of the invention

[0005] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a device for quickly judging cable fault items to facilitate the fault detection process of multi-phase paths. Through this device, the insulation degree between each phase branch and between each phase branch and the ground can be quickly and automatically measured, and the device will automatically discharge to the ground after the measurement is completed.

[0006] The technical solution adopted by the present invention to solve the technical problem is:

[0007] The present invention provides a device for quickly judging cable fault items, comprising: an intelligent logic main control module, a test high voltage generation module, a high voltage discharge module, an insulation performance test module, a multi-phase path switching module, a line inductance test module, a test result storage module, an HMI module, and a power supply module. The intelligent logic main control module is the core general control module of the device, which is used to provide scheduling and coordination between various modules and complete data processing and data analysis; the test high voltage generation module is connected to the intelligent logic main control module to generate the DC high voltage required for insulation testing; the high voltage discharge module is connected to the test high voltage generation module to discharge the high voltage on the test line to a safe voltage state to the ground after testing; the insulation performance test module is respectively connected to the intelligent logic main control module and the test high voltage generation module, and is controlled by the intelligent logic main control module to cooperate with the test high voltage The generating module samples and measures the returned insulation signal to complete the insulation data between the tested phases; the multi-phase path switching module is respectively connected to the intelligent logic main control module and the insulation performance test module, and is controlled by the intelligent logic main control module to automatically complete the switching of the test paths between the phases; the line inductance test module is respectively connected to the intelligent logic main control module and the multi-phase path switching module to test the inductance data of the line to be tested and determine whether the test line contains inductive components of other transformers; the test result storage module is connected to the intelligent logic main control module to save the collected data and the analyzed results; the HMI module is connected to the intelligent logic main control module to provide process data, allow input of commands and set values, and display alarms and other information; the power supply module is connected to the intelligent logic main control module to provide overall working power supply.

[0008] Furthermore, it also includes a human-machine interface module, which is used to complete information exchange with the user and meet the user's control requirements.

[0009] Furthermore, the chip model used by the intelligent logic main control module is STM32F103VET6.

[0010] Further, the test high voltage generation module includes a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a resistor R8, a resistor RHv1, a resistor RHv2, a resistor RHv3, a resistor RHv4, a capacitor C1, a capacitor C2, a capacitor VH_C1, a capacitor VH_C2, a capacitor VH_C3, a capacitor VH_C4, a capacitor VH_C5, a potentiometer W1, a diode D1, a diode VH_D1, a diode VH_D2, a diode VH_D3, a diode VH_D4, a diode VH_D5, an operational amplifier AP1, an operational amplifier AP2, a field effect transistor Q, and a transformer THv;One end of the primary coil of the transformer THv is connected to the switch PW_CTL of the relay, the other end of the primary coil of the transformer THv is connected to the drain of the field effect tube Q, the source of the field effect tube Q is grounded, the gate of the field effect tube Q is connected to the output end of the operational amplifier AP1 and the output end of the operational amplifier AP2, the negative input end of the operational amplifier AP2 is connected to the output end of the operational amplifier AP2 through the resistor R2, the negative input end of the operational amplifier AP2 is also connected to the switch PW_CTL of the relay through the resistor R6, the negative input end of the operational amplifier AP2 is also grounded through the resistor R4, the positive input end of the operational amplifier AP2 is connected to the output end of the operational amplifier AP2 through the resistor R3, the positive input end of the operational amplifier AP2 is also connected to the output end of the operational amplifier AP2 through the resistor R4, Capacitor C1 is grounded, the positive input terminal of the power supply of the operational amplifier AP2 is connected to the switch PW_CTL of the relay, the negative input terminal of the power supply of the operational amplifier AP2 is grounded, the negative input terminal of the operational amplifier AP1 is connected to one end of the resistor R7 and the resistor R8, and the other ends of the resistors R7 and R8 are connected to the signal network HV-, one end of the resistor R1 is connected to the gate of the field effect tube Q, and the other end is connected to the switch PW_CTL of the relay, the anode of the diode D1 is grounded through the resistor R5 and connected to the signal network HV-, the cathode of the diode D1 is connected to the switch PW_CTL of the relay, the first end of the potentiometer W1 is connected to the switch PW_CTL of the relay, the other end of the switch PW_CTL of the relay is connected to the power supply VCC, and the relay one The first end of the transformer THv is connected to the power supply VCC, and the other end is connected to the module working control signal. The module working control signal receives the signal of the intelligent logic main control module to adjust the working state of the high voltage generation module. The second end of the potentiometer W1 is grounded through the capacitor C2, and the third end is connected to the second end of the potentiometer W1, the positive electrode of the diode D1 and the resistor R8. One end of the secondary coil of the transformer THv is connected to the positive electrode of the diode VH_D5 through the capacitor VH_C2 and the capacitor VH_C4, and the negative electrode of the diode VH_D5 is connected to the signal network HV+. The other end of the secondary coil is connected to the capacitor VH_C1, and the other end of the capacitor VH_C1 is connected to the negative electrode of the diode VH_D1, the positive electrode of the diode VH_D2, the capacitor VH_C3, and the capacitor VH_C The other end of 3 is connected to the cathode of diode VH_D3, the anode of diode VH_D4, and capacitor VH_C5, the other end of capacitor VH_C5 is connected to resistor RHv4 and signal network HV+, the anode of diode VH_D1 is connected to one end of capacitor VH_C2, the cathode of diode VH_D2 is connected to the other end of capacitor VH_C2, the anode of diode VH_D3 is connected to one end of capacitor VH_C4, the cathode of diode VH_D4 is connected to the other end of capacitor VH_C4, resistor RHv4 is connected to resistor RHv2 through resistor RHv3, the other end of resistor RHv2 is connected to the positive input end of operational amplifier AP1, and the other end of resistor RHv2 is also connected to signal network HV- through resistor RHv1. ;

[0011] Furthermore, the insulation performance test module includes a chip ADCF, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a capacitor C1, a capacitor C2, a capacitor C11, a capacitor C12, a capacitor C13, a capacitor C14, and an operational amplifier AP1. Pin 1 of the chip ADCF is connected to one end of the capacitor C14 and pin 8. Pin 2 of the chip ADCF is connected to one end of the capacitor C13, the other end of the capacitor C14 and grounded. Pin 3 of the chip ADCF is connected to one end of the capacitor C12, the other end of the capacitor C13 and the test voltage U2 through the resistor R4. Pin 4 of the chip ADCF is connected to one end of the capacitor C11, the other end of the capacitor C12 and the resistor R3. The other end of the capacitor C11 is grounded, and the other end of the resistor R3 is connected to the output end of the operational amplifier AP1 through the voltage Uxk. The output end of the operational amplifier AP1 is also connected to the positive input end of the operational amplifier AP1 through the voltage Uxk and the resistor R7. The positive input end of the operational amplifier AP1 is also grounded through the resistor R6. The negative input end of the operational amplifier AP1 is connected to the Rtest2 interface of the signal network HV- through the resistor R3. One end of the resistor R5 is grounded and the other end is connected to the resistor R3. One end of the resistor R4 is connected to the test voltage U2 and the other end is grounded. One end of the resistor R2 is connected to the test voltage U2 and the other end is connected to the signal network HV+. Pin 5 of the chip ADCF is connected to the CLK interface of the intelligent logic main control module through the resistor R1. Pin 6 of the chip ADCF is connected to the Data interface of the intelligent logic main control module through the resistor R2. Pin 7 of the chip ADCF is connected to the power supply VCC, one end of the capacitor C1, and one end of the capacitor C2. The other ends of the capacitors C1 and C2 are both grounded.

[0012] Furthermore, the multiphase path switching module includes a first group of lines and a second group of lines. The first group of lines is: one end of the switching path relay KHVA+ is connected to the switching path relay KHVB+, the switching path relay KHVC+, and the switching path relay KHVN+, and the other end is connected to the control logic interface HV+CtN, one end of the switch of the switching path relay KHVA+ is connected to the A phase, and the other end is connected to the signal network HV+, the other end of the switching path relay KHVB+ is connected to the control logic interface HV+CtC, and one end of the switch of the switching path relay KHVB+ is connected to Phase B, the other end is connected to the signal network HV+, the other end of the switching path relay KHVC+ is connected to the control logic interface HV+CtB, one end of the switch of the switching path relay KHVC+ is connected to phase C, and the other end is connected to the signal network HV+, the other end of the switching path relay KHVN+ is connected to the control logic interface HV+CtA, one end of the switch of the switching path relay KHVN+ is connected to the neutral line, and the other end is connected to the signal network HV+, and the control logic interface HV+CtA, control logic interface HV+CtB, control logic interface HV+CtC, control logic interface HV+CtN is connected to the circuit to be tested; the second group of circuits is: one end of the switching path relay KHVA- is connected to the switching path relay KHVB-, the switching path relay KHVC-, and the switching path relay KHVN-, and the other end is connected to the control logic interface HV-CtN, one end of the switch of the switching path relay KHVA- is connected to phase A, and the other end is connected to the signal network HV-, the other end of the switching path relay KHVB- is connected to the control logic interface HV-CtC, one end of the switch of the switching path relay KHVB- is connected to phase B, and the other end is connected to the signal network HV- , the other end of the switching path relay KHVC- is connected to the control logic interface HV-CtB, one end of the switch of the switching path relay KHVC- is connected to the C phase, and the other end is connected to the signal network HV-, the other end of the switching path relay KHVN- is connected to the control logic interface HV-CtA, one end of the switch of the switching path relay KHVN- is connected to the neutral line, and the other end is connected to the signal network HV-, and the control logic interface HV-CtA, the control logic interface HV-CtB, the control logic interface HV-CtC, and the control logic interface HV-CtN are connected to the circuit to be tested.

[0013] Furthermore, the high-voltage discharge module includes a relay KHVA, a relay KHVB, a relay KHVC, a relay KHVN, and a discharge resistor R_release. One end of the relay KHVA is connected to the relay KHVB, the relay KHVC, and the relay KHVN, and the other end is connected to the test interface HV+CsleN. One end of the switch of the relay KHVA is connected to the A phase, and the other end is connected to the signal network HV- through the discharge resistor R_release. The other end of the relay KHVB is connected to the test interface HV+CsleC. One end of the switch of the relay KHVB is connected to the B phase, and the other end is connected to the signal network HV- through the discharge resistor R_release. One end is connected to the discharge resistor R_release, the other end of the relay KHVC is connected to the test interface HV+CsleB, one end of the switch of the relay KHVC is connected to the C phase, and the other end is connected to the discharge resistor R_release, the other end of the relay KHVN is connected to the test interface HV+CsleA, one end of the switch of the relay KHVN is connected to the neutral line, and the other end is connected to the discharge resistor R_release, and the test interface HV+CsleA, the test interface HV+CsleB, the test interface HV+CsleC, and the test interface HV+CsleN are connected to the circuit to be tested.

[0014] Further, the line inductance test module includes a resistor RL1, a resistor RL2, a resistor RL3, a resistor Radc1, a resistor Radc2, a resistor Radc3, a resistor Radc4, a capacitor CL1, a capacitor CL2, a capacitor CL3, a capacitor CL4, a capacitor Cadc1, a capacitor Cadc2, a capacitor Cadc3, a capacitor Cadc4, a capacitor Cadc5, a capacitor Cadc6, a chip ADCLTF, a potentiometer WL1, a field effect transistor QL1, an operational amplifier APL1, an inductor LL1, and a test interface J1;Pin 1 of chip ADCLTF is connected to one end of capacitor Cadc6 and pin 8, pin 2 of chip ADCLTF is connected to one end of capacitor Cadc5, the other end of capacitor Cadc6, resistor RL2 and grounded, pin 3 of chip ADCLTF is connected to one end of capacitor Cadc4, the other end of capacitor Cadc5 and resistor Radc2, pin 4 of chip ADCLTF is connected to one end of capacitor Cadc3, the other end of capacitor Cadc4 and resistor Radc1, the other end of capacitor Cadc3 is grounded, the other end of resistor Radc1 is connected to the output end of operational amplifier APL1, and pin 5 of chip ADCLTF is connected to the intelligent logic main control module through resistor Radc3. The MCU_CLK interface of the chip ADCLTF is connected to the MCU_Data interface of the intelligent logic main control module through the resistor Radc4. The MCU_Data interface of the chip ADCLTF is connected to the power supply VCC, one end of the capacitor Cadc1, and one end of the capacitor Cadc2. The other ends of the capacitors Cadc1 and Cadc2 are grounded. The gate of the field effect transistor QL1 is connected to one end of the potentiometer WL1, the capacitor CL4, and the resistor RL2 respectively. The other end of the resistor RL2 is connected to the resistor RL3 and grounded. The other end of the resistor RL3 is connected to the source of the field effect transistor QL1. The other two ends of the potentiometer WL1 are connected to the resistor RL1 and the power supply VCC. The drain of the field effect transistor QL1 is connected to the other end of the resistor RL1 The other end of capacitor CL4 is connected to the drain of field effect transistor QL1 through capacitors CL2, CL1 and CL3. Interface No. 1 of test interface J1 is connected to the positive input of operational amplifier APL1 through inductor LL1. Interface No. 2 of test interface J1 is connected to capacitor CL2. The negative input of operational amplifier APL1 is grounded. The positive input of power supply is connected to power supply VCC. The negative input of power supply is grounded. Interface No. 1 of test interface J1 is also connected to signal network HV+ of multi-phase path switching module through relay switch KLT1. Interface No. 2 of test interface J1 is also connected to signal network HV+ of multi-phase path switching module through relay switch KLT2. One end of relay corresponding to relay switch KLT1 is connected to intelligent logic The relay corresponding to the main control module and relay switch KHV+ has the other end connected to the power supply VCC. One end of the relay corresponding to the relay switch KLT2 is connected to the intelligent logic main control module and the relay corresponding to the relay switch KHV-, and the other end is connected to the power supply VCC. One end of the relay switch KHV+ is connected to the signal network HV+ of the test high voltage generation module, and the other end is connected to the signal network HV+ of the multi-phase path switching module. The other end of the relay corresponding to the relay switch KHV+ is connected to the power supply VCC. One end of the relay switch KHV- is connected to the signal network HV- of the test high voltage generation module, and the other end is connected to the power supply VCC. The other end of the relay corresponding to the relay switch KHV- is connected to the signal network HV+ of the multi-phase path switching module. ;

[0015] The advantages and positive effects of the present invention are:

[0016] 1. The present invention applies insulation test DC high voltage to the tested phase line through a multi-phase path switching module, and the insulation performance test module cooperates with the test high voltage generation module to sample and measure the returned insulation signal, detect current leakage, and realize fast and fully automatic measurement of the insulation degree between each phase branch and between each phase branch and the ground. It also has the function of checking whether there is a transformer that is not disconnected on the line, and prevents the misjudgment of phase-to-phase short circuit caused by the transformer that is not disconnected on the line. The present invention can reduce the workload of the staff, shorten the measurement time, and improve work efficiency.

[0017] 2. The present invention discharges the high voltage in the path to the negative electrode through a high-voltage discharge module. This automatic discharge technology can eliminate the risk of high-voltage discharge, thereby preventing the tester from being electric shocked, thereby achieving the purpose of protecting the tester, reducing the risk of equipment shock caused by the test, improving power supply reliability, and enhancing the degree of automation at the infrastructure site. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a circuit block diagram of a device for quickly judging cable fault items of the present invention;

[0019] Figure 2 This is a circuit diagram of the intelligent logic main control module of the present invention;

[0020] Figure 3 A circuit diagram for testing a high voltage generation module of the present invention;

[0021] Figure 4 A circuit diagram of the insulation performance test module of the present invention;

[0022] Figure 5 is a circuit diagram of a multiphase path switching module of the present invention;

[0023] Figure 6 is a circuit diagram of a high voltage discharge module of the present invention;

[0024] Figure 7 It is a circuit diagram of the line inductive reactance test module of the present invention. DETAILED DESCRIPTION

[0025] The present invention is further described in detail below through specific examples. The following examples are only illustrative and not restrictive, and the protection scope of the present invention cannot be limited thereto.

[0026] like Figure 1As shown, the present invention provides a device for quickly judging cable fault items, including: an intelligent logic main control module, a test high voltage generation module, a high voltage discharge module, an insulation performance test module, a multi-phase path switching module, a line inductance test module, a test result storage module, an HMI module, and a power supply module.

[0027] like Figure 2 As shown, the intelligent logic main control module is the core control module of the device, which is used to provide scheduling and coordination between various modules, and complete data processing and data analysis. The intelligent logic main control module of the present invention adopts the domestic Huada 32-bit microprocessor as the main control chip, and the chip model used is STM32F103VET6. In terms of hardware design, the peripheral circuit generally includes a voltage stabilizing circuit, a clock circuit, a reset circuit, etc., and the interface circuit includes a serial port, SPI, I2C and other peripheral interfaces. A logic main control module based on the Huada single-chip microcomputer realizes the setting and development of the test path through logic design. In the hardware design, factors such as circuit stability, anti-interference ability and power consumption are considered.

[0028] The test high voltage generation module is connected to the intelligent logic main control module to generate the DC high voltage required for insulation testing.

[0029] like Figure 3As shown, the test high voltage generation module includes a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a resistor R8, a resistor RHv1, a resistor RHv2, a resistor RHv3, a resistor RHv4, a capacitor C1, a capacitor C2, a capacitor VH_C1, a capacitor VH_C2, a capacitor VH_C3, a capacitor VH_C4, a capacitor VH_C5, a potentiometer W1, a diode D1, a diode VH_D1, a diode VH_D2, a diode VH_D3, a diode VH_D4, a diode VH_D5, an operational amplifier AP1, an operational amplifier AP2, a field effect transistor Q, and a transformer THv;One end of the primary coil of the transformer THv is connected to the switch PW_CTL of the relay, the other end of the primary coil of the transformer THv is connected to the drain of the field effect tube Q, the source of the field effect tube Q is grounded, the gate of the field effect tube Q is connected to the output end of the operational amplifier AP1 and the output end of the operational amplifier AP2, the negative input end of the operational amplifier AP2 is connected to the output end of the operational amplifier AP2 through the resistor R2, the negative input end of the operational amplifier AP2 is also connected to the switch PW_CTL of the relay through the resistor R6, the negative input end of the operational amplifier AP2 is also grounded through the resistor R4, the positive input end of the operational amplifier AP2 is connected to the output end of the operational amplifier AP2 through the resistor R3, the positive input end of the operational amplifier AP2 is also connected to the output end of the operational amplifier AP2 through the resistor R4, Capacitor C1 is grounded, the positive input terminal of the power supply of the operational amplifier AP2 is connected to the switch PW_CTL of the relay, the negative input terminal of the power supply of the operational amplifier AP2 is grounded, the negative input terminal of the operational amplifier AP1 is connected to one end of the resistor R7 and the resistor R8, and the other ends of the resistors R7 and R8 are connected to the signal network HV-, one end of the resistor R1 is connected to the gate of the field effect tube Q, and the other end is connected to the switch PW_CTL of the relay, the anode of the diode D1 is grounded through the resistor R5 and connected to the signal network HV-, the cathode of the diode D1 is connected to the switch PW_CTL of the relay, the first end of the potentiometer W1 is connected to the switch PW_CTL of the relay, the other end of the switch PW_CTL of the relay is connected to the power supply VCC, and the relay one The first end of the transformer THv is connected to the power supply VCC, and the other end is connected to the module working control signal. The module working control signal receives the signal of the intelligent logic main control module to adjust the working state of the high voltage generation module. The second end of the potentiometer W1 is grounded through the capacitor C2, and the third end is connected to the second end of the potentiometer W1, the positive electrode of the diode D1 and the resistor R8. One end of the secondary coil of the transformer THv is connected to the positive electrode of the diode VH_D5 through the capacitor VH_C2 and the capacitor VH_C4, and the negative electrode of the diode VH_D5 is connected to the signal network HV+. The other end of the secondary coil is connected to the capacitor VH_C1, and the other end of the capacitor VH_C1 is connected to the negative electrode of the diode VH_D1, the positive electrode of the diode VH_D2, the capacitor VH_C3, and the capacitor VH_C The other end of 3 is connected to the cathode of diode VH_D3, the anode of diode VH_D4, and capacitor VH_C5, the other end of capacitor VH_C5 is connected to resistor RHv4 and signal network HV+, the anode of diode VH_D1 is connected to one end of capacitor VH_C2, the cathode of diode VH_D2 is connected to the other end of capacitor VH_C2, the anode of diode VH_D3 is connected to one end of capacitor VH_C4, the cathode of diode VH_D4 is connected to the other end of capacitor VH_C4, resistor RHv4 is connected to resistor RHv2 through resistor RHv3, the other end of resistor RHv2 is connected to the positive input end of operational amplifier AP1, and the other end of resistor RHv2 is also connected to signal network HV- through resistor RHv1. ;

[0030] The square wave signal generated by the operational amplifier AP2 connected to the multivibrator is added to the field effect tube Q for amplification and boosted by the transformer THv. A pulse wave with opposite polarity is generated at the secondary, and then the capacitor VH_C1 to capacitor VH_C5 and the diode VH_D1 to diode VH_D5 form a boost rectifier circuit to increase the voltage to 0-2kV. The operational amplifier AP1 is connected to form a feedback control circuit, and the output high voltage voltage is added to the reference voltage on the inverting input terminal and the non-inverting input terminal through the feedback resistor voltage divider sampling voltage to control the output voltage regulation.

[0031] like Figure 4 As shown, the insulation performance test module includes a chip ADCF, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a capacitor C1, a capacitor C2, a capacitor C11, a capacitor C12, a capacitor C13, a capacitor C14, and an operational amplifier AP1. Pin 1 of the chip ADCF is connected to one end of the capacitor C14 and pin 8. Pin 2 of the chip ADCF is connected to one end of the capacitor C13, the other end of the capacitor C14 and grounded. Pin 3 of the chip ADCF is connected to one end of the capacitor C12, the other end of the capacitor C13 and the test voltage U2 through the resistor R4. Pin 4 of the chip ADCF is connected to one end of the capacitor C11, the other end of the capacitor C12 and the resistor R3. The other end of the capacitor C11 is grounded. The other end of the resistor R3 is connected to the output end of the operational amplifier AP1 through the voltage Uxk. The output end of the operational amplifier AP1 is also connected to the positive input end of the operational amplifier AP1 through the voltage Uxk and the resistor R7. The positive input end of the operational amplifier AP1 is also grounded through the resistor R6. The negative input end of the operational amplifier AP1 is connected to the Rtest2 interface of the signal network HV- through the resistor R3. One end of the resistor R5 is grounded and the other end is connected to the resistor R3. One end of the resistor R4 is connected to the test voltage U2 and the other end is grounded. One end of the resistor R2 is connected to the test voltage U2 and the other end is connected to the signal network HV+. Pin 5 of the chip ADCF is connected to the CLK interface of the intelligent logic main control module through the resistor R1. Pin 6 of the chip ADCF is connected to the Data interface of the intelligent logic main control module through the resistor R2. Pin 7 of the chip ADCF is connected to the power supply VCC, one end of the capacitor C1, and one end of the capacitor C2. The other ends of the capacitors C1 and C2 are both grounded.

[0032] The insulation test DC high voltage is applied to the tested phase lines through the multi-phase path switching module to detect current leakage, thereby testing the insulation performance between the phase lines. The insulation resistance value between the phases is obtained by calculation after the voltage is converted to AD through the bridge micro-resistance test method composed of resistors R2 and R5 and the bridge zeroing method. The formula is as follows:

[0033]

[0034] The multi-phase path switching module is respectively connected to the intelligent logic main control module and the insulation performance test module, and is controlled by the intelligent logic main control module to automatically complete the switching of the test paths between the phases.

[0035] like Figure 5 As shown, the multi-phase path switching module includes a first group of lines and a second group of lines. The first group of lines is: one end of the switching path relay KHVA+ is connected to the switching path relay KHVB+, the switching path relay KHVC+, and the switching path relay KHVN+, and the other end is connected to the control logic interface HV+CtN, one end of the switch of the switching path relay KHVA+ is connected to the A phase, and the other end is connected to the signal network HV+, the other end of the switching path relay KHVB+ is connected to the control logic interface HV+CtC, and one end of the switch of the switching path relay KHVB+ is connected to the B phase, The other end is connected to the signal network HV+, the other end of the switching path relay KHVC+ is connected to the control logic interface HV+CtB, one end of the switch of the switching path relay KHVC+ is connected to the C phase, and the other end is connected to the signal network HV+, the other end of the switching path relay KHVN+ is connected to the control logic interface HV+CtA, one end of the switch of the switching path relay KHVN+ is connected to the neutral line, and the other end is connected to the signal network HV+, and the control logic interface HV+CtA, control logic interface HV+CtB, control logic interface HV+CtC, control logic interface HV +CtN is connected to the circuit to be tested; the second group of circuits is: one end of the switching path relay KHVA- is connected to the switching path relay KHVB-, the switching path relay KHVC-, and the switching path relay KHVN-, and the other end is connected to the control logic interface HV-CtN, one end of the switch of the switching path relay KHVA- is connected to phase A, and the other end is connected to the signal network HV-, the other end of the switching path relay KHVB- is connected to the control logic interface HV-CtC, one end of the switch of the switching path relay KHVB- is connected to phase B, and the other end is connected to the signal network HV-, The other end of the switching path relay KHVC- is connected to the control logic interface HV-CtB, one end of the switch of the switching path relay KHVC- is connected to phase C, and the other end is connected to the signal network HV-, the other end of the switching path relay KHVN- is connected to the control logic interface HV-CtA, one end of the switch of the switching path relay KHVN- is connected to the neutral line, and the other end is connected to the signal network HV-, and the control logic interface HV-CtA, the control logic interface HV-CtB, the control logic interface HV-CtC, and the control logic interface HV-CtN are connected to the circuit to be tested.

[0036] The multi-phase path switching module controlled by the intelligent logic main control module switches phases between branches according to the program-controlled path and the sequence set by the switching program, automatically connects each phase of the circuit to the high-voltage insulation test system, and completes the automatic insulation phase-changing test function.

[0037] The high-voltage discharge module is connected to the test high-voltage generation module and is used to discharge the high voltage on the test line to a safe voltage state relative to the ground after the test to ensure the safety of the human body.

[0038] like Figure 6 As shown, the high-voltage discharge module includes a relay KHVA, a relay KHVB, a relay KHVC, a relay KHVN, and a discharge resistor R_release. One end of the relay KHVA is connected to the relays KHVB, KHVC, and KHVN, and the other end is connected to the test interface HV+CsleN. One end of the switch of the relay KHVA is connected to the A phase, and the other end is connected to the signal network HV- through the discharge resistor R_release. The other end of the relay KHVB is connected to the test interface HV+CsleC. One end of the switch of the relay KHVB is connected to the B phase, and the other end is connected to the signal network HV-. Connect the discharge resistor R_release, the other end of the relay KHVC is connected to the test interface HV+CsleB, one end of the switch of the relay KHVC is connected to the C phase, and the other end is connected to the discharge resistor R_release, the other end of the relay KHVN is connected to the test interface HV+CsleA, one end of the switch of the relay KHVN is connected to the neutral line, and the other end is connected to the discharge resistor R_release, and the test interface HV+CsleA, the test interface HV+CsleB, the test interface HV+CsleC, and the test interface HV+CsleN are connected to the circuit to be tested.

[0039] According to the program-controlled path, the discharge path is switched between the branches in the order set by the switching program. The test high voltage in the A-phase circuit of the KHVA path is discharged to the negative electrode through the high-voltage discharge path controlled by the discharge path through the discharge resistor R_release, thereby preventing the tester from being electric shocked and achieving the purpose of protecting the tester.

[0040] The insulation performance test module is respectively connected to the intelligent logic main control module and the test high voltage generation module, and is controlled by the intelligent logic main control module. It is used to cooperate with the test high voltage generation module to sample and measure the returned insulation signal to complete the measured phase-to-phase insulation data.

[0041] The line inductance test module is respectively connected to the intelligent logic main control module and the multi-phase path switching module, and is used to test the inductance data of the line to be tested and determine whether other inductive components such as transformers are included in the test line.

[0042] like Figure 7As shown, the line inductance test module includes a resistor RL1, a resistor RL2, a resistor RL3, a resistor Radc1, a resistor Radc2, a resistor Radc3, a resistor Radc4, a capacitor CL1, a capacitor CL2, a capacitor CL3, a capacitor CL4, a capacitor Cadc1, a capacitor Cadc2, a capacitor Cadc3, a capacitor Cadc4, a capacitor Cadc5, a capacitor Cadc6, a chip ADCLTF, a potentiometer WL1, a field effect transistor QL1, an operational amplifier APL1, an inductor LL1, and a test interface J1;Pin 1 of chip ADCLTF is connected to one end of capacitor Cadc6 and pin 8, pin 2 of chip ADCLTF is connected to one end of capacitor Cadc5, the other end of capacitor Cadc6, resistor RL2 and grounded, pin 3 of chip ADCLTF is connected to one end of capacitor Cadc4, the other end of capacitor Cadc5 and resistor Radc2, pin 4 of chip ADCLTF is connected to one end of capacitor Cadc3, the other end of capacitor Cadc4 and resistor Radc1, the other end of capacitor Cadc3 is grounded, the other end of resistor Radc1 is connected to the output end of operational amplifier APL1, and pin 5 of chip ADCLTF is connected to the intelligent logic main control module through resistor Radc3. The MCU_CLK interface of the chip ADCLTF is connected to the MCU_Data interface of the intelligent logic main control module through the resistor Radc4. The MCU_Data interface of the chip ADCLTF is connected to the power supply VCC, one end of the capacitor Cadc1, and one end of the capacitor Cadc2. The other ends of the capacitors Cadc1 and Cadc2 are grounded. The gate of the field effect transistor QL1 is connected to one end of the potentiometer WL1, the capacitor CL4, and the resistor RL2 respectively. The other end of the resistor RL2 is connected to the resistor RL3 and grounded. The other end of the resistor RL3 is connected to the source of the field effect transistor QL1. The other two ends of the potentiometer WL1 are connected to the resistor RL1 and the power supply VCC. The drain of the field effect transistor QL1 is connected to the other end of the resistor RL1 The other end of capacitor CL4 is connected to the drain of field effect transistor QL1 through capacitors CL2, CL1 and CL3. Interface No. 1 of test interface J1 is connected to the positive input of operational amplifier APL1 through inductor LL1. Interface No. 2 of test interface J1 is connected to capacitor CL2. The negative input of operational amplifier APL1 is grounded. The positive input of power supply is connected to power supply VCC. The negative input of power supply is grounded. Interface No. 1 of test interface J1 is also connected to signal network HV+ of multi-phase path switching module through relay switch KLT1. Interface No. 2 of test interface J1 is also connected to signal network HV+ of multi-phase path switching module through relay switch KLT2. One end of relay corresponding to relay switch KLT1 is connected to intelligent logic The relay corresponding to the main control module and relay switch KHV+ has the other end connected to the power supply VCC. One end of the relay corresponding to the relay switch KLT2 is connected to the intelligent logic main control module and the relay corresponding to the relay switch KHV-, and the other end is connected to the power supply VCC. One end of the relay switch KHV+ is connected to the signal network HV+ of the test high voltage generation module, and the other end is connected to the signal network HV+ of the multi-phase path switching module. The other end of the relay corresponding to the relay switch KHV+ is connected to the power supply VCC. One end of the relay switch KHV- is connected to the signal network HV- of the test high voltage generation module, and the other end is connected to the power supply VCC. The other end of the relay corresponding to the relay switch KHV- is connected to the signal network HV+ of the multi-phase path switching module. ;

[0043] The test result storage module is connected to the intelligent logic main control module to save the collected data and the analyzed results. The HMI module is connected to the intelligent logic main control module to provide process data, allow input of commands and set values, and display alarms and other information. The power supply module is connected to the intelligent logic main control module to provide overall working power supply. The human-machine interface module is used to complete information exchange with the user and meet the user's control requirements.

[0044] This device facilitates the fault detection process of multi-phase circuits. It can quickly and fully automatically measure the insulation between each phase branch and between each phase branch and the ground, and automatically discharge to the ground after the measurement is completed. This device also has the function of checking whether there is a transformer that has not been disconnected on the line, to prevent misjudgment of interphase short circuit caused by a transformer that has not been disconnected on the line.

[0045] During operation, connect the ground wire to the grounding bus, and connect each phase branch to be measured to the test interface. The insulation test module displays the measured insulation value on the human-machine interface. This device optimizes the way to measure cable faults, shortens the measurement to one time, reduces the measurement time of each cable section by 5 minutes, and shortens the average fault finding time of each cable by 25 minutes. At the same time, it reduces the risk of equipment shock caused by test transmission, improves power supply reliability, reduces the workload of staff, eliminates the risk of high-voltage discharge through automatic discharge technology, and improves the degree of automation on the infrastructure site.

[0046] The above description is only a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several modifications and improvements without departing from the inventive concept, which all belong to the protection scope of the present invention.

Claims

1. A device for quickly judging cable fault items, It is characterized in that include: Intelligent logic main control module, which is the core control module of the device, and is used to provide scheduling and coordination between various modules, and complete data processing and data analysis; A test high voltage generation module, which is connected to the intelligent logic main control module and is used to generate the DC high voltage required for insulation testing; A high-voltage discharge module, which is connected to the test high-voltage generation module and is used to discharge the high voltage on the test line to a safe voltage state relative to the ground after the test; An insulation performance test module, which is respectively connected to the intelligent logic main control module and the test high voltage generation module, and is controlled by the intelligent logic main control module, and is used to cooperate with the test high voltage generation module to sample and measure the returned insulation signal to complete the measured phase-to-phase insulation data; A multi-phase path switching module, which is respectively connected to the intelligent logic main control module and the insulation performance test module, and is controlled by the intelligent logic main control module, and is used to automatically complete the switching of the test paths between the phases; A line inductance test module, which is connected to the intelligent logic main control module and the multi-phase path switching module respectively, and is used to test the inductance data of the line to be tested and determine whether the test line contains inductive components of other transformers; A test result storage module, which is connected to the intelligent logic main control module and is used to store the collected data and the analyzed results; An HMI module connected to the intelligent logic main control module for providing process data, allowing input of commands and setpoints, and displaying alarms and other information; A power supply module, which is connected to the intelligent logic main control module and is used to provide overall working power supply.

2. The device for quickly judging cable fault items according to claim 1, It is characterized in that It also includes a human-machine interface module, which is used to complete information exchange with the user and meet the user's control requirements.

3. The device for quickly judging cable fault items according to claim 2, It is characterized in that The chip model used by the intelligent logic main control module is STM32F103VET6.

4. The device for quickly judging cable fault items according to claim 3, It is characterized in that The test high voltage generation module includes a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a resistor R8, a resistor RHv1, a resistor RHv2, a resistor RHv3, a resistor RHv4, a capacitor C1, a capacitor C2, a capacitor VH_C1, a capacitor VH_C2, a capacitor VH_C3, a capacitor VH_C4, a capacitor VH_C5, a potentiometer W1, a diode D1, a diode VH_D1, a diode VH_D2, a diode VH_D3, a diode VH_D4, a diode VH_D5, an operational amplifier AP1, an operational amplifier AP2, a field effect transistor Q, and a transformer THv;One end of the primary coil of the transformer THv is connected to the switch PW_CTL of the relay, the other end of the primary coil of the transformer THv is connected to the drain of the field effect tube Q, the source of the field effect tube Q is grounded, the gate of the field effect tube Q is connected to the output end of the operational amplifier AP1 and the output end of the operational amplifier AP2, the negative input end of the operational amplifier AP2 is connected to the output end of the operational amplifier AP2 through the resistor R2, the negative input end of the operational amplifier AP2 is also connected to the switch PW_CTL of the relay through the resistor R6, the negative input end of the operational amplifier AP2 is also grounded through the resistor R4, the positive input end of the operational amplifier AP2 is connected to the output end of the operational amplifier AP2 through the resistor R3, the positive input end of the operational amplifier AP2 is also connected to the output end of the operational amplifier AP2 through the resistor R4, Capacitor C1 is grounded, the positive input terminal of the power supply of the operational amplifier AP2 is connected to the switch PW_CTL of the relay, the negative input terminal of the power supply of the operational amplifier AP2 is grounded, the negative input terminal of the operational amplifier AP1 is connected to one end of the resistor R7 and the resistor R8, and the other ends of the resistors R7 and R8 are connected to the signal network HV-, one end of the resistor R1 is connected to the gate of the field effect tube Q, and the other end is connected to the switch PW_CTL of the relay, the anode of the diode D1 is grounded through the resistor R5 and connected to the signal network HV-, the cathode of the diode D1 is connected to the switch PW_CTL of the relay, the first end of the potentiometer W1 is connected to the switch PW_CTL of the relay, the other end of the switch PW_CTL of the relay is connected to the power supply VCC, and the relay one The first end of the transformer THv is connected to the power supply VCC, and the other end is connected to the module working control signal. The module working control signal receives the signal of the intelligent logic main control module to adjust the working state of the high voltage generation module. The second end of the potentiometer W1 is grounded through the capacitor C2, and the third end is connected to the second end of the potentiometer W1, the positive electrode of the diode D1 and the resistor R8. One end of the secondary coil of the transformer THv is connected to the positive electrode of the diode VH_D5 through the capacitor VH_C2 and the capacitor VH_C4, and the negative electrode of the diode VH_D5 is connected to the signal network HV+. The other end of the secondary coil is connected to the capacitor VH_C1, and the other end of the capacitor VH_C1 is connected to the negative electrode of the diode VH_D1, the positive electrode of the diode VH_D2, the capacitor VH_C3, and the capacitor VH_C The other end of 3 is connected to the cathode of diode VH_D3, the anode of diode VH_D4, and capacitor VH_C5, the other end of capacitor VH_C5 is connected to resistor RHv4 and signal network HV+, the anode of diode VH_D1 is connected to one end of capacitor VH_C2, the cathode of diode VH_D2 is connected to the other end of capacitor VH_C2, the anode of diode VH_D3 is connected to one end of capacitor VH_C4, the cathode of diode VH_D4 is connected to the other end of capacitor VH_C4, resistor RHv4 is connected to resistor RHv2 through resistor RHv3, the other end of resistor RHv2 is connected to the positive input end of operational amplifier AP1, and the other end of resistor RHv2 is also connected to signal network HV- through resistor RHv1. ; 5. The device for quickly judging cable fault items according to claim 4, It is characterized in that The insulation performance test module includes a chip ADCF, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a capacitor C1, a capacitor C2, a capacitor C11, a capacitor C12, a capacitor C13, a capacitor C14, and an operational amplifier AP1. Pin 1 of the chip ADCF is connected to one end of the capacitor C14 and pin 8. Pin 2 of the chip ADCF is connected to one end of the capacitor C13, the other end of the capacitor C14 and grounded. Pin 3 of the chip ADCF is connected to one end of the capacitor C12, the other end of the capacitor C13 and a test voltage U2 through a resistor R4. Pin 4 of the chip ADCF is connected to one end of the capacitor C11, the other end of the capacitor C12 and the resistor R3. The other end of the capacitor C11 is grounded. The other end of the resistor R3 is connected to the output end of the operational amplifier AP1 through a voltage Uxk. The output end of amplifier AP1 is also connected to the positive input end of operational amplifier AP1 through voltage Uxk and resistor R7. The positive input end of operational amplifier AP1 is also grounded through resistor R6. The negative input end of operational amplifier AP1 is connected to Rtest2 interface of signal network HV- through resistor R3. One end of resistor R5 is grounded and the other end is connected to resistor R3. One end of resistor R4 is connected to test voltage U2 and the other end is grounded. One end of resistor R2 is connected to test voltage U2 and the other end is connected to signal network HV+. Pin 5 of chip ADCF is connected to CLK interface of intelligent logic main control module through resistor R1. Pin 6 of chip ADCF is connected to Data interface of intelligent logic main control module through resistor R2. Pin 7 of chip ADCF is connected to power supply VCC, one end of capacitor C1 and one end of capacitor C2. The other ends of capacitor C1 and capacitor C2 are both grounded.

6. The device for quickly judging cable fault items according to claim 5, It is characterized in that The multiphase path switching module includes a first group of lines and a second group of lines. The first group of lines is: one end of the switching path relay KHVA+ is connected to the switching path relay KHVB+, the switching path relay KHVC+, and the switching path relay KHVN+, and the other end is connected to the control logic interface HV+CtN. One end of the switch of the switching path relay KHVA+ is connected to the A phase, and the other end is connected to the signal network HV+. The other end of the switching path relay KHVB+ is connected to the control logic interface HV+CtC. One end of the switch of the switching path relay KHVB+ is connected to the B phase, and the other end is connected to the signal network HV+. One end is connected to the signal network HV+, the other end of the switching path relay KHVC+ is connected to the control logic interface HV+CtB, one end of the switch of the switching path relay KHVC+ is connected to the C phase, and the other end is connected to the signal network HV+, the other end of the switching path relay KHVN+ is connected to the control logic interface HV+CtA, one end of the switch of the switching path relay KHVN+ is connected to the neutral line, and the other end is connected to the signal network HV+, and the control logic interface HV+CtA, control logic interface HV+CtB, control logic interface HV+CtC, control logic interface HV+ CtN is connected to the circuit to be tested; the second group of circuits is: one end of the switching path relay KHVA- is connected to the switching path relay KHVB-, the switching path relay KHVC-, and the switching path relay KHVN-, and the other end is connected to the control logic interface HV-CtN, one end of the switch of the switching path relay KHVA- is connected to the A phase, and the other end is connected to the signal network HV-, the other end of the switching path relay KHVB- is connected to the control logic interface HV-CtC, one end of the switch of the switching path relay KHVB- is connected to the B phase, and the other end is connected to the signal network HV-, The other end of the switching path relay KHVC- is connected to the control logic interface HV-CtB, one end of the switch of the switching path relay KHVC- is connected to phase C, and the other end is connected to the signal network HV-, the other end of the switching path relay KHVN- is connected to the control logic interface HV-CtA, one end of the switch of the switching path relay KHVN- is connected to the neutral line, and the other end is connected to the signal network HV-, and the control logic interface HV-CtA, the control logic interface HV-CtB, the control logic interface HV-CtC, and the control logic interface HV-CtN are connected to the circuit to be tested.

7. The device for quickly judging cable fault items according to claim 6, It is characterized in that The high-voltage discharge module includes a relay KHVA, a relay KHVB, a relay KHVC, a relay KHVN, and a discharge resistor R_release. One end of the relay KHVA is connected to the relays KHVB, KHVC, and KHVN, and the other end is connected to the test interface HV+CsleN. One end of the switch of the relay KHVA is connected to the A phase, and the other end is connected to the signal network HV- through the discharge resistor R_release. The other end of the relay KHVB is connected to the test interface HV+CsleC. One end of the switch of the relay KHVB is connected to the B phase, and the other end is connected to the Connect the discharge resistor R_release, the other end of the relay KHVC is connected to the test interface HV+CsleB, one end of the switch of the relay KHVC is connected to the C phase, and the other end is connected to the discharge resistor R_release, the other end of the relay KHVN is connected to the test interface HV+CsleA, one end of the switch of the relay KHVN is connected to the neutral line, and the other end is connected to the discharge resistor R_release, and the test interface HV+CsleA, the test interface HV+CsleB, the test interface HV+CsleC, and the test interface HV+CsleN are connected to the circuit to be tested.

8. The device for quickly judging cable fault items according to claim 7, It is characterized in that The line inductive reactance test module includes a resistor RL1, a resistor RL2, a resistor RL3, a resistor Radc1, a resistor Radc2, a resistor Radc3, a resistor Radc4, a capacitor CL1, a capacitor CL2, a capacitor CL3, a capacitor CL4, a capacitor Cadc1, a capacitor Cadc2, a capacitor Cadc3, a capacitor Cadc4, a capacitor Cadc5, a capacitor Cadc6, a chip ADCLTF, a potentiometer WL1, a field effect tube QL1, an operational amplifier APL1, an inductor LL1, and a test interface J1; Pin 1 of chip ADCLTF is connected to one end of capacitor Cadc6 and pin 8, pin 2 of chip ADCLTF is connected to one end of capacitor Cadc5, the other end of capacitor Cadc6, resistor RL2 and grounded, pin 3 of chip ADCLTF is connected to one end of capacitor Cadc4, the other end of capacitor Cadc5 and resistor Radc2, pin 4 of chip ADCLTF is connected to one end of capacitor Cadc3, the other end of capacitor Cadc4 and resistor Radc1, the other end of capacitor Cadc3 is grounded, the other end of resistor Radc1 is connected to the output end of operational amplifier APL1, and pin 5 of chip ADCLTF is connected to the intelligent logic main control module through resistor Radc3. The MCU_CLK interface of the chip ADCLTF is connected to the MCU_Data interface of the intelligent logic main control module through the resistor Radc4. The MCU_Data interface of the chip ADCLTF is connected to the power supply VCC, one end of the capacitor Cadc1, and one end of the capacitor Cadc2. The other ends of the capacitors Cadc1 and Cadc2 are grounded. The gate of the field effect transistor QL1 is connected to one end of the potentiometer WL1, the capacitor CL4, and the resistor RL2 respectively. The other end of the resistor RL2 is connected to the resistor RL3 and grounded. The other end of the resistor RL3 is connected to the source of the field effect transistor QL1. The other two ends of the potentiometer WL1 are connected to the resistor RL1 and the power supply VCC. The drain of the field effect transistor QL1 is connected to the other end of the resistor RL1 The other end of capacitor CL4 is connected to the drain of field effect transistor QL1 through capacitors CL2, CL1 and CL3. Interface No. 1 of test interface J1 is connected to the positive input of operational amplifier APL1 through inductor LL1. Interface No. 2 of test interface J1 is connected to capacitor CL2. The negative input of operational amplifier APL1 is grounded. The positive input of power supply is connected to power supply VCC. The negative input of power supply is grounded. Interface No. 1 of test interface J1 is also connected to signal network HV+ of multi-phase path switching module through relay switch KLT1. Interface No. 2 of test interface J1 is also connected to signal network HV+ of multi-phase path switching module through relay switch KLT2. One end of relay corresponding to relay switch KLT1 is connected to intelligent logic The main control module and the relay corresponding to the relay switch KHV+ have their other ends connected to the power supply VCC. One end of the relay corresponding to the relay switch KLT2 is connected to the intelligent logic main control module and the relay corresponding to the relay switch KHV-, and the other end is connected to the power supply VCC. One end of the relay switch KHV+ is connected to the signal network HV+ of the test high-voltage generation module, and the other end is connected to the signal network HV+ of the multi-phase path switching module. The other end of the relay corresponding to the relay switch KHV+ is connected to the power supply VCC. One end of the relay switch KHV- is connected to the signal network HV- of the test high-voltage generation module, and the other end is connected to the power supply VCC. The other end of the relay corresponding to the relay switch KHV- is connected to the signal network HV+ of the multi-phase path switching module.

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