Cutting depth detection method and device

Abstract

The invention discloses a cutting depth detection method and device, and relates to the technical field of wafer scribing, and the method comprises the steps: controlling a cutting knife to cut a glue film; the lens center of the microscope is controlled to be aligned with the trace center of the cutting trace on the adhesive film, and the microscope is controlled to move in the extension direction of the cutting trace until the lens of the microscope collects image information of the tail end of the cutting trace; based on the image information, determining the total length of the cutting trace on the adhesive film; and determining the actual cutting depth of the cutting knife according to the radius of the cutting knife and the total length of the cutting trace. According to the invention, depth detection is carried out on the cutting trace after the adhesive film is cut, the wafer is not directly cut, and the integrity of the wafer is not influenced. And the total length of the cutting trace can be accurately measured according to the image information, collected by the microscope, from the trace center of the cutting trace to the tail end of the cutting trace, and the determined cutting depth is more accurate.

Description

Technical Field

[0001] The present application relates to the field of wafer dicing technology, and more specifically, to a cutting depth detection method and device. Background Art

[0002] With the rapid development of intelligence, the demand for chips in various industries is increasing, and the quality requirements for chips are gradually improving. Wafer dicing is a technology used to cut semiconductor wafers into small-sized chips. On a wafer, there are usually hundreds to thousands of chips connected together, with a gap of 80um to 150um between the chips. Wafer dicing technology is used to cut the wafer into several independent chips along the gap.

[0003] The cutting accuracy during the cutting process is directly related to the dimensional accuracy and quality of the chip after cutting. Among them, the cutting accuracy refers to the accuracy level that can be achieved during the cutting process, at least including the cutting accuracy in the direction perpendicular to the wafer placement plane, that is, the cutting depth. Currently, the commonly used cutting depth measurement methods include contact height measurement and non-contact height measurement. Non-contact height measurement is mainly used during the cutting process. The commonly used non-contact height measurement is laser height measurement, such as: using a laser beam to illuminate the surface of the object to be measured, and by measuring the time difference or phase difference from the emission to the reflection of the laser beam, combined with physical parameters such as the speed of light, the height of the object to be measured is calculated. However, due to factors such as splashing materials or water vapor generated during the cutting process, the measured time difference, speed of light, etc. are not accurate enough to meet the requirements for accurate measurement of the cutting depth, affecting the subsequent accurate adjustment of the cutting equipment or cutting knife, and thus affecting the quality of the chips obtained by cutting. Summary of the invention

[0004] In view of the above problems, the present application provides a cutting depth detection method and device to achieve the purpose of accurately detecting the cutting depth of the cutting knife. The specific scheme is as follows:

[0005] The first aspect of the present application provides a cutting depth detection method, comprising:

[0006] Control the cutting knife to cut the film;

[0007] Controlling the center of the lens of the microscope to align with the center of the cutting mark on the film, and controlling the microscope to move in the extension direction of the cutting mark until the lens of the microscope collects image information of the tail end of the cutting mark;

[0008] Based on the image information, determining the total length of the cutting marks on the adhesive film;

[0009] The actual cutting depth of the cutting knife is determined according to the radius of the cutting knife and the total length of the cutting mark.

[0010] In a possible implementation, controlling the microscope to move in the extension direction of the cutting mark until the lens of the microscope collects image information of the tail end of the cutting mark includes:

[0011] When the image information of the cutting mark collected by the lens of the microscope does not meet a preset condition, the lens of the microscope is controlled to move along the target extension direction of the cutting mark by a preset moving distance, wherein the preset condition includes: the image information contains characteristic information representing the tail end of the cutting mark;

[0012] After the lens of the microscope moves the preset moving distance, controlling the lens of the microscope to collect image information of the cutting mark at the current position;

[0013] If the image information of the cutting mark at the current position meets the preset condition, stop moving the lens of the microscope and store the image information collected each time;

[0014] If the image information of the cutting mark at the current position does not satisfy the preset condition, the step of returning to control the lens of the microscope to move along the target extension direction of the cutting mark by a preset moving distance is executed.

[0015] In a possible implementation, the characteristic information characterizing the tail end of the cutting mark is that the length of the cutting mark displayed in the image information is less than a preset length.

[0016] In a possible implementation, determining the total length of the cutting marks on the adhesive film based on the image information includes:

[0017] Based on the image information satisfying the preset conditions, determining the coordinates of the tail end of the cutting mark;

[0018] The total length of the cutting mark is determined according to the coordinates of the center position of the blade center of the cutting knife and the coordinates of the tail end of the cutting mark.

[0019] In a possible implementation, determining the total length of the cutting marks on the adhesive film based on the image information includes:

[0020] Dividing the stored image information into first image information and second image information, the first image information being image information that does not satisfy the preset condition, and the second image information being image information that satisfies the preset condition;

[0021] determining a first length of the cutting mark based on the amount of the first image information and the image size of the first image information;

[0022] Based on the second image information, determining a second length of the cutting mark;

[0023] The total length of the cutting mark is determined according to the first length and the second length.

[0024] In a possible implementation, before determining the total length of the cutting marks on the adhesive film based on the image information, the method further includes:

[0025] The image captured by the lens of the microscope is binarized to obtain image information.

[0026] In a possible implementation, aligning the lens center of the control microscope with the center of the cutting mark on the adhesive film includes:

[0027] acquiring, when the cutting knife cuts the adhesive film, the position coordinates of the center of the blade of the cutting knife on the operating platform on which the adhesive film is placed, as the center position coordinates;

[0028] Based on the coordinates of the center of the picture in the lens of the microscope and the coordinates of the center position, the lens of the microscope is corrected for deviation so that the coordinates of the center of the picture in the lens coincide with the coordinates of the center position.

[0029] In a possible implementation, before the lens center of the control microscope is aligned with the center of the cutting mark on the film, it also includes: setting the lens image parameters of the microscope according to the blade width of the cutting knife and the magnification of the microscope so that the vertical size of the lens image is larger than the blade width.

[0030] In a possible implementation, the method further includes:

[0031] Determining whether the actual cutting depth is equal to the preset cutting depth;

[0032] When the actual cutting depth is not equal to the preset cutting depth, the cutting parameters of the cutting blade are determined based on the difference between the actual cutting depth and the preset cutting depth, and the cutting parameters at least include: the lifting amount and the lowering amount of the cutting blade.

[0033] A second aspect of the present application provides a cutting depth detection device, comprising:

[0034] A cutting control unit, used for controlling the cutting knife to cut the film;

[0035] An image acquisition unit, used to control the center of a microscope lens to align with the center of the cutting mark on the adhesive film, and control the microscope to move in the extension direction of the cutting mark until the lens of the microscope acquires image information of the tail end of the cutting mark;

[0036] An image processing unit, used for determining the total length of the cutting marks on the adhesive film based on the image information;

[0037] The depth determination unit is used to determine the actual cutting depth of the cutting knife according to the radius of the cutting knife and the total length of the cutting mark.

[0038] It can be seen from the above technical solution that the cutting depth detection method provided by the embodiment of the present application first controls the cutting knife to cut the cutting film. The cutting knife does not directly cut the wafer. By detecting the cutting marks of the film, the cutting depth of the cutting knife is determined without affecting the integrity of the wafer. And the present application aligns the trace center of the cutting mark with the lens center of the microscope, and can accurately measure the length of the cutting mark with reference to the lens coordinates or the screen size of the lens. Based on this, according to the image information from the trace center of the cutting mark to the tail end of the cutting mark collected by the microscope, the total length of the cutting mark can be accurately measured. Further, combined with the radius of the cutting knife and the total length of the cutting mark, the determined cutting depth is more accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0040] Figure 1 A schematic diagram of a flow chart of a method for implementing cutting depth detection provided in an embodiment of the present application;

[0041] Figure 2 A front view schematic diagram of a cutting film provided in an embodiment of the present application;

[0042] Figure 3 A schematic side view of a cutting film provided in an embodiment of the present application;

[0043] Figure 4 A knife mark center diagram provided in an embodiment of the present application;

[0044] Figure 5 A knife mark edge diagram provided in an embodiment of the present application;

[0045] Figure 6 A schematic diagram of the structure of a cutting depth detection device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0047] Wafer scribing is a process of cutting a wafer with hundreds to thousands of chips connected together into several independent chips by using a cutting knife to cut along the gaps between the chips. The cutting depth of the cutting knife is a process parameter that needs to be carefully controlled during the wafer scribing process. A cutting depth that is too shallow may not effectively separate the wafers, while a cutting depth that is too deep may increase the risk of edge collapse and cracks, causing the material at the edge of the wafer to fall off or break, or affect the performance and reliability of the chip. In addition, the cutting depth directly affects the wear of the tool. A deeper cutting depth will increase the friction and collision between the tool and the wafer material, thereby accelerating the wear and damage of the tool.

[0048] Based on this, the cutting depth is a process parameter that needs to be carefully controlled during wafer dicing. By reasonably setting and adjusting the cutting depth, production efficiency can be improved and tool life can be extended while ensuring the quality of dicing. If the current cutting depth of the dicing knife cannot be accurately grasped, it cannot be accurately regulated.

[0049] In order to automatically and accurately detect the cutting depth, an embodiment of the present application provides a cutting depth detection method, which can be applied to an automated platform for wafer dicing. The automated platform can control hardware such as microscopes and cutting knives. At the same time, it can also perform image processing and depth calculation on the image information collected by the microscope. The automated platform can use the MKS automated platform.

[0050] For details, please refer to Figure 1 , a flow chart of a method for detecting cutting depth provided in an embodiment of the present application is provided, and the method for detecting cutting depth is introduced, which includes the following process:

[0051] Step S110, controlling the cutting blade to cut the film.

[0052] During normal cutting, the wafer is cut on the adhesive film. The embodiment of the present application detects the cutting depth in real time by cutting the adhesive film, and dynamically adjusts the cutting knife based on the detection result so that the final cutting depth meets the demand. It is understandable that there are multiple chips on the wafer. If the cutting depth is detected and adjusted on the wafer, it will directly affect the quality of the chip. The adhesive film is a consumable in the wafer dicing process. Cutting test on the adhesive film is low cost and does not affect the chips on the wafer.

[0053] Reference Figure 2 , a front view of a cutting film provided in an embodiment of the present application, the cutting knife used in this example is a circular blade, which forms a sharp cutting edge under high-speed rotation, providing strong power support for the cutting operation. After the blade cuts the film, a cutting mark is left on the surface of the film. The embodiment of the present application uses the cutting mark to determine the cutting depth of the cutting knife.

[0054] Step S120, controlling the center of the microscope lens to align with the center of the cutting mark on the film, and controlling the microscope to move in the extension direction of the cutting mark until the microscope lens captures image information of the tail end of the cutting mark.

[0055] Reference Figure 3 A side schematic diagram of a cutting film provided in an embodiment of the present application, wherein the dotted line portion in the figure is the portion where the cutting knife cuts into the film, and also leaves a corresponding cutting mark (knife mark) on the film, and the depth h of the cutting knife cutting into the film can be determined based on the knife mark length L and the blade radius R of the cutting knife.

[0056] The gap size between chips in a wafer is usually in the range of 80um to 150um, and the cutting mark will only be smaller than this size range and cannot be accurately measured by the naked eye. Therefore, the embodiment of the present application introduces a microscope and controls the lens of the microscope to measure the total length L of the cutting mark.

[0057] Control and adjust the lens of the microscope so that the center of the lens image is aligned with the center of the trace of the cutting mark, wherein the center of the trace is the center of the blade of the cutting knife when cutting. The process of adjusting the microscope may include: obtaining the position coordinates of the blade center of the cutting knife on the operating platform where the film is placed when the cutting knife cuts the film as the center position coordinates; based on the coordinates of the center of the image in the lens of the microscope and the center position coordinates, correcting the deviation of the lens of the microscope so that the coordinates of the center of the image in the lens coincide with the center position coordinates.

[0058] Add the calibration deviation of the blade center and the center of the image in the microscope lens in the X direction to the automation platform, where the X direction is the extension direction of the cutting mark. According to the coordinate deviation between the blade center and the center of the lens image, adjust the movement of the microscope until the coordinate deviation between the blade center and the center of the lens image is small enough, or the deviation meets the preset deviation, then stop calibrating the microscope.

[0059] It can be understood that under normal circumstances, the cutting blade is a blade with a symmetrical structure. Therefore, the cutting marks obtained by cutting are also symmetrical. After the center of the lens is aligned with the center of the cutting mark, the lens moves in any extension direction of the cutting mark. Based on the image information collected during the movement, the number of movements, the lens size and other information, 1 / 2 of the total length of the cutting mark can be determined.

[0060] Therefore, the microscope in the embodiment of the present application only needs to move in one of the two extension directions of the cutting mark, and the total length of the cutting mark can be determined by the image information on one side of the cutting mark collected during the movement process.

[0061] At the observation magnification corresponding to the naked eye, it is impossible to accurately measure the cutting marks. Therefore, it is necessary to increase the magnification of the microscope. It is understandable that the higher the magnification of the microscope, the clearer the details of the object image it displays, thereby improving the accuracy of observation. However, as the magnification increases, the field of view of the microscope will also be reduced, that is, the fewer cutting marks will appear in the lens image. This means that at high magnification, although the details of the object image are clearer, the overall range that can be observed becomes smaller.

[0062] In an embodiment of the present application, in order to improve the accuracy of measuring cutting marks, after increasing the magnification of the microscope, the lens screen cannot fully display the cutting marks. Therefore, it is necessary to move the lens of the microscope to find the tail end of the cutting mark by calculating the number of times the lens is moved, the lens magnification, the proportion of the lens screen occupied by the cutting mark, the lens movement speed, etc.

[0063] In a possible implementation, the process of searching for cutting marks in step S120 may include: when the image information of the cutting marks captured by the lens of the microscope does not meet the preset conditions, controlling the lens of the microscope to move along the target extension direction of the cutting marks by a preset moving distance, and the preset conditions include: the image information contains characteristic information characterizing the tail end of the cutting marks; after the lens of the microscope moves the preset moving distance, controlling the lens of the microscope to capture image information of the cutting marks at the current position; if the image information of the cutting marks at the current position meets the preset conditions, stopping moving the lens of the microscope and storing the image information captured each time; if the image information of the cutting marks at the current position does not meet the preset conditions, returning to execute the step of controlling the lens of the microscope to move along the target extension direction of the cutting marks by a preset moving distance.

[0064] Reference Figure 4 , an embodiment of the present application provides a knife mark center map, in which the thick black lines are cutting marks, and the entire picture is the lens picture of the microscope. If the cutting depth is small, the entire cutting mark can be displayed in the picture where the knife mark center is aligned with the lens center, and there is no need to move the microscope lens.

[0065] Theoretically, the microscope lens is used to collect image information and cannot identify whether the end of the trace is included in the current lens. Therefore, an automated platform is required to identify the cutting traces in the image information collected by each movement of the lens to see whether the end of the trace is included. Figure 4 and Figure 5 In the knife mark edge map and the knife mark center map, the knife mark spans the entire screen, but the length of the tail of the knife mark is not enough to span the entire screen, and the feature that does not span the entire screen in the image information can be a feature that characterizes the tail of the mark, or the length of the cutting mark displayed in the image information is less than a preset length. For example, it is less than 90% of the horizontal length of the lens screen. Based on this, it is identified whether the image information of each movement meets the preset conditions. The preset conditions can be: the cutting mark in the image information spans the entire screen, or the length of the cutting mark displayed in the image information is less than the preset length, so as to determine whether the current position is moved to the tail of the mark.

[0066] After each movement, the image information of the cutting mark is collected. If the collected image information of the cutting mark meets the above preset conditions, it is proved that the current position is the tail end position of the cutting mark, and the movement of the microscope is stopped. If the collected image information of the cutting mark does not meet the above preset conditions, the lens of the microscope is controlled to continue to move and collect image information.

[0067] It is understandable that, since the cutting mark is short, when the microscope moves a large distance, the cutting mark is not in the lens picture, which increases the difficulty of measuring the cutting mark. Considering the possibility of calculating the total length of the cutting mark based on the number of movements and the moving distance, it is necessary to count the distance of each movement. Based on this, the embodiment of the present application pre-sets the moving distance of each movement of the microscope, for example: each moving distance is 1 / 2 of the width of the lens picture of the microscope, so that the lens of the microscope after the movement still retains 1 / 2 of the picture content of the previous movement, avoiding the failure to track the cutting mark after the movement.

[0068] Step S130, determining the total length of the cutting marks on the film based on the image information.

[0069] The automation platform pre-configures an algorithm for image information, extracts cutting marks from the image information, and calculates the total length of the cutting marks. Optionally, the total length of the cutting marks can be determined based on the image information collected at each movement, or only the image information at the end of the mark is collected, and the total length of the cutting marks is determined by the coordinates of the end of the mark and the coordinates of the center of the mark, but this method requires the establishment of a unified coordinate system in advance.

[0070] In one possible implementation, the total length of the cutting mark on the film is determined based on the image information, including: determining the coordinates of the tail end of the cutting mark based on the image information that meets preset conditions; determining the total length of the cutting mark according to the center position coordinates of the blade center of the cutting knife and the coordinates of the tail end of the cutting mark.

[0071] The automated platform identifies the image information of the tail end of the cutting mark, matches it with the pre-established coordinate system, and determines the coordinates of the tail end of the mark; the blade center is the center of the cutting mark, so the blade center in step S120 can be directly used. The blade center and the coordinates of the tail end of the cutting mark are subtracted, and the double difference is taken as the total length L of the cutting mark.

[0072] In another possible implementation, based on the image information, the total length of the cutting marks on the film is determined, including: dividing the stored image information into first image information and second image information, the first image information is image information that does not meet the preset conditions, and the second image information is image information that meets the preset conditions; based on the number of first image information and the image size of the first image information, determining the first length of the cutting marks; based on the second image information, determining the second length of the cutting marks; and based on the first length and the second length, determining the total length of the cutting marks.

[0073] The image size of each image information is the lens screen size of the microscope. Figure 4 The length of the cutting mark in can be recorded as the width of the lens image; Figure 5 For the cutting marks in the image, it is necessary to identify the proportion of the cutting marks in the horizontal direction of the lens screen, and determine the length of the cutting marks in the image information at the end of the marks in combination with the horizontal width of the lens screen.

[0074] The trace calculation methods of the two types of image information are different, so the collected image information is classified, and the image information that does not contain the features representing the tail end of the trace is taken as the first image information, and the image information that contains the features representing the tail end of the trace is taken as the second image information.

[0075] Optionally, the total length of the cutting mark is obtained by summing the product of the number of first image information and the horizontal width of the lens image and the length of the tail end of the cutting mark in the second image information.

[0076] However, considering that in the process of moving the microscope, the cutting marks in the image information collected this time include part of the cutting marks in the image information collected last time, that is, if only the length of the marks in each image information is added up, there is a possibility of repeated calculation of part of the length. Therefore, it is necessary to combine the movement setting of the microscope with the moving microscope. For example, in step S120, the moving distance each time is 1 / 2 of the width of the lens screen of the microscope, so that 1 / 2 of the screen content of the last movement is still retained in the lens of the microscope after the movement. In this setting, 1 / 2 of the horizontal width of the lens screen in each collected image information is the actual length of the cutting mark. Based on this, the lengths of the first image information and the second image information mentioned above are statistically processed to obtain the accurate total length L of the cutting mark.

[0077] Step S140, determining the actual cutting depth of the cutting knife according to the radius of the cutting knife and the total length of the cutting marks.

[0078] Reference Figure 3 , when the total length L of the cutting mark and the radius R of the cutting knife are known, the actual cutting depth h is calculated according to the geometric algorithm pre-set by the automation platform and the geometric relationship between the cutting mark, cutting radius and cutting depth. The specific formula for calculating the actual cutting depth can be referred to the following formula (1):

[0079] (1)

[0080] In summary, the cutting depth detection method provided in the embodiment of the present application first controls the cutting knife to cut the cutting film, and the cutting knife does not directly cut the wafer. By detecting the cutting marks of the film, the cutting depth of the cutting knife is determined, which does not affect the integrity of the wafer. And the present application aligns the trace center of the cutting mark with the lens center of the microscope, and can accurately measure the length of the cutting mark with reference to the lens coordinates or the screen size of the lens. Based on this, according to the image information from the trace center of the cutting mark to the tail end of the cutting mark collected by the microscope, the total length of the cutting mark can be accurately measured. Further, combined with the radius of the cutting knife and the total length of the cutting mark, the determined cutting depth is more accurate. The embodiment of the present application realizes the automatic detection of the cutting depth, and the automatic detection of the cutting marks by the microscope improves the accuracy of the detection, and the detection result is also more accurate.

[0081] Next, other possible implementations of the cutting depth detection method provided in the embodiments of the present application are described.

[0082] In a possible implementation, before executing step S130 to determine the total length of the cutting marks on the film based on the image information, the method further includes: performing binarization processing on the image captured by the lens of the microscope to obtain image information.

[0083] Figure 4 , Figure 5 The image information collected by the microscope under ideal conditions is actually Figure 4 , 5 The blank area of ​​the image will contain the enlarged film image, that is, the color of the cutting mark is different from that of the background, which affects the recognition of the cutting mark in the image information. Therefore, the embodiment of the present application can define the area of ​​the cutting mark by grayscale through binarization, so that the binarization result of the pixel in the area where the cutting mark is located in the image is 1, and the binarization result of the pixel in the background area is 0, so that the processed image presents a visual effect of only two colors. Figure 4 , Figure 5 , the area where the cutting mark is located is black and the background is white, which improves the efficiency and accuracy of identifying the cutting marks.

[0084] In another possible implementation, before the lens center of the control microscope is aligned with the center of the cutting mark on the film, it also includes: setting the lens image parameters of the microscope according to the knife width of the cutting knife and the magnification of the microscope so that the size of the lens image in the vertical direction is larger than the knife width.

[0085] The staff or the automated platform shall set the ROI height of the microscope in advance according to the actual width of the cutting knife, the magnification of the microscope and other factors. The ROI height refers to the vertical size or position of the cutting mark area in the image, that is, the pixel size of the center of the microscope lens screen in the vertical direction from the edge of the lens to avoid the vertical length of the lens screen being less than the width of the knife, resulting in the inability to fully collect the cutting marks, which affects the accuracy of the final total length of the cutting marks.

[0086] In one possible implementation, it is determined whether the actual cutting depth is equal to the preset cutting depth; when the actual cutting depth is not equal to the preset cutting depth, the cutting parameters of the cutting knife are determined based on the difference between the actual cutting depth and the preset cutting depth, and the cutting parameters include at least: the lifting amount and the lowering amount of the cutting knife.

[0087] According to the deviation between the actual cutting depth and the preset cutting depth, the cutting parameters of the cutting knife are adjusted. For example, if the actual cutting depth is lower than the preset cutting depth, the descent amount of the cutting knife is increased. The cutting parameters may include at least: the lifting amount and the descent amount of the cutting knife. Specifically, they may include: the single descent extreme value, the single lifting extreme value, the final descent extreme value, the final lifting extreme value, the first cut single extreme value, the first cut final extreme value and the adjustment amount floating value, etc., refer to the cutting parameters shown in Table 1 below.

[0088] Table 1 Cutting parameters

[0089]

[0090] In summary, the embodiment of the present application detects the adhesive film after cutting, and the precision error is low. The detection frequency can be adjusted according to the specific situation, and it does not affect the actual cutting of the chip in the wafer, reducing the trial and error cost of wafer dicing. Moreover, after aligning the center of the blade with the center of the microscope, the embodiment of the present application can accurately find the center of the knife mark, which can greatly improve the detection efficiency and accuracy. In addition, based on the actual cutting depth detected, the embodiment of the present application adjusts the card control parameters of the lifting and lowering amount of the cutting knife, which can facilitate on-site regulation according to the specific situation and improve the adaptability to different cutting requirements.

[0091] The cutting depth detection device provided in an embodiment of the present application is described below. The cutting depth detection device described below and the cutting depth detection method described above can be referenced to each other.

[0092] First, combine Figure 6 , the cutting depth detection device is introduced, such as Figure 6 As shown, the cutting depth detection device may include:

[0093] A cutting control unit 100 is used to control a cutting knife to cut the film;

[0094] The image acquisition unit 200 is used to control the center of the lens of the microscope to align with the center of the cutting mark on the film, and control the microscope to move in the extension direction of the cutting mark until the lens of the microscope acquires image information of the tail end of the cutting mark;

[0095] An image processing unit 300, configured to determine a total length of the cutting marks on the adhesive film based on the image information;

[0096] The depth determination unit 400 is used to determine the actual cutting depth of the cutting knife according to the radius of the cutting knife and the total length of the cutting marks.

[0097] In a possible implementation, the image acquisition unit 200 includes:

[0098] a movement control subunit, for controlling the lens of the microscope to move along a target extension direction of the cutting mark by a preset movement distance when the image information of the cutting mark collected by the lens of the microscope does not meet a preset condition, wherein the preset condition includes: the image information contains characteristic information representing the tail end of the cutting mark;

[0099] An image acquisition subunit, used for controlling the lens of the microscope to acquire image information of the cutting mark at a current position after the lens of the microscope moves the preset moving distance;

[0100] An image storage subunit, used to stop moving the lens of the microscope and store the image information collected each time if the image information of the cutting mark at the current position meets the preset condition;

[0101] The jump return subunit is used to return to the step of controlling the lens of the microscope to move along the target extension direction of the cutting mark by a preset moving distance if the image information of the cutting mark at the current position does not meet the preset condition.

[0102] In a possible implementation, the characteristic information characterizing the tail end of the cutting mark is that the length of the cutting mark displayed in the image information is less than a preset length.

[0103] In a possible implementation, the image processing unit 300 includes:

[0104] A coordinate determination subunit, used to determine the coordinates of the tail end of the cutting mark based on the image information that meets the preset conditions;

[0105] The length determination subunit is used to determine the total length of the cutting mark according to the center position coordinates of the blade center of the cutting knife and the coordinates of the tail end of the cutting mark.

[0106] In a possible implementation, the image processing unit 300 includes:

[0107] an image classification subunit, configured to classify the stored image information into first image information and second image information, wherein the first image information is image information that does not satisfy the preset condition, and the second image information is image information that satisfies the preset condition;

[0108] A first length determining subunit, configured to determine a first length of the cutting mark based on the amount of the first image information and the image size of the first image information;

[0109] A second length determination subunit, configured to determine a second length of the cutting mark based on the second image information;

[0110] The total length determination subunit is used to determine the total length of the cutting mark according to the first length and the second length.

[0111] In a possible implementation, the image processing unit 300 further includes:

[0112] The binarization processing subunit is used to perform binarization processing on the image collected by the lens of the microscope to obtain image information.

[0113] In a possible implementation, the image acquisition unit 200 includes:

[0114] a center coordinate acquisition subunit, used to acquire, when the cutting knife cuts the adhesive film, the position coordinates of the blade center of the cutting knife on the operating platform where the adhesive film is placed, as the center position coordinates;

[0115] The deviation correction subunit is used to perform deviation correction on the lens of the microscope based on the coordinates of the center of the picture in the lens of the microscope and the center position coordinates, so that the coordinates of the center of the picture in the lens coincide with the center position coordinates.

[0116] In a possible implementation, the image acquisition unit 200 further includes:

[0117] The picture parameter adjustment subunit is used to set the lens picture parameters of the microscope according to the blade width of the cutting blade and the magnification of the microscope, so that the size of the lens picture in the vertical direction is larger than the blade width.

[0118] In a possible implementation, the method further includes:

[0119] A depth comparison unit, used to determine whether the actual cutting depth is equal to the preset cutting depth;

[0120] A parameter adjustment unit is used to determine the cutting parameters of the cutting knife based on the difference between the actual cutting depth and the preset cutting depth when the comparison result of the depth comparison unit is negative, and the cutting parameters at least include: the lifting amount and the lowering amount of the cutting knife.

[0121] It can be seen from the above technical solution that the cutting depth detection method provided by the embodiment of the present application first controls the cutting knife to cut the cutting film. The cutting knife does not directly cut the wafer. By detecting the cutting marks of the film, the cutting depth of the cutting knife is determined without affecting the integrity of the wafer. And the present application aligns the trace center of the cutting mark with the lens center of the microscope, and can accurately measure the length of the cutting mark with reference to the lens coordinates or the screen size of the lens. Based on this, according to the image information from the trace center of the cutting mark to the tail end of the cutting mark collected by the microscope, the total length of the cutting mark can be accurately measured. Further, combined with the radius of the cutting knife and the total length of the cutting mark, the determined cutting depth is more accurate.

[0122] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0123] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0124] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cutting depth detection method, It is characterized in that include: Control the cutting knife to cut the film; Controlling the center of the lens of the microscope to align with the center of the cutting mark on the film, and controlling the microscope to move in the extension direction of the cutting mark until the lens of the microscope collects image information of the tail end of the cutting mark; Based on the image information, determining the total length of the cutting marks on the adhesive film; The actual cutting depth of the cutting knife is determined according to the radius of the cutting knife and the total length of the cutting mark.

2. The cutting depth detection method according to claim 1, It is characterized in that The controlling the microscope to move in the extension direction of the cutting mark until the lens of the microscope collects image information of the tail end of the cutting mark includes: When the image information of the cutting mark collected by the lens of the microscope does not meet a preset condition, the lens of the microscope is controlled to move along the target extension direction of the cutting mark by a preset moving distance, wherein the preset condition includes: the image information contains characteristic information representing the tail end of the cutting mark; After the lens of the microscope moves the preset moving distance, controlling the lens of the microscope to collect image information of the cutting mark at the current position; If the image information of the cutting mark at the current position meets the preset condition, stop moving the lens of the microscope and store the image information collected each time; If the image information of the cutting mark at the current position does not satisfy the preset condition, the step of returning to control the lens of the microscope to move along the target extension direction of the cutting mark by a preset moving distance is executed.

3. The cutting depth detection method according to claim 2, It is characterized in that The characteristic information characterizing the tail end of the cutting mark is that the length of the cutting mark displayed in the image information is less than a preset length.

4. The cutting depth detection method according to claim 2, It is characterized in that The determining the total length of the cutting marks on the adhesive film based on the image information includes: Based on the image information satisfying the preset conditions, determining the coordinates of the tail end of the cutting mark; The total length of the cutting mark is determined according to the coordinates of the center position of the blade center of the cutting knife and the coordinates of the tail end of the cutting mark.

5. The cutting depth detection method according to claim 2, It is characterized in that The determining the total length of the cutting marks on the adhesive film based on the image information includes: Dividing the stored image information into first image information and second image information, the first image information being image information that does not satisfy the preset condition, and the second image information being image information that satisfies the preset condition; determining a first length of the cutting mark based on the amount of the first image information and the image size of the first image information; Based on the second image information, determining a second length of the cutting mark; The total length of the cutting mark is determined according to the first length and the second length.

6. The cutting depth detection method according to claim 2, It is characterized in that Before determining the total length of the cutting marks on the adhesive film based on the image information, the method further includes: The image captured by the lens of the microscope is binarized to obtain image information.

7. The cutting depth detection method according to claim 1, It is characterized in that The lens center of the control microscope is aligned with the center of the cutting mark on the adhesive film, comprising: acquiring, when the cutting knife cuts the adhesive film, the position coordinates of the center of the blade of the cutting knife on the operating platform on which the adhesive film is placed, as the center position coordinates; Based on the coordinates of the center of the picture in the lens of the microscope and the coordinates of the center position, the lens of the microscope is corrected for deviation so that the coordinates of the center of the picture in the lens coincide with the coordinates of the center position.

8. The cutting depth detection method according to claim 1, It is characterized in that Before the lens center of the control microscope is aligned with the center of the cutting mark on the film, it also includes: setting the lens image parameters of the microscope according to the blade width of the cutting knife and the magnification of the microscope so that the vertical size of the lens image is greater than the blade width.

9. The cutting depth detection method according to claim 1, It is characterized in that Also includes: Determining whether the actual cutting depth is equal to the preset cutting depth; When the actual cutting depth is not equal to the preset cutting depth, the cutting parameters of the cutting blade are determined based on the difference between the actual cutting depth and the preset cutting depth, and the cutting parameters at least include: the lifting amount and the lowering amount of the cutting blade.

10. A cutting depth detection device, It is characterized in that include: A cutting control unit, used for controlling the cutting knife to cut the film; An image acquisition unit, used to control the center of a microscope lens to align with the center of the cutting mark on the adhesive film, and control the microscope to move in the extension direction of the cutting mark until the lens of the microscope acquires image information of the tail end of the cutting mark; An image processing unit, used for determining the total length of the cutting marks on the adhesive film based on the image information; The depth determination unit is used to determine the actual cutting depth of the cutting knife according to the radius of the cutting knife and the total length of the cutting mark.

Images