Vacuum gauge

Abstract

The invention discloses a vacuum gauge, and the vacuum gauge comprises a first housing which is provided with a first accommodation cavity; the second shell is located in the first containing cavity, the second shell is provided with a second containing cavity, and a third containing cavity is formed between the second shell and the first shell; the gas pressure detection assembly is positioned in the second accommodating cavity; the first end of the interface assembly is located outside the first shell, the second end of the interface assembly is located in the second shell, the interface assembly is used for transmitting process gas to the vacuum gauge, the second end of the interface assembly is provided with a first cut-off assembly, and the side wall of the interface assembly is provided with at least one first through hole; and the first through hole is communicated with the third accommodating cavity. According to the vacuum gauge, the process gas is used for heating the gas pressure detection assembly, and the measurement precision during gas pressure detection is improved.

Description

Technical Field

[0001] The present application relates to the technical field of air pressure measurement, and in particular to a vacuum gauge. Background Art

[0002] A vacuum gauge is an instrument for measuring gas pressure. Among them, the capacitive film vacuum gauge uses the pressure difference in the core structure to cause the inner diaphragm to move, causing the capacitance between the diaphragm and the fixed electrode to change. The pressure is measured by measuring the change in capacitance, and it is widely used in the field of vacuum measurement.

[0003] In practical applications, the error in measuring pressure by a vacuum gauge mainly comes from changes in ambient temperature. Therefore, how to control the temperature of the core structure in the vacuum gauge and improve the measurement accuracy of the vacuum gauge has become a research hotspot for technicians in this field. Summary of the invention

[0004] In view of the above problems, the present application provides a vacuum gauge to improve the measurement accuracy of the vacuum gauge. The specific solution is as follows:

[0005] A vacuum gauge, comprising:

[0006] A first shell, wherein the first shell has a first accommodating cavity;

[0007] A second shell located in the first accommodating cavity, the second shell having a second accommodating cavity, and a third accommodating cavity between the second shell and the first shell;

[0008] a gas pressure detection component located in the second accommodating chamber;

[0009] An interface component, wherein the first end of the interface component is located outside the first shell, and the second end is located inside the second shell, and is used to transmit process gas to the vacuum gauge. The second end of the interface component has a first cut-off component, and the side wall of the interface component has at least one first through hole, and the first through hole is connected to the third accommodating chamber.

[0010] Optionally, it also includes: a second cutoff component for controlling the passage between the at least one first through hole and the third accommodating cavity.

[0011] Optionally, also include:

[0012] At least one airflow plate is located in the third accommodating cavity, and the airflow plate has a plurality of second through holes, and the second through holes are used to achieve communication between the accommodating spaces of the third accommodating cavity located on opposite sides of the airflow plate.

[0013] Optionally, along the gas flow path in the third accommodating chamber, the second through hole has a first port close to the interface component and a second port away from the interface component;

[0014] The size of the second port of the second through hole in the first direction is smaller than the size of the first port of the second through hole in the first direction;

[0015] Along the direction from the first port to the second port, a size of at least a portion of the second through hole close to the first port in the first direction gradually decreases.

[0016] Optionally, the at least one airflow plate comprises:

[0017] a first airflow plate, which is an annular airflow plate and is disposed on a side of the second accommodating cavity close to the interface assembly;

[0018] a second airflow plate, the second airflow plate being an annular airflow plate, disposed on a side of the second accommodating cavity close to the interface assembly and located on a side of the first airflow plate away from the interface assembly;

[0019] The third airflow plate is a flat airflow plate and is arranged around the outer side wall of the second accommodating cavity.

[0020] Optionally, the number of the second through holes on the first airflow plate and the number of the first through holes in the interface assembly meet the same condition, and in a preset direction, the second through holes on the first airflow plate and the first through holes on the side wall of the interface assembly are staggered, and the preset direction is perpendicular to the gas flow direction in the third accommodating chamber;

[0021] The number of the second through holes on the second air flow plate meets the same condition as the number of the second through holes on the first air flow plate, and in the preset direction, the second through holes on the first air flow plate and the second through holes on the second air flow plate are staggered;

[0022] The number of through holes on the third air flow plate is twice the number of through holes on the second air flow plate, and in the preset direction, the second through holes on the third air flow plate are staggered with the second through holes on the second air flow plate.

[0023] Optionally, the at least one airflow plate further comprises:

[0024] a fourth airflow plate, the fourth airflow plate being a flat airflow plate, arranged in a ring outside the side wall of the second accommodating cavity and located at a side of the third airflow plate away from the interface assembly;

[0025] A fifth airflow plate, which is an annular airflow plate, is disposed on a side of the second accommodating cavity away from the interface assembly.

[0026] Optionally, the number of the second through holes on the fourth air flow plate and the number of the second through holes on the third air flow plate meet the same condition, and along a preset direction, the second through holes on the fourth air flow plate and the second through holes on the third air flow plate are staggered, and the preset direction is perpendicular to the gas flow direction in the third accommodating chamber;

[0027] The number of the second through holes on the fifth air flow plate and the number of the second through holes on the third air flow plate meet the same condition, and along the preset direction, the second through holes on the fifth air flow plate and the second through holes on the fourth air flow plate are staggered.

[0028] Optionally, it also includes: an anti-deposition structural component arranged in the interface component close to the first end of the interface component.

[0029] Optionally, it also includes: a gas adsorption component located in the second accommodating chamber.

[0030] The vacuum gauge provided in the embodiment of the present application utilizes process gas to heat the gas pressure detection component (i.e., the core structure) so that the temperature of the core structure is consistent with the temperature of the process gas, thereby avoiding the expansion of the process gas due to the heating temperature being higher than its own temperature, solving the problem of inaccurate pressure measurement caused by the expansion phenomenon and affecting the process results, improving the detection accuracy of the vacuum gauge, and effectively reducing the adhesion on the inner diaphragm in the core structure, thereby improving the sensitivity, stability and consistency of the vacuum gauge when performing gas pressure detection, thereby increasing the service life of the vacuum gauge.

[0031] In addition, the vacuum gauge provided in the embodiment of the present application utilizes process gas to heat the gas pressure detection component (i.e., the core structure) so that the temperature of the core structure is consistent with the temperature of the process gas. The temperature stability of the core structure can be maintained during the entire process, thereby avoiding the influence of ambient temperature changes on the measurement accuracy, stability, and consistency of the capacitive film vacuum gauge.

[0032] Moreover, in the vacuum gauge provided in the embodiment of the present application, the temperature of the core structure depends on the temperature of the process gas, so that the vacuum gauge provided in the embodiment of the present application can be applicable to pressure detection of process gases at various temperatures, has a wide range of use, strong versatility, and does not have the problem of inaccurate measurement results caused by using a capacitive film vacuum gauge with an inappropriate temperature, further improving the accuracy of the vacuum gauge in pressure detection.

[0033] In addition, in the vacuum gauge provided in the embodiment of the present application, the gas pressure detection component (i.e., the core structure) is heated by process gas, and a heating plate is no longer used, thereby eliminating the need for high-power power supply, reducing the interference of the introduction of large current on the detection of small signals, and improving the accuracy and stability of pressure measurement. This provides a basis for measuring gas pressures in a lower range and shortens the process waiting time. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. Throughout the accompanying drawings, the same or similar reference numerals represent the same or similar elements. It should be understood that the drawings are schematic and the originals and elements are not necessarily drawn to scale.

[0035] Figure 1 A schematic diagram of the structure of a vacuum gauge provided for this application;

[0036] Figure 2 A schematic diagram of the structure of an annular airflow plate in a vacuum gauge provided in the present application;

[0037] Figure 3 A schematic diagram of the structure of a flat airflow plate in a vacuum gauge provided in the present application;

[0038] Figure 4 A schematic diagram of a staggered arrangement of second through holes in adjacent air flow plates in a vacuum gauge provided in the present application;

[0039] Figure 5 A schematic diagram of a gas flow beam formed at a second through hole in an air flow plate in a vacuum gauge provided in the present application. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the embodiments in the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0041] It is obvious to those skilled in the art that various modifications and changes can be made in this application without departing from the spirit or scope of this application. Therefore, this application is intended to cover modifications and changes of this application that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of this application can be combined with each other without contradiction.

[0042] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0043] As described in the background technology section, how to control the temperature of the core structure in the vacuum gauge and improve the measurement accuracy of the vacuum gauge has become a research hotspot for those skilled in the art.

[0044] In addition, when the vacuum gauge measures gas pressure, the process gas and by-products formed during the measurement process have adhesion. If they adhere to the inner diaphragm of the core structure, they will directly impact and erode the inner diaphragm, affecting the detection of nano-scale deformation, causing deviations in the test data of the strain diaphragm (i.e., the inner diaphragm), and directly affecting the accuracy, sensitivity, and consistency of pressure detection. Moreover, when the core structure temperature of the vacuum gauge is lower than the temperature of the process gas, the process gas and by-products formed during the measurement process are easy to adhere to the inner diaphragm of the core structure. Therefore, if you want to reduce the adhesion on the inner diaphragm, controlling the temperature of the core structure is also a major measure.

[0045] Specifically, in a vacuum gauge, a heating structure can be installed outside the core structure, such as fixing a heater (such as a silicone heating sheet) evenly on the outer wall of a heat-conducting material (such as aluminum) to heat the core structure, and the temperature of the core structure can be controlled through the temperature feedback of the temperature sensor. However, this temperature control method takes a long time to achieve a constant and uniform temperature of the core structure, generally four hours, which increases the process time.

[0046] Moreover, in this temperature control method, the heating structure is arranged outside the core structure, wraps the core structure, and is connected to the core structure through a mechanical structure, and then the temperature is transferred to the core structure through heat conduction. In order to ensure that the heat loss during the heat conduction process and the inconsistency of the processing and production of each core structure (the production cannot ensure the consistency of the quality of each structure, the contact of the conduction path, etc.) will not cause the temperature in the measurement chamber of the vacuum gauge to be lower than the required temperature, and at the same time, in order to ensure the reliability of the heating structure, the heating temperature of the heating structure is generally set higher than the process gas temperature, which will cause the process gas to expand in the measurement chamber of the capacitance film vacuum gauge due to the temperature being higher than itself, and the measured pressure value is not the true pressure value of the process gas. Even after the later artificial correction, the unpredictable measurement chamber volume deviation caused by the processing error makes it difficult for the vacuum gauge to measure the accurate pressure value, which will directly affect the process results. Especially in the semiconductor industry, the process size is achieved in the nanometer level. As a key component of the process equipment, the capacitance film vacuum gauge has higher requirements for the accuracy, sensitivity and stability of the capacitance film vacuum gauge measurement. The accuracy of the pressure measurement directly affects the success or failure of the process.

[0047] In addition, in order to ensure the stability of the target temperature in the vacuum gauge measurement chamber and to minimize the time taken to achieve the target temperature, the power of the heating structure is usually set to match the required temperature value. For example, if the target temperature is 45°C, the power of the heating structure is 20W; if the target temperature is 200°C, the required power is 50W. As a result, the temperature control method using the heating structure for heating requires different capacitive film vacuum gauges for process gases at different temperatures in actual applications. This method cannot be used universally and cannot cover the entire process temperature range.

[0048] If you want to cover all process temperatures with one heating structure, the power required for the heating structure will be very large to meet the high temperature requirements. For example, if you use 50W at 200℃ to achieve 45℃, the stability at 45℃ will be very poor, and the temperature will take a long time to stabilize. This will significantly affect the measurement results of the capacitive film vacuum gauge.

[0049] In view of this, an embodiment of the present application provides a vacuum gauge, and optionally, the vacuum gauge is a capacitive film vacuum gauge. Figure 1 As shown, the vacuum gauge includes:

[0050] A first housing 10, wherein the first housing 10 has a first accommodating cavity;

[0051] A second housing 20 located in the first housing cavity, wherein the second housing 20 has a second housing cavity 21, and a third housing cavity is provided between the second housing 20 and the first housing 10;

[0052] A gas pressure detection component (i.e., a core structure, not shown in the figure) located in the second accommodating cavity;

[0053] An interface component 30, wherein the first end of the interface component 30 is located outside the first shell 10, and the second end is located inside the second shell 20, and is used to transmit process gas to the vacuum gauge. The second end of the interface component 30 has a first cut-off component 40, and the side wall of the interface component 30 has at least one first through hole, and the first through hole is connected to the third accommodating chamber.

[0054] Specifically, in one embodiment of the present application, the core structure includes: an inner diaphragm (i.e., a metal diaphragm), a fixed electrode, a fixed electrode support structure, etc. In specific applications, air pressure detection is performed based on the capacitance change between the metal diaphragm and the fixed electrode. Since it is already well known to those skilled in the art, this application will not elaborate on it.

[0055] Optionally, in one embodiment of the present application, the first cut-off component is a micro cut-off valve, but the present application does not limit this and it depends on the specific circumstances.

[0056] Specifically, in one embodiment of the present application, the number of air inlets of the third accommodating chamber is 4 or an integer multiple of 4, that is, the number of the first through holes is 4 or an integer multiple of 4, and they are evenly arranged in the annular direction of the side wall, so that the air inlet direction of the third accommodating chamber can cover all directions of the core structure at the same time, so that the gas is evenly radiated in all directions, so that the target temperature of the core structure can be achieved more evenly and quickly, but the present application does not limit this, and it depends on the size of the vacuum gauge.

[0057] When measuring gas pressure, the vacuum gauge provided in the embodiment of the present application first cuts off the passage between the interface component and the second containing chamber through the first cut-off component, so that the process gas input in the interface component can only enter the third containing chamber through the first through hole, and heats the third containing chamber by using the temperature of the process gas, and then heats the second containing chamber until the temperature on the gas pressure detection component in the second containing chamber and the temperature of the process gas meet the same conditions, and then opens the first cut-off component to allow the process gas to enter the second containing chamber, and uses the gas pressure detection component to perform gas pressure detection. At the same time, the process gas is in direct contact with the core structure, and can also exchange heat with the core structure to maintain the temperature stability of the core structure.

[0058] It should be noted that, in the present embodiment, the temperature of the gas pressure detection component in the second containing chamber and the temperature of the process gas satisfy the same condition, which includes: the temperature of the gas pressure detection component in the second containing chamber and the temperature of the process gas are the same, and also includes that the temperature of the gas pressure detection component in the second containing chamber and the temperature of the process gas are basically the same.

[0059] It can be seen that the vacuum gauge provided in the embodiment of the present application utilizes process gas to heat the gas pressure detection component (i.e., the core structure) so that the temperature of the core structure is consistent with the temperature of the process gas, thereby avoiding the expansion of the process gas due to the heating temperature being higher than its own temperature, solving the problem of inaccurate pressure measurement caused by the expansion phenomenon and affecting the process results, improving the detection accuracy of the vacuum gauge, and effectively reducing the adhesion on the inner diaphragm in the core structure, thereby improving the sensitivity, stability and consistency of the vacuum gauge when performing gas pressure detection, thereby improving the service life of the vacuum gauge.

[0060] Moreover, in the vacuum gauge provided in the embodiment of the present application, the temperature of the core structure depends on the temperature of the process gas, so that the vacuum gauge provided in the embodiment of the present application can be applicable to pressure detection of process gases at various temperatures, has a wide range of use, and is highly versatile. There is no problem of inaccurate measurement results caused by using a capacitive film vacuum gauge with an inappropriate temperature, which further improves the accuracy of the vacuum gauge in pressure detection.

[0061] In addition, in the vacuum gauge provided in the embodiment of the present application, the gas pressure detection component (i.e., the core structure) is heated by process gas, and a heating plate is no longer used, thereby eliminating the need for high-power power supply, which has a favorable effect on the detection of tiny signals, can improve the accuracy and stability of pressure measurement, and provide a basis for measuring gas pressures in a lower range, while shortening the process waiting time.

[0062] Optionally, in one embodiment of the present application, continue as Figure 1 As shown, the outer surface of the first shell 10 is covered with a heat-insulating layer 100. Specifically, the heat-insulating layer 100 can be made of a heat-insulating material or can be heat-insulated by vacuum insulation to reduce heat loss in the third accommodating cavity.

[0063] Based on the above embodiment, in one embodiment of the present application, continue as follows Figure 1 As shown, the vacuum gauge also includes a temperature detection component 90, and the temperature detection component 90 includes a first temperature detection element and a second temperature detection element, wherein the first temperature detection element is used to detect the temperature of the process gas input by the interface component 30, and the second temperature detection element is used to detect the temperature of the core structure, so that when the temperature of the core structure and the temperature of the process gas meet the same conditions, the first cut-off component 40 is opened to allow the process gas input by the interface component 30 to enter the second containing chamber 21 to start pressure measurement.

[0064] Optionally, in one embodiment of the present application, the first temperature detection element is a micro temperature sensor, and the second temperature detection element is a micro temperature sensor. The first temperature detection element is used to detect the temperature of the process gas input at the first end of the interface component, and the second temperature detection element is used to detect the temperature at the core position of the metal diaphragm in the core structure, so as to use the temperature at the core position of the metal diaphragm in the core structure that is basically consistent with the temperature of the process gas as the opening condition of the first cut-off component.

[0065] Based on any of the above embodiments, in one embodiment of the present application, continue as follows Figure 1As shown, the vacuum gauge also includes: a second cut-off component 50 for controlling the passage between the at least one first through hole and the third accommodating chamber. When the vacuum gauge uses the process gas to heat the third accommodating chamber, the second cut-off component 50 controls the passage between the interface component 30 and the third accommodating chamber to be connected. When the temperature of the core structure and the process gas meets the same condition, the second cut-off component 50 controls the passage between the interface component 30 and the third accommodating chamber to be cut off to increase the amount of process gas input at the interface component entering the second accommodating chamber and shorten the detection time. However, the present application is not limited to this. In other embodiments of the present application, when the temperature of the core structure and the process gas meets the same condition, the second cut-off component can also control the passage between the interface component and the third accommodating chamber to be connected, depending on the specific circumstances.

[0066] Optionally, in one embodiment of the present application, the second cut-off component is a micro cut-off valve, but the present application does not limit this and it depends on the specific circumstances.

[0067] On the basis of any of the above embodiments, in one embodiment of the present application, the vacuum chamber further includes: at least one airflow plate located in the third accommodating chamber, the airflow plate having a plurality of second through holes, the second through holes being used to realize the connection between the accommodating spaces of the third accommodating chamber located on opposite sides of the airflow plate, so that the process gas entering the third accommodating chamber through the interface assembly forms a uniform gas flow beam through the at least one airflow plate and flows in the third accommodating chamber, thereby improving the uniformity of the heating temperature at each position in the third accommodating chamber.

[0068] Optionally, in one embodiment of the present application, the material of the airflow plate is a heat-conducting material, such as copper. In this embodiment, when the gas input at the interface assembly flows in the third containing cavity, it will collide with the airflow plate, so that the gas heat can be introduced into the second containing cavity through heat exchange with the airflow plate, and the second containing cavity is heated, thereby increasing the heating speed of the core structure in the second containing cavity until the temperature of the core structure is consistent with the temperature of the process gas, that is, the same conditions are met, thereby achieving rapid and uniform heating of the core structure.

[0069] Specifically, in one embodiment of the present application, the at least one airflow plate includes a plurality of airflow plates, and the plurality of airflow plates are evenly arranged in the first accommodating chamber to improve the uniformity of gas flow at different positions in the third accommodating chamber.

[0070] Similarly, in one embodiment of the present application, the multiple second through holes on the air flow plate are also evenly arranged, thereby improving the uniformity of gas flow at different positions in the third accommodating chamber, and further improving the uniformity of temperature at different positions in the third accommodating chamber.

[0071] Optionally, in one embodiment of the present application, continue as Figure 1 As shown, the at least one airflow plate comprises:

[0072] A first airflow plate 61, which is an annular airflow plate and is disposed on a side of the second accommodating cavity close to the interface assembly 30;

[0073] A second airflow plate 62, which is an annular airflow plate and is disposed on a side of the second accommodating cavity close to the interface assembly 30 and on a side of the first airflow plate 61 away from the interface assembly 30;

[0074] The third air flow plate 63 is a flat air flow plate and is arranged around the outer side wall of the second accommodating cavity.

[0075] In another embodiment of the present application, the at least one airflow plate may also include: a first airflow plate, the first airflow plate is an annular airflow plate, and is arranged on a side of the second accommodating chamber close to the interface component; a second airflow plate, the second airflow plate is a flat airflow plate, and is arranged on a side of the second accommodating chamber close to the interface component, and is located on a side of the first airflow plate away from the interface component; a third airflow plate, the third airflow plate is an annular airflow plate, and is arranged on the outer side of the side wall of the second accommodating chamber, such as Figure 2 and Figure 3 As shown, Figure 2 shows a schematic diagram of the structure of the annular airflow plate, Figure 3 The present application does not limit this, and in other embodiments of the present application, the first airflow plate, the second airflow plate and the third airflow plate may also adopt other structures, depending on the specific situation.

[0076] Specifically, in one embodiment of the present application, the number of the second through holes on the first airflow plate and the number of the first through holes in the interface assembly meet the same condition, and in a preset direction, the second through holes on the first airflow plate and the first through holes on the side wall of the interface assembly are staggered, and the preset direction is perpendicular to the gas flow direction in the third accommodating chamber (such as Figure 1 Indicated by the dashed arrow in the middle), so as to improve the uniformity of distribution of the process gas in the third accommodating chamber and the heat exchange efficiency between the third accommodating chamber and the second accommodating chamber;

[0077] The number of the second through holes on the second air flow plate meets the same condition as the number of the second through holes on the first air flow plate, and in the preset direction, the second through holes on the first air flow plate and the second through holes on the second air flow plate are staggered to further improve the uniformity of distribution of the process gas in the third accommodating chamber and the heat exchange efficiency between the third accommodating chamber and the second accommodating chamber;

[0078] The number of through holes on the third air flow plate is twice the number of through holes on the second air flow plate, and in the preset direction, the second through holes on the third air flow plate are staggered with the second through holes on the second air flow plate to further improve the uniformity of distribution of the process gas in the third accommodating chamber and the heat exchange efficiency between the third accommodating chamber and the second accommodating chamber.

[0079] It should be noted that, in the above embodiments, satisfying the same condition includes being the same and being substantially the same, such as a difference within a certain range.

[0080] Optionally, based on the above embodiment, in one embodiment of the present application, continue as follows Figure 1 As shown, the at least one airflow plate further includes a fourth airflow plate 64 and a fifth airflow plate 65, so as to further improve the uniformity of the process gas distribution in the third accommodating chamber and the heat exchange efficiency between the third accommodating chamber and the second accommodating chamber. Specifically, in one embodiment of the present application, the fourth airflow plate 64 is a flat airflow plate, which is arranged on the outer side of the side wall of the second accommodating chamber and is located on the side of the third airflow plate 63 away from the interface component 30; the fifth airflow plate 65 is an annular airflow plate, which is arranged on the side of the second accommodating chamber away from the interface component 30.

[0081] Optionally, in one embodiment of the present application, the number of second through holes on the fourth air flow plate and the number of second through holes on the third air flow plate meet the same condition, and along the preset direction, the second through holes on the fourth air flow plate and the second through holes on the third air flow plate are staggered; the number of second through holes on the fifth air flow plate and the number of second through holes on the third air flow plate meet the same condition, and along the preset direction, the second through holes on the fifth air flow plate and the second through holes on the fourth air flow plate are staggered.

[0082] It should be noted that in other embodiments of the present application, the at least one airflow plate may also include other numbers of airflow plates, and / or the number of second through holes in different airflow plates may adopt other proportional relationships, depending on the size of the core structure of the vacuum gauge, as long as the setting of the at least one airflow plate can make the process gas flow more evenly in the third accommodating chamber, so that the temperature of the core structure can be achieved more evenly and quickly. Optionally, the second through holes in each airflow plate are staggered with the second through holes on the previous airflow plate, such as Figure 4 As shown, Figure 4 A schematic diagram showing the staggered arrangement of the second through holes in adjacent airflow plates is shown, but the present application does not limit this, and it depends on the specific circumstances.

[0083] It should also be noted that the vacuum gauge provided in the embodiment of the present application adopts a structural design of at least one airflow plate, which can make the temperature of the core structure more uniform and faster, reduce process waiting time, and thus shorten the total duration of an air pressure measurement.

[0084] Based on any of the above embodiments, in one embodiment of the present application, Figure 5 As shown, along the gas flow direction X in the third accommodating chamber, the second through hole has a first port 66 close to the interface component and a second port 67 away from the interface component, and the size of the second port 67 of the second through hole in the first direction Y is smaller than the size of the first port 66 of the second through hole in the first direction Y, so that the gas molecules in the process gas collide with and scatter with the second through hole under the impetus of thermal motion and the gas beams gathered to flow can only flow in the direction away from the interface component, but not in the direction toward the interface component, so that when the process gas enters each accommodating space separated by the multiple airflow plates, it can undergo sufficient heat exchange in the accommodating space and then evenly enter the next accommodating space along the direction away from the interface component.

[0085] Based on any of the above embodiments, in one embodiment of the present application, continue as follows Figure 5 As shown, along the direction from the first port 66 to the second port 67, the size of at least the portion of the second through hole close to the first port 66 in the first direction Y gradually decreases to increase the air intake of the first port 66 in the second through hole and improve the gas transmission speed in the air flow plate. Optionally, in one embodiment of the present application, the inner side surface of at least the portion of the second through hole close to the first port 66 is an arc-shaped surface to facilitate scattering and gathering more process gases into gas flow beams entering the second through hole and entering the third accommodating chamber through the second through hole, but the present application does not limit this and it depends on the specific circumstances.

[0086] Based on any of the above embodiments, in one embodiment of the present application, the cross-sectional area of ​​the air inlet of the second accommodating chamber is equal to the sum of the cross-sectional areas of all air inlets of the third accommodating chamber, so that after the first cut-off component is opened and the second cut-off component is not opened or closed, the amount of gas input in the interface component flowing to the second accommodating chamber and the amount of gas flowing to the third accommodating chamber are consistent, but the present application does not limit this and it depends on the specific circumstances.

[0087] Based on any of the above embodiments, in one embodiment of the present application, continue as follows Figure 1 As shown, the vacuum gauge also includes: an anti-deposition structure 70 arranged in the interface component 30 near the first end of the interface component 30, and the anti-deposition structure 70 is used to prevent process gas from being deposited inside the vacuum gauge, especially on key components in the core structure (such as metal diaphragm).

[0088] Based on any of the above embodiments, in one embodiment of the present application, continue as follows Figure 1 As shown, the vacuum gauge also includes: a gas adsorption component 80 located in the second containing chamber, and the gas adsorption component 80 can be used to adsorb the process gas in the second containing chamber after a measurement is completed, so as to avoid the residual process gas in the second containing chamber affecting or contaminating the next measurement of the process gas, but the present application does not limit this. In specific applications, the function of the gas adsorption component can be selected to be turned on or off according to actual conditions.

[0089] It should be noted that, in the above embodiment, the gas adsorption component can also be used to adsorb the process gas during the measurement process to accelerate the flow rate of the process gas, but the present application does not limit this and it depends on the specific situation.

[0090] Optionally, in one embodiment of the present application, the getter material in the gas adsorption assembly is replaceable to ensure the adsorption performance of the gas adsorption assembly.

[0091] Based on any of the above embodiments, in one embodiment of the present application, continue as follows Figure 1 As shown, the vacuum gauge further includes a control system 110, and the control system 110 includes at least one of the following modules:

[0092] A control module 111, the control module 111 is used to control the working state of each component in the vacuum gauge, for example, to control the working state of the first cut-off component, the second cut-off component, the gas adsorption component and other components;

[0093] A capacitance module 112, used for collecting capacitance changes on the gas pressure detection component. Optionally, the capacitance module 112 is used for collecting capacitance changes on the gas pressure detection component in real time;

[0094] The output module 113 is used to output the acquisition results of each module (such as the capacitance module) in real time. Optionally, the acquisition results may include: a voltage signal (the voltage signal is obtained through a series of conversions of the capacitance signal), a real-time temperature condition, etc., wherein the voltage signal is the result output of the vacuum gauge pressure measurement, and the real-time temperature condition is used to check whether the core structure temperature of the vacuum gauge reaches the target temperature (such as being consistent with the process gas temperature);

[0095] The recording module 114 is used to back up and record the data collected in real time in the vacuum gauge to facilitate subsequent retrieval and comparison and analysis of process results.

[0096] It should be noted that, in other embodiments of the present application, the processing system may further include other modules, which is not limited in the present application and depends on the specific circumstances.

[0097] In summary, the vacuum gauge provided in the embodiment of the present application utilizes process gas to heat the gas pressure detection component (i.e., the core structure) so that the temperature of the core structure is consistent with the temperature of the process gas, thereby avoiding the expansion of the process gas due to the heating temperature being higher than its own temperature, solving the problem of inaccurate pressure measurement caused by the expansion phenomenon and affecting the process results, improving the detection accuracy of the vacuum gauge, and effectively reducing the adhesion on the inner diaphragm in the core structure, thereby improving the sensitivity, stability and consistency of the vacuum gauge when performing gas pressure detection, thereby increasing the service life of the vacuum gauge.

[0098] In addition, the vacuum gauge provided in the embodiment of the present application utilizes process gas to heat the gas pressure detection component (i.e., the core structure) so that the temperature of the core structure is consistent with the temperature of the process gas. The temperature stability of the core structure can be maintained during the entire process, thereby avoiding the influence of ambient temperature changes on the measurement accuracy, stability, and consistency of the capacitive film vacuum gauge.

[0099] Moreover, in the vacuum gauge provided in the embodiment of the present application, the temperature of the core structure depends on the temperature of the process gas, so that the vacuum gauge provided in the embodiment of the present application can be applicable to pressure detection of process gases at various temperatures, has a wide range of use, strong versatility, and does not have the problem of inaccurate measurement results caused by using a capacitive film vacuum gauge with an inappropriate temperature, further improving the accuracy of the vacuum gauge in pressure detection.

[0100] In addition, in the vacuum gauge provided in the embodiment of the present application, the gas pressure detection component (i.e., the core structure) is heated by process gas, and a heating plate is no longer used, thereby eliminating the need for high-power power supply, reducing the interference of the introduction of large current on the detection of small signals, and improving the accuracy and stability of pressure measurement. This provides a basis for measuring gas pressures in a lower range and shortens the process waiting time.

[0101] In this specification, each embodiment is described in a progressive, parallel, or progressive and parallel manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0102] It should be noted that in the description of the present application, it should be understood that the description of the drawings and embodiments is illustrative rather than restrictive. The same reference numerals throughout the embodiments of the specification mark the same structure. In addition, for the purpose of understanding and ease of description, the drawings may exaggerate the thickness of some layers, films, panels, regions, etc. It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the term "includes", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that the article or equipment including a series of elements includes not only those elements, but also includes other elements that are not clearly listed, or also includes elements inherent to such articles or equipment. In the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the articles or equipment including the above elements.

[0103] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A vacuum gauge, characterized in that: include: A first shell, wherein the first shell has a first accommodating cavity; A second shell located in the first accommodating cavity, the second shell having a second accommodating cavity, and a third accommodating cavity between the second shell and the first shell; a gas pressure detection component located in the second accommodating chamber; An interface component, wherein the first end of the interface component is located outside the first shell, and the second end is located inside the second shell, and is used to transmit process gas to the vacuum gauge. The second end of the interface component has a first cut-off component, and the side wall of the interface component has at least one first through hole, and the first through hole is connected to the third accommodating chamber.

2. The vacuum gauge according to claim 1, characterized in that: Also includes: A second cutoff component controls the passage between the at least one first through hole and the third accommodating cavity.

3. The vacuum gauge according to claim 1, characterized in that: Also includes: At least one airflow plate is located in the third accommodating cavity, and the airflow plate has a plurality of second through holes, and the second through holes are used to achieve communication between the accommodating spaces of the third accommodating cavity located on opposite sides of the airflow plate.

4. The vacuum gauge according to claim 3, characterized in that: Along the gas flow path in the third accommodating chamber, the second through hole has a first port close to the interface component and a second port away from the interface component; The size of the second port of the second through hole in the first direction is smaller than the size of the first port of the second through hole in the first direction; Along the direction from the first port to the second port, a size of at least a portion of the second through hole close to the first port in the first direction gradually decreases.

5. The vacuum gauge according to claim 3, characterized in that: The at least one airflow plate comprises: a first airflow plate, which is an annular airflow plate and is disposed on a side of the second accommodating cavity close to the interface assembly; a second airflow plate, the second airflow plate being an annular airflow plate, disposed on a side of the second accommodating cavity close to the interface assembly and located on a side of the first airflow plate away from the interface assembly; The third airflow plate is a flat airflow plate and is arranged around the outer side wall of the second accommodating cavity.

6. The vacuum gauge according to claim 5, characterized in that: The number of the second through holes on the first airflow plate and the number of the first through holes in the interface assembly meet the same condition, and in a preset direction, the second through holes on the first airflow plate and the first through holes on the side wall of the interface assembly are staggered, and the preset direction is perpendicular to the gas flow direction in the third accommodating chamber; The number of the second through holes on the second air flow plate meets the same condition as the number of the second through holes on the first air flow plate, and in the preset direction, the second through holes on the first air flow plate and the second through holes on the second air flow plate are staggered; The number of through holes on the third air flow plate is twice the number of through holes on the second air flow plate, and in the preset direction, the second through holes on the third air flow plate are staggered with the second through holes on the second air flow plate.

7. The vacuum gauge according to claim 5, characterized in that: The at least one airflow plate further comprises: a fourth airflow plate, the fourth airflow plate being a flat airflow plate, arranged in a ring outside the side wall of the second accommodating cavity and located at a side of the third airflow plate away from the interface assembly; A fifth airflow plate, which is an annular airflow plate, is disposed on a side of the second accommodating cavity away from the interface assembly.

8. The vacuum gauge according to claim 7, characterized in that: The number of the second through holes on the fourth air flow plate and the number of the second through holes on the third air flow plate meet the same condition, and along a preset direction, the second through holes on the fourth air flow plate and the second through holes on the third air flow plate are staggered, and the preset direction is perpendicular to the gas flow direction in the third accommodating chamber; The number of the second through holes on the fifth air flow plate and the number of the second through holes on the third air flow plate meet the same condition, and along the preset direction, the second through holes on the fifth air flow plate and the second through holes on the fourth air flow plate are staggered.

9. The vacuum gauge according to claim 1, characterized in that: Also includes: An anti-deposition structural component is disposed in the interface component close to the first end of the interface component.

10. The vacuum gauge according to claim 1, characterized in that: Also includes: A gas adsorption component is located in the second accommodating chamber.

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