Display panel and splicing display module

Abstract

The invention provides a display panel and a tiled display module, the display panel comprises a substrate, a transparent cover plate, a filling part and a plurality of light-emitting chips, and the plurality of light-emitting chips and the filling part are located between the substrate and the transparent cover plate; the filling part comprises a first filling part and a second filling part, and the first filling part is located on the side, away from the substrate, of the light-emitting chip; the second filling part is located between two adjacent light-emitting chips; wherein the first filling part is transparent or semitransparent to the visible light, and the second filling part is semitransparent or non-transparent to the visible light. According to the display panel and the spliced display module provided by the invention, the transmittance of the display panel can be improved, and enough black level can be ensured.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a spliced ​​display module. Background Art

[0002] At present, mini-LED display panels use glue-filled packaging. This packaging structure is thicker and has a higher risk of splicing. At the same time, the rework characteristics are poor and it is difficult to remove the surface packaging glue.

[0003] There is also a packaging form that uses a film. This packaging form achieves ideal optical performance through a flexible laminated design. At the same time, the soft glue used in this packaging is more conducive to rework and tearing. In the laminated structure of the existing package, the black layer is on the top. In order to increase the transmittance of the display module, it is necessary to improve the transmittance of the black layer, but at the same time it will bring the risk of not being dark enough in the dark state, resulting in a poor black level. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a display panel and a spliced ​​display module, which can not only improve the transmittance of the display panel but also ensure a sufficient black level.

[0005] To achieve the above-mentioned purpose, an embodiment of the present disclosure provides a display panel, comprising a substrate, a transparent cover, a filling portion and a plurality of light-emitting chips, wherein the plurality of light-emitting chips and the filling portion are both located between the substrate and the transparent cover; the filling portion comprises a first filling portion and a second filling portion, wherein the first filling portion is located on a side of the light-emitting chip away from the substrate; and the second filling portion is located between two adjacent light-emitting chips;

[0006] The first filling portion is transparent or translucent to visible light, and the second filling portion is translucent or opaque to visible light.

[0007] In some embodiments, the substrate includes a driving circuit and a pad, the light-emitting chip includes a pin, and the pin is fixedly connected to the pad;

[0008] The driving circuit provides a driving signal to the light-emitting chip through the pad.

[0009] In some embodiments, the first filling portion is disposed in contact with the second filling portion;

[0010] The second filling part is in contact with the transparent cover plate and the substrate respectively; the first filling part is in contact with the light emitting chip and the transparent cover plate respectively.

[0011] In some embodiments, the orthographic projection of the first filling portion on the plane where the transparent cover plate is located covers the center of the orthographic projection of the light emitting area of ​​the light emitting chip on the plane where the transparent cover plate is located.

[0012] In some embodiments, the orthographic projection of the first filling portion on the plane where the transparent cover plate is located covers the orthographic projection of the light emitting area of ​​the light emitting chip on the plane where the transparent cover plate is located.

[0013] In some embodiments, the second filling part includes a matrix and a light-absorbing material mixed in the matrix, and the light-absorbing material includes at least one of light-absorbing particles and light-absorbing dyes.

[0014] In some embodiments, the second filling part further includes scattering particles mixed in the matrix.

[0015] In some embodiments, the matrix is ​​an ultraviolet-cured product or a thermally-cured product.

[0016] In some embodiments, the first filling part and the second filling part are made of the same material.

[0017] In some embodiments, the transmittance of the first filling portion is in the range of 45% to 80%;

[0018] The transmittance of the second filling part is in the range of 10% to 20%.

[0019] In some embodiments, the thickness of the first filling portion is greater than or equal to 20 μm.

[0020] In some embodiments, the first filling portion is transparent to visible light;

[0021] The light-emitting chips are arranged in one-to-one correspondence with the first filling parts, and the volume V of the first filling part corresponding to each light-emitting chip satisfies:

[0022] V = k × S × H1;

[0023] Wherein, S is the area of ​​a light-emitting region of the light-emitting chip; H1 is the thickness of the first filling portion, the value range of H1 is greater than or equal to 20 μm, and k is greater than or equal to 0.5 and less than or equal to 1.5.

[0024] In some embodiments, the plurality of light emitting chips are all blue light chips;

[0025] The first filling portion includes a first sub-filling portion, a second sub-filling portion, and a third sub-filling portion;

[0026] The first sub-filling portion includes a first color conversion material, which converts blue light into red light; the second sub-filling portion includes a second color conversion material, which converts blue light into green light; and the third sub-filling portion is configured to transmit blue light.

[0027] In some embodiments, the filling portion further includes a third filling portion disposed around the light emitting chip;

[0028] The third filling portion is located between the second filling portion and the light emitting chip;

[0029] The third filling part is respectively arranged in contact with the first filling part, the second filling part, and the light-emitting chip;

[0030] The first filling part and the third filling part are made of the same material.

[0031] In some embodiments, the plurality of light emitting chips are separated by the second filling portion, and the light emitting chips are in direct contact with the second filling portion.

[0032] In some embodiments, the plurality of light emitting chips include a blue light chip, a green light chip, and a red light chip;

[0033] The light-emitting chip is a mini-LED chip or a micro-LED chip.

[0034] As another technical solution, the present invention further provides a spliced ​​display module, comprising a plurality of the above-mentioned display panels provided by the present invention, wherein the plurality of display panels are arranged in an array. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A partial cross-sectional view of a display panel of the related art;

[0036] Figure 2 A partial cross-sectional view of a display panel provided by an embodiment of the present invention;

[0037] Figure 3 A process diagram of the display panel during lamination provided by an embodiment of the present invention;

[0038] Figure 4 Another partial cross-sectional view of a display panel provided by an embodiment of the present invention;

[0039] Figure 5 A further partial cross-sectional view of a display panel provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] The shapes and sizes of the components in the drawings do not reflect the actual proportions, and are only intended to facilitate understanding of the contents of the embodiments of the present invention.

[0042] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0043] The embodiments of the present disclosure are not limited to the embodiments shown in the drawings, but include modifications of the configurations formed based on the manufacturing process. Therefore, the regions illustrated in the drawings have schematic properties, and the shapes of the regions shown in the drawings illustrate the specific shapes of the regions of the elements, but are not intended to be limiting.

[0044] Figure 1 For a partial cross-sectional view of a display panel of the related art, please refer to Figure 1The display panel includes a transparent cover plate 12 and a substrate 11, and a plurality of light-emitting chips 13 and a packaging stack 14 arranged therebetween and sequentially arranged in a direction away from the substrate 11, wherein the plurality of light-emitting chips 13 include a blue chip, a green chip and a red chip, and the plurality of light-emitting chips 13 are arranged at intervals. The packaging stack 14 includes a diffusion glue layer 141, a transparent glue layer 142 and a black glue layer 143 sequentially arranged in a direction away from the substrate 11, wherein the matrix of the black glue layer 143 is mixed with black particles or black dye; the matrix of the diffusion glue layer 141 is mixed with white particles and transparent particles; the transparent glue layer 142 is used to compensate for the thickness of the transparent glue layer 142 to ensure that the plurality of light-emitting chips 13 will not be squeezed. However, in order to increase the transmittance of the display panel, it is necessary to improve the transmittance of the black glue layer 143, but at the same time it will bring the risk of not being dark enough in the dark state, resulting in a poor black level.

[0045] In order to solve the above problems, an embodiment of the present invention provides a display panel, which can not only improve the transmittance of the display panel, but also ensure a sufficient black level. Figure 1 , the display panel includes a substrate 21, a transparent cover plate 22, a filling part 24 and a plurality of light-emitting chips 23. In some embodiments, the transparent cover plate 22 is, for example, a transparent polyethylene terephthalate (PET) material, which can be formed into an integrated film material with the filling material of the filling part 24 before lamination. The filling material is located on the surface of the transparent cover plate 22 facing the substrate 21. When vacuum lamination is performed, the entire cavity to be lamination is first evacuated, and then air is introduced into the side of the transparent cover plate 22 in the cavity away from the substrate 21, so that there is an air pressure difference on both sides of the transparent cover plate 22. By utilizing the air pressure difference, the integrated film material formed by the transparent cover plate 22 and the filling material can be pressed onto the substrate 21 (with a plurality of light-emitting chips 23 installed), so that the filling material is pressed between the transparent cover plate 22 and the substrate 21, and finally the filling part 24 is formed after curing treatment and other processes.

[0046] It should be noted that the transparent cover plate 22 is a cover plate that is transparent to the visible light band.

[0047] In some embodiments, the transparent cover plate 22 is a rigid cover plate, for example, made of glass.

[0048] In some embodiments, the transparent cover plate 22 is a flexible cover plate, for example, the material is a PET film.

[0049] In some embodiments, the substrate 21 may include a driving circuit and a pad, wherein the light emitting chip 23 includes pins, and the pins are fixedly connected to the pad; the driving circuit provides a driving signal to the light emitting chip 23 through the pad. The driving circuit may be an active driving circuit or a passive driving circuit.

[0050] A plurality of light emitting chips 23 and a filling part 24 are located between the substrate 21 and the transparent cover plate 22; the filling part 24 includes a first filling part 241 and a second filling part 242, wherein the first filling part 241 is located on the side of the light emitting chip 23 away from the substrate 21; the second filling part 242 is located between two adjacent light emitting chips 23; wherein the first filling part 241 is transparent or semi-transparent to visible light, and the second filling part 242 is semi-transparent or opaque to visible light. It should be noted that in the embodiment of the present invention, the transparent or semi-transparent state of the first filling part 241 and the semi-transparent or opaque state of the second filling part 242 can be set according to specific circumstances, that is, different states correspond to different transmittances actually required, specifically, "transparent" refers to a state where the transmittance is greater than a first preset percentage, such as 85%, 90% or 95%, etc., and "semi-transparent" refers to a state where the transmittance is less than or equal to the first preset percentage and greater than or equal to the second preset percentage, such as 5%, 10% or 15%, etc. “Opaque” refers to a state where the transmittance is less than a second preset percentage.

[0051] The display panel provided by the embodiment of the present invention adopts the above-mentioned filling part 24 to replace the packaging stack 14 (i.e., the diffusion glue layer 141, the transparent glue layer 142 and the black glue layer 143) in the related art, which not only simplifies the structure, but also the filling part 24 can realize multiple functions of the packaging stack 14, which can not only improve the transmittance of the display panel, but also ensure a sufficient black level. Specifically, with the first filling portion 241 located on the side of the light emitting chip 23 away from the substrate 21, on the one hand, the light emitting chip 23 can be prevented from being squeezed and deformed. On the other hand, since the first filling portion 241 is transparent or translucent to visible light, and the thickness of the first filling portion 241 between the transparent cover plate 22 and the light emitting chip 23 is smaller than that of the second filling portion 242, and the smaller the thickness, the higher the transmittance, the transparent or translucent first filling portion 241 has a higher transmittance; at the same time, with the second filling portion 242 located between two adjacent light emitting chips 23, since it is translucent or opaque to visible light and has a greater thickness than the first filling portion 241, the transmittance of the second filling portion 242 is lower than that of the first filling portion 241, thereby ensuring a sufficient black level. As can be seen from the above, the combination of the above-mentioned first filling portion 241 and the second filling portion 242 can not only improve the transmittance of the display panel, but also ensure a sufficient black level.

[0052] In some embodiments, the first filling portion 241 is arranged in contact with the second filling portion 242. In this case, the thickness of the second filling portion 242 is greater than the thickness of the light emitting chip 23, so that the first filling portion 241 is in contact with the second filling portion 242. In this way, each light emitting chip 23 can be completely covered by the first filling portion 241 and the second filling portion 242, so that the light emitting chip 23 can be better protected and the light emitting chip 23 can be prevented from being squeezed and damaged by contact with the transparent cover plate 22 after pressing.

[0053] In some embodiments, on the basis of the first filling part 241 and the second filling part 242 being in contact with each other, the second filling part 242 is in contact with the transparent cover plate 22 and the substrate 21 respectively; the first filling part 241 is in contact with the light emitting chip 23 and the transparent cover plate 22 respectively. Figure 2 As shown, the thickness H2 of the second filling portion 242 is equal to or substantially equal to the sum of the thickness of the light emitting chip 23 and the thickness H1 of the first filling portion 241. In this way, the first filling portion 241 and the second filling portion 242 can be completely filled between the transparent cover plate 22 and the substrate 21, thereby better protecting the light emitting chip 23. In a specific embodiment, the thickness of the light emitting chip 23 is 80 μm, the thickness H2 of the second filling portion 242 is 100 μm, and the thickness H1 of the first filling portion 241 is 20 μm.

[0054] In some embodiments, a plurality of light emitting chips 23 are separated by the second filling portion 242, and the light emitting chips 23 are in direct contact with the second filling portion 242. In this way, the second filling portion 242 can protect the light emitting chips 23 at their peripheries, thereby preventing the light emitting chips 23 from being squeezed and damaged by contact with the transparent cover plate 22 after pressing.

[0055] In some embodiments, the orthographic projection of the first filling portion 241 on the plane where the transparent cover plate 22 is located covers the center of the orthographic projection of the light-emitting area of ​​the light-emitting chip 23 on the plane where the transparent cover plate 22 is located. The first filling portion 241 can partially cover the light-emitting area of ​​the light-emitting chip 23, that is, cover the center of the light-emitting area, so that the light emitting effect of the display panel is better.

[0056] In some embodiments, the orthographic projection of the first filling portion 241 on the plane where the transparent cover plate 22 is located covers the orthographic projection of the light emitting area of ​​the light emitting chip 23 on the plane where the transparent cover plate 22 is located. The first filling portion 241 may completely cover the light emitting area of ​​the light emitting chip 23.

[0057] In some embodiments, the second filling part 242 includes a matrix and a light-absorbing material mixed in the matrix, and the light-absorbing material includes at least one of light-absorbing particles and light-absorbing dyes. The light-absorbing material in the second filling part 242 can ensure that the black level of the second filling part 242 meets the requirements. The matrix includes, for example, acrylic resin, epoxy resin, etc. The light-absorbing particles include, for example, carbon black particles (the particle size can be greater than or equal to 400nm and less than or equal to 600nm, for example, 500nm), etc. The light-absorbing dye includes, for example, black organic pigments, etc.

[0058] On the basis that the second filling part 242 includes a matrix and a light-absorbing material mixed in the matrix, in some embodiments, the second filling part 242 also includes scattering particles mixed in the matrix. The scattering particles in the matrix of the second filling part 242 can scatter light to produce a uniform light-emitting effect. The scattering particles include, for example, silicon dioxide (SiO2) particles, transparent polystyrene (PS) particles, transparent polymethylmethacrylate (PMMA) particles, etc. The particle size of these particles can be greater than or equal to 4μm and less than or equal to 6μm, for example, 5μm. In some embodiments, the mass percentage of the scattering particles is, for example, greater than or equal to 10% and less than or equal to 20%. The above-mentioned scattering particles are transparent to prevent the matrix from being formed into other colors that are not close to black.

[0059] On the basis that the second filling part 242 includes a matrix and a light-absorbing material mixed in the matrix, in some embodiments, the matrix is ​​an ultraviolet curing product or a heat-curing product. Before curing, the ultraviolet (UV) particles or heat-curing particles provided in the matrix of the second filling part 242 are cured after the matrix containing these particles is cured (ultraviolet irradiation or heat treatment), so that the matrix of the second filling part 242 can be hardened as a whole, there is no uncured part, and the creep amount is reduced by about 50%, so that the disassembly and assembly adhesion can be greatly weakened. The above-mentioned curing treatment is a process in which a substance (a matrix containing ultraviolet particles or heat-curing particles) is transformed from a low molecule to a high molecule (a substance generated after curing). Taking ultraviolet curing as an example, its principle can be: ultraviolet particles are photosensitizing, and they are photo-induced under ultraviolet light to form excited ecological molecules, decompose into free radicals or ions, and make unsaturated organic matter undergo chemical reactions such as polymerization, grafting, and cross-linking to achieve the purpose of curing.

[0060] In some embodiments, Figure 2As shown, the materials of the first filling part 241 and the second filling part 242 are the same. That is, the first filling part 241 includes the above-mentioned matrix and the light-absorbing material mixed in the matrix. Since the thickness H1 of the first filling part 241 is smaller than the thickness H2 of the second filling part 242, and the smaller the thickness, the higher the transmittance, the first filling part 241 has a higher transmittance relative to the second filling part 242, so that the transmittance of the display panel can still be improved. In practical applications, the thickness H1 of the first filling part 241 can be reduced as much as possible to maximize its transmittance while avoiding the extrusion damage caused by the contact between the light-emitting chip 23 and the transparent cover plate 22 after lamination. On this basis, in some embodiments, the first filling part 241 also includes scattering particles mixed in the matrix, which can scatter the light to produce a uniform light-emitting effect. In some embodiments, the first filling part 241 also includes ultraviolet particles or thermosetting particles mixed in the matrix, so that the matrix of the first filling part 241 can be hardened as a whole, thereby greatly reducing the disassembly and assembly adhesion.

[0061] In the case where the materials of the first filling part 241 and the second filling part 242 are the same, the first filling part 241 and the second filling part 242 can be simultaneously manufactured by pressing, that is, the filling materials of the first filling part 241 and the second filling part 242 form an integrated film material with the transparent cover plate 22 on the surface of the transparent cover plate 22 facing the substrate 21. When vacuum pressing is performed, the entire cavity to be pressed is first evacuated, and then air is introduced into the side of the transparent cover plate 22 in the cavity away from the substrate 21, so that there is an air pressure difference on both sides of the transparent cover plate 22. By utilizing the air pressure difference, the integrated film material formed by the transparent cover plate 22 and the filling material can be pressed onto the substrate 21 (with multiple light-emitting chips 23 installed). The vacuum pressing process is, for example, as follows: Figure 3 As shown. The filling material on the surface of the light emitting chip 23 facing away from the substrate 21 overflows between two adjacent light emitting chips 23 due to being squeezed. After pressing, the remaining filling material on the surface of the light emitting chip 23 facing away from the substrate 21 forms the above-mentioned first filling part 241, and the second filling part 242 is formed between the two adjacent light emitting chips 23.

[0062] In other embodiments, Figure 4As shown, the materials of the first filling part 241 and the second filling part 242 can also be different. For example, the first filling part 241 uses a filling material that is transparent to visible light, and the second filling part 242 uses a filling material that is translucent or opaque to visible light. In this case, the filling material of the first filling part 241 (for example, a filling material that is transparent to visible light) can be dispensed on the surface of the side of the light-emitting chip 23 away from the substrate 21 by dispensing, and then the filling material of the second filling part 242 (for example, a filling material that is translucent or opaque to visible light) and the transparent cover plate 22 are formed into an integrated film material by the above-mentioned vacuum pressing method, and pressed onto the substrate 21 (with multiple light-emitting chips 23 installed). Since the filling material of the first filling part 241 has been dispensed on the surface of the side of the light-emitting chip 23 away from the substrate 21, during pressing, the filling material will squeeze all the filling materials of the second filling part 242 to both sides of the light-emitting chip 23 to form the second filling part 242.

[0063] In some embodiments, the transmittance of the first filling part 241 is within a range of greater than or equal to 45%. Further, when the materials of the first filling part 241 and the second filling part 242 are the same, the transmittance of the first filling part 241 is within a range of 45% to 80%; the transmittance of the second filling part 242 is within a range of 10% to 20%. When the materials of the first filling part 241 and the second filling part 242 are different, and the first filling part 241 is transparent to visible light and the second filling part 242 is translucent or opaque to visible light, the transmittance of the first filling part 241 is within a range of greater than or equal to 80%; the transmittance of the second filling part 242 is within a range of 10% to 20%.

[0064] By adopting the above-mentioned ranges respectively, the first filling portion 241 and the second filling portion 242 have an overall transmittance of the filling portion 24 greater than 50%, and a lightness value (called L value, used to characterize the black level, the lower the L value, the darker) of the Lab color system of the filling portion 24 is less than 31.5, thereby not only improving the transmittance of the display panel but also ensuring a sufficient black level.

[0065] In some embodiments, the thickness H1 of the first filling portion 241 is within a range of greater than or equal to 20 μm. The setting of the thickness H1 of the first filling portion 241 takes into account the height tolerance of the light-emitting chip (for example, ±15 μm) and the thickness tolerance of the first filling portion 241 (±5 μm), which can ensure that the light-emitting chip 23 does not contact the transparent cover plate 22 after pressing, avoiding extrusion damage to the light-emitting chip 23, and at the same time can improve the transmittance, for example, to more than 50%.

[0066] Specifically, the thickness H1 of the first filling portion 241 can be 20 μm, and its transmittance can reach 60%, and the thickness H2 of the second filling portion 242 can be 80 μm, and its transmittance can reach 10%. The overall transmittance of the filling portion 24 can reach about 55%, and the lightness value of the Lab color system of the filling portion 24 (called L value, used to characterize the black level, the lower the L value, the darker) is about 30, which is equivalent to the L value of the encapsulation stack used in the related art, so that not only the transmittance of the display panel can be improved, but also a sufficient black level can be ensured.

[0067] In some embodiments, the first filling portion 241 is transparent to visible light. The transparent first filling portion 241 is, for example, a transparent glue without scattering particles, so that the light energy of the light-emitting chip 23 can be released to the maximum extent, so that the transmittance reaches more than 80%; at the same time, the first filling portion 241 can also protect the light-emitting chip 23, and prevent the light-emitting chip 23 from contacting with the transparent cover plate 22 and causing injury.

[0068] In some embodiments, the light emitting chips 23 and the first filling parts 241 are arranged in a one-to-one correspondence, and the volume V of the first filling part 241 corresponding to each light emitting chip 23 satisfies:

[0069] V = k × S × H1;

[0070] Wherein, S is the area of ​​the light-emitting region of a light-emitting chip 23; H1 is the thickness of the first filling portion 241, which is equal to the difference between the thickness H2 of the second filling portion 242 and the height of the light-emitting chip 23, the value range of H1 is greater than or equal to 20 μm, and k is greater than or equal to 0.5 and less than or equal to 1.5.

[0071] In other embodiments, Figure 5As shown, the filling part 24 further includes a third filling part 243 disposed around the light emitting chip 23, the third filling part 243 is located between the second filling part 242 and the light emitting chip 23, and the third filling part 243 is disposed in contact with the first filling part 241, the second filling part 242, and the light emitting chip 23. With the third filling part 243, the light emitting chip 23 can be protected at the periphery of the light emitting chip 23. On this basis, in some embodiments, the first filling part 241 and the third filling part 243 are made of the same material. In this case, the first filling part 241, the second filling part 242 and the third filling part 243 can be made by dispensing and pressing, that is, a certain amount of the filling materials of the first filling part 241 and the third filling part 243 are firstly dispensed on the surface of the light-emitting chip 23 on the side away from the substrate 21 by dispensing, and then the filling material of the second filling part 242 and the transparent cover plate 22 are formed into an integrated film material by the above-mentioned vacuum pressing method, and pressed onto the substrate 21 (with multiple light-emitting chips 23 installed). The filling material of the first filling part 241 and the third filling part 243 has been dotted on the surface. When pressed, the filling material will squeeze out all the filling material of the second filling part 242 to both sides of the light-emitting chip 23 to form the second filling part 242; at the same time, part of the filling material of the first filling part 241 and the third filling part 243 will also be squeezed out to both sides of the light-emitting chip 23, and the third filling part 243 will be formed around the light-emitting chip 23, and the remaining filling material on the surface of the light-emitting chip 23 away from the substrate 21 will form the first filling part 241. It can be seen that the manufacturing method of the first filling part 241, the second filling part 242 and the third filling part 243 is simple, and compared with only dotting the filling material on the surface of the light-emitting chip 23 away from the substrate 21, the glue dispensing accuracy requirement is reduced, thereby reducing the manufacturing difficulty. It is easy to understand that, when only the filling material of the first filling part 241 is dotted on the surface of the light emitting chip 23 on the side away from the substrate 21, due to the small amount of the filling material, during pressing, only the filling material of the second filling part 242 is squeezed and expelled to the two sides of the light emitting chip 23. When the first filling part 241 and the third filling part 243 are dotted on the surface of the light emitting chip 23 on the side away from the substrate 21, the amount of the filling material is more, so that during pressing, part of the filling material of the first filling part 241 and the third filling part 243 can also be squeezed and expelled to the two sides of the light emitting chip 23, and the third filling part 243 is formed around the light emitting chip 23.

[0072] In some embodiments, the plurality of light emitting chips 23 include a blue chip 23 a , a green chip 23 b , and a red chip 23 c .

[0073] In other embodiments, the plurality of light-emitting chips 23 are all blue light chips. On this basis, the first filling portion 241 includes a first sub-filling portion, a second sub-filling portion, and a third sub-filling portion; wherein the first sub-filling portion includes a first color conversion material, such as red quantum dots, and the first color conversion material converts blue light into red light; the second sub-filling portion includes a second color conversion material, such as green quantum dots; the second color conversion material converts blue light into green light; the third sub-filling portion is configured to transmit blue light, such as a transparent resin (i.e., the wavelength of the blue light may not be adjusted) or a blue quantum dot. When the third sub-filling portion is a blue quantum dot, the first wavelength blue light can be converted into a second wavelength blue light.

[0074] In some embodiments, the light emitting chip 23 is a mini-LED chip or a micro-LED chip.

[0075] To sum up, the display panel provided by the embodiment of the present invention adopts the above-mentioned filling part 24 to replace the packaging stack (i.e., the diffusion glue layer, the transparent glue layer and the black glue layer) in the related technology, which not only simplifies the structure, but also the filling part 24 can realize multiple functions of the packaging stack, which can not only improve the transmittance of the display panel, but also ensure a sufficient black level. Specifically, with the first filling portion 241 located on the side of the light emitting chip 23 away from the substrate 21, on the one hand, the light emitting chip 23 can be prevented from being squeezed and deformed. On the other hand, since the first filling portion 241 is transparent or translucent to visible light, and the thickness of the first filling portion 241 between the transparent cover plate 22 and the light emitting chip 23 is smaller than that of the second filling portion 242, and the smaller the thickness, the higher the transmittance, the transparent or translucent first filling portion 241 has a higher transmittance; at the same time, with the second filling portion 242 located between two adjacent light emitting chips 23, since it is translucent or opaque to visible light and has a greater thickness than the first filling portion 241, the transmittance of the second filling portion 242 is lower than that of the first filling portion 241, thereby ensuring a sufficient black level. As can be seen from the above, the combination of the above-mentioned first filling portion 241 and the second filling portion 242 can not only improve the transmittance of the display panel, but also ensure a sufficient black level.

[0076] As another technical solution, an embodiment of the present invention further provides a spliced ​​display module, comprising a plurality of the above-mentioned display panels provided by an embodiment of the present invention, wherein the plurality of display panels are arranged in an array. By adopting the above-mentioned display panels provided by an embodiment of the present invention, the plurality of display panels can not only improve the transmittance of the display panels, but also ensure a sufficient black level.

[0077] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A display panel, characterized in that: The invention comprises a substrate, a transparent cover, a filling part and a plurality of light-emitting chips, wherein the plurality of light-emitting chips and the filling part are both located between the substrate and the transparent cover; the filling part comprises a first filling part and a second filling part, wherein the first filling part is located on a side of the light-emitting chip away from the substrate; and the second filling part is located between two adjacent light-emitting chips; The first filling portion is transparent or translucent to visible light, and the second filling portion is translucent or opaque to visible light.

2. The display panel according to claim 1, characterized in that: The substrate includes a driving circuit and a pad, and the light-emitting chip includes a pin, and the pin is fixedly connected to the pad; The driving circuit provides a driving signal to the light-emitting chip through the pad.

3. The display panel according to claim 1, characterized in that: The first filling part is arranged in contact with the second filling part; The second filling part is in contact with the transparent cover plate and the substrate respectively; the first filling part is in contact with the light emitting chip and the transparent cover plate respectively.

4. The display panel according to claim 3, characterized in that: The orthographic projection of the first filling portion on the plane where the transparent cover plate is located covers the center of the orthographic projection of the light-emitting area of ​​the light-emitting chip on the plane where the transparent cover plate is located.

5. The display panel according to claim 3, characterized in that: The orthographic projection of the first filling portion on the plane where the transparent cover plate is located covers the orthographic projection of the light emitting area of ​​the light emitting chip on the plane where the transparent cover plate is located.

6. The display panel according to any one of claims 1 to 5, characterized in that: The second filling part includes a matrix and a light-absorbing material mixed in the matrix, and the light-absorbing material includes at least one of light-absorbing particles and light-absorbing dyes.

7. The display panel according to claim 6, characterized in that: The second filling part also includes scattering particles mixed in the matrix.

8. The display panel according to claim 6, characterized in that: The matrix is ​​an ultraviolet curing product or a thermal curing product.

9. The display panel according to claim 6, characterized in that: The first filling part and the second filling part are made of the same material.

10. The display panel according to claim 9, characterized in that: The transmittance of the first filling portion is in the range of 45% to 80%; The transmittance of the second filling part is in the range of 10% to 20%.

11. The display panel according to claim 9, characterized in that: The thickness of the first filling portion is in a range of greater than or equal to 20 μm.

12. The display panel according to claim 6, characterized in that: The first filling portion is transparent to visible light; The light-emitting chips are arranged in one-to-one correspondence with the first filling parts, and the volume V of the first filling part corresponding to each light-emitting chip satisfies: V = k × S × H1; Wherein, S is the area of ​​a light-emitting region of the light-emitting chip; H1 is the thickness of the first filling portion, the value range of H1 is greater than or equal to 20 μm, and k is greater than or equal to 0.5 and less than or equal to 1.

5.

13. The display panel according to claim 6, characterized in that: The multiple light-emitting chips are all blue light chips; The first filling portion includes a first sub-filling portion, a second sub-filling portion, and a third sub-filling portion; The first sub-filling portion includes a first color conversion material, which converts blue light into red light; the second sub-filling portion includes a second color conversion material, which converts blue light into green light; and the third sub-filling portion is configured to transmit blue light.

14. The display panel according to claim 1, characterized in that: The filling part further includes a third filling part arranged around the light emitting chip; The third filling portion is located between the second filling portion and the light emitting chip; The third filling part is respectively arranged in contact with the first filling part, the second filling part, and the light-emitting chip; The first filling part and the third filling part are made of the same material.

15. The display panel according to any one of claims 1 to 5, characterized in that: The plurality of light emitting chips are separated by the second filling portion, and the light emitting chips are in direct contact with the second filling portion.

16. The display panel according to any one of claims 1 to 5, characterized in that: The plurality of light emitting chips include a blue light chip, a green light chip and a red light chip; The light-emitting chip is a mini-LED chip or a micro-LED chip.

17. A spliced ​​display module, comprising a plurality of display panels according to any one of claims 1 to 16, wherein the plurality of display panels are arranged in an array.

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