Photo-curable low-dielectric ink for packaging, packaging layer and preparation method of packaging layer

Abstract

The invention belongs to the technical field of organic thin film packaging, and particularly relates to light-curable low-dielectric ink for packaging, a packaging layer and a preparation method of the light-curable low-dielectric ink. Comprising 60%-85% of a fluorine-containing bifunctional monomer, 10%-30% of a monofunctional monomer containing a silyl ether structure, 1%-5% of a bifunctional monomer containing a POSS (Polyhedral Oligomeric Silsesquioxane) structure, 0.1%-6% of a photoinitiator and 0.1%-5% of a photosensitizer. The light-curable low-dielectric ink effectively reduces the dielectric constant of an organic layer and improves the light transmittance and tensile strength, and a packaging layer prepared from the light-curable low-dielectric ink is high in flatness, low in dielectric constant, high in light transmittance and high in tensile strength.

Description

Technical Field

[0001] The invention belongs to the technical field of organic thin film encapsulation, and in particular relates to a light-curable low-dielectric ink for encapsulation, an encapsulation layer and a preparation method thereof. Background Art

[0002] When the organic molecular materials of OLED (Organic Light-Emitting Diode, OLED) electronic devices are exposed to water vapor and oxygen from inside and outside, their organic layers and electrode layers will be oxidized, so that the luminous efficiency, working performance, stability and service life will drop rapidly. By stacking and depositing dense thin films on the substrate of OLED devices to encapsulate the thin films, the intrusion of water vapor and oxygen can be effectively blocked, ensuring the reliability and service life of OLED devices.

[0003] With the rapid improvement of device performance, the size of instruments and equipment continues to shrink. The performance of instruments and equipment such as the path and cycle time are significantly affected by the transmission lag, capacitance and induced coupling between conductors. This also puts forward more stringent and comprehensive requirements on the functional characteristics and packaging effects of packaging materials for semiconductor display devices. Organic thin film packaging materials with excellent dielectric properties such as low dielectric constant and low dielectric loss are gradually becoming a development trend.

[0004] In its patent application number TW202130677A, SDI described the use of cyclopentane dimer-modified (meth) acrylic acid monomers and (meth) acrylic acid functional monomers containing phenyl silane, and the addition of other auxiliary materials to compound the INK composition to obtain a material with a lower dielectric constant. However, phenyl silanes often have a higher viscosity and are not easy to achieve colorless and transparent. At the same time, the acrylic acid system ink has a large gas curing shrinkage rate, which affects the deposition of the inorganic layer, resulting in a decrease in the flatness of the thin film package, thereby affecting the packaging effect.

[0005] 3M's patent application number CN201880082492.X describes the use of monomers containing branched (meth) alkyl acrylate monomers having 12 or more carbon atoms to form an amorphous optically clear layer having a dielectric constant of less than or equal to 3.0 at 1 MHz when cured. However, the tensile strength of the fully alkyl acrylate compound when cured into a film is often insufficient.

[0006] In view of this, the present inventor provides a photocurable low dielectric ink for packaging, a packaging layer and a preparation method thereof to solve the above technical problems. Summary of the invention

[0007] The object of the present invention is to overcome the disadvantages of the above-mentioned prior art, and to provide a photocurable low dielectric ink for encapsulation, an encapsulation layer and a preparation method thereof. The preparation method is simple to operate and easy to realize industrial mass production. The prepared photocurable low dielectric ink adopts a fluorine-containing bifunctional monomer, a monofunctional monomer containing a silicon ether structure, a bifunctional monomer containing a POSS structure, a photoinitiator and a photosensitizer. By reasonably controlling the ratio of each component, the photocurable low dielectric ink has excellent curing efficiency. In addition, the photocurable low dielectric ink is cured by ultraviolet light to form an encapsulation layer, and the encapsulation layer has a small curing shrinkage and a low dielectric constant, thereby improving the flatness and tensile strength of the thin film encapsulation.

[0008] In order to achieve the above object, the present invention adopts the following technical solutions:

[0009] In one aspect, the present invention provides a photocurable low dielectric ink for encapsulation, comprising the following components:

[0010] (A) a fluorinated bifunctional monomer;

[0011] (B) a monofunctional monomer containing a silyl ether structure;

[0012] (C) bifunctional monomers containing polysilsesquioxane (POSS) structure;

[0013] (D) a photoinitiator;

[0014] (E) photosensitizer;

[0015] The photocurable low dielectric ink comprises, by weight percentage, 60% to 85% of a fluorine-containing bifunctional monomer, 10% to 30% of a monofunctional monomer containing a silyl ether structure, 1% to 5% of a bifunctional monomer containing a POSS structure, 0.1% to 6% of a photoinitiator and 0.1% to 5% of a photosensitizer.

[0016] Furthermore, the structural formula of the fluorine-containing bifunctional monomer is shown in the following formula (I):

[0017]

[0018] In formula (I), X 1 and X 2 Each is independently any one of a single bond, O, a substituted or unsubstituted C1 to C10 alkylene group, and a substituted or unsubstituted C1 to C10 alkylene ether group;

[0019] Y 1 and Y 2 Each is independently an epoxy group, and the epoxy group includes any one of monocyclic epoxy, polycyclic epoxy, and styrene epoxy.

[0020] Furthermore, the epoxy group is any one of formula (I-1) to formula (I-5):

[0021]

[0022]

[0023] In formula (I-1) to formula (I-5), * is a linking site;

[0024] In formula (I-2), R 1 is any one of H, C1 to C6 alkyl, C1 to C6 fluoroalkyl, alkenyl, and phenyl; R 2 is any one of a single bond and a C1 to C6 alkylene ether group;

[0025] More preferably, the structure of the fluorine-containing bifunctional monomer is at least one of formula (I-6) to formula (I-8):

[0026]

[0027]

[0028] Furthermore, the structural formula of the monofunctional monomer containing a silicon ether structure is shown in the following formula (ⅠⅠ):

[0029]

[0030] In formula (ⅠⅠ), X 3 Y is any one of a single bond, O, a substituted or unsubstituted C1 to C10 alkylene group, and a substituted or unsubstituted C1 to C10 alkylene ether group; 3 The structure is any one of Formula (Ⅰ-1) to Formula (Ⅰ-5).

[0031] Further preferably, the structure of the monofunctional monomer containing a silicon ether structure is at least one of formula (ⅠⅠ-1) and formula (ⅠⅠ-2):

[0032]

[0033] Furthermore, the general formula of the bifunctional monomer containing the POSS structure is shown in the following formula (III):

[0034] (MSiO1.5)n(ⅠⅠⅠ)

[0035] In formula (III), M represents -M 1 M 2 Y 4 , n is 6, 8, 10 or 12; preferably, n is 8;

[0036] Among them, M1 and M 2 Each independently represents any one of a substituted or unsubstituted C1 to C10 alkylene group and a substituted or unsubstituted C1 to C10 alkylene ether group; Y 4 The structure is any one of Formula (Ⅰ-1) to Formula (Ⅰ-5).

[0037] The bifunctional monomer containing POSS structure provided by the present invention is selected from any one of the following structures;

[0038]

[0039] Where R is -R 3 R 4 Y 5 , R 3 and R 4 Each independently represents any one of O, substituted or unsubstituted C1 to C10 alkylene, and substituted or unsubstituted C1 to C10 alkylene ether; Y 5 The structure is any one of Formula (Ⅰ-1) to Formula (Ⅰ-5);

[0040] Further preferably, the structure of the bifunctional monomer containing the POSS structure is at least one of formula (III-1) and formula (III-2):

[0041]

[0042] In the present invention, the alkylene ether group may include all functional groups in which at least one alkylene group is connected to at least one oxygen atom, for example, (alkylene-oxygen) n -alkylene, (alkylene-oxy-alkylene) n -alkylene, alkylene-oxy or -(oxy-alkylene) n , (wherein n is an integer from 1 to 10).

[0043] Furthermore, the photoinitiator is one or more of a diazonium salt, an aromatic ferrocenium salt, and an aromatic sulfonium salt;

[0044] The photosensitizer is one or more of benzophenone, thioxanthone, xanthone, anthracene, pyrene, thiazine and azathioxanthene.

[0045] On the other hand, the present invention also provides a method for preparing the photocurable low dielectric ink for encapsulation as described above. It should be noted that the method for preparing the photocurable low dielectric ink in the present invention is similar to the method for preparing the conventional encapsulation composition, and specifically comprises the following steps:

[0046] According to weight percentage, 60% to 85% of a fluorine-containing bifunctional monomer, 10% to 30% of a monofunctional monomer containing a silyl ether structure, 1% to 5% of a bifunctional monomer containing a POSS structure, 0.1% to 6% of a photoinitiator and 0.1% to 5% of a photosensitizer are first added into a brown glass container, and then shaken at room temperature until the mixture is uniformly mixed, thereby preparing a photocurable low dielectric ink for packaging.

[0047] On the other hand, the present invention also provides an encapsulation layer, comprising inorganic layers and organic layers alternately arranged in sequence, with the outermost layer being an inorganic layer; the organic layer is prepared by curing the above-mentioned photocurable low-dielectric ink for encapsulation by ultraviolet light irradiation.

[0048] Specifically, the thickness of the inorganic layer is 5 nm to 500 nm; the thickness of the organic layer is 0.1 μm to 100 μm.

[0049] Compared with the prior art, the present invention has the following beneficial effects:

[0050] 1) The present invention discloses a photocurable low dielectric ink for encapsulation, which adopts a fluorine-containing bifunctional monomer, a monofunctional monomer containing a silyl ether structure, a bifunctional monomer containing a POSS structure, a photoinitiator and a photosensitizer. By introducing these bulky structures with poor regularity, the regularity of the polymer chain is reduced, the chain stacking density is reduced, thereby reducing the molar volume of the polymer, further reducing the dielectric constant of the polymer material, and by reasonably controlling the ratio of each component, a high-performance photocurable low dielectric ink (encapsulation glue) is obtained to meet the development requirements of increasingly complex OLED encapsulation.

[0051] 2) The invention discloses a photocurable low dielectric ink for encapsulation. By adding a monomer containing a silicon ether structure and using it in combination with a fluorine-containing monomer and a POSS-containing monomer, the dielectric constant of the organic layer can be effectively reduced, and the light transmittance and tensile strength can be improved. The large-volume bifunctional structure is usually a network structure with relatively large rigidity. The silicon ether structure monomer is a small-molecule single-functional structure. The monomer can form a linear structure, which effectively reduces the rigidity of the overall formula, and at the same time significantly reduces the viscosity of the system. In addition, the printing performance is also significantly improved.

[0052] 3) The present invention provides a photocurable low-dielectric ink for encapsulation, which has excellent inkjet printing performance and is cured by ultraviolet light to form an organic layer. The organic layer has a small curing shrinkage rate and a low dielectric constant, which can ensure the flatness of the encapsulation layer, is conducive to the subsequent deposition of inorganic materials, and has an excellent barrier effect on water vapor. DETAILED DESCRIPTION

[0053] Here, exemplary embodiments will be described in detail, and the embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Instead, they are only examples of devices consistent with some aspects of the present invention as detailed in the appended claims.

[0054] Preparation Example

[0055] This preparation example provides a compound for encapsulation film, specifically a fluorine-containing monofunctional monomer, the structural formula of the compound is formula (1), and the specific synthesis route and preparation process are as follows:

[0056]

[0057] First, 230.1 g of 3,5-bis(trifluoromethyl)phenol, 96.9 g of ethylene carbonate, and 6.9 g of potassium carbonate were added to a reaction bottle, and then 200 mL of DMF was added. The reaction was reacted at 110° C. and the reaction was monitored by TLC (thin layer chromatography) until the reaction of the raw materials was completed. After cooling to room temperature, the system was added to 1000 mL of water, and the precipitate was filtered, washed with water three times, and vacuum dried to obtain intermediate 1-A with a yield of 95.4%.

[0058] Further, 80g of sodium hydroxide and 500mL of water were placed in a 2500mL round-bottom flask, 273.1g of intermediate 1-A and 16.1g of tetrabutylammonium bromide were added under stirring, and 138.8g of epichlorohydrin was slowly added dropwise using a constant pressure dropping funnel under ice bath conditions, and the addition was completed within 2 hours. The reaction was allowed to proceed overnight at room temperature, and after the reaction was completed by monitoring by TLC (thin layer chromatography), 500mL of water was added, and the mixture was extracted with ethyl acetate (200mL×3), the organic phases were combined, dried over anhydrous sodium sulfate, and the solvent was removed by distillation under reduced pressure. The fluorine-containing monofunctional monomer was separated by column chromatography, and the yield was 91.4%.

[0059] Example 1

[0060] This embodiment provides a photocurable low dielectric ink for packaging, which includes, by weight percentage:

[0061] (A) fluorine-containing bifunctional monomer: 72% of (A1), wherein (A1) is a compound of formula (I-6);

[0062] (B) a monofunctional monomer containing a silyl ether structure: 20% of (B1), wherein (B1) is a compound of formula (ⅠⅠ-1);

[0063] (C) a bifunctional monomer containing a POSS structure: 4% of (C1), wherein (C1) is a compound of formula (III-1);

[0064] (D) Photoinitiator: 3% UV-1331 photoinitiator;

[0065] (E) Photosensitizer: 1% CPI-210S photosensitizer.

[0066] In a brown glass bottle, add 72% (A1), 20% (B1), 4% (C1), 3% (D) and 1% (E) by weight and shake at room temperature until mixed evenly to prepare a photocurable low dielectric ink for packaging.

[0067] In addition, this embodiment further provides an encapsulation layer, including inorganic layers and organic layers alternately arranged in sequence, and the outermost layer is an inorganic layer; the organic layer is made by curing the photocurable low-dielectric ink of this embodiment through ultraviolet light irradiation.

[0068] Example 2

[0069] This embodiment provides a photocurable low dielectric ink for packaging, which includes, by weight percentage:

[0070] (A) fluorine-containing bifunctional monomer: 60% of (A1), wherein (A1) is a compound of formula (I-6);

[0071] (B) a monofunctional monomer containing a silyl ether structure: 30% of (B1), wherein (B1) is a compound of formula (ⅠⅠ-1);

[0072] (C) a bifunctional monomer containing a POSS structure: 1% (C1) + 4% (C2), wherein (C1) is a compound of formula (III-1), and (C2) is a compound of formula (III-2);

[0073] (D) Photoinitiator: 4% UV-1331 photoinitiator;

[0074] (E) Photosensitizer: 1% CPI-210S photosensitizer.

[0075] In a brown glass bottle, add 60% (A1), 30% (B1), 1% (C1), 4% (C2), 4% (D) and 1% (E) by weight and shake at room temperature until mixed evenly to prepare a photocurable low-dielectric ink for packaging.

[0076] In addition, this embodiment further provides an encapsulation layer, including inorganic layers and organic layers alternately arranged in sequence, and the outermost layer is an inorganic layer; the organic layer is made by curing the photocurable low-dielectric ink of this embodiment through ultraviolet light irradiation.

[0077] Example 3

[0078] This embodiment provides a photocurable low dielectric ink for packaging, which includes, by weight percentage:

[0079] (A) fluorine-containing bifunctional monomer: 85% of (A1), wherein (A1) is a compound of formula (I-6);

[0080] (B) a monofunctional monomer containing a silyl ether structure: 5% of (B1) + 5% of (B2), wherein (B1) is a compound of formula (ⅠⅠ-1), and (B2) is a compound of formula (ⅠⅠ-2);

[0081] (C) a bifunctional monomer containing a POSS structure: 1% (C1) + 2% (C2), wherein (C1) is a compound of formula (III-1), and (C2) is a compound of formula (III-2);

[0082] (D) Photoinitiator: 1% UV-1331 photoinitiator;

[0083] (E) Photosensitizer: 1% CPI-210S photosensitizer.

[0084] In a brown glass bottle, add 85% (A1), 5% (B1), 5% (B2), 1% (C1), 2% (C2), 1% (D) and 1% (E) by weight and shake at room temperature until mixed evenly to prepare a photocurable low dielectric ink for packaging.

[0085] In addition, this embodiment further provides an encapsulation layer, including inorganic layers and organic layers alternately arranged in sequence, and the outermost layer is an inorganic layer; the organic layer is made by curing the photocurable low-dielectric ink of this embodiment through ultraviolet light irradiation.

[0086] Example 4

[0087] This embodiment provides a photocurable low dielectric ink for packaging, which includes, by weight percentage:

[0088] (A) fluorine-containing bifunctional monomer: 72% of (A1), wherein (A1) is a compound of formula (I-6);

[0089] (B) a monofunctional monomer containing a silyl ether structure: 20% of (B2), wherein (B2) is a compound of formula (ⅠⅠ-2);

[0090] (C) a bifunctional monomer containing a POSS structure: 1% of (C2), wherein (C2) is a compound of formula (III-2);

[0091] (D) Photoinitiator: 5% UV-1331 photoinitiator;

[0092] (E) Photosensitizer: 2% CPI-210S photosensitizer.

[0093] In a brown glass bottle, add 72% (A1), 20% (B2), 1% (C2), 5% (D) and 2% (E) by weight and shake at room temperature until mixed evenly to prepare a photocurable low-dielectric ink for packaging.

[0094] In addition, this embodiment further provides an encapsulation layer, including inorganic layers and organic layers alternately arranged in sequence, and the outermost layer is an inorganic layer; the organic layer is made by curing the photocurable low-dielectric ink of this embodiment through ultraviolet light irradiation.

[0095] Comparative Example 1

[0096] This comparative example provides a photocurable low dielectric ink for packaging, which comprises, by weight percentage:

[0097] (B) a monofunctional monomer containing a silyl ether structure: 80% of (B1), wherein (B1) is a compound of formula (ⅠⅠ-1);

[0098] (C) a bifunctional monomer containing a POSS structure: 16% of (C1), wherein (C1) is a compound of formula (III-1);

[0099] (D) Photoinitiator: 3% UV-1331 photoinitiator;

[0100] (E) Photosensitizer: 1% CPI-210S photosensitizer.

[0101] In a brown glass bottle, add 80% (B1), 16% (C1), 3% (D) and 1% (E) by weight and shake at room temperature until mixed evenly, thereby preparing a photocurable low-dielectric ink for packaging.

[0102] In addition, this comparative example also provides an encapsulation layer, including inorganic layers and organic layers alternately arranged in sequence, and the outermost layer is an inorganic layer; the organic layer is prepared by curing the photocurable low-dielectric ink of this comparative example through ultraviolet light irradiation.

[0103] Comparative Example 2

[0104] This comparative example provides a photocurable low dielectric ink for packaging, which comprises, by weight percentage:

[0105] (A) fluorine-containing bifunctional monomer: 90% of (A1), wherein (A1) is a compound of formula (I-6);

[0106] (C) a bifunctional monomer containing a POSS structure: 5% of (C1), wherein (C1) is a compound of formula (III-1);

[0107] (D) Photoinitiator: 3% UV-1331 photoinitiator;

[0108] (E) Photosensitizer: 1% CPI-210S photosensitizer.

[0109] In a brown glass bottle, add 90% (A1), 5% (C1), 3% (D) and 1% (E) by weight and shake at room temperature until mixed evenly, thereby preparing a photocurable low-dielectric ink for packaging.

[0110] In addition, this comparative example also provides an encapsulation layer, including inorganic layers and organic layers alternately arranged in sequence, and the outermost layer is an inorganic layer; the organic layer is prepared by curing the photocurable low-dielectric ink of this comparative example through ultraviolet light irradiation.

[0111] Comparative Example 3

[0112] This comparative example provides a photocurable low dielectric ink for packaging, which comprises, by weight percentage:

[0113] (A) fluorine-containing bifunctional monomer: 72% of (A1), wherein (A1) is a compound of formula (I-6);

[0114] (B) a monofunctional monomer containing a silyl ether structure: 20% of (B1), wherein (B1) is a compound of formula (ⅠⅠ-1);

[0115] (D) Photoinitiator: 6% UV-1331 photoinitiator;

[0116] (E) Photosensitizer: 2% CPI-210S photosensitizer.

[0117] In a brown glass bottle, add 72% (A1), 20% (B1), 6% (D) and 2% (E) by weight and shake at room temperature until mixed evenly, thereby preparing a photocurable low-dielectric ink for packaging.

[0118] In addition, this comparative example also provides an encapsulation layer, including inorganic layers and organic layers alternately arranged in sequence, and the outermost layer is an inorganic layer; the organic layer is prepared by curing the photocurable low-dielectric ink of this comparative example through ultraviolet light irradiation.

[0119] Comparative Example 4

[0120] This comparative example provides a photocurable low dielectric ink for packaging, which comprises, by weight percentage:

[0121] (A) fluorine-containing bifunctional monomer: 72% of (A2), wherein (A2) is the compound of the above-mentioned preparation example, and its structure is shown in formula (1);

[0122] (B) a monofunctional monomer containing a silyl ether structure: 20% of (B1), wherein (B1) is a compound of formula (ⅠⅠ-1);

[0123] (C) a bifunctional monomer containing a POSS structure: 4% of (C1), wherein (C1) is a compound of formula (III-1);

[0124] (D) Photoinitiator: 3% UV-1331 photoinitiator;

[0125] (E) Photosensitizer: 1% CPI-210S photosensitizer.

[0126] In a brown glass bottle, add 72% (A2), 20% (B1), 4% (C1), 3% (D) and 1% (E) by weight and shake at room temperature until mixed evenly to prepare a photocurable low dielectric ink for packaging.

[0127] In addition, this comparative example also provides an encapsulation layer, including inorganic layers and organic layers alternately arranged in sequence, and the outermost layer is an inorganic layer; the organic layer is prepared by curing the photocurable low-dielectric ink of this comparative example through ultraviolet light irradiation.

[0128] Furthermore, the organic layers obtained in Examples 1 to 4 and Comparative Examples 1 to 4 were tested as follows:

[0129] (1) Dielectric constant: The organic layer was made into a disc with a diameter of 20 mm and a thickness of 8 μm. The dielectric constant was tested using an Agilent 4294A precision impedance analyzer at a test frequency of 10 GHz.

[0130] (2) Tensile strength: Based on GB / T 1040-92 “General test methods for mechanical properties of plastics (tensile)”; test conditions: tensile speed is 1 mm / min, each group of specimens has at least 5, and the test results are averaged.

[0131] (3) Light transmittance: The light transmittance of the organic layer in the visible light range of 400 nm to 800 nm was measured by an ultraviolet-visible spectrophotometer (U-3900 Hitachi).

[0132] (4) Dynamic bending test: The short sides of the 10 mm × 120 mm organic layer were fixed with tape, and the organic layer was installed on a tension-free U-shaped folding tester (instrument name DLDMLH-FS, manufactured by Yuasa System Co., Ltd.). The outer diameter (Φ) of the bending part of the testing machine was set to 4 mm, and the radius (R) was set to 2 mm. The organic layer was then folded in half and subjected to a 180° dynamic bending test 200,000 times to check whether there were ruptures or cracks in the bending part. If there were no ruptures or cracks in the bending part, it was evaluated as (○). If there were ruptures or cracks in the bending part, it was evaluated as (×).

[0133] (5) Printing performance: Print continuously for 100 hours on an inkjet printer and observe whether pore blockage occurs using ink droplets. If no pore blockage occurs, it is indicated by "△", and if pore blockage occurs, it is indicated by "▲".

[0134] The results of the above tests are shown in Table 1:

[0135] Table 1 Test results of organic layer of Examples 1 to 4 and Comparative Examples 1 to 4

[0136]

[0137]

[0138] It can be seen from Table 1 that the photocurable low dielectric ink of the present invention has excellent dielectric properties, and the prepared encapsulation layer has high light transmittance, high flatness, high uniformity, high tensile strength, and small curing shrinkage.

[0139] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention.

[0140] It should be understood that the present invention is not limited to what has been described above and that various modifications and changes may be made without departing from its scope. The scope of the present invention is limited only by the appended claims.

Claims

1. A photocurable low dielectric ink for packaging, characterized in that: Includes the following components: (A) a fluorinated bifunctional monomer; (B) a monofunctional monomer containing a silyl ether structure; (C) bifunctional monomers containing polysilsesquioxane (POSS) structure; (D) a photoinitiator; (E) photosensitizer; The photocurable low dielectric ink comprises, by weight percentage, 60% to 85% of a fluorine-containing bifunctional monomer, 10% to 30% of a monofunctional monomer containing a silyl ether structure, 1% to 5% of a bifunctional monomer containing a POSS structure, 0.1% to 6% of a photoinitiator and 0.1% to 5% of a photosensitizer.

2. The photocurable low dielectric ink for packaging according to claim 1, characterized in that: The structural formula of the fluorine-containing bifunctional monomer is shown in the following formula (I): In formula (I), X1 and X2 are each independently any one of a single bond, O, a substituted or unsubstituted C1 to C10 alkylene group, and a substituted or unsubstituted C1 to C10 alkylene ether group; Y1 and Y2 are each independently an epoxy group, and the epoxy group includes any one of monocyclic epoxy, polycyclic epoxy, and styrene epoxy.

3. The photocurable low dielectric ink for packaging according to claim 2, characterized in that: The structure of the epoxy group is any one of formula (I-1) to formula (I-5): In formula (I-1) to formula (I-5), * is a linking site; In formula (Ⅰ-2), R1 is any one of H, C1 to C6 alkyl, C1 to C6 fluoroalkyl, alkenyl, and phenyl; R2 is any one of a single bond and C1 to C6 alkylene ether.

4. The photocurable low dielectric ink for packaging according to claim 3, characterized in that: The structural formula of the monofunctional monomer containing a silicon ether structure is shown in the following formula (ⅠⅠ): In formula (ⅠⅠ), X3 is any one of a single bond, O, a substituted or unsubstituted C1 to C10 alkylene group, and a substituted or unsubstituted C1 to C10 alkylene ether group; the structure of Y3 is any one of formulas (Ⅰ-1) to (Ⅰ-5).

5. The photocurable low dielectric ink for packaging according to claim 4, characterized in that: The structure of the monofunctional monomer containing a silicon ether structure is at least one of formula (ⅠⅠ-1) and formula (ⅠⅠ-2):

6. The photocurable low dielectric ink for packaging according to claim 3, characterized in that: The general formula of the bifunctional monomer containing POSS structure is shown in the following formula (III): (MSiO1.5)n(ⅠⅠⅠ) In the formula (ⅠⅠⅠ), M represents -M1M2Y4, and n is 6, 8, 10 or 12; M1 and M2 are each independently any one of a substituted or unsubstituted C1 to C10 alkylene group and a substituted or unsubstituted C1 to C10 alkylene ether group; the structure of Y4 is any one of formula (I-1) to formula (I-5).

7. The photocurable low dielectric ink for packaging according to claim 6, characterized in that: The structure of the bifunctional monomer containing the POSS structure is at least one of formula (III-1) and formula (III-2):

8. The photocurable low dielectric ink for packaging according to claim 1, characterized in that: The photoinitiator is one or more of a diazonium salt, an aromatic ferrocenium salt, and an aromatic sulfonium salt; The photosensitizer is one or more of benzophenone, thioxanthone, xanthone, anthracene, pyrene, thiazine and azathioxanthene.

9. A method for preparing a photocurable low dielectric ink for packaging as claimed in any one of claims 1 to 8, characterized in that: The following steps are involved: According to weight percentage, 60% to 85% of a fluorine-containing bifunctional monomer, 10% to 30% of a monofunctional monomer containing a silyl ether structure, 1% to 5% of a bifunctional monomer containing a POSS structure, 0.1% to 6% of a photoinitiator and 0.1% to 5% of a photosensitizer are first added into a glass container, and then shaken until the mixture is uniformly mixed, thereby preparing a photocurable low dielectric ink for packaging.

10. A packaging layer, characterized in that: It comprises inorganic layers and organic layers which are alternately arranged in sequence, and the outermost layer is the inorganic layer; the organic layer is prepared by curing the photocurable low-dielectric ink for encapsulation as claimed in claim 9 through ultraviolet light irradiation.

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