Heat exchange plate fin structure, heat exchange device and air conditioner

Abstract

The invention provides a heat exchange plate-fin structure, a heat exchange device and an air conditioner, and the heat exchange plate-fin structure comprises a flow path layer which is provided with a first input hole, a first output hole and a plurality of first circulation grooves, and the two ends of the first circulation grooves communicate with the first input hole and the first output hole correspondingly; the plate-shaped layer is in diffusion joint with the flow path layer, and the plate-shaped layer covers the first circulation groove so that a first medium flow path can be defined by the plate-shaped layer and the flow path layer. According to the heat exchange plate-fin structure, the media to be subjected to heat exchange can be distributed into the first medium flow paths, the heat exchange area utilization rate of the heat exchange plate-fin structure is increased, the heat exchange efficiency of the heat exchange plate-fin structure is improved, the compactness of the heat exchange plate-fin structure is guaranteed while the heat exchange performance of the heat exchange plate-fin structure is improved, and the heat exchange efficiency of the heat exchange plate-fin structure is improved. The miniaturization and light weight level of the heat exchange plate-fin structure is improved, the forming precision of the first medium flow path can be guaranteed, the possibility that the first medium flow path is blocked is reduced, and the production yield of the heat exchange plate-fin structure is increased.

Description

Technical Field

[0001] The present invention relates to the technical field of air conditioning equipment, and in particular to a heat exchange plate fin structure, a heat exchange device and an air conditioner. Background Art

[0002] In the related art, air-conditioning equipment is usually equipped with a heat exchanger. When the refrigerant flows through the heat exchanger, the heat exchanger is used to improve the heat exchange efficiency between the refrigerant and the external environment, thereby ensuring the efficient heating or cooling process. Therefore, the heat exchange performance of the heat exchanger often directly affects the overall performance of the air-conditioning equipment.

[0003] Therefore, how to improve the heat transfer performance of the heat exchanger has become a problem that needs to be solved urgently. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0005] To this end, a first aspect of the present invention provides a heat exchange plate-fin structure.

[0006] A second aspect of the present invention provides a heat exchange device.

[0007] A third aspect of the present invention provides an air conditioner.

[0008] In view of this, according to a first aspect of an embodiment of the present application, a heat exchange plate-fin structure is proposed, comprising:

[0009] A flow path layer is formed with a first input hole, a first output hole and a plurality of first flow grooves, wherein two ends of the first flow grooves are respectively connected to the first input hole and the first output hole;

[0010] The plate-shaped layer is diffusion-bonded to the flow path layer, and the plate-shaped layer covers the first flow groove to form a first medium flow path with the flow path layer.

[0011] In a feasible implementation manner, the heat exchange plate-fin structure further includes:

[0012] A current collecting member is formed with a current collecting flow path, the plate-shaped layer is formed with a second input hole and a second output hole, the second input hole and the second output hole are respectively connected to the first input hole and the first output hole, and each of the second input hole and the second output hole is penetrated by a current collecting member;

[0013] The collecting flow path is connected to the first medium flow path.

[0014] In a possible embodiment, the current collecting member is diffusion-bonded to the plate-shaped layer.

[0015] In a feasible implementation, step structures are formed at both ends of the current collecting member along the conducting direction of the current collecting path, wherein one step structure abuts against the plate-shaped layer, and the distance from the other step structure to the plate-shaped layer is greater than or equal to 0.1 mm.

[0016] In a feasible implementation manner, the plate-shaped layer is formed with a plurality of second flow grooves, and each second flow groove is correspondingly connected to a first flow groove to form a first medium flow path.

[0017] In a feasible embodiment, the first input hole and the first output hole are arranged at intervals along the first direction of the flow path layer, and the plurality of first flow grooves are arranged at intervals along the second direction of the flow path layer, and the length of the flow path layer in the first direction is smaller than the length of the flow path layer in the second direction.

[0018] In a feasible implementation manner, the first flow groove is formed by a stamping process; or

[0019] The first flow groove is formed by a milling process; or

[0020] The first flow groove is formed by laser processing.

[0021] In a feasible embodiment, the plate-shaped layer is made of aluminum material or stainless steel material; and / or

[0022] The flow path layer is made of aluminum material or stainless steel material.

[0023] According to a second aspect of an embodiment of the present application, a heat exchange device is provided, comprising:

[0024] A plurality of heat exchange plate-fin structures as provided in any one of the first aspects above, wherein the plurality of heat exchange plate-fin structures are arranged in sequence along a conducting direction of the first input hole;

[0025] Among them, in two adjacent heat exchange plate-fin structures, a gap is formed between the plate-shaped layer of one and the flow path layer of the other, so that a second medium flow path is formed between the two adjacent heat exchange plate-fin structures.

[0026] In a feasible embodiment, when the heat exchange plate-fin structure includes a collecting member, in two adjacent heat exchange plate-fin structures, the first input hole of one is connected to the second input hole of the other through a collecting flow path of a collecting member, and the first output hole of one is connected to the second output hole of the other through a collecting flow path of a collecting member.

[0027] According to a third aspect of an embodiment of the present application, an air conditioner is provided, comprising:

[0028] A heat exchange device as proposed in any one of the second aspects above.

[0029] Compared with the prior art, the present invention includes at least the following beneficial effects: the heat exchange plate-fin structure provided in the embodiment of the present application includes a flow path layer and a plate-shaped layer, wherein the flow path layer is formed with a plurality of first flow grooves, the plate-shaped layer is arranged on the flow path layer and covers the plurality of aforementioned first flow grooves, so that the plate-shaped layer and the flow path layer can enclose a plurality of first medium flow paths to provide a flow path for the medium to be exchanged with heat during use; the flow path layer is also formed with a first input hole and a first output hole, one end of the aforementioned first flow groove is connected to the aforementioned first input hole, and the other end is connected to the first output hole, so that the medium to be exchanged with heat can flow into the heat exchange plate-fin structure through the aforementioned first input hole, and further discharge the heat exchange plate-fin structure through the aforementioned first output hole after flowing through the first medium flow path. Therefore, based on the above-mentioned settings, the heat exchange plate-fin structure provided in the embodiment of the present application can distribute the heat exchange medium that is relatively concentrated when input to each first medium flow path, thereby improving the dispersion of the heat exchange medium. When there is heat exchange medium in the first medium flow path, the heat exchange medium in each first medium flow path can absorb heat from the external environment or release heat to the external environment through the plate layer and the flow path layer, which is beneficial to improving the heat exchange area utilization rate of the heat exchange plate-fin structure, improving the heat exchange efficiency of the heat exchange plate-fin structure, and ensuring the compactness of the heat exchange plate-fin structure while improving the heat exchange performance of the heat exchange plate-fin structure, improving the miniaturization and lightweight level of the heat exchange plate-fin structure, and reducing the volume and mass of the heat exchange device and the air conditioner in actual applications. After heat exchange, the heat exchange medium in each first medium flow path can be further output in a concentrated manner through the first output hole, which can provide a guarantee for the convenience of medium output of the heat exchange plate-fin structure. At the same time, the plate layer and the flow path layer are connected by diffusion bonding. On the one hand, the tightness of the connection between the plate layer and the flow path layer can be ensured, gaps between the plate layer and the flow path layer can be avoided, and the possibility of leakage of the medium to be exchanged in the first medium flow path can be reduced; on the other hand, the connection strength between the plate layer and the flow path layer can be ensured, thereby improving the adaptability of the heat exchange plate-fin structure to high-pressure conditions, which is conducive to broadening the application scope of the heat exchange plate-fin structure and providing further guarantee for the structural reliability of the heat exchange plate-fin structure; on the other hand, the plastic deformation of the plate layer and the flow path layer during connection can be reduced, and the possibility of large-scale deformation of the first flow groove during the connection process can be reduced, which is conducive to ensuring the molding accuracy of the first medium flow path, and can reduce the possibility of blockage of the first medium flow path during the production of the heat exchange plate-fin structure, thereby improving the production yield of the heat exchange plate-fin structure and ensuring the heat exchange performance of the heat exchange plate-fin structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the exemplary embodiments below. The accompanying drawings are only for the purpose of illustrating exemplary embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0031] Figure 1 A schematic structural diagram of a heat exchange plate-fin structure of an embodiment provided in the present application;

[0032] Figure 2 for Figure 1 A schematic cross-sectional view of the heat exchange plate-fin structure along the AA direction shown in FIG.

[0033] Figure 3 for Figure 1 A schematic cross-sectional view of the heat exchange plate-fin structure along the BB direction shown in FIG.

[0034] Figure 4 for Figure 1 Another schematic cross-sectional view of the heat exchange plate-fin structure along the BB direction shown in FIG.

[0035] Figure 5 A schematic structural diagram of a flow path layer of an embodiment provided in the present application;

[0036] Figure 6 A schematic structural diagram of a plate-shaped layer of an embodiment provided in the present application;

[0037] Figure 7 A schematic structural diagram of a plate-shaped layer of another embodiment provided in the present application;

[0038] Figure 8 A schematic structural diagram of a current collecting member of an embodiment provided in the present application from a first viewing angle;

[0039] Fig. 9 A schematic structural diagram of a current collecting member of an embodiment provided in the present application from a second viewing angle;

[0040] Fig.10 A schematic structural diagram of a heat exchange device according to an embodiment of the present application.

[0041] in, Figures 1 to 10 The corresponding relationship between the reference numerals and the component names is as follows:

[0042] 10 heat exchange plate-fin structure; 20 first end plate; 30 second end plate; 40 medium input pipe; 50 medium output pipe;

[0043] 100 flow path layers; 200 plate layers; 300 current collectors;

[0044] 310 step structure;

[0045] 11 first medium flow path; 12 second medium flow path;

[0046] 101 first input hole; 102 first output hole; 103 first flow slot;

[0047] 201 second input hole; 202 second output hole; 203 second flow slot;

[0048] 301 Collector flow path. DETAILED DESCRIPTION

[0049] The exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present application and to fully convey the scope of the present application to those skilled in the art.

[0050] like Figures 1 to 10 As shown, according to the first aspect of an embodiment of the present application, a heat exchange plate-fin structure 10 is proposed, comprising: a flow path layer 100, formed with a first input hole 101, a first output hole 102 and a plurality of first flow grooves 103, wherein both ends of the first flow grooves 103 are respectively connected to the first input hole 101 and the first output hole 102; a plate-shaped layer 200, diffusely bonded to the flow path layer 100, the plate-shaped layer 200 covers the first flow grooves 103, so as to enclose a first medium flow path 11 with the flow path layer 100.

[0051] The heat exchange plate-fin structure 10 provided in the embodiment of the present application includes a flow path layer 100 and a plate-shaped layer 200, wherein the flow path layer 100 is formed with a plurality of first flow grooves 103, and the plate-shaped layer 200 is arranged on the flow path layer 100 and covers the plurality of the aforementioned first flow grooves 103, so that the plate-shaped layer 200 and the flow path layer 100 can enclose a plurality of first medium flow paths 11 to provide a flow path for the medium to be heat exchanged during use; the flow path layer 100 is also formed with a first input hole 101 and a first output hole 102, one end of the aforementioned first flow groove 103 is connected to the aforementioned first input hole 101, and the other end is connected to the first output hole 102, so that the medium to be heat exchanged can flow into the heat exchange plate-fin structure 10 through the aforementioned first input hole 101, and further discharge the heat exchange plate-fin structure 10 through the aforementioned first output hole 102 after flowing through the first medium flow path 11.

[0052] Therefore, based on the above-mentioned settings, the heat exchange plate-fin structure 10 provided in the embodiment of the present application can distribute the heat exchange medium that is relatively concentrated when input to each first medium flow path 11, thereby improving the dispersion of the heat exchange medium. When there is heat exchange medium in the first medium flow path 11, the heat exchange medium in each first medium flow path 11 can absorb heat from the external environment or release heat to the external environment through the plate-shaped layer 200 and the flow path layer 100, thereby helping to improve the heat exchange area utilization rate of the heat exchange plate-fin structure 10, and improving the heat exchange efficiency of the heat exchange plate-fin structure 10. It is beneficial to ensure the compactness of the heat exchange plate-fin structure 10 while improving the heat exchange performance of the heat exchange plate-fin structure 10, and improve the miniaturization and lightweight level of the heat exchange plate-fin structure 10, which is beneficial to reducing the volume and mass of the heat exchange device and the air conditioner in practical applications. After heat exchange, the heat exchange medium in each first medium flow path 11 can be further output in a concentrated manner through the first output hole 102, which can provide a guarantee for the convenience of medium output of the heat exchange plate-fin structure 10.

[0053] The plate-shaped layer 200 and the flow path layer 100 are connected by diffusion bonding. On the one hand, the tightness of the connection between the plate-shaped layer 200 and the flow path layer 100 can be ensured, and a gap between the plate-shaped layer 200 and the flow path layer 100 can be avoided, thereby reducing the possibility of leakage of the medium to be exchanged in the first medium flow path 11; on the other hand, the connection strength between the plate-shaped layer 200 and the flow path layer 100 can be ensured, thereby improving the adaptability of the heat exchange plate-fin structure 10 to high-pressure working conditions, which is conducive to broadening the application scope of the heat exchange plate-fin structure 10 and providing further guarantee for the structural reliability of the heat exchange plate-fin structure 10; on the other hand, the plastic deformation of the plate-shaped layer 200 and the flow path layer 100 during connection can be reduced, and the possibility of a large deformation of the first flow groove 103 during the connection process can be reduced, which is conducive to ensuring the molding accuracy of the first medium flow path 11, and can reduce the possibility of blockage of the first medium flow path 11 during the production of the heat exchange plate-fin structure 10, thereby improving the production yield of the heat exchange plate-fin structure 10, thereby ensuring the heat exchange performance of the heat exchange plate-fin structure 10.

[0054] It is understandable that if Figures 1 to 7 As shown, the flow path layer 100 and the plate-shaped layer 200 can both be sheet-shaped structures, which is beneficial to reduce the overall volume and mass of the heat exchange plate-fin structure 10 while ensuring the heat exchange area of ​​the heat exchange plate-fin structure 10, thereby improving the compactness of the heat exchange plate-fin structure 10. For example, Figures 1 to 7 As shown, the surfaces of the flow path layer 100 and the plate-shaped layer 200 may both have a high flatness, which further facilitates the connection of the flow path layer 100 and the plate-shaped layer 200 by diffusion bonding and reduces the possibility of stress irregularity during diffusion bonding.

[0055] It is understandable that if Figure 2 and Figure 5 As shown, the flow path layer 100 can be provided with the aforementioned first input hole 101 and the first output hole 102 along its thickness direction, and the first input hole 101 and the first output hole 102 are arranged at intervals. The aforementioned multiple first flow grooves 103 are opened in the flow path layer 100 and are located between the first input hole 101 and the first output hole 102, so as to establish a connection relationship between the first input hole 101, the first output hole 102 and the first flow grooves 103, and ensure that the first flow grooves 103 can have a relatively high opening length, so as to further ensure the heat exchange effect of the heat exchange medium when flowing through the first medium flow path 11.

[0056] It is understandable that if Figures 3 to 5 As shown, the first flow groove 103 is an open groove, that is, a notch of the first flow groove 103 can be formed on one side of the flow path layer 100, which is conducive to reducing the difficulty of forming the first flow groove 103. Accordingly, the aforementioned plate-shaped layer 200 covers the first flow groove 103, that is, the plate-shaped layer 200 is arranged on the side of the notch of the flow path layer 100 formed with the first flow groove 103 and covers the aforementioned notch, so that the plate-shaped layer 200 and the flow path layer 100 can enclose the aforementioned first medium flow path 11 based on the groove-shaped space of the first flow groove 103.

[0057] It is understandable that if Figure 3 and Figure 4 As shown, the cross-sectional shape of the first circulation groove 103 can be set according to actual needs. For example, the cross-sectional shape of the first circulation groove 103 can be a triangle, a quadrilateral, an arcuate shape, etc., which is not limited too much here.

[0058] It can be understood that the aforementioned heat exchange medium can be but is not limited to refrigerant.

[0059] It should be noted that when actually performing diffusion bonding between the flow path layer 100 and the plate-shaped layer 200, the flow path layer 100 and the plate-shaped layer 200 can be pressurized and bonded at a temperature lower than the melting point of the plate-shaped layer 200 and the flow path layer 100 to avoid melting and deformation of the flow path layer 100 and the plate-shaped layer 200, thereby ensuring the molding accuracy of the heat exchange plate fin structure 10.

[0060] It should be noted that the heat exchange plate-fin structure 10 provided in the embodiment of the present application can be used as a component of a heat exchange device or an air conditioner in practical applications. During use, the installation position of the heat exchange plate-fin structure 10 can be adjusted so that the fluid medium in the external environment can flow through the heat exchange plate-fin structure 10 along the spacing direction of the multiple first medium flow paths 11, so that the aforementioned fluid medium can pass through the outside of each first medium flow path 11 in sequence when flowing through the heat exchange plate-fin structure 10, and then exchange heat with the medium to be exchanged in the first medium flow path 11. It can be understood that the aforementioned fluid medium can be but is not limited to air. Taking the aforementioned heat exchange plate-fin structure 10 as an example when it is applied to an air conditioner, the spacing direction of the aforementioned multiple first medium flow paths 11 can be used to be arranged along the air supply direction of the air supply device of the air conditioner, so that the airflow output by the aforementioned air supply device can pass through the outside of each first medium flow path 11 in sequence.

[0061] like Fig.10 As shown, taking the heat exchange plate-fin structure 10 as a component of the heat exchange device as an example, multiple aforementioned heat exchange plate-fin structures 10 can be stacked and arranged, and the first input holes 101 of each heat exchange plate-fin structure 10 are sequentially connected, and the first output holes 102 of each heat exchange plate-fin structure 10 are sequentially connected, so that each first heat exchange plate-fin structure 10 forms a parallel relationship, and then the medium to be heat exchanged can be distributed to the corresponding heat exchange plate-fin structure 10 through each first input hole 101, and flow through the first medium channel of each heat exchange plate-fin structure 10 for heat exchange, and the medium to be heat exchanged can be further output in a centralized manner through each first output hole 102 after heat exchange. Among the multiple heat exchange plate-fin structures 10, a gap can be formed between two adjacent heat exchange plate-fin structures 10, and the aforementioned gap can be used as a second medium flow path 12, and the second medium flow path 12 can be used for the circulation of fluid medium in the external environment, so as to facilitate heat exchange between the medium to be heat exchanged and the aforementioned fluid medium. It can be understood that the aforementioned fluid medium can be but not limited to air.

[0062] For example, when the heat exchange plate-fin structure 10 is used as a component of a heat exchange device, the first input hole 101 and the first output hole 102 can be arranged along the direction of gravity, so that the first medium flow path 11 can maintain a high verticality. When the aforementioned heat exchange device is used as an evaporator, the condensed water generated on the surface of the heat exchange plate-fin structure 10 can drip under the action of gravity, thereby improving the drainage performance of the heat exchange device and preventing the condensed water from occupying a large area of ​​the second medium flow path 12, which is beneficial to reducing the resistance of the aforementioned fluid medium when flowing through the second medium flow path 12, thereby further exerting the heat exchange performance of the heat exchange device.

[0063] like Figure 1 , Figure 2 , Figure 8 and Fig. 9As shown, in some examples, the heat exchange plate-fin structure 10 also includes: a collecting piece 300, which is formed with a collecting flow path 301, and the plate-shaped layer 200 is formed with a second input hole 201 and a second output hole 202, the second input hole 201 and the second output hole 202 are respectively connected to the first input hole 101 and the first output hole 102, and the second input hole 201 and the second output hole 202 are each penetrated by a collecting piece 300; wherein, the collecting flow path 301 is connected to the first medium flow path 11.

[0064] In this technical solution, the heat exchange plate-fin structure 10 may further include a current collecting member 300, and the second input hole 201 and the second output hole 202 of the plate-shaped layer 200 may be respectively provided with one of the current collecting members 300, the second input hole 201 is connected to the first input hole 101, and the second output hole 202 is connected to the first output hole 102, and the current collecting flow path 301 of the current collecting member 300 may be connected to the first medium flow path 11, for example, the current collecting flow path 301 of the current collecting member 300 located at the second input hole 201 may be connected to one end of the first medium flow path 11 through the second input hole 201 and the first input hole 101 The collecting flow path 301 of the collecting piece 300 located at the second output hole 202 can be connected to the other end of the first medium flow path 11 through the second output hole 202 and the first output hole 102, so that the heat exchange plate-fin structure 10 can, based on the above-mentioned setting, on the one hand, carry out centralized input and output of the medium to be exchanged through the above-mentioned collecting piece 300 during use, thereby improving the convenience of medium circulation of the heat exchange plate-fin structure 10; on the other hand, when the heat exchange plate-fin structure 10 is used as a component of a heat exchange device, it is convenient to connect the multiple heat exchange plate-fin structures 10 included in the heat exchange device through the collecting piece 300, which is beneficial to improve the structural compactness of the heat exchange device.

[0065] For example, when the heat exchange plate-fin structure 10 is used as a component of a heat exchange device, the heat exchange device may include a plurality of the aforementioned heat exchange plate-fin structures 10, and the plurality of the aforementioned heat exchange plate-fin structures 10 are stacked. In two adjacent heat exchange plate-fin structures 10, the second input hole 201 of one can be connected to the first input hole 101 of the other through the aforementioned collector 300, and the second output hole 202 of one can be connected to the first output hole 102 of the other through the aforementioned collector 300, that is, the second input hole 201 of each heat exchange plate-fin structure 10 can be connected to the first input hole 101 of the other through the aforementioned collector 300, and the second output hole 202 of one can be connected to the first output hole 102 of the other through the aforementioned collector 300. One end of the collecting piece 300 at the input hole 201 away from the second input hole 201 can be passed through the first input hole 101 of the adjacent heat exchange plate-fin structure 10, and one end of the collecting piece 300 at the second output hole 202 of each heat exchange plate-fin structure 10 away from the second output hole 202 can be passed through the first output hole 102 of the adjacent heat exchange plate-fin structure 10, thereby realizing the sequential connection of the first input holes 101 of each heat exchange plate-fin structure 10 and the sequential connection of the first output holes 102 of each heat exchange plate-fin structure 10.

[0066] In some examples, the current collector 300 is diffusion-bonded to the plate-shaped layer 200 .

[0067] In this technical solution, the current collecting part 300 and the plate-shaped layer 200 can be connected by diffusion bonding, so that on the one hand, the tightness of the connection between the plate-shaped layer 200 and the current collecting part 300 can be ensured, and a gap between the plate-shaped layer 200 and the current collecting part 300 can be avoided, thereby reducing the possibility of leakage of the heat exchange medium; on the other hand, the connection strength between the plate-shaped layer 200 and the current collecting part 300 can also be ensured, thereby improving the adaptability of the heat exchange plate-fin structure 10 to high-pressure working conditions, which is conducive to broadening the application scope of the heat exchange plate-fin structure 10 and providing further guarantee for the structural reliability of the heat exchange plate-fin structure 10.

[0068] It can be understood that when the heat exchange plate-fin structure 10 is used as a component of a heat exchange device, the end of the collecting piece 300 at the second input hole 201 of each heat exchange plate-fin structure 10 away from the second input hole 201 can be diffusely bonded to the flow path layer 100 of the adjacent heat exchange plate-fin structure 10, so that the second input hole 201 of one of the two adjacent heat exchange plate-fin structures 10 can be connected to the first input hole 101 of the other through the aforementioned collecting piece 300; and the end of the collecting piece 300 at the second output hole 202 of each heat exchange plate-fin structure 10 away from the second output hole 202 can be diffusely bonded to the flow path layer 100 of the adjacent heat exchange plate-fin structure 10, so that the second output hole 202 of one of the two adjacent heat exchange plate-fin structures 10 can be connected to the first output hole 102 of the other through the aforementioned collecting piece 300, thereby ensuring the connection reliability and tightness of the two adjacent heat exchange plate-fin structures 10 when the collecting piece 300 is used to connect the two adjacent heat exchange plate-fin structures 10.

[0069] like Figure 2 and Fig. 9 As shown, in some examples, step structures 310 are formed at both ends of the current collecting member 300 along the conducting direction of the current collecting path 301, wherein one step structure 310 abuts against the plate-shaped layer 200, and the distance L from the other step structure 310 to the plate-shaped layer 200 is greater than or equal to 0.1 mm.

[0070] In this technical solution, step structures 310 can be formed at both ends of the current collecting piece 300 along the conducting direction of the current collecting flow path 301, one of the step structures 310 can abut against the plate-shaped layer 200, and accordingly, the end of the current collecting piece 300 corresponding to the step structure 310 abutting against the plate-shaped layer 200 is passed through the second input hole 201 or the second output hole 202 of the aforementioned plate-shaped layer, and the distance L from the other step structure 310 to the aforementioned plate-shaped layer 200 is greater than or equal to 0.1 mm, so that when the end of the current collecting piece 300 away from the aforementioned plate-shaped layer 200 is used to connect other heat exchange plate-fin structures 10 or other devices, a certain interval can be formed between the aforementioned other heat exchange plate-fin structures 10 or other devices and the plate-shaped layer 200 where the current collecting piece 300 is located, thereby avoiding contact between the aforementioned plate-shaped layer 200 and other structures, which is beneficial to make the plate-shaped layer 200 more fully exposed to the external environment and improve the heat exchange performance of the heat exchange plate-fin structure 10.

[0071] In some feasible examples, when one step structure 310 abuts against the plate-shaped layer 200, the distance L from the other step structure 310 to the plate-shaped layer 200 is greater than or equal to 0.1 mm and less than or equal to 10 mm, thereby avoiding the length of the current collecting member 300 being too large, which is beneficial to ensuring the compactness of the heat exchange plate-fin structure 10.

[0072] like Figure 7 As shown, in some examples, the plate-shaped layer 200 is formed with a plurality of second flow slots 203 , and each second flow slot 203 is correspondingly connected to a first flow slot 103 to form a first medium flow path 11 .

[0073] In this technical solution, the plate-shaped layer 200 can be formed with a second flow groove 203, and the number of the second flow grooves 203 is multiple. When the plate-shaped layer 200 covers the aforementioned first flow groove 103, each second flow groove 203 corresponds to one of the aforementioned first flow grooves 103 and is interconnected to form the aforementioned first medium flow path 11, that is, the aforementioned first medium flow path 11 can include the groove space of the first flow groove 103 and the groove space of the second flow groove 203. Therefore, based on the aforementioned setting, when the parameters of the first medium flow path 11 are the same, the volume of the first flow groove 103 can be reduced, which is beneficial to reducing the processing difficulty of the flow path layer 100, and at the same time improving the structural consistency of the flow path layer 100 and the plate-shaped layer 200, which is beneficial to reducing the number of molds used in the processing of the heat exchange plate-fin structure 10, and is beneficial to further reducing the production cost of the heat exchange plate-fin structure 10.

[0074] It is understandable that if Figure 4 , Figure 5 and Figure 7As shown, the flow path layer 100 and the plate-shaped layer 200 can both be symmetrical structures, and the structure of the flow path layer 100 can be the same as that of the plate-shaped layer 200, thereby greatly reducing the number of components of different structures included in the heat exchange plate-fin structure 10, and further reducing the processing difficulty and manufacturing cost of the heat exchange plate-fin structure 10.

[0075] like Figure 5 As shown, in some examples, the first input hole 101 and the first output hole 102 are arranged at intervals along the first direction of the flow path layer 100, and the plurality of first flow grooves 103 are arranged at intervals along the second direction of the flow path layer 100, and the length of the flow path layer 100 in the first direction is less than the length of the flow path layer 100 in the second direction.

[0076] In this technical solution, the first input hole 101 and the first output hole 102 can be arranged at intervals along the direction of the larger size of the flow path layer 100, so as to facilitate increasing the opening length of the first circulation groove 103, so as to provide favorable conditions for increasing the heat exchange capacity of the medium to be heat exchanged. Accordingly, multiple first circulation grooves 103 can be arranged at intervals along the direction of the smaller size of the flow path layer 100, which is conducive to further improving the compactness of the heat exchange plate-fin structure 10, reducing the volume and mass of the heat exchange plate-fin structure 10, and achieving further improvement in the lightweight and miniaturization of the heat exchange plate-fin structure 10.

[0077] It should be noted that Figure 5 The X direction is used to schematically represent the second direction, and the Y direction is used to schematically represent the first direction. For example, when the flow path layer 100 is a rectangular sheet structure, the first direction may be the length direction of the rectangular sheet structure, and the second direction may be the width direction of the rectangular sheet structure.

[0078] In some examples, the first flow groove 103 is formed by a stamping process; or the first flow groove 103 is formed by a milling process; or the first flow groove 103 is formed by laser processing.

[0079] In this technical solution, the first flow groove 103 can be formed by a stamping process, which is conducive to ensuring the surface quality of the flow path layer 100 and the molding accuracy of the first flow groove 103. In addition, when the flow path layer 100 is a sheet structure, it is also convenient to form by a stamping process, and improve the material utilization rate when manufacturing the flow path layer 100. Alternatively, the first flow groove 103 can be formed by a milling process, so that when the structure of the first flow groove 103 is relatively complex, it is convenient to achieve high-precision molding of the first flow groove 103, which is conducive to ensuring the reliability of the first medium flow path 11. Alternatively, the first flow groove 103 can be formed by laser processing, which is conducive to improving the processing efficiency of the flow path layer 100, and when the size of the first flow groove 103 is small, it can also ensure good molding accuracy, which is convenient to further reduce the size of the first structure flow path, and provide further guarantee for improving the heat exchange efficiency of the heat exchange plate-fin structure 10.

[0080] It is understandable that the second flow groove 203 can also be formed by stamping, milling or laser processing.

[0081] In some examples, the plate-shaped layer 200 is made of an aluminum material or a stainless steel material; and / or the flow path layer 100 is made of an aluminum material or a stainless steel material.

[0082] In this technical solution, the plate-shaped layer 200 can be made of aluminum material or stainless steel material, which is beneficial to improve the thermal conductivity of the plate-shaped layer 200 and further improve the heat exchange performance of the heat exchange plate-fin structure 10.

[0083] Correspondingly, the flow path layer 100 can also be made of aluminum material or stainless steel material, which is beneficial to improve the thermal conductivity of the plate-shaped layer 200 and further improve the heat exchange performance of the heat exchange plate-fin structure 10.

[0084] like Fig.10 As shown, according to the second aspect of an embodiment of the present application, a heat exchange device is proposed, comprising: a plurality of heat exchange plate-fin structures 10 as proposed in any one of the first aspects above, the plurality of heat exchange plate-fin structures 10 being arranged in sequence along the conduction direction of the first input hole 101; wherein, in two adjacent heat exchange plate-fin structures 10, a gap is formed between the plate-shaped layer 200 of one and the flow path layer 100 of the other, so that a second medium flow path 12 is formed between the two adjacent heat exchange plate-fin structures 10.

[0085] The heat exchange device provided in the embodiment of the present application may include a plurality of the aforementioned heat exchange plate-fin structures 10. The plurality of aforementioned heat exchange plate-fin structures 10 may be arranged in sequence along the conduction direction of the first input hole 101, so that the plurality of heat exchange plate-fin structures 10 form a stacked state, thereby improving the structural compactness of the heat exchange device, and facilitating the distribution of the medium to be exchanged through each first input hole 101 to the corresponding first medium flow path 11, thereby improving the distribution dispersion of the medium to be exchanged, and allowing the medium to be exchanged to flow through the first medium channel of each heat exchange plate-fin structure 10 to exchange heat with the external environment, thereby improving the heat exchange efficiency. In two adjacent heat exchange plate-fin structures 10, a gap may be formed between the plate-shaped layer 200 of one and the flow path layer 100 of the other, and the aforementioned gap may be used as a second medium flow path 12, and the second medium flow path 12 may be used for the circulation of fluid medium in the external environment, so as to facilitate heat exchange between the medium to be exchanged and the aforementioned fluid medium.

[0086] It can be understood that the aforementioned heat exchange medium can be but is not limited to refrigerant; the aforementioned fluid medium can be but is not limited to air.

[0087] Exemplarily, the first input hole 101 and the first output hole 102 of each heat exchange plate-fin structure 10 are arranged along the direction of gravity, so that the first medium flow path 11 can maintain a high verticality. When the aforementioned heat exchange device is used as an evaporator, the condensed water generated on the surface of the heat exchange plate-fin structure 10 can drip under the action of gravity, thereby improving the drainage performance of the heat exchange device and preventing the condensed water from occupying a large area of ​​the second medium flow path 12, which is beneficial to reducing the resistance of the aforementioned fluid medium when flowing through the second medium flow path 12, thereby further exerting the heat exchange performance of the heat exchange device.

[0088] In some examples, when the heat exchange plate-fin structure 10 includes a current collecting member 300, in two adjacent heat exchange plate-fin structures 10, the first input hole 101 of one is connected to the second input hole 201 of the other through a current collecting flow path 301 of a current collecting member 300, and the first output hole 102 of one is connected to the second output hole 202 of the other through a current collecting flow path 301 of a current collecting member 300.

[0089] In this technical solution, when the heat exchange plate-fin structure 10 includes the aforementioned collecting member 300, in two adjacent heat exchange plate-fin structures 10, the first input hole 101 of one is connected with the second input hole 201 of the other through a collecting flow path 301 of a collecting member 300, and the first output hole 102 of one is connected with the second output hole 202 of the other through a collecting flow path 301 of a collecting member 300, thereby making the two adjacent heat exchange plate-fin structures 10 connected in parallel with each other. On the one hand, it is convenient for the centralized input and output of the heat exchange device and improves the connection convenience between the heat exchange device and other devices. On the other hand, the collecting member 300 can also be used to control the gap between the flow path layer 100 of one of the two adjacent heat exchange plate-fin structures 10 and the plate-shaped layer 200 of the other, so as to facilitate the formation of the second medium flow path 12 and further ensure the heat exchange performance of the heat exchange device.

[0090] In some feasible examples, in two adjacent heat exchange plate-fin structures 10, a gap is formed between the plate layer 200 of one and the flow path layer 100 of the other, and the length of the gap is greater than or equal to 0.1 mm and less than or equal to 10 mm, so as to reduce the resistance of the second medium flow path 12 to the aforementioned fluid medium while ensuring the structural compactness of the heat exchange device, thereby further improving the heat exchange performance of the heat exchange device.

[0091] In some feasible examples, the heat exchange device may also include a first end plate 20, a second end plate 30, a medium input pipe 40 and a medium output pipe 50, wherein the first end plate 20 and the second end plate 30 are arranged at intervals along the conduction direction of the aforementioned first input hole 101, and the plurality of aforementioned heat exchange plate-fin structures 10 are located between the first end plate 20 and the second end plate 30, the medium input pipe 40 and the medium output pipe 50 are passed through the aforementioned first end plate 20, and the medium input pipe 40 is connected to each first input hole 101, and the medium output pipe 50 is connected to the aforementioned first output hole 102, so that based on the aforementioned setting, the heat exchange device can use the first end plate 20 and the second end plate 30 to constrain and fix the plurality of heat exchange plate-fin structures 10, thereby improving the structural stability and reliability of the heat exchange device, and facilitating the centralized input and output of the medium to be exchanged through the medium input pipe 40 and the medium output pipe 50, respectively, thereby improving the convenience of use of the heat exchange device.

[0092] In addition, since the air conditioner provided in the embodiment of the present application includes the heat exchange plate-fin structure 10 proposed in any one of the first aspects above, it has all the beneficial effects of the heat exchange plate-fin structure 10, which will not be repeated here.

[0093] According to a third aspect of an embodiment of the present application, an air conditioner is provided, comprising: a heat exchange device as provided in any one of the second aspects above.

[0094] Since the air conditioner provided in the embodiment of the present application includes the heat exchange device proposed in any one of the second aspects above, it has all the beneficial effects of the heat exchange device, which will not be repeated here.

[0095] In the present invention, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance; the term "plurality" refers to two or more, unless otherwise clearly defined. The terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0096] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by terms such as “upper”, “lower”, “left”, “right”, “front” and “back” are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, cannot be understood as a limitation on the present invention.

[0097] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0098] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heat exchange plate-fin structure, characterized in that: include: A flow path layer is formed with a first input hole, a first output hole and a plurality of first flow grooves, wherein two ends of the first flow grooves are respectively connected to the first input hole and the first output hole; The plate-shaped layer is diffusion-bonded to the flow path layer, and the plate-shaped layer covers the first flow groove to enclose a first medium flow path with the flow path layer.

2. The heat exchange plate-fin structure according to claim 1, characterized in that: Also includes: A current collecting member is formed with a current collecting flow path, the plate-shaped layer is formed with a second input hole and a second output hole, the second input hole and the second output hole are respectively connected to the first input hole and the first output hole, and the second input hole and the second output hole are each penetrated by one of the current collecting members; Wherein, the collecting flow path is connected to the first medium flow path.

3. The heat exchange plate-fin structure according to claim 2, characterized in that: The current collecting member is diffusion-bonded to the plate-shaped layer.

4. The heat exchange plate-fin structure according to claim 2, characterized in that: Along the conducting direction of the current collecting flow path, both ends of the current collecting member are formed with step structures, wherein one of the step structures abuts against the plate-shaped layer, and the distance from the other step structure to the plate-shaped layer is greater than or equal to 0.1 mm.

5. The heat exchange plate-fin structure according to claim 1, characterized in that: The plate-shaped layer is formed with a plurality of second flow grooves, and each of the second flow grooves is correspondingly connected to one of the first flow grooves to form the first medium flow path.

6. The heat exchange plate-fin structure according to any one of claims 1 to 5, characterized in that: The first input hole and the first output hole are arranged at intervals along the first direction of the flow path layer, and the plurality of first flow grooves are arranged at intervals along the second direction of the flow path layer. The length of the flow path layer in the first direction is less than the length of the flow path layer in the second direction.

7. The heat exchange plate-fin structure according to any one of claims 1 to 5, characterized in that: The first flow groove is formed by a stamping process; or The first flow groove is formed by a milling process; or The first flow groove is formed by laser processing.

8. The heat exchange plate-fin structure according to any one of claims 1 to 5, characterized in that: The plate-shaped layer is made of aluminum material or stainless steel material; and / or The flow path layer is made of aluminum material or stainless steel material.

9. A heat exchange device, characterized in that: include: A plurality of heat exchange plate-fin structures according to any one of claims 1 to 8, wherein the plurality of heat exchange plate-fin structures are arranged in sequence along the conduction direction of the first input hole; Among the two adjacent heat exchange plate-fin structures, a gap is formed between the plate-shaped layer of one and the flow path layer of the other, so that a second medium flow path is formed between the two adjacent heat exchange plate-fin structures.

10. The heat exchange device according to claim 9, characterized in that: When the heat exchange plate-fin structure includes a current collecting member, in two adjacent heat exchange plate-fin structures, the first input hole of one is connected to the second input hole of the other through a current collecting flow path of the current collecting member, and the first output hole of one is connected to the second output hole of the other through a current collecting flow path of the current collecting member.

11. An air conditioner, characterized in that: include: The heat exchange device according to claim 9 or 10.

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