Space light and small camera structure and thermal control function integrated design and forming method

Abstract

The invention relates to a spatial light and small camera structure and thermal control function integrated design and forming method, which comprises the following steps of: after the spatial light and small camera structure design is completed, designing a heating loop and a ceramic insulating layer of the heating loop along a structure base body according to thermal control requirements, and obtaining a camera structure and thermal control function integrated design model. And then the camera structure, the ceramic insulating layer and the heating loop are fused or sintered together through a 3D printing process. The integrated design can greatly reduce the temperature gradient of the camera structure, so that the temperature control is more uniform; the heat transfer efficiency is obviously improved, and the thermal control power consumption is reduced; and the temperature control reliability can be greatly improved. The insulating layer is made of a high-thermal-conductivity and high-resistivity ceramic material, so that the selection range of a camera structure material is effectively expanded.

Description

Technical Field

[0001] The present technology belongs to the field of lightweight and small space cameras, and specifically relates to a method for designing and forming a lightweight and small space camera having a structure and thermal control function. Background Art

[0002] With the development of "deep coupling, high integration, ultra-light and small" lightweight and compact space cameras, the temperature control heating circuit and its wiring routing have, to a certain extent, restricted the miniaturization and high integration of lightweight and compact cameras, and even affected the performance of the camera system. For example, the transmission function of the wire diameter of the heating plate on the back of the secondary mirror to the small-aperture lens cannot be ignored. Due to the space limitations of lightweight and compact cameras, many structures such as the primary mirror cannot be directly temperature controlled at present, and some structures even require special auxiliary structures for thermal control to achieve indirect temperature control. For example, highly lightweight reflectors are currently indirectly temperature controlled by thermal radiation, and it is difficult to directly control the temperature by sticking heating elements on them.

[0003] The above problems can be solved by coupling the structure with the thermal control function. There are two main ways: embedded and integrated printing. The embedded method is to embed the already formed heating element into the structure in a certain way. The disadvantages of this method are low flexibility and poor universality. It cannot cope with the complex structure and thermal control function co-design of space-light and small cameras. The integrated printing method is to directly integrate the optical-mechanical structure and the temperature control heating circuit by means of 3D printing. This method has strong universality and can meet complex design requirements. "A 3D printing molding method with electrical integration" discloses a molding method for printing the electrical conductive circuit inside the object while printing the object in 3D. The printed entity material is limited to non-metallic materials, and the matching conductive material is limited to low-temperature hot-melt tin alloy materials or colloidal materials, which can only meet the structural requirements and electrical requirements in a local range.

[0004] The structural materials of lightweight and small space cameras are usually high-temperature metal materials such as titanium alloy, aluminum alloy, copper alloy, Invar, stainless steel, etc., and the electric heating materials are usually copper-nickel-manganese alloy, nickel-chromium alloy, iron-nickel-aluminum alloy, high-melting point pure metal and other conductive materials with high resistivity. The use of ceramic materials for insulation allows metal structures and non-metallic structures to directly print high-melting point or low-melting point conductive materials; the use of ceramic materials for insulation increases the operating temperature range of the heating circuit, because the sintering temperature of ceramic materials is at least above 1000°C, which is much higher than the temperature of the polyimide insulation film on the surface of the current heating plate. The use of currently disclosed processes cannot simultaneously meet the structural requirements, electrical requirements and thermal control requirements in this field, and also does not involve the design and molding requirements of the structure and thermal control functions. Summary of the invention

[0005] The technical problem solved by the present invention is: to overcome the shortcomings of the prior art, to provide a method for designing and forming a lightweight and small space camera structure and a thermal control function, to use insulating ceramics to achieve insulation between the electrical heating circuit and the camera structure, and to solve the design problems of complex wiring of the temperature control heating circuit of the space camera, low temperature control efficiency, high power consumption, and the inability of some structures to directly control temperature.

[0006] The technical solution of the present invention is: a design and molding method of a space light and small camera structure and thermal control function, comprising:

[0007] A space-light and compact camera structure is designed according to actual needs;

[0008] According to the required heating power, a heating circuit is designed inside the space light and small camera structure;

[0009] Along the heating loop, a ceramic insulating layer is designed between the heating loop and the structure to obtain a co-structure of the camera structure and the thermal control function;

[0010] The co-structure is printed and formed on a 3D printing device, and effective bonding between structures of the same or different materials is ensured through melting or sintering.

[0011] The heating circuit is designed with a uniform cross section, or with a unequal cross section according to temperature control requirements.

[0012] The cross-section of the heating loop is circular or rectangular.

[0013] The ceramic insulating layer is designed to have a constant thickness, and the thickness range is 0<δ≤2mm.

[0014] The thermal conductivity of the ceramic insulating layer is not less than 10W / m·℃, and the resistivity is not less than 10 13 Ω·m.

[0015] The ceramic material of the ceramic insulating layer includes Al2O3, BeO, Si3N4, AlN, and BN ceramics.

[0016] The common structure is formed by layer-by-layer printing, and the priority of printing each layer is the camera structure, the ceramic insulation layer, and the heating circuit.

[0017] The common structure is printed layer by layer by adopting a feeding method, and the camera structure, the ceramic insulating layer, and the heating circuit are fed in sequence by multi-head feeding. At the same time, the camera structure is printed by a directed energy deposition process, the ceramic insulating layer is printed by a material extrusion process, and the heating circuit is printed by a directed energy deposition process.

[0018] The common structure is printed layer by layer in a paving manner, and the camera structure, the ceramic insulating layer, and the heating circuit are paved in sequence according to the printing priority. At the same time, the camera structure is printed by powder bed fusion or directed energy deposition process, the ceramic insulating layer is printed by binder jetting process, and the heating circuit is printed by powder bed fusion or directed energy deposition process.

[0019] After each material of each layer is printed, the remaining material is collected and recovered by the corresponding suction nozzle or blown to the side, and then the next material is laid and printed. Different materials are recycled by different devices. The base powder of the camera structure and the conductor powder of the heating circuit are recycled by side blowing, and the insulating powder of the ceramic insulating layer is recycled by suction nozzle.

[0020] The advantages of the present invention compared with the prior art are:

[0021] 1) Ceramic materials are used for insulation, so that both metal structures and non-metal structures can be directly printed with high-melting-point or low-melting-point conductive materials.

[0022] 2) The use of ceramic insulation increases the operating temperature range of the heating circuit, because the sintering temperature of the ceramic material is at least above 1000°C, which is much higher than the temperature of the polyimide insulation film on the surface of the current heating plate;

[0023] 3) Only the insulating properties of ceramic materials are used, without the need for high-temperature sintering of ceramics, and the difficulty of ceramic additive manufacturing is reduced. Parts formed by ceramic additive manufacturing generally need to undergo high-temperature sintering. The present invention only uses the insulating properties of ceramic materials and does not use their structural mechanical properties, so no special sintering is required;

[0024] 4) The camera structure and thermal control function are designed and molded as a whole, so that camera parts that are difficult to implement thermal control can be directly controlled in temperature. The co-design makes the heating circuit more three-dimensional and diversified, making the temperature control more uniform;

[0025] 5) The same heating circuit can be designed with multiple backup circuits, which greatly improves the temperature control reliability. The heating circuits are evenly distributed inside the parts to directly control the temperature. Compared with the traditional surface-mounted heating sheet method, the heat transfer efficiency is increased several times, which can significantly reduce the power consumption of thermal control;

[0026] 6) The heating circuit package is printed inside the structure, avoiding complex wiring on the camera surface, which is conducive to the overall miniaturization and lightweight of the camera system. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of a design and molding method of a space light and small camera structure and thermal control function as described in the present invention;

[0028] Figure 2An embodiment of a flat-lay heating circuit for a space light and small camera structure and a thermal control function integrated design and molding method described in the present invention;

[0029] Figure 3 An embodiment of a three-dimensional heating circuit of a space light and small camera structure and a thermal control function co-design and molding method described in the present invention;

[0030] Figure 4 The model to be printed is an embodiment of a method for designing and molding a structure and thermal control function of a space light and small camera according to the present invention;

[0031] Figure 5 A material recycling scheme is implemented for the integrated design and molding method of the structure and thermal control function of a space lightweight and small camera described in the present invention. DETAILED DESCRIPTION

[0032] The following will further describe in detail the design and molding method of a space lightweight and small camera structure and thermal control function according to the present invention in combination with the accompanying drawings and specific embodiments.

[0033] like Figure 1-Figure 4 As shown, according to the present invention, a method for designing and forming a space lightweight and compact camera structure and a thermal control function as a whole includes the following steps: S1: designing a space lightweight and compact camera structure; S2: designing a heating circuit inside the structure according to the required resistance value; S3: designing a ceramic insulating layer between the heating circuit and the structure along the heating circuit to obtain a structure and a thermal control function as a whole; S4: printing and forming the structure on a 3D printing device.

[0034] The material of the space-light and small camera structure 1-1 is a metal material or a non-metal material.

[0035] Preferably, the common structure is formed by layer-by-layer printing, and the priority order of printing each layer is camera structure 1-1, ceramic insulation layer 1-3, heating circuit 1-2.

[0036] Preferably, the common structure is printed layer by layer by feeding method, and the camera structure 1-1, the ceramic insulating layer 1-3, and the heating circuit 1-2 are fed in sequence by multi-head feeding. At the same time, the camera structure 1-1 is printed by a directed energy deposition process, the ceramic insulating layer 1-3 is printed by a material extrusion process, and the heating circuit 1-2 is printed by a directed energy deposition process.

[0037] The common structure is printed layer by layer in a paving manner, and the camera structure 1-1, the ceramic insulating layer 1-3, and the heating loop 1-2 are laid in sequence according to the printing priority. At the same time, the camera structure 1-1 is printed by a powder bed fusion process or a directed energy deposition process, the ceramic insulating layer 1-3 is printed by a binder jetting process, and the heating loop 1-2 is printed by a powder bed fusion process or a directed energy deposition process.

[0038] like Figure 5 As shown, after each material of each layer is printed, the remaining material is collected and recovered by the corresponding suction nozzle or blown to the side, and then the next material is laid and printed to avoid material waste due to mixing. Different materials are recycled in different directions and with different devices; the matrix powder 2-2 and the conductor powder 2-4 are recycled by side blowing, and the insulating powder 2-3 is recycled by suction nozzle, and they are respectively recycled in different devices for easy recycling and reuse.

[0039] The heating circuit is designed with a uniform cross section, or with a unequal cross section according to temperature control requirements.

[0040] The cross-section of the heating loop is circular or rectangular.

[0041] The ceramic insulating layer is designed to have a constant thickness, and the thickness range is 0<δ≤2mm.

[0042] The thermal conductivity of the ceramic insulating layer is not less than 10W / m·℃, and the resistivity is not less than 10 13 Ω·m.

[0043] The ceramic material of the ceramic insulating layer includes Al2O3, BeO, Si3N4, AlN, and BN ceramics.

[0044] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solution of the present invention by using the technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. A design and molding method for a space lightweight small camera structure and thermal control function, characterized in that: include: A space-light and compact camera structure is designed according to actual needs; According to the required heating power, a heating circuit is designed inside the space light and small camera structure; Along the heating loop, a ceramic insulating layer is designed between the heating loop and the structure to obtain a co-structure of the camera structure and the thermal control function; The co-structure is printed and formed on a 3D printing device, and effective bonding between structures of the same or different materials is ensured through melting or sintering.

2. According to claim 1, a space light and small camera structure and thermal control function integrated design and molding method is characterized in that: The heating circuit is designed with a uniform cross section, or with a unequal cross section according to temperature control requirements.

3. According to claim 2, a method for designing and molding a space lightweight small camera structure and thermal control function, characterized in that: The cross-section of the heating loop is circular or rectangular.

4. According to claim 1, a space light and small camera structure and thermal control function integrated design and molding method is characterized in that: The ceramic insulating layer is designed to have a constant thickness, and the thickness range is 0<δ≤2mm.

5. According to claim 1, a space light and small camera structure and thermal control function integrated design and molding method is characterized in that: The thermal conductivity of the ceramic insulating layer is not less than 10W / m·℃, and the resistivity is not less than 10 13 Ω·m.

6. The method for designing and molding a space lightweight small camera structure and thermal control function as a whole according to claim 1, characterized in that: The ceramic material of the ceramic insulating layer includes Al2O3, BeO, Si3N4, AlN, and BN ceramics.

7. The method for designing and molding a space lightweight small camera structure and thermal control function as a whole according to claim 1, characterized in that: The common structure is formed by layer-by-layer printing, and the priority of printing each layer is the camera structure, the ceramic insulation layer, and the heating circuit.

8. The method for designing and molding a space lightweight small camera structure and thermal control function as a whole according to claim 1, characterized in that: The common structure is printed layer by layer by adopting a feeding method, and the camera structure, the ceramic insulating layer, and the heating circuit are fed in sequence by multi-head feeding. At the same time, the camera structure is printed by a directed energy deposition process, the ceramic insulating layer is printed by a material extrusion process, and the heating circuit is printed by a directed energy deposition process.

9. The method for designing and molding a space lightweight small camera structure and thermal control function as a whole according to claim 1, characterized in that: The common structure is printed layer by layer in a paving manner, and the camera structure, the ceramic insulating layer, and the heating circuit are paved in sequence according to the printing priority. At the same time, the camera structure is printed by powder bed fusion or directed energy deposition process, the ceramic insulating layer is printed by binder jetting process, and the heating circuit is printed by powder bed fusion or directed energy deposition process.

10. The method for designing and molding a space lightweight small camera structure and thermal control function as a whole according to claim 1, characterized in that: After each material of each layer is printed, the remaining material is collected and recovered by the corresponding suction nozzle or blown to the side, and then the next material is laid and printed. Different materials are recycled by different devices. The base powder of the camera structure and the conductor powder of the heating circuit are recycled by side blowing, and the insulating powder of the ceramic insulating layer is recycled by suction nozzle.

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