Chip side push test device and method

Abstract

The present invention provides a chip side-push test device and method, wherein the device comprises: a test probe and an elastic support assembly arranged on one side of the test probe; wherein the test probe comprises a probe arm and a contact end arranged at the end of the probe arm, wherein the contact end is in contact and conduction with a support column of a metal bump on a chip to be tested; the elastic support assembly is used to deform under force and generate a lateral thrust to the probe arm during the contact between the contact end and the support column; the contact end is docked with the support column with the assistance of the lateral thrust, so that the chip to be tested and the test probe transmit signals through the support column. The above invention can be used to complete relevant tests on the chip without damaging the solder cap.

Description

Technical Field

[0001] The present invention relates to the field of chip detection technology, and more specifically, to a chip side-pushing test device and method. Background Art

[0002] In the field of semiconductor chip stacking technology, before a chip is formed or shipped, its related performance needs to be tested to achieve chip quality inspection, grading, and defective product screening. Currently, there are various ways to stack chips, such as HBM, Wide-IO, or HMC. When testing such chips, an external probe is required to contact the metal bumps on the chip to achieve the transmission of test signals and test results.

[0003] However, since the metal bumps on the chip are small and fragile, if the existing probes are used to directly contact the metal bumps, the solder ends of the metal bumps will be damaged. The positioning error between the chip and the probe will also cause the probe and the solder end to collide, thereby affecting the subsequent bonding process and chip performance, and affecting the product yield.

[0004] Therefore, there is an urgent need for a chip testing solution that can achieve precise positioning and effective contact between the chip and the test signal while ensuring that the two are connected, thereby preventing the solder end of the metal bump from being damaged and affecting chip performance. Summary of the invention

[0005] In view of the above problems, the purpose of the present invention is to provide a chip side-push test device and method to solve the problem that the solder end of the chip is damaged due to contact testing and positioning contact in the existing chip testing scheme, thereby affecting the chip performance.

[0006] The chip side-push test device provided by the present invention comprises: a test probe and an elastic support component arranged on one side of the test probe; wherein the test probe comprises a probe arm and a contact end arranged at the end of the probe arm, and the contact end is in contact and conduction with a support column of a metal bump on a chip to be tested; the elastic support component is used to be deformed by force and generate a lateral thrust on the probe arm during the contact between the contact end and the support column; the contact end is docked with the support column under the auxiliary action of the lateral thrust, so that the chip to be tested and the test probe can transmit signals through the support column.

[0007] In addition, an optional technical solution is that the elastic support assembly includes a connecting portion arranged on the probe arm, an elastic deformation portion arranged below the connecting portion, and an abutment portion located at one end of the elastic deformation portion away from the connecting portion; wherein,

[0008] During the downward movement of the test probe, the abutment portion contacts and limits the chip protection layer under the metal bump in advance, and the elastic deformation portion is deformed toward the support column on the chip protection layer under the pressure of the connection portion and the abutment portion.

[0009] In addition, an optional technical solution is that the elastic deformation portion is a stacked prismatic structure, a serrated structure or an arc-shaped structure; when the elastic deformation portion is an arc-shaped structure, the arc-shaped structure is elastically bent toward the side close to the support column.

[0010] In addition, an optional technical solution is that a push plate is provided on one side of the elastic deformation portion;

[0011] When the elastic deformation portion is deformed, the push plate is used to push the probe arm to move toward the supporting column side.

[0012] In addition, an optional technical solution is that, in a vertical direction perpendicular to the chip protection layer, the elastic deformation portion has different deformation amounts at different positions, so that the push plate tilts and squeezes the probe arm.

[0013] In addition, an optional technical solution is that the elastic support component is an insulating component, and the elastic support component is an integrally formed structure.

[0014] In addition, an optional technical solution is that the probe arms are vertically distributed, obliquely distributed, or arc-shaped; and the contact ends are horizontally distributed or obliquely distributed.

[0015] In addition, an optional technical solution is that an arc-shaped slot is provided in the contact end and passes through the contact end; the shape of the arc-shaped slot is adapted to the support column, and the height of the arc-shaped slot is less than the height of the support column.

[0016] In addition, an optional technical solution is that an insulating layer is provided inside the test probe, and the insulating layer is used to isolate the test probe to form two test ends;

[0017] The two test terminals are used together to implement a Kelvin test on the chip to be tested.

[0018] On the other hand, the present invention further provides a chip testing method, using the above chip side push testing device to test the chip to be tested, the method comprising:

[0019] Adjusting the relative position between the test probe and the chip to be tested so that the contact end of the test probe is located on one side of the support column and one end of the elastic support component abuts against the chip protection layer under the metal bump;

[0020] Controlling the test probe to continue to move downward, the elastic support assembly is deformed by force, and generates a lateral thrust on the probe arm side;

[0021] Under the auxiliary action of the lateral thrust, the contact end of the test probe contacts and conducts with the support column;

[0022] A test signal is sent to the chip to be tested through a test probe, and the test of the chip to be tested is completed through the test signal.

[0023] By utilizing the above-mentioned chip side-push test device and method, an elastic support component is arranged on one side of the test probe. During the contact between the contact end and the support column, the elastic support component can be deformed by the extrusion force, and generate a lateral thrust on the probe arm through the deformation, thereby ensuring that during the test process, the contact end of the test probe is effectively contacted and connected with the support column with the assistance of the lateral thrust. This not only avoids direct contact between the test probe and the solder cap, ensures the integrity of the shape of the solder cap, and avoids the subsequent process and performance being affected by damage to the solder cap, but also ensures the effectiveness of the contact during the test and improves the accuracy of the test.

[0024] In order to achieve the above and related purposes, one or more aspects of the present invention include the features that will be described in detail later. The following description and the accompanying drawings describe some exemplary aspects of the present invention in detail. However, these aspects indicate only some of the various ways in which the principles of the present invention can be used. In addition, the present invention is intended to include all these aspects and their equivalents. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] By referring to the following description in conjunction with the accompanying drawings, and with a more comprehensive understanding of the present invention, other objects and results of the present invention will become more apparent and easy to understand. In the accompanying drawings:

[0026] Figure 1 It is a structural schematic diagram of a chip side push testing device according to an embodiment of the present invention;

[0027] Figure 2 This is a schematic structural diagram of an elastic support assembly before deformation according to Embodiment 1 of the present invention;

[0028] Figure 3 is a schematic structural diagram of the elastic support assembly after deformation according to the first embodiment of the present invention;

[0029] Figure 4 is a schematic structural diagram of an elastic support assembly before deformation according to Embodiment 2 of the present invention;

[0030] Figure 5 is a schematic structural diagram of the elastic support assembly after deformation according to the second embodiment of the present invention;

[0031] Figure 6 is a schematic structural diagram of an elastic support assembly before deformation according to Embodiment 3 of the present invention;

[0032] Figure 7 is a schematic structural diagram of the elastic support assembly after deformation according to the third embodiment of the present invention;

[0033] Figure 8 Schematic diagram of the structure of the elastic support assembly before deformation according to the fourth embodiment of the present invention

[0034] Fig. 9 is a schematic structural diagram of an elastic support assembly after deformation according to a fourth embodiment of the present invention;

[0035] Fig.10 FIG. 4 is a flow chart of a chip testing method according to an embodiment of the present invention.

[0036] The reference numerals include: chip protection layer 1 , probe arm 11 , contact end 12 , solder cap 21 , support column 22 , connection portion 31 , elastic deformation portion 32 , abutment portion 33 , push plate 34 .

[0037] The same reference numerals throughout the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0038] In the following description, for the purpose of illustration, in order to provide a comprehensive understanding of one or more embodiments, many specific details are set forth. However, it is apparent that these embodiments may also be implemented without these specific details. In other examples, for ease of describing one or more embodiments, known structures and devices are shown in the form of block diagrams.

[0039] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0040] It will be understood by those skilled in the art that, unless otherwise stated, the singular forms "a", "an", "said" and "the" used herein may also include plural forms. It should be further understood that the term "comprising" used in the specification of the present invention refers to the presence of the features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. It should be understood that the term "and / or" used herein includes any unit and all combinations of one or more associated listed items.

[0041] It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as generally understood by those skilled in the art in the field to which the present invention belongs. It should also be understood that terms such as those defined in common dictionaries should be understood to have meanings consistent with the meanings in the context of the prior art, and will not be interpreted with idealized or overly formal meanings unless defined as herein.

[0042] In order to describe the chip side push test device and method in detail, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0043] Figures 1 to 9 The overall or partial schematic structures of the chip side-pushing test device according to the embodiment of the present invention are shown from different angles.

[0044] like Figures 1 to 9 As shown together, the chip side-push test device of the embodiment of the present invention includes a test probe and an elastic support component arranged on one side of the test probe; wherein, the metal bump of the chip to be tested includes a support column 22 arranged on the chip protection layer 1 and a solder cap 21 located at the end of the support column 22. Under normal circumstances, the material of the support column 22 is slightly harder than the solder cap 21. For example, the support column 22 can be made of copper, which is less susceptible to damage than the solder cap 21; in order to avoid direct contact between the traditional test probe and the solder cap 21, the test probe in the embodiment of the present invention includes a probe arm 11 and a contact end 12 arranged at the end of the probe arm 11; the elastic support component is used to deform under force and generate a lateral thrust on the probe arm 11 during the contact between the contact end 12 and the support column 22, so that the contact end 12 is effectively contacted and connected with the support column 22 under the auxiliary action of the lateral thrust, so that the chip to be tested and the test probe can transmit signals through the support column 22 to complete the functional detection of the chip.

[0045] The test probe can be arranged on a probe holder, and its probe arm 11 can be directly connected to the probe holder. The position of the test probe can be adjusted by controlling the movement of the probe holder, so as to complete the contact and conduction between the test probe and the metal bumps of the chip to be detected. In addition, the test probes can be distributed in a regular array on the probe holder, and the distribution of the test probes can be set accordingly according to the positions of the metal bumps on the chip to be detected. The positions of the test probes in adjacent rows or columns are staggered, so as to reduce mutual interference between the test probes and complete the independent detection of multiple metal bumps on the chip to be detected at one time.

[0046] In addition, the elastic support assembly includes a connecting portion 31 arranged on one side of the probe arm 11, an elastic deformation portion 32 arranged below the connecting portion 31, and an abutment portion 33 located at an end of the elastic deformation portion 32 away from the connecting portion 31. In the process of the test probe moving downward, the abutment portion 33 first contacts the upper surface of the chip protection layer 1 to achieve limitation in the direction perpendicular to the chip protection layer 1, and then continues to control the test probe to move downward. The further movement of the connecting portion 31 squeezes the elastic deformation portion 32, forcing the elastic deformation portion 32 to produce elastic deformation between the abutment portion 33 and the connecting portion 31. The elastic deformation will cause the elastic deformation portion 32 to increase in size in a direction parallel to the chip protection layer 1, that is, to deform toward the side close to the support column 22. The deformation can control the probe arm 11 to tilt toward the side close to the support column 22, so that its contact end 12 can make reliable contact with the support column 22.

[0047] In a specific embodiment of the present invention, the structure of the elastic deformation portion 32 can be set as a structure in which multiple prisms are stacked (such as the attached Figure 2 and 3 as shown), sawtooth structure (as shown in the attached Figures 4 to 7 as shown) or an arc structure (as Figure 8 and Fig. 9 As shown in the figure, when the elastic deformation portion 32 is an arc-shaped structure, in a natural state, the arc-shaped structure bends toward the side close to the support column 22; in addition, the elastic deformation portion 32 can also be set to other elastic structures that can be displaced to one side under the action of force. The present invention is not limited to the specific structure shown in the drawings.

[0048] It can be seen that when the elastic deformation part 32 is deformed, a certain amount of displacement can be generated toward the side close to the support column 22. In order to improve the position accuracy between the contact end 12 and the support column 22, a push plate 34 can be set on one side of the elastic deformation part 32. The push plate 34 can be fixed on the probe arm 11 or independently set from the probe arm 11. When the elastic deformation part 32 is deformed, the push plate 34 can push the probe arm 11 to tilt and deform, thereby ensuring effective fit between the contact end 12 and the support column 22 and ensuring test accuracy. Among them, since the deformation amount of the elastic deformation part 32 at each position can be different, the push plate 34 can generate an inclined thrust, which can make the probe arm 11 more easily deformed and restore the initial position compared to the horizontal thrust.

[0049] In addition, the contact end 12, the elastic deformation portion 32 and the abutment portion 33 can be formed in an integral structure to form an elastic insulator with a certain amount of deformation. In other words, in order to avoid affecting the chip test, the elastic support component can be an insulating member and can be set as an integral structure, thereby improving the overall strength of the structure and simplifying the preparation process.

[0050] It should be noted that since the probe arm 11 also has a certain amount of deformation, and the deformation process is easier to achieve by tilting at a certain angle, in order to avoid using only horizontal lateral thrust to push the probe arm directly, in the elastic support assembly of the present invention, in the vertical direction along the vertical chip protection layer 1, the deformation amount of the elastic deformation part 32 at different positions is different, so that the push plate 34 can tilt and squeeze the probe arm 11, which is convenient for the deformation and resetting of the probe arm 11.

[0051] In the chip side-push test device of the present invention, the probe arm 11 can be distributed vertically, obliquely or in an arc shape, and the setting direction of the contact end 12 arranged at the end of the probe arm 11 is different from the setting direction of the probe arm 11. It can be distributed horizontally or obliquely at a certain angle. When the contact end 12 contacts the support column 22, the probe arm 11 can avoid the metal bump; in other words, the contact end 12 can extend outward at the end of the probe arm 11, and through the fit between the contact end 12 and the support column 22, the contact and conduction between the test probe and the chip to be tested are achieved.

[0052] In addition, an arc-shaped slot can be provided inside the contact end 12 and penetrate the contact end 12, and the curvature of the arc-shaped slot is adapted to the size of the support column 22, and the height of the arc-shaped slot is smaller than the height of the support column 22, so that during the test contact process, the arc-shaped slot can effectively contact the support column 22, and avoid contact and collision between the contact end 12 and the solder cap 21, so as to ensure the structural integrity of the solder cap 21.

[0053] In order to further improve the accuracy of chip testing, an insulating layer can be set inside the test probe to isolate the test probe through the insulating layer to form two test ends. The two test ends are used together to implement Kelvin testing on the chip to be tested. The Kelvin testing method can eliminate the loss of the test probe during the signal transmission process and improve the accuracy of detection.

[0054] Corresponding to the above-mentioned chip side-push testing device, the present invention also provides a chip testing method, which uses the above-mentioned chip side-push testing device to test the chip to be tested.

[0055] Specifically, Fig.10 The schematic flow of the chip testing method according to the embodiment of the present invention is shown.

[0056] like Fig.10 As shown, the chip testing method of the embodiment of the present invention mainly includes the following steps:

[0057] S100: adjusting the relative position between the test probe and the chip to be tested so that the contact end of the test probe is located on one side of the support column and one end of the elastic support component abuts against the chip protection layer;

[0058] S200: Controlling the test probe to continue to move downward, the elastic support assembly is deformed by force, and generates a lateral thrust on the probe arm side;

[0059] S300: Under the auxiliary action of the lateral thrust, the contact end of the test probe contacts and is connected to the support column;

[0060] S400: Sending a test signal to the chip to be tested through a test probe, and completing the test of the chip to be tested through the test signal.

[0061] Specifically, when using the chip side-push test device to test the chip to be tested, the probe holder and the test probe thereon are first moved to one side of the metal bump on the chip to be tested by the driving device. This process can also be achieved by driving the chip to be tested to move by the driving device, and the relative position between the test probe and the chip to be tested can be adjusted to a specified position; then, the test probe is controlled to continue to move downward, and the abutting portion of the elastic support assembly contacts and limits the signal protection layer, so that the elastic deformation portion generates a lateral thrust, so that the contact end of the test probe contacts and is connected with the support column; finally, a test signal is sent to the chip to be tested by the test probe, and the test of the chip to be tested is completed by the test signal.

[0062] It should be noted that the embodiments of the above chip testing method can refer to the description in the embodiment of the chip side-push testing device, which will not be described in detail here.

[0063] According to the chip side-push test device and method of the present invention, an elastic support component is arranged on one side of the test probe. The elastic support component can be deformed by the extrusion force and generate a lateral thrust on the probe arm through the deformation, so as to ensure that during the test process, the contact end of the test probe is effectively contacted and connected with the support column with the assistance of the lateral thrust, thereby improving the mechanical properties and test accuracy of the test probe. The present invention can not only avoid direct contact between the test probe and the solder cap, ensure the integrity of the shape of the solder cap, and avoid the subsequent process and performance being affected by damage to the solder cap, but also ensure the effectiveness of contact during the test process and improve the accuracy of the test.

[0064] As described above, the chip side push test device and method according to the present invention are described by way of example with reference to the accompanying drawings. However, those skilled in the art should understand that various improvements can be made to the chip side push test device and method proposed by the present invention without departing from the content of the present invention. Therefore, the protection scope of the present invention should be determined by the content of the attached claims.

Claims

1. A chip side push test device, characterized in that: It includes a test probe and an elastic support assembly arranged on one side of the test probe; wherein, The test probe comprises a probe arm and a contact end arranged at the end of the probe arm, wherein the contact end is in contact and conduction with a support column of a metal bump on a chip to be tested; The elastic support assembly is used to deform under force and generate a lateral thrust on the probe arm during the contact between the contact end and the support column; The contact end is docked with the support column under the auxiliary action of the lateral thrust, so that the chip to be tested and the test probe transmit signals through the support column; The elastic support assembly includes a connecting portion arranged on the probe arm, an elastic deformation portion arranged below the connecting portion, and an abutment portion located at one end of the elastic deformation portion away from the connecting portion; wherein, During the downward movement of the test probe, the abutment portion contacts and limits the chip protection layer under the metal bump in advance, and the elastic deformation portion is deformed toward the support column on the chip protection layer under the pressure of the connection portion and the abutment portion.

2. The chip side push test device according to claim 1, characterized in that: The elastic deformation portion is a stacked prismatic structure, a sawtooth structure or an arc structure; When the elastic deformation portion is an arc-shaped structure, the arc-shaped structure is elastically bent toward the side close to the support column.

3. The chip side push test device according to claim 1, characterized in that: A push plate is provided on one side of the elastic deformation portion; When the elastic deformation portion is deformed, the push plate is used to push the probe arm to move toward the supporting column side.

4. The chip side push test device according to claim 3, characterized in that: In a vertical direction perpendicular to the chip protection layer, the elastic deformation portion has different deformation amounts at different positions, so that the push plate tilts and presses the probe arm.

5. The chip side push test device according to claim 1, characterized in that: The elastic support component is an insulating member, and the elastic support component is an integrally formed structure.

6. The chip side push test device according to claim 1, characterized in that: The probe arms are distributed vertically, obliquely or in an arc shape; The contact ends are distributed horizontally or obliquely.

7. The chip side push test device according to claim 6, characterized in that: An arc-shaped slot is provided in the contact end and passes through the contact end; The shape of the arc-shaped slot is matched with the support column, and the height of the arc-shaped slot is smaller than the height of the support column.

8. The chip side push test device according to claim 1, characterized in that: An insulating layer is provided inside the test probe, and the insulating layer is used to isolate the test probe to form two test ends; The two test terminals are used together to implement a Kelvin test on the chip to be tested.

9. A chip testing method, characterized in that: The chip to be tested is tested using the chip side push test device according to any one of claims 1 to 8, the method comprising: Adjusting the relative position between the test probe and the chip to be tested so that the contact end of the test probe is located on one side of the support column and one end of the elastic support component abuts against the chip protection layer under the metal bump; Controlling the test probe to continue to move downward, the elastic support assembly is deformed by force, and generates a lateral thrust on the probe arm side; Under the auxiliary action of the lateral thrust, the contact end of the test probe contacts and conducts with the support column; A test signal is sent to the chip to be tested through a test probe, and the test of the chip to be tested is completed through the test signal.

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