Piezoelectric stack displacement amplification mechanism

Abstract

The invention discloses a piezoelectric stack displacement amplification mechanism. According to the piezoelectric stack displacement amplification mechanism, two-stage displacement amplification is carried out through the L-shaped first-stage amplification mechanism and the half-bridge second-stage amplification mechanism, and the large amplification ratio is achieved. On the premise that the large amplification ratio is achieved, the L-shaped first-stage amplification mechanism is designed to be two L-shaped arms which are symmetrically arranged, meanwhile, the half-bridge second-stage amplification mechanism comprises two half-bridge structures which are symmetrically arranged, the two stages of amplification mechanisms are symmetrically arranged, and the first-stage amplification mechanism is of an L-shaped structure, so that stress cannot be concentrated on piezoelectric ceramics; the stress is reduced as much as possible, the working stability is improved, the piezoelectric ceramic is well protected, and the service life is long.

Description

Technical Field

[0001] The invention belongs to the technical field of precision machining, and in particular relates to a piezoelectric stack displacement amplification mechanism. Background Art

[0002] Micro-electromechanical systems, precision engineering, aerospace, bioengineering and other fields are some of the hottest fields in the world today, and control and positioning systems are very important in these fields. Piezoelectric ceramics have the characteristics of small size, no heat generation during operation, large output load, extremely high displacement resolution, rapid response and good displacement repeatability, making piezoelectric ceramic drivers a popular choice in the field of micro-nano driving, especially in the field of ultra-precision machining, where its application is even more extensive. The output displacement of piezoelectric ceramics is usually only tens of microns, which is limited in application in many large-scale work environments. How to accurately control and use piezoelectric ceramics has become a major challenge and hot topic in the current scientific research field.

[0003] In recent years, a relatively mature direction is the mechanical micro-displacement amplification mechanism, among which the flexible hinge is the most widely used flexible mechanism. Its principle is to realize the motion transmission of the hinge structure through the elastic deformation of the flexible hinge. Its characteristics are high motion sensitivity, no friction and high precision. Therefore, most mechanical micro-displacement amplification mechanisms on the market currently use flexible hinges. In addition, there are also hydraulic micro-displacement amplification mechanisms, which are widely used in piezoelectric valves.

[0004] For example, the utility model with the authorization announcement number CN215186505U discloses a multi-piezoelectric ceramic antisymmetric micro-displacement amplification mechanism, including a base, an asymmetric amplification unit, and a motion platform, wherein the asymmetric amplification unit is used for micro-displacement amplification. The first-stage asymmetric amplification mechanism is divided into left and right input ends at the input end, the first-stage asymmetric amplification unit is connected in series with the second-stage asymmetric amplification mechanism through a flexible hinge, the second-stage amplification mechanism is connected to the output end through a flexible hinge, and the bases at the two joints are fixedly connected in an antisymmetric manner.

[0005] For another example, the invention application with publication number CN118054692A discloses a compliant mechanism with a compact structure and a high displacement amplification ratio, comprising: a piezoelectric ceramic driver; a lever amplification mechanism, wherein the lever amplification mechanism is disposed on both sides of the piezoelectric ceramic driver, and the input end of the lever amplification mechanism is connected to the piezoelectric ceramic driver through an input block; a first-stage bridge amplification mechanism, wherein the lever amplification mechanism is included in the first-stage bridge amplification mechanism; a second-stage bridge amplification mechanism, wherein the second-stage bridge amplification mechanism is connected to the first-stage bridge amplification mechanism through a support rod; wherein the piezoelectric ceramic driver is used to drive the input block so that the input block generates a horizontal displacement, and the horizontal displacement is amplified by the lever amplification mechanism to obtain a first output displacement, the first output displacement is based on the first-stage bridge amplification mechanism to obtain a vertical and amplified second output displacement, and the second output displacement is based on the second-stage bridge amplification mechanism to obtain a horizontal and amplified third output displacement.

[0006] The above-mentioned prior art discloses a multi-piezoelectric ceramic amplifier, and the structure is not applicable to a single piezoelectric ceramic.

[0007] For a single piezoelectric ceramic, if the stress is concentrated in one place, it will make that place easy to be damaged, reducing the service life of the overall structure, and the control stability is also poor. Summary of the invention

[0008] In view of the above-mentioned deficiencies in the prior art, the present invention provides a piezoelectric stack displacement amplification mechanism, which performs displacement amplification through an L-type primary amplification mechanism and a half-bridge secondary amplification mechanism, so that the piezoelectric stack displacement amplification mechanism of the present invention has a larger amplification ratio under the premise of single piezoelectric ceramic and two-stage amplification. Through the design of symmetrical structure, the stress is relatively small and the piezoelectric ceramic is well protected, the service life is long, and the working stability is improved.

[0009] A piezoelectric stack displacement amplification mechanism comprises a fixed end, an input end and an output end, wherein the input end and the output end are connected to each other through an L-shaped primary amplification mechanism and a half-bridge secondary amplification mechanism for displacement amplification, wherein the L-shaped primary amplification mechanism comprises two symmetrically arranged L-shaped arms, and the half-bridge secondary amplification mechanism comprises two symmetrically arranged half-bridge structures;

[0010] One end of the two L-shaped arms is arranged opposite to each other and is connected to the input end through a first flexible hinge respectively, the other end of the two L-shaped arms is connected to a half-bridge structure through a second flexible hinge respectively, and the two half-bridge structures are connected to the output end through a third flexible hinge respectively;

[0011] The two L-shaped arms are also connected to the fixed end at one end connected to the input end through a fourth flexible hinge, and the connection structures are symmetrically arranged.

[0012] The two L-shaped arms are combined into a U-shaped structure. One end of the two L-shaped arms is oppositely arranged as the bottom position of the U-shaped structure, which is used to connect the input end and the fixed end; the other end of the two L-shaped arms is used as the two arms of the U-shaped structure, which is used to connect the output end.

[0013] Preferably, the fixed end is located within the enclosed area of ​​the two L-shaped arms, and the input end is located outside the enclosed area of ​​the two L-shaped arms.

[0014] More preferably, the first flexible hinge, the second flexible hinge, and the fourth flexible hinge are each connected to a long side of the L-shaped arm. The long side of the L-shaped arm refers to the side where the length is located, and each flexible hinge is connected to the end area of ​​the long side to fully utilize the lever amplification effect of the upper L-shaped arm.

[0015] Preferably, the connection between the two ends of the L-shaped arm is bent inwards. Compared with the L-shaped structure with right-angle connection, this inward bending connection structure can further reduce stress concentration.

[0016] Preferably, the first flexible hinge, the second flexible hinge, the third flexible hinge and the fourth flexible hinge are all straight beam flexible hinges. Compared with the straight circular and elliptical flexible hinges, the straight beam flexible hinge has the characteristics of small deformation and small stress under the same conditions, and has the advantage of a large rotation range, and can well rely on the elastic deformation of the flexible hinge itself to achieve high-sensitivity displacement transmission between different mechanisms.

[0017] More preferably, the thickness of the straight beam type flexible hinge is 1 to 1.5 mm. Further preferably, the thickness of the straight beam type flexible hinge is 1.3 to 1.4 mm. After simulation analysis, the present application found that the magnification factor is close when the thickness is 1.3 mm and 1.4 mm, and is better than that of smaller and larger thicknesses. Considering factors such as the stability, service life and structural strength of the magnification mechanism, 1.4 mm is selected as the optimal thickness of the straight beam type flexible hinge at the input end.

[0018] Preferably, the first flexible hinge is divided into two sections, and a rigid transition block is connected between the two sections. The first flexible hinge is divided into two sections and transitioned through the rigid transition block to prevent the hinge from breaking due to being too thin during use, thereby playing a role in strengthening the structure.

[0019] Preferably, the material used for the piezoelectric stack displacement amplification mechanism is AL7075 aluminum alloy. The micro-displacement flexible amplification mechanism mainly transmits displacement and force through the elastic deformation of the flexible hinge, and is also subjected to tension, compression, bending, torsion and shearing during operation. Therefore, the material properties such as Poisson's ratio, density, tensile strength, etc. have a very important influence on the performance of the flexible amplification mechanism. The piezoelectric stack displacement amplification mechanism described in the present application uses AL7075 aluminum alloy as the material of the two-stage combined micro-displacement amplification mechanism, which can well withstand the two deformations of stretching and bending during the operation of the micro-displacement amplification mechanism, and meets the requirements of high load, light weight, service life and high precision.

[0020] In the present application, the excitation element at the input end is a piezoelectric stack, and the stacked piezoelectric ceramic used is a piezoelectric ceramic displacement actuator produced by Zhejiang Shenlei Ultrasonic Materials Factory.

[0021] The present invention has the following beneficial effects:

[0022] The piezoelectric stack displacement amplification mechanism of the present invention performs secondary displacement amplification through an L-type primary amplification mechanism and a half-bridge secondary amplification mechanism, and has a large amplification ratio. Under the premise of having a large amplification ratio, the present invention designs the L-type primary amplification mechanism as two L-shaped arms arranged symmetrically, and the symmetrical mechanism can effectively reduce the maximum stress. At the same time, the L-type lever mechanism mainly plays a protective role for the piezoelectric ceramics, because it can effectively avoid the bending moment and shear force from being concentrated on the piezoelectric ceramics, thereby improving the service life and control accuracy of the piezoelectric ceramics. At the same time, the half-bridge secondary amplification mechanism includes two symmetrically arranged half-bridge structures, and the symmetrical mechanism can effectively reduce the maximum stress. At the same time, the selection of the half-bridge amplification mechanism can improve the stability of the amplification mechanism, and meet the requirements of compact structure, small space occupation, high amplification multiple, etc. The two-stage amplification mechanism is a symmetrical structure, and the primary amplification mechanism is an L-shaped structure, so that the stress will not be concentrated on the piezoelectric ceramics, the stress is reduced as much as possible, the working stability is improved, the piezoelectric ceramics are well protected, and the service life is long.

[0023] The excitation element at the input end of the present invention is a piezoelectric stack, which has high output displacement accuracy and large output force. The piezoelectric stack displacement amplification mechanism can amplify the displacement of the piezoelectric stack. The use of a half-bridge amplification mechanism can improve structural stability and improve space utilization. The L-type lever amplification mechanism can protect the piezoelectric ceramics and effectively avoid bending moment and shear force concentration. The symmetrical distribution effectively reduces the maximum stress.

[0024] The present invention designs a novel piezoelectric stack displacement amplification mechanism with an amplification factor that meets use requirements, high control accuracy, high stability, small space occupation and a wide range of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of the piezoelectric stack displacement amplification mechanism.

[0026] Figure 2 Schematic diagram of the L-type lever amplification mechanism.

[0027] Figure 3 It is a schematic diagram of the half-bridge amplifier mechanism.

[0028] Figure 4 Schematic diagram of a straight beam type flexible hinge.

[0029] Figure 5 is a schematic diagram of the connection between a rigid body and a hinge, where: Figure 5 a is a rigid body i connected to hinge k. Figure 5 In the figure b, rigid bodies i and j are connected by hinge k.

[0030] Figure 6 The static simulation results of flexible hinges with different thicknesses are shown in Figure 2. Figure 6 Figure a is the simulation result of the flexible hinge with a thickness of 1.5 mm. Figure 6 Figure b is the simulation result of the flexible hinge with a thickness of 1.4 mm. Figure 6 Figure c is the simulation result of the flexible hinge with a thickness of 1.3 mm.

[0031] Figure 7 This is the stress cloud diagram of the static simulation of the two-stage combined micro-displacement amplification mechanism.

[0032] Figure 8 This is the design diagram of the optimized two-stage combined micro-displacement amplification mechanism and some of its main parameters.

[0033] Fig. 9 This is a real picture of the enlarged scale test of the two-stage combined micro-displacement amplification mechanism.

[0034] Fig.10 It is the magnification of the two-stage combined micro-displacement amplification mechanism under different voltages in the test. DETAILED DESCRIPTION

[0035] like Figures 1 to 3 As shown, a piezoelectric stack displacement amplification mechanism includes a fixed end 1, an input end 2 and an output end 5, and displacement amplification is performed between the input end 2 and the output end 5 through an L-type primary amplification mechanism 3 and a half-bridge secondary amplification mechanism 4, wherein the L-type primary amplification mechanism 3 includes two symmetrically arranged L-shaped arms, and the half-bridge secondary amplification mechanism 4 includes two symmetrically arranged half-bridge structures.

[0036] One end of the two L-shaped arms is arranged opposite to each other and is connected to the input end 2 through a first flexible hinge, and the other end of the two L-shaped arms is connected to a half-bridge structure through a second flexible hinge, and the two half-bridge structures are respectively connected to the output end 5 through a third flexible hinge. The two L-shaped arms are also connected to the fixed end 1 through a fourth flexible hinge at the end connected to the input end 2, and the connection structures are symmetrically arranged.

[0037] The two L-shaped arms are combined into a U-shaped structure. One end of the two L-shaped arms is oppositely arranged as the bottom position of the U-shaped structure, used to connect the input end 2 and the fixed end 1; the other end of the two L-shaped arms is used as the two arms of the U-shaped structure, used to connect the output end 5.

[0038] The fixed end 1 is located within the enclosed area of ​​the two L-shaped arms, and the input end 2 is located outside the enclosed area of ​​the two L-shaped arms.

[0039] In a preferred embodiment, the first flexible hinge, the second flexible hinge, and the fourth flexible hinge are each connected to the long side of the L-shaped arm. The long side of the L-shaped arm refers to the side where the length is located, and each flexible hinge is connected to the end area of ​​the long side to fully utilize the lever amplification effect of the upper L-shaped arm.

[0040] The connection between the two ends of the L-shaped arm is bent inwards. Compared with the L-shaped structure connected at right angles, this inward bending connection structure can further reduce stress concentration. As shown in the figure, the two ends of the L-shaped arm are two pieces arranged perpendicular to each other, and the two pieces are connected into one by an oblique connecting piece.

[0041] The first flexible hinge, the second flexible hinge, the third flexible hinge and the fourth flexible hinge are all straight beam flexible hinges. Compared with the straight circular and elliptical types, the straight beam flexible hinge has the characteristics of small deformation and small stress under the same conditions, and has the advantage of a large rotation range. It can well rely on the elastic deformation of the flexible hinge itself to achieve high-sensitivity displacement transmission between different mechanisms. The thickness of the straight beam flexible hinge is preferably 1 to 1.5 mm. The thickness of the straight beam flexible hinge is further preferably 1.3 to 1.4 mm. The thickness of the hinge has the most obvious effect on the overall performance. The length and width have a certain effect, but the relative effect is small. In addition, considering the volume reasons, adjusting the length and width of the hinge will cause the overall volume to change, and the corresponding other components must change adaptively, so the thickness is mainly optimized and adjusted.

[0042] The first flexible hinge is divided into two sections, and a rigid transition block is connected between the two sections. The first flexible hinge is divided into two sections and transitioned through the rigid transition block to prevent the hinge from breaking due to being too thin during use, thereby playing a role in strengthening the structure.

[0043] The material used for the piezoelectric stack displacement amplification mechanism is AL7075 aluminum alloy. The micro-displacement flexible amplification mechanism mainly transmits displacement and force through the elastic deformation of the flexible hinge. At the same time, it will be subjected to tension, compression, bending, torsion and shearing during operation. Therefore, the material properties such as Poisson's ratio, density, tensile strength, etc. have a very important influence on the performance of the flexible amplification mechanism. The piezoelectric stack displacement amplification mechanism described in this application uses AL7075 aluminum alloy as the material of the two-stage combined micro-displacement amplification mechanism, which can well withstand the two deformations of stretching and bending during the operation of the micro-displacement amplification mechanism, and meet the requirements of high load, light weight, service life and high precision.

[0044] In the present application, the excitation element at the input end is a piezoelectric stack, and the stacked piezoelectric ceramic used is a piezoelectric ceramic displacement actuator produced by Zhejiang Shenlei Ultrasonic Materials Factory.

[0045] like Figures 4-5 As shown, the present invention Figures 1 to 3 The piezoelectric stack displacement amplification mechanism of the structure shown is modeled. Figure 4 The figure is a schematic diagram of a straight beam type flexible hinge, where l is the length of the flexible hinge, b is the width of the flexible hinge, and t is the thickness of the flexible hinge. The formula of its flexibility matrix is ​​obtained based on mechanical analysis as follows:

[0046]

[0047] In the formula, E represents the Young's modulus of the material, and C represents the flexibility matrix of the corresponding straight beam type flexible hinge.

[0048] Static modeling and analysis of the two-stage combined piezoelectric stack displacement amplification mechanism. Figure 5 is a schematic diagram of the connection between a rigid body and a hinge, where: Figure 5 a is a rigid body i connected to hinge k. Figure 5 b is the rigid body i and j connected by hinge k. By analyzing it, we can get the parameter K in the overall stiffness matrix K of the piezoelectric stack displacement amplification mechanism. ii and K ij They are:

[0049]

[0050]

[0051] The element K in the stiffness matrix ii represents the sum of the stiffness of all straight beam-type flexible hinges connected to the i-th rigid body, K ij It represents the sum of the stiffness of all straight beam-type flexible hinges connected to the i-th rigid body and the j-th rigid body at the same time, and K ij =K ji In the formula, αij is the coordinate system O ik -XYZ relative to coordinate system O i -XYZ rotation angle; α ijk is the coordinate system O ijk -XYZ relative to coordinate system O i -XYZ rotation angle; α jik is the coordinate system O jik -XYZ relative to coordinate system O j -XYZ rotation angle; S ijk is the translation transformation matrix, s Yijk 、sX ijk are the displacement values ​​in the Y-axis direction and the X-axis direction in the translation transformation. ρ represents the proportional coefficient, which is related to the properties of the matrix itself.

[0052] The displacement amplification ratio, input and output stiffness of the two-stage combined micro-displacement amplification mechanism are calculated as follows:

[0053]

[0054] In the formula, the displacement magnification ratio, input stiffness and output stiffness are λ, K in , K out . C ij represents the i-th row and j-th column of the flexibility matrix C, for example, C 23,2 represents the 23rd row and 2nd column of the flexibility matrix C, F in Indicates the load acting on the input end, F out represents the load acting on the output end and along the main working direction, q out represents the output displacement at the output end and along the main working direction, q in Represents the input displacement at the input and along the main working direction.

[0055] like Figures 6-7 As shown in the figure, the thickness of the straight beam flexible hinge is modeled and simulated. Figure 6 It can be calculated that when the thickness of the output straight beam type flexible hinge (including the second flexible hinge and the third flexible hinge) is set to 1mm, the magnification ratios of the three different thickness straight beam type flexible hinges are: 23.518, 23.622, 23.654. ​​By comparison, it is found that the magnification of the input straight beam type flexible hinge is similar when the thickness is 1.4mm and 1.3mm, which is relatively better than the case of 1.5mm thickness, but the overall difference between the three different thickness straight beam type flexible hinges is not very large. Considering the stability, service life and structural strength of the magnification mechanism, 1.4mm is finally selected as the thickness of the input straight beam type flexible hinge.

[0056] Figure 7To select the size (the thickness of the flexible hinge is selected as 1.4mm, and the specific sizes of other magnification mechanisms are as follows Figure 8 From the static simulation stress cloud diagram of the two-stage combined piezoelectric stack displacement amplifier mechanism (shown in Figure 1), it can be found that the places with high stress mainly occur in the part where the L-type lever mechanism connects with the half-bridge amplifier mechanism, as well as the output end flexible hinge and the input end flexible hinge. At the same time, the maximum stress is also much smaller than the allowable stress of AL7075, meeting the use requirements and safety standards.

[0057] like Figure 8 This is the design diagram of the optimized two-stage combined piezoelectric stack displacement amplification mechanism and some of its main parameters.

[0058] Figures 9-10 For the experimental test of the amplification ratio of the piezoelectric stack displacement amplification mechanism, the stacked piezoelectric ceramics used are piezoelectric ceramic displacement actuators produced by Zhejiang Shenlei Ultrasonic Materials Factory, the displacement sensor used is the spectral confocal sensor TC-1200 produced and provided by Suzhou Chuangshi Intelligent Technology Co., Ltd., and the displacement sensor controller used is a dual-channel controller produced by Suzhou Chuangshi Intelligent Technology Co., Ltd. Signal generators and signal amplifiers are used to provide electrical signals for the stacked piezoelectric ceramics.

[0059] like Fig. 9Use nuts to fix the experimental model on a smooth wooden board, and then fix the wooden board on a smooth and horizontal tabletop with a clamp. Fix the stacked piezoelectric ceramics on the two-stage combined piezoelectric stack displacement amplification mechanism model through a fixing block, and ensure that the displacement generated by the stacked piezoelectric ceramics during experimental measurement is parallel to the horizontal plane, and no additional displacement in other directions will be generated. The fixing block is clamped between the fixed end and the piezoelectric ceramics, and the two sides are tightened. The piezoelectric stack and the displacement input end are tightened and fixed by applying a pre-tightening force through the fixing block. Place a spectral confocal sensor TC-1200 on each side, respectively, and align it with the input and output ends of the two-stage combined micro-displacement amplification mechanism model. First, use clean standard A4 paper to raise the two sensors so that their light spots can be aligned with the center of the input and output ends, and then perform system calibration on the two spectral confocal sensors TC-1200. Use the function of the supporting software to calibrate the lens. When the peak is in the middle of the white window, it means that the calibration has been completed. Set the position at this time as the test zero point. A DC signal is output, and the stacked piezoelectric ceramic generates a displacement due to the inverse piezoelectric effect. This displacement will generate a tiny displacement at the input end of the two-stage combined micro-displacement amplifier due to the squeezing effect. Then, this tiny input displacement is amplified in two stages and then outputs an amplified displacement from the output end. At the same time, the two spectral confocal sensors TC-1200 can obtain the displacement changes of the input and output ends respectively, and transmit them to the supporting control software in the computer through the dual-channel controller. After the system is stable, the data of the two channels within a period of time are obtained, and then the amplification factor of the two-stage combined micro-displacement amplifier is obtained by sorting and calculating the data.

[0060] In order to obtain more accurate experimental results, the power supply voltage was controlled to be different under the same conditions, 30V, 60V, 90V, 120V and 150V, and the system was measured multiple times. The sampling frequency during the experiment was 2ms. Each group of experiments collected valid data within a period of time. The measured and sorted experimental data were plotted as follows: Fig.10 It can be found that as the voltage increases, the amplification ratio will also increase, but the increase is small. After testing with a rated voltage of 150V, it is found that the amplification factor of the two-stage combined micro-displacement amplification mechanism is 20.12, which is ideal. Due to external interference, experimental instrument calibration deviation and other factors, there is a slight error between the simulation result and 23.622.

Claims

1. A piezoelectric stack displacement amplification mechanism, characterized in that: It includes a fixed end, an input end and an output end, wherein the input end and the output end are subjected to displacement amplification through an L-shaped primary amplification mechanism and a half-bridge secondary amplification mechanism, wherein the L-shaped primary amplification mechanism includes two symmetrically arranged L-shaped arms, and the half-bridge secondary amplification mechanism includes two symmetrically arranged half-bridge structures; One end of the two L-shaped arms is arranged opposite to each other and is connected to the input end through a first flexible hinge respectively, the other end of the two L-shaped arms is connected to a half-bridge structure through a second flexible hinge respectively, and the two half-bridge structures are connected to the output end through a third flexible hinge respectively; The two L-shaped arms are also connected to the fixed end at one end connected to the input end through a fourth flexible hinge, and the connection structures are symmetrically arranged.

2. The piezoelectric stack displacement amplification mechanism according to claim 1, characterized in that: The fixed end is located within the enclosed area of ​​the two L-shaped arms, and the input end is located outside the enclosed area of ​​the two L-shaped arms.

3. The piezoelectric stack displacement amplification mechanism according to claim 2, characterized in that: The first flexible hinge, the second flexible hinge and the fourth flexible hinge are respectively connected to the long side of the L-shaped arm.

4. The piezoelectric stack displacement amplification mechanism according to claim 1, characterized in that: The connection between the two ends of the L-shaped arm is bent inwardly for connection.

5. The piezoelectric stack displacement amplification mechanism according to claim 1, characterized in that: The first flexible hinge, the second flexible hinge, the third flexible hinge and the fourth flexible hinge are all straight beam flexible hinges.

6. The piezoelectric stack displacement amplification mechanism according to claim 5, characterized in that: The thickness of the straight beam flexible hinge is 1 to 1.5 mm.

7. The piezoelectric stack displacement amplification mechanism according to claim 6, characterized in that: The thickness of the straight beam flexible hinge is 1.3 to 1.4 mm.

8. The piezoelectric stack displacement amplification mechanism according to claim 5, characterized in that: The first flexible hinge is divided into two sections, and a rigid transition block is connected between the two sections.

9. The piezoelectric stack displacement amplification mechanism according to claim 1, characterized in that: The material used for the piezoelectric stack displacement amplification mechanism is AL7075 aluminum alloy.

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