Composition, method for producing composition, and method for producing silver film

Abstract

Provided is a composition containing (A) a compound represented by general formula (1), (B) a compound represented by general formula (2), and (C) a silver compound. (In formula (1), R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1-5 carbon atoms. ) (In formula (2), R3 and R4 each independently represent a hydrogen atom, a sodium atom, a potassium atom, or an alkyl group having 1-5 carbon atoms, and n represents 1 or 2. > # imgabs0 #

Description

Technical Field

[0001] The present invention relates to a composition containing a compound having a specific structure and a silver compound, a method for producing the composition, and a method for producing a silver film using the composition. Background Art

[0002] Silver film is a useful component showing high reflectivity and high conductivity among metal films, and is therefore used in fine wiring in electronic circuits, image devices, reflective materials, etc. Silver plating is one of the representative methods for manufacturing silver film. When forming a silver film by silver plating, it is required to form a silver film with good adhesion and surface flatness in order to obtain high connection reliability.

[0003] Various compositions have been reported as compositions for use as silver plating solutions. For example, Patent Document 1 discloses a cyanide-free silver plating bath containing silver hydroxyalkanesulfonate, potassium iodide, and p-aminobenzenesulfonic acid. Patent Document 2 discloses a silver plating bath containing silver isethionate, isethionic acid, and 3-aminopyrazole. Patent Document 3 discloses an electroless tin-silver alloy plating bath containing tin 2-hydroxyethanesulfonate, silver methanesulfonate, 2-hydroxyethanesulfonic acid, and thiourea. Prior art literature

[0004] Patent Literature Patent Document 1: Japanese Patent Publication No. 05-075837 Patent Document 2: Japanese Patent Application Publication No. 2007-327127 Patent Document 3: Japanese Patent Application Publication No. 2009-155703 Summary of the invention Problems to be solved by the invention

[0005] However, when silver plating is performed using the silver plating solutions described in Patent Documents 1 to 3, there is a problem that a silver film having excellent adhesion and surface flatness cannot be obtained.

[0006] Therefore, an object of the present invention is to provide a composition capable of obtaining a silver film having excellent adhesion and surface flatness. Means of solving problems

[0007] The present inventors have conducted repeated studies and have found that the above-mentioned problems can be solved by using a composition containing a compound having a specific structure and a silver compound, thereby completing the present invention.

[0008] That is, the present invention is a composition comprising (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), and (C) a silver compound.

[0009] [Chemistry 1]

[0010] (Where R 1 and R 2 Each independently represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms.)

[0011] [Chemistry 2]

[0012] (Where R 3 and R 4 Each independently represents a hydrogen atom, a sodium atom, a potassium atom or an alkyl group having 1 to 5 carbon atoms, and n represents 1 or 2.)

[0013] The present invention is also directed to a method for producing the composition, comprising the step of mixing the component (A), the component (B), the component (C), and a solvent.

[0014] Furthermore, the present invention is a method for producing a silver film, comprising the step of forming a silver film using the above-mentioned composition. Effects of the Invention

[0015] According to the present invention, a composition capable of obtaining a silver film having excellent adhesion and surface flatness can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic cross-sectional view of a substrate to be plated after a silver film is formed on the surface of the substrate to be plated by a silver plating method in an evaluation test. DETAILED DESCRIPTION

[0017] Hereinafter, embodiments of the present invention will be described in detail.

[0018] <Composition> The composition of the present invention contains (A) a compound represented by the above general formula (1) (hereinafter also referred to as "component (A)"), (B) a compound represented by the above general formula (2) (hereinafter also referred to as "component (B)"), and (C) a silver compound (hereinafter also referred to as "component (C)") as essential components.

[0019] In the above general formula (1), R 1 and R 2 Each independently represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms. 1 and R 2 The alkyl group having 1 to 5 carbon atoms represented by , for example, methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, pentyl, neopentyl, etc. From the viewpoint of being able to form a silver film with better adhesion and surface flatness, R 1 and R 2Each of them is independently preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and particularly preferably a methyl group. 1 and R 2 All are methyl.

[0020] Preferred specific examples of the compound represented by the general formula (1) include the following compounds No. 1 to No. 15. In the following compounds, "Me" represents a methyl group, "Et" represents an ethyl group, "nPr" represents an n-propyl group, and "nBu" represents an n-butyl group.

[0021] [Chemistry 3]

[0022] In the above general formula (2), R 3 and R 4 Each independently represents a hydrogen atom, a sodium atom, a potassium atom or an alkyl group having 1 to 5 carbon atoms. 3 and R 4 The alkyl group having 1 to 5 carbon atoms represented by , for example, methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, pentyl, neopentyl, etc. From the viewpoint of obtaining a silver film having better adhesion and surface flatness, R 3 It is preferably a hydrogen atom, a sodium atom, a potassium atom or an alkyl group having 1 to 3 carbon atoms, more preferably a hydrogen atom, a sodium atom or a potassium atom, and particularly preferably a hydrogen atom or a sodium atom. 4 It is preferably a hydrogen atom, a sodium atom, a potassium atom or an alkyl group having 1 to 3 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and particularly preferably a hydrogen atom.

[0023] In the above general formula (2), n represents 1 or 2. n is preferably 2 from the viewpoint of obtaining a silver film having better adhesion and surface flatness.

[0024] Preferred specific examples of the compound represented by the general formula (2) include the following compounds No. 16 to No. 27. In the following compounds, "Me" represents a methyl group, "Et" represents an ethyl group, and "iPr" represents an isopropyl group.

[0025] [Chemistry 4]

[0026] The silver compound as the component (C) may be any silver compound that is a source of silver ions, and for example, silver isethionate, silver histidine, silver hydantoin, silver dimethylhydantoin, silver citrate, silver nitrate, silver oxide, etc. may be used. One of these components (C) may be used alone, or two or more thereof may be used in combination. From the viewpoint of obtaining a silver film having better adhesion and surface flatness, as the component (C), silver isethionate, silver histidine, silver hydantoin, or silver dimethylhydantoin is preferably used, silver isethionate or silver dimethylhydantoin is more preferably used, and silver isethionate is most preferably used.

[0027] From the viewpoint of obtaining a silver film having excellent adhesion and surface flatness, the content of the component (B) is preferably 0.1 to 20 parts by mass, more preferably 0.3 to 10 parts by mass, and particularly preferably 1 to 5 parts by mass, relative to 100 parts by mass of the component (A) in the composition.

[0028] From the viewpoint of obtaining a silver film having excellent adhesion and surface flatness, the content of the component (C) is preferably 0.2 to 30 parts by mass, more preferably 0.5 to 20 parts by mass, and particularly preferably 2 to 10 parts by mass, relative to 100 parts by mass of the component (A) in the composition.

[0029] The concentration of the component (A) in the composition is not particularly limited, but is preferably 1 g / L to 500 g / L, more preferably 5 g / L to 200 g / L, particularly preferably 10 g / L to 100 g / L, and most preferably 20 g / L to 60 g / L from the viewpoint of obtaining a silver film having excellent adhesion and surface flatness.

[0030] The concentration of the component (B) in the composition is not particularly limited, but is preferably 0.1 g / L to 100 g / L, more preferably 0.3 g / L to 50 g / L, particularly preferably 0.5 g / L to 10 g / L, and most preferably 0.5 g / L to 3 g / L from the viewpoint of obtaining a silver film having excellent adhesion and surface flatness.

[0031] The concentration of the component (C) in the composition is not particularly limited, but is preferably 0.04 g / L to 400 g / L, more preferably 0.4 g / L to 40 g / L, particularly preferably 0.8 g / L to 20 g / L, and most preferably 2 g / L to 10 g / L from the viewpoint of obtaining a silver film having excellent adhesion and surface flatness.

[0032] The composition of the present invention may further contain (D) an amine compound, (E) a reducing agent, a stabilizer, a polymer surfactant, a pH adjuster, and the like as components other than the above-mentioned components (A) to (C).

[0033] As the (D) amine compound, for example, an alkylamine compound, an alkanolamine compound, etc. can be used. Specific examples of the alkylamine compound include: tetramethylammonium hydroxide, ethylenediamine, etc. Specific examples of the alkanolamine compound include: ethanolamine, 2-methylaminoethanol, diethanolamine, diisopropanolamine, etc. Among them, from the viewpoint of easy control of the plating speed, tetramethylammonium hydroxide, 2-methylaminoethanol, diisopropanolamine are preferred, and diisopropanolamine is more preferred. These (D) components can be used alone or in combination of two or more. From the same viewpoint, the concentration of the (D) component in the composition is preferably 0.1 g / L to 200 g / L, more preferably 1 g / L to 200 g / L, particularly preferably 10 g / L to 100 g / L, and most preferably 10 g / L to 70 g / L. It should be noted that the compound represented by the general formula (1) is not contained in the (D) component.

[0034] As the (E) reducing agent, any reducing agent can be used as long as it can reduce silver ions to form a silver film, for example, hydrazine compounds, aldehyde compounds, hypophosphites, hydroxylamine compounds, polyphenol compounds, borane compounds, etc. can be used. Specific examples of hydrazine compounds include: hydrazine, etc. Specific examples of aldehyde compounds include: formaldehyde, glyoxylic acid, etc. Specific examples of hypophosphites include: sodium hypophosphite, etc. Specific examples of hydroxylamine compounds include: hydroxylamine sulfate, etc. Specific examples of polyphenol compounds include: hydroquinone, etc. Specific examples of borane compounds include: dimethylamine borane, etc. Among them, from the viewpoint of easy control of the plating speed, hydrazine compounds and aldehyde compounds are preferred, hydrazine, formaldehyde and glyoxylic acid are more preferred, and glyoxylic acid is most preferred. These (E) components can be used alone or in combination of two or more. From the same viewpoint, the concentration of the component (E) in the composition is preferably 0.1 g / L to 100 g / L, more preferably 1 g / L to 50 g / L, and particularly preferably 5 g / L to 20 g / L.

[0035] As a stabilizer, any stabilizer that can prevent the silver ions from being undesirably reduced by light or by adding a reducing agent and can retain the silver ions in the plating solution can be used, for example, thiosulfate, thiocyanate, iodide salt, cyanide, heterocyclic amine compound, polycarboxylic acid and its salt, polyphosphonic acid and its salt, etc. can be used. As specific examples of these compounds, sodium thiosulfate, potassium thiocyanate, potassium iodide, potassium cyanide, imidazole, pyrazole, triazole, benzotriazole, ethylenediaminetetraacetic acid, ethylenediaminetetramethylenephosphonic acid, etc. can be cited. These stabilizers can be used alone or in combination of two or more. The concentration of the stabilizer in the composition varies depending on the type of the stabilizer, preferably about 1g / L to 100g / L. By combining the stabilizer at an appropriate concentration, a plating solution with better adhesion and surface flatness and excellent stability can be prepared.

[0036] As a high molecular surfactant, for example, an oxygen-containing high molecular organic compound can be used. Specific examples of oxygen-containing high molecular organic compounds include polyethylene glycol, polypropylene glycol, polyoxyethylene-polyoxypropylene random copolymers, polyoxyethylene-polyoxypropylene block copolymers, polyoxyethylene alkyl ethers, polyoxyethylene alkyl phenyl ethers, etc. Among them, polyethylene glycol and polyoxyethylene alkyl phenyl ethers are preferred. From the viewpoint of further improving the effect of the present invention, the weight average molecular weight of the oxygen-containing high molecular organic compound is preferably 300 to 100,000, and more preferably 500 to 10,000. Polyethylene glycol or polyoxyethylene alkyl phenyl ether having a weight average molecular weight of 500 to 5000 is particularly preferred. From the same viewpoint, the concentration of the oxygen-containing high molecular organic compound in the composition is preferably 0.05 g / L to 50 g / L, and more preferably 0.5 g / L to 10 g / L. It should be noted that the weight average molecular weight can be measured using GPC (Tosoh HLC-8320GPC) or the like.

[0037] As the pH adjuster, potassium hydroxide, sodium hydroxide, sulfuric acid, hydrochloric acid, phosphoric acid, sulfurous acid, etc. are preferably used. These pH adjusters may be used alone or in combination of two or more to adjust the plating solution to a desired pH.

[0038] The composition of the present invention may also contain a solvent. As the solvent, a known solvent in the plating solution can be used. Here, a substance that is liquid at 25°C under atmospheric pressure is defined as a solvent. Examples of the solvent include: water; alcohols such as methanol, ethanol, isopropanol, n-butanol, ethylene glycol, 1,3-butanediol, and glycerol; acetates such as ethyl acetate, butyl acetate, and methoxyethyl acetate; tetrahydrofuran, tetrahydropyran, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, dibutyl ether, diethylene glycol dimethyl ... Ethers such as alkanes; ketones such as methyl butyl ketone, methyl isobutyl ketone, ethyl butyl ketone, dipropyl ketone, diisobutyl ketone, methyl amyl ketone, cyclohexanone, and methylcyclohexanone; hydrocarbons such as hexane, cyclohexane, methylcyclohexane, dimethylcyclohexane, ethylcyclohexane, heptane, octane, toluene, and xylene. These solvents can be used alone or in combination of two or more. Among them, water is preferred. The concentration of these solvents in the composition is preferably 700 g / L to 990 g / L, more preferably 800 g / L to 970 g / L, and most preferably 850 g / L to 950 g / L.

[0039] In the composition of the present invention, other additives known to be added to a plating solution may be used arbitrarily within a range not inhibiting the effects of the present invention.

[0040] Examples of other additives include anthraquinone derivatives, cationic surfactants, nonionic surfactants, anionic surfactants, amphoteric surfactants, alkanesulfonic acids, alkanesulfonates, alkanesulfonic acid esters, hydroxyalkanesulfonic acid esters, hydroxyalkanesulfonic acid organic acid esters, etc. (excluding compounds corresponding to component (B)). The concentration of these other additives in the composition is preferably 0.1 mg / L to 500 mg / L, more preferably 0.5 mg / L to 100 mg / L.

[0041] The pH of the composition of the present invention is not particularly limited, but is preferably an alkaline condition of 7.5 or more, more preferably an alkaline condition of 8 or more, and particularly preferably an alkaline condition of 8.5 or more. The upper limit of the pH of the composition of the present invention is not particularly limited, but is preferably 13 or less. The pH can be measured using a pH meter LAQUA F-70 manufactured by HORIBA. The temperature for measuring the pH can be about room temperature.

[0042] The composition of the present invention can be preferably used as a silver plating solution, and can be more preferably used as an electroless silver plating solution.

[0043] The method for preparing the composition of the present invention only needs to include the step of mixing the component (A), the component (B), the component (C), the solvent, and the amine compound (D), the reducing agent (E), the stabilizer, the polymer surfactant, the pH adjuster and other additives as needed. The mixing ratio of each component can be appropriately adjusted to the preferred concentration of each component.

[0044] <Method for producing silver film> As an example of a method for producing a silver film using the composition of the present invention, a method for producing a silver film using a silver plating method is described below. The method for producing a silver film of the present invention can be carried out in the same manner as a conventional silver plating method except that the composition of the present invention is used as a silver plating solution. Here, a case where a silver film is formed on a substrate to be plated is described.

[0045] As the silver-plating device, for example, a paddle stirring plating device can be used. The composition of the present invention is filled in the plating tank of the silver-plating device, and the plated substrate is immersed in the composition. The plated substrate can be, for example, a Si substrate, a SiO2 substrate, a SiN substrate, a Ni substrate, a NiB substrate, a Co substrate, a CoB substrate, a resist substrate, a TiO2 substrate, a TiN substrate, a TiAl substrate, a TaN substrate, a Cu substrate, a Ru substrate, a W substrate, a Ge substrate, a II IV compound substrate and a composite substrate thereof.

[0046] The temperature of the composition when forming the silver film can be, for example, 10° C. to 70° C., preferably 20° C. to 60° C. When the composition of the present invention is used as an electrolytic silver plating solution, the current density can be, for example, 0.01 A / dm 2~30A / dm 2 , preferably 0.05A / dm 2 ~10A / dm 2 , more preferably 0.1A / dm 2 ~5A / dm 2 The composition may be stirred by air stirring, rapid liquid flow stirring, mechanical stirring using stirring blades, or the like.

[0047] In the method for producing a silver film of the present invention, under the above-mentioned conditions, a silver film having excellent adhesion and surface flatness can be formed on a substrate to be plated.

[0048] Products on which the silver film produced using the composition of the present invention is formed are not particularly limited, and examples thereof include: automotive industry materials (radiators, carburetor parts, fuel injectors, cylinders, various valves, engine interiors, etc.), electronic industry materials, etc. (contacts, circuits, semiconductor packages, printed circuit boards, thin film resistors, capacitors, hard disks, magnetic bodies, lead frames, nuts, magnets, resistors, sockets, computer parts, electronic parts, laser oscillating elements, optical storage elements, optical fibers, filters, thermistors, heating elements, high temperature heating elements, varistors, magnetic heads, various sensors (gas, temperature, humidity, light, speed, etc.), MEMS, etc.), precision instruments (copier parts, optical equipment parts, watch parts, etc.), aviation and ship materials (hydraulic equipment, screws, engines, turbines, etc.), chemical industry materials (balls, valves, plugs, testers, etc.), various molds, machine tool parts, vacuum equipment parts, and the like. The method for producing a silver film of the present invention is particularly preferably used for electronic industry materials requiring fine patterns, and among them, it is preferably used for the production of optical equipment parts, and is particularly preferably used for sensor devices.

[0049] <Other> In the present disclosure, the following embodiments can be mentioned. [1] A composition comprising: (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), and (C) a silver compound,

[0050] [Chemistry 5]

[0051] (Where R 1 and R 2 Each independently represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms.)

[0052] [Chemistry 6]

[0053] (Where R 3 and R 4 Each independently represents a hydrogen atom, a sodium atom, a potassium atom or an alkyl group having 1 to 5 carbon atoms, and n represents 1 or 2.) [2] The composition according to [1], wherein the component (C) is at least one selected from the group consisting of silver isethionate, silver histidine, silver hydantoin, and silver dimethylhydantoin. [3] The composition according to [1] or [2], further comprising (D) an amine compound. [4] The composition according to any one of [1] to [3], further comprising (E) a reducing agent. [5] The composition according to any one of [1] to [4], which is a silver plating solution. [6] The composition according to [5], which is an electroless silver plating solution. [7] The composition as described in [5] or [6], wherein the concentration of the above-mentioned component (A) is 1 g / L to 500 g / L, the concentration of the above-mentioned component (B) is 0.1 g / L to 100 g / L, and the concentration of the above-mentioned component (C) is 0.04 g / L to 400 g / L. [8] The method for producing the composition according to any one of [1] to [7], comprising the step of mixing the component (A), the component (B), the component (C), and a solvent. [9] A method for producing a silver film, comprising the step of forming a silver film using the composition according to any one of [1] to [7].

[0054] The present disclosure is not limited to the above-mentioned embodiments. The above-mentioned embodiments are merely examples, and any embodiments having substantially the same configuration and having the same functions and effects as the technical concept described in the claims of the present disclosure are included in the technical scope of the present disclosure. Example

[0055] Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples and the like.

[0056] The (A) component and the comparative components used in Examples and Comparative Examples are shown below. a-1: Compound No.6 a-2: Compound No.1 a-3: imidazole a-4: pyrazole

[0057] The (B) component and the comparative components used in Examples and Comparative Examples are shown below. b-1: Compound No.22 b-2: Compound No.23 b-3: citric acid b-4: Methanesulfonic acid

[0058] The (C) component used in Examples and Comparative Examples is as follows. c-1: Silver isethionate c-2: Silver dimethylhydantoin

[0059] The (D) component used in Examples and Comparative Examples is as follows. d-1: diisopropanolamine d-2: Tetramethylammonium hydroxide d-3: 2-methylaminoethanol

[0060] The (E) component used in Examples and Comparative Examples is as follows. e-1: Glyoxylic acid e-2: Formaldehyde

[0061] [Examples 1-10] According to the composition shown in Table 1, the components (A), (B), (C), (D), (E), additives and water were mixed to obtain the silver plating solutions of Examples 1 to 10. As additives, 10 g / L of imidazole and 10 g / L of ethylenediaminetetramethylenephosphonic acid were added to each silver plating solution. The remainder (remainder) in the composition of the silver plating solution shown in Table 1 was water, and the concentration of each component was adjusted with water.

[0062] [Table 1]

[0063] [Comparative Examples 1 to 7] According to the composition shown in Table 2, the components (A), (B), (C), (D), (E), additives and water were mixed to obtain the silver plating solutions of Comparative Examples 1 to 7. As additives, 10 g / L of imidazole and 10 g / L of ethylenediaminetetramethylenephosphonic acid were added to each silver plating solution. The remainder (remainder) in the composition of the silver plating solution shown in Table 2 was water, and the concentration of each component was adjusted with water.

[0064] [Table 2]

[0065] [Evaluation Examples 1 to 10, Comparative Evaluation Examples 1 to 7] As a silver plating device, a paddle stirring type plating device is used, and the silver plating solutions of Examples 1 to 10 and Comparative Examples 1 to 7 are respectively filled in the plating tank of the paddle stirring type plating device. The substrates to be plated are respectively immersed in the respective silver plating solutions. As the substrate to be plated, a substrate having a NiB layer formed on a Si substrate having a SiO2 layer on the surface is used. Then, a silver film is formed on the substrate to be plated by an electroless silver plating method under the following plating conditions. (Plating conditions) (1) Liquid temperature: 25℃ (2) Plating time: 3 minutes

[0066] In Evaluation Examples 1 to 10 and Comparative Evaluation Examples 1 to 7, Figure 1 As shown, the surface of the silver film 1 formed on the surface of the plated substrate 2 was observed by a scanning probe microscope (manufactured by BRUKER, model: MultiMode 8), and the surface roughness Ra of the silver film 1 was measured. In addition, the peeling of the obtained silver film was visually confirmed. The results are shown in Table 3.

[0067] [Table 3] Silver plating solution Ra(nm) Whether there is peeling Evaluation Example 1 Example 1 1.0 none Evaluation Example 2 Example 2 1.3 none Evaluation Example 3 Example 3 1.3 none Evaluation Example 4 Example 4 1.4 none Evaluation Example 5 Example 5 1.4 none Evaluation Example 6 Example 6 1.2 none Evaluation Example 7 Example 7 1.5 none Evaluation Example 8 Example 8 1.1 none Evaluation Example 9 Example 9 1.5 none Evaluation Example 10 Example 10 1.8 none Comparative Evaluation Example 1 Comparative Example 1 3.5 have Comparative Evaluation Example 2 Comparative Example 2 2.2 have Comparative Evaluation Example 3 Comparative Example 3 Cannot form silver film - Comparative Evaluation Example 4 Comparative Example 4 2.6 have Comparative Evaluation Example 5 Comparative Example 5 2.9 have Comparative Evaluation Example 6 Comparative Example 6 4.0 have Comparative Evaluation Example 7 Comparative Example 7 3.7 have

[0068] The smaller the Ra value of the silver film, the more a silver film with excellent surface flatness can be formed. In addition, in the case where there is no peeling of the silver film, it means that a silver film with excellent adhesion can be formed. According to the results of Table 3, compared with comparative evaluation examples 1 to 7, in evaluation examples 1 to 10, a silver film with excellent surface flatness can be formed without peeling of the silver film. In particular, in evaluation examples 1, 6, and 8, a silver film with particularly excellent surface flatness can be formed.

[0069] As described above, it is known that a silver film having excellent adhesion and surface flatness can be formed on a substrate to be plated by a silver plating method using the composition of the present invention.

[0070] Description of Reference Numerals 1 Silver film 2. Plated substrate

Claims

1. A composition comprising: (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), and (C) a silver compound, In the formula, R 1 and R 2 each independently represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, In the formula, R 3 and R 4 Each independently represents a hydrogen atom, a sodium atom, a potassium atom or an alkyl group having 1 to 5 carbon atoms, and n represents 1 or 2.

2. The composition according to claim 1, wherein The component (C) is at least one selected from the group consisting of silver isethionate, silver histidine, silver hydantoin, and silver dimethylhydantoin. 3 . The composition according to claim 1 , further comprising (D) an amine compound.

4. The composition according to claim 1 or 2, further comprising (E) a reducing agent.

5. The composition according to claim 1 or 2, which is a silver plating solution. The composition according to claim 5 , which is an electroless silver plating solution.

7. The composition of claim 5, wherein The concentration of the component (A) is 1 g / L to 500 g / L, the concentration of the component (B) is 0.1 g / L to 100 g / L, and the concentration of the component (C) is 0.04 g / L to 400 g / L. 8 . The method for producing the composition according to claim 1 , comprising the step of mixing the component (A), the component (B), the component (C) and a solvent.

9. A method for producing a silver film, comprising the step of forming a silver film using the composition according to claim 1 or 2.

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