System for processing micro-hemispherical harmonic oscillator based on carbon dioxide laser

Abstract

According to the system for machining the micro-hemispherical harmonic oscillator based on the carbon dioxide laser, the glass substrate is heated and softened through the carbon dioxide laser, and the energy utilization rate is higher. The horizontal displacement table drives the forming mold to move until the center coincides with the center of a laser spot, so that the positioning accuracy of a processing area is ensured; the diameter of the laser beam is adjusted through the beam expander, it is guaranteed that the diameter of a laser spot is larger than that of the to-be-machined micro-hemispherical harmonic oscillator, and the accuracy of a machining area is guaranteed. The forming mold and the glass substrate are driven to rotate through the rotating table, so that heat distribution of a processing area is relatively balanced, the size deviation of the micro-hemispherical harmonic oscillator caused by unbalanced heat distribution is avoided, and the processing quality of the micro-hemispherical harmonic oscillator is improved. Compared with a traditional method for softening the glass substrate through flame heating, all technological parameters in the machining process can be accurately controlled, the method has the advantages of being easy to operate and high in automation integration degree, and the micro-hemispherical harmonic oscillators high in forming precision and good in batch consistency can be machined.

Description

Technical Field

[0001] The present application relates to the technical field of micro-hemispherical resonant gyroscopes, and in particular to a system for processing micro-hemispherical resonators based on carbon dioxide lasers. Background Art

[0002] The micro-hemispherical resonator gyroscope is a high-precision gyroscope based on micro-electromechanical system (MEMS) technology. It inherits the advantages of MEMS gyroscopes and effectively improves the accuracy and performance of gyroscopes by adopting high-quality micro-hemispherical resonators and advanced manufacturing processes. It has broad application prospects in inertial navigation, aerospace, automotive industry, consumer electronics and other fields.

[0003] The micro-hemispherical resonator is the core component of the micro-hemispherical resonator gyroscope. Its structural size, shape accuracy and surface quality directly affect the measurement accuracy of the gyroscope. At present, the processing methods of micro-hemispherical resonators are mainly divided into micro-mold method and high-temperature blowing method. The advantages of the high-temperature blowing method include: it can produce micro-hemispherical resonators with smooth surface, high symmetry and high performance, which can be mass-produced and suitable for large-scale manufacturing, which helps to improve production efficiency and reduce costs.

[0004] At present, in the high-temperature blowing method, the heat source for softening the molten glass substrate is usually a combustion gas (using fuel gas and oxygen) or a flame generated by a hydrogen-oxygen water welding machine. The flame generated by fuel gas contains carbides, which may adhere to the surface of the resonator. In addition, the storage of fuel gas is unsafe, and there is a risk of explosion of high-pressure gas cylinders. The flame generated by the hydrogen-oxygen water welding machine through the electrolysis of water produces oxygen and hydrogen, which has no pollution caused by the combustion of carbides and is safe to store, but the ratio of oxygen and hydrogen cannot be controlled, and the flame temperature and size are difficult to control accurately. During the processing, it is difficult to accurately control all process parameters, which may affect the consistency and quality of the micro-hemispherical resonator. Summary of the invention

[0005] Based on this, it is necessary to provide a system for processing micro-hemispherical resonators based on carbon dioxide laser to address the problems existing in the prior art.

[0006] A system for processing a micro-hemispherical resonator based on a carbon dioxide laser, the system comprising:

[0007] CO2 laser;

[0008] A horizontal displacement stage, on which a forming mold is arranged, and the forming mold is used to carry a glass substrate; the horizontal displacement stage is used to drive the forming mold to move so that the center of the forming mold coincides with the center of the laser spot projected onto the forming mold;

[0009] A beam expander is located on the transmission light path between the carbon dioxide laser and the molding die, so that the diameter of the laser spot projected onto the molding die is larger than the diameter of the micro-hemispherical resonator to be processed;

[0010] The rotating table is arranged on the horizontal displacement table; the forming mold is connected to the rotating table, and the rotating table is used to drive the forming mold to rotate.

[0011] In one of the embodiments, the system includes a detection camera, which is used to detect the center position of the laser spot.

[0012] In one embodiment, the system further comprises a reflector, and the reflector is arranged on the transmission light path between the carbon dioxide laser and the beam expander.

[0013] In one embodiment, the system further includes a lifting platform, the beam expander is connected to the lifting platform, and the lifting platform is used to adjust the distance between the beam expander and the reflector.

[0014] In one embodiment, the system further comprises a shaper disposed on a transmission light path between the carbon dioxide laser and the reflector, wherein the shaper is used to shape the Gaussian beam into a flat-top beam.

[0015] In one of the embodiments, a molding cavity is provided in the molding mold, and the molding mold absorbs the glass substrate through the molding cavity.

[0016] In one embodiment, the system further comprises a vacuum pump, wherein the vacuum pump is connected to the molding cavity.

[0017] In one of the embodiments, a support column is provided in the molding cavity;

[0018] Vacuum through holes are arranged on both sides of the support column, and the vacuum through holes are used to connect the molding cavity with the vacuum pump.

[0019] In one embodiment, the system further comprises a cooling mold connected between the forming mold and the rotating table.

[0020] In one embodiment, the cooling mold is connected to a pneumatic rotary joint, and the pneumatic rotary joint is used to connect to the air pipe of the vacuum pump; and / or,

[0021] One of the forming mold and the cooling mold is provided with a clamping column, and the other is provided with a clamping groove for clamping with the clamping column; and / or,

[0022] A heat insulation plate is arranged between the cooling mold and the rotating table.

[0023] The system based on carbon dioxide laser processing of micro-hemispherical resonators heats and softens the glass substrate through a carbon dioxide laser. Since the quartz material has a strong absorption effect on carbon dioxide laser, the energy utilization rate is higher and the processing efficiency is higher. The horizontal translation stage drives the forming mold to move to its center to coincide with the center of the laser spot to ensure the accuracy of positioning the processing area; the laser spot is enlarged by the beam expander to ensure that the size of the laser spot is larger than the diameter of the micro-hemispherical resonator to be processed, thereby ensuring the accuracy of the processing area. The rotating table drives the forming mold and the glass substrate to rotate, so that the heat distribution in the processing area is more balanced, avoiding the size deviation of the micro-hemispherical resonator caused by unbalanced heat distribution, thereby improving the processing quality of the micro-hemispherical resonator. Compared with the traditional method of flame heating to soften the glass substrate, the heating temperature and area can be accurately controlled by adjusting the laser power and the spot size, and the temperature uniformity of the laser processing area is also better. All process parameters in the processing process can be accurately controlled, with the characteristics of simple operation and high automation integration, and micro-hemispherical resonators with high forming accuracy and good batch consistency can be processed. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIG1 is a schematic diagram of a system for processing a micro-hemispherical resonator based on a carbon dioxide laser according to an embodiment of the present application.

[0025] FIG. 2 is a partial schematic diagram of the system for processing a micro-hemispherical resonator based on a carbon dioxide laser as shown in FIG. 1 .

[0026] FIG. 3 is a schematic diagram of a molding mold in the system for processing a micro-hemispherical resonator based on a carbon dioxide laser as shown in FIG. 1 .

[0027] FIG. 4 is a flowchart of the working process of the system for processing micro-hemispherical resonators based on carbon dioxide laser shown in FIG. 1 .

[0028] Figure numbers: 110, carbon dioxide laser; 120, shaper; 130, reflector; 140, beam expander; 210, horizontal translation stage; 220, rotating stage; 230, lifting translation stage; 310, molding mold; 311, molding cavity; 312, supporting column; 313, vacuum through hole; 320, cooling mold; 321, pneumatic rotary joint; 330, heat insulation board; 340, base; 350, vacuum pump; 360, air pipe; 410, detection camera; 420, host computer; 430, controller; 440, communication control line; 1000, glass substrate. DETAILED DESCRIPTION

[0029] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0030] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0031] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0032] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0033] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0034] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0035] Referring to FIGS. 1 to 3 , a system for processing a micro-hemispherical resonator based on a carbon dioxide laser is provided in one embodiment of the present application, comprising a carbon dioxide laser 110, a horizontal displacement stage 210, a rotating stage 220 and a beam expander 140; the carbon dioxide laser 110 can emit a continuous carbon dioxide laser, a forming mold 310 is arranged on the horizontal displacement stage 210, and the forming mold 310 is used to carry a glass substrate 1000; the horizontal displacement stage 210 is used to drive the forming mold 310 to move so that the center of the forming mold 310 coincides with the center of the laser spot projected to the forming mold 310; the beam expander 140 is located on the transmission light path between the carbon dioxide laser 110 and the forming mold 310, so that the diameter of the laser spot projected to the forming mold 310 is larger than the diameter of the micro-hemispherical resonator to be processed; the rotating stage 220 is arranged on the horizontal displacement stage 210; the forming mold 310 is connected to the rotating stage 220, and the rotating stage 220 is used to drive the forming mold 310 to rotate.

[0036] The system for processing micro-hemispherical resonators based on carbon dioxide laser heats and softens the glass substrate 1000 through the carbon dioxide laser 110. Since the quartz material has a strong absorption effect on carbon dioxide laser, the energy utilization rate is higher and the processing efficiency is higher. The horizontal displacement stage 210 drives the forming mold 310 to move to its center to coincide with the center of the laser spot to ensure the accuracy of positioning the processing area; the diameter of the laser beam is adjusted by the beam expander 140 to achieve the amplification of the laser spot to control the area of ​​the laser processing area, and ensure that the size of the laser spot is larger than the diameter of the micro-hemispherical resonator to be processed, thereby ensuring the accuracy of the processing area. The rotating table 220 drives the forming mold 310 and the glass substrate 1000 to rotate, so that the heat distribution in the processing area is more balanced, avoiding the size deviation of the micro-hemispherical resonator caused by the unbalanced heat distribution, thereby improving the processing quality of the micro-hemispherical resonator. Compared with the traditional method of heating and softening the glass substrate 1000 with flames, the heating temperature and area can be accurately controlled by adjusting the laser power and the spot size, and the temperature uniformity of the laser processing area is also better. All process parameters in the processing can be precisely controlled, and the operation is simple and the automation integration is high. Micro-hemispherical resonators with high molding precision and good batch consistency can be processed. The glass substrate can be specifically high-purity quartz glass.

[0037] Among them, the horizontal displacement stage 210 can be an electric displacement stage, which can realize precise displacement control, and includes a guide rail module, such as a ball screw, a linear guide rail, etc., to ensure smooth and precise movement. It can also be equipped with a position sensor, such as a photoelectric encoder, a linear encoder, etc., for detecting the actual position of the displacement stage. In other embodiments, the displacement stage can also be a manual displacement stage, which is driven to move by a manual knob or a handwheel. It can be understood that the horizontal displacement stage 210 includes an X-axis displacement stage and a Y-axis displacement stage, and the Y-axis displacement stage can be set on the X-axis displacement stage. The molding mold 310 and the rotating stage 220 are set on the Y-axis displacement stage, and the position of the molding mold 310 is adjusted by the X-axis displacement stage and the Y-axis displacement stage so that its center coincides with the center of the laser spot. The rotating stage 220 can include a rotating motor, etc., and the molding mold 310 is driven to rotate by the rotating motor, so that the glass substrate 1000 is heated more evenly.

[0038] Referring to FIG. 1 , in one embodiment, the system includes a detection camera 410, and the detection camera 410 is used to detect the center position of the laser spot. The detection camera 410 can be a CCD camera, which is very sensitive to light, can capture images under very weak light, has high sensitivity, can provide high-resolution images, has low image noise, can provide clear image quality, has a long service life, and can work stably in various environments.

[0039] Referring to FIG. 1 , in one embodiment, the system further includes a reflector 130, and the reflector 130 is disposed on the transmission optical path between the CO2 laser 110 and the beam expander 140. By arranging the reflector 130, the laser beam path is adjusted, which not only extends the optical path of the beam, but also enables the laser beam after beam expansion to be focused, and such an arrangement makes more reasonable use of space.

[0040] Referring to FIG. 1 , in one embodiment, the system further includes a lifting platform 230, the beam expander 140 is connected to the lifting platform 230, and the lifting platform 230 is used to adjust the distance between the beam expander 140 and the reflector 130. The structure of the lifting platform 230 can refer to the aforementioned horizontal platform 210, and can achieve precise displacement control. The height of the beam expander 140 is adjusted by the lifting platform 230, so that the diameter of the laser beam can be more conveniently adjusted to control the area of ​​the laser processing area.

[0041] Referring to FIG. 1 , in one embodiment, the system further includes a shaper 120 disposed on the transmission light path between the carbon dioxide laser 110 and the reflector 130. The shaper 120 is used to shape the Gaussian beam into a flat-top beam, so that the heat distribution in the heated area of ​​the glass substrate 1000 is more uniform, thereby preventing the glass substrate 1000 from being heated unevenly due to the high temperature at the center and low temperature at both sides.

[0042] Referring to FIGS. 1 to 3 , in one embodiment, a molding cavity 311 is provided in the molding mold 310, and the molding mold 310 absorbs the glass substrate 1000 through the molding cavity 311. Specifically, the molding cavity 311 is a vacuum environment, and the glass substrate 1000 is fixed by negative pressure absorption, which can ensure the position stability of the glass substrate 1000 during the processing, and can also conveniently control the air pressure of each area in the molding cavity 311, and soften the glass substrate 1000 into a desired shape under the action of the internal and external pressure difference, and then process it into a micro-hemispherical resonator. The molding mold 310 can specifically be a graphite mold, which is made of graphite material. It has a very high melting point, can remain stable in a high temperature environment, and has a small thermal expansion coefficient, which is conducive to maintaining the dimensional accuracy of the finished product; the graphite mold can also provide uniform heat distribution, which helps to improve the quality consistency of the product; it is not easy to oxidize at high temperatures, which helps to extend the service life of the mold; compared with metal molds, graphite molds are lighter and easier to carry and install; graphite molds have higher strength and hardness and can withstand the pressure during casting or molding; graphite molds can be recycled and reused, reducing waste generation; due to the high efficiency of thermal conductivity and lightweight characteristics of graphite molds, energy consumption during heating can be reduced.

[0043] Referring to FIG. 1 , in one embodiment, the system further includes a vacuum pump 350, and the vacuum pump 350 is connected to the molding cavity 311. The gas in the molding cavity 311 is discharged through the vacuum pump 350 to form a negative pressure environment, so as to better adsorb and fix the glass substrate 1000 located on the molding mold 310. The vacuum pump 350 can be specifically a rotary vane pump, which compresses and discharges the gas through rotating blades.

[0044] Referring to FIGS. 1 to 3 , in one embodiment, a support column 312 is provided in the middle of the molding cavity 311, and the middle of the glass substrate 1000 is supported by the support column 312, so that the glass substrate 1000 can form a micro-hemispherical resonator under the action of the air pressure difference after being heated and softened. Correspondingly, vacuum through holes 313 are provided on both sides of the support column 312, and the vacuum through holes 313 are used to connect the molding cavity 311 with the vacuum pump 350. By providing a plurality of vacuum through holes 313, it is helpful to control the air pressure in different areas of the molding cavity 311, and then the softened glass substrate 1000 is processed into a micro-hemispherical resonator of a corresponding shape under the action of the internal and external air pressure difference.

[0045] Referring to Figures 1 to 3, in one embodiment, the system also includes a cooling mold 320 connected between the molding mold 310 and the rotating table 220. The function of the cooling mold 320 is to extract the heat of the molding mold 310, so that the molding mold 310 is cooled, and then it is convenient to take out the micro-hemispherical resonator in the molding mold 310. The cooling mold 320 can be a mold made of stainless steel. The stainless steel mold has good corrosion resistance and high temperature resistance. The heat of the molding mold 310 is transferred to the cooling mold 320, and heat exchange is performed with the air through the cooling mold 320, so as to realize heat extraction. Furthermore, a liquid cooling channel or an air cooling structure can also be provided inside the cooling mold 320 to improve the cooling efficiency.

[0046] As shown in FIG. 2 , in some embodiments, one of the forming mold 310 and the cooling mold 320 is provided with a clamping column, and the other is provided with a clamping groove. The connection between the forming mold 310 and the cooling mold 320 is achieved through the clamping cooperation between the clamping column and the clamping groove, so that the rotating table 220 drives the cooling mold 320 and the forming mold 310 to rotate synchronously. Specifically in this embodiment, the lower end of the forming mold 310 is provided with a clamping groove, and the upper end of the cooling mold 320 is provided with a clamping column. Of course, the setting positions of the clamping column and the clamping groove can be interchanged. In other embodiments, the forming mold 310 and the cooling mold 320 can also be fastened by fasteners such as bolts.

[0047] As shown in FIG2 , in some embodiments, the cooling mold 320 and the rotating table 220 can be fastened by fasteners, and threaded holes are provided on the cooling mold 320 and the rotating table 220, and fasteners such as bolts are passed through the threaded holes on the cooling mold 320 and the rotating table 220 to achieve the connection between the cooling mold 320 and the rotating table 220. Furthermore, a countersunk hole is provided on the cooling mold 320, and the design of the countersunk hole enables the fastener head to be embedded in the threaded hole and be flush with the surface of the cooling mold 320 or slightly lower than the surface of the cooling mold 320, so as to avoid interference caused by the protrusion of the fastener and improve the flatness and aesthetics of the surface of the cooling mold 320.

[0048] Referring to Figures 1 to 3, in one embodiment, the cooling mold 320 is connected to a pneumatic rotary joint 321, and the pneumatic rotary joint 321 is used to connect to the air pipe 360 ​​of the vacuum pump 350. When the molding mold 310 rotates, the air pipe 360 ​​is kept stationary by the pneumatic rotary joint 321, so that the gas can flow smoothly, while maintaining good sealing performance to prevent gas leakage.

[0049] Referring to FIGS. 1 to 3 , in some embodiments, a heat insulating plate 330 is provided between the cooling mold 320 and the rotating table 220. The heat insulating plate 330 may be made of glass fiber and resin, may withstand a high temperature of 1000 degrees Celsius, and has a relatively low heat conduction system and good heat insulation performance, thereby preventing the heat of the molding mold 310 from being transferred to the rotating table 220 to affect the working stability of the rotating table 220, and keeping the rotating table 220 always within the working temperature range, thereby ensuring the reliability of the rotating table 220 driving the glass substrate 1000 to rotate, and making the heat distribution in the processing area of ​​the glass substrate 1000 relatively balanced.

[0050] As shown in FIG1 , in some embodiments, the system further includes a base 340, which is connected between the rotating table 220 and the horizontal translation table 210, and the rotating table 220, the cooling mold 320, and the molding mold 310 are supported by the base 340 to improve the overall support effect. The side of the base 340 may be provided with a perforation, and the air pipe 360 ​​of the vacuum pump 350 is connected to the molding cavity 311 through the perforation.

[0051] As shown in FIG1 , it can be understood that the system further includes a controller 430 and a host computer 420. The host computer 420 is connected to the controller 430, the detection camera 410, and the carbon dioxide laser 110 through a communication control line 440. The host computer 420 and the controller 430 control the heating power of the carbon dioxide laser 110, the movement of the horizontal displacement stage 210 and the lifting displacement stage 230, the rotation speed of the rotating stage 220, the imaging of the detection camera 410, and the vacuum degree of the glass substrate 1000 and the cavity of the molding mold 310, and other process parameters, thereby improving the processing quality of the micro-hemispherical resonator, and having the characteristics of simple operation and high automation integration.

[0052] As shown in FIG4 , the workflow of the system is described below: during processing, firstly, the feed amount of the horizontal displacement stage 210 is adjusted so that the center of the molding mold 310 and the center of the laser spot projected onto the molding mold 310 are aligned; then, the lifting displacement stage 230 is adjusted so that the beam expander 140 moves upward to amplify the laser spot so that the diameter of the laser spot is larger than the diameter of the micro-hemispherical resonator; then, the glass substrate 1000 is placed on the molding mold 310, and the air pressure in the molding cavity 311 of the molding mold 310 is adjusted so that the glass substrate 1000 is 000 is firmly fixed on the forming mold 310; the rotation speed of the rotating table 220 is set so that it can drive the forming mold 310, the cooling mold 320 and the glass substrate 1000 to rotate at a high speed to avoid the size deviation of the micro-hemispherical resonator caused by the unbalanced heat distribution; finally, the laser power and duration of the carbon dioxide laser 110 are controlled so that the glass substrate 1000 gradually softens under the heating of the carbon dioxide laser, and the glass substrate 1000 forms a micro-hemispherical resonator under the action of the internal and external pressure difference by controlling the air pressure in different areas. After the forming mold 310 is cooled, the micro-hemispherical resonator can be taken out from the forming cavity 311.

[0053] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0054] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A system based on carbon dioxide laser processing of micro-hemispherical resonators, characterized in that: The system for processing micro-hemispherical resonators based on carbon dioxide laser comprises: CO2 laser (110); A horizontal displacement stage (210), wherein a molding mold (310) is arranged on the horizontal displacement stage (210), and the molding mold (310) is used to carry a glass substrate (1000); the horizontal displacement stage (210) is used to drive the molding mold (310) to move so that the center of the molding mold (310) coincides with the center of a laser spot projected onto the molding mold (310); A beam expander (140) is located on a transmission light path between the carbon dioxide laser (110) and the molding die (310), so that the diameter of the laser spot projected onto the molding die (310) is larger than the diameter of the micro-hemispherical resonator to be processed; The rotating table (220) is arranged on the horizontal displacement table (210); the forming mold (310) is connected to the rotating table (220), and the rotating table (220) is used to drive the forming mold (310) to rotate.

2. The system based on carbon dioxide laser processing micro-hemispherical resonator according to claim 1 is characterized in that: The system comprises a detection camera (410), wherein the detection camera (410) is used to detect the center position of the laser spot.

3. The system based on carbon dioxide laser processing micro-hemispherical resonator according to claim 1 is characterized in that: The system further comprises a reflector (130), wherein the reflector (130) is arranged on a transmission light path between the carbon dioxide laser (110) and the beam expander (140).

4. The system based on carbon dioxide laser processing micro-hemispherical resonator according to claim 3 is characterized in that: The system further comprises a lifting and displacing platform (230), the beam expander (140) being connected to the lifting and displacing platform (230), and the lifting and displacing platform (230) being used to adjust the distance between the beam expander (140) and the reflector (130).

5. The system based on carbon dioxide laser processing micro-hemispherical resonator according to claim 3 is characterized in that: The system further comprises a shaper (120) arranged on a transmission light path between the carbon dioxide laser (110) and the reflector (130), wherein the shaper (120) is used to shape a Gaussian beam into a flat-top beam.

6. The system based on carbon dioxide laser processing micro-hemispherical resonator according to claim 1, characterized in that: A molding cavity (311) is provided in the molding mold (310), and the molding mold (310) absorbs the glass substrate (1000) through the molding cavity (311).

7. The system based on carbon dioxide laser processing of micro-hemispherical resonator according to claim 6, characterized in that: The system further comprises a vacuum pump (350), wherein the vacuum pump (350) is in communication with the molding cavity (311).

8. The system based on carbon dioxide laser processing micro-hemispherical resonator according to claim 7 is characterized in that: A support column (312) is provided in the molding cavity (311); Vacuum through holes (313) are provided on both sides of the support column (312), and the vacuum through holes (313) are used to connect the molding cavity (311) with the vacuum pump (350).

9. The system based on carbon dioxide laser processing micro-hemispherical resonator according to claim 7, characterized in that: The system further comprises a cooling mold (320) connected between the molding mold (310) and the rotating table (220).

10. The system based on carbon dioxide laser processing of micro-hemispherical resonator according to claim 9, characterized in that: The cooling mold (320) is connected to a pneumatic rotary joint (321), and the pneumatic rotary joint (321) is used to be connected to the air pipe (360) of the vacuum pump (350); and / or, One of the forming mold (310) and the cooling mold (320) is provided with a clamping column, and the other is provided with a clamping groove for clamping with the clamping column; and / or, A heat insulation plate (330) is provided between the cooling mold (320) and the rotating table (220).

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