Display module and preparation method thereof, display device and tiled display device

Abstract

The embodiment of the invention provides a display module and a preparation method thereof, a display device and a tiled display device, relates to the technical field of display, and is used for improving the display stability of the display device. The substrate comprises a first surface and a second surface which are opposite to each other, and a plurality of side surfaces connected between the first surface and the second surface, and at least one of the plurality of side surfaces is a selected side surface; the driving circuit layer is arranged on the first surface; the binding pattern is arranged on the second surface; the circuit board is arranged on the second surface; the circuit board comprises a third surface and a fourth surface which are oppositely arranged; the circuit board further comprises a binding terminal arranged on the third surface and a plurality of conductive terminals arranged on the fourth surface, and the binding terminal is connected with the binding pattern; the connecting wire extends from the first surface to the second surface through the selected side surface; the plurality of connecting wires are arranged corresponding to the plurality of conductive terminals, one end of each connecting wire is electrically connected with the corresponding conductive terminal, and the other end of each connecting wire is electrically connected with the driving circuit layer. The display module is used for displaying images.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display module and a preparation method thereof, a display device, and a spliced ​​display device. Background Art

[0002] The display device generally includes a display panel and a flexible circuit board. The flexible circuit board and the display panel are electrically connected through wires on the side of the display panel, so that the signal of the signal source is transmitted to the display panel through the flexible circuit board, thereby realizing the picture display of the display panel.

[0003] In the related art, the flexible circuit board is adhered to the back of the display panel with double-sided tape to fix the flexible circuit board. However, due to the large thickness of the double-sided tape, the climbing angle of the wire on the side of the display panel is too large when it climbs to the side surface of the flexible circuit board away from the display panel to make an electrical connection with the flexible circuit board, which may cause the wire to break. Summary of the invention

[0004] The purpose of the embodiments of the present disclosure is to provide a display module and a preparation method thereof, a display device, and a spliced ​​display device, which are used to reduce the risk of side wire breakage of the display module, thereby improving the display stability of the display module.

[0005] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0006] On the one hand, a display module is provided, which includes a substrate, a driving circuit layer, a binding pattern, a circuit board and a plurality of connecting wires, wherein the substrate includes a first surface and a second surface opposite to each other, and a plurality of side surfaces connected between the first surface and the second surface, at least one of the plurality of side surfaces being a selected side surface. The driving circuit layer is arranged on the first surface of the substrate; the binding pattern is arranged on the second surface of the substrate. The circuit board is arranged on the second surface of the substrate; the circuit board includes a third surface and a fourth surface arranged opposite to each other, the third surface being closer to the substrate than the fourth surface; the circuit board also includes a binding terminal arranged on the third surface, and a plurality of conductive terminals arranged on the fourth surface, the binding terminal being connected to the binding pattern. The connecting wire extends from the first surface to the second surface through the selected side surface; the plurality of connecting wires are arranged corresponding to the plurality of conductive terminals, one end of the connecting wire is electrically connected to the corresponding conductive terminal, and the other end is electrically connected to the driving circuit layer.

[0007] The display module electrically connects the circuit board, the conductive terminals, the connecting wires and the driving circuit layer in sequence, so that the circuit board can transmit the driving signal to the driving circuit layer, thereby realizing the picture display of the display module.

[0008] Since the binding terminals on the circuit board are located on the third surface of the circuit board, and the binding patterns on the substrate are located on the second surface of the substrate, the third surface and the second surface are two surfaces close to each other, and the binding terminals and the binding patterns are connected to each other, the circuit board can be directly bound to the substrate, which can reduce the distance between the fourth surface of the circuit board and the second surface of the substrate. Therefore, when forming the connecting wire, the angle of the connecting wire climbing from the second surface of the substrate to the fourth surface of the circuit board is reduced, thereby reducing the risk of the connecting wire breaking, thereby ensuring the display stability of the display module, and further ensuring the display stability of the display device.

[0009] Furthermore, since the circuit board can be directly bound to the substrate without the need to attach the circuit board to the substrate via double-sided tape, the generation of bubbles between the double-sided tape and the substrate is avoided, and the distance between the circuit board and the substrate can be reduced, thereby also reducing the angle at which the connecting wire climbs from the second surface of the substrate to the fourth surface of the circuit board, thereby reducing the risk of the connecting wire breaking, thereby ensuring the display stability of the display module, and further ensuring the display stability of the display device.

[0010] In some embodiments, an orthographic projection of the binding terminal on the substrate overlaps with the binding pattern.

[0011] In some embodiments, a plurality of the binding terminals are provided, and the plurality of the binding terminals are arranged along a first direction, the first direction is parallel to the first surface and parallel to the selected side surface, and the plurality of the binding terminals are all connected to the binding pattern.

[0012] In some embodiments, a plurality of the binding patterns are provided, a plurality of the binding terminals correspond to the plurality of the binding patterns one by one, and the binding terminals are connected to the corresponding binding patterns.

[0013] In some embodiments, a distance between two adjacent binding terminals is less than or equal to 0.2 μm.

[0014] In some embodiments, a distance between two adjacent binding terminals is smaller than a distance between two adjacent conductive terminals.

[0015] In some embodiments, the plurality of conductive terminals are arranged along the first direction; along the first direction, the plurality of binding terminals constitute two terminal groups, and the plurality of conductive terminals are located between the orthographic projections of the two terminal groups on the third surface of the circuit board.

[0016] In some embodiments, the conductive terminal overlaps with an orthographic projection of at least one of the binding terminals on the third surface of the circuit board.

[0017] In some embodiments, the orthographic projections of the plurality of conductive terminals on the third surface of the circuit board are located between two of the plurality of binding terminals that are farthest apart.

[0018] In some embodiments, the binding terminal is in a strip shape, and the strip extends along a first direction.

[0019] In some embodiments, the orthographic projections of the plurality of conductive terminals on the third surface of the circuit board are located between two ends of the binding terminal in the length direction.

[0020] In some embodiments, a first recognition pattern and a second recognition pattern are further included, wherein the first recognition pattern is disposed on the second surface of the substrate, and the second recognition pattern is disposed on the third surface of the circuit board, and the orthographic projection on the second surface of the substrate overlaps with the first recognition pattern.

[0021] In another aspect, a method for preparing a display module is provided, comprising:

[0022] A driving circuit layer and a binding pattern are formed on the substrate; the driving circuit layer is arranged on the first surface of the substrate, and the binding pattern is arranged on the second surface of the substrate;

[0023] A circuit board is provided; the circuit board comprises a third surface and a fourth surface which are arranged opposite to each other, the third surface being closer to the substrate than the fourth surface; the circuit board further comprises a binding terminal arranged on the third surface, and a plurality of conductive terminals arranged on the fourth surface;

[0024] Disposing the circuit board on the second surface of the substrate so that the binding terminals are connected to the binding patterns;

[0025] A plurality of connecting conductive wires are formed, and the connecting conductive wires extend from the first surface through the selected side surface to the second surface; the plurality of connecting conductive wires are arranged corresponding to the plurality of conductive terminals, one end of the connecting conductive wire is electrically connected to the corresponding conductive terminal, and the other end is electrically connected to the driving circuit layer.

[0026] The method for preparing the display module mentioned above has the same beneficial effects as those achieved by the display module provided above, and will not be described in detail here.

[0027] On the other hand, a display device is provided, comprising a housing and a display module as described in any one of the above embodiments, wherein the display module is disposed in the housing.

[0028] The above-mentioned display device has the same structure and beneficial technical effects as the display modules provided in some of the above-mentioned embodiments, which will not be described in detail here.

[0029] On the other hand, a spliced ​​display device is provided, comprising a plurality of display modules spliced ​​together, wherein the display modules are the display modules described in any of the above embodiments.

[0030] The above-mentioned spliced ​​display device has the same structure and beneficial technical effects as the display modules provided in some of the above-mentioned embodiments, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the products involved in the embodiments of the present disclosure, the actual process of the method, etc.

[0032] Figure 1 is a structural diagram of a display device according to some embodiments;

[0033] Figure 2 is a structural diagram of another display device according to some embodiments;

[0034] Figure 3 is a structural diagram of a display module according to some embodiments;

[0035] Figure 4 is a structural diagram of another display module according to some embodiments;

[0036] Figure 5 is a structural diagram of another display module according to some embodiments;

[0037] Figure 6 is a structural diagram of another display module according to some embodiments;

[0038] Figure 7 is a structural diagram of a circuit board according to some embodiments;

[0039] Figure 8 is a structural diagram of another display module according to some embodiments;

[0040] Fig. 9 is a structural diagram of another circuit board according to some embodiments;

[0041] Fig.10 A structural diagram of a display module in the related art;

[0042] Fig.11 for Fig.10 A cross-sectional view of

[0043] Fig.12 is a structural diagram of another display module according to some embodiments;

[0044] Fig.13 is a structural diagram of another circuit board according to some embodiments;

[0045] Fig.14 for Fig.12 A cross-sectional view of

[0046] Fig.15 is a structural diagram of another display module according to some embodiments;

[0047] Fig.16 is a structural diagram of another display module according to some embodiments;

[0048] Fig.17 is a structural diagram of another display module according to some embodiments;

[0049] Fig.18 is a structural diagram of another display module according to some embodiments;

[0050] Fig.19 is a structural diagram of another display module according to some embodiments;

[0051] Fig. 20 is a structural diagram of another display module according to some embodiments;

[0052] Fig.21 is a structural diagram of another display module according to some embodiments;

[0053] Fig. 22 is a structural diagram of another display module according to some embodiments;

[0054] Fig.23 is a structural diagram of another display module according to some embodiments;

[0055] Fig.24 is a structural diagram of another display module according to some embodiments;

[0056] Fig.25 is a structural diagram of another display module according to some embodiments;

[0057] Fig.26 is a structural diagram of another display module according to some embodiments;

[0058] Fig. 27 is a flow chart of a method for preparing a display module according to some embodiments;

[0059] Figures 28A to 28EIt is a structural diagram corresponding to each step in the method for preparing a display module according to some embodiments. DETAILED DESCRIPTION

[0060] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0061] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics described may be included in any one or more embodiments or examples in any appropriate manner.

[0062] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0063] When describing some embodiments, the term "connection" and its derivative expressions may be used. The term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0064] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0065] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0066] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0067] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in the shapes relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0068] With the development of display technology, various display devices have appeared in life, and the display devices can provide people with various display services to meet people's needs.

[0069] Exemplarily, the display device may be any device that displays either motion (e.g., video) or stationary (e.g., still images) and whether text or images. More specifically, it is contemplated that the embodiments may be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal digital assistants (PDAs), handheld or portable computers, global positioning system (GPS) receivers / navigators, cameras, moving picture experts group 4 (MP4) video players, video cameras, game consoles, watches, clocks, calculators, television monitors, computer monitors, automotive displays (e.g., odometer displays, etc.), navigation instruments, cockpit controls and / or displays, displays of camera views (e.g., displays of rear-view cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0070] In some embodiments, Figure 1 As shown, the display device 1 may be a spliced ​​display device, which includes a plurality of display modules 11 spliced ​​together, and the plurality of display modules 11 cooperate with each other to realize picture display.

[0071] Exemplarily, the light emitting surface of the spliced ​​display device may be a regular shape such as a rectangle or a square, or may be an irregular shape. The light emitting surface refers to a side surface that can emit light.

[0072] In some other embodiments, the display device 1 may also include only one display module 11. In this case, Figure 2 As shown, the display device 1 further includes a housing 12, and the display module 11 is disposed in the housing 12. The housing 12 provides support and protection for the display module 11, and the display module 11 displays images through a light outlet on the housing 12.

[0073] It is understandable that the housing 12 should have a certain strength to provide support and protection for the display module 11 . For example, the material of the housing 12 may be plastic, metal, etc.

[0074] In some examples, the display module 11 may be a Micro LED (Micro Light Emitting Diode) display module, a Mini LED (Mini Light Emitting Diode) display module, or an OLED (Organic Light-Emitting Diode) display module.

[0075] For ease of description, the following description takes the display module 11 as a Micro LED display module as an example.

[0076] For example, Figure 3 As shown, the display module 11 includes a substrate 111, a driving circuit layer 112 and a plurality of light-emitting devices 113. The substrate 111 includes a first surface 111a and a second surface 111b opposite to each other, and a plurality of side surfaces 111c connected between the first surface 111a and the second surface 111b. The driving circuit layer 112 is disposed on the first surface 111a of the substrate 111. The light-emitting devices 113 are disposed on a side of the driving circuit layer 112 away from the substrate 111 and are electrically connected to the driving circuit layer 112.

[0077] In some examples, the substrate 111 may be a flexible substrate. For example, the material of the substrate 111 may include PET (Polyethylene Terephthalate), PEN (Polyethylene Naphthalate Two Formic Acid Glycol Ester), or PI (Polyimide).

[0078] Alternatively, the substrate 111 may also be a rigid substrate. For example, the material of the substrate 111 may include glass.

[0079] In some examples, when the light emitting device 113 is a Micro LED, the structure of the light emitting device 113 may be any one of a face-up structure, a vertical structure, or a flip-down structure.

[0080] For the convenience of description, the following description takes the structure of the light emitting device 113 as a flip-chip structure as an example.

[0081] In some examples, the light emitting device 113 may be driven in an active driving manner, and accordingly, the driving circuit layer 112 is an AM (Active Matrix) circuit layer.

[0082] Specifically, when the driving circuit layer 112 is an AM circuit layer, the driving circuit layer 112 includes a plurality of pixel driving circuits, and the structure of the pixel driving circuit includes a variety of structures, which can be selected and set according to actual needs. For example, the structure of the pixel driving circuit includes but is not limited to "3T1C", "6T1C", "7T1C", "6T2C" or "7T2C" structures. Here, "T" represents a transistor, and the number in front of "T" represents the number of transistors, and "C" represents a storage capacitor, and the number in front of "C" represents the number of storage capacitors.

[0083] In some other examples, the driving mode of the light emitting device 113 may also be passive driving, and accordingly, the driving circuit layer 112 is a PM (Passive Matrix, passive driving) circuit layer.

[0084] Through the above configuration, the substrate 111 provides support for the driving circuit layer 112 to facilitate the configuration of the driving circuit layer 112 , and the driving circuit layer 112 controls the light-emitting device 113 to emit light, thereby enabling the display module 11 to display a picture, and ultimately realizing the picture display of the display device 1 .

[0085] On this basis, if Figure 4 As shown, at least one of the multiple side surfaces 111c is a selected side surface C. Figure 5 , Figure 6 As shown, the display module 11 provided in the present application further includes a circuit board 114 and a plurality of connecting wires 115. The circuit board 114 is disposed on the second surface 111b of the substrate 111. The circuit board 114 includes a third surface 114a and a fourth surface 114b disposed opposite to each other. The third surface 114a is closer to the substrate 111 than the fourth surface 114b. Figure 6 , Figure 7 As shown, the circuit board 114 further includes a plurality of conductive terminals 1141 disposed on the fourth surface 114b. The connecting wire 115 extends from the first surface 111a to the second surface 111b via the selected side surface C. The plurality of connecting wires 115 are disposed corresponding to the plurality of conductive terminals 1141, one end of the connecting wire 115 is electrically connected to the corresponding conductive terminal 1141, and the other end is electrically connected to the driving circuit layer 112.

[0086] It can be understood that the distance between two adjacent conductive terminals 1141 is related to the distance between two adjacent connecting wires 115. For example, the distance between two adjacent conductive terminals 1141 can be 0.4μm to 0.6μm, such as 0.4μm, 0.5μm, 0.55μm, 0.576μm, 0.6μm, etc.

[0087] The line width of the connecting wire 115 is related to the resistance value of the connecting wire 115 , and the line width of the connecting wire 115 is set according to the required resistance value of the connecting wire 115 .

[0088] In some examples, the substrate 111 is a cubic structure, and the selected side surface C may be only one of the four side surfaces 111c of the substrate 111. In this case, the connecting wire 115 is disposed only on the side of the substrate 111 where the selected side surface C is located.

[0089] Alternatively, a plurality of selected side surfaces C may be provided, that is, a plurality of the four side surfaces 111 c of the substrate 111 may be selected side surfaces C, for example, two selected side surfaces C, three selected side surfaces C or four selected side surfaces C. In this case, a connecting wire 115 is provided on one side where each selected side surface C is located.

[0090] In some examples, such as Figure 8 As shown, the display module 11 further includes a driving chip 120 , which is electrically connected to the circuit board 114 . The driving chip 120 can send a driving signal to the circuit board 114 , and then the driving signal can be transmitted to the driving circuit layer 112 through the circuit board 114 , thereby realizing the screen display of the display module 11 .

[0091] In some examples, the circuit board 114 may be a flexible printed circuit (FPC) or a rigid-flex printed circuit (RFPC).

[0092] Exemplarily, when the circuit board 114 is a flexible circuit board 114, as shown in FIG. Fig. 9 As shown, the circuit board 114 includes a substrate 1142, a first copper layer 1143 and a second copper layer 1144, the first copper layer 1143 and the second copper layer 1144 are respectively arranged on two opposite sides of the substrate 1142, the third surface 114a of the circuit board 114 is on the side where the first copper layer 1143 is located, the fourth surface 114b of the circuit board 114 is on the side where the second copper layer 1144 is located, and the second copper layer 1144 includes a plurality of conductive terminals 1141. The second copper layer 1144 may also include a signal line, and the conductive terminal 1141 may be connected to the signal line. When the driving chip 120 is arranged on the fourth surface 114b of the circuit board 114, the signal line is also connected to the driving chip 120, so as to realize the connection between the conductive terminal 1141 and the driving chip 120.

[0093] By way of example, the material of the substrate 1142 may include polyimide (PI) or the like.

[0094] For the convenience of subsequent description, the circuit board 114 is described as a flexible circuit board in the following.

[0095] In some examples, the plurality of conductive terminals 1141 correspond one-to-one to the plurality of connecting wires 115 , that is, one end of a connecting wire 115 is electrically connected to the corresponding conductive terminal 1141 , and the other end is electrically connected to the driving circuit layer 112 .

[0096] For example, the number of the conductive terminals 1141 may be 10, 15, 20, etc., and correspondingly, the number of the connecting wires 115 may also be 10, 15, 20. The specific number may be set according to actual conditions.

[0097] In some examples, the connecting wire 115 can be formed by 3D printing technology. Specifically, a three-dimensional model is established by computer software simulation to obtain the position coordinates of the connecting wire 115, and then parameters are set to 3D print the silver paste raw material through a set moving path to form the connecting wire 115.

[0098] Of course, the connecting wire 115 may also be formed in other ways.

[0099] In some examples, multiple connection terminals are provided on the driving circuit layer 112, and the multiple connection terminals correspond one-to-one to the multiple conductive terminals 1141. The multiple connection terminals are electrically connected to the driving circuit layer 112, one end of the connecting wire 115 is electrically connected to the corresponding conductive terminal 1141, and the other end of the connecting wire 115 is electrically connected to the corresponding connecting terminal, thereby realizing electrical connection between the circuit board 114 and the driving circuit layer 112.

[0100] Through the above-mentioned configuration, the circuit board 114 and the driving circuit layer 112 are electrically connected together using the connecting wire 115. When the driving chip 120 is set on the circuit board 114, the driving signal output by the driving chip 120 can be transmitted to the driving circuit layer 112 through the connecting wire 115, thereby realizing the screen display of the display module 11.

[0101] In addition, when the display device 1 is a spliced ​​display device, since the connecting wires 115 in each display module 11 are routed on the side and the circuit board 114 is disposed on the back of the display module 11, it is not necessary to provide a large binding area on the front of the display module 11, which can reduce the black border of the display module 11 and improve the appearance of the display device 1. And since the connecting wires 115 are small in size, the space they occupy between two adjacent display modules 11 is also small, so when actually viewed, the gap between two adjacent display modules 11 is also difficult to be found by the naked eye, and a better display effect can be presented.

[0102] In the related art, in order to facilitate the use of connecting wires 115 to connect the driving circuit layer 112 and the circuit board 114, as shown in FIG. Fig.10 As shown, a double-sided adhesive tape 116 is generally disposed between the circuit board 114 and the second surface 111 b of the substrate 111 , so that the circuit board 114 is adhered to the second surface 111 b of the substrate 111 by using the double-sided adhesive tape 116 .

[0103] However, if Fig.11 As shown, since the thickness of the double-sided adhesive 116 is relatively large, which can reach more than 50 μm, the distance between the circuit board 114 and the substrate 111 will be relatively large, that is, the distance between the fourth surface 114b of the circuit board 114 and the second surface 111b of the substrate 111 ( Fig.11 The L1 shown in FIG. 1 is larger, which increases the step difference of the circuit board 114, so that the connecting wire 115 extends from the first surface 111a of the substrate 111 through the selected surface to the second surface 111b, and continues to climb to the fourth surface 114b of the circuit board 114. The climbing section of the connecting wire 115 may be increased due to the climbing angle (such as Fig.11 The W1 shown in FIG. 1 is too large and breaks, which affects the stability of the electrical connection between the circuit board 114 and the driving circuit layer 112 , thereby reducing the stability of the image display of the display module 11 .

[0104] In a related technology, in order to reduce the step difference, the structure of the circuit board 114 is modified to change the double-layer copper (first copper layer 1143 and second copper layer 1144) of the circuit board 114 into a single-layer copper structure, thereby reducing the thickness of the circuit board 114 to reduce the step difference. However, doing so will sacrifice the electrical properties of the circuit board 114, thereby affecting the stability of the image display of the display module 11.

[0105] In addition, due to current process reasons, when using double-sided tape 116 for pasting and fixing, the alignment accuracy of the double-sided tape 116 and the substrate 111 is low, that is, the deviation is large. Generally, the double-sided tape 116 and the preset pasting position on the second surface 111b of the substrate 111 will deviate by about 60μm front to back or left to right, resulting in that after the circuit board 114 is pasted to the substrate 111, the conductive terminal 1141 on the fourth surface 114b of the circuit board 114 deviates from the preset position, resulting in that when the connecting wire 115 is set, the route of the connecting wire 115 will deviate from the preset path, thereby affecting the electrical connection between the connecting wire 115 and the driving circuit layer 112, thereby reducing the stability of the display of the display module 11.

[0106] Furthermore, when the double-sided adhesive 116 is used for pasting, bubbles or edge floating may occur between the double-sided adhesive 116 and the second surface 111b of the substrate 111, which may make the connection between the circuit board 114 and the substrate 111 unstable, and the distance between the fourth surface 114b of the circuit board 114 and the second surface 111b of the substrate 111 may increase due to the presence of bubbles (the height of the bubbles is about 50 μm), thereby increasing the step difference. This will increase the risk of the connecting wire 115 breaking, thereby reducing the stability of the display of the display module 11.

[0107] In another related technology, in order to eliminate bubbles, an exhaust hole is opened on the circuit board 114 to exhaust and eliminate the bubbles. However, this solution requires the lines on the circuit board 114 to provide a way out for the opening of the exhaust hole, which will affect the electrical characteristics of the circuit board 114 and also affect the stability of the screen display of the display module 11.

[0108] Based on this, Fig.12 As shown, the display module 11 provided in the present application further includes a binding pattern 117, which is disposed on the second surface 111b of the substrate 111. The circuit board 114 further includes a binding terminal 1145 disposed on the third surface 114a, which is connected to the binding pattern 117.

[0109] It can be understood that the connection between the binding terminal 1145 and the binding pattern 117 only involves a physical connection and does not necessarily involve an electrical connection.

[0110] In some examples, such as Fig.13 As shown, the circuit board 114 includes a substrate 1142, a first copper layer 1143 and a second copper layer 1144. The first copper layer 1143 and the second copper layer 1144 are respectively arranged on opposite sides of the substrate 1142. The third surface 114a of the circuit board 114 is on the side where the first copper layer 1143 is located, and the fourth surface 114b of the circuit board 114 is on the side where the second copper layer 1144 is located. The second copper layer 1144 includes a plurality of conductive terminals 1141, and the first copper layer 1143 includes a binding terminal 1145.

[0111] In some examples, a preset material can be used to form a film layer on the second surface 111b of the substrate 111 through a film forming process. The preset material is any material that can be used for binding, such as metal, and then an etching process is used to form a binding pattern 117. For example, the binding pattern 117 can be any suitable shape such as a cuboid, a cube, a groove, etc.

[0112] Illustratively, the above-mentioned film forming process may be a sputtering process or the like.

[0113] Exemplarily, the etching process may be laser etching, wet etching or dry etching.

[0114] In some examples, the binding terminal 1145 and the binding pattern 117 are connected together by bonding.

[0115] Specifically, a colloid is first disposed on the binding pattern 117, for example, the colloid may be an anisotropic conductive film (ACF), and then the binding terminal 1145 is made opposite to the binding pattern 117, and finally the circuit board 114 is pre-pressed and pressed so that the binding terminal 1145 is connected to the binding pattern 117 through the ACF.

[0116] In this way, if Fig.14 As shown, since the binding terminals 1145 on the circuit board 114 and the binding patterns 117 on the substrate 111 are connected to each other, the circuit board 114 can be directly bound to the substrate 111, avoiding the use of double-sided tape 114a to stick the circuit board 114 and the substrate 111. In this way, after binding, the distance between the fourth surface 114b of the circuit board 114 and the second surface 111b of the substrate 111 is reduced. For example, the distance L2 between the fourth surface 114b of the circuit board 114 and the second surface 111b of the substrate 111 can be less than 5μm. Compared with the solution of sticking with double-sided tape 116, the step difference is reduced. Therefore, when forming the connecting wire 115, the angle W2 of the connecting wire 115 climbing from the second surface 111b of the substrate 111 to the fourth surface 114b of the circuit board 114 is reduced, thereby reducing the risk of the connecting wire 115 breaking, thereby ensuring the display stability of the display module 11, and further ensuring the display stability of the display device 1.

[0117] At the same time, since double-sided tape 116 is not used for pasting, there will be no bubble problem, thereby avoiding the generation of bubbles and increasing the distance between the fourth surface 114b of the circuit board 114 and the second surface 111b of the substrate 111, thereby reducing the step difference.

[0118] There is no need to open an exhaust hole on the circuit board 114 , so the circuits on the circuit board 114 do not need to provide a clearance for the exhaust hole, thereby ensuring the electrical characteristics of the circuit board 114 and further ensuring the display stability of the display device 1 .

[0119] In addition, since the binding process is relatively mature, compared with the solution of fixing with double-sided tape 116, the binding alignment accuracy between the binding terminal 1145 and the binding pattern 117 in the present application is higher, which can reduce the alignment offset between the circuit board 114 and the substrate 111. The alignment accuracy is, for example, within 15μm, thereby improving the connection accuracy of the connecting wire 115, and then improving the uniformity of the current on the connecting wire 115, so as to ensure the stability of the screen display of the display module 11.

[0120] In some embodiments, Fig.15 As shown, the orthographic projection of the bonding terminal 1145 on the substrate 111 overlaps with the bonding pattern 117 .

[0121] In this way, the surface of the binding terminal 1145 facing the binding pattern 117 can be completely in contact with the binding pattern 117, which can increase the connection strength between the binding terminal 1145 and the binding pattern 117. Thus, the circuit board 114 is more stably connected to the substrate 111, thereby ensuring the stability of the setting of the connecting wire 115, so that the screen display of the display module 11 is stable.

[0122] In some embodiments, one binding terminal 1145 and one binding pattern 117 may be provided, and the circuit board 114 may be fixed on the substrate 111 by using the connection between one binding terminal 1145 and one binding pattern 117 .

[0123] In other embodiments, Fig.16 As shown, the binding terminals 1145 are provided in plurality, and the plurality of binding terminals 1145 are arranged along a first direction ( Fig.16 The first direction is parallel to the first surface 111a and parallel to the selected side surface C; the binding pattern 117 is a long strip extending along the first direction Y, and multiple binding terminals 1145 are all connected to the binding pattern 117.

[0124] In some examples, the distance between two adjacent binding terminals 1145 is less than or equal to 0.2 μm. In this way, the requirements of the binding process can be better met. At the same time, along the first direction, sufficient binding terminals 1145 can also be set in the limited space of the third surface 114a of the circuit board 114, thereby increasing the connection strength between the circuit board 114 and the substrate 111, so as to improve the connection stability between the two.

[0125] For example, the distance between two adjacent binding terminals 1145 is 0.2 μm, 0.18 μm, 0.15 μm, 0.1 μm, 0.05 μm, 0, or the like.

[0126] Of course, the distance between two adjacent binding terminals 1145 may also be greater than 0.2 μm.

[0127] It is understandable that when the number of binding terminals 1145 is greater than 2, the distance between any two adjacent binding terminals 1145 can be equal, for example, 0.2 μm, 0.15 μm, etc., which can facilitate the processing and setting of the binding terminals 1145 and the binding pattern 117.

[0128] Alternatively, the distance between any two adjacent binding terminals 1145 may be partially equal or completely unequal, for example, the distance between the first binding terminal 1145 and the second binding terminal 1145 is 0.19 μm, the distance between the second binding terminal 1145 and the third binding terminal 1145 is 0.18 μm, and the distance between the third binding terminal 1145 and the fourth binding terminal 1145 is 0.19 μm.

[0129] By providing a plurality of binding terminals 1145 on the circuit board 114, the connection between the circuit board 114 and the substrate 111 is achieved by utilizing the connection between the plurality of binding terminals 1145 and the binding pattern 117. Since the plurality of binding terminals 1145 are arranged along the first direction, the plurality of binding terminals 1145 can be arranged neatly, so that it is convenient to set the parameters required for 3D printing, thereby facilitating the connection of the conductive wire 115 to the conductive terminal 1141 and the driving circuit layer 112.

[0130] In some other examples, the plurality of binding terminals 1145 may not be arranged along a specific direction, but may be irregularly disposed on the third surface 114 a of the circuit board 114 .

[0131] In some embodiments, Fig.17 As shown, a plurality of binding patterns 117 are provided, and a plurality of binding terminals 1145 correspond to the plurality of binding patterns 117 one by one, and the binding terminals 1145 are connected to the corresponding binding patterns 117 .

[0132] It can be understood that the plurality of binding patterns 117 should also be arranged along the first direction to be connected to the corresponding binding terminals 1145 .

[0133] Exemplarily, the number of the binding patterns 117 may be 10, 15, 20, etc., and correspondingly, the number of the binding terminals 1145 may also be 10, 15, 20. The specific number may be set according to actual conditions.

[0134] In some examples, the orthographic projection of each binding terminal 1145 on the second surface 111b of the substrate 111 overlaps with the corresponding binding pattern 117, so that the connection stability between each binding terminal 1145 and each binding pattern 117 can be ensured, thereby ensuring the stability of the connection between the circuit board 114 and the substrate 111 to the greatest extent.

[0135] Of course, it is also possible that the orthographic projection of a portion of the plurality of binding terminals 1145 on the second surface 111 b of the substrate 111 overlaps with a corresponding portion of the plurality of binding patterns 117 .

[0136] By providing a plurality of binding patterns 117 , each binding terminal 1145 is connected to one binding pattern 117 , thereby achieving connection between the circuit board 114 and the substrate 111 .

[0137] In some other embodiments, a plurality of binding terminals 1145 may correspond to one binding pattern 117 , that is, each binding pattern 117 is connected to a plurality of binding terminals 1145 .

[0138] For example, Fig.18 As shown, the number of the plurality of binding terminals 1145 corresponding to the plurality of binding patterns 117 may be equal, for example, each binding pattern 117 corresponds to two binding terminals 1145 , three binding terminals 1145 , and so on.

[0139] Or, if Fig.19 As shown, the number of binding terminals 1145 corresponding to the binding patterns 117 may also be unequal, for example, one binding pattern 117 corresponds to two binding terminals 1145, another binding pattern 117 corresponds to three binding terminals 1145, another binding pattern 117 corresponds to four binding terminals 1145, and so on.

[0140] In some embodiments, Fig. 20 As shown, the distance N1 between two adjacent binding terminals 1145 is smaller than the distance N2 between two adjacent conductive terminals 1141 .

[0141] Illustratively, N2=0.5 μm, N1=0.2 μm; N2=0.56 μm, N1=0.15 μm; N2=0.576 μm, N1=0.12 μm, and so on.

[0142] Through the above-mentioned arrangement, there is at least one binding terminal 1145 between the orthographic projections of two adjacent conductive terminals 1141 on the third surface 114a of the circuit board 114. In this way, part of the circuit board 114 between the two adjacent conductive terminals 1141 can be fixed on the substrate 111 by the binding terminal 1145, which can improve the stability of the fixation of the circuit board 114 to ensure that each conductive terminal 1141 can be stably connected to the connecting wire 115, thereby ensuring the stability of the signal transmission of the connecting wire 115, and further ensuring the stability of the screen display of the display module 11.

[0143] In some embodiments, Fig.21As shown, the plurality of conductive terminals 1141 are arranged along the first direction. Along the first direction, the plurality of binding terminals 1145 form two terminal groups A, and the plurality of conductive terminals 1141 are located between the orthographic projections of the two terminal groups A on the third surface 114 a of the circuit board 114 .

[0144] The number of binding terminals 1145 in the two terminal groups A can be the same, for example, the number of binding terminals 1145 in each terminal group A is 10, 15, 20, etc. In this way, along the first direction, it can be ensured that the part of the circuit board 114 located on both sides of the plurality of conductive terminals 1141 is subjected to uniform force, thereby more stably fixing the circuit board 114 on the substrate 111.

[0145] Alternatively, the number of binding terminals 1145 in the two terminal groups A may be different, for example, there are 10 binding terminals 1145 in one terminal group A and 15 binding terminals 1145 in the other terminal group A. There are 11 binding terminals 1145 in one terminal group A and 13 binding terminals 1145 in the other terminal group A.

[0146] Through the above arrangement, the orthographic projections of the plurality of conductive terminals 1141 on the third surface 114a of the circuit board 114 will be located between the two terminal groups A, so that parts of the circuit board 114 at both ends of any conductive terminal 1141 can be fixed by the terminal group A, so that the parts of the circuit board 114 corresponding to all the conductive terminals 1141 can be stably fixed on the substrate 111, thereby ensuring the connection stability between the connecting wire 115 and the conductive terminal 1141, thereby ensuring the stability of the picture display of the display module 11.

[0147] In some embodiments, Fig. 22 As shown, the conductive terminal 1141 overlaps with the orthographic projection of at least one binding terminal 1145 on the third surface 114a of the circuit board 114. That is, the conductive terminal 1141 overlaps with the orthographic projection of at least one binding terminal 1145 on the third surface 114a of the circuit board 114, or at least partially overlaps.

[0148] Among them, Fig. 20 As shown, the conductive terminal 1141 may overlap with the orthographic projections of one, two, or three binding terminals 1145 on the third surface 114 a of the circuit board 114 .

[0149] Through the above-mentioned arrangement, each conductive terminal 1141 has at least one binding terminal 1145 at the position corresponding to it, so that the circuit board 114 at the position corresponding to each conductive terminal 1141 can be fixed together with the substrate 111 through the binding terminal 1145, so that the conductive terminal 1141 at this position can be in a stable state, thereby facilitating the establishment of a stable electrical connection between each connecting wire 115 and each conductive terminal 1141, so as to ensure the stability of signal transmission, and further ensure the stability of the picture display of the display module 11.

[0150] In some embodiments, Fig.23 As shown, the orthographic projections of the plurality of conductive terminals 1141 on the third surface 114a of the circuit board 114 are located at the two binding terminals 1145 ( Fig.21 between p1 and p2).

[0151] In this way, the orthographic projection of each conductive terminal 1141 on the third surface 114a of the circuit board 114 includes at least one binding terminal 1145 on both sides along the first direction, so that it can be ensured that the circuit board 114 at the corresponding position of each conductive terminal 1141 can be fixed on the substrate 111 through at least two binding terminals 1145, so that all the conductive terminals 1141 are stably fixed on the substrate 111, thereby ensuring the connection stability between the connecting wire 115 and the conductive terminal 1141, so that the display module 11 can achieve stable picture display.

[0152] In some embodiments, Fig.24 As shown, the binding terminal 1145 is in a strip shape, and the strip extends along the first direction.

[0153] For example, the binding terminal 1145 may be in a regular shape such as a rectangular parallelepiped bar, a semi-cylindrical bar, or an irregular shape.

[0154] Since the binding terminal 1145 is in a bar shape, part of the circuit board 114 at the corresponding position of the binding terminal 1145 can be fixed on the substrate 111 through the binding terminal 1145, thereby ensuring that the conductive terminals 1141 on the part of the circuit board 114 can be in a relatively stable state, thereby ensuring the connection stability of the connecting wire 115, thereby ensuring the stability of the screen display of the display module 11.

[0155] In addition, since the binding terminal 1145 is in a strip shape, it can be processed in one step, which can reduce the difficulty of processing the binding terminal 1145. At the same time, it can also reduce the difficulty of connecting the binding terminal 1145 with the binding pattern 117.

[0156] On this basis, if Fig.25As shown, the orthographic projections of the plurality of conductive terminals 1141 on the third surface 114 a of the circuit board 114 are located between the two ends of the binding terminal 1145 in the length direction.

[0157] It can be understood that the two ends of the binding terminal 1145 in the length direction refer to the two ends of the binding terminal 1145 along the first direction.

[0158] Through the above-mentioned arrangement, part of the circuit board 114 at the corresponding position of the conductive terminal 1141 can be fixed on the substrate 111 through the binding terminal 1145, so that the circuit board 114 of this part can be in a stable state, thereby ensuring that all the conductive terminals 1141 at this part are in a stable state, so that the connecting wire 115 can be stably connected to the conductive terminal 1141, thereby ensuring that the connecting wire 115 can stably transmit signals, thereby ensuring the stability of the screen display of the display module 11.

[0159] In some embodiments, Fig.26 As shown, the display module 11 further includes a first identification pattern 118 and a second identification pattern 119. The first identification pattern 118 is disposed on the second surface 111b of the substrate 111. The second identification pattern 119 is disposed on the third surface 114a of the circuit board 114, and its orthographic projection on the second surface 111b of the substrate 111 overlaps with the first identification pattern 118.

[0160] In some examples, a first recognition film layer may be formed on the second surface 111b of the substrate 111 by a film forming process, and then the first recognition film layer may be etched by an etching process to form a first recognition pattern 118. For example, the first recognition pattern 118 may be "T" shaped.

[0161] In some examples, a second identification film layer may be formed on the third surface 114a of the circuit board 114 by a film forming process, and then the second identification film layer may be etched by an etching process to form a second identification pattern 119. For example, the second identification pattern 119 may be "T" shaped.

[0162] By setting the first identification pattern 118 and the second identification pattern 119 so that the first identification pattern 118 and the second identification pattern 119 are opposite to each other, the binding pattern 117 and the binding terminal 1145 are accurately connected together, thereby ensuring that the circuit board 114 can be accurately fixed on the substrate 111. In this way, the fixing deviation of the circuit board 114 can be reduced, and the current uniformity of the multiple connecting wires 115 can be improved to ensure the stability of the picture display of the display module 11.

[0163] In order to more clearly understand the formation process of the display module 11 in the present application, as shown in FIG. Fig. 27As shown, the present application also provides a method for preparing a display module 11, and the method includes: S100 to S400.

[0164] S100: Fig.28A As shown, a driving circuit layer 112 and a binding pattern 117 are formed on a substrate 111 ; the driving circuit layer 112 is disposed on a first surface 111 a of the substrate 111 , and the binding pattern 117 is disposed on a second surface 111 b of the substrate 111 .

[0165] For example, a binding film layer may be formed on the second surface 111 b of the substrate 111 by a film forming process, and then a binding pattern 117 may be formed by an etching process. For example, the binding pattern 117 may be in any suitable shape such as a cuboid, a cube, or a groove.

[0166] Illustratively, the above-mentioned film forming process may be a sputtering process or the like.

[0167] Exemplarily, the etching process may be laser etching, wet etching or dry etching.

[0168] In some embodiments, Fig.28A As shown, a plurality of light emitting devices 113 are manufactured on a side of the driving circuit layer 112 away from the substrate 111 , so that the light emitting devices 113 are electrically connected to the driving circuit layer 112 .

[0169] Exemplarily, the driving circuit layer 112 may be an AM circuit layer, or may also be a PM circuit layer.

[0170] Exemplarily, the light emitting device 113 may be a Micro LED or a Mini LED.

[0171] S200: Fig.28B As shown, a circuit board 114 is provided; the circuit board 114 includes a third surface 114a and a fourth surface 114b arranged opposite to each other, and the third surface 114a is closer to the substrate 111 than the fourth surface 114b; the circuit board 114 also includes a binding terminal 1145 arranged on the third surface 114a, and a plurality of conductive terminals 1141 arranged on the fourth surface 114b.

[0172] Exemplarily, the circuit board 114 may be an FPC or an RFPC.

[0173] Exemplarily, the circuit board 114 is an FPC, and the circuit board 114 includes a substrate 1142, a first copper layer 1143 and a second copper layer 1144, the first copper layer 1143 and the second copper layer 1144 are respectively arranged on opposite sides of the substrate 1142, the third surface 114a of the circuit board 114 is on the side where the first copper layer 1143 is located, and the fourth surface 114b of the circuit board 114 is on the side where the second copper layer 1144 is located, the first copper layer 1143 includes a binding terminal 1145, and the second copper layer 1144 includes a plurality of conductive terminals 1141.

[0174] Exemplarily, one binding terminal 1145 may be provided.

[0175] Alternatively, a plurality of binding terminals 1145 may be provided, and the plurality of binding terminals 1145 are arranged along the first direction, and the plurality of binding terminals 1145 are all connected to the binding pattern 117 .

[0176] The distance between two adjacent binding terminals 1145 is less than or equal to 0.2 μm. For example, the distance between two adjacent binding terminals 1145 may be 0.19 μm, 0.17 μm, 0.14 μm, 0.1 μm, 0.05 μm, 0, or the like.

[0177] Of course, the distance between two adjacent binding terminals 1145 may also be greater than 0.2 μm.

[0178] S300: Fig.28C As shown, the circuit board 114 is disposed on the second surface 111 b of the substrate 111 , and the binding terminals 1145 are connected to the binding patterns 117 .

[0179] In some examples, the binding terminal 1145 and the binding pattern 117 are connected together by bonding.

[0180] Specifically, firstly, a colloid is set on the binding pattern 117, for example, the colloid can be ACF, then the binding terminal 1145 is made opposite to the binding pattern 117, and finally the circuit board 114 is pre-pressed and pressed so that the binding terminal 1145 is connected to the binding pattern 117 through the ACF.

[0181] In some examples, such as Fig.28DAs shown, a first identification pattern 118 is made on the second surface of the substrate 111, and a second identification pattern 119 is made on the third surface of the circuit board 114. Before connecting the binding terminal 1145 with the binding pattern 117, the first identification pattern 118 on the second surface 111b and the second identification pattern 119 on the third surface 114a are firstly made to recognize and align with each other, so that the binding terminal 1145 can be accurately aligned with the binding pattern 117. This can improve the connection accuracy between the circuit board 114 and the substrate 111, thereby facilitating the subsequent use of the connecting wire 115 to accurately connect the conductive terminal 1141 and the driving circuit layer 112, thereby ensuring the uniformity of the current of the connecting wire 115, so as to ensure the stability of the screen display of the display module 11.

[0182] S400: Fig.28E As shown, a plurality of connecting wires 115 are formed, and the connecting wires 115 extend from the first surface 111a to the second surface 111b through the selected side surface C. The plurality of connecting conductive wires are arranged corresponding to the plurality of conductive terminals 1141, and one end of the connecting wire 115 is electrically connected to the corresponding conductive terminal 1141, and the other end is electrically connected to the driving circuit layer 112.

[0183] It can be understood that the distance between two adjacent conductive terminals 1141 is related to the distance between two adjacent connecting wires 115 . For example, the distance between two adjacent conductive terminals 1141 may be 0.42 μm, 0.52 μm, 0.54 μm, 0.576 μm, 0.59 μm, 0.61 μm, etc.

[0184] The line width of the connecting wire 115 is related to the resistance value of the connecting wire 115 , and the line width of the connecting wire 115 is determined specifically according to the required resistance value of the connecting wire 115 .

[0185] In some examples, the number of the conductive terminals 1141 may be 9, 16, 23, etc., and correspondingly, the number of the connecting wires 115 may also be 9, 16, or 23. The specific number may be set according to actual conditions.

[0186] In some examples, the connecting wire 115 is formed by 3D printing technology. A three-dimensional model can be established by computer software simulation to obtain the position coordinates of the connecting wire 115. Then, parameters are set to 3D print the silver paste raw material through a set moving path to form the connecting wire 115.

[0187] Through the above-mentioned configuration, the circuit board 114 and the driving circuit layer 112 are electrically connected together using the connecting wire 115, so that the circuit board 114 can transmit the driving signal to the driving circuit layer 112. Since the driving circuit layer 112 is connected to the light-emitting device 113, the driving signal can drive the light-emitting device 113 to emit light, thereby realizing the picture display of the display module 11.

[0188] Since the binding terminals 1145 on the circuit board 114 and the binding patterns 117 on the substrate 111 are connected to each other, the circuit board 114 can be directly bound to the substrate 111, so that the distance between the fourth surface 114b of the circuit board 114 and the second surface 111b of the substrate 111 can be reduced. Therefore, when forming the connecting wire 115, the angle of the connecting wire 115 climbing from the second surface 111b of the substrate 111 to the fourth surface 114b of the circuit board 114 is reduced, thereby reducing the risk of the connecting wire 115 breaking, thereby ensuring the display stability of the display module 11, and further ensuring the display stability of the display device 1.

[0189] In some embodiments, after the connecting wire 115 is printed using a 3D printing process, a protective layer may be printed on the surface of the connecting wire 115 to encapsulate and protect the connecting wire 115 .

[0190] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display module, characterized in that: include: A substrate comprising a first surface and a second surface opposite to each other, and a plurality of side surfaces connected between the first surface and the second surface, at least one of the plurality of side surfaces being a selected side surface; A driving circuit layer is disposed on the first surface of the substrate; A binding pattern, disposed on the second surface of the substrate; A circuit board is arranged on the second surface of the substrate; the circuit board includes a third surface and a fourth surface arranged opposite to each other, the third surface is closer to the substrate than the fourth surface; the circuit board also includes a binding terminal arranged on the third surface, and a plurality of conductive terminals arranged on the fourth surface, the binding terminal is connected to the binding pattern; A plurality of connecting wires extend from the first surface through the selected side surface to the second surface; the plurality of connecting wires are arranged corresponding to the plurality of conductive terminals, one end of the connecting wire is electrically connected to the corresponding conductive terminal, and the other end is electrically connected to the driving circuit layer.

2. The display module according to claim 1, characterized in that: The orthographic projection of the binding terminal on the substrate overlaps with the binding pattern.

3. The display module according to claim 1, characterized in that: A plurality of the binding terminals are provided, and the plurality of the binding terminals are arranged along a first direction, the first direction is parallel to the first surface and parallel to the selected side surface, and the plurality of the binding terminals are all connected to the binding pattern.

4. The display module according to claim 3, characterized in that: There are a plurality of the binding patterns, a plurality of the binding terminals correspond to the plurality of the binding patterns one by one, and the binding terminals are connected to the corresponding binding patterns.

5. The display module according to claim 3, characterized in that: The distance between two adjacent binding terminals is less than or equal to 0.2 μm.

6. The display module according to claim 3, characterized in that: The distance between two adjacent binding terminals is smaller than the distance between two adjacent conductive terminals.

7. The display module according to claim 3, characterized in that: The plurality of conductive terminals are arranged along the first direction; Along the first direction, the plurality of binding terminals form two terminal groups, and the plurality of conductive terminals are located between orthographic projections of the two terminal groups on the third surface of the circuit board.

8. The display module according to claim 3, characterized in that: The conductive terminal overlaps with an orthographic projection of at least one of the binding terminals on the third surface of the circuit board.

9. The display module according to claim 3, characterized in that: The orthographic projections of the plurality of conductive terminals on the third surface of the circuit board are located between two binding terminals that are farthest from each other among the plurality of binding terminals.

10. The display module according to claim 1, characterized in that: The binding terminal is in a strip shape, and the strip extends along a first direction.

11. The display module according to claim 10, characterized in that: The orthographic projections of the plurality of conductive terminals on the third surface of the circuit board are located between two ends of the binding terminal in the length direction.

12. The display module according to any one of claims 1 to 11, characterized in that: Also includes: A first identification pattern is disposed on the second surface of the substrate; The second identification pattern is disposed on the third surface of the circuit board, and its orthographic projection on the second surface of the substrate overlaps with the first identification pattern.

13. A method for preparing a display module, characterized in that: include: forming a driving circuit layer and a binding pattern on the substrate; The driving circuit layer is disposed on the first surface of the substrate, and the binding pattern is disposed on the second surface of the substrate; Provide circuit boards; The circuit board includes a third surface and a fourth surface that are arranged opposite to each other, and the third surface is closer to the substrate than the fourth surface; the circuit board also includes a binding terminal arranged on the third surface, and a plurality of conductive terminals arranged on the fourth surface; Disposing the circuit board on the second surface of the substrate so that the binding terminals are connected to the binding patterns; A plurality of connecting conductive wires are formed, and the connecting conductive wires extend from the first surface through the selected side surface to the second surface; the plurality of connecting conductive wires are arranged corresponding to the plurality of conductive terminals, one end of the connecting conductive wire is electrically connected to the corresponding conductive terminal, and the other end is electrically connected to the driving circuit layer.

14. A display device, characterized in that: include: shell; The display module according to any one of claims 1 to 12, wherein the display module is disposed in the housing.

15. A splicing display device, characterized in that: It comprises a plurality of display modules which are spliced ​​together, and the display modules are the display modules according to any one of claims 1 to 12.

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