Composite copper wire with good wear-resistant and corrosion-resistant effects and preparation process thereof
By adopting nickel-chromium alloy electroplating treatment and strictly controlling the plating time and stirring speed in the copper wire preparation process, the problem of existing copper wires being easily corroded in the motor is solved, and better wear and corrosion resistance and coating quality are achieved.
Patent Information
- Application Number
- CN202411578414.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-07
- Publication Date
- 2025-02-14
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing copper wire is susceptible to corrosion by cooling water during the use of the motor, resulting in serious corrosion of the stator, and a copper wire with excellent wear and corrosion resistance is needed.
A composite copper wire is used, and its preparation process includes mixing and melting elements such as copper, zinc, aluminum, nickel and chromium in a specific proportion, followed by molding, rounding and drawing crystallization, and finally undergoing nickel-chromium alloy electroplating treatment, controlling Plating time and stirring speed to ensure uniformity and quality of the plating.
The composite copper wire prepared through this process shows better wear and corrosion resistance in the motor, avoiding the generation of pinholes during electroplating, ensuring the uniform thickness and high quality of the plating layer, and extending the service life of the motor stator.
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Abstract
Description
Technical Field
[0001] The invention relates to the field of copper material processing, in particular to a composite copper wire with good wear resistance and corrosion resistance and a preparation process thereof. Background Art
[0002] Copper processing is an important part of my country's nonferrous metal industry. After years of rapid development, my country has become the world's largest copper producer and consumer, with its comprehensive strength significantly enhanced. The copper processing industry is an intermediate link in the copper industry chain and an important sector of the national economy. Copper processing products can be divided into pure copper and copper alloy products according to their copper content. Among them, the demand for copper wire has greatly increased with the rapid development of real estate and the construction of my country's power infrastructure.
[0003] In the field of motor assembly, copper wire is an important component of the motor rotor and stator. During the maintenance of the motor, the rubber sleeve between the cooling water and the chamber may age over a long period of time, causing water to enter the chamber and causing the motor stator and rotor to be corroded by the cooling water. However, the motor rotor will throw out water during operation, and the corrosion of the stator is often more serious. Therefore, a copper wire with excellent wear resistance and corrosion resistance is needed to solve the above problems. Summary of the invention
[0004] 1. Technical issues to be resolved
[0005] In view of the deficiencies in the prior art, the present invention provides a composite copper wire with good wear resistance and corrosion resistance and a preparation process thereof, which has the advantages of better wear resistance and corrosion resistance, and solves the problems in the above-mentioned background technology.
[0006] (II) Technical solution
[0007] In order to achieve the above-mentioned purpose of better wear resistance and corrosion resistance, the present invention provides the following technical solution: a composite copper wire with good wear resistance and corrosion resistance and a preparation process thereof, comprising the following preparation raw materials: copper-97%, zinc-1.7%, aluminum-0.7%, nickel-0.4% and chromium-0.2%.
[0008] Preferably, the purity of the raw materials used in the preparation is 100%.
[0009] Preferably, the following processing steps are included:
[0010] S1: Pour all raw materials into the furnace for melting;
[0011] S2: The molten raw materials are poured into the mold base for casting;
[0012] S3: After the mold base is cooled, a semi-finished copper alloy is obtained;
[0013] S4: rolling the semi-finished copper alloy into a copper column;
[0014] S5: placing the copper column after the rounding process into a wire drawing machine for wire drawing crystallization;
[0015] S6: The copper wire obtained after wire drawing is electroplated.
[0016] Preferably, the plating solution used in the electroplating treatment is a nickel-chromium alloy solution, and the pH value of the nickel-chromium alloy solution is 4-6, and the buffer added to the plating solution is a formic acid buffer. The main purpose of adding the formic acid buffer is to prevent the buffer from affecting the pH of the nickel-chromium alloy solution. The buffering pH range of formic acid is 3.75, which is compatible with the nickel-chromium alloy solution.
[0017] Preferably, the conductive salt added to the electroplating solution is ammonium chloride, and the added surfactant is alkylphenol, wherein the addition of ammonium chloride conductive salt can increase the water content in the mixed plating solution, making the coating better, wherein the addition of alkylphenol surfactant can avoid the pinhole phenomenon caused by sulfate-containing surfactants to the coating.
[0018] Preferably, the electroplating process adopts pulse electroplating, and the electroplating time is calculated using the following formula:
[0019]
[0020] in:
[0021] S represents the plating time;
[0022] w represents the intensity of the electroplating pulse;
[0023] b represents the stirring rate;
[0024] m represents the plating solution temperature;
[0025] r represents the radius of the copper wire;
[0026] μ represents the mediation coefficient.
[0027] Preferably, the stirring speed is calculated by the following formula:
[0028]
[0029] in:
[0030] μ represents the mediation coefficient;
[0031] n represents the concentration of the plating solution;
[0032] h represents the depth of the plating solution.
[0033] (III) Beneficial effects
[0034] Compared with the prior art, the present invention provides a composite copper wire with good wear resistance and corrosion resistance and a preparation process thereof, which has the following beneficial effects:
[0035] The composite copper wire with good wear resistance and corrosion resistance and its preparation process ensure the forming quality of the copper wire surface coating by strictly controlling the electroplating process and the electroplating time during the preparation process, and also prevent the generation of pinholes during the electroplating process, which brings substantial features to the use of motor stators. Compared with ordinary electroplating, the coating quality is improved and the obtained coating thickness is more uniform. DETAILED DESCRIPTION
[0036] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0037] Example 1
[0038] A preferred embodiment of a composite copper wire with good wear resistance and corrosion resistance and its preparation process provided by the present invention is as follows: A composite copper wire with good wear resistance and corrosion resistance and its preparation process, comprising the following preparation raw materials: copper-97%, zinc-1.7%, aluminum-0.7%, nickel-0.4% and chromium-0.2%.
[0039] In this embodiment, the purity of the above raw materials is 100%.
[0040] Example 2
[0041] On the basis of Example 1, a preferred embodiment of a composite copper wire with good wear resistance and corrosion resistance and a preparation process thereof provided by the present invention is as follows: comprising the following processing steps:
[0042] S1: Pour all raw materials into the furnace for melting;
[0043] S2: The molten raw materials are poured into the mold base for casting;
[0044] S3: After the mold base is cooled, a semi-finished copper alloy is obtained;
[0045] S4: rolling the semi-finished copper alloy into a copper column;
[0046] S5: placing the copper column after the rounding process into a wire drawing machine for wire drawing crystallization;
[0047] S6: The copper wire obtained after wire drawing is electroplated.
[0048] In this embodiment, the plating solution used in the electroplating treatment is a nickel-chromium alloy solution, and the pH value of the nickel-chromium alloy solution is 4-6, and the buffer added to the plating solution is a formic acid buffer. The main purpose of adding the formic acid buffer is to prevent the buffer from affecting the pH of the nickel-chromium alloy solution. The buffering pH range of formic acid is 3.75, which is compatible with the nickel-chromium alloy solution.
[0049] Furthermore, the conductive salt added to the electroplating solution is ammonium chloride, and the added surfactant is alkylphenol, wherein the addition of ammonium chloride conductive salt can increase the water content in the mixed plating solution, making the coating better, wherein the addition of alkylphenol surfactant can avoid the pinhole phenomenon caused by sulfate-containing surfactants to the coating.
[0050] Furthermore, the electroplating process uses pulse electroplating, and the electroplating time is calculated using the following formula:
[0051]
[0052] in:
[0053] S represents the plating time;
[0054] w represents the intensity of the electroplating pulse;
[0055] b represents the stirring rate;
[0056] m represents the plating solution temperature;
[0057] r represents the radius of the copper wire;
[0058] μ represents the mediation coefficient.
[0059] By measuring the electroplating time, the overall electroplating quality can be effectively guaranteed. The influencing factors are substituted into the formula to calculate the required electroplating time, and the overall electroplating process of the copper wire is strictly controlled to ensure the quality of the coating.
[0060] This electroplating process can ensure that the copper wire is more stable and has stronger corrosion resistance when used in the blister environment of the motor copper wire. It also ensures the working stability of the motor stator and facilitates the subsequent cleaning of the motor interior.
[0061] In addition, the stirring speed is calculated by the following formula:
[0062]
[0063] in:
[0064] μ represents the mediation coefficient;
[0065] n represents the concentration of the plating solution;
[0066] h represents the depth of the plating solution;
[0067] By setting the stirring rate of the plating solution, the concentration gradient of nickel and chromium ions near the electrode surface, the thickness of the diffusion layer and the increase in the pH value of the cathode area caused by a large amount of hydrogen evolution can be effectively reduced, which is beneficial to the deposition of chromium.
[0068] In summary, the composite copper wire with good wear resistance and corrosion resistance and its preparation process ensure the forming quality of the copper wire surface coating through strict control of the electroplating process and electroplating time during the preparation process, and also eliminate the generation of pinholes during the electroplating process, which brings substantial features to the use of motor stators. Compared with ordinary electroplating, the coating quality is improved and the coating thickness is more uniform.
[0069] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0070] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A composite copper wire with good wear resistance and corrosion resistance, characterized in that: The preparation comprises the following raw materials: copper-97%, zinc-1.7%, aluminum-0.7%, nickel-0.4% and chromium-0.2%.
2. The composite copper wire with good wear resistance and corrosion resistance and its preparation process according to claim 1, characterized in that: The purity of the raw materials for preparation is 100%.
3. The process for preparing a composite copper wire with good wear resistance and corrosion resistance according to claim 1, characterized in that: The processing steps include: S1: Pour all raw materials into the furnace for melting; S2: The molten raw materials are poured into the mold base for casting; S3: After the mold base is cooled, a semi-finished copper alloy is obtained; S4: rolling the semi-finished copper alloy into a copper column; S5: placing the copper column after the rounding process into a wire drawing machine for wire drawing crystallization; S6: The copper wire obtained after wire drawing is electroplated.
4. The composite copper wire with good wear resistance and corrosion resistance and its preparation process according to claim 2, characterized in that: The electroplating solution used in the electroplating treatment is a nickel-chromium alloy solution, and the pH value of the nickel-chromium alloy solution is 4-6, and the buffer added to the electroplating solution is a formic acid buffer. The main purpose of adding the formic acid buffer is to prevent the buffer from affecting the pH of the nickel-chromium alloy solution. The buffering pH range of formic acid is 3.75, which is compatible with the nickel-chromium alloy solution.
5. The composite copper wire with good wear resistance and corrosion resistance and its preparation process according to claim 2, characterized in that: The conductive salt added to the electroplating solution is ammonium chloride, and the added surfactant is alkylphenol. The addition of ammonium chloride conductive salt can increase the water content in the mixed plating solution, making the coating better. The addition of alkylphenol surfactant can avoid the pinhole phenomenon caused by sulfate-containing surfactants on the coating.
6. The composite copper wire with good wear resistance and corrosion resistance and its preparation process according to claim 2, characterized in that: The electroplating process adopts pulse electroplating, and the electroplating time is calculated using the following formula: in: S represents the plating time; w represents the intensity of the electroplating pulse; b represents the stirring rate; m represents the plating solution temperature; r represents the radius of the copper wire; μ represents the mediation coefficient; By measuring the electroplating time, the overall electroplating quality can be effectively guaranteed. The influencing factors are substituted into the formula to calculate the required electroplating time, and the overall electroplating process of the copper wire is strictly controlled to ensure the quality of the coating.
7. The composite copper wire with good wear resistance and corrosion resistance and its preparation process according to claim 5, characterized in that: The stirring speed is calculated by the following formula: in: μ represents the mediation coefficient; n represents the concentration of the plating solution; h represents the depth of the plating solution.