Integrated circuit board, circuit assembly, circuit module, radio frequency thawing device and refrigerator

Abstract

The invention discloses an integrated circuit board, a circuit assembly, a circuit module, a radio frequency thawing device and a refrigerator, the integrated circuit board comprises a substrate, a power amplifier module, a control module, an impedance matcher and a coupler, the power amplifier module, the control module, the impedance matcher and the coupler are arranged on the substrate, the power amplifier module, the control module, the impedance matcher and the coupler are separated through the ground, and the circuit assembly is arranged on the substrate. All functional module circuits can be completely independent, and mutual interference is extremely small; the power amplifier module and the coupler are both electrically connected with the control module, and the impedance matcher is electrically connected with the power amplifier module. The integrated circuit board is a compact high integrated circuit PCB (printed circuit board) integrating power amplification, coupling, tuning and control, connecting lines among functional modules are reduced, and signal attenuation caused by long lines is avoided, so that the performance of a radio frequency system is improved, and the cost is reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of integrated circuit boards, and specifically relates to an integrated circuit board, a circuit component, a circuit module, a radio frequency thawing device and a refrigerator. Background Art

[0002] Radio frequency heating systems have certain professionalism, independence, and complexity in each functional module, especially for large systems with high precision requirements, which are often used in industry and scientific research. As a mature heating method, radio frequency technology is being introduced into the field of refrigerator defrosting. Integrated defrosting drawers enable refrigerators to have defrosting functions, which has become a design trend for high-quality refrigerators.

[0003] In different RF systems, these functional modules usually have different forms. The refrigerator RF system includes RF power source, power coupler, impedance matcher and load. In existing RF refrigerators, each functional module is installed in various places in the refrigerator. In the application context of refrigerator defrosting, each functional module needs to be miniaturized and then integrated. Summary of the invention

[0004] In order to solve the problem of low integration of the current refrigerator radio frequency system, the present application provides an integrated circuit board, a circuit component, a circuit module, a radio frequency thawing device and a refrigerator.

[0005] In the first aspect of the present application: an integrated circuit board is provided, comprising a substrate, and a power amplifier module, a control module, an impedance matcher and a coupler arranged on the substrate, the power amplifier module, the control module, the impedance matcher and the coupler are separated by a ground, the power amplifier module and the coupler are electrically connected to the control module, and the impedance matcher is electrically connected to the power amplifier module.

[0006] In some embodiments, the impedance matcher is disposed at a first end of the substrate in the first direction, and the power amplifier module, the control module and the coupler are all disposed at a second end of the substrate in the first direction;

[0007] The control module is arranged on a first side of the substrate in the second direction, and the power amplifier module and the coupler are both arranged on a second side of the substrate in the second direction; the second direction is arranged at an angle to the first direction.

[0008] In some embodiments, the integrated circuit board also includes an input power supply disposed on the substrate, and the input power supply is electrically connected to the control module; the input power supply, the power amplifier module, the coupler and the impedance matcher are arranged in sequence along the first direction.

[0009] In some embodiments, the integrated circuit board also includes a power supply module disposed on the substrate, the power supply module, the power amplifier module, the control module, the impedance matcher and the coupler are separated by the ground, and the power supply module is electrically connected to the power amplifier module and the control module for supplying power to the power amplifier module and the control module.

[0010] In a second aspect of the present application: a circuit assembly is provided, comprising:

[0011] The integrated circuit board of the first aspect;

[0012] A shielding cover is arranged on the power amplifier module, the control module and the coupler, the shielding cover is provided with a middle partition rib, and the inner cavity of the shielding cover is divided into shielding rooms corresponding to the power amplifier module, the control module and the coupler one by one by the middle partition rib, and the body of the shielding cover and the middle partition rib are both in conductive contact with the ground of the integrated circuit board.

[0013] In some embodiments, the body of the shielding cover includes a top plate and side plates arranged around the edge of the top plate, and the side plates and the middle ribs are both in conductive contact with the ground of the integrated circuit board.

[0014] In some embodiments, the shielding cover is provided with more than one mounting lug; the shielding cover is provided with a mounting hole for mounting a fastener.

[0015] In a third aspect of the present application: a circuit module is provided, comprising:

[0016] The circuit assembly of the second aspect above;

[0017] A heat sink is thermally connected to the integrated circuit board.

[0018] In some embodiments, the heat sink includes a connected heat sink plate and heat sink fins; the circuit module also includes a potting box provided with a accommodating area and a through opening, the heat sink is located in a box cavity of the potting box, and the heat sink fins are passed through the through opening; the impedance matcher of the integrated circuit board is at least partially located in the accommodating area and is sealed and fixed to the potting box by potting glue.

[0019] In some embodiments, the glue potting box includes a box bottom, an inner partition and a surrounding edge arranged around the edge of the box bottom, the through opening is located at the box bottom, and the inner partition is arranged around the edge of the through opening to enclose the accommodating area together with the surrounding edge.

[0020] In some embodiments, the height of the inner partition is lower than the surrounding edge, so that the substrate of the integrated circuit board is located in the box cavity of the glue potting box.

[0021] In some embodiments, the heat sink, the shielding cover, the potting box, and the integrated circuit board are sealed and connected by the potting glue for integral potting, and the potting glue wraps the impedance matcher.

[0022] In a fourth aspect of the present application: a radio frequency thawing device is provided, comprising:

[0023] The box assembly has a first shielding cavity and a second shielding cavity which are independent of each other;

[0024] A drawer assembly, installed in the first shielding cavity, for accommodating food to be thawed;

[0025] The circuit module of the third aspect above, wherein the circuit module is disposed in the second shielding cavity;

[0026] The electrode plate is arranged in the first shielding cavity and is electrically connected to the impedance matcher of the integrated circuit board, and is used to radiate radio frequency energy into the drawer assembly to thaw the food to be thawed.

[0027] In some embodiments, the box assembly includes a shielding shell, a shielding partition and a shielding cover, the shielding partition is connected to one end of the shielding shell to form the first shielding cavity, and the shielding cover is connected to the shielding partition to form the second shielding cavity; the circuit module is connected to the shielding cover or the shielding partition.

[0028] In some embodiments, the radio frequency thawing device further comprises a power module, which is electrically connected to both the power amplifier module and the control module, and is used to supply power to the power amplifier module and the control module;

[0029] The power module is arranged in the second shielding cavity; or the power module is arranged outside the second shielding cavity and connected to the shielding cover.

[0030] In a fifth aspect of the present application: a refrigerator is provided, comprising a refrigerator body and the radio frequency thawing device of the fourth aspect, wherein the radio frequency thawing device is arranged inside the refrigerator body.

[0031] It can be seen from the above technical solution that the integrated circuit board provided by the present application, the power amplifier module, the control module, the impedance matcher and the coupler are arranged on the same substrate, and the power amplifier module, the control module, the impedance matcher and the coupler are separated by the ground, so that the circuits of each functional module can be completely independent and the mutual interference is minimal. The integrated circuit board is a compact high-integrated circuit PCB board that includes power amplifier, coupling, tuning and control, which reduces the connection lines between the functional modules and avoids the signal attenuation caused by long lines. Therefore, the performance of the radio frequency system is improved and the cost is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0033] Figure 1 A schematic diagram of the structure of an integrated circuit board in one or more embodiments of the present application is shown.

[0034] Figure 2 A schematic diagram of the structure of a circuit component in one or more embodiments of the present application is shown.

[0035] Figure 3 Shows Figure 2 Schematic diagram of the structure of the shielding cover in the circuit component.

[0036] Figure 4 A schematic diagram of the structure of the circuit module in some embodiments of the present application is shown.

[0037] Figure 5 Shows Figure 4 Front view of the circuit module.

[0038] Figure 6 Shows Figure 5 AA section view.

[0039] Figure 7 Shows Figure 4 Exploded diagram of the circuit module.

[0040] Figure 8 A schematic structural diagram of a radio frequency thawing device in some embodiments of the present application is shown.

[0041] Fig. 9 Shows Figure 8 Exploded view of the box assembly of the radio frequency thawing device.

[0042] Fig.10 An exploded view of a radio frequency thawing device in some embodiments of the present application is shown.

[0043] Fig.11 A schematic diagram of the structure of a refrigerator in some embodiments of the present application is shown.

[0044] Fig.12 Shows Fig.11 Layout diagram of the radio frequency thawing device in the inner tank of a refrigerator.

[0045] Description of the reference numerals: 101-power amplifier module, 1011-signal source, 102-control module, 103-impedance matcher, 104-power module; 106-coupler; 107-tuning inductor; 110-integrated circuit board, 111-substrate; 112-ground, 115-input power supply; 120-shielding cover, 121-body, 1211-top plate, 1212-side plate, 122-middle partition edge, 123-notch, 124-mounting lug, 125-mounting hole; 130-heat sink, 131-heat sink, 132-heat sink fin; 140-glue potting box, 141-accommodating area, 142-through opening, 143-bottom of box, 144-inner partition, 145-enclosure edge; 150-circuit module; 160-fastener; 170-circuit assembly; 200-RF thawing device, 201-first shielding cavity, 202-second shielding cavity, 203-tuning cavity; 210-box assembly, 211-shielding shell, 212-shielding partition, 213-shielding cover, 2131-air inlet, 2132-air outlet, 214-protrusion; 220-drawer assembly; 230-fan; 240-air guide; 1000-refrigerator, 300-refrigerator body, 301-refrigerating chamber, 310-first storage box, 320-small item drawer, 330-second storage box, 340-water tank, 350-liner, 351-back panel, 352-return air outlet. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0047] In addition, the present application may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides various specific examples of processes and materials, but those of ordinary skill in the art may recognize the application of other processes and / or the use of other materials.

[0048] In the related art, the refrigerator radio frequency system has the technical problem of low integration. The embodiment of the present application provides an integrated circuit board, a circuit component, a circuit module, a radio frequency thawing device and a refrigerator, which can at least solve the technical problem of low integration of the refrigerator radio frequency system to a certain extent. The present application is described below with reference to the accompanying drawings and specific embodiments:

[0049] In a first aspect of an embodiment of the present application, an integrated circuit board is provided, such as Figure 1As shown, it is an overall structural diagram of the integrated circuit board 110. The integrated circuit board 110 is applied to the radio frequency thawing system of household appliances, and is a compact high-integrated circuit PCB board including power amplifier, coupling, tuning, and control. Specifically, the integrated circuit board 110 includes a substrate 111, a power amplifier module 101, a control module 102, an impedance matcher 103, and a coupler 106. The power amplifier module 101, the control module 102, the impedance matcher 103, and the coupler 106 are arranged at different positions of the substrate 111, respectively. The power amplifier module 101, the control module 102, the impedance matcher 103, and the coupler 106 are separated from each other by a ground 112 except for the connecting wires, so that the circuits of each functional module can be completely independent and the mutual interference is minimal. Since the power amplifier module 101, the control module 102, the impedance matcher 103, and the coupler 106 are arranged on the same substrate 111, the connecting wires between the functional modules are reduced, and the signal attenuation caused by the long wires is avoided. Therefore, the performance of the radio frequency system is improved and the cost is reduced.

[0050] In the RF thawing system, the connection relationship between the power amplifier module 101, the control module 102, the impedance matcher 103 and the coupler 106 is as follows: the power amplifier module 101 and the coupler 106 are both electrically connected to the control module 102, and the impedance matcher 103 is electrically connected to the power amplifier module 101.

[0051] The power amplifier module 101 is used to generate a radio frequency signal after power amplification. The power amplifier module 101 generally includes an electrically connected signal source 1011 and a power amplifier circuit. The signal source 1011 is used to generate an initial signal of a set frequency (for example, 40.68MHz). The power amplifier circuit is used to amplify the initial signal, enhance the power of the initial signal, and output the radio frequency signal after power amplification. The radio frequency signal generated by the crystal oscillator can reach a hundred watts after being amplified step by step.

[0052] The power amplifier circuit can adopt primary amplification, secondary amplification, tertiary amplification or even more according to actual needs. The specific number of amplification stages and the circuit structure of each stage of the amplifier circuit can refer to the relevant disclosure of the prior art, and this application does not limit it. In some embodiments, in some embodiments, the power amplifier circuit adopts secondary amplification, including a primary driver and a secondary power amplifier circuit. The primary driver and the secondary power amplifier circuit are both arranged on the integrated circuit board 110, and the signal source 1011, the primary driver, the secondary power amplifier circuit, the impedance matcher 103 and the plate are electrically connected in sequence. The primary driver and the secondary power amplifier circuit amplify the initial signal emitted by the signal source 1011 step by step, and the secondary power amplifier circuit outputs the amplified signal. The specific circuit structures of the primary driver and the secondary power amplifier circuit can refer to the relevant disclosure of the prior art, and this application does not limit it.

[0053] The control module 102 is electrically connected to the signal source 1011 and the power amplifier circuit. When the power amplifier module 101 is working, it is controlled by the control system of the control module 102. The control module 102 is electrically connected to an external input device (display screen, operation panel, keyboard, etc.), receives operation instructions issued by the user, and controls the circuit operation of the power module 104 and the power amplifier module 101. The control module 102 is centered on the MCU and includes auxiliary circuits, DC / DC, drive circuits, terminal interfaces, etc. When the output power of the power amplifier module 101 needs to be adjusted, the control module 102 calculates the voltage adjustment control instruction based on the internal algorithm and sends it to the power module 104. The power module 104 adjusts the voltage to change the output voltage of the power module 104.

[0054] The impedance matcher 103 is electrically connected to the power amplifier circuit of the power amplifier module 101. The impedance matcher 103 is used to balance the load end impedance to achieve impedance matching. The impedance matching enables the RF thawing device 200 to achieve the best impedance and improve the thawing effect. The impedance matcher 103 mainly includes a relay and a capacitor. The capacitor of the impedance matcher 103 is electrically connected to the plate, and the plate is used to radiate radio frequency energy to achieve the purpose of thawing food.

[0055] The coupler 106 uses microstrip line coupling to convert power into a voltage signal to communicate with the MCU of the control module 102. Specifically, the control module 102 is electrically connected to the coupler 106, and the coupler 106 is used to detect the reflected power reflected back from the impedance matcher 103 and feed it back to the control module 102. The control module 102 performs relevant control on the signal source 1011, the power amplifier circuit and the power supply module 104 through an internal algorithm.

[0056] The power module 104 has a built-in AC / DC conversion circuit and a voltage regulation circuit for performing AC / DC conversion and voltage regulation to provide low-voltage DC power to the power amplifier module 101 and the control module 102. Fig.10 In some embodiments, the power module 104 is independently provided, and the power module 104 can be installed in the same space as the integrated circuit board 110, or can be arranged in a different space. In some embodiments, the power module can also be integrated on the integrated circuit board 110. In some embodiments, the circuit on the integrated circuit board 110 includes a power amplifier module 101, a control module 102, an impedance matcher 103, a coupler 106 and a power module, and each circuit is separated by a ground 112, and electrical conduction is achieved only through connecting wires. In the radio frequency system, the specific circuit structures of the power amplifier module 101, the control module 102, the impedance matcher 103, the coupler 106 and the power module can all refer to the relevant disclosure of the prior art, and will not be described in detail here.

[0057] The substrate 111 of the PCB circuit board is generally rectangular, with one of the length direction and the width direction of the substrate 111 being the first direction and the other being the second direction. Figure 1 In some embodiments, the impedance matcher 103 is disposed at the first end a of the substrate 111 in the first direction, and the power amplifier module 101, the control module 102 and the coupler 106 are all disposed at the second end b of the substrate 111 in the first direction. The power amplifier module 101, the control module 102 and the coupler 106 are formed as a whole and are arranged side by side with the impedance matcher 103 in the first direction. Since the impedance matcher 103 has strong electromagnetic radiation and is easy to interfere with the power amplifier module 101 and the control module 102, the impedance matcher 103 is independently disposed at the first end a of the substrate 111 in the first direction, so as to facilitate the separate shielding of the power amplifier module 101 and the control module 102.

[0058] See also Figure 1 In some embodiments, the control module 102 is disposed on the first side c of the substrate 111 in the second direction, and the power amplifier module 101 and the coupler 106 are both disposed on the second side d of the substrate 111 in the second direction. Since the control module 102 has relatively more circuit components, by arranging the whole formed by the power amplifier module 101 and the coupler 106 side by side with the control module 102, the distribution area of ​​the power amplifier module 101, the control module 102 and the coupler 106 is relatively compact, which facilitates reducing the area of ​​the entire integrated circuit board.

[0059] The circuit layout area of ​​the power amplifier module 101, the control module 102, the impedance matcher 103 and the coupler 106 is substantially rectangular. Figure 1 The signal source 1011 of the power amplifier module 101 is arranged in the rectangular layout area where the control module 102 is located, so that the circuit layout area of ​​the control module 102 is concave. On the one hand, it can prevent the circuit part from bulging outward from the edge of the substrate 111, so that the integrated circuit board 110 remains rectangular and is easy to install. On the other hand, the signal source 1011 is close to the control module 102, shortening the length of the connection line and reducing the cost of the integrated circuit board 110.

[0060] In some embodiments, the integrated circuit board 110 further includes an input power supply 115 disposed on the substrate 111. The input power supply 115 is electrically connected to the control module 102 and serves as a connection port between the integrated circuit board 110 and an external power supply. The circuit structure of the input power supply 115 is relatively simple, and the layout area is relatively small. In some embodiments, such as Figure 1 As shown, the input power supply 115 , the power amplifier module 101 , the coupler 106 and the impedance matcher 103 are arranged in sequence along the first direction to fully utilize the area of ​​the substrate 111 .

[0061] The integrated circuit board provided in the first aspect of the present application is a PCB board that highly integrates a radio frequency power amplifier circuit with a crystal oscillator and LDMOS as the core; a system control circuit with an MCU as the core; an impedance matching circuit with relays and matching capacitors as the core; and all circuit power supplies (input power supply 115). Different modules are isolated with a large area of ​​ground 112, and the circuits of each functional module are completely independent. The radio frequency signal generated by the power amplifier module 101 reaches the load end (generally referring to the place where the signal flows, here referring to the impedance matcher 103) with a small turn. The whole board is reasonably designed and has minimal mutual interference. The highly integrated PCB circuit board reduces the connecting wires between the functional modules and avoids the signal attenuation caused by long wires. Therefore, the performance of the system is improved and the cost is reduced.

[0062] In a second embodiment of the present application, a circuit assembly 170 is provided. Figure 2 , shows the overall structure of the circuit assembly 170. The circuit assembly 170 includes a shielding cover 120 and the integrated circuit board 110 of the first embodiment. The shielding cover 120 is provided to cover a part of the integrated circuit board 110, and the power amplifier module 101, the control module 102 and the coupler 106 of the integrated circuit board 110 are located inside the shielding cover 120. The shielding cover 120 is provided to achieve shielding between the power amplifier module 101, the control module 102 and the coupler 106 and the impedance matcher 103.

[0063] See also Figure 3 In some embodiments, the shielding cover 120 is provided with a middle rib 122, which is provided according to the position of the ground 112 in the integrated circuit board 110 to ensure that different functional circuit areas are completely separated. The inner cavity of the shielding cover 120 is divided into a shielding chamber A corresponding to the position of the power amplifier module 101, a shielding chamber B corresponding to the position of the control module 102, and a shielding chamber C corresponding to the position of the coupler 106 by the middle rib 122. The body 121 of the shielding cover 120 and the middle rib 122 are both in conductive contact with the ground 112 of the integrated circuit board 110. At the connection line of each module, the body 121 of the shielding cover 120 and the middle rib 122 are provided with corresponding notches 123 to avoid the connection line.

[0064] See also Figure 3In some embodiments, the shielding cover 120 is in a polygonal structure as a whole. The body 121 of the shielding cover 120 includes a top plate 1211 and a side plate 1212 surrounding the edge of the top plate 1211. The side plate 1212 realizes the shielding between the power amplifier module 101, the control module 102 and the coupler 106 and the impedance matcher 103, and the middle partition rib 122 realizes the isolation between the power amplifier module 101, the control module 102 and the coupler 106. The middle partition rib 122 is connected to both the top plate 1211 and the side plate 1212. The middle partition rib 122, the top plate 1211 and the side plate 1212 can be formed separately and fixed by welding. The shielding cover 120 can also be integrally formed by casting, and the middle partition rib 122, the top plate 1211 and the side plate 1212 are directly cast. The side plates 1212 and the middle ribs 122 are both in conductive contact with the ground 112 of the integrated circuit board 110 , and corresponding notches 123 are provided on the side plates 1212 and the middle ribs 122 at the connection lines of each module.

[0065] In some embodiments, the shielding cover 120 is connected to the integrated circuit board 110 by fasteners. Figure 1 and Figure 3 The shielding cover 120 and the integrated circuit board 110 are both provided with mounting holes 125 for mounting fasteners, and the mounting holes 125 of the integrated circuit board 110 are all located in the area where the ground 112 of the integrated circuit board 110 is located. The positions of the mounting holes 125 of the shielding cover 120 are exactly the same as the positions of the mounting holes 125 of the integrated circuit board 110. The mounting holes 125 of the shielding cover 120 are arranged at the bending part of the side plate 1212, the bending part of the middle partition rib 122, and the connection part between the side plate 1212 and the middle partition rib 122, so as to improve the structural strength of the connection part between the shielding cover 120 and the integrated circuit board 110.

[0066] See also Figure 3 In some embodiments, in order to facilitate the installation of the circuit assembly 170, one or more mounting lugs 124 are provided on the shielding cover 120. The mounting lugs 124 can be selectively provided on the top plate 1211 or the side plate 1212 of the shielding cover 120. The mounting lugs 124 are also provided with mounting holes 125 for mounting the circuit assembly 170 on the external structure through fasteners.

[0067] In a third embodiment of the present application, a circuit module 150 is provided, such as Figure 4 , Figure 5 , Figure 6 and Figure 7As shown, the overall structure diagram, main view, cross-sectional view and exploded view of the circuit module 150 in certain embodiments are respectively shown. . The circuit module 150 includes the circuit assembly 170 of the above-mentioned second aspect embodiment and the heat sink 130 for dissipating heat from the circuit assembly 170. The heat sink 130 is thermally connected to the circuit assembly 170. Since the integrated circuit board 110 in the circuit assembly 170 is a compact high-integrated circuit PCB board that includes power amplifier, coupling, tuning, and control, and generates a large amount of heat, the heat sink 130 is provided to quickly conduct heat for the heating components of the PCB board, or directly cool the heating components of the PCB board. The shielding cover 120 and the heat sink 130 are respectively arranged on different sides of the integrated circuit board 110, so that the shielding cover 120 and the heat sink 130 will not interfere with each other. The shielding cover 120 is made of metal and can also play a certain degree of heat dissipation role.

[0068] The heat sink 130 may be a metal part or a semiconductor cooling part. The metal part can conduct the heat of the integrated circuit board 110 and achieve heat dissipation through heat exchange with the air. The semiconductor cooling part can automatically generate cold energy to cool the integrated circuit board 110. In some embodiments, the heat sink 130 is provided with an air flow channel, and when the wind blows through the air flow channel, it can take away the heat of the heat sink 130.

[0069] In order to meet the requirements of installation and heat dissipation of the integrated circuit board 110, see Figure 7 The heat sink 130 includes a heat sink 131 and a plurality of heat sink fins 132. The heat sink fins 132 are distributed on one surface of the heat sink 131. The heat sink fins 132 are spaced apart so that the gaps between the heat sink fins 132 form an air flow channel. The specific number and spacing of the heat sink fins 132 are determined according to the heat dissipation requirements of the integrated circuit board 110, and are not limited in this application. In some embodiments, the heat sink 131 and the heat sink fins 132 are integrally formed. The heat sink 131 has a large mounting plane, and the integrated circuit board 110 is mounted on the mounting plane of the heat sink 131 by fasteners 160, and the integrated circuit board 110 is at least partially in contact with the heat sink 131.

[0070] Since metal is conductive, in order to ensure that the integrated circuit board 110 and the heat sink 131 are in full contact as much as possible, in some embodiments, a plurality of avoidance blind holes are provided on the installation plane of the heat sink 131, and the number and position of the avoidance blind holes completely correspond to the number and distribution of the conductors (pins of components, solder parts, wires, etc.) of the integrated circuit board 110, and the size of the avoidance blind holes is larger than the corresponding conductors on the integrated circuit board 110, so that the conductors extend into the avoidance blind holes and will not contact the heat sink 131, thereby ensuring that the integrated circuit board 110 and the heat sink 131 are closely fitted, the larger contact area is conducive to heat dissipation, and the overall structure of the integrated circuit board 110 is more stable. Since the avoidance blind holes are designed as blind holes, the problem of leakage caused by the conductors contacting water due to the design of through holes can be avoided.

[0071] Compared with the integrated circuit board 110, the heat sink 130 has a higher structural strength, so the heat sink 130 also serves as the installation base of the integrated circuit board 110 and the shielding cover 120. The integrated circuit board 110 and the shielding cover 120 are installed on the heat sink 130 through the fasteners 160. Figure 6 In some embodiments, at least two mounting lugs 124 are provided on the heat sink 131 and / or the shielding cover 120. The mounting lugs 124 can be provided on the heat sink 131 or the shielding cover 120 according to actual needs. The mounting lugs 124 are provided with fixing holes for installing fasteners 160. The fixing holes can be light holes or threaded holes. The fasteners 160 can be screws, rivets, pins, etc., which are not limited in this application.

[0072] In some embodiments, considering that the shielding cover 120 only covers part of the integrated circuit board 110, the power amplifier module 101, the control module 102 and the coupler 106 of the integrated circuit board 110 are located inside the shielding cover 120. The impedance matcher 103 is exposed outside the shielding cover 120. When the integrated circuit board 110 is installed outside the device, the impedance matcher 103 needs to be protected from water, dust and insects. If the integrated circuit board 110 is installed inside the device, for example, inside the refrigerator, the temperature inside the refrigerator is relatively low, and heat will be generated during the thawing process. The cold and hot shock will produce condensation, which is easy to damage the exposed impedance matcher 103. For this reason, in some embodiments, the impedance matcher 103 is coated with potting glue, which is filled between the various electronic components of the impedance matcher 103, and fully covers the various pins, wires and electronic components, which is not only waterproof, dustproof and insect-proof, but also plays a role in increasing heat dissipation. The potting glue may only wrap the impedance matcher 103 . In some embodiments, the integrated circuit board 110 and the shielding cover 120 may also be potted as a whole to form a whole. The potting glue may conduct the heat generated by the components on the integrated circuit board 110 to the shielding cover 120 .

[0073] In some embodiments, to facilitate the glue filling on the impedance matcher 103, please refer to Figure 4 , Figure 5 , Figure 6 and Figure 7 The circuit module 150 further includes a potting box 140 , the substrate of the integrated circuit board 110 is located in a box cavity of the potting box 140 , and the impedance matcher 103 is sealed and fixed to the potting box 140 by potting glue.

[0074] See also Figure 7 In some embodiments, the glue potting box 140 is provided with a containing area 141 and a through hole 142. The heat sink 130 protrudes out of the glue potting box 140 through the through hole 142. The through hole 142 is an opening that penetrates the glue potting box 140. The heat sink 130 is arranged in the through hole 142. The heat sink 130 can at least partially extend out of the glue potting box 140 through the through hole 142. The part of the heat sink 130 extending out of the glue potting box 140 can exchange heat with the wind flow, thereby dissipating heat for the integrated circuit board 110. In some embodiments, the heat sink 131 of the heat sink 130 is located in the box cavity of the glue potting box 140, and the heat sink fins 132 extend out of the glue potting box 140. The components of the impedance matcher 103 are at least partially located in the containing area 141. When the impedance matcher 103 is potted with glue, the containing area 141 can store glue, so that the impedance matcher 103 is sealed and fixed to the glue potting box 140 by the potting glue.

[0075] The glue potting box 140 is a box body with an opening on one side, and the size of its box cavity should be larger than the board area of ​​the integrated circuit board 110, so that the integrated circuit board 110 can be placed in the box cavity of the glue potting box 140. Figure 7 In some embodiments, the glue potting box 140 includes a box bottom 143, an inner partition 144, and a surrounding edge 145 arranged around the edge of the box bottom 143, and a through opening 142 is formed by hollowing out part of the box bottom 143. The inner partition 144 is arranged at the edge of the through opening 142, and the inner partition 144 can be arranged close to the edge of the through opening 142, or can be spaced from the edge of the through opening 142. The end of the inner partition 144 is connected to the surrounding edge 145, and the bottom is connected to the box bottom 143, so that the inner partition 144 and the surrounding edge 145 enclose a receiving area 141. The various parts of the glue potting box 140 can be fixedly connected by bonding, welding, etc. In some embodiments, the glue potting box 140 is integrally formed by injection molding.

[0076] See also Figure 7In some embodiments, the height of the inner partition 144 of the potting box 140 is lower than the surrounding edge 145, so that when the integrated circuit board 110 is placed in the box cavity of the potting box 140, the substrate of the integrated circuit board 110 is located in the box cavity of the potting box 140, and the electronic components of the integrated circuit board 110 are at least partially located in the box cavity, so that the potting glue can stay in the area surrounded by the substrate of the integrated circuit board 110, the inner partition 144 and the surrounding edge 145, so as to at least encapsulate the connection between the electronic components in the accommodating area 141 and the substrate, or pot the electronic components in the accommodating area 141 as a whole. The potting glue completely covers each pin, wire and electronic component, which is not only waterproof, dustproof and insect-proof, but also plays a role in increasing heat dissipation.

[0077] In some embodiments, the heat sink 130, the shielding cover 120, the glue potting box 140 and the integrated circuit board 110 are sealed and connected by the integrally potted potting glue, the potting glue wraps the impedance matcher, and the potting glue wraps the heat sink 130, the shielding cover 120, the glue potting box 140 and the connection of the integrated circuit board 110, so that the heat sink 130, the shielding cover 120, the glue potting box 140 and the integrated circuit board 110 form a whole, and the whole is installed as a component during installation, which is convenient for installation. In other embodiments, the heat sink 130, the shielding cover 120, the glue potting box 140 and the integrated circuit board 110 can also be connected only by threaded fasteners to facilitate the disassembly and maintenance of each component.

[0078] In the fourth embodiment of the present application, a radio frequency thawing device 200 is provided, see Figure 8 , shows the overall structure of the radio frequency thawing device 200. The radio frequency thawing device 200 includes a box assembly 210, a drawer assembly 220, a plate (not visible in the figure) and a circuit module 150 of the third embodiment of the above-mentioned aspect. Fig. 9 The box assembly 210 has a first shielding cavity 201 and a second shielding cavity 202 which are independent of each other, the drawer assembly 220 is installed in the first shielding cavity 201, the interior of the drawer assembly 220 is used to accommodate the food to be thawed, and the circuit module 150 is arranged in the second shielding cavity 202. The plate is arranged in the first shielding cavity 201, and the plate is electrically connected to the impedance matcher 103 of the integrated circuit board 110, and is used to radiate radio frequency energy into the drawer assembly 220 to thaw the food to be thawed.

[0079] See also Fig. 9In some embodiments, the box assembly 210 includes a shielding shell 211, a shielding partition 212, and a shielding cover 213. The shielding partition 212 is connected to one end of the shielding shell 211 to form a first shielding cavity 201. One end of the shielding shell 211 is open for the drawer assembly 220 to pull and move. The shielding cover 213 is connected to the shielding partition 212 to form a second shielding cavity 202. The circuit module 150 can be selectively connected to the shielding cover 213 or the shielding partition 212. In some embodiments, the power module 104 is also disposed in the second shielding cavity 202.

[0080] The power of the circuit module 150 can be provided by an independent power module, or by an electrical device installed with the circuit module 150. In some embodiments, the circuit module 150 is powered by an independent power module, see Fig.10 The power module 104 is disposed outside the second shielding cavity 202 , and the power module 104 is connected to the shielding cover 213 , thereby shortening the wiring length between the power module 104 and the integrated circuit board 110 .

[0081] See also Figure 8 and Fig. 9 In some embodiments, a protrusion 214 is provided at the bottom of the shielding shell 211, and the protrusion 214 is protruded from the shielding shell 211 in a direction away from the first shielding cavity 201, so that the first shielding cavity 201 can be expanded inside the protrusion 214 to form a tuning cavity 203, and the electrode plate of the RF thawing system 100 is arranged in the tuning cavity 203. In addition, the protrusion 214 serves as the tuning cavity 203 to accommodate the electrode plate, and also plays a role in strengthening the structural strength of the shielding shell 211, thereby reducing the probability of magnetic leakage due to damage to the shielding shell 211 to a certain extent.

[0082] See also Fig.10 In some embodiments, the tuning inductor 107 of the impedance matcher 103 is arranged outside the integrated circuit board 110, specifically located in the second shielding cavity 202, and the shape of the shielding cover 213 is designed according to the shapes of the circuit module 150 and the tuning inductor 107. For example, the circuit module 150 is roughly rectangular box-shaped, and the tuning inductor 107 is a hollow winding inductor, which is cylindrical as a whole. Then the shielding cover 213 includes two rectangular parts, which are used to accommodate the circuit module 150 and the tuning inductor 107 respectively.

[0083] See also Fig.10In some embodiments, the RF thawing device 200 is further provided with a heat dissipation component for dissipating heat from the integrated circuit board 110, and the heat dissipation component includes a fan 230 and an air guide 240. Since the integrated circuit board 110 is installed in the second shielding cavity 202, an air inlet 2131 and an air outlet 2132 are provided on the shielding cover 213 that forms the second shielding cavity 202. The air inlet 2131 and the air outlet 2132 are both connected to the second shielding cavity 202. The fan 230 is installed on the shielding cover 213 or the structural member around the RF thawing device 200. The air inlet end of the fan 230 is connected to the air inlet 2131, and the air outlet end is connected to the air guide 240, which is used to discharge the air in the second shielding cavity 202 from the air outlet 2132 to the outside of the air guide 240.

[0084] When the RF thawing device 200 is installed in the refrigerator compartment or freezer compartment, since the air inlet 2131 is connected to the refrigerator compartment or freezer compartment at the same time, the cold air in the refrigerator compartment or freezer compartment can be introduced into the second shielding cavity 202. After entering the second shielding cavity 202, the cold air exchanges heat with the heat dissipation fins 132, so that the heat dissipation fins 132 cool the integrated circuit board 110. The hot air after the heat exchange is drawn out to the air guide 240 by the fan 230 through the air outlet 2132. Please refer to Fig.10 In some embodiments, the air outlet of the air guide 240 can be connected to the return air port 352 provided on the refrigerator back plate 351, so that the hot air after heat exchange enters the refrigeration device through the return air channel of the refrigerator, and re-forms cold air after heat exchange and returns to the refrigeration chamber or the freezer. In some embodiments, the air outlet of the air guide 240 can also be exposed, and the hot air is directly discharged to the outside of the refrigerator through the air guide 240.

[0085] In a fifth embodiment of the present application, a refrigerator 1000 is provided. Fig.11 , shows a schematic structural diagram of a refrigerator 1000. The refrigerator 1000 includes a refrigerator body 300 and a radio frequency thawing device 200 according to the fourth embodiment, and the radio frequency thawing device 200 is arranged inside the refrigerator body 300. The refrigerator body 300 is a basic component of the refrigerator 1000, and the refrigerator body 300 can provide an installation foundation for at least some of the other components of the refrigerator 1000, and can also protect at least some of the other components of the refrigerator 1000.

[0086] In some embodiments, the refrigerator body 300 has a freezing chamber, a refrigerating chamber 301 and a variable temperature chamber, and the radio frequency thawing device 200 can be arranged in any one of the freezing chamber, the refrigerating chamber 301 and the variable temperature chamber. Fig.12, the radio frequency thawing device 200 is arranged in the cold storage chamber 301 of the refrigerator 1000. The cold storage chamber 301 of the refrigerator 1000 has an air duct, and the inner tank 350 of the cold storage chamber 301 of the refrigerator 1000 is partially concave at a position corresponding to the radio frequency thawing device 200, and the concave position is a part of the air duct. When the radio frequency thawing device 200 is installed in the inner tank 350, the protrusion 214 is located in the concave position, so that the protrusion 214 does not occupy the original installation space of the shielding shell 211 in the cold storage chamber 301. In some embodiments, the protrusion 214 and the inner tank 350 are arranged at intervals to ensure that air flows between the protrusion 214 and the inner tank 350, thereby ensuring that the heat in the tuning cavity 203 is taken away by the air, and enhancing the heat dissipation effect of the tuning cavity 203.

[0087] In some embodiments, see Fig.12 , the refrigerator 1000 also includes a first storage box 310, a small item drawer 320, a second storage box 330 and a water tank 340. The small item drawer 320 is stacked with the radio frequency thawing device 200 in the height direction and is located on one side of the width direction of the refrigerator 1000, and the first storage box 310 is placed on the other side of the width direction of the refrigerator 1000. Considering that the radio frequency thawing device 200 is relatively heavy, the radio frequency thawing device 200 is directly installed on the inner tank 350 and is located in the bottom space of the inner tank 350. The second storage box 330 and the water tank 340 are located on the upper layer of the small item drawer 320 and the first storage box 310, and the second storage box 330 and the water tank 340 are also arranged side by side in the width direction of the refrigerator 1000. Other undetailed contents of the refrigerator 1000 can refer to the relevant disclosure of the prior art, which will not be described here.

[0088] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0089] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise" and "counterclockwise" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0090] It should be noted that all directional indications in the embodiments of the present application are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0091] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0092] In addition, in the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0093] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0094] In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0095] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An integrated circuit board (110), characterized in that: The invention comprises a substrate (111), and a power amplifier module (101), a control module (102), an impedance matcher (103) and a coupler (106) which are arranged on the substrate (111); the power amplifier module (101), the control module (102), the impedance matcher (103) and the coupler (106) are separated by a ground (112); the power amplifier module (101) and the coupler (106) are both electrically connected to the control module (102); and the impedance matcher (103) is electrically connected to the power amplifier module (101).

2. The integrated circuit board (110) according to claim 1, characterized in that: The impedance matcher (103) is arranged at a first end of the substrate (111) in a first direction, and the power amplifier module (101), the control module (102) and the coupler (106) are all arranged at a second end of the substrate (111) in the first direction; The control module (102) is arranged on a first side of the substrate (111) in a second direction, and the power amplifier module (101) and the coupler (106) are both arranged on a second side of the substrate (111) in the second direction; the second direction is arranged at an angle to the first direction.

3. The integrated circuit board (110) as claimed in claim 2, characterized in that: The integrated circuit board (110) further comprises an input power supply (115) arranged on the substrate (111), and the input power supply (115) is electrically connected to the control module (102); the input power supply (115), the power amplifier module (101), the coupler (106) and the impedance matcher (103) are arranged in sequence along the first direction.

4. The integrated circuit board (110) according to any one of claims 1 to 3, characterized in that: The integrated circuit board (110) further comprises a power module (104) arranged on the substrate (111); the power module (104), the power amplifier module (101), the control module (102), the impedance matcher (103) and the coupler (106) are separated by a ground (112); the power module (104) is electrically connected to the power amplifier module (101) and the control module (102) and is used to supply power to the power amplifier module (101) and the control module (102).

5. A circuit assembly (170), characterized in that: include: The integrated circuit board (110) according to any one of claims 1 to 4; A shielding cover (120) is provided on the power amplifier module (101), the control module (102) and the coupler (106); the shielding cover (120) is provided with a middle partition rib (122); the inner cavity of the shielding cover (120) is divided into shielding chambers corresponding to the power amplifier module (101), the control module (102) and the coupler (106) one by one by the middle partition rib (122); the body (121) of the shielding cover (120) and the middle partition rib (122) are both in conductive contact with the ground (112) of the integrated circuit board (110).

6. The circuit assembly (170) of claim 5, wherein: The body (121) of the shielding cover (120) comprises a top plate (1211) and a side plate (1212) arranged around the edge of the top plate (1211), and the side plate (1212) and the middle rib (122) are both in conductive contact with the ground (112) of the integrated circuit board (110).

7. The circuit assembly (170) of claim 5, wherein: The shielding cover (120) is provided with one or more mounting lugs; the shielding cover (120) is provided with mounting holes for mounting fasteners.

8. A circuit module (150), characterized in that: include: The circuit assembly (170) of any one of claims 5 to 7; A heat sink (130) is thermally connected to the integrated circuit board (110).

9. The circuit module (150) according to claim 8, characterized in that: The heat sink (130) comprises a heat sink plate (131) and heat sink fins (132) which are connected. The circuit module (150) further comprises a potting box (140) provided with a housing area (141) and a through opening (142). The heat sink plate (131) is located in a box cavity of the potting box (140), and the heat sink fins (132) are inserted through the through opening (142). The impedance matcher (103) of the integrated circuit board (110) is at least partially located in the housing area (141) and is sealed and fixed to the potting box (140) by potting glue.

10. The circuit module (150) according to claim 9, characterized in that: The glue potting box (140) comprises a box bottom (143), an inner partition (144) and a surrounding edge (145) arranged around the edge of the box bottom (143); the through opening (142) is located at the box bottom (143); the inner partition (144) is arranged around the edge of the through opening (142) to enclose the accommodating area (141) together with the surrounding edge (145).

11. The circuit module (150) according to claim 10, characterized in that: The height of the inner partition (144) is lower than that of the surrounding edge (145), so that the substrate (111) of the integrated circuit board (110) is located in the box cavity of the glue potting box (140).

12. The circuit module (150) according to claim 9, characterized in that: The heat sink (130), the shielding cover (120), the potting box (140) and the integrated circuit board (110) are sealed and connected by the potting glue for integral potting, and the potting glue wraps the impedance matcher (103).

13. A radio frequency thawing device (200), characterized in that: include: A box assembly (210) having a first shielding cavity (201) and a second shielding cavity (202) that are independent of each other; A drawer assembly (220), installed in the first shielding cavity (201), and used for accommodating food to be thawed; The circuit module (150) according to any one of claims 8 to 12, wherein the circuit module (150) is arranged in the second shielding cavity; An electrode plate is disposed in the first shielding cavity (201) and is electrically connected to the impedance matcher (103) of the integrated circuit board (110), and is used to radiate radio frequency energy into the drawer assembly (220) to thaw the food to be thawed.

14. The radio frequency thawing device (200) according to claim 13, characterized in that: The box assembly (210) comprises a shielding shell (211), a shielding partition (212) and a shielding cover (213); the shielding partition (212) is connected to one end of the shielding shell (211) to form the first shielding cavity (201); the shielding cover (213) is connected to the shielding partition (212) to form the second shielding cavity (202); the circuit module (150) is connected to the shielding cover (213) or the shielding partition (212).

15. The radio frequency thawing device (200) according to claim 14, characterized in that: The radio frequency thawing device (200) further comprises a power module (104), wherein the power module (104) is electrically connected to the power amplifier module (101) and the control module (102), and is used to supply power to the power amplifier module (101) and the control module (102); The power module (104) is arranged in the second shielding cavity (202); or the power module (104) is arranged outside the second shielding cavity (202) and connected to the shielding cover (213).

16. A refrigerator (1000), characterized in that: The invention comprises a refrigerator body (300) and a radio frequency thawing device (200) according to any one of claims 13 to 15, wherein the radio frequency thawing device (200) is arranged inside the refrigerator body (300).

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