Automatic semiconductor wafer cleaning and drying equipment

Abstract

The invention belongs to the technical field of wafer processing, and discloses automatic semiconductor wafer cleaning and drying equipment which comprises a base, the base adopts a shell-drawing design, a rotating mechanism is arranged on the inner curved surface of the base, and second telescopic rods are symmetrically and fixedly installed in the middles of the front side and the rear side of the upper surface of the base. Push plates are symmetrically and fixedly installed on the inner sides of the telescopic ends of the two second telescopic rods, a cross-shaped base is fixedly installed on the upper portions of the inner side faces of the telescopic ends of the two second telescopic rods, and a mounting plate is fixedly installed in the middle of the upper surface of the cross-shaped base. By starting the ultrasonic mechanism, ultrasonic waves generated by the ultrasonic mechanism penetrate through cleaning liquid on the surface of the wafer to cause the surface of the wafer to vibrate up and down, so that attachments on the surface of the wafer are further separated, and the cleaning effect on the surface of the wafer is improved; and the amount of the cleaning liquid flowing into the inner cavity of the nozzle through the sliding shell is reduced, so that the problems of poor cleaning effect and serious waste of cleaning materials of the existing wafer cleaning device are solved.

Description

Technical Field

[0001] This invention belongs to the field of wafer processing technology, specifically an automated semiconductor wafer cleaning and drying equipment. Background Technology

[0002] An automated semiconductor wafer cleaning and drying equipment is a highly integrated production device designed specifically for the semiconductor industry. It aims to clean and dry wafers through an automated process. This equipment requires advanced cleaning technology and an efficient drying mechanism to ensure the cleanliness and dryness of the wafer surface, meeting the high standards required in the semiconductor manufacturing process.

[0003] However, current traditional wafer cleaning and drying methods often rely on manual operation or semi-automated equipment, which are inefficient, unstable, and difficult to precisely control the cleaning effect, especially in high-precision semiconductor manufacturing processes. In addition, conventional single cleaning and drying modules cannot effectively remove tiny particles, thin film contaminants, or water spots, easily causing residual impurities or moisture on the wafer surface, increasing the defect rate and affecting the yield. Furthermore, the flow rates of cleaning fluid and nitrogen used in existing wafer cleaning and drying equipment remain constant during operation. However, when cleaning and drying from the center of the wafer to the outside, the area to be cleaned and dried continuously decreases. Controlling the flow rates of cleaning fluid and nitrogen to maximize the cleaning area leads to waste of cleaning fluid and nitrogen materials, resulting in increased production costs. Summary of the Invention

[0004] The purpose of this invention is to provide an automated semiconductor wafer cleaning and drying equipment to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an automated semiconductor wafer cleaning and drying equipment, comprising a base, the base adopting a shell-drawing design, a rotating mechanism provided on the inner curved surface of the base, second telescopic rods symmetrically fixedly installed at the center of the front and rear sides of the upper surface of the base, push plates symmetrically fixedly installed on the inner sides of the telescopic ends of the two second telescopic rods, a cross seat fixedly installed on the upper part of the inner side of the telescopic ends of the two second telescopic rods, an mounting plate fixedly installed on the center of the upper surface of the cross seat, a threaded sleeve rod threadedly connected to the center of the mounting plate, a toothed sleeve slidably sleeved on the upper part of the outer curved surface of the threaded sleeve rod, a driving component fixedly installed on the upper surface of the mounting plate, a drive gear fixedly installed at the output end of the driving component, and the toothed sleeve and... The driving gears mesh with each other. The inner curved surface of the threaded sleeve is equipped with an air jet mechanism. The bottom of the threaded sleeve is equipped with an unfolding mechanism. Symmetrical spraying mechanisms are slidably sleeved on the front and rear sides of the cross seat. Each spraying mechanism includes a sliding shell, which is slidably sleeved with the cross seat. An input sleeve is fixedly sleeved on the upper part of the sliding shell. The input sleeve is fixedly sleeved with the output end of the external cleaning fluid input device. Sealing blocks are slidably sleeved on both sides of the sliding shell. A nozzle is fixedly sleeved on the bottom of the sliding shell. An ultrasonic mechanism is slidably sleeved on the left and right sides of the middle of the cross seat. Each ultrasonic mechanism includes a sliding block, which is slidably sleeved with the cross seat. An ultrasonic head is fixedly installed on the bottom surface of the sliding block. An infrared mechanism is provided between each of the two adjacent nozzles and ultrasonic heads.

[0006] Preferably, the rotating mechanism includes a mounting base, which is fixedly sleeved on the middle of the inner curved surface of the base. An isolation seat is fixedly sleeved on the upper part of the inner curved surface of the base. A first driving member is fixedly installed on the middle of the upper surface of the mounting base. The output shaft of the first driving member is movably sleeved on the middle of the isolation seat. An eccentric disk is fixedly installed at the top of the output shaft of the isolation seat. A first telescopic rod is fixedly installed on the side of the upper surface of the eccentric disk away from its center. A suction cup is fixedly installed at the top of the first telescopic rod. The suction cup is made of flexible rubber.

[0007] Preferably, the jetting mechanism includes a cone head, which is fixedly sleeved on the bottom of the inner curved surface of the threaded sleeve rod. The cone head is cone-shaped to guide the nitrogen flowing out of the bottom of the threaded sleeve rod. A first guide block is fixedly installed at the bottom end of the cone head. A valve body is fixedly sleeved on the bottom of the inner curved surface of the threaded sleeve rod. The valve body is located above the cone head. A bottom hole is opened on the outer side of the bottom surface of the valve body. A central hole is opened in the middle of the upper surface of the valve body. Multiple side holes are equidistantly opened on the inner curved surface of the central hole. A piston is slidably sleeved on the inner curved surface of the central hole. The contact surface between the central hole and the piston is a smooth surface. A push rod is fixedly installed on the top end of the piston. A second guide block is fixedly installed on the top end of the push rod. A sleeve is fixedly sleeved on the outer curved surface of the second guide block. The outer curved surface of the sleeve is slidably sleeved with the inner curved surface of the threaded sleeve rod. The sleeve is fixedly connected to the output end of an external nitrogen input device.

[0008] Preferably, the unfolding mechanism includes a rotating sleeve, which is movably sleeved on the bottom of the outer curved surface of the threaded sleeve rod. A plurality of first movable seats are fixedly installed at equal intervals around the outer curved surface of the rotating sleeve. A curved rod is movably sleeved on the middle of each of the plurality of first movable seats. A second movable seat is movably sleeved on the end of each of the plurality of curved rods away from the first movable seats. The front and rear two second movable seats are fixedly installed on the bottom surface of the sliding shell on the same side, and the left and right two second movable seats are fixedly installed on the bottom surface of the sliding block on the same side.

[0009] Preferably, the infrared mechanism includes two housings, which are respectively fixedly installed on the side of the sliding housing adjacent to the sliding block. A sleeve rod is slidably sleeved on the middle of the two housings. An elastic element is fixedly installed on the side of the inner cavity of the sleeve rod away from the sliding block. The elastic element is fixedly connected to the sliding block on the same side. A middle block is fixedly installed on the middle of the bottom surface of the elastic element. An infrared head is fixedly installed on the bottom end of the middle block.

[0010] Preferably, the outer curved surface of the threaded sleeve is provided with multiple guide grooves at equal intervals, the toothed sleeve is slidably sleeved with the guide grooves, the upper and lower parts of the drive gear protrude to the side away from the center, and the toothed sleeve meshes with the middle part of the drive gear.

[0011] Preferably, the sealing block slides in contact with the push plate on the same side, the side of the push plate near the sliding shell is inclined, and both the push plate and the sliding shell are made of magnets.

[0012] The beneficial effects of this invention are as follows:

[0013] 1. This invention uses a rotating mechanism to drive the wafer it adsorbs to rotate eccentrically. This causes the cleaning liquid sprayed onto the wafer surface by the spraying mechanism to flow along the wafer surface from the center to the outside of the wafer under the action of centrifugal force. The eccentrically rotating wafer compensates for the areas that cannot be sprayed by the multiple spraying mechanisms. When the centrifugally flowing cleaning liquid on the wafer surface is used as a static reference, the eccentrically rotating wafer rubs against the cleaning liquid at different angles, making it easier for the deposits on the wafer surface to shake off. At the same time, when the cleaning liquid is sprayed onto the wafer surface, the ultrasonic mechanism is activated. The ultrasonic waves generated by the ultrasonic mechanism pass through the cleaning liquid on the wafer surface, causing the wafer surface to vibrate up and down, thereby further removing the deposits on the wafer surface and improving the cleaning effect of the wafer surface.

[0014] 2. Next, the threaded sleeve drives the unfolding mechanism to move upward. The unfolding mechanism pushes the spraying mechanism and ultrasonic mechanism, which are fixedly connected to it, to move away from the threaded sleeve. At this time, the push plate pushes the sealing block to move towards the middle of the sliding shell. The amount of cleaning fluid flowing into the inner cavity of the nozzle through the sliding shell is reduced, so that the upper surface of the wafer is in close contact with the bottom of the nozzle. At the same time, the adhering substances on the wafer surface are pushed from the middle of the wafer to the outside of the wafer to improve the overall cleaning effect of the wafer surface. Meanwhile, as the annular area formed between the nozzle and the wafer decreases, the amount of cleaning fluid sprayed by the nozzle onto the upper surface of the wafer is reduced, improving the cleaning fluid utilization efficiency.

[0015] 3. In this invention, when the threaded sleeve moves upward, the distance between the cone and the wafer increases, thereby gradually increasing the size of the nitrogen ring ejected by the jetting mechanism. Simultaneously, the upward-moving mounting plate drives the valve body upward, increasing the height of the side hole above the piston top surface. The amount of nitrogen flowing from the inner cavity of the threaded sleeve through the middle hole, push rod, bottom hole, and first through block out of the cone gradually increases with the nitrogen ring, thus achieving timely nitrogen application to the cleaning fluid on the wafer surface to dry the wafer, following the change in nozzle position. Simultaneously, the nitrogen output is adjusted according to the size of the nitrogen ring to reduce unnecessary nitrogen consumption. Furthermore, when the threaded sleeve moves the spraying mechanism and ultrasonic mechanism away from the threaded sleeve via the unfolding mechanism, the nozzle and sleeve drive the infrared head of the infrared mechanism to move away from the threaded sleeve. The infrared head further heats and dries the wafer surface through which the nitrogen passes, rapidly removing residual moisture and preventing water spots from forming. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall appearance and structure of the present invention;

[0017] Figure 2 This is a schematic diagram of the rotating mechanism of the present invention;

[0018] Figure 3 This is a schematic diagram of the unfolding mechanism of the present invention;

[0019] Figure 4 This is a schematic diagram of the jet mechanism structure of the present invention;

[0020] Figure 5 This is a schematic diagram of the liquid spraying mechanism of the present invention;

[0021] Figure 6 This is a schematic diagram of the infrared mechanism structure of the present invention.

[0022] In the diagram: 1. Base; 2. Rotating mechanism; 201. Mounting seat; 202. Isolation seat; 203. First driving component; 204. Eccentric disc; 205. First telescopic rod; 206. Suction cup; 3. Second telescopic rod; 301. Push plate; 4. Cross seat; 5. Mounting plate; 6. Threaded sleeve; 601. Gear sleeve; 602. Driving component; 603. Drive gear; 7. Air jet mechanism; 701. Cone; 702. First through block; 703. Valve body; 704. Bottom hole; 705. Middle hole; 706. Side hole; 707. Piston; 708, Push rod; 709, Second through block; 710, Sleeve; 8, Deployment mechanism; 801, Rotating sleeve; 802, First movable seat; 803, Crank rod; 804, Second movable seat; 9, Spraying mechanism; 901, Sliding shell; 902, Input sleeve; 903, Sealing block; 904, Nozzle; 10, Ultrasonic mechanism; 1001, Sliding block; 1002, Ultrasonic head; 11, Infrared mechanism; 1101, Shell; 1102, Sleeve rod; 1103, Elastic element; 1104, Middle block; 1105, Infrared head. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] like Figures 1 to 6As shown, this embodiment of the invention provides an automated semiconductor wafer cleaning and drying equipment, including a base 1. The base 1 adopts a shell-drawing design, thereby reducing the material consumption and production cost during the production of the base 1. A rotating mechanism 2 is provided on the inner curved surface of the base 1. Second telescopic rods 3 are symmetrically fixedly installed on the middle of the front and rear sides of the upper surface of the base 1. Push plates 301 are symmetrically fixedly installed on the inner sides of the telescopic ends of the two second telescopic rods 3. A cross seat 4 is fixedly installed on the upper part of the inner side of the telescopic ends of the two second telescopic rods 3. An installation plate 5 is fixedly installed on the middle of the upper surface of the cross seat 4. A threaded sleeve 6 is threadedly connected to the middle of the installation plate 5. A toothed sliding sleeve 601 is slidably sleeved on the upper part of the outer curved surface of the threaded sleeve 6. Multiple teeth are equidistantly formed on the circumference of the outer curved surface of the threaded sleeve 6. A guide groove is provided, and the toothed sleeve 601 is slidably sleeved with the guide groove. This allows the toothed sleeve 601 to rotate, and at the same time, drive the threaded sleeve rod 6 to rotate. The threaded sleeve rod 6 can move upward along the inner curved surface of the toothed sleeve 601. A driving component 602 is fixedly installed on the upper surface of the mounting plate 5. A drive gear 603 is fixedly installed at the output end of the driving component 602. The toothed sleeve 601 and the drive gear 603 mesh with each other. The upper and lower parts of the drive gear 603 protrude to the side away from its center. The toothed sleeve 601 meshes with the middle part of the drive gear 603. This allows the drive gear 603 to limit the vertical movement of the toothed sleeve 601 and prevent the toothed sleeve 601 from sliding downward along the threaded sleeve rod 6 and disengaging from the drive gear 603.

[0025] The threaded sleeve 6 has an air jet mechanism 7 on its inner curved surface and an unfolding mechanism 8 at its bottom. Symmetrical spraying mechanisms 9 are slidably fitted onto the front and rear sides of the cross seat 4. Each spraying mechanism 9 includes a sliding shell 901, which is slidably fitted onto the cross seat 4. An input sleeve 902 is fixedly fitted onto the upper part of the sliding shell 901, and the input sleeve 902 is fixedly fitted onto the output end of an external cleaning fluid input device. Sealing blocks 903 are slidably fitted onto both sides of the sliding shell 901, and a nozzle 904 is fixedly fitted onto the bottom of the sliding shell 901. The sealing blocks 903 slide in contact with the push plate 301 on the same side. The side of the push plate 301 closest to the sliding shell 901 is inclined. Both the push plate 301 and the sliding shell 901 are made of magnets. The straight-line distance between two adjacent push plates 301 near the threaded sleeve rod 6 is greater than the straight-line distance between two adjacent push plates 301 away from the threaded sleeve rod 6. This allows the push plate 301 to push the sealing block 903, which is slidably connected to it, to slide towards the sliding shell 901 when the sliding shell 901 moves away from the threaded sleeve rod 6, thereby reducing the flow rate of the cleaning fluid flowing through the sliding shell 901. Ultrasonic mechanisms 10 are slidably connected to the left and right sides of the middle of the cross seat 4. The ultrasonic mechanism 10 includes a sliding block 1001, which is slidably connected to the cross seat 4. An ultrasonic head 1002 is fixedly installed on the bottom surface of the sliding block 1001. An infrared mechanism 11 is provided between each of the two adjacent nozzles 904 and the ultrasonic head 1002.

[0026] like Figure 1 and Figure 2 As shown, the rotating mechanism 2 includes a mounting base 201, which is fixedly sleeved in the middle of the inner curved surface of the base 1. An isolation seat 202 is fixedly sleeved on the upper part of the inner curved surface of the base 1. A first driving member 203 is fixedly installed in the middle of the upper surface of the mounting base 201. The output shaft of the first driving member 203 is movably sleeved in the middle of the isolation seat 202. An eccentric disk 204 is fixedly installed at the top of the output shaft of the isolation seat 202. A first telescopic rod 205 is fixedly installed on the side of the upper surface of the eccentric disk 204 away from its center. A suction cup 206 is fixedly installed at the top of the first telescopic rod 205. The suction cup 206 is made of rubber, so that when the wafer is placed on the upper surface of the suction cup 206, the wafer squeezes the suction cup 206 to deform, expelling the air in the cavity of the suction cup 206, and the suction cup 206 adsorbs and fixes the wafer.

[0027] like Figure 1 , Figure 3 and Figure 4 As shown, the jetting mechanism 7 includes a cone head 701, which is fixedly sleeved on the bottom of the inner curved surface of the threaded sleeve 6. The cone head 701 is cone-shaped, thereby guiding the nitrogen gas flowing out of the bottom of the threaded sleeve 6. When the threaded sleeve 6 moves upward, the nitrogen gas sprayed onto the wafer surface moves in a ring towards the outer edge of the wafer, thereby pushing the cleaning fluid on the wafer surface from the center to the outer edge and drying it, reducing the moisture that needs to be dried on the wafer surface, improving drying efficiency, and preventing the formation of stains. A first through block 702 is fixedly installed at the bottom end of the cone head 701, and a valve body 703 is fixedly sleeved on the bottom of the inner curved surface of the threaded sleeve 6. The valve body 703 is located above the cone head 701. A bottom hole 704 is provided on the outer side of the bottom surface of the valve body 703. A central hole 705 is provided in the middle of the upper surface of the valve body 703. Multiple side holes 706 are provided at equal intervals on the inner curved surface of the central hole 705. A piston 707 is slidably sleeved on the inner curved surface of the central hole 705. The contact surface between the central hole 705 and the piston 707 is a smooth surface, thereby improving the sealing between the central hole 705 and the piston 707 and preventing gas leakage. A push rod 708 is fixedly installed on the top of the piston 707. A second passage block 709 is fixedly installed on the top of the push rod 708. A sleeve 710 is fixedly sleeved on the outer curved surface of the second passage block 709. The outer curved surface of the sleeve 710 is slidably sleeved with the inner curved surface of the threaded sleeve rod 6. The sleeve 710 is fixedly connected to the output end of the external nitrogen input device.

[0028] like Figure 3As shown, the unfolding mechanism 8 includes a rotating sleeve 801, which is movably sleeved on the bottom of the outer curved surface of the threaded sleeve rod 6. The contact surface between the rotating sleeve 801 and the threaded sleeve rod 6 is a smooth surface, thereby reducing the frictional resistance between the rotating sleeve 801 and the threaded sleeve rod 6, reducing the horizontal torque generated by the frictional force between the rotating sleeve 801 and the threaded sleeve rod 6, and preventing the curved rod 803 from being bent. Multiple first movable seats 802 are fixedly installed at equal intervals on the circumference of the outer curved surface of the rotating sleeve 801. The curved rod 803 is movably sleeved in the middle of each of the multiple first movable seats 802. The ends of the multiple curved rods 803 away from the first movable seats 802 are movably sleeved with second movable seats 804. The front and rear two second movable seats 804 are fixedly installed on the bottom surface of the sliding shell 901 on the same side, and the left and right two second movable seats 804 are fixedly installed on the bottom surface of the sliding block 1001 on the same side.

[0029] like Figure 1 As shown, the infrared mechanism 11 includes two housings 1101. The two housings 1101 are respectively fixedly installed on the side of the sliding housing 901 adjacent to the sliding block 1001. The middle of the two housings 1101 is slidably sleeved with a sleeve rod 1102. The inner cavity of the sleeve rod 1102 away from the sliding block 1001 is fixedly installed with an elastic element 1103. The elastic element 1103 is fixedly connected to the sliding block 1001 on the same side. The middle block 1104 is fixedly installed in the middle of the bottom surface of the elastic element 1103. The bottom end of the middle block 1104 is fixedly installed with an infrared head 1105. The infrared head 1105 is located inside the multiple nozzles 904, thereby avoiding the infrared light emitted by the infrared head 1105 from coming into contact with the diameter of the cleaning liquid sprayed by the nozzles 904, which would reduce the heat utilization efficiency generated by the infrared light.

[0030] Working principle:

[0031] In use, the first driving component 203 is activated, causing the output end of the first driving component 203 to rotate the eccentric disk 204. The eccentric disk 204 drives the first telescopic rod 205 to rotate eccentrically, which in turn drives the suction cup 206 to rotate eccentrically. The suction cup 206 then drives the wafer it holds to rotate eccentrically. Next, the external cleaning fluid input device is activated. At this time, the cleaning fluid is sprayed sequentially onto the upper surface of the wafer through the input sleeve 902, the sliding shell 901, and the sealing block 903. Under the action of centrifugal force, the cleaning fluid flows along the surface of the wafer from the center to the outer side. The wafer compensates for the areas that cannot be sprayed between multiple sealing blocks 903. At this time, when the centrifugally flowing cleaning fluid on the upper surface of the wafer is used as a static reference, the eccentrically rotating wafer can rub against the cleaning fluid at different horizontal angles with the static reference on the upper surface of the wafer, making it easier for the deposits on the wafer to shake off. At the same time, when the cleaning fluid is sprayed onto the surface of the wafer, the ultrasonic head 1002 is activated. The ultrasonic waves generated by the ultrasonic head 1002 pass through the cleaning fluid on the surface of the wafer, causing the surface of the wafer to vibrate up and down, thereby further removing the deposits on the surface of the wafer and improving the cleaning effect of the wafer surface.

[0032] Furthermore, when using this invention, the drive unit 602 is activated, and the output shaft of the drive unit 602 drives the drive gear 603 to rotate. The drive gear 603 drives the toothed sleeve 601 to rotate, and the toothed sleeve 601 drives the threaded sleeve rod 6 to rotate. The threaded sleeve rod 6 moves upward along the cross seat 4 that is threaded to it, and the threaded sleeve rod 6 drives the rotating sleeve 801 to move downward. The rotating sleeve 801 pushes the spraying mechanism 9 and the ultrasonic mechanism 10 that are fixedly connected to it to a side away from the threaded sleeve rod 6 through the first movable seat 802, the crank rod 803 and the second movable seat 804. As the pusher plate 301 moves, it pushes the sealing block 903 towards the center of the sliding shell 901. At this time, the amount of cleaning fluid flowing into the inner cavity of the nozzle 904 through the sliding shell 901 is reduced, so that the upper surface of the wafer is in close contact with the bottom of the nozzle 904. At the same time, it pushes the deposits on the wafer surface from the middle of the wafer to the outside of the wafer, thereby improving the overall cleaning effect of the wafer surface. Meanwhile, as the annular area formed between the nozzle 904 and the wafer decreases, the amount of cleaning fluid sprayed by the nozzle 904 onto the upper surface of the wafer is reduced, thereby improving the cleaning fluid utilization efficiency.

[0033] In addition, when the threaded sleeve 6 moves upward, the distance between the cone 701 and the wafer increases, thereby gradually increasing the size of the nitrogen ring ejected from the cone 701 through the sleeve 710, bottom hole 704 and first passage block 702. As the nitrogen ring gradually increases, the upward-moving mounting plate 5 drives the valve body 703 to move upward. At this time, the height of the side hole 706 above the top surface of the piston 707 increases. The amount of nitrogen flowing out of the cone 701 through the middle hole 705, push rod 708, bottom hole 704 and first passage block 702 from the inner cavity of the threaded sleeve 6 gradually increases with the nitrogen ring. This allows the nitrogen to follow the position change of the nozzle 904, promptly blowing the cleaning fluid on the wafer surface with nitrogen to dry the wafer. At the same time, the nitrogen output is adjusted according to the size of the nitrogen ring to reduce unnecessary nitrogen consumption.

[0034] Furthermore, when the present invention is used, when the threaded sleeve 6 moves away from the threaded sleeve 6 via the unfolding mechanism 8, the spraying mechanism 9 and the ultrasonic mechanism 10 move away from the threaded sleeve 6. The nozzle 904 and the sleeve 1102 move the shell 1101 fixedly connected to it away from the threaded sleeve 6. The shell 1101 moves the sleeve 1102 away from the threaded sleeve 6. At this time, the sleeve 1102 pulls the elastic members 1103 fixedly connected at both ends to extend synchronously. The elastic members 1103 keep the sleeve 1102 in the middle position connected to the shell 1101. The sleeve 1102 moves the infrared head 1105 away from the threaded sleeve 6 via the middle block 1104. The infrared head 1105 further heats and dries the wafer surface through which the nitrogen gas passes.

[0035] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0036] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automated semiconductor wafer cleaning and drying device, comprising a base (1), characterized in that: The base (1) adopts a shell-drawing design, and the inner curved surface of the base (1) is provided with a rotating mechanism (2). Second telescopic rods (3) are symmetrically fixedly installed in the middle of the front and rear sides of the upper surface of the base (1), and push plates (301) are symmetrically fixedly installed on the inner sides of the telescopic ends of the two second telescopic rods (3). A cross seat (4) is fixedly installed on the upper part of the inner side surface of the telescopic ends of the two second telescopic rods (3), and a mounting plate (5) is fixedly installed in the middle of the upper surface of the cross seat (4). The middle part of the mounting plate (5) is threadedly connected with a threaded sleeve rod (6), the upper part of the outer curved surface of the threaded sleeve rod (6) is slidably sleeved with a toothed sleeve (601), the upper surface of the mounting plate (5) is fixedly mounted with a driving member (602), the output end of the driving member (602) is fixedly mounted with a driving gear (603), the toothed sleeve (601) and the driving gear (603) are meshed with each other, the inner curved surface of the threaded sleeve rod (6) is provided with an air injection mechanism (7), and the bottom of the threaded sleeve rod (6) is provided with a toothed sleeve (601). A deployment mechanism (8) is provided, and symmetrical liquid spraying mechanisms (9) are slidably sleeved on the front and rear sides of the cross seat (4), and the liquid spraying mechanism (9) comprises a sliding shell (901), and the sliding shell (901) is slidably sleeved with the cross seat (4), and an input sleeve (902) is fixedly sleeved on the upper part of the sliding shell (901), and the input sleeve (902) is fixedly sleeved with the output end of the external cleaning liquid input device, and sealing blocks (903) are slidably sleeved on both sides of the sliding shell (901). The bottom of the sliding shell (901) is fixedly sleeved with a nozzle (904), and the left and right sides of the middle of the cross seat (4) are slidably sleeved with an ultrasonic mechanism (10). The ultrasonic mechanism (10) comprises a sliding block (1001), and the sliding block (1001) is slidably sleeved with the cross seat (4). The bottom surface of the sliding block (1001) is fixedly installed with an ultrasonic head (1002), and an infrared mechanism (11) is provided between two adjacent nozzles (904) and the ultrasonic head (1002).

2. The automated semiconductor wafer cleaning and drying equipment according to claim 1, characterized in that: The rotating mechanism (2) comprises a mounting seat (201), wherein the mounting seat (201) is fixedly sleeved on the middle part of the inner curved surface of the base (1), an isolation seat (202) is fixedly sleeved on the upper part of the inner curved surface of the base (1), a first driving member (203) is fixedly mounted on the middle part of the upper surface of the mounting seat (201), an output shaft of the first driving member (203) is movably sleeved on the middle part of the isolation seat (202), an eccentric disk (204) is fixedly mounted on the top end of the output shaft of the isolation seat (202), a first telescopic rod (205) is fixedly mounted on the side of the upper surface of the eccentric disk (204) away from the center thereof, a suction cup (206) is fixedly mounted on the top end of the first telescopic rod (205), and the suction cup (206) is made of flexible rubber.

3. The automated semiconductor wafer cleaning and drying equipment according to claim 1, characterized in that: The jet mechanism (7) comprises a cone head (701), the cone head (701) being fixedly sleeved on the bottom of the inner curved surface of the threaded sleeve (6), the cone head (701) being in the shape of a cone, so as to guide the nitrogen flowing out of the bottom of the threaded sleeve (6), a first through block (702) being fixedly mounted on the bottom end of the cone head (701), a valve body (703) being fixedly sleeved on the bottom of the inner curved surface of the threaded sleeve (6), the valve body (703) being located above the cone head (701), a bottom hole (704) being provided on the outer side of the bottom surface of the valve body (703), a middle hole (705) being provided in the middle of the upper surface of the valve body (703), and the The inner curved surface of the central hole (705) is provided with a plurality of side holes (706) at equal intervals on its circumference. The inner curved surface of the central hole (705) is slidably sleeved with a piston (707). The contact surface between the central hole (705) and the piston (707) is a smooth surface. A push rod (708) is fixedly mounted on the top of the piston (707). A second through block (709) is fixedly mounted on the top of the push rod (708). A sleeve (710) is fixedly sleeved on the outer curved surface of the second through block (709). The outer curved surface of the sleeve (710) is slidably sleeved with the inner curved surface of the threaded sleeve rod (6). The sleeve (710) is fixedly connected to the output end of an external nitrogen input device.

4. The automated semiconductor wafer cleaning and drying equipment according to claim 1, characterized in that: The unfolding mechanism (8) comprises a rotating sleeve (801), wherein the rotating sleeve (801) is movably sleeved on the bottom of the outer curved surface of the threaded sleeve rod (6), and a plurality of first movable seats (802) are fixedly installed at equal intervals on the circumference of the outer curved surface of the rotating sleeve (801), and a bent rod (803) is movably sleeved in the middle of the plurality of first movable seats (802), and a second movable seat (804) is movably sleeved at one end of the plurality of bent rods (803) away from the first movable seat (802), and the front and rear second movable seats (804) are fixedly installed on the bottom surface of the sliding shell (901) on the same side, and the left and right second movable seats (804) are fixedly installed on the bottom surface of the sliding block (1001) on the same side.

5. The automated semiconductor wafer cleaning and drying equipment according to claim 1, characterized in that: The infrared mechanism (11) comprises two sleeve shells (1101), the two sleeve shells (1101) are respectively fixedly mounted on one side of the sliding shell (901) adjacent to the sliding block (1001), a sleeve rod (1102) is slidably sleeved in the middle of the two sleeve shells (1101), an elastic member (1103) is fixedly mounted on the side of the inner cavity of the sleeve rod (1102) away from the sliding block (1001), the elastic member (1103) is fixedly connected to the sliding block (1001) on the same side, a middle block (1104) is fixedly mounted in the middle of the bottom surface of the elastic member (1103), and an infrared head (1105) is fixedly mounted at the bottom end of the middle block (1104).

6. The automated semiconductor wafer cleaning and drying equipment according to claim 1, characterized in that: The outer curved surface of the threaded sleeve (6) is provided with a plurality of guide grooves at equal intervals, the toothed sleeve (601) is slidably sleeved with the guide grooves, the upper and lower parts of the driving gear (603) protrude toward a side away from the center of the circle, and the toothed sleeve (601) is meshed with the middle part of the driving gear (603).

7. The automated semiconductor wafer cleaning and drying equipment according to claim 1, characterized in that: The sealing block (903) is in sliding contact with the push plate (301) on the same side. The side surface of the push plate (301) close to the sliding shell (901) is an inclined surface. The push plate (301) and the sliding shell (901) are both made of magnets.

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