Universal structure for realizing 360-degree spatial luminescence of white-light monochromatic light LED (light-emitting diode)

Abstract

The invention discloses a universal structure for realizing 360-degree space light emitting of a white-light monochromatic light LED, and relates to the technical field of LED packaging, the universal structure for realizing 360-degree space light emitting of the white-light monochromatic light LED comprises an LED direct insertion support, an LED chip, a wire, a chip bonding material, an LED packaging colloid, a chip forming colloid and an auxiliary material, the chip bonding material is arranged on a solid crystal position of the LED direct-insertion support, the LED chip is fixedly connected with the LED direct-insertion support through the chip bonding material, the LED chip and the LED direct-insertion support form circuit connection through a wire, chip forming colloid is formed on the solid crystal position of the LED direct-insertion support in a dispensing mode, and the interior of the LED direct-insertion support is of an LED reflection cup or flat cup structure. And the chip forming colloid completely covers the LED chip and has a spherical crown-like shape, a hemisphere-like shape or an ellipse-like shape of a highlight center with a certain height, and the scheme solves the problems that an existing LED packaging structure does not have universality, the packaging process is complex, and the light quality level is low.

Description

Technical Field

[0001] The present invention relates to the technical field of LED packaging, in particular to a universal structure for realizing 360-degree spatial luminescence of a white light monochromatic light LED. Background Art

[0002] The so-called 360-degree LED is called 360-degree spatial luminous LED, also known as omnidirectional light LED, that is, the 360-degree LED or 360-degree spatial luminous LED mentioned in this article.

[0003] Since the invention of 360-degree LED, its white light and monochromatic light have achieved 360-degree spatial luminescence solutions, which are mainly achieved by adding auxiliary materials to the LED packaging colloid in combination with a flat cup LED plug-in bracket. Monochromatic light is mainly achieved by adding diffusing agents, and white light is mainly achieved by adding fluorescent powder, diffusing agents and diffusion powders.

[0004] Based on the above existing solutions, we can list its two typical structural features. The first is that the LED plug-in bracket does not have a reflective cup. The second is to add auxiliary materials (including diffusers / powders or fluorescent powders, etc.) in the optical cavity of the LED packaging colloid. According to the typical structural characteristics of the latter, the manufacturing process is manifested as one-time packaging or two-time packaging. In order to obtain better light uniformity, the main secondary packaging technology is used.

[0005] For example, a typical patent for secondary packaging:

[0006] "360-degree (volume luminescence) high-efficiency photoluminescent diode", patent number:

[0007] "CN2004100524874";

[0008] "Adaptive 360-degree volumetric white light emitting diode", patent number:

[0009] "CN2005100346782";

[0010] For example, a typical patent for one-time packaging:

[0011] "360-degree body light-emitting diode", patent number: "CN200520064262.0". (Note: typical one-time package white light);

[0012] "360-degree white light emitting diode", patent number "CN200720120245.3". (Note: typical one-time package white light);

[0013] Comparing the above four patents, their commonality is that the LED plug-in brackets are all without reflective cups, and their second packaging method is one-time packaging or two-time packaging. The above two commonalities can be explained as the purpose of using LED plug-in brackets without reflective cups is to obtain a larger luminous angle, and the common purpose of implementing one-time or two-time packaging is to obtain a larger optical cavity or a multi-layer optical cavity through the LED packaging colloid, so as to achieve a 360-degree spatial luminous effect of the plug-in LED.

[0014] Disadvantages of the above process:

[0015] First, it is not universal: LED can only use flat cup LED direct plug bracket to achieve 360-degree spatial illumination.

[0016] Secondly, the packaging process is complicated: in order to obtain a better light quality level, it is mainly achieved through a secondary packaging process, which doubles the production cost.

[0017] The third problem is that the light quality level is low: it is mainly manifested in the "three-segment light" defect. The so-called "three-segment light" refers to the yellow area, bright area, and relatively bright area, which are three sections of uneven light when the package diameter of the direct-insert LED component is ≤Φ5mm, especially when the package height is >5mm. We call this phenomenon the "three-segment light" phenomenon. If we use "light quality" to measure this phenomenon, it manifests as light unevenness. When the package size is smaller, the "three-segment light" defect has not been well resolved. For this reason, we provide a universal structure for white light monochromatic LED to achieve 360-degree spatial luminescence. Summary of the invention

[0018] The purpose of the present invention is to provide a universal structure for a white light monochromatic LED to achieve 360-degree spatial luminescence, so as to solve the problems in the above background technology that the existing LED packaging structure is not universal, the packaging process is complex, and the light quality level is low.

[0019] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a universal structure for a white light monochromatic LED to realize 360-degree spatial luminescence, comprising an LED plug-in bracket, an LED chip, a wire, a chip bonding material, an LED encapsulation colloid, a chip forming colloid and auxiliary materials, wherein the chip bonding material is arranged on a solid crystal position of the LED plug-in bracket, the LED chip is fixedly connected to the LED plug-in bracket through the chip bonding material, the LED chip is circuit-connected to the LED plug-in bracket through a wire, a chip forming colloid is formed by dispensing glue on the solid crystal position of the LED plug-in bracket, the interior of the LED plug-in bracket is an LED reflective cup or a flat cup structure, the chip forming colloid completely covers the LED chip, and has a high light center of a certain height in the shape of a spherical crown, a hemispherical or an elliptical body, and the LED plug-in bracket is encapsulated with an LED encapsulation colloid on the outside.

[0020] Preferably, the chip-shaped colloid formed by dispensing glue on the LED plug-in bracket with the LED reflective cup inside is higher than the extension of the LED reflective cup, and has a spherical crown shape, a hemispherical shape, or an ellipsoidal shape with a high light center of a certain height.

[0021] Preferably, the chip bonding material is a conductive or non-conductive bonding material.

[0022] Preferably, the chip forming colloid is silica gel or modified silica gel.

[0023] Preferably, auxiliary materials are added into the chip forming colloid, and the auxiliary materials are diffusion auxiliary materials, and the diffusion auxiliary materials are diffusing agents or diffusion powders.

[0024] Preferably, auxiliary materials are added into the chip forming colloid, and the auxiliary materials are fluorescent auxiliary materials, and the fluorescent auxiliary materials are fluorescent powder.

[0025] Preferably, the shape of the LED encapsulation colloid is a standard shape or a non-standard shape or a round shape or a flat-top shape.

[0026] Preferably, when the top of the LED encapsulation colloid is a flat top, the LED encapsulation colloid is a transparent body, or is added with diffusion auxiliary materials to form a translucent body.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] The present invention realizes 360-degree spatial luminescence inside the direct-insert LED, that is, by dispensing glue, the chip-shaped colloid is "a spherical crown shape, a hemispherical shape, or an ellipsoidal shape with a high light center of a certain height". The present invention breaks the iron rule that 360-degree spatial luminescence can only be achieved by using a flat cup LED direct-insert bracket, and the present invention can meet the three indicators of light quality. Secondly, since the present invention has a spherical crown shape, a hemispherical shape, or an ellipsoidal shape with a high light center of a certain height, the packaging process of the 360-degree LED is greatly simplified, and the "three-segment light" defect can be slowed down or eliminated, and the requirement of light uniformity can be met, thereby solving the problems that the existing LED packaging structure is not universal, the packaging process is complicated, and the light quality level is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of a monochromatic light LED of the present invention;

[0030] Figure 2 It is a schematic diagram of an elliptical body such as a monochromatic light chip forming adhesive of the present invention;

[0031] Figure 3 This is a schematic diagram of a white light LED with a reflective cup according to the present invention;

[0032] Figure 4 This is a schematic diagram of a flat cup white light LED of the present invention;

[0033] Figure 5 This is a schematic diagram of a traditional directional light-emitting direct-insert LED;

[0034] Figure 6 This is a schematic diagram of 360-degree LED monochromatic light;

[0035] Figure 7 Schematic diagram of 360-degree white light LED with externally sealed phosphor;

[0036] Figure 8 This is a schematic diagram of a 360-degree white light LED with internally sealed phosphor;

[0037] In the figure: 1. LED plug-in bracket; 2. LED chip; 3. Wire; 4. Chip bonding material; 5. LED packaging colloid; 6. LED reflective cup; 7. Fluorescent auxiliary material; 8. LED inner packaging colloid; 9. Diffusion auxiliary material; 10. Chip forming colloid. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0039] Example 1

[0040] See also Figure 1 , a universal structure for realizing 360-degree spatial luminescence of a white light monochromatic LED, a chip bonding material 4 is arranged on a die-bonding position of an LED plug-in bracket 1, an LED chip 2 is fixedly connected to the LED plug-in bracket 1 through the chip bonding material 4, and the LED chip 2 forms a circuit connection with the LED plug-in bracket 1 through a wire 3, a chip forming colloid 10 is formed by dispensing glue on the die-bonding position of the LED plug-in bracket 1, the chip forming colloid 10 adopts a modified silica gel with high thixotropy, a diffusion auxiliary material 9 is added to the chip forming colloid 10, and the chip forming colloid 10 is formed into a spherical crown shape, a hemispherical shape or an elliptical shape with a high light center of a certain height, and then the component is transparently encapsulated with an LED encapsulation colloid 5;

[0041] In this embodiment, a slight change can be made in the process of LED encapsulation colloid 5, that is, a diffusion auxiliary material 9 is added to the LED encapsulation colloid 5 to form a semi-transparent LED encapsulation colloid 5 with a diffusion effect;

[0042] The object of the embodiment described above is that the top of the LED packaging colloid 5 is flat or quasi-flat. This structure is not only suitable for monochromatic light, but also suitable for white light LED packaging.

[0043] Example 2

[0044] See also Figure 3 , a universal structure for a white light monochromatic LED to realize 360-degree spatial luminescence, a chip bonding material 4 is arranged on the solid crystal position of an LED plug-in bracket 1, an LED chip 2 is fixedly connected to the LED plug-in bracket 1 through the chip bonding material 4, and the LED chip 2 forms a circuit connection with the LED plug-in bracket 1 through a wire 3, and then a chip forming colloid 10 is formed by dispensing glue on the LED chip 2, i.e., an LED reflective cup 6, and the chip forming colloid 10 adopts a modified silica gel with high thixotropy, a fluorescent auxiliary material 7 is added to the chip forming colloid 10, and a diffusion auxiliary material 9 can also be added and mixed together, the chip forming colloid 10 is formed into a spherical crown shape, a hemispherical shape, or an elliptical shape with a high light center, and then the component is encapsulated with an LED encapsulation colloid 5, and a diffusion auxiliary material 9 is added to the LED encapsulation colloid 5.

[0045] Example 3

[0046] See also Figure 4 , a universal structure for a white light monochromatic LED to realize 360-degree spatial luminescence, a chip bonding material 4 is arranged on a die-fixing position of an LED plug-in bracket 1 without an LED reflective cup 6, an LED chip 2 is fixedly connected to the LED plug-in bracket 1 through the chip bonding material 4, the LED chip 2 forms a circuit connection with the LED plug-in bracket 1 through a wire 3, and then a chip forming colloid 10 is formed by dispensing glue on the LED chip 2, the chip forming colloid 10 adopts a modified silica gel with high thixotropy, a fluorescent auxiliary material 7 is added to the chip forming colloid 10, and a diffusion auxiliary material 9 can also be added and mixed together, the chip forming colloid 10 is formed into a spherical crown shape, a hemispherical shape or an elliptical shape with a high light center, and then the component is encapsulated with an LED encapsulation colloid 5, and a diffusion auxiliary material 9 is added to the LED encapsulation colloid 5.

[0047] In the above embodiment, the basic solution of the new design white light can be used not only for packages ≤Φ5mm, but also for packages of Φ12mm, and for longer packages (for example, DX-326 modules), and can meet the light quality index requirements.

[0048] in conclusion:

[0049] 1. Whether it is a flat cup or a cup, whether it is a long package or a short package, whether it is a large package or a small package, whether it is a standard geometry package or an anisotropic package, it can achieve 360-degree spatial luminescence and meet the requirements of light quality indicators;

[0050] From the optimization angle evaluation, the flat cup is the first choice, and the transparent package is limited to the package with a flat top. Under the same proportion conditions, the K value of the transparent package is less than the K value of the package with a diffuser.

[0051] 2. The flat cup reduces the unevenness of the "three-segment light" of the white light LED. (Note: This phenomenon is particularly prominent in small sizes, i.e. ≤Φ5mm).

[0052] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A universal structure for achieving 360-degree spatial luminescence of a white monochromatic LED, comprising an LED plug-in bracket (1), an LED chip (2), a wire (3), a chip bonding material (4), an LED encapsulation colloid (5), a chip forming colloid (10) and auxiliary materials, characterized in that: The chip bonding material (4) is arranged on the crystal fixing position of the LED plug-in bracket (1); the LED chip (2) is fixedly connected to the LED plug-in bracket (1) through the chip bonding material (4); the LED chip (2) forms a circuit connection with the LED plug-in bracket (1) through a wire (3); a chip forming colloid (10) is formed by dispensing glue on the crystal fixing position of the LED plug-in bracket (1); the interior of the LED plug-in bracket (1) is an LED reflective cup (6) or a flat cup structure; the chip forming colloid (10) completely covers the LED chip (2) and has a high light center spherical crown shape, a hemispherical shape or an elliptical shape; the LED plug-in bracket (1) is encapsulated with an LED encapsulation colloid (5) on the outside.

2. The universal structure of the white light monochromatic LED for realizing 360-degree spatial luminescence according to claim 1 is characterized in that: The chip-shaped colloid (10) formed by dispensing glue on the LED plug-in bracket (1) with the LED reflective cup (6) inside is higher than the extension of the LED reflective cup (6) and has a high-light center spherical crown shape, a hemispherical shape, or an ellipsoidal shape with a certain height.

3. The universal structure of the white light monochromatic LED for realizing 360-degree spatial luminescence according to claim 2 is characterized in that: The chip bonding material (4) is a conductive or non-conductive bonding material.

4. The universal structure of the white light monochromatic LED for realizing 360-degree spatial luminescence according to claim 3 is characterized in that: The chip forming colloid (10) is silica gel or modified silica gel.

5. The universal structure of the white light monochromatic LED for realizing 360-degree spatial luminescence according to claim 4 is characterized in that: Auxiliary materials are added into the chip forming colloid (10), and the auxiliary materials are diffusion auxiliary materials (9), and the diffusion auxiliary materials (9) are diffusion agents or diffusion powders.

6. The universal structure of the white light monochromatic LED for realizing 360-degree spatial illumination according to claim 5 is characterized in that: Auxiliary materials are added into the chip forming colloid (10), and the auxiliary materials are fluorescent auxiliary materials (7), and the fluorescent auxiliary materials (7) are fluorescent powder.

7. The universal structure of the white light monochromatic LED for realizing 360-degree spatial illumination according to claim 6, characterized in that: The shape of the LED packaging colloid (5) is a standard shape or a non-standard shape or a round shape or a flat top shape.

8. The universal structure of the white light monochromatic LED for realizing 360-degree spatial illumination according to claim 7, characterized in that: When the top of the LED encapsulation colloid (5) is a flat top, the LED encapsulation colloid (5) is a transparent body, or a diffusion auxiliary material (9) is added to form a translucent body.

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