Vapor chamber and heat dissipation device

Abstract

The embodiment of the invention provides a uniform temperature plate and a heat dissipation device, the uniform temperature plate comprises an evaporation capillary structure, a condensation capillary structure, a capillary column structure connected between the evaporation capillary structure and the condensation capillary structure, and a heat dissipation structure connected between the evaporation capillary structure and the condensation capillary structure, and the middle thickness of the condensation capillary structure is larger than the peripheral thickness of the condensation capillary structure. And the liquid working medium flows back to the evaporation capillary structure along the capillary column structure. According to the embodiment of the invention, the problem of dry burning or overlarge evaporation thermal resistance of the capillary structure of the vapor chamber in the prior art can be solved, the evaporation thermal resistance is reduced, the circulation heat dissipation efficiency of the phase change working medium is accelerated, dry burning of the capillary structure is prevented, and the heat transfer capacity of the vapor chamber is improved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation of electronic devices, and more specifically, to a temperature homogenizing plate and a heat dissipation device. Background Art

[0002] With the rapid development of the communications electronics industry, the integration of electronic products is becoming increasingly higher, resulting in a continuous increase in power consumption and heat flux density, which poses severe challenges to heat dissipation technology. Vapor Chamber (VC) is widely used in the field of electronic heat dissipation due to its efficient heat transfer characteristics. Vapor Chamber is mainly composed of a shell, a capillary structure and working fluid water. Its working principle is mainly to use the continuous phase change and circulation of working fluid water to bring the heat source of the chip to the external environment.

[0003] There are two problems with current VC technology: in scenarios with high power consumption and high heat flux density, the liquid working fluid in the capillary structure of the core evaporation area above the internal heat source of the VC evaporates and cannot be replenished in time, resulting in dry burning of the capillary structure and failure of VC performance; the capillary structure is too thick or the amount of liquid injected is too much. Although it can ensure that the VC does not dry burn, the evaporation thermal resistance is too large due to the thickness of the capillary structure or the excessive amount of liquid injected, so that the performance of the VC does not meet the heat dissipation requirements.

[0004] In summary, there is no good solution to the problem of dry burning of the capillary structure of the temperature equalizing plate or excessive evaporation thermal resistance in the related technology. Summary of the invention

[0005] The embodiments of the present application provide a temperature evaporating plate and a heat dissipation device to at least solve the problem of dry burning of the capillary structure of the temperature evaporating plate or excessive evaporation thermal resistance in the related art.

[0006] According to one embodiment of the present application, a temperature homogenizing plate is provided, the temperature homogenizing plate comprising:

[0007] Evaporation capillary structure;

[0008] A condensation capillary structure, wherein the middle thickness of the condensation capillary structure is greater than the peripheral thickness of the condensation capillary structure;

[0009] The capillary column structure is connected between the evaporation capillary structure and the condensation capillary structure, and is used for the liquid working medium to flow back to the evaporation capillary structure along the capillary column structure.

[0010] Preferably, the area of ​​the condensation capillary structure is larger than the area of ​​the evaporation capillary structure.

[0011] Preferably, the temperature homogenizing plate further comprises:

[0012] An upper shell, the upper shell being connected to an upper surface of the condensation capillary structure;

[0013] A lower shell, one side of which is connected to the lower surface of the evaporation capillary structure, and the other side of which is in contact with a heat source;

[0014] A support column is connected between the lower shell and the upper shell.

[0015] Preferably, the area of ​​the evaporation capillary structure is larger than the area of ​​the heat source.

[0016] Preferably, a side of the lower shell body in contact with the evaporation capillary structure has a groove array structure consisting of a plurality of grooves, and the groove array structure is located directly below the evaporation capillary structure.

[0017] Preferably, the arrangement of the groove array structure includes one of the following: a dot array, a strip array, and a staggered array; the shape of the groove includes one of the following: a triangle, a circle, and a rectangle.

[0018] Preferably, the material of the lower shell and the upper shell is one of the following: metal, alloy, composite material.

[0019] Preferably, a sealed cavity is formed between the lower shell and the upper shell.

[0020] Preferably, the evaporation capillary structure, the capillary column structure and the condensation capillary structure are one of the following: sintered copper powder, copper mesh, groove, fiber bundle.

[0021] Preferably, the condensation capillary structure is a prism-shaped or truncated cone-shaped structure, wherein the upper surface of the condensation capillary structure is larger than the lower surface of the condensation capillary structure.

[0022] According to another embodiment of the present application, a heat dissipation device is further provided. The heat dissipation device includes one or more temperature averaging plates as described in any of the above embodiments.

[0023] The embodiment of the present application provides a temperature averaging plate and a heat dissipation device, the temperature averaging plate includes: an evaporation capillary structure, a condensation capillary structure, the middle thickness of the condensation capillary structure is greater than the peripheral thickness of the condensation capillary structure, and a capillary column structure connected between the evaporation capillary structure and the condensation capillary structure, and used for the liquid working medium to flow back to the evaporation capillary structure along the capillary column structure. The embodiment of the present application can solve the problem of dry burning of the capillary structure of the temperature averaging plate or excessive evaporation thermal resistance in the related art, reduce the evaporation thermal resistance, accelerate the heat dissipation efficiency of the phase change working medium circulation, prevent the capillary structure from dry burning, and improve the heat transfer capacity of the temperature averaging plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic diagram of a capillary structure of a temperature homogenizing plate according to an embodiment of the present application;

[0025] Figure 2is a schematic diagram of the structure of a temperature equalizing plate in another embodiment of the application;

[0026] Figure 3 is a schematic diagram of the structure of a temperature equalizing plate in another embodiment of the application;

[0027] Figure 4 is a top view of a lower housing having a groove array structure according to an embodiment of the present application;

[0028] Figure 5 is a schematic diagram of the path of the working medium circulation in the temperature homogenizing plate according to the embodiment of the present application;

[0029] Figure 6 It is a schematic diagram of the structure of a temperature equalizing plate in a vertical installation scenario according to an embodiment of the present application.

[0030] In the figure, there are an evaporation capillary structure 11, a capillary column structure 12, a condensation capillary structure 13, an upper shell 14, a lower shell 15, a support column 16, a heat source 17, and a groove array structure 18. DETAILED DESCRIPTION

[0031] The embodiments of the present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0032] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0033] According to an embodiment of the present application, a temperature homogenizing plate is provided.

[0034] Figure 1 Schematic diagram of the capillary structure of the temperature equalizer according to an embodiment of the present application. Figure 1 As shown, the temperature homogenizing plate includes the following structure:

[0035] The evaporation capillary structure 11 , the capillary column structure 12 and the condensation capillary structure 13 .

[0036] In this embodiment, the evaporation capillary structure 11 is used to evaporate the liquid working medium into a vapor working medium under the heat of the heat source. The evaporation capillary structure 11 can be designed as a thinner capillary structure to reduce the evaporation thermal resistance by reducing the thickness of the liquid film.

[0037] In this embodiment, the middle thickness of the condensation capillary structure 13 is greater than the peripheral thickness of the condensation capillary structure, forming an "aggregation type" capillary structure. The "aggregation type" condensation capillary structure 13 can gather the condensed liquid working medium in the middle of the condensation capillary structure, that is, just above the core evaporation area, and play the role of a "liquid storage tank", continuously providing liquid working medium for the evaporation capillary structure, and preventing dry burning in the evaporation capillary structure due to untimely liquid replenishment under high power consumption.

[0038] In this embodiment, the capillary column structure 12 is connected between the evaporation capillary structure 11 and the condensation capillary structure 13, and is used for the liquid working medium to flow back to the evaporation capillary structure along the capillary column structure. The capillary column structure can shorten the liquid return path, speed up the return speed of the liquid working medium, and further prevent the evaporation capillary structure from drying out.

[0039] Through the embodiments of the present application, the supply of circulating working fluid is guaranteed, the capillary structure is prevented from dry burning, and the evaporation thermal resistance is also reduced, and the heat transfer capacity of the temperature equalizing plate is improved, thereby solving the problem of dry burning of the capillary structure of the temperature equalizing plate or excessive evaporation thermal resistance in related technologies.

[0040] In the embodiment of the present application, the evaporation capillary structure can be designed as a thinner capillary structure to reduce the thickness of the liquid film, thereby reducing the evaporation thermal resistance, while ensuring the supply of liquid working fluid to the capillary structure and preventing the capillary structure from drying out.

[0041] In an exemplary embodiment, the thickness of the evaporation capillary structure can be designed according to power consumption requirements, material and processing costs, and the thickness can be designed to be tens of micrometers to several millimeters.

[0042] In some embodiments, there may be one or more capillary column structures 12, and the reflux rate of the liquid working medium may be further accelerated by increasing the number of capillary column structures 12. Furthermore, the capillary column structures are distributed directly above the evaporation capillary structure.

[0043] In the embodiment of the present application, the condensed liquid flows back from the capillary column structure and evaporates in the evaporation area, so that the liquid return path and the evaporation path can be separated, which is more conducive to the escape of steam, more efficient circulation and lower thermal resistance.

[0044] In some embodiments, the area of ​​the condensation capillary structure is larger than the area of ​​the evaporation capillary structure, which can further promote the speed of liquid working medium condensation and heat dissipation of the vapor chamber.

[0045] In some embodiments, the evaporation capillary structure, the capillary column structure, and the condensation capillary structure are one of the following: sintered copper powder, copper mesh, groove, fiber bundle.

[0046] Furthermore, the evaporation capillary structure, the capillary column structure and the condensation capillary structure can also be prepared using other porous materials, which is not limited in the present application. The capillary structure in the embodiment of the present application is simpler, which can save complex capillary processing technology, thereby reducing production costs.

[0047] In some embodiments, the condensation capillary structure is a prism-shaped or truncated cone-shaped structure, wherein the upper surface of the condensation capillary structure is larger than the lower surface of the condensation capillary structure.

[0048] In the embodiment of the present application, the condensation capillary structure is designed as an "aggregation type" structure that is larger at the top and smaller at the bottom, so that the condensed liquid working medium can be gathered in the middle of the condensation capillary structure, that is, directly above the evaporation capillary structure, playing the role of a "liquid storage tank" to provide liquid working medium for the evaporation capillary structure and prevent dry burning in the evaporation capillary structure due to untimely liquid replenishment under high power consumption.

[0049] Figure 2 Schematic diagram of the structure of a temperature equalizing plate in another embodiment of the application. Figure 2 As shown, in addition to the evaporation capillary structure 11, the capillary column structure 12 and the condensation capillary structure 13 in any of the above embodiments, the temperature homogenizing plate further includes the following structures:

[0050] An upper shell 14 , a lower shell 15 and a support column 16 .

[0051] In this embodiment, the upper shell 14 is connected to the upper surface of the condensation capillary structure.

[0052] In this embodiment, one side of the lower shell 15 is connected to the lower surface of the evaporation capillary structure, and the other side of the lower shell 15 is in contact with the heat source 17 .

[0053] In this embodiment, the support column 16 is connected between the lower shell 15 and the upper shell 14 .

[0054] In some embodiments, the area of ​​the evaporation capillary structure is larger than the area of ​​the heat source. The area of ​​the evaporation capillary structure can cover the entire area of ​​the heat source to ensure the heat transfer effect of the heat source.

[0055] In an exemplary embodiment, the area of ​​the evaporation capillary structure may be 10% to 50% larger than the area of ​​the heat source, but the present application is not limited thereto.

[0056] In some embodiments, the material of the lower shell and the upper shell is one of the following: metal, alloy, composite material. Further, the lower shell and the upper shell can also be made of other high thermal conductivity materials to ensure heat transfer and heat dissipation effects.

[0057] In some embodiments, a sealed cavity can be formed between the lower shell and the upper shell to prevent the vapor working medium from overflowing and ensure that the vapor working medium can condense in the condensation capillary structure. The space in the sealed cavity other than the capillary structure is the flow path of the vapor working medium. In the schematic diagrams of various embodiments of the present application, only the core structure of the temperature equalizer is shown, and the complete temperature equalizer structure is not drawn.

[0058] Furthermore, a sealed cavity can be formed between the lower shell and the upper shell by diffusion welding, brazing, laser welding or other welding processes, and the cavity can be prevented from collapsing by providing support columns.

[0059] In some embodiments, the condensation capillary structure is connected to the upper shell by sintering, CNC (Computer Numerical Control, referred to as CNC), etching or other processes, and is formed into a structure thick in the middle and thin around the periphery by a mold of a specific shape or machining or other processes. The evaporation capillary structure is connected to the lower shell by sintering, CNC, etching or other processes.

[0060] Figure 3 Schematic diagram of the structure of a temperature equalizing plate in another embodiment of the application. Figure 3 As shown, the side of the lower shell 15 that contacts the evaporation capillary structure 11 has a groove array structure 18 composed of a plurality of grooves.

[0061] In this embodiment, the groove array structure 18 is located directly below the evaporation capillary structure 11 , and the areas of the two are substantially the same.

[0062] In some embodiments, the arrangement of the groove array structure includes one of the following: a dot array, a strip array, and a staggered array; the shape of the groove includes one of the following: a triangle, a circle, and a rectangle.

[0063] The groove array structure in the embodiment of the present application can also be designed into other shapes or arrangements. The groove array structure can increase the evaporation / boiling heat dissipation area and increase the vaporization core, thereby enhancing phase change heat transfer.

[0064] Figure 4 is a top view of a lower housing having a groove array structure according to an embodiment of the present application, such as Figure 4 As shown, the groove array structure 18 is located in the middle of the lower shell 15 and can be specifically designed according to the position of the evaporation capillary structure 11 .

[0065] In this embodiment, the arrangement of the groove array structure may include but is not limited to the following:

[0066] (a) Dot array, (b) Strip array, (c) Staggered array.

[0067] Furthermore, the grooves in the strip array and the staggered array are in the shape of long strips, including but not limited to straight grooves, curved grooves, etc. The shape of each groove in the dot array includes but not limited to triangle, circle, rectangle, etc.

[0068] In the embodiment of the present application, a groove array structure is provided on the lower shell to increase the evaporation / boiling heat dissipation area and increase the vaporization core, thereby enhancing phase change heat transfer.

[0069] Figure 5 is a schematic diagram of the path of the working medium circulation in the temperature equalizing plate in the embodiment of the present application, such as Figure 5As shown, the vapor working medium and the liquid working medium in the temperature homogenizing plate flow along their own vapor path and liquid path respectively and are separated from each other, which can reduce the flow resistance of the vapor working medium and the liquid working medium and increase the working medium circulation efficiency.

[0070] In this embodiment, heat is introduced from the heat source 17 and conducted to the evaporation capillary structure 11 through the lower shell 15. The liquid working medium at the evaporation capillary structure evaporates into a vapor working medium under the heat of the heat source 17. The vapor working medium rises to the condensation capillary structure 13 along the vapor path outside the capillary column structure 12. The condensation capillary structure transfers heat to the air, heat sink fins, or other heat dissipation devices through the upper shell 14 for heat dissipation. The vapor working medium condenses into a liquid working medium at the condensation capillary structure. The liquid working medium in the condensation capillary structure gathers in the middle and lower part of the condensation capillary structure under the action of gravity, and flows back to the evaporation capillary structure along the capillary column structure (i.e., the liquid path) for the next round of evaporation. Through the phase change cycle of the working medium, the heat of the heat source can be taken away to achieve heat dissipation.

[0071] In this embodiment, the condensing capillary structure can act as a "liquid storage tank" to provide liquid working fluid for the evaporating capillary structure, preventing the evaporating capillary structure from burning dry due to untimely liquid replenishment under high power consumption. The capillary column structure can shorten the liquid return path, speed up the reflux speed of the liquid working fluid, and further prevent the evaporating capillary structure from burning dry.

[0072] In this embodiment, the liquid working medium is contained in the evaporation capillary structure. Since the thickness of the evaporation capillary structure 11 is relatively thin, the evaporation liquid film of the working medium liquid is also relatively thin. According to Fourier's law of heat conduction, the heat transfer amount Q is inversely proportional to the liquid film thickness δ. By reducing the liquid film thickness, the heat transfer amount can be increased, and the evaporation thermal resistance can be further reduced.

[0073] Fourier's law of heat conduction is as follows:

[0074] Among them, Q is the heat transfer, A is the heat conduction area, δ is the liquid film thickness, λ is the thermal conductivity of the material, and dT is the temperature difference.

[0075] Through the embodiments of the present application, the flow paths of the vapor working medium and the liquid working medium can be separated, the flow resistance of the liquid and the vapor is reduced, the efficiency of the working medium circulation is increased, and thus the heat transfer efficiency of the temperature equalizing plate is improved.

[0076] The temperature homogenizing plate in the embodiment of the present application can be applied to a horizontal installation scenario or a vertical installation scenario.

[0077] Figure 6 is a schematic diagram of the structure of a temperature equalizing plate in a vertical installation scenario according to an embodiment of the present application, such as Figure 6As shown, in the vertical installation scenario, in order to overcome the influence of gravity, gather more working fluid directly above the heat source and accelerate the reflux of working fluid liquid, the "liquid storage tank" in the condensation capillary structure can be moved upward and adjusted to Figure 6 The condensation capillary structure 60 in the vertical direction.

[0078] In this embodiment, other structures of the temperature vapor chamber are the same as those in the horizontal installation scenario.

[0079] According to another embodiment of the present application, a heat dissipation device is further provided, wherein the heat dissipation device includes one or more temperature averaging plates as described in any of the above embodiments.

[0080] Furthermore, the heat dissipation device in the embodiment of the present application can be applied to heat dissipation scenarios of chips with high power consumption and high heat flux density, including but not limited to communication products, automobiles, aerospace, new energy, consumer electronics heat dissipation and other fields.

[0081] For specific examples in this embodiment, reference may be made to the examples described in the above embodiments and exemplary implementation modes, and this embodiment will not be described in detail herein.

[0082] Obviously, those skilled in the art should understand that the above modules or steps of the present application can be implemented by a general computing device, they can be concentrated on a single computing device, or distributed on a network composed of multiple computing devices, they can be implemented by a program code executable by a computing device, so that they can be stored in a storage device and executed by the computing device, and in some cases, the steps shown or described can be executed in a different order from that herein, or they can be made into individual integrated circuit modules, or multiple modules or steps therein can be made into a single integrated circuit module for implementation. Thus, the present application is not limited to any specific combination of hardware and software.

[0083] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the principles of the present application shall be included in the protection scope of the present application.

Claims

1. A temperature equalizing plate, characterized in that: The temperature homogenizing plate comprises: Evaporation capillary structure; A condensation capillary structure, wherein the middle thickness of the condensation capillary structure is greater than the peripheral thickness of the condensation capillary structure; The capillary column structure is connected between the evaporation capillary structure and the condensation capillary structure, and is used for the liquid working medium to flow back to the evaporation capillary structure along the capillary column structure.

2. The temperature equalizing plate according to claim 1, characterized in that: The area of ​​the condensation capillary structure is greater than the area of ​​the evaporation capillary structure.

3. The temperature homogenizing plate according to claim 1, characterized in that: The temperature homogenizing plate further comprises: An upper shell, the upper shell being connected to an upper surface of the condensation capillary structure; A lower shell, one side of which is connected to the lower surface of the evaporation capillary structure, and the other side of which is in contact with a heat source; A support column is connected between the lower shell and the upper shell.

4. The temperature equalizing plate according to claim 3, characterized in that: The area of ​​the evaporation capillary structure is larger than the area of ​​the heat source.

5. The temperature homogenizing plate according to claim 3, characterized in that: A side of the lower shell body in contact with the evaporation capillary structure has a groove array structure consisting of a plurality of grooves, and the groove array structure is located directly below the evaporation capillary structure.

6. The temperature homogenizing plate according to claim 5, characterized in that: The arrangement of the groove array structure includes one of the following: a dot array, a strip array, and a staggered array; the shape of the groove includes one of the following: a triangle, a circle, and a rectangle.

7. The temperature homogenizing plate according to claim 3, characterized in that: The material of the lower shell and the upper shell is one of the following: metal, alloy, and composite material.

8. The temperature homogenizing plate according to claim 3, characterized in that: A sealed cavity is formed between the lower shell and the upper shell.

9. The temperature equalizing plate according to claim 1, characterized in that: The evaporation capillary structure, the capillary column structure and the condensation capillary structure are one of the following: sintered copper powder, copper mesh, grooves, and fiber bundles.

10. The temperature homogenizing plate according to claim 1, characterized in that: The condensation capillary structure is of a prism shape or a truncated cone shape, wherein the upper surface of the condensation capillary structure is larger than the lower surface of the condensation capillary structure.

11. A heat dissipation device, characterized in that: The method comprises one or more temperature vapor chambers as described in any one of claims 1 to 10.

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