Screen printing method for solder mask surface of integrated circuit board

Abstract

The invention provides an integrated circuit board solder mask surface screen printing method, which comprises the following steps: acquiring basic information of a solder mask panel to be screen-printed, the basic information comprising a component to be welded, a size, a component bounding box and a non-overlapping part; constructing a virtual panel based on the size, the component bounding box and the non-allowed overlapping part; numbering the components to be welded, and randomly filling the numbers to the outer sides of the corresponding component bounding boxes on the virtual panel; randomly selecting a serial number on the outer side of each component boundary frame for combination to form a plurality of screen printing schemes; performing preliminary screening on the silk-screen scheme based on the non-allowed overlapping part; obtaining a screen printing demand of a user, and optimizing the screen printing scheme after preliminary screening based on the screen printing demand to obtain an optimal screen printing scheme; the optimal silk-screen scheme not only can meet the silk-screen requirement of a user, but also can reduce the overlapping of the number and the non-allowed overlapping part as much as possible, and ensures the normal use of the integrated circuit board.

Description

Technical Field

[0001] The invention relates to the technical field of integrated circuit board processing, and in particular to a silk screen printing method for a solder resist surface of an integrated circuit board. Background Art

[0002] Integrated circuit board is PCB board, which is an important part of electronic manufacturing. Components such as capacitors and resistors can form circuits after being welded on the integrated circuit board. The assembled integrated circuit board can be directly used as a component in the power system after being packaged. In the manufacture of the integrated circuit board, a solder mask layer and a silk screen layer are added on its surface in sequence. The solder mask layer is used to prevent unnecessary parts from being welded, and the silk screen layer is mainly used to add numbers and patterns on the circuit board, and is used to identify the components on the circuit board to facilitate the welding process and subsequent maintenance. At present, when the integrated circuit board is silk-screened, most of them are silk-screened in the ordinary way. Due to changes in components, the silk-screen scheme will be different, resulting in the overlap of numbers with pads and vias on the circuit board, thereby affecting the manufacture of the circuit board. In addition, when the current circuit board is silk-screened, the needs of users are not taken into account. Some users hope that all the numbers on the circuit board can be in the same direction, so as to improve the aesthetics, while some users hope that the intervals between the numbers on the circuit board can be larger to avoid the numbers being too close to each other, resulting in errors in viewing the numbers and affecting the selection and repair and maintenance of components. Summary of the invention

[0003] In view of this, the present invention proposes a method for silk screen printing on a solder mask surface of an integrated circuit board, which can customize the silk screen printing scheme in consideration of the silk screen printing needs of the user and can avoid the overlap of numbers and important parts.

[0004] The technical solution of the present invention is achieved in this way:

[0005] A method for screen printing on a solder mask surface of an integrated circuit board comprises the following steps:

[0006] Step S1, obtaining basic information of the panel to be screen-printed with solder mask, wherein the basic information includes components to be soldered, dimensions, component boundary boxes, and parts that are not allowed to overlap;

[0007] Step S2, constructing a virtual panel based on the size, component boundary box, and not allowing overlapping parts;

[0008] Step S3, numbering the components to be welded, and randomly filling the numbers outside the corresponding component boundary boxes on the virtual panel;

[0009] Step S4, randomly selecting a number outside the boundary box of each component and combining them to form several silk-screen printing schemes;

[0010] Step S5, preliminarily screening the screen printing schemes based on the parts that are not allowed to overlap;

[0011] Step S6: obtaining the user's silk screen printing requirements, optimizing the silk screen printing solutions after preliminary screening based on the silk screen printing requirements, and obtaining the optimal silk screen printing solution.

[0012] Preferably, the specific steps of step S1 are:

[0013] Step S11, obtaining the model of the solder mask panel to be screen-printed, and matching and obtaining a standard circuit board from a circuit board database;

[0014] Step S12: Obtain a circuit layout design of a standard circuit board, and obtain basic information from the circuit layout design.

[0015] Preferably, the parts that are not allowed to overlap include pads, vias, traces, test points, debugging points, power supplies and grounding.

[0016] Preferably, the specific steps of step S2 are:

[0017] Step S21, constructing a virtual panel based on the size information, and mapping the component boundary box and the non-overlapping part onto the virtual panel;

[0018] Step S22, obtaining image information of the panel to be screen-printed with solder mask, and overlapping the image information with the virtual panel;

[0019] Step S23: adjusting the positions of the component boundary boxes and the parts not allowed to overlap according to the overlapping effect.

[0020] Preferably, the specific steps of step S3 are:

[0021] Step S31, determining whether components to be welded of the same type form a clustering area;

[0022] Step S32: if a clustering area is formed, sequentially number the components to be welded of the type according to the arrangement of the clustering area;

[0023] Step S33: if the components to be welded of the same type do not form a clustering area, number the components to be welded in a clockwise or counterclockwise order;

[0024] Step S34: Randomly fill the numbers of the components to be welded outside the corresponding component boundary box on the virtual panel.

[0025] Preferably, the specific steps of step S4 are: randomly selecting one of the numbers outside the component boundary box, combining it with the numbers outside the other component boundary boxes, and after multiple selections, obtaining several silk-screen printing schemes.

[0026] Preferably, the specific steps of step S5 are:

[0027] Step S51, mapping the silk screen printing schemes onto the virtual panel in sequence;

[0028] Step S52, obtaining virtual panels whose numbers overlap with the parts that are not allowed to overlap, and recording them as panels to be screened;

[0029] Step S53, determining the number of overlaps between each type of parts that are not allowed to overlap and the numbers on the panel to be screened;

[0030] Step S54: when the number of overlaps between the non-allowable overlapped parts and the serial numbers is greater than a preset threshold, the corresponding panel to be screened is eliminated.

[0031] Preferably, the silk-screen printing requirement includes the numbering direction being consistent, and the specific steps of step S6 are:

[0032] Step S61, obtaining each virtual panel after preliminary screening;

[0033] Step S62: collect all serial numbers through image recognition and identify the orientation of the serial numbers;

[0034] Step S63: Calculate the numbering orientation consistency rate of the virtual panels, and output the silk-screen printing scheme on the virtual panel with the highest numbering orientation consistency rate as the optimal silk-screen printing scheme.

[0035] Preferably, the silk-screen printing requirement includes appropriate numbering intervals, and the specific steps of step S6 are:

[0036] Step S64, obtaining each virtual panel after preliminary screening;

[0037] Step S65, collecting all numbers through image recognition, and collecting the intervals between any two numbers;

[0038] Step S66 , counting the proportion of intervals greater than a preset threshold, and outputting the silk-screen printing scheme on the virtual panel with the highest proportion as the optimal silk-screen printing scheme.

[0039] Compared with the prior art, the present invention has the following beneficial effects:

[0040] A method for silk-screening a solder mask panel of an integrated circuit board of the present invention is used for silk-screening an integrated circuit board after a solder mask layer is added, wherein basic information of the solder mask panel to be silk-screened is first obtained, and then a virtual panel is constructed, and components to be soldered are numbered in the virtual panel, and the numbers are filled in the outside of the component boundary box. At this time, there will be several identical numbers located at different positions outside each component boundary box, and then a random selection combination method is adopted to obtain several silk-screening schemes for each virtual panel, and then the silk-screening schemes are preliminarily screened by not allowing overlapping parts, and after the overlapping silk-screening schemes are deleted, the silk-screening needs of users are collected to optimize the silk-screening schemes, which can not only avoid the key parts of the circuit board from being covered by numbers, but also meet the user's own attraction needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only preferred embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0042] Figure 1 It is a flow chart of a method for silk-screening a solder mask surface of an integrated circuit board of the present invention;

[0043] Figure 2 It is a flow chart of step S1 of a method for silk-screening a solder mask surface of an integrated circuit board of the present invention;

[0044] Figure 3 It is a flow chart of step S2 of a method for silk-screening a solder mask surface of an integrated circuit board of the present invention;

[0045] Figure 4 It is a flow chart of step S3 of a method for silk-screening a solder mask surface of an integrated circuit board of the present invention;

[0046] Figure 5 It is a flow chart of step S5 of a method for silk-screening a solder mask surface of an integrated circuit board of the present invention;

[0047] Figure 6 It is a flow chart of step S6 of a method for screen printing a solder mask surface of an integrated circuit board of the present invention when the screen printing requirement is that the numbering direction is consistent;

[0048] Figure 7 The flowchart of step S6 of the silk screen printing method for the solder mask surface of an integrated circuit board of the present invention is shown in FIG. 1 when the silk screen printing requirement is that the numbering interval is appropriate. DETAILED DESCRIPTION

[0049] In order to better understand the technical content of the present invention, a specific embodiment is provided below, and the present invention is further described in conjunction with the accompanying drawings.

[0050] See also Figures 1 to 7 The present invention provides a method for screen printing a solder mask surface of an integrated circuit board, comprising the following steps:

[0051] Step S1, obtaining basic information of the panel to be screen-printed with solder mask, wherein the basic information includes components to be soldered, dimensions, component boundary boxes, and parts that are not allowed to overlap;

[0052] Step S2, constructing a virtual panel based on the size, component boundary box, and not allowing overlapping parts;

[0053] Step S3, numbering the components to be welded, and randomly filling the numbers outside the corresponding component boundary boxes on the virtual panel;

[0054] Step S4, randomly selecting a number outside the boundary box of each component and combining them to form several silk-screen printing schemes;

[0055] Step S5, preliminarily screening the screen printing schemes based on the parts that are not allowed to overlap;

[0056] Step S6: obtaining the user's silk screen printing requirements, optimizing the silk screen printing solutions after preliminary screening based on the silk screen printing requirements, and obtaining the optimal silk screen printing solution.

[0057] A method for silk-screening a solder mask of an integrated circuit board of the present invention is used for silk-screening a circuit board with a solder mask layer added, firstly, basic information of the solder mask panel to be silk-screened is obtained, wherein the basic information includes circuit layout information and size of the solder mask panel to be silk-screened, and the circuit layout information of the solder mask panel to be silk-screened mainly includes components to be welded, component boundary boxes and non-overlapping parts thereon, wherein the components to be welded will be welded on the component boundary boxes during later assembly, and the non-overlapping parts need to ensure the integrity at the initial stage to avoid overlap during silk-screening, after obtaining the size, a virtual panel of the same size can be constructed, and then the component boundary boxes and non-overlapping parts are mapped to the virtual panel, and the virtual panel at this time is equivalent to the solder mask panel to be silk-screened, and after the silk-screen layer is added to the virtual panel, the virtual panel is equivalent to the panel of the components to be welded, and the silk-screen layer mainly includes numbers and some special patterns, and according to different components to be welded, Different numbers, the numbering of the same type of components to be welded needs to be carried out in sequence, for example, resistors are R1, R2, etc. After the welding components are numbered according to the numbering rules, the numbers can be randomly filled in the outside of the corresponding component boundary box on the virtual panel, and the sizes of the component boundary boxes are different. The component boundary boxes of resistors or capacitors are mostly small, while the component boundary boxes of some chips are large. Therefore, the number and position of the numbers filled in the outside of different component boundary boxes are different. When the numbers outside each component boundary box are selected for combination, several silk screen schemes can be combined, and some silk screen schemes will have numbers that overlap with the parts that are not allowed to overlap. Therefore, the silk screen schemes can be preliminarily screened. After the silk screen schemes with overlapping are screened out, the optimization is performed based on the user's silk screen requirements, and the optimal silk screen scheme is obtained. Finally, the silk screen solder mask panel can be silk screened based on the optimal silk screen scheme, which can not only avoid overlap but also meet the user's silk screen requirements.

[0058] Preferably, the specific steps of step S1 are:

[0059] Step S11, obtaining the model of the solder mask panel to be screen-printed, and matching and obtaining a standard circuit board from a circuit board database;

[0060] Step S12: Obtain a circuit layout design of a standard circuit board, and obtain basic information from the circuit layout design.

[0061] The layout design of integrated circuit boards and the design of components are mostly standard. When obtaining the basic information of the panel to be screen-printed with solder mask, the model of the panel to be screen-printed with solder mask can be obtained first. The corresponding standard circuit board can be matched from the database through the model, so that the size, component boundary box, type of components to be soldered and the non-overlapping parts on the circuit board can be obtained from the standard circuit board. The non-overlapping parts include pads, vias, traces, test points, debugging points, power supplies and grounding, etc. Pads are places for soldering electronic components. The information on the silk-screen layer should not overlap with the pads to avoid blocking or interfering with the soldering process. Holes are used to connect different layers of the PCB, and the patterns on the silkscreen layer should avoid overlapping with vias to prevent affecting electrical characteristics and welding quality; traces are used to connect different components on the PCB, and the information on the silkscreen layer should not overlap with the traces to avoid affecting electrical performance or causing visual confusion; test points are used for circuit testing and debugging, and the information on the silkscreen layer should not block the test points to ensure that they are easily accessible during testing; debug points are used for debugging and calibration of circuits, and the information on the silkscreen layer should not block these points to ensure that they can be easily accessed during debugging; the power and ground markings usually need to be clearly visible and should not be blocked by other information on the silkscreen layer.

[0062] Preferably, the specific steps of step S2 are:

[0063] Step S21, constructing a virtual panel based on the size information, and mapping the component boundary box and the non-overlapping part onto the virtual panel;

[0064] Step S22, obtaining image information of the panel to be screen-printed with solder mask, and overlapping the image information with the virtual panel;

[0065] Step S23: adjusting the positions of the component boundary boxes and the parts not allowed to overlap according to the overlapping effect.

[0066] After obtaining the basic information of the solder mask panel to be screen-printed, first build a virtual panel based on the size information, and then map the component boundary box and the non-overlapping part to the virtual panel. There may be errors in the mapping, so the mapped virtual panel is overlapped with the image information of the solder mask panel to be screen-printed for viewing. If the component boundary box and the non-overlapping part are offset, the position can be adjusted in time to ensure that the layout on the virtual panel is consistent with the solder mask panel to be screen-printed.

[0067] Preferably, the specific steps of step S3 are:

[0068] Step S31, determining whether components to be welded of the same type form a clustering area;

[0069] Step S32: if a clustering area is formed, sequentially number the components to be welded of the type according to the arrangement of the clustering area;

[0070] Step S33: if the components to be welded of the same type do not form a clustering area, number the components to be welded in a clockwise or counterclockwise order;

[0071] Step S34: Randomly fill the numbers of the components to be welded outside the corresponding component boundary box on the virtual panel.

[0072] For the same type of components to be welded, their numbering needs to be carried out in sequence. On the circuit board, a certain type of components to be welded may form a clustering area, for example, multiple resistors are clustered together, and in order to facilitate subsequent welding and repair and maintenance, the numbers of the same type of components to be welded in the clustering area should be similar. Therefore, after obtaining the arrangement of the components to be welded in the clustering area, the components to be welded of this type are numbered according to the arrangement. For example, if there are several resistors on the circuit board gathered in an area and arranged vertically, they can be numbered R1-R5 in a vertical ascending manner, and the components to be welded that do not form a clustering area can be numbered clockwise or counterclockwise.

[0073] After the numbering is completed, the numbers can be filled outside the component boundary box. The larger the component boundary box, the more numbers can be filled.

[0074] Preferably, the specific steps of step S4 are: randomly selecting one of the numbers outside the component boundary box, combining it with the numbers outside the other component boundary boxes, and after multiple selections, obtaining several silk-screen printing schemes.

[0075] When determining the silk-screen printing scheme, a random selection and combination method is adopted. The number outside the boundary box of each component will be selected and combined with other numbers. Since the same number outside the boundary box of each component will be in a different position, multiple silk-screen printing schemes can be formed after the combination is completed.

[0076] Preferably, the specific steps of step S5 are:

[0077] Step S51, mapping the silk screen printing schemes onto the virtual panel in sequence;

[0078] Step S52, obtaining virtual panels whose numbers overlap with the parts that are not allowed to overlap, and recording them as panels to be screened;

[0079] Step S53, determining the number of overlaps between each type of parts that are not allowed to overlap and the numbers on the panel to be screened;

[0080] Step S54: when the number of overlaps between the non-allowable overlapped parts and the serial numbers is greater than a preset threshold, the corresponding panel to be screened is eliminated.

[0081] There are many silk-screen printing schemes, and not all of them can be put into use. In some silk-screen printing schemes, the numbers will overlap on the parts that are not allowed to overlap. Therefore, after the silk-screen printing scheme is mapped to the virtual panel, if there is a virtual panel where the numbers overlap with the parts that are not allowed to overlap, the virtual panel will be output as a panel to be screened, and then the number of overlaps between each part that is not allowed to overlap and the number on the panel to be screened is calculated, and each part that is not allowed to overlap will be set with a threshold for the number of allowed overlaps. If the number of overlaps exceeds the preset threshold, the silk-screen printing scheme is unqualified and needs to be eliminated. After preliminary screening, the number of silk-screen printing schemes can be reduced and the workload of optimization can be reduced.

[0082] Preferably, the silk-screen printing requirement includes the numbering direction being consistent, and the specific steps of step S6 are:

[0083] Step S61, obtaining each virtual panel after preliminary screening;

[0084] Step S62: collect all serial numbers through image recognition and identify the orientation of the serial numbers;

[0085] Step S63: Calculate the numbering orientation consistency rate of the virtual panels, and output the silk-screen printing scheme on the virtual panel with the highest numbering orientation consistency rate as the optimal silk-screen printing scheme.

[0086] When manufacturing circuit boards, some users require that the numbers on the circuit boards be oriented in a consistent direction to ensure the aesthetics of the circuit boards. When the silk-screen printing requirement is for the numbers to be oriented in a consistent direction, the directions of all the numbers on the virtual panel are identified through image recognition, where the number orientation consistency rate is calculated based on whether they are oriented in the same side or in other sides. Finally, the silk-screen printing scheme with the highest number orientation consistency rate can be output as the optimal silk-screen printing scheme, ensuring that the numbers in the optimal silk-screen printing scheme are basically oriented in a consistent direction.

[0087] Preferably, the silk-screen printing requirement includes appropriate numbering intervals, and the specific steps of step S6 are:

[0088] Step S64, obtaining each virtual panel after preliminary screening;

[0089] Step S65, collecting all numbers through image recognition, and collecting the intervals between any two numbers;

[0090] Step S66 , counting the proportion of intervals greater than a preset threshold, and outputting the silk-screen printing scheme on the virtual panel with the highest proportion as the optimal silk-screen printing scheme.

[0091] When some users manufacture circuit boards, they need to ensure that the intervals between numbers are appropriate to facilitate component welding and reduce the difficulty of subsequent maintenance, so as to ensure that the numbers and types of components can be accurately located. Therefore, when the silk screen printing requirement is that the number intervals are appropriate, the intervals between the two numbers can be collected, and the proportion of intervals greater than the preset threshold can be counted. The larger the proportion, the more numbers meet the interval threshold, so the silk screen printing plan with the highest proportion can be output.

[0092] After collecting the silk screen printing requirements of users, we can optimize the silk screen printing solutions after preliminary screening in different ways to obtain the silk screen printing solution that best meets the user's needs.

[0093] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for screen printing on a solder mask surface of an integrated circuit board, characterized in that: The following steps are involved: Step S1, obtaining basic information of the panel to be screen-printed with solder mask, wherein the basic information includes components to be soldered, dimensions, component boundary boxes, and parts that are not allowed to overlap; Step S2, constructing a virtual panel based on the size, component boundary box, and not allowing overlapping parts; Step S3, numbering the components to be welded, and randomly filling the numbers outside the corresponding component boundary boxes on the virtual panel; Step S4, randomly selecting a number outside the boundary box of each component and combining them to form several silk-screen printing schemes; Step S5, preliminarily screening the screen printing schemes based on the parts that are not allowed to overlap; Step S6: obtaining the user's silk screen printing requirements, optimizing the silk screen printing solutions after preliminary screening based on the silk screen printing requirements, and obtaining the optimal silk screen printing solution.

2. A method for screen printing on a solder mask surface of an integrated circuit board according to claim 1, characterized in that: The specific steps of step S1 are: Step S11, obtaining the model of the solder mask panel to be screen-printed, and matching and obtaining a standard circuit board from a circuit board database; Step S12: Obtain a circuit layout design of a standard circuit board, and obtain basic information from the circuit layout design.

3. A method for screen printing on a solder mask surface of an integrated circuit board according to claim 1 or 2, characterized in that: The parts that are not allowed to overlap include pads, vias, traces, test points, debugging points, power supplies and grounding.

4. The method for screen printing on a solder mask surface of an integrated circuit board according to claim 1, characterized in that: The specific steps of step S2 are: Step S21, constructing a virtual panel based on the size information, and mapping the component boundary box and the non-overlapping part onto the virtual panel; Step S22, obtaining image information of the panel to be screen-printed with solder mask, and overlapping the image information with the virtual panel; Step S23: adjusting the positions of the component boundary boxes and the parts not allowed to overlap according to the overlapping effect.

5. The method for screen printing on a solder mask surface of an integrated circuit board according to claim 1, characterized in that: The specific steps of step S3 are: Step S31, determining whether components to be welded of the same type form a clustering area; Step S32: if a clustering area is formed, sequentially number the components to be welded of the type according to the arrangement of the clustering area; Step S33: if the components to be welded of the same type do not form a clustering area, number the components to be welded in a clockwise or counterclockwise order; Step S34: Randomly fill the numbers of the components to be welded outside the corresponding component boundary box on the virtual panel.

6. A method for screen printing on a solder mask surface of an integrated circuit board according to claim 1, characterized in that: The specific steps of step S4 are: randomly selecting one of the numbers outside the component boundary box, combining it with the numbers outside the other component boundary boxes, and obtaining several screen printing schemes after multiple selections.

7. A method for screen printing on a solder mask surface of an integrated circuit board according to claim 1, characterized in that: The specific steps of step S5 are: Step S51, mapping the silk screen printing schemes onto the virtual panel in sequence; Step S52, obtaining virtual panels whose numbers overlap with the parts that are not allowed to overlap, and recording them as panels to be screened; Step S53, determining the number of overlaps between each type of parts that are not allowed to overlap and the numbers on the panel to be screened; Step S54: when the number of overlaps between the non-allowable overlapped parts and the serial numbers is greater than a preset threshold, the corresponding panel to be screened is eliminated.

8. The method for screen printing on a solder mask surface of an integrated circuit board according to claim 1, characterized in that: The silk screen printing requirement includes the numbering direction being consistent, and the specific steps of step S6 are: Step S61, obtaining each virtual panel after preliminary screening; Step S62: collect all serial numbers through image recognition and identify the orientation of the serial numbers; Step S63: Calculate the numbering orientation consistency rate of the virtual panels, and output the silk-screen printing scheme on the virtual panel with the highest numbering orientation consistency rate as the optimal silk-screen printing scheme.

9. The method for screen printing on a solder mask surface of an integrated circuit board according to claim 1, characterized in that: The silk screen printing requirement includes that the numbering interval is appropriate, and the specific steps of step S6 are: Step S64, obtaining each virtual panel after preliminary screening; Step S65, collecting all numbers through image recognition, and collecting the intervals between any two numbers; Step S66 , counting the proportion of intervals greater than a preset threshold, and outputting the silk-screen printing scheme on the virtual panel with the highest proportion as the optimal silk-screen printing scheme.

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